JP2006032470A - 電子装置 - Google Patents
電子装置 Download PDFInfo
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- JP2006032470A JP2006032470A JP2004205906A JP2004205906A JP2006032470A JP 2006032470 A JP2006032470 A JP 2006032470A JP 2004205906 A JP2004205906 A JP 2004205906A JP 2004205906 A JP2004205906 A JP 2004205906A JP 2006032470 A JP2006032470 A JP 2006032470A
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Abstract
【解決手段】 リードフレーム10のダイパッド11上にICチップ30が導電性接着剤20により接合され、リードフレーム10のリード部12にセラミックからなる受動部品40が導電性接着剤20により接合されており、装置全体がモールド樹脂60により封止されている電子装置100において、ICチップ30と受動部品40の電極41とが、直接ボンディングワイヤ50により接続されている。
【選択図】 図1
Description
続いて、ワイヤボンディングを行ってボンディングワイヤ50を形成する。これは、受動部品40を搭載してから、ワイヤボンディングを行うと、ワイヤボンディングのツールが、ボンディングワイヤ50の近傍に位置する受動部品40に当たるので、ワイヤボンディングがうまくできないためである。
図1は、本発明の第1実施形態に係る電子装置100の構成を示す図であり、(a)は概略平面図、(b)は概略断面図である。なお、図1(a)中、モールド樹脂60の外形は一点鎖線にて示してある。
なお、本実施形態では、電極41の一方がリード部12に支持されずに浮いている構成の受動部品40が存在しているが、そのような受動部品40の形態としては、上記図2に示されるものに限らない。
図5は、本発明の第2実施形態に係る電子装置200の構成を示す概略断面図である。上記実施形態との相違点を中心に述べる。
12…リードフレームのリード部、20…導電部材としての導電性接着剤、
30…ICチップ、40…受動部品、41…受動部品の電極、
50…ボンディングワイヤ、60…モールド樹脂。
Claims (4)
- リードフレーム(10)のダイパッド(11)上にICチップ(30)が導電部材(20)により接合され、前記リードフレーム(10)のリード部(12)にセラミックからなる受動部品(40)が導電部材(20)により接合されており、装置全体がモールド樹脂(60)により封止されている電子装置において、
前記ICチップ(30)と前記受動部品(40)の電極(41)とが、直接ボンディングワイヤ(50)により接続されていることを特徴とする電子装置。 - 前記受動部品(40)として、その電極(41)の一方が前記リード部(12)に支持されずに浮いている構成のものが存在することを特徴とする請求項1に記載の電子装置。
- 前記受動部品(40)の線膨張係数は、前記モールド樹脂(60)の線膨張係数よりも小さいことを特徴とする請求項1または2に記載の電子装置。
- リードフレーム(10)のダイパッド(11)上にICチップ(30)が導電部材(20)により接合され、前記リードフレーム(10)のリード部(12)にセラミックからなる受動部品(40)が導電部材(20)により接合されており、
前記ICチップ(30)と前記受動部品(40)の近傍に位置する前記リード部(12)とがボンディングワイヤ(50)により接続されており、
装置全体がモールド樹脂(60)により封止されている電子装置において、
前記ボンディングワイヤ(50)が接続される前記リード部(12)の面は、前記リードフレーム(10)の一面であり、前記受動部品(40)が接合される前記リード部(12)の面は、前記リードフレーム(10)の一面とは反対側の他面であることを特徴とする電子装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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JP2004205906A JP4728606B2 (ja) | 2004-07-13 | 2004-07-13 | 電子装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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JP2004205906A JP4728606B2 (ja) | 2004-07-13 | 2004-07-13 | 電子装置 |
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JP2006032470A true JP2006032470A (ja) | 2006-02-02 |
JP4728606B2 JP4728606B2 (ja) | 2011-07-20 |
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JP2004205906A Expired - Fee Related JP4728606B2 (ja) | 2004-07-13 | 2004-07-13 | 電子装置 |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010135737A (ja) * | 2008-10-30 | 2010-06-17 | Denso Corp | 半導体装置 |
JP2012009904A (ja) * | 2008-10-30 | 2012-01-12 | Denso Corp | 半導体装置 |
JP2014143433A (ja) * | 2014-03-31 | 2014-08-07 | Mitsubishi Electric Corp | 半導体装置 |
WO2015146130A1 (ja) * | 2014-03-26 | 2015-10-01 | 株式会社デンソー | 半導体装置及びその製造方法 |
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2004
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JP2010135737A (ja) * | 2008-10-30 | 2010-06-17 | Denso Corp | 半導体装置 |
JP2012009904A (ja) * | 2008-10-30 | 2012-01-12 | Denso Corp | 半導体装置 |
US8624367B2 (en) | 2008-10-30 | 2014-01-07 | Denso Corporation | Semiconductor device including semiconductor chip mounted on lead frame |
US9029993B2 (en) | 2008-10-30 | 2015-05-12 | Denso Corporation | Semiconductor device including semiconductor chip mounted on lead frame |
WO2015146130A1 (ja) * | 2014-03-26 | 2015-10-01 | 株式会社デンソー | 半導体装置及びその製造方法 |
JP2015185832A (ja) * | 2014-03-26 | 2015-10-22 | 株式会社デンソー | 半導体装置及びその製造方法 |
CN106133906A (zh) * | 2014-03-26 | 2016-11-16 | 株式会社电装 | 半导体装置及其制造方法 |
US9935074B2 (en) | 2014-03-26 | 2018-04-03 | Denso Corporation | Semiconductor device and method for manufacturing same |
CN106133906B (zh) * | 2014-03-26 | 2018-11-09 | 株式会社电装 | 半导体装置及其制造方法 |
JP2014143433A (ja) * | 2014-03-31 | 2014-08-07 | Mitsubishi Electric Corp | 半導体装置 |
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