KR20160132751A - 전자부품 패키지 및 그 제조방법 - Google Patents

전자부품 패키지 및 그 제조방법 Download PDF

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Publication number
KR20160132751A
KR20160132751A KR1020150139682A KR20150139682A KR20160132751A KR 20160132751 A KR20160132751 A KR 20160132751A KR 1020150139682 A KR1020150139682 A KR 1020150139682A KR 20150139682 A KR20150139682 A KR 20150139682A KR 20160132751 A KR20160132751 A KR 20160132751A
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KR
South Korea
Prior art keywords
electronic component
disposed
component package
layer
insulating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020150139682A
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English (en)
Korean (ko)
Inventor
박대현
김한
허강헌
고영관
심정호
Original Assignee
삼성전기주식회사
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Filing date
Publication date
Application filed by 삼성전기주식회사 filed Critical 삼성전기주식회사
Priority to KR1020160047455A priority Critical patent/KR102002071B1/ko
Priority to US15/144,162 priority patent/US10199337B2/en
Priority to TW105114045A priority patent/TWI682692B/zh
Priority to JP2016093940A priority patent/JP6478943B2/ja
Priority to US15/297,831 priority patent/US9984979B2/en
Publication of KR20160132751A publication Critical patent/KR20160132751A/ko
Priority to US15/877,021 priority patent/US10256200B2/en
Priority to US15/944,321 priority patent/US10262949B2/en
Priority to JP2018166145A priority patent/JP6683780B2/ja
Pending legal-status Critical Current

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    • H01L25/073—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/49—Adaptable interconnections, e.g. fuses or antifuses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/08—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers by depositing layers on the chip or wafer, e.g. "chip-first" RDLs
    • H10W70/09—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers by depositing layers on the chip or wafer, e.g. "chip-first" RDLs extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs
    • H01L23/28—
    • H01L23/481—
    • H01L23/498—
    • H01L23/522—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/41—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes characterised by their conductive parts
    • H10W20/42—Vias, e.g. via plugs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/654—Top-view layouts
    • H10W70/655—Fan-out layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H10W74/117—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations the substrate having spherical bumps for external connection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/132—Containers comprising a conductive base serving as an interconnection having other interconnections through an insulated passage in the conductive base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9413—Dispositions of bond pads on encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/019—Manufacture or treatment using temporary auxiliary substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/722—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/732—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

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  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
KR1020150139682A 2015-05-11 2015-10-05 전자부품 패키지 및 그 제조방법 Pending KR20160132751A (ko)

Priority Applications (8)

Application Number Priority Date Filing Date Title
KR1020160047455A KR102002071B1 (ko) 2015-05-11 2016-04-19 팬-아웃 반도체 패키지 및 그 제조방법
US15/144,162 US10199337B2 (en) 2015-05-11 2016-05-02 Electronic component package and method of manufacturing the same
TW105114045A TWI682692B (zh) 2015-05-11 2016-05-06 扇出半導體封裝及其製造方法
JP2016093940A JP6478943B2 (ja) 2015-05-11 2016-05-09 ファンアウト半導体パッケージ及びその製造方法
US15/297,831 US9984979B2 (en) 2015-05-11 2016-10-19 Fan-out semiconductor package and method of manufacturing the same
US15/877,021 US10256200B2 (en) 2015-05-11 2018-01-22 Electronic component package and method of manufacturing the same
US15/944,321 US10262949B2 (en) 2015-05-11 2018-04-03 Fan-out semiconductor package and method of manufacturing the same
JP2018166145A JP6683780B2 (ja) 2015-05-11 2018-09-05 ファンアウト半導体パッケージ及びその製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020150065177 2015-05-11
KR20150065177 2015-05-11

Publications (1)

Publication Number Publication Date
KR20160132751A true KR20160132751A (ko) 2016-11-21

Family

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Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020150139682A Pending KR20160132751A (ko) 2015-05-11 2015-10-05 전자부품 패키지 및 그 제조방법
KR1020160047455A Active KR102002071B1 (ko) 2015-05-11 2016-04-19 팬-아웃 반도체 패키지 및 그 제조방법

Family Applications After (1)

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KR1020160047455A Active KR102002071B1 (ko) 2015-05-11 2016-04-19 팬-아웃 반도체 패키지 및 그 제조방법

Country Status (3)

Country Link
JP (2) JP6478943B2 (https=)
KR (2) KR20160132751A (https=)
TW (1) TWI682692B (https=)

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WO2018097408A1 (ko) * 2016-11-28 2018-05-31 주식회사 네패스 절연 프레임을 이용한 반도체 패키지 및 이의 제조방법
KR20190017233A (ko) * 2017-08-10 2019-02-20 삼성전기주식회사 팬-아웃 반도체 패키지
KR20190036266A (ko) * 2017-09-27 2019-04-04 삼성전기주식회사 팬-아웃 반도체 패키지
KR101982058B1 (ko) * 2017-12-06 2019-05-24 삼성전기주식회사 팬-아웃 반도체 패키지
WO2020067732A1 (ko) * 2018-09-28 2020-04-02 주식회사 네패스 반도체 패키지
KR20200036689A (ko) * 2018-09-28 2020-04-07 주식회사 네패스 반도체 패키지 및 그 제조 방법
KR20200036771A (ko) * 2018-09-27 2020-04-07 타이완 세미콘덕터 매뉴팩쳐링 컴퍼니 리미티드 집적 회로 패키지 및 방법
US11355465B2 (en) 2017-10-11 2022-06-07 Sony Semiconductor Solutions Corporation Semiconductor device including glass substrate having improved reliability and method of manufacturing the same
US12074104B2 (en) 2018-09-27 2024-08-27 Taiwan Semiconductor Manufacturing Company, Ltd. Integrated circuit packages with ring-shaped substrates

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JP6815880B2 (ja) * 2017-01-25 2021-01-20 株式会社ディスコ 半導体パッケージの製造方法
KR102019353B1 (ko) * 2017-04-07 2019-09-09 삼성전자주식회사 팬-아웃 센서 패키지 및 이를 포함하는 광학방식 지문센서 모듈
US10644046B2 (en) 2017-04-07 2020-05-05 Samsung Electronics Co., Ltd. Fan-out sensor package and optical fingerprint sensor module including the same
US20180337454A1 (en) * 2017-05-16 2018-11-22 Samsung Electro-Mechanics Co., Ltd. Filter module and front end module including the same
CN108878380B (zh) 2017-05-16 2022-01-21 三星电机株式会社 扇出型电子器件封装件
US20190006305A1 (en) * 2017-06-29 2019-01-03 Powertech Technology Inc. Semiconductor package structure and manufacturing method thereof
KR102018616B1 (ko) * 2017-07-04 2019-09-06 삼성전자주식회사 반도체 장치
KR102077455B1 (ko) * 2017-07-04 2020-02-14 삼성전자주식회사 반도체 장치
KR102081086B1 (ko) * 2017-07-07 2020-02-25 삼성전자주식회사 팬-아웃 반도체 패키지 모듈
KR20190013051A (ko) 2017-07-31 2019-02-11 삼성전기주식회사 팬-아웃 반도체 패키지
US10453821B2 (en) * 2017-08-04 2019-10-22 Samsung Electronics Co., Ltd. Connection system of semiconductor packages
KR102440119B1 (ko) * 2017-08-10 2022-09-05 삼성전자주식회사 반도체 패키지 및 그 제조방법
KR102117463B1 (ko) * 2017-08-18 2020-06-02 삼성전기주식회사 팬-아웃 반도체 패키지
KR102019349B1 (ko) * 2017-10-19 2019-09-09 삼성전자주식회사 반도체 패키지
KR101922884B1 (ko) * 2017-10-26 2018-11-28 삼성전기 주식회사 팬-아웃 반도체 패키지
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TWI736780B (zh) 2017-10-31 2021-08-21 台灣積體電路製造股份有限公司 晶片封裝及其形成方法
US11322449B2 (en) 2017-10-31 2022-05-03 Taiwan Semiconductor Manufacturing Co., Ltd. Package with fan-out structures
KR101963292B1 (ko) 2017-10-31 2019-03-28 삼성전기주식회사 팬-아웃 반도체 패키지
KR101963293B1 (ko) * 2017-11-01 2019-03-28 삼성전기주식회사 팬-아웃 반도체 패키지
KR101942744B1 (ko) * 2017-11-03 2019-01-28 삼성전기 주식회사 팬-아웃 반도체 패키지
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WO2019111874A1 (ja) * 2017-12-05 2019-06-13 株式会社村田製作所 モジュール
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