KR20160074559A - 전자 소자 및 시트재 - Google Patents

전자 소자 및 시트재 Download PDF

Info

Publication number
KR20160074559A
KR20160074559A KR1020167012862A KR20167012862A KR20160074559A KR 20160074559 A KR20160074559 A KR 20160074559A KR 1020167012862 A KR1020167012862 A KR 1020167012862A KR 20167012862 A KR20167012862 A KR 20167012862A KR 20160074559 A KR20160074559 A KR 20160074559A
Authority
KR
South Korea
Prior art keywords
resin
substrate
conductive particles
electronic
insulating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020167012862A
Other languages
English (en)
Korean (ko)
Inventor
히데노부 코바야시
카즈노리 마츠도
준 미코시바
Original Assignee
토요잉크Sc홀딩스주식회사
토요켐주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 토요잉크Sc홀딩스주식회사, 토요켐주식회사 filed Critical 토요잉크Sc홀딩스주식회사
Publication of KR20160074559A publication Critical patent/KR20160074559A/ko
Ceased legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/003—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields made from non-conductive materials comprising an electro-conductive coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0031—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields combining different shielding materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0064—Earth or grounding circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Laminated Bodies (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
KR1020167012862A 2013-12-03 2014-11-07 전자 소자 및 시트재 Ceased KR20160074559A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2013-249809 2013-12-03
JP2013249809 2013-12-03
PCT/JP2014/079573 WO2015083491A1 (ja) 2013-12-03 2014-11-07 電子素子およびシート材

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020187014727A Division KR102150258B1 (ko) 2013-12-03 2014-11-07 전자 소자 및 시트재

Publications (1)

Publication Number Publication Date
KR20160074559A true KR20160074559A (ko) 2016-06-28

Family

ID=53273262

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020167012862A Ceased KR20160074559A (ko) 2013-12-03 2014-11-07 전자 소자 및 시트재
KR1020187014727A Active KR102150258B1 (ko) 2013-12-03 2014-11-07 전자 소자 및 시트재

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020187014727A Active KR102150258B1 (ko) 2013-12-03 2014-11-07 전자 소자 및 시트재

Country Status (5)

Country Link
JP (1) JP6623513B2 (enExample)
KR (2) KR20160074559A (enExample)
CN (1) CN105794331A (enExample)
TW (1) TW201524284A (enExample)
WO (1) WO2015083491A1 (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190031985A (ko) 2017-09-19 2019-03-27 학교법인혜화학원 독활 복합오일을 포함하는 항아토피성 약학 조성물
KR20190031987A (ko) 2017-09-19 2019-03-27 학교법인혜화학원 산조인 복합오일을 포함하는 항아토피성 약학 조성물
KR20200069288A (ko) * 2017-10-13 2020-06-16 타츠타 전선 주식회사 차폐 패키지
KR20210066802A (ko) * 2018-10-03 2021-06-07 토요잉크Sc홀딩스주식회사 전자파 차폐 시트 및 전자부품 탑재 기판

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018060990A (ja) * 2016-07-08 2018-04-12 住友ベークライト株式会社 封止用フィルム、電子部品搭載基板の封止方法および封止用フィルム被覆電子部品搭載基板
KR101915947B1 (ko) * 2016-07-20 2019-01-30 스템코 주식회사 연성 회로 기판 및 그 제조 방법
JP6747129B2 (ja) * 2016-07-20 2020-08-26 東洋インキＳｃホールディングス株式会社 電子素子
JP2018060991A (ja) * 2016-09-28 2018-04-12 住友ベークライト株式会社 封止用フィルム、電子部品搭載基板の封止方法および封止用フィルム被覆電子部品搭載基板
FR3062981A1 (fr) * 2017-02-13 2018-08-17 Commissariat Energie Atomique Structure de blindage electromagnetique pour cartes electroniques
FR3062982B1 (fr) * 2017-02-13 2019-04-19 Commissariat A L'energie Atomique Et Aux Energies Alternatives Structure de blindage electromagnetique pour cartes electroniques
US10403582B2 (en) * 2017-06-23 2019-09-03 Tdk Corporation Electronic circuit package using composite magnetic sealing material
JP2019021757A (ja) * 2017-07-14 2019-02-07 住友ベークライト株式会社 封止用フィルムおよび電子部品搭載基板の封止方法
JP2019091866A (ja) * 2017-11-17 2019-06-13 東洋インキＳｃホールディングス株式会社 電子素子の製造方法
US10541065B2 (en) 2017-12-21 2020-01-21 The Boeing Company Multilayer stack with enhanced conductivity and stability
JP7290083B2 (ja) * 2019-07-31 2023-06-13 株式会社オートネットワーク技術研究所 配線部材
JP7010323B2 (ja) * 2020-04-02 2022-01-26 東洋インキＳｃホールディングス株式会社 電子素子
WO2023095697A1 (ja) * 2021-11-29 2023-06-01 東洋インキＳｃホールディングス株式会社 保護シート、電子デバイスパッケージ及びその製造方法

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1255203A (en) * 1984-11-15 1989-06-06 Paul A. Krieger Transfer adhesive sandwich and method of applying adhesive to substrates
JPH01164099A (ja) * 1987-12-21 1989-06-28 Shin Etsu Chem Co Ltd 放熱シールドシート
JPH09116289A (ja) * 1995-10-24 1997-05-02 Tokin Corp ノイズ抑制型電子装置およびその製造方法
JPH10173392A (ja) * 1996-12-09 1998-06-26 Daido Steel Co Ltd 電磁波遮蔽用シート
JPH1187984A (ja) * 1997-09-05 1999-03-30 Yamaichi Electron Co Ltd 実装回路装置
JP2000276053A (ja) * 1999-03-29 2000-10-06 Sato Corp 多層ラベル
JP4406484B2 (ja) * 1999-12-03 2010-01-27 ポリマテック株式会社 熱伝導性電磁波シールドシート
JP2003273562A (ja) * 2002-03-13 2003-09-26 Murata Mfg Co Ltd 電磁波シールドシートおよび電子機器
EP1561237A2 (en) * 2002-08-14 2005-08-10 Honeywell International, Inc. Method and apparatus for reducing electromagnetic emissions from electronic circuits
JP2005064266A (ja) * 2003-08-13 2005-03-10 Murata Mfg Co Ltd 電磁波シールドシートおよび電子機器
JP2006286915A (ja) * 2005-03-31 2006-10-19 Taiyo Yuden Co Ltd 回路モジュール
EP1933609A4 (en) * 2005-08-30 2011-01-05 Panasonic Corp SUBSTRATE STRUCTURE
JP4784606B2 (ja) * 2005-09-30 2011-10-05 パナソニック株式会社 シート状複合電子部品とその製造方法
JP4857927B2 (ja) 2006-06-13 2012-01-18 日産自動車株式会社 サスペンション構造
JPWO2008026247A1 (ja) * 2006-08-29 2010-01-14 日本包材株式会社 電磁波シールド構造とその形成方法
JP2009021578A (ja) * 2007-06-15 2009-01-29 Ngk Spark Plug Co Ltd 補強材付き配線基板
JP2009081400A (ja) * 2007-09-27 2009-04-16 Mitsubishi Electric Corp 電子機器端末のシールド構造
JP4911321B2 (ja) * 2008-02-05 2012-04-04 株式会社村田製作所 電磁遮蔽シート及び電磁遮蔽方法
KR100874689B1 (ko) * 2008-09-08 2008-12-18 두성산업 주식회사 방열, 전자파 차폐, 및 전자파와 충격 흡수 특성이 향상된 롤 타입 복합 시트 및 그 제조 방법
JP2011124413A (ja) * 2009-12-11 2011-06-23 Murata Mfg Co Ltd 電子部品モジュールの製造方法及び電子部品モジュール
JP5528259B2 (ja) * 2010-05-17 2014-06-25 日東電工株式会社 配線回路基板の製造方法
JP2012124413A (ja) * 2010-12-10 2012-06-28 Fuji Electric Co Ltd 薄膜太陽電池の製造装置
JP2012146869A (ja) * 2011-01-13 2012-08-02 Alps Electric Co Ltd 磁性シート及び磁性シートの製造方法
JP5587804B2 (ja) * 2011-01-21 2014-09-10 日本特殊陶業株式会社 電子部品実装用配線基板の製造方法、電子部品実装用配線基板、及び電子部品付き配線基板の製造方法
KR101250677B1 (ko) * 2011-09-30 2013-04-03 삼성전기주식회사 반도체 패키지 및 그의 제조 방법

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190031985A (ko) 2017-09-19 2019-03-27 학교법인혜화학원 독활 복합오일을 포함하는 항아토피성 약학 조성물
KR20190031987A (ko) 2017-09-19 2019-03-27 학교법인혜화학원 산조인 복합오일을 포함하는 항아토피성 약학 조성물
KR20200069288A (ko) * 2017-10-13 2020-06-16 타츠타 전선 주식회사 차폐 패키지
KR20210066802A (ko) * 2018-10-03 2021-06-07 토요잉크Sc홀딩스주식회사 전자파 차폐 시트 및 전자부품 탑재 기판

Also Published As

Publication number Publication date
JP6623513B2 (ja) 2019-12-25
CN105794331A (zh) 2016-07-20
TW201524284A (zh) 2015-06-16
KR102150258B1 (ko) 2020-09-01
JP2015130484A (ja) 2015-07-16
KR20180059952A (ko) 2018-06-05
WO2015083491A1 (ja) 2015-06-11

Similar Documents

Publication Publication Date Title
KR20160074559A (ko) 전자 소자 및 시트재
TWI807011B (zh) 電磁波屏蔽片
KR102400969B1 (ko) 전자 부품 탑재 기판 및 전자 기기
US20160076829A1 (en) Heat dissipating sheet
CN106465568B (zh) 导电性接合膜、印刷布线板及电子设备
TWI802757B (zh) 電磁波遮蔽片以及電子零件搭載基板
JP2019091866A (ja) 電子素子の製造方法
TW201705156A (zh) 導電性微粒及其製造方法、導電性樹脂組成物、導電性薄片、以及電磁波屏蔽薄片
CN102384697A (zh) 散热带及其制造方法
JP2019186438A (ja) 積層体、部品搭載基板、および部品搭載基板の製造方法
JP7010323B2 (ja) 電子素子
TWI842957B (zh) 電磁波屏蔽膜
CN114762470A (zh) 电磁波屏蔽膜
JP6747129B2 (ja) 電子素子
JP7099365B2 (ja) 電磁波シールドシート、部品搭載基板、および電子機器
TWI590750B (zh) 絕緣散熱薄片、散熱器及電子機器
JP2020057759A (ja) 電磁波シールドシート、および電子部品搭載基板
JP7634666B2 (ja) 電磁波シールドフィルム
WO2021112075A1 (ja) 電磁波シールドフィルム
HK1198448B (en) Anisotropic conductive film, connecting method and joined structure
HK1198448A1 (en) Anisotropic conductive film, connecting method and joined structure

Legal Events

Date Code Title Description
A201 Request for examination
PA0105 International application

Patent event date: 20160516

Patent event code: PA01051R01D

Comment text: International Patent Application

PA0201 Request for examination
PG1501 Laying open of application
E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20170904

Patent event code: PE09021S01D

AMND Amendment
E601 Decision to refuse application
PE0601 Decision on rejection of patent

Patent event date: 20171113

Comment text: Decision to Refuse Application

Patent event code: PE06012S01D

Patent event date: 20170904

Comment text: Notification of reason for refusal

Patent event code: PE06011S01I

AMND Amendment
PX0901 Re-examination

Patent event code: PX09011S01I

Patent event date: 20171113

Comment text: Decision to Refuse Application

Patent event code: PX09012R01I

Patent event date: 20171102

Comment text: Amendment to Specification, etc.

PX0601 Decision of rejection after re-examination

Comment text: Decision to Refuse Application

Patent event code: PX06014S01D

Patent event date: 20180326

Comment text: Amendment to Specification, etc.

Patent event code: PX06012R01I

Patent event date: 20180205

Comment text: Decision to Refuse Application

Patent event code: PX06011S01I

Patent event date: 20171113

Comment text: Amendment to Specification, etc.

Patent event code: PX06012R01I

Patent event date: 20171102

Comment text: Notification of reason for refusal

Patent event code: PX06013S01I

Patent event date: 20170904

A107 Divisional application of patent
PA0104 Divisional application for international application

Comment text: Divisional Application for International Patent

Patent event code: PA01041R01D

Patent event date: 20180524