CN105794331A - 电子元件以及片材 - Google Patents

电子元件以及片材 Download PDF

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Publication number
CN105794331A
CN105794331A CN201480065951.5A CN201480065951A CN105794331A CN 105794331 A CN105794331 A CN 105794331A CN 201480065951 A CN201480065951 A CN 201480065951A CN 105794331 A CN105794331 A CN 105794331A
Authority
CN
China
Prior art keywords
sheet
substrate
electronic
base material
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201480065951.5A
Other languages
English (en)
Chinese (zh)
Inventor
小林英宣
松户和规
御子柴淳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyochem Co Ltd
Artience Co Ltd
Original Assignee
Toyo Ink SC Holdings Co Ltd
Toyochem Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyo Ink SC Holdings Co Ltd, Toyochem Co Ltd filed Critical Toyo Ink SC Holdings Co Ltd
Publication of CN105794331A publication Critical patent/CN105794331A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0031—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields combining different shielding materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0064—Earth or grounding circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Laminated Bodies (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
CN201480065951.5A 2013-12-03 2014-11-07 电子元件以及片材 Pending CN105794331A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013-249809 2013-12-03
JP2013249809 2013-12-03
PCT/JP2014/079573 WO2015083491A1 (ja) 2013-12-03 2014-11-07 電子素子およびシート材

Publications (1)

Publication Number Publication Date
CN105794331A true CN105794331A (zh) 2016-07-20

Family

ID=53273262

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201480065951.5A Pending CN105794331A (zh) 2013-12-03 2014-11-07 电子元件以及片材

Country Status (5)

Country Link
JP (1) JP6623513B2 (enExample)
KR (2) KR20160074559A (enExample)
CN (1) CN105794331A (enExample)
TW (1) TW201524284A (enExample)
WO (1) WO2015083491A1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109119380A (zh) * 2017-06-23 2019-01-01 Tdk株式会社 使用复合磁性密封材料的电子电路封装
TWI744556B (zh) * 2017-10-13 2021-11-01 日商拓自達電線股份有限公司 屏蔽封裝體
CN114207743A (zh) * 2019-07-31 2022-03-18 株式会社自动网络技术研究所 配线部件

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JP2018060990A (ja) * 2016-07-08 2018-04-12 住友ベークライト株式会社 封止用フィルム、電子部品搭載基板の封止方法および封止用フィルム被覆電子部品搭載基板
JP6747129B2 (ja) * 2016-07-20 2020-08-26 東洋インキＳｃホールディングス株式会社 電子素子
KR101915947B1 (ko) * 2016-07-20 2019-01-30 스템코 주식회사 연성 회로 기판 및 그 제조 방법
JP2018060991A (ja) * 2016-09-28 2018-04-12 住友ベークライト株式会社 封止用フィルム、電子部品搭載基板の封止方法および封止用フィルム被覆電子部品搭載基板
FR3062982B1 (fr) * 2017-02-13 2019-04-19 Commissariat A L'energie Atomique Et Aux Energies Alternatives Structure de blindage electromagnetique pour cartes electroniques
FR3062981A1 (fr) * 2017-02-13 2018-08-17 Commissariat Energie Atomique Structure de blindage electromagnetique pour cartes electroniques
JP2019021757A (ja) * 2017-07-14 2019-02-07 住友ベークライト株式会社 封止用フィルムおよび電子部品搭載基板の封止方法
KR102031418B1 (ko) 2017-09-19 2019-10-11 학교법인혜화학원 산조인 복합오일을 포함하는 항아토피성 피부염 약학 조성물
KR102071110B1 (ko) 2017-09-19 2020-01-29 학교법인혜화학원 독활 복합오일을 포함하는 항아토피성 약학 조성물
JP2019091866A (ja) * 2017-11-17 2019-06-13 東洋インキＳｃホールディングス株式会社 電子素子の製造方法
US10541065B2 (en) 2017-12-21 2020-01-21 The Boeing Company Multilayer stack with enhanced conductivity and stability
JP6497477B1 (ja) * 2018-10-03 2019-04-10 東洋インキＳｃホールディングス株式会社 電磁波シールドシート、および電子部品搭載基板
JP7010323B2 (ja) * 2020-04-02 2022-01-26 東洋インキＳｃホールディングス株式会社 電子素子
KR20240113761A (ko) * 2021-11-29 2024-07-23 아티엔스 가부시키가이샤 보호 시트, 전자 디바이스 패키지 및 그 제조 방법

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JPH10173392A (ja) * 1996-12-09 1998-06-26 Daido Steel Co Ltd 電磁波遮蔽用シート
JP2006286915A (ja) * 2005-03-31 2006-10-19 Taiyo Yuden Co Ltd 回路モジュール
CN101253825A (zh) * 2005-09-30 2008-08-27 松下电器产业株式会社 片状复合电子部件及其制造方法
CN101273674A (zh) * 2005-08-30 2008-09-24 松下电器产业株式会社 基板结构
CN101325182A (zh) * 2007-06-15 2008-12-17 日本特殊陶业株式会社 带有加强构件的配线基板
JP2009081400A (ja) * 2007-09-27 2009-04-16 Mitsubishi Electric Corp 電子機器端末のシールド構造
JP2009188083A (ja) * 2008-02-05 2009-08-20 Murata Mfg Co Ltd 電磁遮蔽シート及び電磁遮蔽方法
CN102256448A (zh) * 2010-05-17 2011-11-23 日东电工株式会社 布线电路基板的制造方法
CN102612273A (zh) * 2011-01-21 2012-07-25 日本特殊陶业株式会社 电子元件安装用配线基板及其制造方法和具有电子元件的配线基板的制造方法
JP2012146869A (ja) * 2011-01-13 2012-08-02 Alps Electric Co Ltd 磁性シート及び磁性シートの製造方法

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JPH01164099A (ja) * 1987-12-21 1989-06-28 Shin Etsu Chem Co Ltd 放熱シールドシート
JPH09116289A (ja) * 1995-10-24 1997-05-02 Tokin Corp ノイズ抑制型電子装置およびその製造方法
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JP2000276053A (ja) * 1999-03-29 2000-10-06 Sato Corp 多層ラベル
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JP2003273562A (ja) * 2002-03-13 2003-09-26 Murata Mfg Co Ltd 電磁波シールドシートおよび電子機器
JP2005536059A (ja) * 2002-08-14 2005-11-24 ハネウェル・インターナショナル・インコーポレーテッド 電子回路からの電磁放射を低減する方法及び装置
JP2005064266A (ja) * 2003-08-13 2005-03-10 Murata Mfg Co Ltd 電磁波シールドシートおよび電子機器
JP4857927B2 (ja) 2006-06-13 2012-01-18 日産自動車株式会社 サスペンション構造
JPWO2008026247A1 (ja) * 2006-08-29 2010-01-14 日本包材株式会社 電磁波シールド構造とその形成方法
KR100874689B1 (ko) 2008-09-08 2008-12-18 두성산업 주식회사 방열, 전자파 차폐, 및 전자파와 충격 흡수 특성이 향상된 롤 타입 복합 시트 및 그 제조 방법
JP2011124413A (ja) * 2009-12-11 2011-06-23 Murata Mfg Co Ltd 電子部品モジュールの製造方法及び電子部品モジュール
JP2012124413A (ja) 2010-12-10 2012-06-28 Fuji Electric Co Ltd 薄膜太陽電池の製造装置
KR101250677B1 (ko) * 2011-09-30 2013-04-03 삼성전기주식회사 반도체 패키지 및 그의 제조 방법

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10173392A (ja) * 1996-12-09 1998-06-26 Daido Steel Co Ltd 電磁波遮蔽用シート
JP2006286915A (ja) * 2005-03-31 2006-10-19 Taiyo Yuden Co Ltd 回路モジュール
CN101273674A (zh) * 2005-08-30 2008-09-24 松下电器产业株式会社 基板结构
CN101253825A (zh) * 2005-09-30 2008-08-27 松下电器产业株式会社 片状复合电子部件及其制造方法
CN101325182A (zh) * 2007-06-15 2008-12-17 日本特殊陶业株式会社 带有加强构件的配线基板
JP2009081400A (ja) * 2007-09-27 2009-04-16 Mitsubishi Electric Corp 電子機器端末のシールド構造
JP2009188083A (ja) * 2008-02-05 2009-08-20 Murata Mfg Co Ltd 電磁遮蔽シート及び電磁遮蔽方法
CN102256448A (zh) * 2010-05-17 2011-11-23 日东电工株式会社 布线电路基板的制造方法
JP2012146869A (ja) * 2011-01-13 2012-08-02 Alps Electric Co Ltd 磁性シート及び磁性シートの製造方法
CN102612273A (zh) * 2011-01-21 2012-07-25 日本特殊陶业株式会社 电子元件安装用配线基板及其制造方法和具有电子元件的配线基板的制造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109119380A (zh) * 2017-06-23 2019-01-01 Tdk株式会社 使用复合磁性密封材料的电子电路封装
TWI744556B (zh) * 2017-10-13 2021-11-01 日商拓自達電線股份有限公司 屏蔽封裝體
CN114207743A (zh) * 2019-07-31 2022-03-18 株式会社自动网络技术研究所 配线部件
US12046397B2 (en) 2019-07-31 2024-07-23 Autonetworks Technologies, Ltd. Wiring member

Also Published As

Publication number Publication date
KR102150258B1 (ko) 2020-09-01
KR20160074559A (ko) 2016-06-28
KR20180059952A (ko) 2018-06-05
JP6623513B2 (ja) 2019-12-25
WO2015083491A1 (ja) 2015-06-11
JP2015130484A (ja) 2015-07-16
TW201524284A (zh) 2015-06-16

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SE01 Entry into force of request for substantive examination
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Application publication date: 20160720