KR102150258B1 - 전자 소자 및 시트재 - Google Patents

전자 소자 및 시트재 Download PDF

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Publication number
KR102150258B1
KR102150258B1 KR1020187014727A KR20187014727A KR102150258B1 KR 102150258 B1 KR102150258 B1 KR 102150258B1 KR 1020187014727 A KR1020187014727 A KR 1020187014727A KR 20187014727 A KR20187014727 A KR 20187014727A KR 102150258 B1 KR102150258 B1 KR 102150258B1
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KR
South Korea
Prior art keywords
substrate
sheet material
electronic
resin
insulating layer
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KR1020187014727A
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English (en)
Korean (ko)
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KR20180059952A (ko
Inventor
히데노부 코바야시
카즈노리 마츠도
준 미코시바
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토요잉크Sc홀딩스주식회사
토요켐주식회사
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Publication of KR20180059952A publication Critical patent/KR20180059952A/ko
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/003—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields made from non-conductive materials comprising an electro-conductive coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0031—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields combining different shielding materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0064—Earth or grounding circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Laminated Bodies (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
KR1020187014727A 2013-12-03 2014-11-07 전자 소자 및 시트재 Active KR102150258B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2013-249809 2013-12-03
JP2013249809 2013-12-03
PCT/JP2014/079573 WO2015083491A1 (ja) 2013-12-03 2014-11-07 電子素子およびシート材

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020167012862A Division KR20160074559A (ko) 2013-12-03 2014-11-07 전자 소자 및 시트재

Publications (2)

Publication Number Publication Date
KR20180059952A KR20180059952A (ko) 2018-06-05
KR102150258B1 true KR102150258B1 (ko) 2020-09-01

Family

ID=53273262

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020187014727A Active KR102150258B1 (ko) 2013-12-03 2014-11-07 전자 소자 및 시트재
KR1020167012862A Ceased KR20160074559A (ko) 2013-12-03 2014-11-07 전자 소자 및 시트재

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020167012862A Ceased KR20160074559A (ko) 2013-12-03 2014-11-07 전자 소자 및 시트재

Country Status (5)

Country Link
JP (1) JP6623513B2 (enExample)
KR (2) KR102150258B1 (enExample)
CN (1) CN105794331A (enExample)
TW (1) TW201524284A (enExample)
WO (1) WO2015083491A1 (enExample)

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JP2018060990A (ja) * 2016-07-08 2018-04-12 住友ベークライト株式会社 封止用フィルム、電子部品搭載基板の封止方法および封止用フィルム被覆電子部品搭載基板
KR101915947B1 (ko) * 2016-07-20 2019-01-30 스템코 주식회사 연성 회로 기판 및 그 제조 방법
JP6747129B2 (ja) * 2016-07-20 2020-08-26 東洋インキＳｃホールディングス株式会社 電子素子
JP2018060991A (ja) * 2016-09-28 2018-04-12 住友ベークライト株式会社 封止用フィルム、電子部品搭載基板の封止方法および封止用フィルム被覆電子部品搭載基板
FR3062982B1 (fr) * 2017-02-13 2019-04-19 Commissariat A L'energie Atomique Et Aux Energies Alternatives Structure de blindage electromagnetique pour cartes electroniques
FR3062981A1 (fr) * 2017-02-13 2018-08-17 Commissariat Energie Atomique Structure de blindage electromagnetique pour cartes electroniques
US10403582B2 (en) * 2017-06-23 2019-09-03 Tdk Corporation Electronic circuit package using composite magnetic sealing material
JP2019021757A (ja) * 2017-07-14 2019-02-07 住友ベークライト株式会社 封止用フィルムおよび電子部品搭載基板の封止方法
KR102031418B1 (ko) 2017-09-19 2019-10-11 학교법인혜화학원 산조인 복합오일을 포함하는 항아토피성 피부염 약학 조성물
KR102071110B1 (ko) 2017-09-19 2020-01-29 학교법인혜화학원 독활 복합오일을 포함하는 항아토피성 약학 조성물
US11191198B2 (en) * 2017-10-13 2021-11-30 Tatsuta Electric Wire & Cable Co., Ltd. Shield package
JP2019091866A (ja) * 2017-11-17 2019-06-13 東洋インキＳｃホールディングス株式会社 電子素子の製造方法
US10541065B2 (en) 2017-12-21 2020-01-21 The Boeing Company Multilayer stack with enhanced conductivity and stability
JP6497477B1 (ja) * 2018-10-03 2019-04-10 東洋インキＳｃホールディングス株式会社 電磁波シールドシート、および電子部品搭載基板
JP7290083B2 (ja) * 2019-07-31 2023-06-13 株式会社オートネットワーク技術研究所 配線部材
JP7010323B2 (ja) * 2020-04-02 2022-01-26 東洋インキＳｃホールディングス株式会社 電子素子
JP7609301B2 (ja) * 2021-11-29 2025-01-07 ａｒｔｉｅｎｃｅ株式会社 保護シート、電子デバイスパッケージ及びその製造方法

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KR100874689B1 (ko) 2008-09-08 2008-12-18 두성산업 주식회사 방열, 전자파 차폐, 및 전자파와 충격 흡수 특성이 향상된 롤 타입 복합 시트 및 그 제조 방법
JP2009081400A (ja) 2007-09-27 2009-04-16 Mitsubishi Electric Corp 電子機器端末のシールド構造
JP2009188083A (ja) * 2008-02-05 2009-08-20 Murata Mfg Co Ltd 電磁遮蔽シート及び電磁遮蔽方法
JP2012124413A (ja) 2010-12-10 2012-06-28 Fuji Electric Co Ltd 薄膜太陽電池の製造装置
JP2012146869A (ja) * 2011-01-13 2012-08-02 Alps Electric Co Ltd 磁性シート及び磁性シートの製造方法
KR101250677B1 (ko) * 2011-09-30 2013-04-03 삼성전기주식회사 반도체 패키지 및 그의 제조 방법

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JP2011124413A (ja) * 2009-12-11 2011-06-23 Murata Mfg Co Ltd 電子部品モジュールの製造方法及び電子部品モジュール
JP5528259B2 (ja) * 2010-05-17 2014-06-25 日東電工株式会社 配線回路基板の製造方法
JP5587804B2 (ja) * 2011-01-21 2014-09-10 日本特殊陶業株式会社 電子部品実装用配線基板の製造方法、電子部品実装用配線基板、及び電子部品付き配線基板の製造方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005064266A (ja) 2003-08-13 2005-03-10 Murata Mfg Co Ltd 電磁波シールドシートおよび電子機器
JP2009081400A (ja) 2007-09-27 2009-04-16 Mitsubishi Electric Corp 電子機器端末のシールド構造
JP2009188083A (ja) * 2008-02-05 2009-08-20 Murata Mfg Co Ltd 電磁遮蔽シート及び電磁遮蔽方法
KR100874689B1 (ko) 2008-09-08 2008-12-18 두성산업 주식회사 방열, 전자파 차폐, 및 전자파와 충격 흡수 특성이 향상된 롤 타입 복합 시트 및 그 제조 방법
JP2012124413A (ja) 2010-12-10 2012-06-28 Fuji Electric Co Ltd 薄膜太陽電池の製造装置
JP2012146869A (ja) * 2011-01-13 2012-08-02 Alps Electric Co Ltd 磁性シート及び磁性シートの製造方法
KR101250677B1 (ko) * 2011-09-30 2013-04-03 삼성전기주식회사 반도체 패키지 및 그의 제조 방법
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Also Published As

Publication number Publication date
TW201524284A (zh) 2015-06-16
KR20160074559A (ko) 2016-06-28
KR20180059952A (ko) 2018-06-05
JP6623513B2 (ja) 2019-12-25
JP2015130484A (ja) 2015-07-16
WO2015083491A1 (ja) 2015-06-11
CN105794331A (zh) 2016-07-20

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