KR20080061298A - 기판 처리 장치 - Google Patents

기판 처리 장치 Download PDF

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Publication number
KR20080061298A
KR20080061298A KR1020070137143A KR20070137143A KR20080061298A KR 20080061298 A KR20080061298 A KR 20080061298A KR 1020070137143 A KR1020070137143 A KR 1020070137143A KR 20070137143 A KR20070137143 A KR 20070137143A KR 20080061298 A KR20080061298 A KR 20080061298A
Authority
KR
South Korea
Prior art keywords
substrate
stage
floating
processing apparatus
predetermined
Prior art date
Application number
KR1020070137143A
Other languages
English (en)
Korean (ko)
Inventor
도시후미 이나마스
요시하루 오오따
후미히꼬 이께다
쯔요시 야마사끼
요시따까 오오쯔까
Original Assignee
도쿄엘렉트론가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20080061298A publication Critical patent/KR20080061298A/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
KR1020070137143A 2006-12-27 2007-12-26 기판 처리 장치 KR20080061298A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2006-00351688 2006-12-27
JP2006351688A JP4753313B2 (ja) 2006-12-27 2006-12-27 基板処理装置

Publications (1)

Publication Number Publication Date
KR20080061298A true KR20080061298A (ko) 2008-07-02

Family

ID=39611678

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020070137143A KR20080061298A (ko) 2006-12-27 2007-12-26 기판 처리 장치

Country Status (4)

Country Link
JP (1) JP4753313B2 (zh)
KR (1) KR20080061298A (zh)
CN (1) CN100594584C (zh)
TW (1) TWI356467B (zh)

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JP5056611B2 (ja) * 2008-06-20 2012-10-24 凸版印刷株式会社 基板処理装置
JP4755233B2 (ja) * 2008-09-11 2011-08-24 東京エレクトロン株式会社 基板処理装置
US8047354B2 (en) 2008-09-26 2011-11-01 Corning Incorporated Liquid-ejecting bearings for transport of glass sheets
JP4787872B2 (ja) * 2008-10-16 2011-10-05 東京エレクトロン株式会社 基板搬送処理装置
KR100985135B1 (ko) * 2008-11-05 2010-10-05 세메스 주식회사 기판 처리 장치
JP5200868B2 (ja) * 2008-11-11 2013-06-05 株式会社Ｉｈｉ 浮上搬送装置
CN102202992A (zh) * 2008-11-14 2011-09-28 东京毅力科创株式会社 基板处理系统
KR101296659B1 (ko) * 2008-11-14 2013-08-14 엘지디스플레이 주식회사 세정 장치
JP2010123970A (ja) * 2008-11-24 2010-06-03 Sfa Engineering Corp 基板移送装置
JP4696165B2 (ja) * 2009-02-03 2011-06-08 東京エレクトロン株式会社 基板処理装置及び基板処理方法
TWI385114B (zh) * 2009-04-23 2013-02-11 Corning Inc 實質上以垂直的方向運送玻璃片的方法
TWI466225B (zh) * 2009-05-13 2014-12-21 Utechzone Co Ltd Suspended air float working platform
JP4785210B2 (ja) * 2009-07-23 2011-10-05 東京エレクトロン株式会社 基板搬送装置
JP4916035B2 (ja) * 2009-08-28 2012-04-11 東京エレクトロン株式会社 基板搬送装置及び基板搬送方法
KR101205832B1 (ko) * 2009-11-27 2012-11-29 세메스 주식회사 기판 이송 유닛과, 이를 이용한 기판 이송 방법
JP2011124342A (ja) * 2009-12-09 2011-06-23 Tokyo Electron Ltd 基板処理装置、基板処理方法及びこの基板処理方法を実行させるためのプログラムを記録した記録媒体
KR101099555B1 (ko) * 2010-01-12 2011-12-28 세메스 주식회사 기판 처리 장치
TWI777060B (zh) * 2010-02-17 2022-09-11 日商尼康股份有限公司 搬送裝置、曝光裝置以及元件製造方法
KR101202455B1 (ko) * 2010-06-07 2012-11-16 주식회사 나래나노텍 코팅 영역의 기판 이송 유닛에 사용되는 이송 캐리어의 피딩 장치, 및 이를 구비한 기판 이송 유닛 및 코팅 장치
TW201214609A (en) 2010-09-27 2012-04-01 Toray Eng Co Ltd Substrate conveying apparatus
JP2012076877A (ja) * 2010-10-01 2012-04-19 Nitto Denko Corp ワーク搬送方法およびワーク搬送装置
JP5877954B2 (ja) * 2011-03-07 2016-03-08 株式会社ゼビオス 非接触浮上搬送機能を有する基板処理装置
CN102167227B (zh) * 2011-04-02 2012-09-05 东莞宏威数码机械有限公司 基片传输设备
CN102909714A (zh) * 2011-08-05 2013-02-06 南通居梦莱家用纺织品有限公司 自动减重操作台
CN103065998A (zh) * 2011-10-21 2013-04-24 东京毅力科创株式会社 处理台装置及使用该处理台装置的涂布处理装置
JP5912642B2 (ja) 2012-02-20 2016-04-27 日本電気硝子株式会社 ガラス板の搬送装置及びその搬送方法
KR101962083B1 (ko) * 2012-04-03 2019-03-25 가부시키가이샤 니콘 패턴 형성 장치
SG11201406746RA (en) 2012-04-19 2015-03-30 Intevac Inc Dual-mask arrangement for solar cell fabrication
US10062600B2 (en) 2012-04-26 2018-08-28 Intevac, Inc. System and method for bi-facial processing of substrates
JP5915358B2 (ja) * 2012-04-26 2016-05-11 株式会社Ihi 搬送装置
JP6231078B2 (ja) 2012-04-26 2017-11-15 インテヴァック インコーポレイテッド 真空プロセスのためのシステム構成
KR101212817B1 (ko) 2012-09-14 2012-12-14 주식회사 나래나노텍 코팅 영역의 기판 이송 유닛에 사용되는 이송 캐리어의 피딩 장치를 구비한 코팅 장치
KR101212816B1 (ko) 2012-09-14 2012-12-14 주식회사 나래나노텍 이송 캐리어의 피딩 장치를 구비한 코팅 영역의 기판 이송 유닛
TWI590367B (zh) * 2012-11-20 2017-07-01 Toray Eng Co Ltd Suspension transfer heat treatment device
JP3183651U (ja) * 2013-03-13 2013-05-30 揚博科技股▲ふん▼有限公司 フルフラット式回路板加工輸送装置
WO2015052763A1 (ja) * 2013-10-08 2015-04-16 ヤマハ発動機株式会社 基板搬送装置
CN105185726B (zh) * 2014-05-13 2018-09-21 芝浦机械电子株式会社 基板处理装置、基板处理方法、基板制造装置及基板制造方法
CN106688088B (zh) 2014-08-05 2020-01-10 因特瓦克公司 注入掩膜及对齐
KR101563128B1 (ko) * 2015-01-09 2015-10-27 엠에스티코리아(주) 기판 이송 장치
CN105151780B (zh) * 2015-08-28 2018-11-23 武汉华星光电技术有限公司 一种超声波传送装置
CN106081627B (zh) * 2016-07-26 2019-07-02 中导光电设备股份有限公司 一种高速气浮板的使用方法
JP6698489B2 (ja) * 2016-09-26 2020-05-27 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP6860356B2 (ja) * 2017-01-20 2021-04-14 株式会社Ｓｃｒｅｅｎホールディングス 塗布装置および塗布方法
CN107187874B (zh) * 2017-04-28 2019-03-22 武汉华星光电技术有限公司 一种传送装置
CN108750669B (zh) * 2018-05-07 2020-04-24 芜湖良匠机械制造有限公司 一种滚轮式高精度的玻璃基板传送装置
CN110670070A (zh) * 2019-11-19 2020-01-10 江苏上达电子有限公司 一种液浮喷盘的设计方法
TWI753631B (zh) * 2020-10-28 2022-01-21 凌嘉科技股份有限公司 冷卻系統
CN112357581A (zh) * 2020-12-30 2021-02-12 彩虹（合肥）液晶玻璃有限公司 一种玻璃基板风干及传送装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3756402B2 (ja) * 2000-12-08 2006-03-15 富士写真フイルム株式会社 基板搬送装置及び方法
JP3763125B2 (ja) * 2001-07-03 2006-04-05 東京エレクトロン株式会社 基板処理装置
JP4349101B2 (ja) * 2003-11-21 2009-10-21 株式会社Ｉｈｉ 基板搬送装置

Also Published As

Publication number Publication date
CN100594584C (zh) 2010-03-17
TW200845276A (en) 2008-11-16
JP2008166359A (ja) 2008-07-17
TWI356467B (en) 2012-01-11
CN101211756A (zh) 2008-07-02
JP4753313B2 (ja) 2011-08-24

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