200845276 九、發明說明： 【發明所屬之技術領域】 處理基^二二：::^^處理裝置:厂面使矩形之被 施既定處理’尤關於可實現輪^構其，=並在基板上實 裝置。 k機構間易化·低成本化之基板處理 【先前技術】 漸浮升輸送式技術。㈣离基板專）上之光阻塗布裝置，_ 採用浮升輸送式技術之習知氺 揭示’藉由以氣體壓力使矩形被’例如專利文獻1β 之浮升式平台形成浮升輸送道，璃基板)浮趣 在平台上之基板觸之輸送機構包含作如水+鶴之方式使漂浮 一對導執，配置於平台左右兩側； ，右-對滑件’沿此等導軌平行直進移動； 板左t邊::真f吸附墊’以—定間隔以可離合之方式吸附在基 板片彈黃等連結部材，分別使此耸一 於左右滑件’且跟隨基板浮升高度& i真空式吸附墊連結 【專利文獻！】日本特開平島—=5°5 【發明内容】 咖 欲解決的譯靡 右^知ίΓ升輸达式基板處理裝置之輸送機構，如上所、f兩目 有V·執、b件、真空式吸附墊等，因 ㈤上所述’兩具 2別是在光微影製財，於塗布抛、 及高。 其之間作為輔助製程而進行熱處理之烘烤n“製程前後或 本之浮升輸送機構之出現。 私置4 ’期待簡易且低成 200845276 鑒於如上述習知技術之問題點滅 板處理裝置，可以㈣、低成本之構成進;^目的在於一種基 用來解決問題的方式 升輸、式之基板處理。 為^上述目的，本發明之第丨基板處理裝置 式基板處理裝置，藉由氣體壓力使 ^子升輸达 之既定輸送方向延伸之平台上大致水平 =输置之處理部對纖供給心輸=以 以實施既定處理； 矾體、光或熱， ^平台兩側以既定間距配置多個側滾輪成 :上㈣之該幻反兩侧端部搭載於滾輪外周 t千 滾輪以輸送該基板。 、卩紋轉驅動该侧 ιίϊίϋ#藉H之旋轉運動，將浮升於平台上之基& 接j达—面以水平移動之方式沿輸送方向移動。在理 之吸入 之門之錄#，人口賦轉板向下之抽吸力以提高基板 =之里ϊΓΓ，側滾輪之滾輪= 2由氣?壓力使矩形之被處;基板在沿1 理冗送=輸;或;=通： L二二且在平台頂面與侧滾輪接近之端部設置吸人周圍氣體 在_既定間距配置多個㈣輪成-列，俾使 任^十口上汙升之該基板較低一邊之邊緣加壓婵触兵、/一 一平使 =構成巾，齡織輪旋轉運動，使於平台切 輪外周面，且旋轉驅動該側滾輪以輸送該基板 200845276 本發明之第3基板處理裝置係—浮輪 朴 由氣體壓力使矩形之被處理基板在沿水 之平台上浮起之狀態沿該輪送方向輸送致】=== 部對:Ϊ==體、氣體、光或熱，以實施既定處理T 平面成既定角度傾斜之姿態浮起；〃工罝之方向以相對於水 平台y向延伸之無端皮帶，俾使在該 且驅動該無端皮帶以輸送該基板。迎/千口之皮▼外周面， 姿態浮升以動，在平台上以傾斜 沿輸送方向移動。 、'一皮π上㈣水平移動之方式 由氣ίΐΠίί基ΐί理裝置係—浮升輸送式基板處理裝置，藉 之:送方向延伸 偟佔ίΪ彳 科載具以與絲板大致相同之浮料声料 載具自後端之-邊_，且《該ί'浮升 成坑狀或溝槽狀之凹部，使浮;用氧2載具下方形 f致相同之浮升高度浮升，俾使4:ί:ί=載;以與基板 ^吏第2浮升載具在設定位置=====端之一邊 低成之=述構成及作用，㈣、 200845276 【實施方式】 以下參_圖制本發明之騎實施_。 渖作用本發明之基板處理裝置之-構成例的塗布 1布顯影處理系統刚皮設置於無塵室内，以例1 之清i、Ltii被ί:二,亍lcd製:步驟内光微影製程中 理在鄰接此系統而設置^部串處理。曝光處 、統10中，於中心部配置有橫向較長之處理站 （x柏）兩端繼繼站_ ，二=(C/S) 14 ’係系統1〇之g盒送入送出口，包含·· 板之可承载4個可多段重疊多片以收納基 板之IE益C並可使{£孟沿水平之一方向（γ方向）排 及輸送機構22 ’使基板G出入於此平台2〇上之，c。 以X1片為單位固持基板g之輸“22a，可 G〇 軸動作，可與鄰接之處理站（P/S) 16側傳遞基板 t^(P/S) 16中’各處理部沿處理流程或製程之 C A B1緣長邊方向（X方向）延伸之平行対向相反之-對線 而言，在自E盒站（c/s) 14側朝介面站200845276 IX. Description of the invention: [Technical field of invention] Processing unit ^22:::^^ Processing device: The surface of the factory is subjected to the predetermined treatment of the rectangle, especially regarding the realization of the wheel, = and on the substrate Real device. Substrate processing and cost reduction of substrate processing [Prior Art] Gradual lift-up transport technology. (4) The photoresist coating device on the substrate, _ using the floating transfer technology, reveals that 'the rectangular shape is formed by the gas pressure, for example, the floating platform of the patent document 1β is formed into a floating conveyor. Substrate) The conveying mechanism of the substrate touched on the platform includes a pair of floating guides arranged in a manner such as water + crane, arranged on the left and right sides of the platform; and the right-to-slide member moves parallel along the guide rails; Left t side:: true f adsorption pad' is attached to the connecting piece of the substrate piece, such as elastic yellow, in a separable manner, respectively, so as to make it stand on the left and right sliding parts' and follow the substrate floating height & i vacuum type Adsorption pad connection [patent literature! 】Japan Special Kaiping Island—=5°5 【Inventive content】 The translation mechanism of the 基板 Γ 输 输 输 基板 基板 基板 基板 , , , 输 输 输 输 输 输 输 输 输 输 输 输 输 输 输 输 输 输 输 输 输 输Type of adsorption pad, etc., because (5) above, 'two two are in the light micro-shadow making, in coating throwing, and high. Baking between the heat treatment as an auxiliary process n" before and after the process or the present floating transport mechanism. Private 4 'looking simple and low into 200845276 In view of the problems of the above-mentioned prior art, the device is eliminated. The fourth substrate processing device of the present invention can be used for the purpose of solving the problem. The substrate processing device of the second substrate processing device of the present invention is controlled by gas pressure. The platform is extended to the predetermined conveying direction, and the processing unit is connected to the fiber to supply the heart to the fiber to perform the predetermined process; the body, the light or the heat, and the two sides of the platform are arranged at a predetermined interval. The side rollers are formed as follows: the upper and the opposite ends of the upper (four) are mounted on the outer circumference of the roller to transport the substrate. The crepe drive drives the side ιίϊίϋ# by the rotation motion of H, which will rise to the base of the platform. & pick up the j-surface to move in the direction of the horizontal movement. In the door of the inhalation of the door #, the population transfer plate downward suction force to improve the substrate = inside the wheel, the side roller roller = 2 The gas pressure causes the rectangle to be placed; the substrate is arbitrarily sent along the line; or; = pass: L two and two at the end of the top surface of the platform and the side roller are placed at the end of the suction gas at the _ predetermined spacing (4) Wheel-in-column, so that the edge of the lower side of the substrate is smeared on the lower side of the substrate, 婵 婵 = 构成 构成 构成 构成 构成 构成 构成 构成 构成 构成 构成 构成 构成 构成 构成 构成 构成 构成 构成 构成 构成 构成 构成 构成 构成 构成 构成 构成 构成 构成 构成And rotating the side roller to transport the substrate 200845276. The third substrate processing apparatus of the present invention is a floating wheel which is conveyed in the direction of the wheel by a gas pressure to cause the rectangular processed substrate to float on the platform along the water. 】=== Partial pair: Ϊ = = body, gas, light or heat, in the attitude of the T-plane to achieve a predetermined angle of inclination for the implementation of the predetermined treatment; the direction of the 罝 罝 is the endless belt extending in the y direction with respect to the water platform,俾 在 且 且 且 且 且 无 无 无 无 无 无 。 。 。 。 。 。 迎 迎 迎 迎 迎 迎 迎 迎 迎 迎 迎 迎 迎 迎 迎 迎 迎 迎 迎 迎 迎 迎 迎 迎 迎 迎 迎 迎 迎 迎 迎 迎 迎 迎 迎 迎 迎 迎The way is by gas ί ΐΠ ί ΐ 理 理 — 浮 浮 浮 浮 浮 浮The processing device, by means of: the direction of the extension is 偟 Ϊ彳 载 载 以 以 以 以 以 大致 大致 大致 大致 大致 大致 大致 大致 大致 大致 大致 大致 大致 大致 大致 大致 大致 大致 大致 大致 大致 大致 大致 大致 大致 大致 , , , , , The concave portion of the shape makes the float; the lower float of the square with the oxygen 2 carrier causes the same floating height to rise, so that the 4: ί: ί = load; and the substrate 2 浮 the second floating carrier at the set position == [=========================================================================================================== The development processing system is set in the clean room, and the clearing of the example 1 and the Ltii are made by ί:2, 亍lcd: in the step of the photolithography process, the process is arranged adjacent to the system. In the exposure section, the system 10 is provided with a horizontally long processing station (x cypress) at both ends of the relay station _, two = (C / S) 14 'system 1 〇 g box into the delivery outlet, The board includes four IE-Cs that can be stacked in multiple stages to accommodate the substrate, and can make the substrate G enter and exit the platform 2 in one direction (γ direction) and the transport mechanism 22'. In fact, c. The input "g" of the substrate g is held in units of X1 sheets, and the operation can be performed on the axis of the substrate, and the processing unit (P/S) 16 side can transmit the substrate t^(P/S) 16 in the processing unit along the processing flow. Or the parallel direction of the longitudinal direction of the CA B1 edge (X direction) or the opposite direction - for the line, from the E box station (c/s) 14 side to the interface station
Λ上游侧沿第1水平移動輸送道34舰J Ϊ 30=i清洗處理部26、第1熱性處理部狀、塗布處理 口ί5 30及弟2熱性處理部32以此順序配置為_列。 呷处里 於而言’送入單元（IN PASS) 24自£盒站（C/S) 14之 ί接ί未處理HG ’以既定作業將其導人第1水平移 洲。幻熱性處理部28中’自上游側依序設有附著單元^)(40及 200845276 布單42。塗布處理部30卜自上游側依序設有光阻塗 減壓乾燥單元（W) 46。第2熱性處理㈣中， (™'βΑ]ίΕ) (COL) 將以皮卓梦命( SS) 52。自此終點之傳遞單元（PASS) 52 -34 ^ 下游自Ϊ面站U/?) 18側朝11金站（C/S) 14側之 (卿二、Μ眛自上游側沿第2水平移動輸送道64將顯影單元 ^杳ϊ /Αί 1 烤單7"(贿―_) 56、冷卻單元⑽）58、 3了^，f »及送出單元㈣—PASS) 62以此順序配置為一 成第Μίΐί、共烤早兀（肅―MKE) 56及冷卻單元（C0L) 58構 ϊί 4^4"^ (0UT PASS) 62 ^ 2 iiL 基板G ’交倾盒站（c/s) 14之輸送 健i兩/ΐ ΐ線Α、β之間設有獅輸送空間68，藉絲經圖示之驅 以=為單位水科絲板g之穿梭裝置7g沿處理線 方向（X方向）雙方向移動。 八 面站（I/F) 18，具有輸送裝置72，用以與上述第1及第2 i 動道34、64或鄰接之曝光裝置12傳輪基板G，於此輸送 平台㈣）74及周邊裝置76。旋轉平台 其ΐίί在水平面内旋轉之平…係於與曝光裝置12 巧基板μ，用於轉換長方形基板G之方向。周邊裝置76中，例如 ^ j光機（TITLER)或周邊曝絲置（EE)等連接於第2水平移 動輸送道64。 圖^顯示此塗布顯影處理系統中針對丨片基板G全製程之處理 順序。首先，於匣盒站（C/s) 14内，輸送機構22自平台20上之 盒C中取出1片基板G，將此—被取出之基板G送人處理站（p /S) 16之處理線A側的送入單元（IN PASS) 24 (步驟幻）。自送 200845276 =單上元（針卿24將基板G移載轉人至第丨水平移動輸送道 在清洗處理部26中，先藉由準分子uv昭 擦磨清洗單元（SCR) 38依序對被導入至第^水$ ^UV) 36及 ^ (^ r 下:通即直接料1料移_送道34而 於第1熱性處理部28内，先在附著單元（AD) 4 t用ϊί狀膽s之附著處理，以疏水化被處理面（步驟⑦芯 處理後，在冷卻單^ (a)L) 42内 g 度(步驟S5)。此後亦沿第1水平移動輸送道34而下=5= + =塗布處理部30巾，先在光阻塗布單元（C0T) 44内藉由使用 布法以水平移動之方式對基板G在基板曰頂面(被 46接為葬1龍夕t然後馬上在下游側旁之減壓乾燥單元⑽ 接又錯由減壓之方式進行之常溫乾燥處理（步驟邠）。 、雨J ίΪΐΐ部3〇而出之基板G沿第1水平移動輸送道34而下 ϊΐί pt 32。於第2熱性處理部32中，基板G先在預供 η ) 48内接受預烘烤以作為光阻塗布後熱處理或曝 之、°藉由此預烘烤使殘餘在基板g上光阻膜甲 -^以除之’強化光阻膜對基板之密著性。其次於冷卻單 ί平編基板G至既絲板溫度（步驟S8)。織自第1 4之終點之舰單元（聰）52將基板G交接給介 面站Π/F) 18之輸送裝置72。 译夕(、Ά 18中，以旋轉平台74使基板G接受例如90 又σ轉、再送入周邊裝置76之周邊曝光裝置（ΕΕ)，在此接受 200845276 用以在顯影時去除附著於基板(^周邊部之光阻之曝光後，將其送至 隔壁之曝光裝置12 (步驟S9)。 於曝光裝置12内使基板G上之光阻曝光為既定之電路圖案。 又，結束圖案曝光之基板G—旦自曝光裝置12回到介面站（I/F) 18 (步驟S9)」首先將其送入周邊裝置76之印字曝光機（titler)， 在此將既定資訊記在基板上之既定部位（步驟sl〇)。然後藉由 裝置72將基板G送入被舖設於處理站（P//S) 16處理線B侧之2 水平移動輸送道64之顯影單元（DEV) 54起點。 如此f式，現在使基板G在第2水平移動輸送道64上朝處理 B下游側輸送。綠顯影單元（勝）54中，於以水平移動之= =$期間，對基板G實施顯影、沖洗、乾燥之—連串顯影處理^步 甘枚ί束ί顯影單元（膽）54内一連串顯影處理之基板G，在維持 ，、拕載於第2水平移動輸送道64之情況下，依序通過3埶拽 部66及檢查單元（ΑΡ) 6〇。於第3熱性處理部66内，先在^ :里 I6 …處理（步驟S12)。猎由此後烘烤使殘餘在基板G上 液或清洗液蒸發財除之’強化光阻圖案對基板之密 兀（c〇l) 58内冷卻基板g至既定基板溫度（步“d ^單元（ΑΡ) 6G巾，進行關於基板GJi之光阻 寬檢查或膜質、膜厚檢查等（步驟S14)。 -非接觸式線 送出單元（0UTPASS) 62接收自第2水平移動輪详、# β/1从土 製程處理而來之基板G，傳送給g盒站（G/S之^ j全 於ϋ盒站（C/S) 14側，輸送機構22使自逆出之^機構22。 (步ίΪί 料收納於任—（通常係原來）之内 此塗布顯影處理系統1〇中，浮升式輸送i 水平移動輸送道34、64之-部分或翻於第1及第2 200845276 圖3顯示第1水平移動輸送道34中 ^ UD) 40 ίωυ ΐίίί 向）以水平移動之方式長邊方向亦即輸送方向（X方 側： 4〇"8^ ίίίΓ〇Ι：Ηϊ 體（例如式通過正下方之基板g吹送既定溫度之冷卻氣 端起ij!;:::台寬度方向(γ方向)涵編板G之一 構成，有狹縫狀流出口4::嘴嘴84或冷卻氣體嘴嘴90， 塗布處理第光1阻]^多HU34中，浮升式輸送道適用於通過 式加以輸送。方向/即輸送方向（X方向）以水平移動之方 光阻噴嘴92，光阻^ Q9 f，輸达方向之既定位置配置有長條形 =之浮雜送枝=_以水平 二 ==如舖地 200845276 50區間之構成例。此時亦使基板G以在 洋升之狀態藉由未經圖示之給详她描、,L T y 4 人王水十狀 α古w二二Γ 輸機構沿平台長邊方向亦即輸送方向 輸送。於預烘烤單^麗—β 方沿輸送方向排列多段配置有多片加熱器，例如 其ϊΐΐ_轄射板94使以水平移動之浮升輸送方式 阻蒸發。在此雖將圖示省略，作槪上义尤 χ 、々憎广彳一可知亦可在平台80上方設置用以吸 入洛祕風之排亂用吸入口或多孔板。於冷卻單元（c〇L) 5〇中 i多W或多條冷卻氣體喷嘴96，沿輸送方向排列°， ^由各β K射嘴％對以水平鶴之料輸送方式通過正下方之 基板G吹送一定溫度之冷卻氣體（例如空氣）。 與圖5相同之洋升式輸送道，亦可適用於第2水平移動輸送道 64^通過第3熱性處理部66之後烘烤單元（POST—BAKE) 56及冷 卻單兀（COL) 58之區間。且相同之浮升式輸送道亦可適用 ^ 分子UV照射單元（E — UV) 36之區間等。 圖6顯示浮升平台80之重要部位構成例。於平台8〇頂面，以 既定之排列圖案（例如矩陣狀）穿孔形成有喷祕縮空氣Q (藉此使 洋升力及於基板G)之多數喷出口 1〇〇。各喷出口 100連通平台80 内之壓縮空氣供給路（或緩衝室）1〇2，壓縮空氣供給路1〇2透過外 部配管f未經圖示）與壓縮機等壓縮空氣供給源（未經圖示）相通。 顯示於圖7之構成係設置抽吸口 1〇4，位於浮升平台8〇頂面， 與喷出口 100混雜構成並以負壓吸入空氣（藉此使向下之抽吸力及 於基板G)。各抽吸口 1〇4連通於平台内之真空通路（或緩衝室）1〇6, 真空通路106透過外部配管（未經圖示）與真空泵等真空源（未經 ，示^相通。如此自喷出口 100對通過正上方之基板G送出壓縮^ $，藉以對其施加垂直向上之力，並同時藉由抽吸口 104施加因負 壓抽吸力所造成之垂直向下之力，即可藉由控制互相對抗之雙方向 力之平衡，而穩定維持浮升量h於設定値附近。 以下詳細説明此實施形態中關於使用於浮升輸送之輪送機構。 13 200845276 示、輸送^向’實，例構成之浮升輸送機構。如圖8所 滾輪或側滾輪11〇^ ’平^ 80左右兩側分別配置有多個 由圓板體或圓桂體所°以一疋間距排成一列。各側滾輪11〇 支持軸112於其中^ ^ =部朝γ方向外側水平延伸之滾輪 輪支持軸112前=^ =114可旋轉之方式受到支持，同時滾 軸118透過驅動帶^ ^^16連接於共通驅動軸118。驅動 驅動源之馬達12〇。^9 時皮帶124及從動帶輪126連接於旋轉 台80之頂面袞輪外周面之頂部沿Z方向恰較平 度尺寸設定為，俾^Γ平之程度。另一方面，平台80寬 所受之上為下方頂面）噴出口⑽ 台兩侧側滾輪110之上。、 狀悲，其左右兩側端部搭載於平 多個輸ϋ〇用H面口 it最ίϊ近各側滾輪110之處設置有1個或 ίίί示以滾輪外周以又向下 混雜構成於：S用出 120 (122'124' ^6. (前進方向）旋轉。/由相方向 ◦接替傳送之‘ 距沿輸送方向（x方向）排列舖設有棒狀月ίί子136，滾動 14 200845276 度配合平台8〇上 ☆ / i3mt機構連接==動馬雖達將圖示省略，但可知各滾子 板《不停止送道-上移動而來之基 台80上之空中之壯At ’予升輪送道，如上述使J:浮於早 ^) 〇 110 ^ ^ -i t ^;80 0 ° ^ s" 以既定間距沿輪送方向α ,、 ，k向紅轉軸140之側滾輪138， b因重力力嗎觸#^台1=卜成^=使基板G較低之-邊 ίίί 旋轉運動，與平台80平行之傾斜姿態浮升Ik板猎r由 3 L姻滾輪138 _送之狀g，沿輸送柏(=== 如此，此實施例之浮升輸送機構，係藉由 :滾_之構成進行基板。之浮升輸送者，而=為之=己 言，係於平台80較低之-側（右侧）設置沿輸送^向13 °^=田而 ΐ ^帶142 ’俾使基板G較低之—邊Lg因重力加壓‘ί ^ 口之皮▼外周面142a。此無端皮帶142係掛設在配置於千 侧，具有縱方向旋轉軸144之驅動帶輪146與從動帶於右 之間°藉由旋轉驅動帶輪146，無端皮帶142直進移動以帶 15 200845276 無端皮帶142以接觸下邊Lg之方式搭載以與平台80平行之傾斜姿態 浮升之基板G使其以水平移動之方式沿輸送方向（X方向）移動。 圖14〜圖16顯示以第4實施例構成之浮升輸送機構。如圖14 及圖16所示，此實施例係使一板狀浮升載具148位於平台80上， 基板G後，浮升至與基板G大致相同之浮升高度，浮升載具148，係 自後推擠基板G而一體移動者。浮升載具148之材質宜具有與基板G 相同或大致相同之比重，亦可構成為其前端之邊完全吻合基板G後 端之邊之矩形板體。 於此實施例中，為賦予浮升載具148輸送推進力，在浮升載具 148背面（下方）以例如圖15所示之矩陣狀圖案形成有多數之小凹 孔（坑）150。又，於平台80頂面，形成有各喷出口 100，俾使其朝 往輸送方向（X方向）之斜上方。藉此，自平台80頂面之喷出口 100 朝同方向所喷出之浮升用高壓空氣Q，雖分別以均一之流量沖擊浮升 載具148及基板G下方，然而對浮升載具148下方之小凹孔150係 以較其他小之照射角（為法線之角）沖擊其前部内壁，因此較基板G 大之推進力產生於浮升載具148,浮升載具148 —面推擠基板G —面 使其沿輸送方向（X方向）移動。 作為此實施例之一變形例，亦可如圖17 (A)、（B)及圖18所 示，以沿與輸送方向（X方向）垂直之方向（Y方向）延伸之溝槽152 取代浮升載具148之小凹孔150。此時，如圖17 (B)所示，藉由使 溝槽152兩端部朝輸送方向前方彎曲，朝内（朝平台中心）之推進 力產生於此等兩端部分，不僅對防止浮升載具148橫向偏位亦對防 止基板G之橫向偏位有效。 顯示於圖19之變形例，係為賦予浮升載具148輸送推進力，不 如上述於背面形成小凹孔150,而代之以使銷154以可離合之方式卡 合於形成在例如浮升載具148 —端或兩端之孔（開口）’藉由未圖 示之直進輸送機構，透過銷154使浮升載具148沿輸送方向（X方向） 移動者。且為任意停止基板G之水平移動輸送，亦可於平台80上， 基板G前，使另一板狀浮升載具156以與基板G大致相同之浮升高 16 200845276 度浮升，使浮升载具i56在所 基板G之前進移動。 置彳 並以此為障礙物阻止 圖20及圖21 _+丨v贫c ^ 例係以可調整之方式沿輸送之浮升輪送機構。此實施 方噴出之__流向藉控f自平㈣頂面朝上 liif ί G前進移動者。亦即如圖20 (:)之ΐ?力ϊίί台80上 上使基板G以相對較大之浮 =所不，百先在平台80 如圖20 (Β)所示，自基板“又^^ 2〜3刪）水平浮升。其次 各位置，使(Χ方向）之前方 f 板〇即如同溜滑梯一般因逐漸變小。如此，基 用壓縮空㈣流量（壓力）較 ^方曰向）之兩端部，浮升 抑制基板G之橫向偏位。 』匕4之忒抓置大，可有效防止或 圖22〜圖24顯示以第β實施例構成 所示，此實施例係將平㈣呈以沿。如圖22 α (例如5〜15。)傾斜之前傾姿態 台80上如同溜滑梯一般因重力朝 二苎J板G在平 二二平面上之浮升用壓縮 圖23所不，因與第5實施例相同之 了胃然，如 板G強制停止於平台8G上所期待之位置^、=移广欲使基 位置附近形成嘴出口 100，俾使浮升用壓縮〜圖24=在停止 與輸送方向（X方向）減之-餘斜上方喷=Q自千台8G頂面朝 圖25及圖26顯示以第7實施例構成之浮升輪 ⑽，於無端皮帶⑽外侧面以1間隔安裝吸附墊=。 1 η 200845276 吸附塾162自下往上推。基板G被送人平台8 = ^ 吸附墊162 —旦來到推壓構件17〇夕T t: 81^上無知皮Y 160之 在從:，6附近折返，改i:進方U自方= 板並不限於LCD用玻璃基板，亦可為盆他平 理液。 < 7十"電材枓、配線材料等處 【圖式簡單說明】 構成科細本發日狀絲處縣置之㈣㈣處理系統 口=====圖 圖4係顯示實施形態中基板處理2；： 基編裝置；=: 剖面@之另—構成之放大部分 =2示ϊ施Γ1Ι浮升輪送機構構成之俯視圖； 圖9係顯料1貫⑽财科輪顿 ! !； ；：f ； 圖1係以不苐2貫施例中序升輪送機構構成之侧視圖； 200845276 圖12係顯示第3實施例中洋升輪送機構構成之俯視 圖13係顯示第3實施例中浮升輪送機構構成之側 圖I4係齡第4實施射料輪送機漏狀俯視圖； 圖 圖15係顯示第4實施例中設置於浮升載具背面之小凹 案例之仰視圖； 圖16係顯示第4實施射浮升輸送機構構成及作狀側； 圖17(A)、（B)係顯不作為第4實施例之一變形 载具背面設有溝槽之構成之仰視圖； '开 圖18係顯示圖17之浮升载具作用之側視图· 圖19係顯示第5實施例中浮升輸送機構^成之俯 圖20(A)、⑻係顯示第6實施例中浮升 作用之側視圖； W射再风/、 圖 圖 •圖21係齡第6實施例中浮升輪送機構構成與_伽之後視 ， .圖22係顯示第7實施例中浮升輪送機構構成與一作用之側視 .圖23係顯示第7實施例中浮升輸送機構構成與一作用之後視 圖； 圖24係顯示第7實施例中浮升輸送機構構成與一作用之侧視 圖； 圖25係顯示第7實施例巾料輪送機構構成之俯 圖26係顯示第7實施例中浮升輸送機構構成之側視_ : 19 200845276 【主要元件符號說明】 A、B〜處理線（線） C〜匣盒 EE〜周邊曝光裝置 G〜基板 h〜浮升量 . Η〜水平面The upstream side of the crucible is moved along the first horizontal moving conveyance path 34, the ship J Ϊ 30 = i, the cleaning processing unit 26, the first heat treatment portion, the coating processing port ί5 30, and the second heat processing unit 32 are arranged in this order as a column. In the case of the "incoming unit (IN PASS) 24 from the box station (C / S) 14 ί ί unprocessed HG ‘advanced to the first level of the continent with a given job. In the magic heat treatment unit 28, 'the attachment unit ^ is provided in order from the upstream side (40 and 200845276). The coating processing unit 30 is provided with a photoresist coating drying unit (W) 46 in this order from the upstream side. In the second heat treatment (4), (TM'βΑ]ίΕ) (COL) will be Pippi Dream (SS) 52. From this end of the transfer unit (PASS) 52 -34 ^ downstream from the kneading station U /?) 18 side facing the 11th gold station (C/S) 14 side (Qing Er, Μ眛 from the upstream side along the 2nd horizontal moving conveyor 64 will develop the unit ^ 杳ϊ / Αί 1 baking list 7 " (Brib - _) 56 , cooling unit (10)) 58, 3, ^, f » and delivery unit (four) - PASS) 62 in this order configured as a Μ ΐ ΐ ΐ 共 共 共 共 共 共 共 肃 肃 肃 肃 肃 肃 肃 肃 肃 肃 肃 肃 M M M M M M M M M M M M M M M M M M M M M M 4^4"^ (0UT PASS) 62 ^ 2 iiL Substrate G 'Intersection box station (c/s) 14 Transportation ii two / ΐ ΐ line Α, β between the lion transport space 68, by the silk The shuttle 7g of the water-based silk plate g, which is shown in the figure, moves in both directions in the processing line direction (X direction). An eight-face station (I/F) 18 having a transport device 72 for transporting the substrate G with the first and second i-movements 34, 64 or adjacent exposure device 12, and the transport platform (four) 74 and surrounding Device 76. The rotating platform is 旋转ίί rotated in the horizontal plane...the substrate is used in conjunction with the exposure device 12 for converting the direction of the rectangular substrate G. In the peripheral device 76, for example, a TITLER or a peripheral wire (EE) is connected to the second horizontal moving path 64. Fig. 2 shows the processing sequence for the entire process of the ruthenium substrate G in this coating development processing system. First, in the cassette station (C/s) 14, the transport mechanism 22 takes out one substrate G from the cassette C on the platform 20, and sends the taken-out substrate G to the processing station (p/S) 16 Handle the feed unit on the line A side (IN PASS) 24 (step magic). Self-delivering 200845276=Single-element (Xinqing 24 transfers the substrate G transfer to the third horizontal moving conveyor in the cleaning processing unit 26, first by the excimer uv-ray cleaning unit (SCR) 38 It is introduced into the first water $ ^UV) 36 and ^ (^ r under: the direct feed 1 material transfer _ the feed channel 34 in the first heat treatment portion 28, first in the attachment unit (AD) 4 t for ϊ ϊ Attachment treatment of the spleen s to hydrophobize the treated surface (after the step 7 core treatment, in the cooling unit ^ (a) L) 42 g degrees (step S5). Thereafter, the transport path 34 is also moved along the first level. =5= + = coating treatment unit 30, first in the photoresist coating unit (C0T) 44 by using the cloth method to horizontally move the substrate G on the substrate dome surface (by 46 to be buried 1 Long Xi t Then, the decompression drying unit (10) next to the downstream side is connected to the room temperature drying process by the decompression method (step 邠), and the substrate G which moves out of the rain is moved along the first horizontal moving path 34. And in the second heat treatment portion 32, the substrate G is pre-baked in the pre-supply η) 48 to be heat-treated or exposed as a photoresist after coating. Baking causes the photoresist film to remain on the substrate g to remove the adhesion of the photoresist film to the substrate. Secondly, the substrate G is cooled to the temperature of the board (step S8). The ship unit (Cong) 52 at the end of the 14th passes the substrate G to the transport device 72 of the interface station Π/F) 18. In the case of Ά18, the substrate G is subjected to a peripheral exposure device (ΕΕ) which is rotated by 90, for example, and then sent to the peripheral device 76 by the rotating platform 74, and is subjected to 200845276 for removing the adhesion to the substrate during development (^ After exposure of the photoresist of the peripheral portion, it is sent to the exposure device 12 of the partition wall (step S9). The photoresist on the substrate G is exposed to a predetermined circuit pattern in the exposure device 12. Further, the substrate G for ending the pattern exposure Once the exposure device 12 returns to the interface station (I/F) 18 (step S9)", it is first sent to the titler of the peripheral device 76, where the predetermined information is recorded on the predetermined portion of the substrate ( Step s1). Then, the substrate G is fed by the device 72 to the starting point of the developing unit (DEV) 54 which is laid on the horizontal moving conveyor 64 of the processing line (P//S) 16 processing line B side. Now, the substrate G is transported to the downstream side of the process B on the second horizontal moving transport path 64. In the green developing unit (winning) 54, the substrate G is developed, washed, and dried during the horizontal shift ==$. - series of development processing ^ step 甘枚 ί beam ί development unit (biliary) 54 When the substrate G to be developed is held on the second horizontal movement path 64, the substrate G and the inspection unit (ΑΡ) 6 are sequentially passed through the third heat treatment unit 66. First, in the ^: I6 ... process (step S12). Hunting is then baked to make the residual liquid on the substrate G or the cleaning solution is evaporated and the 'enhanced photoresist pattern is cooled in the substrate (c〇l) 58 The substrate g is brought to a predetermined substrate temperature (step "d ^ unit (6) 6G towel, light resistance inspection with respect to the substrate GJi, film quality, film thickness inspection, etc. (step S14). - Non-contact line sending unit (0UTPASS) 62 Receiving the substrate G from the second horizontal moving wheel detail, #β/1 from the earth processing, and transmitting it to the g box station (G/S is all on the side of the cassette station (C/S) 14 side, the conveying mechanism 22 so that the self-reversing mechanism 22 is placed in the coating development processing system 1 ,, the floating transport i horizontally moves the portions of the transport lanes 34, 64 or Turning to the first and second 200845276, FIG. 3 shows that the first horizontal moving conveyor 34 is in the middle of the UD) 40 ίωυ ΐ ί ί ί The side direction is the conveying direction (X side: 4〇"8^ ίίίΓ〇Ι: Ηϊ body (for example, the cooling gas end of the predetermined temperature is blown from the substrate g directly below ij!;::: the width direction of the table ( One of the gamma-direction culvert plates G, there are slit-shaped outlets 4:: nozzles 84 or cooling gas nozzles 90, coating treatment light 1 resistance] ^ HU34, the floating conveyor is suitable for passing The direction is the direction, that is, the conveying direction (X direction), the square photoresist nozzle 92 is moved horizontally, and the photoresist is Q9 f. The predetermined position of the conveying direction is arranged with a long strip = the floating miscellaneous branch = _ with horizontal two = = Example of the construction of the 200845276 50 section. At this time, the substrate G is also shown in the state of the ocean rise by the illustration, and the LT y 4 person's water is in the direction of the long side of the platform, that is, the transport direction. delivery. A plurality of heaters are arranged in a plurality of stages arranged in the conveying direction of the pre-baked sheet. For example, the ϊΐΐ-plate 117 is configured to evaporate in a horizontally moving floating conveying manner. Although the illustration is omitted here, it can be seen that the suction port or the perforated plate for intrusion of the secret wind can be provided above the platform 80 as the upper side of the platform. In the cooling unit (c〇L) 5〇, more than W or a plurality of cooling gas nozzles 96 are arranged in the conveying direction, and ^ is passed by each of the β K nozzles to the horizontally crane material through the substrate G directly below. A cooling gas (such as air) that blows a certain temperature. The same type of ascending conveyor as in FIG. 5 can also be applied to the second horizontal moving conveyor 64 through the third thermal processing unit 66, the post-baking unit (POST-BAKE) 56 and the cooling unit (COL) 58. . The same floating conveyor can also be used for the interval of the molecular UV irradiation unit (E-UV) 36. Fig. 6 shows an example of the configuration of important parts of the floating platform 80. On the top surface of the platform 8, a predetermined array pattern (e.g., a matrix shape) is perforated to form a plurality of ejection ports 1 of the blasting air Q (by which the ocean lift and the substrate G). Each of the discharge ports 100 communicates with a compressed air supply path (or buffer chamber) 1〇2 in the platform 80, and the compressed air supply path 1〇2 passes through an external pipe f (not shown) and a compressed air supply source such as a compressor (not shown). Show) communicate. The structure shown in Fig. 7 is provided with a suction port 1〇4, which is located at the top surface of the floating platform 8, and is formed by being mixed with the discharge port 100 and sucking air with a negative pressure (by which the downward suction force is applied to the substrate G). ). Each of the suction ports 1〇4 communicates with a vacuum passage (or a buffer chamber) 1〇6 in the platform, and the vacuum passage 106 passes through an external pipe (not shown) and a vacuum source such as a vacuum pump (not shown). The discharge port 100 sends a compression force to the substrate G passing directly above, thereby applying a vertical upward force thereto, and simultaneously applying a vertical downward force due to the suction force of the negative pressure by the suction port 104. By controlling the balance of the bidirectional forces against each other, the floating amount h is stably maintained near the set 。. The following is a detailed description of the wheeling mechanism used for the hoisting conveyance in this embodiment. 13 200845276 As shown in Fig. 8, the roller or the side roller 11 is disposed on the left and right sides of the flat plate, and a plurality of discs or round bodies are arranged in a row at a pitch. Each of the side rollers 11 〇 support shaft 112 is supported in a rotatable manner in front of the roller wheel support shaft 112 in which the ^ ^ = portion extends horizontally outward in the γ direction, and the roller 118 is connected through the drive belt ^ ^ ^ 16 Common drive shaft 118. Drive the source of the horse When the belt is 12, the belt 124 and the driven pulley 126 are connected to the top surface of the outer surface of the top surface of the rotary table 80 in the Z direction, and the flatness dimension is set to be the degree of the flat surface. The upper surface of the platform 80 is above the top surface of the spray port (10). The left and right ends are mounted on a flat H-side port for each of the flats. The bottom roller 110 is provided with one or the other side of the roller. S uses 120 (122'124' ^6. (forward direction) rotation. / The phase direction ◦ takes over the transmission'. The distance is arranged along the conveying direction (x direction), and the rod-shaped month ίί子 136, rolling 14 200845276 degree fit Platform 8 〇 / / i3mt mechanism connection == moving horse Although the illustration will be omitted, but we can know that each roller board "does not stop sending the road - the movement on the base station 80 on the air of the strong At ' to the lift Send the road, as described above, make J: float early ^) 〇110 ^ ^ -it ^; 80 0 ° ^ s" at a given interval along the direction of rotation α, , , k to the side of the red shaft 140 138, b Gravity force touch #^台1=卜成^=Make the substrate G lower-edge ίίί Rotating motion, parallel with the platform 80, tilting posture, Ik board hunting r by 3 L marriage wheel 138 _ send shape g, Along the transporting cypress (===, the floating transport mechanism of this embodiment is performed by the structure of the roll_the substrate. The floater transporter, and ======================================================= The low-side (right side) setting along the transport direction 13 ° ^ = Tian ΐ ^ belt 142 '俾 makes the substrate G lower - the edge Lg is pressurized by gravity 'ί ^ mouth skin ▼ outer peripheral surface 142a. The endless belt 142 is hung on the thousand side, and the driving pulley 146 having the longitudinal rotating shaft 144 and the driven belt are between the right sides. By rotating the driving pulley 146, the endless belt 142 moves straight to the belt 15 200845276 The belt 142 is mounted on the lower side Lg so as to be moved in the transport direction (X direction) so as to move horizontally in an inclined posture parallel to the stage 80. Fig. 14 to Fig. 16 show the fourth embodiment. As shown in FIG. 14 and FIG. 16, this embodiment is such that a plate-shaped floating carrier 148 is placed on the platform 80, and after the substrate G, it rises to substantially the same height as the substrate G. The floating carrier 148 is integrally moved by pushing the substrate G from the rear. The material of the floating carrier 148 preferably has the same or substantially the same specific gravity as the substrate G, and may be configured such that the edge of the front end completely conforms to the substrate G. a rectangular plate on the side of the end. In this embodiment, to give the lifting carrier 148 Propelling force, a plurality of small recessed holes (pits) 150 are formed on the back surface (lower side) of the floating carrier 148 in a matrix pattern such as that shown in Fig. 15. Further, on the top surface of the platform 80, respective discharge ports 100 are formed.俾 俾 朝 朝 朝 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 The carrier 148 and the substrate G are below, but the small recess 150 below the floating carrier 148 is impacted on the front inner wall by a smaller angle of illumination (the angle of the normal), so the propulsion is larger than the substrate G. The floating carrier 148 is generated, and the floating carrier 148 pushes the surface of the substrate G to move in the conveying direction (X direction). As a modification of this embodiment, as shown in FIGS. 17(A), (B) and 18, the groove 152 extending in the direction perpendicular to the conveying direction (X direction) (Y direction) may be substituted for the float. The small recess 150 of the carrier 148 is lifted. At this time, as shown in Fig. 17(B), by bending both end portions of the groove 152 toward the front in the conveying direction, the thrust force inward (toward the center of the platform) is generated at both end portions, not only to prevent the rise. The lateral offset of the carrier 148 is also effective to prevent lateral misalignment of the substrate G. In the modification shown in Fig. 19, in order to impart a propulsive force to the floating carrier 148, the small recess 150 is formed on the back surface as described above, and instead the pin 154 is engaged in a disengageable manner to form, for example, a float. The hole (opening) of the carrier 148 at the end or both ends is moved by the pin 154 in the conveying direction (X direction) by the straight feed mechanism (not shown). And the horizontal movement of any stop substrate G can also be carried out on the platform 80, before the substrate G, so that the other plate-shaped floating carrier 156 rises at substantially the same height as the substrate G. The elevator i56 moves forward before the substrate G.彳 彳 彳 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图 图The __ flow from the implementer to the borrower f is self-flat (four) top face up liif ί G forward mover. That is, as shown in Fig. 20 (:), the substrate G is made to have a relatively large float on the upper surface of the substrate 80, and the first is on the platform 80 as shown in Fig. 20 (Β), since the substrate "also ^^ 2~3 delete) horizontally rise. Secondly, the position of the front side of the (f) direction is as small as the slippery ladder. Therefore, the base is compressed (four) flow rate (pressure) is better than the square) At both ends, the lift-up suppresses the lateral offset of the substrate G. The 忒4 忒 忒 忒 , , , , , , , 忒 忒 忒 忒 忒 忒 忒 忒 忒 忒 忒 忒 忒 忒 忒 忒 忒 或 图 图 或 或 或 或 或 或 或 或 或 或As shown in Fig. 22 (e.g., 5~15.), the tilting posture of the front tilting table 80 is like a sliding ladder, and the lifting of the second plate J on the plane of the plane is due to gravity. Because of the same sorrow as the fifth embodiment, if the plate G is forcibly stopped at the desired position on the platform 8G ^, = shifting to form the mouth outlet 100 near the base position, so that the lifting is compressed ~ Figure 24 = In the stop and transport direction (X direction) minus - the overshoot oblique spray = Q from the thousand 8G top surface to Fig. 25 and Fig. 26 shows the floating wheel (10) constructed in the seventh embodiment, The outer side of the end belt (10) is attached with an adsorption pad at intervals of 1. = 1 η 200845276 The adsorption 塾 162 is pushed from the bottom up. The substrate G is sent to the platform 8 = ^ The adsorption pad 162 comes to the pressing member 17 T T t: 81^On the ignorant skin Y 160 from:,6 near the return, change i: into the square U from the square = board is not limited to LCD glass substrate, can also be potted liquid. < 7 ten "枓, wiring materials, etc. [Simple description of the diagram] The composition of the syllabic hairline is placed at the county level (4) (4) Processing system port ===== Figure 4 shows the substrate processing 2 in the embodiment; =: Section @又的—Amplified part of the structure = 2 shows the top view of the structure of the floating lift mechanism; Figure 9 shows the material 1 (10) Finance branch! !; ;:f ; Figure 1 FIG. 12 is a plan view showing the configuration of the ocean lift mechanism in the third embodiment. FIG. 13 is a view showing the side of the floating train mechanism in the third embodiment. Fig. I4 is a plan view showing a leaky shape of the fourth embodiment of the injection vehicle; Fig. 15 is a view showing a small concave case provided on the back of the floating carrier in the fourth embodiment. Fig. 16 is a view showing the configuration and the side of the fourth embodiment of the radiation lifting conveyor; Fig. 17 (A) and (B) are not shown as a configuration of the fourth embodiment. [Fig. 18 is a side view showing the action of the floating carrier of Fig. 17. Fig. 19 is a view showing the elevation of the floating conveying mechanism in the fifth embodiment. Figs. 20(A) and (8) show the sixth. The side view of the floating action in the embodiment; the W-ray re-winding, the figure-figure, the figure 21, the sixth embodiment, the floating-up wheeling mechanism, and the _ gamma rear view, Fig. 22 shows the seventh embodiment. FIG. 23 is a rear view showing the configuration of the floating conveying mechanism in the seventh embodiment; FIG. 24 is a view showing the configuration and the acting of the floating conveying mechanism in the seventh embodiment. Fig. 25 is a side view showing the configuration of the material feeding mechanism of the seventh embodiment. Fig. 25 is a side view showing the configuration of the floating conveying mechanism in the seventh embodiment. _ 19 200845276 [Description of main components] A, B ~ Processing line (line) C ~ 匣 box EE ~ peripheral exposure device G ~ substrate h ~ float amount. Η ~ water level
Lg〜基板G較低之一邊（下邊） > R〜光阻 f S1"_S14〜步驟 < TITLER〜印字曝光機 Q、QE〜壓縮空氣（高壓空氣） 0、α〜既定之角度 10〜塗布顯影處理系統（系統） 12〜曝光裝置 16〜處理站（P/S) 14〜匣盒站（C/S) 18〜介面站（I/F) 20〜匣盒平台（平台） / 22〜輸送機構 22a〜輸送臂 24〜送入單元（IN PASS) 26〜清洗處理部 28〜第1熱性處理部 30〜塗布處理部 32〜第2熱性處理部 34〜第1水平移動輸送道 36〜準分子UV照射單元（E —UV) 38〜擦磨清洗單元（SCR) 20 200845276 4.0〜附著單元（AD) 42〜冷卻單元（COL) 44〜光阻塗布單元（COT) 46〜減壓乾燥單元（VD) 48〜預烘烤單元（PRE — BAKE) 50〜冷卻單元（COL) 52〜傳遞單元（PASS) 54〜顯影單元（DEV) 56〜後烘烤單元（POST — BAKE) 58〜冷卻單元（COL) 60〜檢查單元（AP) 62〜送出單元（OUT —PASS) 64〜第2水平移動輸送道 66〜第3熱性處理部 68〜輔助輸送空間 70〜穿梭裝置 72〜輸送裝置 74〜旋轉平台（R/S) 76〜周邊裝置 80〜浮升平台（平台） 82、94〜均熱輻射板 84〜HMDS喷嘴 86〜氣體引導蓋 88〜排氣用吸入口 90、96〜冷卻氣體喷嘴 92〜光阻喷嘴 100〜喷出口 102〜壓縮空氣供給路 104、130〜抽吸口（浮升輸送用抽吸口） 21 200845276 106〜真空通路 110、138〜侧滚輪（導引滚輪） 112〜滾輪支持軸 114〜軸承 116〜傘齒輪 118〜共通驅動軸（驅動軸） 120〜馬達 122、146、164〜驅動帶輪 124〜正時皮帶 126、166〜從動帶輪 132、134〜滾動輸送道 136〜滚子 138a〜滾輪外周面 140、144〜旋轉軸 142、160〜無端皮帶 142a〜皮帶外周面 148、156〜浮升載具 150〜小凹孔 152〜溝槽 154〜銷 162〜吸附墊 168〜推壓銷 170〜推壓構件 22Lg ~ one side of the lower side of the substrate G (lower side) > R ~ photoresist f S1 " _S14 ~ step < TITLER ~ printing exposure machine Q, QE ~ compressed air (high pressure air) 0, α ~ a given angle 10 ~ coating Development processing system (system) 12~exposure device 16~processing station (P/S) 14~匣 box station (C/S) 18~interface station (I/F) 20~匣 box platform (platform) / 22~ conveying Mechanism 22a to transport arm 24 to feed unit (IN PASS) 26 to cleaning processing unit 28 to first heat treatment unit 30 to coating processing unit 32 to second heat treatment unit 34 to first horizontal moving transport path 36 to excimer UV irradiation unit (E - UV) 38 ~ scrub cleaning unit (SCR) 20 200845276 4.0 ~ attachment unit (AD) 42 ~ cooling unit (COL) 44 ~ photoresist coating unit (COT) 46 ~ decompression drying unit (VD 48~Pre-baking unit (PRE-BAKE) 50~Cooling unit (COL) 52~Transfer unit (PASS) 54~Developing unit (DEV) 56~Post-bake unit (POST-BAKE) 58~Cooling unit (COL) 60 to check unit (AP) 62 to send unit (OUT - PASS) 64 to 2nd horizontal moving transport path 66 to 3rd thermal processing 68 to auxiliary conveying space 70 to shuttle device 72 to conveying device 74 to rotating platform (R/S) 76 to peripheral device 80 to floating platform (platform) 82, 94 to soaking radiation plate 84 to HMDS nozzle 86 to gas guiding Cover 88 to exhaust suction ports 90, 96 to cooling gas nozzle 92 to photoresist nozzle 100 to discharge port 102 to compressed air supply path 104, 130 to suction port (slowing suction port) 21 200845276 106~ Vacuum passages 110, 138 to side rollers (guide rollers) 112 to roller support shaft 114 to bearing 116 to bevel gear 118 to common drive shaft (drive shaft) 120 to motor 122, 146, 164 to drive pulley 124 to timing Belts 126, 166 - driven pulleys 132, 134 - rolling conveyor 136 - rollers 138a - roller outer peripheral surfaces 140, 144 - rotating shafts 142, 160 - endless belts 142a - belt outer peripheral surfaces 148, 156 ~ floating carriers 150 to small recessed hole 152 to groove 154 to pin 162 to suction pad 168 to push pin 170 to pressing member 22