CN100594584C - Substrate processing device - Google Patents

Substrate processing device Download PDF

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Publication number
CN100594584C
CN100594584C CN 200710160567 CN200710160567A CN100594584C CN 100594584 C CN100594584 C CN 100594584C CN 200710160567 CN200710160567 CN 200710160567 CN 200710160567 A CN200710160567 A CN 200710160567A CN 100594584 C CN100594584 C CN 100594584C
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China
Prior art keywords
substrate
floating
direction
stage
side
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CN 200710160567
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Chinese (zh)
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CN101211756A (en
Inventor
大塚庆崇
太田义治
山崎刚
池田文彦
稻益寿史
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东京毅力科创株式会社
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Priority to JP2006-351688 priority Critical
Priority to JP2006351688A priority patent/JP4753313B2/en
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Publication of CN101211756A publication Critical patent/CN101211756A/en
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Publication of CN100594584C publication Critical patent/CN100594584C/en

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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274Photolithographic processes
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • G03F7/2041Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Exposure apparatus for microlithography
    • G03F7/70691Handling of masks or wafers
    • G03F7/70716Stages
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames

Abstract

The present invention provides a floatable conveying type substrate handling device. Looking in conveying direction (X direction), setting a plurality of rollers or profile rollers (110) with certaindistance in a line along conveying direction on two sides of a platform (80). On the platform (80), the basal plate (G) floats in the air using the pressure of gas obtained from the just subjacent ejecting mouth (100) on the platform, and the two ends of the two sides are loaded on the top of the profile roller (110). By means of the rotation motion of the profile roller (110), the basal plate (G)floated on the platform (80) is tossing to convey on the profile rollers (110) and moves towards conveying direction (X direction) in advection mode.

Description

基板处理装置 The substrate processing apparatus

技术领域 FIELD

本发明涉及使矩形的被处理基板在台上浮起并在沿水平方向搬送的同时在基板上实施规定的处理的浮起搬送式的基板处理装置,特别是涉及实现搬送机构的简易化、低成本化的基板处理装置。 A rectangular substrate to be processed according to the present invention relates to a floating stage and conveyed in the horizontal direction while the embodiment specified on the substrate floating transfer process feed type substrate processing apparatus, particularly to achieve transport mechanism simple and cost of the substrate processing apparatus.

背景技术 Background technique

近年来,在用于平板显示器(FPD)制造的光刻技术领域中,在被处理基板(玻璃基板等)上涂敷抗蚀剂的抗蚀剂涂敷装置釆用浮起搬送式的方式。 In recent years, in the technical field for a flat panel display (FPD) manufacturing lithography, resist coating apparatus applying a resist on a substrate to be processed (glass substrate) preclude the use of floating conveyance-wise manner.

采用浮起搬送式的方式的现有的抗蚀剂涂敷装置,例如专利文献1 所公开的那样,通过利用气体的压力使矩形的被处理基板(例如玻璃基板)浮起的浮起式台来形成浮起搬送通路,同时作为用于使在台上 Conventional resist coating apparatus employed floating conveyance-wise manner, for example, disclosed in Patent Document 1 above, by utilizing the pressure of the gas so that a rectangular substrate to be processed (e.g., glass substrate) stage float floating formula forming a floating transfer path, while as for the stage

浮起的基板以平流的方式移动的搬送装置,包括:配置在台的左右两侧的一对导轨;沿着这些导轨平行地直进移动的配置在左右两侧的一对滑动件;在基板的左右两边部以一定的间隔可装卸地进行吸附的左右一列的真空式吸附垫;和将这些左右一列真空式吸附垫分别连接在左右的滑动件上,并且追随基板的浮起高度而上下变位的板簧等的连接部件。 The substrate in a floating manner advection moving conveying device, comprising: a table arranged in the left and right sides of the pair of guide rails; moves straight along the rails disposed parallel to the pair of right and left sides of the slide member; substrate the left and right portions at predetermined intervals is detachably for about vacuum adsorption pad adsorbed in a row; and the left and right a vacuum adsorption pads are connected to the left and right sliders, and follow the flying height of the substrate and a vertical displacement bit leaf spring connecting member.

现有的浮起搬送式基板处理装置,由于搬送机构需要如上所述的导轨、滑动件、真空式吸附垫等,所以规模大、装置成本高。 Conventional floating type transfer substrate processing apparatus, since the conveyance guide mechanism, a slider, a vacuum adsorption pad needs described above and the like, so that large scale, high apparatus cost. 特别是在光刻中,在涂敷工序、曝光工序和显影工序的前后或间歇中,在作为辅助工序而进行热处理的烘烤装置等上,希望有简单低成本的浮起搬送机构。 Particularly in lithography, or intermittently before or after coating step, exposure step and developing step, in the baking step as an auxiliary device or the like and heat treatment, it is desirable low cost simple floating transfer mechanism.

专利文献1:日本专利特开平2005-244155 发明内容 Patent Document 1: Japanese Patent Laid-Open 2005-244155 DISCLOSURE OF THE INVENTION

本发明是鉴于上述现有技术的问题而完成的,其目的在于提供一种以简单、低成本的结构进行浮起搬送式的基板处理的基板处理装置。 The present invention is made in view of the above-described problems of the prior art and has as its object to provide a simple, low-cost structure to float conveying a substrate processing type substrate processing apparatus. 为了达到上述目的,本发明的第一基板处理装置是,在沿大致水平的规定的搬送方向延伸的台上,通过气体压力使矩形的被处理基板浮起并沿上述搬送方向搬送,同时在沿着上述台配置的处理部向上述基板供给规定的液体、气体、光或热而实施规定的处理的浮起搬送式的基板处理装置,以将浮起在上述台上的上述基板的两侧端部搁在滚轮外周面的顶部的方式在上述台的两侧以规定的间距将多个侧面滚轮配置成一列,并且旋转驱动上述侧面滚轮进行上述基板的搬送。 To achieve the above object, a first substrate processing apparatus according to the present invention, in the stage conveyance direction extending along a predetermined substantially horizontal, by the gas pressure of the rectangular substrate to be processed to float and along the transport direction of the transport, while the direction a liquid, gas, light or heat a predetermined portion of the processing table arranged to supply the substrate to perform predetermined processing floating transport feed type substrate processing apparatus, to both ends of the substrate in the above table will float spacing portion rests on top of the embodiment of the roller outer peripheral surface of both sides of the table to a predetermined plurality of rollers arranged in a row side, and the rotary drive wheel to the side of the substrate is conveyed.

在上述的结构中,通过侧面滚轮的旋转驱动,浮起在台上的基板在侧面滚轮上辗转传送并以沿搬送方向平流的方式移动。 In the above-described moving configuration, by rotating the driving roller side, floating in the substrate stage was removed and the transfer roller on the side along the conveyance direction advection manner. 优选为,在台的上面的与侧面滚轮接近的端部设置吸入周围的气体的吸入口,通过吸入口提供朝向基板下侧的吸引力,使基板和侧面滚轮之间的摩擦力增高。 Preferably, the side surface of the roller near the end portion of the upper table is provided around a suction gas inlet port, to provide an attractive lower toward the substrate side through the suction port, the frictional force between the substrate and the side surface of the roller increases. 另外,为了防滑,也可以利用橡胶形成侧面滚轮的外周面。 Further, in order to slip, it may be formed in the outer circumferential surface of the rubber roller side.

本发明的第二基板处理装置是,在沿大致水平的规定的搬送方向延伸的台上,通过气体压力使矩形的被处理基板浮起并沿上述搬送方向搬送,同时在沿着上述台配置的处理部向上述基板供给规定的液体、 气体、光或热实施规定的处理的浮起搬送式的基板处理装置,在上述台上使上述基板在与上述搬送方向正交的方向以相对水平面倾斜规定角度的姿势浮起,以浮起在上述台上的上述基板的低边的边缘与靠近上述台的滚轮外周面加压接触的方式在上述浮起台的一侧以规定的间距将多个侧面滚轮配置成一列,旋转驱动上述侧面滚轮进行上述基板的搬送。 A second substrate processing apparatus according to the present invention, in the stage conveyance direction extending along a predetermined substantially horizontal, rectangular shape by gas pressure to float and the substrate to be processed along the conveying direction of the conveyance while arranged along the table the substrate processing apparatus of the floating type transfer processing liquid, gas, heat or light to the predetermined substrate processing unit supplying a predetermined embodiment, in the table so that the substrate in a direction orthogonal to the transport direction in a horizontal plane relative to a predetermined floating posture angle, to float in the plurality of low-side edge of the side space of the substrate table and the above-described embodiment the roller table near an outer peripheral surface in pressure contact with one side of the floating platform at a predetermined rollers arranged in a row, the rotational driving wheel to the side of the substrate transport.

在上述的结构中,通过侧面滚轮的旋转运动,在台上以倾斜的姿势浮起的基板以其下边辗转通过侧面滚轮同时沿搬送方向平流移动。 In the above configuration, the side rollers by the rotational movement of the stage in an inclined posture with its floating substrate was removed through a side lower rollers while moving in the conveying direction advection.

本发明的第三基板处理装置是,在沿大致水平的规定的搬送方向延伸的台上,通过气体压力使矩形的被处理基板浮起并沿上述搬送方向搬送,同时在沿着上述台配置的处理部向上述基板供给规定的液体、 气体、光或热实施规定的处理的浮起搬送式的基板处理装置,在上述台上使上述基板在与上述搬送方向正交的方向以相对水平面倾斜规定角度的姿势浮起,以浮起在上述台上的上述基板的底边与靠近上述台的带外周面加压接触的方式在上述台的一侧设置向上述搬送方向延伸的无端带,驱动上述无端带进行上述基板的搬送。 The third substrate processing apparatus according to the present invention, in the stage conveyance direction extending along a predetermined substantially horizontal, rectangular shape by gas pressure to float and the substrate to be processed along the conveying direction of the conveyance while arranged along the table the substrate processing apparatus of the floating type transfer processing liquid, gas, heat or light to the predetermined substrate processing unit supplying a predetermined embodiment, in the table so that the substrate in a direction orthogonal to the transport direction in a horizontal plane relative to a predetermined floating posture angle, the endless belt embodiment floated in the bottom of the substrate table and an outer circumferential surface of the tape closer to the contact pressure table extending in the transport direction is provided in one side of the table, driving the an endless belt for conveying the substrate.

5台进行直进运动,以倾斜的姿势浮起在台上的基板以其下边搭载在无端带上向搬送方向平流移动。 5 station performs linear motion, to an inclined posture in a floating substrate table is mounted with its lower side in the endless belt moving in the conveyor direction advection.

本发明的第四基板处理装置是,在沿大致水平的规定的搬送方向延伸的台上,通过气体压力使矩形的被处理基板浮起并沿上述搬送方向搬送,同时在沿着上述台配置的处理部向上述基板供给规定的液体、 气体、光或热实施规定的处理的浮起搬送式的基板处理装置,其中, 以与浮起在上述台上的上述基板的后端的边接触的方式使板状的第一浮起载体浮起至与上述基板大致相同的浮起高度,利用上述第一浮起载体从后面推压上述基板,进行上述基板的搬送。 Fourth substrate processing apparatus according to the present invention, in the stage conveyance direction extending along a predetermined substantially horizontal, rectangular shape by gas pressure to float and the substrate to be processed along the conveying direction of the conveyance while arranged along the table floating transport process feed type substrate processing apparatus in which, in a rear end side of the substrate and float in the above manner contacting stage liquid, gas, light, or heat processing unit to the predetermined substrate so that a predetermined supply embodiment a plate-shaped first float floating support and the substrate to substantially the same flying height, by the first floating support is pressed from the rear of the substrate, for transporting the substrate.

在上述的结构中,浮起搬送的驱动力直接达到第一浮起载体,通过第一浮起载体间接达到基板。 In the above configuration, the float conveying a first drive force directly to the floating carrier, floating indirectly reach the substrate through the first carrier. 根据优选的一方式,在第一浮起载体的下面形成凹坑状或槽状的凹部,使浮起用的气体从台的上面向着搬送方向朝向斜上方喷射。 According to a preferred embodiment, formation of pits or a groove-like concave portions below the first floating carrier, floating with gas injected from the upper stage toward the conveying direction obliquely upward. 另外,根据另一优选方式,以与浮起在上述台上的基板的前端的边接触的方式使板状的第二浮起载体浮起至与基板大致相同的浮起高度,将第二浮起载体停留于设定位置,停止基板的搬送。 Further, according to another preferred embodiment, in a floating manner with the contact side in the above table the leading end of the plate-like substrate, lifting the second carrier to float the substrate substantially the same flying height and the second floating since the carrier residence in the set position, stopping conveyance of the substrate.

根据本发明的基板处理装置,通过如上所述的结构和作用,能够以简易、低成本的结构实现浮起搬送式的基板处理。 The substrate processing apparatus according to the present invention, the structure and operation as described above, can be a simple, low-cost structure to achieve the transport of Formula floating substrate processing.

附图说明 BRIEF DESCRIPTION

图1为表示可适用于本发明的基板处理装置的涂敷显影处理系统的结构的平面图。 1 is a plan view showing the structure applicable to the coating and developing treatment system of the substrate processing apparatus according to the present invention.

图2为表示上述涂敷显影处理系统的处理顺序的流程图。 FIG 2 is a flowchart showing the processing procedure of the above-described coating and developing processing system.

图3为表示实施方式中的基板处理装置的一例的大致侧面图。 FIG. 3 shows a schematic side view showing an example of the substrate processing apparatus of the embodiment.

图4为表示实施方式中的基板处理装置的一例的大致侧面图。 FIG 4 shows a schematic side view showing an example of the substrate processing apparatus of the embodiment. 图5为表示实施方式中的基板处理装置的一例的大致侧面图。 FIG. 5 shows a schematic side view showing an example of the substrate processing apparatus of the embodiment. 图6为表示实施方式中的浮起台的主要部分的结构的放大部分截面图。 6 is an enlarged partial sectional view showing a configuration of a main portion of the embodiment of floating platform.

图7为表示实施方式中的浮起台的主要部分的其它的结构的放大部分截面图。 7 is a further enlarged partial sectional view of a configuration of a main part of the embodiment of the floating table.

图8为表示第一实施例中的浮起搬送机构的结构的平面图。 8 is a plan view showing a first embodiment of the floating structure of the transfer mechanism. 图9为表示第一实施例中的浮起搬送机构的结构的侧面图。 FIG 9 is a diagram showing a first embodiment of the floating structure of the conveying means side view.

图IO为表示第二实施例中的浮起搬送机构的结构的平面图。 FIG IO is a plan view of a second embodiment of the floating structure of the transfer mechanism.

图11为表示第二实施例中的浮起搬送机构的结构的侧面图。 FIG 11 is a diagram showing a second embodiment of the floating structure of the conveying means side view.

图12为表示第三实施例中的浮起搬送机构的结构的平面图。 FIG 12 is a plan view of a third embodiment of the floating structure of the transfer mechanism. 图13为表示第三实施例中的浮起搬送机构的结构的侧面图。 13 is a third embodiment of the floating structure of the conveying means side view. 图14为表示第四实施例中的浮起搬送机构的结构的平面图。 FIG 14 is a plan view of the floating structure of the transfer mechanism of the fourth embodiment. 图15为表示在第四实施例中设置在浮起载体的背面的凹处的配列图案示例的仰视图。 FIG 15 is a bottom view showing the pattern disposed in a recess of an example of the back surface of the carrier floating arranging in the fourth embodiment.

图16为表示第四实施例中的浮起搬送机构的结构和作用的侧面图。 Example 16 is a floating structure and function of the transport mechanism to send a side view of a fourth embodiment.

图17为表示作为第四实施例的一个变形例在浮起载体的背面设置 FIG 17 is a diagram showing a fourth embodiment of the back support is provided a float Example modification

槽的结构的仰视图。 A bottom view of a configuration of grooves.

图18为表示图17的浮起载体的作用的侧面图。 FIG 18 is a side view of the lifting action of the support 17 of FIG.

图19为表示第五实施例中的浮起搬送机构的结构的平面图。 FIG 19 is a plan view of a fifth embodiment of the floating structure of the transfer mechanism.

图20为表示第六实施例中的浮起搬送机构的结构和一个作用的侧面图。 FIG 20 is a sixth embodiment of a floating structure and the role of the transport mechanism to send a side view.

图21为表示第六实施例中的浮起搬送机构的结构和一个作用的背面图。 FIG 21 is a rear view of a sixth embodiment of a floating structure and the role of the transport feeding mechanism.

图22为表示第七实施例中的浮起搬送机构的结构和一个作用的侧面图。 FIG 22 is a seventh embodiment of a floating structure and the role of the transport mechanism to send a side view.

图23为表示第七实施例中的浮起搬送机构的结构和一个作用的背面图。 FIG 23 is a rear view of the seventh embodiment of the floating structure and a role of transmitting the transport mechanism.

图24为表示第七实施例中的浮起搬送机构的结构和一个作用的侧面图。 FIG 24 is a seventh embodiment of a floating structure and the role of the transport mechanism to send a side view.

图25为表示第七实施例中的浮起搬送机构的结构的平面图。 FIG 25 is a plan view of a seventh embodiment of the floating structure of the transfer mechanism. 图26为表示第七实施例中的浮起搬送机构的结构的侧面图。 Example 26 is a transport mechanism of the floating structure of the side view of the seventh embodiment.

符号说明 Symbol Description

10涂敷显影处理系统28第一热处理部30涂敷处理部32第二热处理部 10 coating and developing treatment system 28 the coating process the first heat treatment section 30 section 32 section a second heat treatment

44抗蚀剂涂敷单元(COT) 80台 44 the resist coating unit (COT) 80 units

82均热放射板 Heat radiation plates 82 are

84 HMDS喷嘴 84 HMDS nozzle

90冷却气体喷嘴 90 the cooling gas nozzle

92抗蚀剂喷嘴 The resist nozzle 92

94均热放射板 Heat radiation plates 94 are

96冷却气体喷嘴 96 the cooling gas nozzle

100喷出口 100 discharge port

104吸引口 Suction port 104

110侧面滚轮 Side roller 110

130浮起搬送用吸引口 130 floating conveyance suction opening

132、 134滚动搬送通路 132, 134 rolling transfer path

138侧面滚轮 Side roller 138

140旋转轴 The rotating shaft 140

142无端带 Endless belt 142

148浮起载体 148 floating carrier

150凹处 150 recess

154销 154 pin

156浮起载体160无端带162吸附垫 156 floating carrier endless belt 162 suction pads 160

具体实施方式 Detailed ways

以下,参照附图对本发明的优选实施方式进行说明。 Hereinafter, with reference to the drawings, preferred embodiments of the present invention will be described. 图1表示作为能够适用本发明的基板处理装置的一个结构例的涂敷显影处理系统。 FIG 1 shows a configuration example of a substrate processing apparatus can be applied to the present invention, the coating and developing treatment system. 该涂敷显影处理系统10被设置在洁净室内,例如以矩形的玻璃基板为被处理基板,在LCD制造过程中进行光刻工序中的清洗、抗蚀剂涂敷、预烘烤、显影和后烘烤等一系列处理。 The coating and developing treatment system 10 is disposed in a clean room, for example, a rectangular glass substrate in a substrate to be processed, washing photolithography process, the resist coating, pre-baking, development and post in the LCD manufacturing process and a series of baking process. 在与该系统邻接设置的外部曝光装置12中进行曝光处理。 Exposure processing in the external exposure means disposed adjacent to the system 12.

8该涂敷显影处理系统10在中心部配置有横宽的处理站(processstation: P/S) 16,在其长边方向(X方向)两端部配置有盒站(cassettestation: C/S) 14和接口站(interface station: I/F) 18。 8 The coating and developing treatment system 10 is configured with a processing station at the central portion of the horizontal width of (processstation: P / S) 16, in which the longitudinal direction (X-direction) is disposed both end portions cassette station (cassettestation: C / S) and an interface station 14 (interface station: I / F) 18.

盒站(C/S) 14为系统10的盒搬入搬出端口,其包括:盒台20,该盒台20能够在水平方向(Y方向)上并排载置4个盒C,其中该盒C能够以多层层叠的方式收容多块基板G;和搬送机构22,其用于对该盒台20上的盒C进行基板G的搬入搬出。 Cassette station (C / S) 14 of the cartridge system 10, transfer port, comprising: a cassette table 20, the cassette station 20 can be arranged side by side mounting four cassettes C in the horizontal direction (Y direction), wherein the cartridge C can accommodated in a multi-layered substrate, a plurality of G; and a transfer mechanism 22, which is used for carrying the substrate G is unloaded cassette C on the cassette stage 20. 搬送机构22具有能够以一块为单位来保持基板G的搬送臂22a,并且能够在X、 Y、 Z、 0的4个轴上进行动作,能够与相邻的处理站(P/S) 16侧进行基板G的交接。 The transport mechanism 22 capable in a units holding the substrate G transfer arm 22a, and can operate at X, Y, Z, 4 projected axes 0, it is possible (P / S) 16 side and the adjacent processing stations transferring the substrates G is.

按照处理流程或工序的顺序,处理站(P/S) 16将各处理部配置在沿水平的系统长边方向(X方向)延伸的相互平行并且逆向的一对线路A、 B上。 Or in the order of process flow step, a processing station (P / S) 16 to the respective processing portions arranged parallel to each other in the longitudinal direction along the horizontal system (X-direction) and a pair of reverse line A, the B.

更详细而言,沿着第一平流搬送通路34,从上游侧开始,在从盒站(C/S) 14侧朝向接口站(I/F) 18侧的上游部的处理线路A上,将搬入单元(IN PASS) 24、清洗处理部26、第一热处理部28、涂敷处理部30和第二热处理部32依次配置成一列。 More specifically, a first stratospheric along transfer path 34, from the upstream side, on the side facing the interface station 14 (I / F) from a cassette station (C / S) A processing line upstream portion 18 side of the carrying unit (IN PASS) 24, cleaning unit 26, the first heat treatment section 28, coating section 30 and the second heat treatment processing portion 32 sequentially arranged in a line.

更详细而言,搬入单元(INPASS) 24以从盒站(C/S) 14的搬送机构22接收未处理的基板G,然后按规定的生产节拍(tact)将基板G投入到第一平流搬送通路34上的方式构成。 More specifically, the loading unit (INPASS) 24 transferred from the cassette to the station (C / S) 14 of the feeding mechanism receives an unprocessed substrate G 22, and then press a predetermined tact (TACT) substrate G is conveyed into the first stratospheric the passage 34 constituting the embodiment. 清洗处理部26沿着第一平流搬送通路34从上游侧开始依次设置有准分子UV照射单元(E-UV)36和洗刷清洗单元(SCR) 38。 A first cleaning unit 26 along the transfer path 34 advection from the upstream side, is provided with an excimer UV irradiation unit (E-UV) 36 and a scrubbing cleaning units (SCR) 38. 第一热处理部28从上游开始侧依次设置有粘附单元(AD) 40和冷却单元(COL) 42。 The first heat treatment section 28 is provided sequentially starting from the upstream side with an adhesive means (AD) 40 and a cooling unit (COL) 42. 涂敷处理部30从上游侧开始依次设置有抗蚀剂涂敷单元(COT) 44和减压干燥单元(VD)46。 Coating process section from the upstream side, is provided with a resist coating unit (COT) 44 and a vacuum drying unit (VD) 46 30. 第二热处理部32从上游侧开始依次设置有预烘烤单元(PRE-BAKE) 48和冷却单元(COL) 50。 The second portion 32 is provided with heat prebaking unit (PRE-BAKE) 48 and a cooling unit (COL) 50 sequentially from the upstream side. 在位于第二热处理部32的下游侧附近的第一平流搬送通路34的终点处设置有传递单元(PASS)52。 In the vicinity of the first advection downstream side of the second portion 32 of the heat transfer path 34 is provided at the end with a transmission unit (PASS) 52. 将在第一平流搬送通路34上以平流的方式搬送的基板G,从该终点的传递单元(PASS) 52交付给接口站(I/F) 18。 The upper conveying passage 34 in a manner advection conveying a first substrate G in the stratosphere, from the delivery end of the transfer unit (PASS) 52 to the interface station (I / F) 18.

另一方面,在从接口站(I/F) 18朝向盒站(C/S) 14的下游部的处理线路B上,沿着第二平流搬送通路64,从上游侧开始,将显影单元(DEV) 54、后烘烤单元(POST-BAKE) 56、冷却单元(COL) 58、检查单元(AP) 60和搬出单元(OUT-PASS) 62依次配置成一列。 On the other hand, at the station from the interface (I / F) 18 toward the cassette station (C / S) B downstream processing circuitry portion 14, along a second transfer path 64 advection, from the upstream side, the developing unit ( DEV) 54, post-baking units (pOST-bAKE) 56, a cooling unit (COL) 58, an inspection unit (AP) 60 and unloading unit (OUT-PASS) 62 are sequentially arranged in a line. 在此,后烘烤单元(POST-BAKE) 56和冷却单元(COL) 58构成第三热处理部66。 Here, the baking unit (POST-BAKE) 56 and a cooling unit (COL) 58 constituting the third heat treatment unit 66. 搬出单元(OUT-PASS) 62以逐个接收来自第二平流搬送通路64上的完成处理的基板G,并将其交付给盒站(C/S) 14的搬送机构22的方式构成。 Unloading unit (OUT-PASS) 62 to receive a second smoothing conveyed individually conveying path G processing is completed on the substrate 64, and deliver it to cassette station (C / S) 14 of the feeding mechanism 22 configured manner.

在两处理线路A、 B之间设置有辅助搬送空间68,能够将基板G以一块为单位水平地载置往复移动装置(shuttle) 70能够通过未图示的驱动机构沿处理线路方向(X方向)双方向移动。 Between the two processing lines A, B is provided with an auxiliary conveying space 68, the substrate G can be in a unit of 70 can be placed horizontally (X-direction reciprocating device (Shuttle) along the processing line direction drive mechanism (not shown) ) to move in both directions.

接口站(I/F) 18具有搬送装置72,该搬送装置72用于与上述第一和第二平流搬送通路34、 64,以及邻接的曝光装置12之间进行基板G的交换,在该搬送装置72的周围配置有旋转台(R/S) 74和周边装置76。 Interface station (I / F) 18 having a transfer apparatus 72, the conveying means 72 for the above-described first and second advection transfer path 34, to exchange the substrate G between the 64 and the adjacent exposure device 12, the transport means 72 is disposed around the turntable (R / S) 74 and the peripheral device 76. 旋转台(R/S) 74是用于使基板G在水平面内旋转的台,用于在与曝光装置12进行交接时变换长方形的基板G的方向。 The turntable (R / S) 74 for rotating the substrate G in a horizontal plane table, for converting the direction of the rectangular substrate G at the time of the exposure device 12 to interface with. 将周边装置76例如标记器(titler)、周边曝光装置(EE)等连接在第二平流搬送通路64上。 The peripheral device 76, for example, marker (titler), edge exposure apparatus (EE) and the like connected to the second transfer path 64 stratosphere.

图2表示该涂敷显影处理系统中的一个基板G的整个工序的处理过程。 Figure 2 shows a processing step the entire substrate on which the coating and developing processing system of G. 首先,在盒站(C/S) 14中,搬送机构22从台20上的任一个盒C中取出一个基板G,并将该取出的基板G搬入到处理站(P/S) 16的处理线路A侧的搬入单元(INPASS) 24 (步骤S1)。 First, in the cassette station (C / S) 14, the transport mechanism 22 from any of the 20 a cassette C out a substrate G, and moved into the withdrawn substrate G to the processing station (P / S) treated 16 a side of the line carrying means (iNPASS) 24 (step S1). 将来自搬入单元(INPASS) 24的基板G移载或投入到第一平流搬送通路34上。 From the loading unit (inpass) transferring the substrate G 24 or into the first conveying passage 34 the stratosphere.

最初,在清洗处理部26中,通过准分子UV照射单元(E-UV) 36和洗刷清洗单元(SCR) 38,对投入到第一平流搬送通路34上的基板G依次实施紫外线清洗处理和洗刷(Scrubbing)清洗处理(步骤S2、S3)。 Initially, and in turn to ultraviolet cleaning process in the washing process in the washing unit 26 by excimer UV irradiation unit (E-UV) 36 and a scrubbing cleaning units (SCR) 38, to transfer into the first smoothing path 34 on substrate G (The Scrubbing) cleaning process (step S2, S3). 洗刷清洗单元(SCR) 38通过对在第一平流搬送通路34上水平移动的基板G实施擦刷(brushing)清洗和吹风(blow)处理除去基板表面的颗粒状污垢,其后,实施漂洗(rinse)处理,最后,利用气刀(air knife)使基板G干燥。 Scrub washing unit (SCR) 38 through the first transfer path 34 stratospheric level of the substrate G moves embodiment brushing (brushing) and hair cleaning (Blow) treated to remove particulate contaminants on the substrate surface, and thereafter, rinsing embodiment (Rinse ), and finally, an air knife (air knife) drying the substrate G. 若洗刷清洗单元(SCR) 38的一系列清洗处理完成,基板G就保持原样沿着第一平流搬送通路34通过第一热处理部28。 If the scrub washing unit (SCR) 38 of a series of cleaning process is completed, the substrate G remains intact along the first transfer path 34 by the first heat treatment section 28 stratosphere.

在第一热处理部28中,最初在粘附单元(AD: adhesion unit) 40中使用蒸气状HMDS对基板G实施粘附处理,使被处理面疏水化(步 In the first heat treatment section 28, the first adhesion unit (AD: adhesion unit) 40 HMDS using vaporous embodiment G substrate adhesion treatment, hydrophobic surface to be treated (step

10骤S4)。 10 step S4). 在该粘附处理完成之后,在冷却单元(COL) 42中将基板G冷却至规定的基板温度(步骤S5)。 After the adhesion process is completed, the cooling unit (COL) 42 in the substrate G is cooled to a predetermined substrate temperature (step S5). 此后,沿着第一平流搬送通路34,将基板G搬入到涂敷处理部30。 Thereafter, a first stratospheric along transfer path 34, the substrate G is loaded to the application processing section 30.

在涂敷处理部30中,使基板G保持平流状态,最初在抗蚀剂涂敷单元(COT) 44中通过使用狭缝喷嘴的非旋转(spinless)法在基板上面(被处理面)涂敷抗蚀剂液,之后在下游侧邻接的减压干燥单元(VD)46中接受通过减压进行的常温干燥处理(步骤S6)。 In the coating process portion 30, the substrate G advection holding state, the first resist coating unit (COT) 44 by using the non-rotating slit nozzle (Spinless) method above the substrate (surface to be treated) coating resist liquid, adjacent to the downstream side after vacuum drying unit (VD) 46 accepts reduced pressure at room temperature by a drying process (step S6).

从涂敷处理部30出来的基板G,沿着第一平流搬送通路34通过第二热处理部32。 G 30 from the substrate out of the coating process section, along a first transfer path 34 through the smoothing heat treatment of the second portion 32. 在第二热处理部32中,基板G在预烘烤单元(PRE-BAKE) 48中受到作为抗蚀剂涂敷后的热处理或曝光前的热处理的预烘烤(步骤S7)。 In the second heat treatment section 32, in the substrate G by prebaking units (PRE-BAKE) 48 as a heat treatment after the heat treatment or the resist coating prebaking (step S7) before the exposure. 通过该预烘烤,蒸发除去残留在基板G上的抗蚀剂膜中的溶剂,增强抗蚀剂膜对于基板的粘合性。 By the prebaking, the resist film is removed by evaporation remaining on the substrate G in the solvent, the resist film for enhancing adhesion to a substrate. 接着,在冷却单元(COL) 50中将基板G冷却至规定的基板温度(步骤S8)。 Next, the substrate temperature (step S8) is cooled in the cooling unit to a predetermined substrate G (COL) 50 will be. 然后,将基板G从第一平流搬送通路34的终点的传递单元(PASS) 52引领至接口站U/F) 18的搬送装置72。 Then, the substrate G from the first stratospheric transfer path 34 of the end transmission unit (PASS) 52 leading to the interface station U / F) 18, the transport device 72.

在接口站(I/F) i8中,基板G在旋转台74上接受例如90度的方向变换,之后,被搬入到周边装置76的周边曝光装置(EE)中,在此处接受用于在显影时除去附着在基板G的周边部上的抗蚀剂的曝光之后,被送向相邻的曝光装置12 (步骤S9)。 Station interface (I / F) i8, the receiving substrate G on the rotating table 74, for example, 90 degrees of conversion, after being loaded into the edge exposure apparatus (EE) of the peripheral device 76, here for receiving after exposure resist is removed attached to the peripheral portion of the substrate G when the developing, sent to an adjacent exposure device 12 (step S9).

在曝光装置12中,在基板G上的抗蚀剂上进行规定的电路图案的曝光。 On a predetermined exposure 12, the resist is exposed on the substrate G means a circuit pattern. 然后,对于完成图案曝光的基板G,若使其从曝光装置12返回到接口站(I/F) 18 (步骤S9),则首先将其搬入到周边装置76的标记(TITLER)器,在此处将规定的信息记录在基板上的规定部位(步骤S10)。 Then, for completion of the pattern exposure of the substrate G, when it returns from the exposure device 12 to the interface station (I / F) 18 (step S9), it is first loaded into the marker peripheral device 76 (Titler) is, in this the predetermined information recording portion on the substrate at a predetermined (step S10). 然后,通过搬送装置72将基板G搬入到被敷设在处理站(P/S)16的处理线路B侧的第二平流搬送通路64上的显影单元(DEV) 54的起点处。 Then, by the transfer device 72 to carry the substrate G is laid in the processing station (P / S) of the second smoothing processing line B side of the transfer path 16 on the developing unit 64 at the start (DEV) 54 in.

这样,这次沿第二平流搬送通路64向处理线路B的下游侧搬送基板G。 Thus, along the second transfer path 64 stratospheric substrate G. conveyed to the downstream side of the processing line B 最初在显影单元(DEV) 54中,在平流搬送基板G的期间对其实施显影、漂洗、干燥等一系列显影处理(步骤Sll)。 During the first embodiment thereof in the developing unit (DEV) 54, the substrate is transferred in the stratosphere G developing, rinsing, and drying a series of development processing (step Sll).

在显影单元(DEV) 54中完成一系列显影处理的基板G保持原封不动地被放置在第二平流搬送通路64上的状态,依次通过第三热处理 Complete a series of development processing in the developing unit 54 (DEV) remains intact substrate G is placed on the second transfer path state stratosphere 64, passes through the third heat treatment

ii部66和检查单元(AP) 60。 ii portion 66 and the inspection unit (AP) 60. 在第三热处理部66中,基板G最初在后烘烤单元(POST-BAKE) 56中接受作为显影处理后的热处理的后烘烤处理(步骤S12)。 In the third heat treatment section 66, the first substrate G after baking unit (POST-BAKE) accepted as a heat treatment after the development treatment after the baking process (step S12) 56. 通过该后烘烤处理,蒸发除去残留在基板G上的抗蚀剂膜中的显影液和清洗液,增强抗蚀剂图案相对基板的粘合性。 By this post-baking treatment, the resist film is removed by evaporation remaining on the substrate G in the developing solution and washing liquid to enhance adhesion of the resist pattern relative to the substrate. 然后,在冷却单元(COL) 58中将基板G冷却至规定的基板温度(步骤S13)。 Then, in the cooling unit (COL) 58 in the substrate, the substrate G is cooled to a predetermined temperature (step S13). 在检査单元(AP) 60中,对基板G上的抗蚀剂图案进行非接触的线宽度检查和膜质、膜厚检查等(步骤S14)。 Check the line width and the film quality, the film thickness of the inspection the inspection unit (AP) 60, a resist pattern on the substrate G in a non-contact, and the like (step S14).

搬出单元(OUT-PASS) 62从第二平流搬送通路64接收己完成全部工序的处理的基板G,并将其转移到盒站(C/S) 14的搬送机构22。 Unloading unit (OUT-PASS) 62 from the second transfer path 64 receives the stratosphere has completed all the processing steps of the substrate G, and transferred to a cassette station (C / S) of the transport mechanism 2214. 在盒站(C/S) 14侧,搬送机构22将从搬出单元(OUT-PASS) 62接收的完成处理的基板G收容在任意一个(通常为原来的盒)盒C中(步骤S1)。 In the side of the cartridge station (C / S) 14, transfer mechanism 22 from the unloading 62 receiving unit (OUT-PASS) substrate G completion processing housed in any one of (usually the original cartridge) cassette C (step S1).

在该涂敷显影处理系统10中,能够将浮起式的搬送通路适用到第一和第二平流搬送通路34、 64的一部分或全部中。 In the coating and developing treatment system 10, it is possible to float the formula applied to the transfer path of the first and second transfer path 34 advection, part or all of 64.

图3表示在第一平流搬送通路34上在通过第一热处理部28的粘附单元(AD) 40和冷却单元(COL) 42的区间中适用浮起式搬送通路的结构例。 Figure 3 shows on a first transfer path 34 applies smoothing structural formula Example lifting transfer path in the first heat treatment section by the adhesive portion 28 of the unit (AD) 40 and a cooling unit (COL) 42 in. 如图所示,使基板G大致水平地浮起在台80上,同时通过未图示的搬送机构沿台的长边方向即搬送方向(X方向)以平流的方式搬送。 As shown, the substrate G substantially horizontally floating on the stage 80, while by the transfer mechanism (not shown), i.e., the conveyance direction (X direction) along the longitudinal direction of the table in a manner advection transport.

粘附单元(AD) 40,在台80的上方从搬送方向朝向下游侧配置有均热放射板82、 HMDS喷嘴84、气体引导盖86和排气用吸入口88。 Adhesion unit (AD) 40, there are disposed heat radiation plate 82, HMDS nozzle 84, the guide cover 86 and the exhaust gas suction port 88 toward the downstream side in the conveyance direction from above the table 80. 在平流的浮起搬送中当基板G通过粘附单元(AD) 40时,均热放射板82从上方向基板G施加放射热从而除去基板表面的水分,HMDS喷嘴84向基板表面吹出HMDS气体,气体引导盖86将滞留在基板G上的HMDS气体引导向搬送下游侧,排气用吸入口88将从上游侧流来的HMDS气体与周围的空气一起吸入并送至排气系统。 The floating transport in the stratosphere when heat is applied in the direction of the radiation from the substrate G while the substrate G 40 are adhered by heat radiation plate means (AD) 82 of the substrate surface to remove moisture, HMDS HMDS gas nozzle 84 is blown to the surface of the substrate, guiding the gas guided to the downstream side of the transport cover 86 is retained on the substrate G HMDS gas exhaust inlet port 88 from the upstream side of the flow of the HMDS gas to the ambient air intake and supplied to the exhaust system together.

冷却单元(COL) 42,沿搬送通路在台80的上方配置有一个或多段并列配置有多个冷却喷嘴90,从各冷却喷嘴90向以平流的浮起搬送方式通过正下方的基板G吹规定温度的冷却气体(例如空气)。 A cooling unit (COL) 42, along the transfer path above the table 80 is provided with a one or more segments are arranged in parallel with a plurality of cooling nozzles 90 from the cooling nozzles 90 to the floated transport advection sent by way of the substrate G directly below the blow predetermined the temperature of the cooling gas (e.g., air).

各机构具有在台80的宽度方向(Y方向)从基板G的一端覆盖至另一端的尺寸,例如HMDS喷嘴84和冷却喷嘴90构成为具有狭缝状的喷出口的超长形的喷嘴。 Each mechanism has a table 80 in the width direction (Y direction) is covered from one end to the dimensions of the substrate G at the other end, e.g. HMDS nozzle 84 and the cooling nozzle 90 is configured to form a nozzle having a long slit-like discharge port.

图4表示在第一平流搬送通路34在通过涂敷处理部30的抗蚀剂涂敷单元(COT) 44的区间中适用浮起式搬送通路的结构例。 4 shows a first transfer path 34 applies smoothing structural formula Example floating conveyance passage in a section through the resist coating unit (COT) unit 30 of the coating process 44. 同样,使基板G大致水平地浮起在台80上,同时通过未图示的搬送机构沿台长边方向即搬送方向(X方向)以平流的方式搬送。 Similarly, the substrate G substantially horizontally floating on the stage 80, while by the transfer mechanism (not shown), i.e., the conveyance direction (X direction) along the longitudinal direction of the table in a manner advection transport. 在台80的上方在搬送方向的规定位置配置有抗蚀剂喷嘴92,通过抗蚀剂喷嘴92从狭缝状的喷出口向以平流浮起搬送的方式通过正下方的基板G带状地喷出抗蚀剂液R,从基板前端到后端像铺地毯那样在基板G上形成一面抗蚀剂液R的液膜。 Disposed above the table 80 in a predetermined position in the transport direction resist nozzle 92, the spray nozzle 92 from the resist through the slit-like discharge port to the advection floating manner by conveying the substrate immediately below the ribbon G the resist solution R, is formed as one surface of the resist solution film on the substrate G R from front to back of the substrate as carpets.

图5表示在第一平流搬送通路34在通过第二热处理部32的预烘烤单元(PRE-BAKE) 48和冷却单元(COL) 50的区间中适用浮起式搬送通路的构成例。 5 shows a first transfer path 34 applies smoothing in the section through the pre-baking unit (PRE-BAKE) 48 of the second heat treatment section 32 and a cooling unit (COL) 50 in the floating configuration embodiment of formula conveyance path. 同样,使基板G大致水平地浮起在台80上,同时通过未图示的搬送机构沿台长边方向即搬送方向(X方向)以平流的方式搬送。 Similarly, the substrate G substantially horizontally floating on the stage 80, while by the transfer mechanism (not shown), i.e., the conveyance direction (X direction) along the longitudinal direction of the table in a manner advection transport. 预烘烤单元(PRE-BAKE) 48,在台80的上方沿搬送方向多段并列配置有多个加热器例如均热放射板94,从均热放射板94向以平流的浮起搬送方式通过正下方的基板G施加放射热从而使残存溶剂从基板G上的抗蚀剂中蒸发掉。 Prebaking unit (PRE-BAKE) 48, a multi-segment conveying direction arranged in parallel above the table 80 along a plurality of radiation heaters, for example, soaking plate 94, the heat radiated from the plate 94 are floated to transfer by way of the positive feed advection G is applied to the substrate below the radiant heat so that the remaining solvent was evaporated from the resist on the substrate G. 虽然省略图示,也可以在台80的上方设置吸入溶剂蒸气的排气用吸入口或多孔板。 Although not shown, may be provided in the exhaust solvent vapor above the suction table 80 by suction port or a perforated plate. 冷却单元(COL) 50,沿搬送通路在台80的上方配置有一个或多段并列配置有多个冷却喷嘴96,从各冷却喷嘴96向以平流的浮起搬送方式通过正下方的基板G喷射规定温度的冷却气体(例如空气)。 A cooling unit (COL) 50, along the transfer path above the table 80 is provided with a one or more segments are arranged in parallel with a plurality of cooling nozzles 96 from the cooling nozzles 96 to at advection floating conveyance by way of the substrate G directly below the ejection predetermined the temperature of the cooling gas (e.g., air).

在第二平流搬送通路64在通过第三热处理部66的后烘烤单元(POST-BAKE) 56和冷却单元(COL) 58的区间也能够适用与图5相同的浮起式搬送通路。 In a second transfer path advection supply path 64 through the third heat treatment in the same portion after baking unit (POST-BAKE) 66 to 56 and a cooling unit (COL) 58 can be applied to a section 5 of FIG floating type transfer. 另外,在通过准分子UV照射单元(E-UV)36的区间也能够适用相同的浮起式搬送通路。 Further, by excimer UV irradiation unit (E-UV) section 36 can also be applied the same type of floating transfer path.

图6表示浮起台80的主要部分的结构例。 FIG. 6 shows the structure of a main part of embodiment 80 of the floating station. 在台80的上面以规定的排列图案(例如矩阵状)以孔的方式穿有大量的喷出压縮空气(由此向基板G提供浮起力)的喷出口100。 In the above table 80 are arranged in a predetermined pattern (e.g., a matrix) in the manner of a large number of holes through the discharge of compressed air (thereby providing a lifting force to the substrate G) of the discharge port 100. 各喷出孔100与台80内的压縮空气供给通路(或缓冲室)102连通,压縮空气供给通路102通过外部配管(未图示)与压縮机等压縮空气供给源(未图示)连通。 Each discharge hole 100 communicating with the compressed air supply passage (or the buffer chamber) 80 102, compressed air is supplied through the external pipe passage 102 (not shown) such as a compressor and a compressed air supply source (not FIG. shown) in communication.

在图7所示的结构中,在浮起台80的上面设置有与喷出口100混 In the configuration shown in Figure 7, the floating table 80 in the above mixture is provided with the discharge port 100

13在一起的以负压吸入空气(由此向基板G提供朝下的吸引力)的吸引 13 together with the intake air negative pressure (down to the substrate thereby providing an attractive G) of the suction

口104。 Port 104. 各吸引口104与台内的真空通路(或缓冲室)106连通,真空通路106通过外部配管(未图示)与真空泵等真空源(未图示)连通。 Each suction port 104 and the vacuum passage station (or buffer chamber) 106 communicating the vacuum passage 106 communicates with a vacuum pump a vacuum source (not shown) through an external pipe (not shown). 这样,对通过正上方的基板G施加来自喷出口IOO的由压縮空气产生的垂直向上的力,同时施加来自吸引口104的由负压吸引力产生的垂直向下的力,通过控制相对抗的双方向的力的平衡能够将浮起量h稳定地维持在设定值附近。 Thus, applying a vertical upward force from the ejection outlet IOO compressed air generated by the positive to the above the substrate G, while applying a vertical downward force generated by the suction force from the suction port 104, by controlling confront sides to balance the force can be maintained stably floating amount h in the vicinity of the set value.

以下,对在该实施方式的浮起搬送中使用的搬送机构进行详细说明。 Hereinafter, the feeding of the transport conveying mechanism used in the floating of the embodiment will be described in detail.

图8和图9表示第一实施例的浮起搬送机构的结构。 Figures 8 and 9 show a first embodiment of the floating structure of the transport mechanism. 如图8所示, 从搬送方向(X方向)看,在台80的左右两侧沿搬送方向以一定间距分别配置有一列多个滚轮或侧面滚轮110。 8, the conveyance direction (X direction) See, around both sides of table 80 along the conveyance direction are disposed at a predetermined pitch over one wheel or roller 110 side. 各侧面滚轮110由圆板体或圆柱体构成,从其中心部向Y方向外侧水平延伸的滚轮支撑轴112在其中心部通过轴承114以能够旋转的方式被支撑,同时在其前端部通过锥齿轮U6与公共驱动轴118连接。 Each side roller 110 is constituted by a circular plate or a cylinder, roller supporting shaft extending in the Y direction from the center outward horizontal portion 112 is supported by bearings 114 rotatably at its center portion, while at its front end by a tapered and a common drive shaft gear 118 connected to U6. 驱动轴118通过驱动带轮122、 同步带124和从动带轮126连接在旋转驱动源的电动机120上。 A drive shaft 118 122, timing belt 124 and the driven pulley 126 attached to the rotation of the motor 120 by a drive source drive pulley.

将各侧面滚轮110以在Z方向滚轮外周面的顶部比台80的上面仅高相当于基板浮起量的程度的方式配置。 Each side roller 110 arranged to the top of the roller outer peripheral surface in the Z direction than the upper surface of the table 80 corresponding to only the floating amount of the substrate a high level manner. 另一方面,以在台80上基板G的左右两侧端部从台80稍微露出的方式设定台80的宽度尺寸。 On the other hand, in the stage 80 to the right and left side end of the substrate G from the table 80 is set slightly exposed width dimension of table 80. 在台80上基板G通过从正下方(台上面)的喷出口IOO承受的气体的压力浮在空中,同时其左右两侧端部搭载在台两侧的侧面滚轮110的上面。 On the table 80 by the pressure receiving substrate G from the discharge ports IOO (below the table above), a gas floating in the air, while the left and right end portions thereof is mounted in the upper side surface of both sides of the roller table 110.

在台80的上面,在最接近各侧面滚轮110的地方设置一个或多个搬送驱动用的吸引口130。 In the above table 80, on each side closest to where the roller 110 is provided a plurality of conveying or driving suction port 130. 各吸引口130增强基板G和侧面滚轮110 之间的摩擦用以防滑,通过负压吸引力向基板G施加垂直向下的力。 Each suction port 130 and the side reinforcing substrate G between the friction roller 110 to slip, the vertical downward force is applied to the substrate G by suction force. 对侧面滚轮110的滚轮外周面采用橡胶的结构也能够有效地防滑。 With rubber rollers of the roller outer peripheral side surface 110 of the structure can be effectively slip. 另外,虽然未图示,但也可以采用将用于使基板浮起量稳定化的吸引口104 (图7)与台上面的喷出口IOO混在一起的结构。 Further, although not shown, it may also be employed for the substrate an amount of a stabilized floating suction port 104 (FIG. 7) and the discharge outlet IOO table above mixed structure.

电动机120动作,其旋转驱动力通过传动机构(122、 124、 126、 120、 118、 116、 112)传递到各侧面滚轮110上,使各侧面滚轮110 沿规定的方向(前进方向)旋转。 Operation of motor 120, the rotational driving force (122, 124, 126, 120, 118, 116, 112) on each side is transmitted to the roller 110 through a transmission mechanism, a direction (advancing direction) of each side of the rollers 110 a predetermined direction of rotation. 通过这样的侧面滚轮110的旋转运动,浮起在台80上的基板G在侧面滚轮IIO上辗转传送并以平流的方式沿搬送方向(X方向)移动。 By such rotational movement of the side surface of the roller 110, the floating table 80 in the substrate G on the side of the transfer roller was removed IIO and advection in the manner along the conveyance direction (X direction).

也适用于后面阐述的其它的实施例,本实施例中的浮起搬送通路能够适当连结滚动搬送通路132、 134。 Also applies to other embodiments described later, the embodiment of the present embodiment lifting transfer path can be appropriately connected to the rolling transfer path 132, 134. 各滚动搬送通路132、 134,沿搬送方向(X方向)以一定的间距并列架设棒状的滚棒136,滚棒搬送面的高度与台80上的浮起搬送通路的高度一致。 The rolling transfer path 132, 134 along the conveyance direction (X direction) at a constant pitch in parallel to set up a rod-shaped roll bar 136, roll bar highly uniform conveyance surface floating on the transfer path 80 and the height of the table. 省略图示,各滚棒136 通过传动机构连接在专用的驱动电动机上。 Not shown, each of the roll bar 136 connected to a dedicated drive motor through a transmission mechanism.

在上游侧的滚动搬送通路132上以滚动搬送的方式移动而来的基板G不停止就保持原样换乘到台80上的浮起搬送通路,如上所述,在台80上浮在空中,同时在侧面滚轮IIO上辗转传送并沿搬送方向(X 方向)移动。 Rolling on the upstream side of the conveyance path 132 to the rolling movement of the transport ways from the substrate G is not stopped as it remains floating on the transfer to the transfer path 80, as described above, floating in the air in the station 80, while IIO transfer roller was removed on a side along the conveyance direction (X direction). 然后, 一旦超过台80的末端,就换乘到下游侧的滚动搬送通路134,以滚动搬送的方式被向前搬送。 Then, once the end of the table exceeds 80, on the transfer to the downstream side of the rolling transfer path 134, transported in a rolling manner conveyed forward.

图10和图11表示第二实施例中的浮起搬送机构的结构。 10 and FIG. 11 shows a second embodiment of the floating structure of the transfer mechanism. 在该实施例中,台80在与搬送方向(X方向)正交的方向相对水平面H倾斜规定的角度0 (例如2〜15°),由此,浮起在台80上的基板G与台80 的上面平行也倾斜相同的角度。 In this embodiment, the table 80 in the conveyance direction (X direction) perpendicular to a direction H relative to the horizontal plane inclined at a predetermined angle 0 (e.g. 2~15 °), thereby lifting the substrate G on the table 80 and the table 80 is also parallel to the above inclined angle of the same. 然后,在台80的底侧(图示的例子中的右侧),以基板G的低边Lc通过重力与靠近台的滚轮外周面138a加压接触的方式,以规定的间距沿搬送方向(X方向)配置一列具有纵方向的旋转轴140的侧面滚轮138。 Then, the bottom side of the table 80 (the right side in the illustrated example), to the low-side substrate G Lc 138a by gravity in contact with the pressing roller outer peripheral surface near the station, at a predetermined pitch in the transport direction ( X direction), a rotary shaft having a longitudinal direction side surface 138 of roller 140. 旋转轴140通过传动机构(未图示) 与电动机等的旋转驱动源(未图示)连接。 Rotation shaft 140 (not shown) via a transmission mechanism connected to a rotational drive source such as a motor (not shown). 通过侧面滚轮138旋转运动,以与台80平行的倾斜姿势浮起的基板G以其下边Lc辗转传过侧面滚轮138而沿搬送方向(X方向)平流移动。 138 side by the rotational movement of the wheel, in parallel with the table in an inclined posture of the float 80 in its lower side of the substrate G Lc removed through the side surface of the rollers 138 pass along the conveyance direction (X direction) movement advection.

这样,该实施例的浮起搬送机构,通过采用仅在台80的一侧配置侧面滚轮138的结构进行基板G的浮起搬送,成为更加简单的结构。 Thus, this embodiment of the floating conveyance mechanism configured by using only one side of the roller table 80 of the side structure 138 is conveyed floating substrate G, the structure becomes simpler.

图12和图13表示第三实施例中的浮起搬送机构的结构。 Figures 12 and 13 show a third embodiment of the floating structure of the transport mechanism. 该实施例将上述第二实施例中的侧面滚轮138置换成无端带142。 The above-described embodiment the side roller 138 of the second embodiment is replaced with an endless belt 142. 更详细而言,在台80的底侧(右侧),以基板G的低边Lo通过重力与靠近台的带外周面142a加压接触的方式,设置沿搬送方向(X方向)延伸的无端带142。 More specifically, the bottom side of the table 80 (the right side), a low-side Lo substrate G by way of gravity and pressure contact with the outer peripheral surface near the table 142a, disposed along the conveyance direction (X direction) extending in an endless 142 tape. 该无端带142架设在具有配置在台80的右侧的纵方向的旋转轴144的驱动带轮146和从动带轮(未图示)之间。 The endless belt 142 stretched between the drive pulley 146 and the driven pulley 144 (not shown) having a rotary shaft arranged in the longitudinal direction of the right side of the table 80. 驱动带轮146 进行旋转,通过无端带142在两带轮之间进行直进运动,以与台80平 Rotation drive pulley 146, 142 for rectilinear movement between two endless belt through the pulleys, with the flat table 80

15行的倾斜姿势浮起的基板G以其下边Lo搭载在无端带142上而沿搬送 15 inclined posture floating line Lo substrate G is mounted with its lower side along the conveyance endless belt 142

方向(x方向)移动。 Direction (x direction).

图14〜图16表示第四实施例中的浮起搬送机构的结构。 FIG. 14~ 16 shows a fourth embodiment of the floating structure of the transport mechanism. 如图14 和图16所示,在该实施例中,在台80上在基板G的后面使板状的浮起载体148浮起在与基板G大致相同的高度,浮起载体148从后面推压基板G并一体地移动。 As shown in FIG. 14 and FIG. 16, in this embodiment, the substrate G 80 behind the plate-like floating floating carrier table 148 and the substrate G substantially in the same height, the carrier 148 to push from behind the float and pressing the substrates G move integrally. 浮起载体148优选具有与基板G相同或大致相同的比重的材质,也可以采用其前端的边与基板G的后端的边恰好吻合的矩形的板体的结构。 Lifting the substrate carrier 148 preferably has the same or substantially the same G of gravity of the material, the structure of the side plate and the rear end side of the front end of the substrate G coincides rectangular may be employed.

在该实施例中,为了向浮起载体148提供搬送推进力,在浮起载体148的背面(下面)以例如图15所示那样的矩阵状的图案形成大量凹处(洼坑)150。 In this embodiment, in order to provide the carrier 148 to transfer floating propulsion, lifting the carrier 148 in the back surface (below), for example in a matrix pattern as shown in FIG. 15 are formed a large number of recesses (pits) 150. 然后,在台80的上面形成各个喷出口100,使其沿搬送方向(X方向)朝向斜上方。 Then, each of the discharge outlet 100 formed in the upper table 80, so that in the transport direction (X direction) obliquely upward. 由此,从台80上面的喷出口IOO向相同方向喷出的浮起用的高压空气Q,虽然以均等的流量碰撞到浮起载体148和基板G的各自的下面,但是对浮起载体148的凹处150以比其前部内壁以外的部位小的照射角(与法线成的角)向该前部内壁碰撞,因此在浮起载体148上产生比基板G大的推进力,浮起载体148 推压基板G同时沿搬送方向(X方向)移动。 Accordingly, the IOO discharged from the discharge outlet 80 above the floating station in the same direction with the high pressure air Q, while the floating support 148 and collision respective underlying substrate G at a uniform flow rate, but the carrier 148 is lifted in the recess 150 is smaller than the portion other than the inner wall of the front portion of the irradiation angle (angle formed with the normal line) to the front portion of the inner wall of the collision, and therefore a large thrust force than the substrate G on the floating support 148, floating carrier 148 is pressed while the substrate G along the conveying direction (X direction).

作为该实施例的一个变形例,也可以将浮起载体148的凹处150 置换成如图17 (A)、 (B)和图18所示那样的向与搬送方向(X方向) 正交的方向(Y方向)延伸的槽152。 As a modification of this embodiment, carrier 148 may be lifted recess 150 is replaced in FIG. 17 (A), (B) and FIG. 18 as to the conveyance direction (X direction) perpendicular to the shown grooves 152 (Y direction) extends. 这时,如图17 (B)所示,通过将槽152的两端部向搬送方向前方弯曲,在这些两端部产生向内(朝向台中心)的推进力,能够有效地防止浮起载体148进而基板G的横向错位。 In this case, as shown in FIG 17 (B), by bending both end portions in front of slot 152 to the feeding direction of conveying, propulsion inwardly (toward the center of the table) in the both end portions can be effectively prevented from floating carrier G 148 further lateral displacement of the substrate.

如图19所示的变形例,为了向浮起载体148提供搬送推进力,替代如上所述那样在背面形成凹处150,例如使销154以可装卸的方式与在浮起载体148的一端或两端形成的孔(开口)卡合,通过未图示的直进搬送机构隔着销154使浮起载体148沿搬送方向(X方向)移动。 Modification shown in FIG. 19, in order to provide propulsion to the floating transport carriers 148, the recess 150 formed as described above, alternatively on the back, for example, the pin 154 detachably floating manner in the support end 148 or holes formed in both ends (opening) is engaged by the straight conveying mechanism (not shown) via a support pin 154 so that float 148 in the conveyance direction (X direction). 另外,为了能够任意使基板G的平流搬送停止,也可以在台80上在基板G的前面使其它的板状的浮起载体156浮起在与基板G大致相同的浮起高度,将浮起载体156停止在希望的位置,以此为阻挡块来阻止基板G的前进移动。 Further, in order to make any advection substrate G conveyance stop, 80 may be on the front substrate G so that the other floating carrier plate 156 in a floating stage and the substrate G substantially equal to the flying height, the float carrier 156 at a desired stop position, as a stopper to stop the forward movement of the substrate G. 图20和图21表示第五实施例中的浮起搬送机构的结构。 20 and FIG. 21 shows a fifth embodiment of the floating structure of the transport mechanism. 该实施例,通过在搬送方向(X方向)对从台80的上面向上方喷出的压縮空气Q的流量分布进行可变控制,利用重力的推进力使浮起在台80上的基板G前进移动。 This embodiment, by upward from the table 80 for the discharge flow rate Q of the compressed air is variably controlled in a conveyance direction (X direction) distribution, using gravity propulsion on the table 80 that the floating substrate G moving forward. 即,如图20 (A)所示,首先在台80上使基板G 水平浮起比较大的浮起高度(例如2〜3mm)。 That is, FIG. 20 (A), first, the substrate G is relatively large float level flying height (e.g. 2~3mm) on the stage 80. 接着,如图20 (B)所示,从基板G的后端的位置向搬送方向(X方向)的前方逐渐减小各位置的浮起用压縮空气Q的流量(压力)。 Next, FIG. 20 (B), the substrate G from the position of the rear end is gradually decreased flow rate Q of each floating position with compressed air (pressure) in the forward transport direction (X direction). 于是,基板G如同从滑梯滑落一样利用重力向搬送方向(X方向)的前方移动。 Then, the substrate G as the same fall by gravity from the slide moves forward transport direction (X direction). 这时,如图21 所示,通过在台80的宽度方向(Y方向)使两端部的浮起用压縮空气Qe的流量(压力)比内侧区域的大,能够有效地防止或抑制基板G的横向错位。 In this case, as shown in FIG. 21, the width direction by a stage 80 (Y-direction) so that the flow rate Qe is lifted by both end portions of the compressed air (pressure) larger than the inner region, can be effectively prevented or suppressed substrate G lateral misalignment.

图22〜图24表示第六实施例中的浮起搬送机构的结构。 FIG. 22~ 24 shows a sixth embodiment of the floating structure of the transport mechanism. 该实施例,如图22所示,在搬送方向(X方向)将台80设置成相对水平面H 倾斜规定的角度a (例如5〜15°)的前倾的姿势,在台80上基板G如同从滑梯滑落一样利用重力向搬送方向(X方向)的前方移动。 This embodiment, as shown, in the transport direction (X direction) of the stage 80 relative to the horizontal plane H 22 disposed inclined at a predetermined angle a (e.g. 5~15 °) a forward position on the stage 80 as the substrate G as the slide moves in the slide using the conveyance direction (X direction) in front of gravity. 这时, 在台80的倾斜面上使浮起用压缩空气Q的流量均等即可。 In this case, the table is tilted so that the lifting surface 80 with compressed air to uniformly flow Q. 不过,也可以以与第五实施例相同的目的(防止横向错位的目的),如图23所示, 在台80的宽度方向(X方向)使两端部的浮起用压缩空气Qe的流量(压力)比内侧区域的大。 However, the same may also be object of the fifth embodiment (the purpose of preventing lateral misalignment), shown in Figure 23, in the table 80 in the width direction (X direction) so that both end portions of the float compressed air flow rate Qe ( pressure) larger than the inner area.

另外,基板G以浮起搬送的方式通过从斜面上滑落而加速,因此即使台80从倾斜面变为水平面,由于惯性基板G也能够暂时继续移动。 Further, the substrate G is conveyed floating manner by accelerated fall from the inclined surface, even if station 80 becomes a horizontal surface from the inclined surface due to inertia continues to move the substrate G can be temporary. 为了在台80上的希望的位置使基板G强制停止,如图24所示,以浮起用的压缩空气Q在停止位置附近从台80上面朝向搬送方向(X方向) 的相反侧向斜上方喷出的方式形成喷出口100即可。 Instead obliquely upward side to a desired position on the substrate table 80 is stopped forcibly G, 24, floated by compressed air in the vicinity of the stop position Q toward the conveyance direction (X direction) from the upper stage 80 of the discharge out of the discharge port 100 can be formed.

图25和图26表示第七实施例中的浮起搬送机构的结构。 25 and 26 shows the seventh embodiment of the floating structure of the transfer mechanism. 该实施例,在台80的左右两侧设置沿搬送方向(X方向)延伸的无端带160, 在无端带160的外侧面上以一定的间隔安装有吸附垫162。 This embodiment is provided along the conveyance direction (X direction) of the endless belt 160 extending in the left and right sides of the table 80, on the outer side of the endless belt 160 at predetermined intervals with a suction pad 162 is mounted. 无端带160 水平架设在驱动带轮164和从动带轮166之间。 Horizontal endless belt 160 stretched between the drive pulley 164 and the driven pulley 166. 在台80的左右两侧面上隔着无端带160安装有用于通过推栓168将吸附垫162从下方推上去的推进器170。 The left and right on both sides of table 80 is mounted via the endless belt 160 by pushing pin 168 for the suction pad 162 is pushed up from below the pusher 170. 将基板G搬入到台80上, 一旦无端带160的吸附垫162来到推进器170的正上方,在此时刻推进器170将推拴168瞵间顶 The substrates G loaded to the stage 80, once the endless belt of the suction pads 162,160 to just above the pusher 170, at this point the pusher 170 pushes the top tether between 168 phosphine

17上去,而将该吸附垫162内的空气压出使其抵接(吸附)在基板G的 17 up, and the air in the suction pad 162 so that the abutment pressure (adsorption) G in the substrate

背面。 back. 吸附垫162以保持基板G的状态与基板G —起沿搬送方向(X 方向)移动,并在从动带轮166附近为了返回而改变前进方向进而与基板G脱离。 Suction pads 162 to maintain the substrate G is mounted on a substrate G - from transportation direction (X direction), and returns to the traveling direction is changed in the vicinity of the driven pulley 166 and further from the substrate G.

上述实施例的任何一个浮起搬送机构都为部件件数少且简单的结构,能够以低成本制作。 Any floating conveying mechanism of the above embodiment are a small number of components and a simple structure can be manufactured at low cost.

本发明中的被处理基板并不限定于LCD用的玻璃基板,也可以为 Substrate to be processed in the present invention is not limited to the glass substrate of the LCD, it may be a

其它平板显示器用基板、光掩模、印刷基板等。 Other flat panel display substrate, a photomask, a printed circuit board. 在基板上涂敷的处理液也不限定于抗蚀剂液,例如也可以为层间绝缘材料、介质材料、配线材料等的处理液。 The process liquid coating on the substrate is not limited to the resist solution, the treatment liquid may be, for example, as an interlayer insulating material, a dielectric material, a wiring material and the like.

Claims (6)

1.一种基板处理装置,其特征在于: 在沿水平的规定的搬送方向延伸的台上,通过气体压力使矩形的被处理基板浮起并沿所述搬送方向搬送,同时从沿着所述台配置的机构向所述基板供给规定的液体、气体、光或热实施规定的处理, 在所述台上使所述基板在与所述搬送方向正交的方向上以相对水平面倾斜规定角度的姿势浮起, 以在所述台上浮起的所述基板的低边的边缘与靠近所述台的滚轮外周面加压接触的方式在所述浮起台的一侧以规定的间距将多个侧面滚轮配置成一列,旋转驱动所述侧面滚轮进行所述基板的搬送。 1. A substrate processing apparatus, characterized in that: in the stage conveyance direction along a predetermined horizontal extending through the rectangular gas pressure to float the substrate to be processed along the conveying direction of conveyance, while along from the a predetermined table mechanism configured to supply liquid to the substrate, gas, light, or heat treatment predetermined embodiment, the substrate on the stage in a direction orthogonal to the transport direction relative to horizontal plane at a predetermined angle floating posture to pressurize the outer circumferential surface of the roller adjacent to the low stage side edge of the substrate on the stage floating manner on the side contacting the floating platform at a predetermined pitch a plurality of rollers arranged one side, the side surface of the drive roller for rotating the substrate conveyance.
2. —种基板处理装置,其特征在于:在沿水平的规定的搬送方向延伸的台上,通过气体压力使矩形的被处理基板浮起并沿所述搬送方向搬送,同时从沿着所述台配置的机构向所述基板供给规定的液体、气体、光或热实施规定的处理,在所述台上使所述基板在与所述搬送方向正交的方向上以相对水平面倾斜规定角度的姿势浮起,以在所述台上浮起的所述基板的低边与靠近所述台的带外周面加压接触的方式在所述台的一侧设置沿所述搬送方向延伸的无端带,驱动所述无端带进行所述基板的搬送。 2. - substrate processing apparatus, wherein: the stage conveyance direction extends along the predetermined level, by gas pressure to float the rectangular substrate to be processed along the conveying direction of conveyance, while along from the a predetermined table mechanism configured to supply liquid to the substrate, gas, light, or heat treatment predetermined embodiment, the substrate on the stage in a direction orthogonal to the transport direction relative to horizontal plane at a predetermined angle floating posture, to press-contact with the lower side of the table near an outer circumferential surface of the substrate with the floating platform disposed along the endless conveyor belt extending in the direction of one side of the table, driving the endless belt transporting the substrate.
3. 如权利要求1或2所述的基板处理装置,其特征在于-以喷出基板浮起用的气体的所述台的上面在与所述搬送方向正交的方向相对水平面倾斜所述规定角度的方式配置所述台,并且使所述基板与所述台的上面平行地浮起。 3. The substrate processing apparatus according to claim 1, characterized in that - the upper surface of the substrate table to float by ejecting a gas in a direction perpendicular to the conveying direction of the predetermined angle relative to horizontal plane disposed in the stage, the substrate and the upper surface of the float parallel to the station.
4. 一种基板处理装置,其特征在于:在沿水平的规定的搬送方向延伸的台上,通过气体压力使矩形的被处理基板浮起并沿所述搬送方向搬送,同时从沿着所述台配置的机构向所述基板供给规定的液体、气体、光或热实施规定的处理,以与在所述台上浮起的所述基板的后端的边接触的方式使板状的第一浮起载体浮起在与所述基板相同的浮起高度,利用所述第一浮起载体从后面推压所述基板进行所述基板的搬送。 4. A substrate processing apparatus, characterized in that: in the stage conveyance direction along a predetermined horizontal extending through the rectangular gas pressure to float the substrate to be processed along the conveying direction of conveyance, while along from the treatment liquid, gas, light or heat embodiments are prescribed to the feed mechanism of the substrate stage arranged, in a manner to a rear end side of the substrate on the stage of the plate-like floating contact of the floating first the substrate support floats in the same flying height by the first urging said floating carrier substrate transporting the substrate from the back.
5. 如权利要求4所述的基板处理装置,其特征在于: 在所述第一浮起载体的下面形成凹坑状或槽状的凹部,使浮起用的气体从所述台的上面向着搬送方向朝向斜上方喷射。 5. The substrate processing apparatus according to claim 4, wherein: formation of pits or a groove-like concave portion under the first floating carrier, floating with gas from the upper stage toward the transport ejecting obliquely upward direction.
6. 如权利要求4或5所述的基板处理装置,其特征在于:以与浮起在所述台上的所述基板的前端的边接触的方式使板状的第二浮起载体浮起在与所述基板相同的浮起高度,所述第二浮起载体在设定位置停止从而停止所述基板的搬送。 The substrate processing apparatus as claimed in claim 4 or claim 5, wherein: the edge so as to contact with the substrate floating on the stage of the plate-like front end of the second carrier to float float in the same flying height of the substrate, said second floating support is stopped to stop in a set position of the substrate transport.
CN 200710160567 2006-12-27 2007-12-25 Substrate processing device CN100594584C (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105185726A (en) * 2014-05-13 2015-12-23 芝浦机械电子株式会社 Substrate treatment device, substrate treatment method, substrate manufacture device and substrate manufacture method

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5056611B2 (en) * 2008-06-20 2012-10-24 凸版印刷株式会社 Substrate processing equipment
JP4755233B2 (en) * 2008-09-11 2011-08-24 東京エレクトロン株式会社 Substrate processing equipment
TWI472467B (en) * 2009-04-23 2015-02-11 Corning Inc Liquid-ejecting bearings for transport of glass sheets
US8047354B2 (en) 2008-09-26 2011-11-01 Corning Incorporated Liquid-ejecting bearings for transport of glass sheets
JP4787872B2 (en) * 2008-10-16 2011-10-05 東京エレクトロン株式会社 Substrate transfer processing equipment
KR100985135B1 (en) * 2008-11-05 2010-10-05 세메스 주식회사 Apparatus for processing a substrate
JP5200868B2 (en) * 2008-11-11 2013-06-05 株式会社Ihi Levitation transfer device
DE112009003614T5 (en) * 2008-11-14 2013-01-24 Tokyo Electron Ltd. Substrate processing system
KR101296659B1 (en) * 2008-11-14 2013-08-14 엘지디스플레이 주식회사 Washing device
JP2010123970A (en) * 2008-11-24 2010-06-03 Sfa Engineering Corp Substrate transfer apparatus
JP4696165B2 (en) * 2009-02-03 2011-06-08 東京エレクトロン株式会社 Substrate processing apparatus and substrate processing method
TWI466225B (en) * 2009-05-13 2014-12-21 Utechzone Co Ltd Suspended air float working platform
JP4785210B2 (en) * 2009-07-23 2011-10-05 東京エレクトロン株式会社 Substrate transfer device
JP4916035B2 (en) * 2009-08-28 2012-04-11 東京エレクトロン株式会社 Substrate transport apparatus and substrate transport method
KR101205832B1 (en) * 2009-11-27 2012-11-29 세메스 주식회사 Substrate transferring unit and method of transfering substrate using the same
JP2011124342A (en) * 2009-12-09 2011-06-23 Tokyo Electron Ltd Substrate processing device, substrate processing method, and recording medium recording program for implementing the substrate processing method
CN107017191A (en) * 2010-02-17 2017-08-04 株式会社尼康 Carrying device, transport method, exposure device and manufacturing method
KR101202455B1 (en) * 2010-06-07 2012-11-16 주식회사 나래나노텍 A Device for Feeding Transferring Carrier Used in Substrate Transferring Unit of Coating Region, and A Substrate Transferring Unit and A Coating Apparatus Having the Same
TW201214609A (en) 2010-09-27 2012-04-01 Toray Eng Co Ltd Substrate conveying apparatus
JP2012076877A (en) * 2010-10-01 2012-04-19 Nitto Denko Corp Workpiece transport method and workpiece transport apparatus
JP5877954B2 (en) * 2011-03-07 2016-03-08 株式会社ゼビオス Substrate processing apparatus having non-contact levitation transfer function
CN102167227B (en) * 2011-04-02 2012-09-05 东莞宏威数码机械有限公司 Substrate transmission equipment
CN102909714A (en) * 2011-08-05 2013-02-06 南通居梦莱家用纺织品有限公司 Automatic weight reduction operation platform
CN103065998A (en) * 2011-10-21 2013-04-24 东京毅力科创株式会社 Processing bench device and coating processing device using same
JP5912642B2 (en) 2012-02-20 2016-04-27 日本電気硝子株式会社 Glass plate conveying apparatus and conveying method thereof
KR20150053733A (en) 2012-04-19 2015-05-18 인테벡, 인코포레이티드 Dual-mask arrangement for solar cell fabrication
US10062600B2 (en) 2012-04-26 2018-08-28 Intevac, Inc. System and method for bi-facial processing of substrates
JP6231078B2 (en) 2012-04-26 2017-11-15 インテヴァック インコーポレイテッド System configuration for vacuum process
JP5915358B2 (en) * 2012-04-26 2016-05-11 株式会社Ihi Transport device
KR101212816B1 (en) 2012-09-14 2012-12-14 주식회사 나래나노텍 Substrate Transferring Unit of Coating Region Having Device for Feeding Transferring Carrier
KR101212817B1 (en) 2012-09-14 2012-12-14 주식회사 나래나노텍 Coating Apparatus Having Device for Feeding Transferring Carrier Used in Substrate Transferring Unit of Coating Region
TWI590367B (en) * 2012-11-20 2017-07-01 Toray Eng Co Ltd Suspension transfer heat treatment device
JP3183651U (en) * 2013-03-13 2013-05-30 揚博科技股▲ふん▼有限公司 Full flat circuit board processing and transportation equipment
KR101888383B1 (en) * 2013-10-08 2018-08-14 야마하하쓰도키 가부시키가이샤 Substrate transfer device
US9543114B2 (en) 2014-08-05 2017-01-10 Intevac, Inc. Implant masking and alignment system with rollers
KR101563128B1 (en) * 2015-01-09 2015-10-27 엠에스티코리아(주) apparatus for transferring substrates
CN105151780B (en) * 2015-08-28 2018-11-23 武汉华星光电技术有限公司 A kind of ultrasonic delivery device
CN106081627B (en) * 2016-07-26 2019-07-02 中导光电设备股份有限公司 A kind of application method of high-speed air floatation plate
JP2018056182A (en) * 2016-09-26 2018-04-05 株式会社Screenホールディングス Substrate processing apparatus and substrate processing method
CN107187874B (en) * 2017-04-28 2019-03-22 武汉华星光电技术有限公司 A kind of transmission device
CN108750669A (en) * 2018-05-07 2018-11-06 芜湖良匠机械制造有限公司 A kind of high-precision glass substrate conveying device of roller type

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2847524Y (en) 2005-12-05 2006-12-13 北京中科信电子装备有限公司 Wafter jack-up device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3756402B2 (en) * 2000-12-08 2006-03-15 富士写真フイルム株式会社 Substrate transfer apparatus and method
JP3763125B2 (en) * 2001-07-03 2006-04-05 東京エレクトロン株式会社 Substrate processing equipment
JP4349101B2 (en) * 2003-11-21 2009-10-21 株式会社Ihi Substrate transfer device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2847524Y (en) 2005-12-05 2006-12-13 北京中科信电子装备有限公司 Wafter jack-up device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105185726A (en) * 2014-05-13 2015-12-23 芝浦机械电子株式会社 Substrate treatment device, substrate treatment method, substrate manufacture device and substrate manufacture method

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