JP2010123970A - Substrate transfer apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate transfer apparatus which reduces the generation of noise and particles, and can be manufactured by using structure which is more efficient than a prior art, and transfers a substrate at a high speed. <P>SOLUTION: The substrate transfer apparatus includes a gripping transfer unit for forcibly transferring a substrate by gripping at least one region of the substrate arranged in parallel to the ground, and an auxiliary transfer unit arranged adjacent to the gripping transfer unit for supporting the substrate so as to be transferable. <P>COPYRIGHT: (C)2010,JPO&amp;INPIT

Description

  The present invention relates to a substrate transfer apparatus, and more particularly, can reduce the generation of noise and particles, can be manufactured with a more efficient structure than conventional ones, and can transfer a substrate at a high speed. Relates to the device.

  In general, the substrate is a flat display device (FPD, Flat Panel Display) such as a plasma display (PDP, Plasma Display Panel), a liquid crystal display (LCD, Liquid Crystal Display), and an organic EL (OLED, Organic Light Emitting Diodes). , Semiconductor wafers, photomask glass, and the like are shown.

  Although a substrate as a flat panel display device (FPD) and a substrate as a semiconductor wafer are different from each other in terms of material and usage, a series of processing steps for the substrate, such as exposure, phenomenon, etching, The steps of stripping, rinsing, cleaning, etc. are substantially similar, and the substrate is manufactured by proceeding sequentially. Hereinafter, among the flat panel display elements (FPD), an LCD substrate will be described as an example.

  The LCD substrate is sold as a product through a TFT process, a cell process and a module process.

  The TFT process is very similar to the semiconductor manufacturing process, but is a process of arranging thin film transistors on a glass substrate by repeating deposition, photolithography and etching.

  In the cell process, an alignment film is formed on the TFT lower plate manufactured by the TFT process and the upper plate, which is a color filter, so that the liquid crystal is well aligned. It is a process of wearing.

  In the module process, a polarizing plate is attached to the completed LCD panel, an integrated circuit (Drive-IC) is mounted, and then assembled with a PCB (Printed Circuit Board). Shows a series of steps to assemble and.

  A substrate transfer device for transferring a substrate from a previous process and transferring the substrate to a subsequent process between the lines connecting the processes so that each process in the process or each process in the process is sequentially performed. Is provided. As an example, during the module process, after the protective film (Protecting Film) attached to the polarizing plate is peeled off to protect the polarizing plate, the polarizing plate is attached to the surface of the substrate after the protective film is peeled off. Although the plate attachment process proceeds, the substrate transfer device for transferring the substrate is also provided in the polarizing plate attachment apparatus in which the polarizing plate attachment process proceeds.

  Most of the substrate transfer apparatuses that are widely known in the past are horizontal substrate transfer apparatuses that transfer a substrate by placing the substrate in a horizontal state. As the types of horizontal substrate transfer apparatuses, a conveyor type substrate transfer apparatus and a roller type substrate transfer apparatus are typically known.

  Among such substrate transfer devices, a roller type substrate transfer device often used in the process is a contact type that rotates a rotating shaft to which a roller is coupled by a combination of a motor and a bevel gear, and a magnetic force of a magnet. There is known a non-contact type that rotates a rotating shaft coupled with a roller by a non-contact type. The latter non-contact type has an advantage that noise generation and particle generation can be reduced compared to the former contact type.

  However, among the conventional techniques, in the case of a non-contact type substrate transfer device using magnetic, since the magnetic is expensive, the manufacturing cost of the substrate transfer device generally increases. In spite of applying the non-contact type by magnetic, high-speed transfer to the substrate is difficult as required in the process, and when the rotating shaft hangs down due to the load of the substrate, the front end of the substrate is not transferred during substrate transfer. There is a problem that the substrate is damaged by colliding with a roller of an adjacent rotating shaft.

  In other words, recently, when considering that various facilities for manufacturing 11 generation substrates having a horizontal / vertical length of about 3 m are used in the field, such large-area substrates are used as the facilities. In the case of a substrate transfer device for transferring, the roller or rotating shaft that supports the substrate may hang depending on the weight of the substrate. If the rotating shaft hangs in this way, the rotating shaft in front of the substrate is being transferred. Since the front end of the substrate collides with the roller of the substrate, the substrate can be damaged. Therefore, it is expected that the research on the high-speed transfer of the substrate should be advanced together.

  On the other hand, unlike the horizontal substrate transfer device described above, the substrate transfer device is a vertical substrate that transfers the substrate in a vertical direction (actually, it is transferred obliquely to approximately 65 ° to 75 °). There is a transfer device.

  According to the vertical substrate transfer apparatus, even if the area of the substrate is substantially large like the substrate for 11th generation, the footprint for equipment in a limited space in a clean room for transferring the substrate upright. (Foot print) can be reduced. In addition, when the substrate is moved upright, work can be performed on both sides of the substrate, which increases work efficiency. In particular, it is necessary to attach a polarizing plate to both sides of the substrate. In the case of a process or the like, the substrate transfer apparatus is expected to be used more effectively, and research on this is required.

  On the other hand, among the horizontal or vertical substrate transfer devices, particularly in the case of a non-contact type substrate transfer device using magnetic, the above-mentioned problems are expected. There has been proposed a substrate transfer apparatus that transfers a substrate after the substrate is levitated at a certain height by applying an air levitation module.

  Such a substrate transfer device includes a large number of air levitation modules for transferring a substrate, and a plurality of air injection holes through which air is injected are formed on the surface of the air levitation module. A coating layer is formed on the surface of the floating module so as not to generate scratches on the substrate. The coating layer is formed with the same size as the air injection holes, and a large number of communication openings that communicate with the air injection holes one by one. As a result, the air supplied inside the air levitation module is sprayed to the outside through the communication holes formed in the coating layer after being sprayed to the air spray holes formed on the surface of the air levitation module. Can float up to a certain height.

  However, in such a substrate transfer apparatus, in order to float the substrate with the air jetted from the air jet holes having the above-described structure, the motor capacity must be relatively large. There is a problem that the capacity of the motor has to be further increased as the motor becomes larger, and in this way, when the capacity of the motor for injecting air to levitate the substrate is large, various complicated problems occur. There is a problem that it is difficult to actually use a motor with a large capacity. Even so, if a motor with sufficient capacity to lift the board is not used, the board will not rise to the desired height, so that the board will float while the capacity of the motor is not increased compared to the conventional one. This is a situation that requires a more efficient structure.

  An object of the present invention is to provide a substrate transfer apparatus that can reduce the generation of noise and the generation of particles, can be manufactured with a more efficient structure, and can transfer the substrate at a high speed.

  Another object of the present invention is to provide a substrate transfer apparatus that can reduce the footprint of the apparatus, reduce the generation of noise and particles, can be manufactured with an efficient structure, and can transfer the substrate at high speed. That is.

  Another object of the present invention is to provide a substrate transfer that has a simple and simple structure, can increase the efficiency of floating the substrate without a significant increase in motor capacity, and can transfer the substrate at a high speed. Is to provide a device.

  According to the present invention, the object is to grip at least one region of a substrate disposed parallel to the ground and to force the substrate to be transported, and to be disposed adjacent to the grip transport unit. And an auxiliary transfer unit for supporting the substrate in a transferable manner.

  The object is, according to the present invention, gripping at least one region of the substrate standing on the ground, forcibly transferring the substrate, and disposed adjacent to the gripping transfer unit, It is also achieved by a substrate transfer apparatus including an auxiliary transfer unit that supports the substrate in a transferable manner.

  According to the present invention, the present invention provides an air levitation module in which a number of air injection holes through which air for levitation of the substrate is levitated are formed, and is provided on the surface of the air levitation module. A substrate protection layer that protects the substrate protection layer. The substrate protection layer communicates with an air injection hole of the air levitation module, and is expanded relatively larger than a size of the air injection hole, so that the air The present invention is also achieved by a substrate transfer device characterized in that an expansion hole is formed to increase an injection cross-sectional area of air directed from the injection hole toward the substrate.

  According to the present invention, it can be manufactured at a much lower cost than before, and high-speed transfer to the substrate is possible, and during the transfer of the substrate, the substrate collides with a roller or a rotating shaft as in the conventional case. The phenomenon of being damaged can be prevented.

  According to the present invention, the footprint of the apparatus can be reduced, the generation of noise and particles can be reduced, the device can be manufactured with an efficient structure, and the substrate can be transferred at high speed.

  According to the present invention, it has a simple and simple structure, can increase the efficiency of floating the substrate without significantly increasing the motor capacity as compared with the prior art, and can perform high-speed transfer to the substrate.

1 is a perspective view of a substrate transfer apparatus according to a first embodiment of the present invention. It is a top view of FIG. It is a partial exploded perspective view of a holding | grip transfer unit. It is a schematic sectional drawing of a holding | grip transfer unit. It is the side view of FIG. 1 which showed operation | movement of the holding | grip transfer unit. It is the side view of FIG. 1 which showed operation | movement of the holding | grip transfer unit. (A) thru | or (c) is the figure which showed schematically operation | movement of the board | substrate transfer apparatus shown by FIG. FIG. 6 is a schematic cross-sectional view of a gripping transfer unit in a substrate transfer apparatus according to a second embodiment of the present invention. It is sectional drawing of the operation state of FIG. It is a principal part enlarged view of FIG. It is a top view of the board | substrate transfer apparatus by 3rd Embodiment of this invention. It is a fragmentary perspective view with respect to a holding | maintenance transfer unit with the board | substrate transfer apparatus by 4th Embodiment of this invention. It is a disassembled perspective view of FIG. It is a schematic perspective view of the transfer apparatus by 5th Embodiment of this invention. It is a side view of the board | substrate transfer apparatus by 6th Embodiment of this invention. FIG. 10 is a schematic perspective view of a substrate transfer apparatus according to a seventh embodiment of the present invention. It is sectional drawing by the AA line of FIG. FIG. 10 is a schematic perspective view of a substrate transfer apparatus according to an eighth embodiment of the present invention. It is sectional drawing by the BB line of FIG. It is a partial top view of the board | substrate transfer apparatus by 9th Embodiment of this invention. It is a perspective view of the board | substrate transfer apparatus by 10th Embodiment of this invention.

  For a full understanding of the invention, its operational advantages, and the objectives achieved by the practice of the invention, reference should be made to the accompanying drawings that illustrate preferred embodiments of the invention and the contents described in the accompanying drawings. There must be.

  Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. Like reference numerals in the drawings denote like members.

  1 is a perspective view of a substrate transfer apparatus according to a first embodiment of the present invention, FIG. 2 is a plan view of FIG. 1, FIG. 3 is a partially exploded perspective view of a gripping transfer unit, and FIG. Is a schematic cross-sectional view of the gripping and transporting unit, FIGS. 5 and 6 are side views of FIG. 1 showing the operation of the gripping and transporting unit, respectively, and (a) to (c) of FIG. It is the figure which showed schematically operation | movement of the board | substrate transfer apparatus shown by FIG.

  As shown in these drawings, the substrate transfer apparatus according to the present embodiment is a horizontal substrate transfer apparatus. Such a substrate transfer apparatus has a horizontal type, that is, a gripping transfer unit 100 that grips at least one region of a substrate arranged parallel to the ground and forcibly transfers the substrate, and a gripping transfer unit 100. And an auxiliary transfer unit 200 disposed adjacently and supporting the substrate in a transferable manner.

  First, the auxiliary transfer unit 200 will be described. In the present embodiment, the auxiliary transfer unit 200 is provided in a non-contact type non-contact type auxiliary transfer unit in which a substrate is levitated at a predetermined height by a large number of air levitation modules 210.

  That is, as shown in FIGS. 1 and 2, a large number of air levitation modules 210 are arranged on the apparatus main body 220 so as to be spaced apart from each other in parallel and have a predetermined substrate loaded on the upper surface thereof. It plays a role of raising the height.

  Therefore, a large number of through holes 211 are formed on the surface of the air levitation module 210. The air provided from the apparatus main body 220 side is discharged through the large number of through holes 211, whereby the substrate can be floated to a predetermined height. Referring to the drawing, six air levitation modules 210 are provided on the apparatus main body 220, but the number of these does not limit the scope of rights of the present invention. Further, the spacing between the air levitation modules 210 is not necessarily equal.

  The gripping and transferring unit 100 is provided in a selected region among the regions between the air levitation modules 210. In the case of this embodiment, one gripping transfer unit 100 is provided in the central region of the air levitation module 210 in a state parallel to the air levitation module 210, but this is not necessarily the case.

  The gripping and transferring unit 100 is in direct contact with the substrate lifted by a predetermined height by the air levitation module 210 and plays a role of substantially transferring the substrate. The gripping and transporting unit 100 has an air flow space 111 inside. The unit main body 110 is formed, and the forced transfer belt 120 is provided.

  Compared to the unit main body 110 being a portion fixed at the position, the forcible transfer belt 120 is substantially in direct contact with the substrate and serves to transfer the substrate. The forced transfer belt 120 is coupled to the unit main body 100 at the upper portion of the unit main body 100 so as to be relatively movable along the substrate transfer direction.

  A number of vacuum holes 121 communicating with the air flow space 111 of the unit main body 100 are formed on the surface of the forced transfer belt 120 for vacuum suction of the substrate. The many vacuum holes 121 are arranged at equal intervals along the longitudinal direction of the forced transfer belt 120, but are not necessarily equal intervals.

  In connection with the operation of the vacuum hole 121, the forced transfer belt 120 of the gripping transfer unit 100 whose surface is flush or lower than the air levitation module 210 has a predetermined height from the air levitation module 210. Further, in order to contact the lower surface of the floating substrate and vacuum-suck the substrate, the gripping and transporting unit 100 must be up so that the forced transfer belt 120 contacts the lower surface of the substrate during the transfer operation.

  For this, an up / down driving unit 140 connected to the gripping and transporting unit 100 and driving the gripping and transporting unit 100 up / down is further provided. That is, when the substrate transfer operation proceeds in the standby state as shown in FIG. 5, the gripping transfer unit 100 is further raised from the air floating module 210 by the up / down driving unit 140 as shown in FIG. A belt 120 is used to suck and support the substrate. Such an up / down driving unit 140 can be applied by a cylinder, a linear motor, or the like.

  Such a forced transfer belt 120 has a closed loop shape like a normal conveyor belt, but the gripping transfer unit 100 is shown in FIG. 7 so that the substrate is forcibly transferred while the forced transfer belt 120 rotates. As described above, the drive pulley 131 disposed inside one side of the forced transfer belt 120, the driven pulley 132 disposed inside the other side of the forced transfer belt 120, and the forced transfer belt coupled to the drive pulley 132. And a drive motor 133 that provides 120 rotational power.

  A vacuum slot 112 is formed on the upper surface of the unit main body 110 to communicate with a number of vacuum holes 121 formed in the forced transfer belt 120. The vacuum slot 112 is formed in a stepped portion 114 that is stepped downward from the upper surface of the unit body 110. An air circulation passage 113 is formed on the lower surface of the unit main body 110 facing the vacuum slot 112.

  In the case of the present embodiment, as shown in FIG. 3, the air flow space 111 in the unit main body 110 is partitioned into a number of zones Z1, Z2, and Z3 (zones) in which a vacuum is formed individually. However, the vacuum slot 112 is formed on the upper surface of the unit body 110 corresponding to each of the zones Z1, Z2, and Z3.

  In this way, the air flow space 111 in the unit main body 110 is formed in a number of zones Z1, Z2, and Z3 in which vacuums are individually formed, and each one corresponds to each of the zones Z1, Z2, and Z3. When the vacuum slot 112 is divided and formed, even if a leak occurs in one zone Z1, Z2, and Z3, a vacuum can be provided through the other zone Z1, Z2, and Z3. Therefore, it is possible to prevent a phenomenon in which the vacuum transfer between the forced transfer belt 120 and the substrate is released and the transfer of the substrate fails.

  However, since the scope of the present invention need not be limited to this, unlike FIG. 3, the vacuum slot 112 is continuously formed on the upper surface of the unit body 110 along the longitudinal direction of the forced transfer belt 120. In addition, the air flow space 111 in the unit main body 110 does not necessarily have to be formed in the multiple zones Z1, Z2, and Z3 in which the vacuum is individually formed.

  As a result, when a vacuum pump (not shown) arranged inside the apparatus main body 220 is operated, it passes through the vacuum hole 121 and the vacuum slot 112 outside the vacuum hole 121 as indicated by the arrow in FIG. Thus, a vacuum is formed on the air flow space 111 and the air circulation passage 113 side in the unit main body 100, so that the substrate is adsorbed by the vacuum on the surface of the forced transfer belt 120. If the experiment is actually carried out, even if it is a huge 11th generation substrate having a horizontal / vertical length of 3 m inside / outside, the vacuum suction force by the forced transfer belt 120 is strong, so that the substrate can be transferred at high speed. It was confirmed that it was not impossible.

  The operation of the substrate transfer apparatus having such a configuration will be described with reference to FIG.

  First, when the substrate to be transferred is supplied to the substrate transfer apparatus of the present embodiment, air provided from the apparatus main body 220 side simultaneously with the through holes 211 formed on the surface of the air levitation module 210. By being discharged, the substrate floats up to a predetermined height in a state as shown in FIG.

  When the substrate is lifted, the gripping transfer unit 100 is operated. That is, as shown in FIG. 5, the gripping / transfer unit 100 whose upper surface is the same as the upper surface of the air levitation module 210 or is placed slightly lower is waiting for the up / down drive unit as shown in FIG. 6. By the operation 140, the air levitation module 210 is further raised, and the forced transfer belt 120 is used to bring the substrate into contact with the lower surface.

  Subsequently, when a vacuum pump (not shown) disposed inside the apparatus main body 220 is operated, the vacuum hole 121 and the vacuum slot 112 are passed outside the vacuum hole 121 as indicated by the arrow in FIG. By forming a vacuum on the air flow space 111 and the air circulation passage 113 side in the unit main body 100, the substrate is adsorbed by the vacuum on the surface of the forced transfer belt 120 (see FIG. 7B).

  If the forced transfer belt 120 sucks the substrate in vacuum, the drive motor 133 is operated to rotate the forced transfer belt 120 wound in a closed loop around the drive pulley 132 and the driven pulley 132, thereby causing the air floating module 210 to rotate. The substrate already lifted to a predetermined height can be transferred by the forced transfer belt 120 as shown in FIG.

  As described above, according to the present embodiment, since it is possible to manufacture with only a simple configuration of the air levitation module 210 and the gripping transfer unit 100 without using expensive parts such as magnets as in the prior art, There is an advantage that the substrate transfer apparatus can be manufactured at a much lower cost.

  In addition, the structure is such that the substrate lifted by the air levitation module 210 is transferred while being forcedly moved by the forced transfer belt 120 of the gripping transfer unit 100, thereby reducing noise and particle generation, There is an advantage that the transfer speed can be much faster than that of the prior art, and high-speed transfer to the substrate is possible. As described above, if high-speed transfer to the substrate is possible, the processing speed of various processes for the substrate can be increased so much that it can contribute to improvement in yield and productivity.

  In the case of the present embodiment, since the substrate is transferred in a state of being lifted by the air levitation module 210, the substrate is moved while being transferred by a roller (not shown) or rotating during the transfer of the substrate. It is possible to prevent a phenomenon in which a shaft (not shown) or the like collides and is damaged.

  8 is a schematic cross-sectional view of a gripping transfer unit in a substrate transfer apparatus according to a second embodiment of the present invention, FIG. 9 is a cross-sectional view of the operating state of FIG. 8, and FIG. It is a principal part enlarged view.

  The gripping and transporting unit 100a of the present embodiment has the same function as the gripping and transporting unit 100 of the above-described embodiment, but has a slightly different configuration.

  To explain this, first, the form of the unit main body 110a is different. Of course, the form of the unit main body 110a does not limit the scope of rights of the present invention, but the unit main body 110a in the form of the present embodiment can be easily manufactured by extrusion molding or the like. An assembly part 110b or the like for assembling with another apparatus can be formed on the side part, which can increase convenience in assembling the transfer apparatus.

  In the case of the gripping transfer unit 100a of the present embodiment, a vacuum pad 151 is provided on the surface of the forced transfer belt 120 to substantially contact and support the lower surface of the substrate while preventing the generation of scratches on the substrate.

  As shown, the vacuum pad 151 may be separately manufactured and bonded to the surface of the forced transfer belt 120, or a coating film may be applied to the surface of the forced transfer belt 120. Also good. In any case, the surface of the forced transfer belt 120 must be formed with communication holes 152 that communicate with a number of vacuum holes 121 formed in the forced transfer belt 120, so that the communication holes 152 and the vacuum holes 121 are formed. And the flow of the air through the air circulation line 153 mentioned later is formed, and a board | substrate can be adsorb | sucked in a vacuum.

  On the other hand, in order to maximize the vacuum efficiency by the gripping and transporting unit 100a, in other words, only in one region of the gripping and transporting unit 100a in which the substrate is substantially contacted and supported on the gripping and transporting unit 100a provided long along the process line. A check valve 154 is further provided in the gripping transfer unit 100a of this embodiment in order to solve the loss or vacuum leak problem caused by forming a vacuum and forming a vacuum up to unnecessary portions.

  The check valve 154 is coupled to the area of the communication hole 152 of the vacuum pad 151 and serves to selectively open and close the flow of vacuum through the communication hole 152 based on the contact of the substrate with the surface of the vacuum pad 151. .

  Such a check valve 154 includes a shaft portion 154 a arranged in the vertical direction from the region of the communication hole 152, and a head portion provided so as to be exposed on the surface of the vacuum pad 151, forming an upper end portion of the shaft portion 154 a. 154b, a hole opening / closing portion 154c that is provided at a lower end portion of the shaft portion 154a facing the head portion 154b, and selectively opens and closes a section of the communication hole 152, and is coupled to the shaft portion 154a to vacuum the head portion 154b. And an elastic member 154d that urges the pad 151 in the direction exposed on the surface. As shown, the hole opening / closing part 154c can be applied as a ball type, and the elastic member 154d can be applied as a compression spring, but this is not necessarily the case.

  Thus, as shown in FIG. 8, the substrate is contacted and supported on the surface of the vacuum pad 151 and provided on the vacuum pad 151 as shown in FIGS. 9 and 10 in a state where the substrate is not in contact with the surface of the vacuum pad 151. If the head portion 154b of the check valve 154 is pressurized, the head portion 154b, the shaft portion 154a, and the hole opening / closing portion 154c are lowered downward by the weight of the substrate to be opened to one section of the communication hole 152 of FIG. An air flow like an arrow is formed. Therefore, the substrate is sucked and supported on the surface of the vacuum pad 151. In this case, the elastic member 154d is in a compressed state.

  However, as shown in FIG. 8, if the substrate is separated from the surface of the vacuum pad 151, the compressed elastic member 154d is expanded into the original shape, thereby causing the head portion 154b, the shaft portion 154a, and the hole opening / closing portion 154c. Therefore, the hole opening / closing part 154c shields one section of the communication hole 152, so that the air flow is blocked.

  By applying the check valve 154 having such a structure and operation to the vacuum pad 151 and forming a vacuum only in a state where the substrate is substantially in contact, a vacuum is unnecessarily formed as described above. Therefore, it is possible to effectively solve the loss problem due to the above and the vacuum leak problem.

  In the present embodiment, the vacuum pad 151 is made of ultra high molecular weight polyethylene (UHMW-PE, Ultra High Molecular Weight-PolyEthylene) material, and the check valve 154 is made of a peak material. The matter does not limit the scope of rights of the present invention. For example, the vacuum pad 151 can be made of fluorine rubber or the like.

  The gripping transfer unit 100a of the present embodiment is provided in the unit main body 110a so as to cover the upper regions on both sides of the forcible transfer belt 120 with the forcible transfer belt 120 interposed therebetween. Further provided is a scattering prevention shield 155 for preventing scattering.

  The scattering prevention shield 155 may be separately manufactured and coupled to the unit main body 110a, or the scattering prevention shield 155 may be integrally formed when the unit main body 110a is manufactured as in the present embodiment. .

  However, since the scattering prevention shield 155 must be brought into contact with the lower surface of the substrate in forming such a scattering prevention shield 155, the height H1 of the upper end portion of the scattering prevention shield 155 is set to a vacuum pad. It must have a position lower than 151 surface H2. If the vacuum pad 151 is not provided in the first embodiment, the height H1 of the upper end of the scattering prevention shield 155 must be lower than the surface of the forced transfer belt 120.

  In the case of the gripping and transferring unit 100a of this embodiment, a filter (not shown) is further provided in the region of the air circulation line 153. Thus, if a filter is provided in the area of the air circulation line 153, the environment of the work space can be kept clean, and the air sucked by the gripping transfer unit 100a can be circulated to the side of the air floating module 210. For reuse, it is advantageous because foreign substances in the air can be removed. For reference, a blower for sucking air is provided at the rear end of the air circulation line 153, but it is sufficient if a filter is removably assembled at the inlet end of such a blower.

  FIG. 11 is a plan view of a substrate transfer apparatus according to a third embodiment of the present invention.

  In the first embodiment described above, one gripping transfer unit 100 is provided between the six air levitation modules 210 along the substrate transfer direction.

  As described above, the gripping and transporting unit 100 may be provided in one region (a central region or an end region) among a plurality of air levitation modules 210, or a plurality of gripping / transfer units 100 may be provided. May be.

  However, when the distance to which the substrate has to be transferred is long, the air levitation module 210 and the grip transfer unit 100 cannot be manufactured without limitation. The gripping and transporting unit 100 is normally used by being assembled along the X-axis direction, which is the direction in which the substrate is transported. In this case, the gripping and transporting unit (not shown) is aligned along the X-axis direction. As shown in FIG. 11, the gripping and transporting unit 100b is arranged in a zigzag manner between the air levitation modules 210 and then arranged along the X-axis direction.

  In the latter case, as shown in FIG. 11, it is desirable that there are overlapping sections O that overlap each other along the Y-axis direction between the gripping and transporting units 100 b arranged in a zigzag manner. The problem of substrate breakage that can be caused during the transfer of the substrate can be solved. Of course, the overlapping section O does not necessarily have to exist.

  FIG. 12 is a partial perspective view of a gripping transfer unit in a substrate transfer apparatus according to a fourth embodiment of the present invention, and FIG. 13 is an exploded perspective view of FIG.

  As shown in these drawings, the gripping and transporting unit 100c of the present embodiment has the same function and role as the gripping and transporting units 100, 100a, and 100b of the above-described embodiment, but the structure is partially different. Is provided. In particular, the gripping and transporting unit 100c of the present embodiment is similar in structure to the gripping and transporting unit 100a of the second embodiment described above, so that it will be described based on the gripping and transporting unit 100a of the second embodiment. To do.

  First, in the case of the gripping and transferring unit 100c of this embodiment, the vacuum pad 151 is provided in the same manner as the gripping and transferring unit 100a of the second embodiment, but the upper part of the vacuum pad 151 is different from that of the second embodiment. Further, a mounting support blade 151a is further provided.

  The placement support blade 151a is a portion where the substrate is substantially placed and supported, and is made of an elastic material having elasticity while the inner surface is formed in a concave shape so as to increase the contact area with the substrate. The

  As described above, when the placement support blade portion 151a is provided, even if the substrate cannot be placed in a completely horizontal state on the surface of the placement support blade portion 151a, it is elastic even if it is placed slightly tilted. The mounting support blade portion 151a made of material can be mounted and supported while being deformed correspondingly, and the phenomenon of leakage between the substrate and the substrate can be reduced.

  In the case of this embodiment, while considering the efficiency, the mounting support blade 151a is manufactured in a substantially elliptical shape, and the internal communication hole 152b is formed as a long hole, but the scope of rights of the present invention is limited to this. There is no need to be restricted.

  In the gripping and transferring unit 100c of this embodiment, a vacuum is formed only in one region of the gripping and transporting unit 100c in which the substrate is contact-supported in the region of the vacuum pad 151, and a vacuum is formed to an unnecessary portion. Although the check valve 154 is provided as a means for solving the loss or vacuum leak problem caused by the above, the structure and function of the check valve 154 are the same as those of the second embodiment, and therefore will be described here. Is omitted.

  On the other hand, in the present embodiment, a pair of rails 115 are formed on the surface of the unit main body 110c so as to be spaced apart from each other and protrude in parallel, and on the inner surface of the forced transfer belt 120c, the pair of rails 115 are formed. A number of rail blocks 125 that are in contact with the surface of the unit main body 110c on the outside are formed.

  As the pair of rails 115 and the plurality of rail blocks 125 mesh with each other, the forcible transfer belt 120c is forcibly transferred to the unit body 110c while rotating.

  With such a structure, a side suction portion 126 for sucking air around the gripping transfer unit 100c is further formed between the multiple rail blocks 125 of the forced transfer belt 120c. The side suction portion 126 is naturally formed between the multiple rail blocks 125 by manufacturing the multiple rail blocks 125 in a concavo-convex shape. There is an advantage that foreign matters and particles that can be generated during transfer can be sucked into the unit main body 110c and discharged to the outside of the apparatus.

  FIG. 14 is a schematic perspective view of a transfer device according to a fifth embodiment of the present invention.

  Referring to this drawing, the substrate transfer apparatus 1 according to the present embodiment is a vertical substrate transfer apparatus 1. Such a substrate transfer apparatus 1 has a vertical type, that is, a gripping transfer unit 100 for gripping at least one region of a substrate standing on the ground and forcibly transferring the substrate, and a gripping transfer unit 100. And an auxiliary transfer unit 200 disposed adjacently and supporting the substrate in a transferable manner.

  For reference, the meaning of being erected with respect to the ground means that the substrate is disposed obliquely at an angle of about 80 ° with respect to the ground, but this is not necessarily the case.

  The specific structures of the gripping transfer unit 100 and the auxiliary transfer unit 200 are replaced with the above description described with reference to FIGS.

  On the other hand, unlike the horizontal substrate transfer apparatus described in the first to fourth embodiments, in the case of the substrate transfer apparatus 1 of the present embodiment, as described above, the substrate is approximately 65 ° to 75 °. If the gripping and transporting unit 100 is released from operation due to an abnormality, in other words, if the gripping and transporting unit 100 cancels gripping of the substrate, the substrate is transferred to the substrate. Because it can be crashed on the route, there is a risk of loss and safety accidents.

  Thereby, in this embodiment, in order to prevent such a phenomenon, the fall prevention unit 300 is provided as shown in FIG.

  Although the fall prevention unit 300 can be embodied in various forms, the fall prevention unit 300 applied in the present embodiment includes a contact support roller 310 on which a lower end portion of a substrate arranged in a vertical shape is contacted and supported. , A roller support bracket 320 that supports the contact support roller 310, and an actuator 330 that is coupled to the roller support bracket 320 and moves the contact support roller 310 and the roller support bracket 320 by a predetermined distance.

  Since the contact support roller 310 is a portion where the substrate that has been dropped by a predetermined distance is contact-supported, the contact support roller 310 may be made of a material that does not damage the substrate, such as silicon or urethane, and has a certain elasticity. desirable. In the case of FIG. 14, since it is a side view, it seems that one contact support roller 310 is shown. Are provided.

  The actuator 330 that can be applied as a cylinder is selectively operated to raise the contact support roller 310 and the roller support bracket 320 and return the substrate to the original position again as the substrate crashes.

  According to such a structure, the substrate and the contact support roller 310 are normally spaced apart from each other by a certain distance, for example, several to several tens of millimeters. When the operation is released, in other words, when the gripping and transporting unit 100 releases the grip of the substrate, the substrate is supported by the contact support roller 310 having elasticity even if the substrate starts to fall on the path. Because it can be contacted, it is not damaged. If the contact support roller 310 prevents the crash, the actuator 330 can be selectively operated to raise the contact support roller 310 and the roller support bracket 320 and return the substrate to the original position again as the substrate crashes. It ’s fine.

  On the other hand, in the present embodiment, the fall prevention unit 300 having the above-described structure is used. However, unlike the above-described structure, the lower end portion of the vertically arranged substrate is partially accommodated. However, it is also possible to use a V block (not shown) that is supported. That is, when the V block is used in this way, even if the transfer unit 100 releases the grip of the substrate due to an abnormal cause under various conditions such as during the transfer of the substrate or during the preparation for the transfer, the substrate becomes the V block. Since it can be supported while being housed, the occurrence of loss and safety accidents can be eliminated.

  FIG. 15 is a side view of a substrate transfer apparatus according to a sixth embodiment of the present invention.

  As described above, the substrate transfer apparatus 1a according to the present embodiment is a device that transfers a substrate in a state where the substrate is set up, that is, in a state where the substrate is set up inside or outside approximately 80 °. In other words, it is used in conjunction with a tilting unit 400 for tilting the substrate. For this purpose, a tilting unit 400 is proposed.

  As shown in FIG. 15, the tilting unit 400 of the present embodiment is coupled to a cylinder body 410 whose one end is pivotally supported by the outer frame 221 and to the cylinder body 410 so that the length can be extended and reduced. A cylinder rod 420 having an end rotatably connected to the apparatus main body 220 may be included. In other words, the tilting unit 400 of the present embodiment is applicable as a pneumatic or hydraulic pressure, or a hydraulic / pneumatic compound cylinder.

  When the tilting unit 400 having such a structure is applied, the apparatus main body 220 supporting the gripping transfer unit 100 and the auxiliary transfer unit 200 is moved approximately 80 ° inside and outside, as indicated by a two-dot chain line in FIG. Therefore, there is no difference in that there is an advantage that the efficiency of substrate transfer can be improved by overcoming the limitations of manual work.

  16 is a schematic perspective view of a substrate transfer apparatus according to a seventh embodiment of the present invention, and FIG. 17 is a cross-sectional view taken along line AA of FIG.

  As shown in these drawings, the substrate transfer apparatus according to the present embodiment includes an air levitation module 510 in which a number of air injection holes H through which air for levitation of the substrate is injected are formed, and an air levitation module. And a substrate protective layer 550 provided on the surface of the module 510 to protect the substrate.

  As shown in FIG. 1, the air floating module 510 has a bowl shape having a certain space so that air is injected into the air floating module 510.

  In the present embodiment, the air levitation module 510 is manufactured in a rectangular bowl shape, but the shape of the air levitation module 510 need not be limited to the drawing. Although not shown in the drawings, the air levitation module 510 further includes means for supplying air to the air injection holes H of the air levitation module 510, such as an air injection pump, a motor, or a nozzle. Combined.

  A large number of air injection holes H are formed in the upper wall 511 forming the surface of the air levitation module 510. Many air injection holes H are provided in the upper wall 511 of the air levitation module 510 as a circular form. Although a large number of air injection holes H are shown in the drawing, an infinite number of fine air injection holes H that are extremely small in diameter and very small in diameter are formed to be difficult to count in an actual product.

  The substrate protective layer 550 is provided on the surface of the air injection hole H and plays a role of protecting the substrate. Since the air levitation module 510 is made of a metal material, when the substrate is lifted using only the air levitation module 510 without the substrate protection layer 550, the air levitation module 510 is not lifted. The glass substrate may come into contact with the surface of the air levitation module 510 and be damaged. Therefore, by providing a substrate protective layer 550 on the surface of the air levitation module 510 in such a case, damage to the substrate that is not obvious is prevented.

  The substrate protective layer 550 is selected from materials that do not scratch or damage the substrate even if the substrate is in contact with the substrate. In this embodiment, the coating applied to the surface of the air floating module 510 is used. Provided in layers. That is, the substrate protective layer 550 can be easily manufactured by applying and curing a coating liquid made of a substance such as urethane on the surface of the air floating module 510 by a spraying method or a roll coating method.

  On the other hand, the substrate protective layer 550 communicates with the air injection hole H of the air levitation module 510, but is expanded to be relatively larger than the size of the air injection hole H, that is, the diameter. An expansion hole 551 is formed to increase the air injection cross-sectional area from H to the substrate.

  The expansion hole 551 can be easily manufactured by applying a coating layer as the substrate protective layer 550 on the surface of the air levitation module 510 and then drilling the coating layer.

  As described above, the expansion hole 551 is expanded relatively larger than the size of the air injection hole H, and serves to increase the injection cross-sectional area of the air from the air injection hole H toward the substrate. In the case of the present embodiment, one expansion hole 551 is arranged corresponding to each of the air injection holes H.

  In this way, one expansion hole 551 per air injection hole H is formed in the substrate protective layer 550. By forming the expansion hole 551 larger than the air injection hole H, the floating of the substrate is increased. Therefore, the air jetted through the air jet hole H is directed toward the substrate while being expanded in the expansion hole 551, that is, expanded. If such a structure is formed in every air injection hole H, in order to provide an effect that the injection cross-sectional area of air directed toward the substrate increases so much, even if the capacity of the motor is not significantly increased as in the prior art, The efficiency of floating the substrate can be increased as compared with the conventional case.

  On the other hand, in FIG. 17, the air movement path is indicated by an arrow. However, if the air does not flow flexibly as shown by the arrow in FIG. The levitation efficiency may be reduced.

  In order to prevent such a phenomenon, the air injection hole H of the present embodiment is provided so that the opening area gradually increases toward the expansion hole 551. With such a structure, the air directed from the air injection hole H toward the expansion hole 551 is easily flowed without vortex and used to float the substrate.

  As described above, according to the present embodiment, it has a simple and simple structure, and can increase the efficiency of floating the substrate without a significant increase in motor capacity compared to the conventional case. In particular, if the floating efficiency of the substrate is increased, it is advantageous to transfer the substrate so much, and as a result, the substrate can be transferred at high speed. The high-speed transfer with respect to the substrate will be described in detail in the following embodiment.

  18 is a schematic perspective view of a substrate transfer apparatus according to an eighth embodiment of the present invention, and FIG. 19 is a cross-sectional view taken along line BB of FIG.

  Referring to these drawings, the air levitation module 520 of the substrate transfer apparatus according to the present embodiment also has a number of air injection holes H formed in the upper wall 521 forming the surface thereof. This is the same as the seventeenth embodiment.

  However, in the case of this embodiment, the form of the expansion hole 561 formed in the substrate protective layer 560 that is applied to the surface of the air floating module 520 and protects the substrate is different from the embodiment of FIG.

  In the present embodiment, the expansion holes 561 formed in the substrate protective layer 560 are provided in a large number of unit expansion holes 561 that are arranged corresponding to each of the large number of air injection holes H. That is, in the case of this embodiment, one unit expansion hole 561 is provided for each of the nine air injection holes H.

  In such a case, the air injected through the air injection holes H for the floating of the substrate is directed to the substrate while the injection cross-sectional area is further increased in the expansion hole 551, that is, expanded. Even if the motor capacity is not significantly increased as in the prior art, the efficiency of floating the substrate can be increased as compared with the prior art.

  One unit expansion hole 561 per nine air injection holes H shown in the drawings of the present embodiment is one embodiment, and such matters do not limit the scope of rights of the present invention.

  FIG. 20 is a partial plan view of a substrate transfer apparatus according to a ninth embodiment of the present invention.

  Referring to this drawing, in the substrate transfer apparatus according to the present embodiment, a plurality of air injection holes H are formed on the substrate protection layer 570 applied to the surface of the air levitation module 530 as the embodiment of FIG. A large number of unit expansion holes 571 (see a circular dotted line) are formed correspondingly one by one. The unit expansion holes 571 are formed in groups of zones (Z1, Z2). , Z3 ...). In other words, in FIG. 20, a large number of unit expansion holes 571 arranged one by one for each of the nine air injection holes H are also arranged in groups of three zones (Z1, Z2, Z3...). Partitioned. In such a case, the unit expansion hole 571 indicated by a circular dotted line in FIG. 20 does not appear in an actual product.

  In the present embodiment, the partition direction for partitioning a large number of unit expansion holes 571 is a direction that intersects the longitudinal direction of the air levitation module 530 that is the substrate transfer direction. Can also be done.

  As described above, when a large number of unit expansion holes 571 are divided into group unit zones (Z1, Z2, Z3,...) As needed, the cross-sectional area of the air directed toward the substrate can be further increased. In addition to the advantages, the air jet flow in each zone (Z1, Z2, Z3...) Can be selectively turned on / off to reduce power consumption. . That is, in the case shown in FIG. 20, only the air in the zone (Z1, Z2, Z3...) Region where the substrate is substantially arranged and transferred is injected, and the rest is controlled to block the air flow. Therefore, the amount of power consumption due to air injection can be reduced so much.

  Even if it seems to be this embodiment, it has a simple and simple structure, can increase the efficiency of floating the substrate without significantly increasing the motor capacity compared to the conventional one, and can transfer at a high speed to the substrate. There is no problem in providing the effect of the present invention.

  FIG. 21 is a perspective view of a substrate transfer apparatus according to a tenth embodiment of the present invention.

  As shown in this drawing, the substrate transfer apparatus according to the present embodiment includes a plurality of air jet modules 540 for levitating the substrate and at least one region of the substrate arranged horizontally, that is, parallel to the ground. And a gripping transfer unit 100 for forcibly transferring the substrate.

  The multiple air injection modules 540 are different from the air injection modules 510, 520, and 530 described in the above-described embodiments only in the form or size, and the functions and roles are the same. That is, the substrate protection layer 580 is formed on the surface of the air injection module 540, and the expansion hole 581 formed in the substrate protection layer 580 is formed larger than the air injection hole H formed on the surface of the air injection module 540. . Further, the expansion holes 581 are arranged corresponding to each of the large number of the air injection holes H. If a large number of air injection modules 540 are provided in such a form and the substrate is levitated through this, the substrate can be levitated effectively at a desired height and without using a large-capacity motor as in the prior art. It can be made. As shown in the drawing, six air levitation modules 540 are provided on the apparatus main body 501, but the number of these does not limit the scope of rights of the present invention. Further, the spacing between the air levitation modules 540 is not necessarily equal.

  The gripping transfer unit 100 plays a role of substantially transferring the substrate lifted by the multiple air jet modules 540. Such a gripping transfer unit 100 is provided in a region selected from among the regions between the air levitation modules 540. In the case of the present embodiment, one gripping transfer unit 100 is provided in the central region of the air levitation module 540 in a state parallel to the air levitation module 540, but this is not necessarily the case. Meanwhile, a series of structures, roles, and functions for the gripping and transporting unit 100 can be substituted for the description of the above-described embodiment described with reference to FIGS.

  As described above, it is obvious to those skilled in the art that the present invention is not limited to the above-described embodiments, and can be variously modified and changed without departing from the spirit and scope of the present invention. Therefore, it should be understood that such modifications or variations fall within the scope of the claims of the present invention.

  The present invention is applicable to a technical field related to a substrate transfer apparatus.

Claims (32)

A gripping transfer unit for gripping at least one region of the substrate arranged parallel to the ground and forcibly transferring the substrate;
An auxiliary transfer unit that is arranged adjacent to the gripping transfer unit and supports the substrate in a transferable manner;
A substrate transfer apparatus comprising: A gripping and transporting unit for gripping at least one region of the substrate standing on the ground and forcibly transporting the substrate;
An auxiliary transfer unit that is arranged adjacent to the gripping transfer unit and supports the substrate in a transferable manner;
A substrate transfer apparatus comprising:   A fall prevention unit which is provided in a lower region of the substrate arranged in a vertical type and prevents the fall of the substrate on the path when the grasping and transferring unit releases the grasp of the substrate; The substrate transfer apparatus according to claim 2, wherein: The crash prevention unit is
A contact support roller in which a lower end portion of the substrate disposed in a vertical mold is contact-supported, and
A roller support bracket for supporting the contact support roller;
An actuator coupled to the roller support bracket to operate the contact support roller and the roller support bracket by a predetermined distance;
The substrate transfer apparatus according to claim 3, comprising: An apparatus main body for supporting the gripping transfer unit and the auxiliary transfer unit;
A tilting unit that is partially connected to the device body and tilts the device body;
The substrate transfer apparatus according to claim 2, further comprising: The tilting unit is
A cylinder body whose one end is pivotally supported by the outer frame;
A cylinder rod coupled to the cylinder body so as to extend and contract in length and having an end portion rotatably connected to the apparatus body;
The substrate transfer apparatus according to claim 5, comprising: An air levitation module in which a number of air injection holes through which air for levitation of the substrate is injected are formed in the surface;
A substrate protection layer provided on a surface of the air levitation module for protecting the substrate;
The substrate protective layer communicates with the air injection hole of the air levitation module, but is expanded relatively larger than the size of the air injection hole, and air injection from the air injection hole toward the substrate is performed. An extended hole for increasing a cross-sectional area is formed. The expansion hall is
8. The substrate transfer apparatus according to claim 7, wherein each of the air injection holes is arranged correspondingly. The expansion hall is
8. The substrate transfer apparatus according to claim 7, wherein a plurality of unit expansion holes are arranged corresponding to each of the plurality of air injection holes. The air injection hole is
The substrate transfer apparatus according to claim 7, wherein an opening area is gradually increased toward the expansion hole. The air levitation module is made of a metal material, the substrate protection layer is provided with a coating layer,
8. The substrate transfer apparatus of claim 7, wherein the expansion hole is manufactured by applying the coating layer to a surface of the air levitation module and then drilling the coating layer. The air levitation module including the substrate protection layer is a plurality of air levitation modules spaced apart from each other and arranged in parallel.
A plurality of air levitation modules are provided in at least one of the regions, and the substrate is lifted by the plurality of air levitation modules so that the region is brought into contact with the surface of the substrate to force the substrate. The substrate transfer apparatus according to claim 7, further comprising a gripping transfer unit that is moved to the position. The auxiliary transfer unit is a non-contact non-contact auxiliary transfer unit that separates the substrate by a predetermined distance by at least one air levitation module;
3. The substrate transfer apparatus according to claim 1, wherein the holding transfer unit holds at least one region of the substrate separated by a predetermined distance by the auxiliary transfer unit and forcibly transfers the substrate. The auxiliary transfer unit is provided by a number of air levitation modules spaced apart and arranged in parallel,
The substrate transfer apparatus according to claim 13, wherein the gripping and transferring unit is provided in at least one of the regions between the plurality of air levitation modules. The gripping transfer unit is
A unit body in which an air flow space is formed;
A plurality of vacuums are coupled to the unit main body at the upper portion of the unit main body so as to be movable relative to the unit main body along the transfer direction of the substrate, and communicate with the air flow space of the unit main body for vacuum suction of the substrate. A forced transfer belt in which a hole is formed;
The substrate transfer apparatus according to claim 1, wherein the substrate transfer apparatus includes: On the upper surface of the unit body,
16. The substrate transfer apparatus of claim 15, wherein a vacuum slot is formed to communicate with the plurality of vacuum holes formed in the forced transfer belt. The vacuum slot is
17. The substrate transfer apparatus according to claim 16, wherein the substrate transfer device is divided into sections or continuously formed on the upper surface of the unit body along the longitudinal direction of the forced transfer belt. The air flow space in the unit body is:
The substrate transfer apparatus according to claim 15, wherein the substrate transfer apparatus is divided into a plurality of zones in which vacuums are individually formed.   A vacuum pad that is coupled to the surface of the forced transfer belt and substantially contacts and supports the lower surface of the substrate, and on the surface of which a communication hole is formed that communicates with a number of vacuum holes formed in the forced transfer belt; The substrate transfer apparatus according to claim 15, further comprising: The vacuum pad is
The substrate according to claim 19, further comprising a mounting support blade portion having an inner surface formed in a concave shape so as to increase a contact area with the substrate. Transfer device. The mounting support blade portion is made of an elastic material having elasticity,
21. The substrate transfer apparatus according to claim 20, wherein the communication hole is a long hole. A pair of rails are formed on the surface of the unit main body so as to be spaced apart from each other and project in parallel. The inner surface of the forced transfer belt is in contact with the surface of the unit main body outside the pair of rails. A number of rail blocks are formed,
16. The substrate transfer apparatus according to claim 15, further comprising a side suction part for sucking air around the gripping transfer unit between the plurality of rail blocks.   And a check valve coupled to the communication hole region of the vacuum pad and selectively opening and closing a flow of vacuum through the communication hole based on contact of the substrate with the surface of the vacuum pad. The substrate transfer apparatus according to claim 19. The check valve is
A shaft portion arranged in the vertical direction from the communication hole region;
A head portion that forms an upper end portion of the shaft portion and is provided so as to be exposed on a surface of the vacuum pad;
A hole opening / closing portion that is provided at a lower end portion of the shaft portion facing the head portion and selectively opens and closes a section of the communication hole;
An elastic member coupled to the shaft portion and biased in a direction in which the head portion is exposed to the surface of the vacuum pad;
The substrate transfer apparatus according to claim 23, comprising:   The vacuum pad according to claim 23, wherein the vacuum pad is made of ultra high molecular weight polyethylene (UHMW-PE, Ultra High Molecular Weight-PolyEthylene) material, and the check valve is made of a peak material. Substrate transfer device.   The gripping transfer unit is provided in the unit body in a form that covers upper regions on both sides of the forced transfer belt with the forced transfer belt interposed therebetween, and prevents scattering of particles generated during transfer of the substrate. The substrate transfer apparatus according to claim 15, further comprising a shield for the substrate. The upper end of the scattering prevention shield is
27. The substrate transfer apparatus according to claim 26, wherein the substrate transfer apparatus has a position lower than a surface of the vacuum pad. An air circulation line is further formed on one side of the unit body,
The substrate transfer apparatus according to claim 15, wherein a filter for removing foreign substances in the air discharged from the unit main body is further provided in a region of the air circulation line. The gripping transfer unit includes a number of unit transfer units arranged along the X-axis direction, which is a direction in which the substrate is transferred,
The substrate transfer apparatus of claim 15, wherein the plurality of unit transfer units are continuously arranged along the X-axis direction or arranged in a zigzag manner.   Between the plurality of unit transfer units arranged in the zigzag manner, an overlapping section that is overlapped along the Y-axis direction, which is a direction intersecting with the X-axis direction, is further provided. 30. The substrate transfer apparatus according to claim 29. The forced transfer belt has a closed loop shape,
The gripping transfer unit is
A driving pulley disposed inside one side of the forced transfer belt;
A driven pulley disposed inside the other side of the forced transfer belt;
A drive motor coupled to the drive pulley for providing rotational power of the forced transfer belt;
The substrate transfer apparatus according to claim 15, further comprising:   The substrate transfer apparatus according to claim 15, further comprising a driving unit coupled to the gripping and transporting unit to drive the gripping and transporting unit toward and away from the substrate to be transported.

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