201029098 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種基板傳送裝置《具體而言，本發明係關於一 種能減少噪音和粉塵顆粒’且與傳統結構相比更為先進，並能高 速傳送基板的基板傳送裝置。 【先前技術】 一般而言，基板包括：平面顯示器（flat panel display，FPD)基 板’例如電漿顯示面板（plasma display panel，PDP )、液晶顯示器 (liquid crystal display, LCD)、有機發光二極體（organic light emitting diode，OLED)基板或類似基板；以及半導體晶片/光罩玻 璃等。 平面顯示器的基板和半導體晶片在材料、用法等方面互不相 同’但在一系列製造程序上卻十分類似，例如是曝光、顯影、蝕 刻、剝離、漂洗、清潔等步驟。這些製造程序係需依次執行以製 造基板。以下，將透過舉例有代表性地描述用於平面顯示器中的 液晶顯不器的基板。 用於液晶顯示器的基板通常需經過薄膜電晶體（thin film transistor, TFT)製造程序、液晶盒製造程序以及模組製造程序， 在模組製造程序中使基板作為產品來出貨。 薄膜電晶體製造程序與半導體的製造程序十分類似，在薄膜電 晶體製程中，薄膜電晶體係經由重複沉積、微影及蝕刻步驟後而 排列在玻璃基板上。 201029098 在於液晶盒製造程序中，形成配向膜以之形成係有助於在薄膜 電晶體製造程序中將製造的後之薄膜電晶艎下板以及用以濾色的 之彩色濾光片上板之間的液晶分子對齊；再插入間隙子；並且印 刷封膠，以將上下板及下板接合。 在模組製造程序中，將偏光板固定並將驅動積體電路晶片 (integrated-chip, 1C)安裝在完整的液晶顯示器面板上，在面板上 裝配印刷電路板（printed circuit board, PCB )，在其背面設置背光 單元並連接元件。 為了依次執行這些上述製造程序以及其子次要製造程序，在這 些上述製造程序之間的之傳送線上設置基板傳送裝置，以便從前 道製造程序接收基板並接續將其傳遞給下一製造程序。舉例來說 例如’在模組製造程序中’執行偏光板貼附之製造程序係以將先 將貼附在偏光板用以保護偏光板的保護膜與偏光板分離後，並再 將其貼附到基板上。在執行偏光板諸製造程序的之偏光板貼附 裝置中，亦需要傳送基板的裝置。 已廣泛使用的基板傳送裝置大多是一種水平傳送裝置在此裝 置上水平放置並傳送基板。作為典楚的水平傳送裝置已知 送帶式傳送裝置和滚筒式傳送裝置。 ， 在基板傳送裝置中 扯*使用的澴同式傳送裝置包含接觸式 ^置和f接觸式傳送裝置。接觸式傳送襄置中，電動機與錦 :類似部件的組合用來驅動連接於滾筒的轉轴旋轉 傳送裝置中，係用磁鐵 接箱 201029098 生較少嗓音和微粒的優點。 然而’在利用磁鐵（即磁浮式）的傳統的非接觸式傳送裝置中， 傳送裝置的生產成本因磁鐵昂貴而增加。儘管利用昂貴的磁鐵亦 係採用磁浮傳送杨’卻仍難以按照製造程序要求來達到高速傳 送基板。此外’如果轉轴因承載基板而下垂，在基板傳送過程中， 基板的前端可能與鄰接轉軸的滾筒發生碰撞，於是基板可能受損。 例如，如 恿將褽造具有長度/寬度約為3米的第十一代基板201029098 VI. Description of the Invention: [Technical Field] The present invention relates to a substrate transfer apparatus "specifically, the present invention relates to a noise reduction and dust particle" and is more advanced than a conventional structure, and can A substrate transfer device that transports substrates at high speed. [Prior Art] In general, the substrate includes: a flat panel display (FPD) substrate, such as a plasma display panel (PDP), a liquid crystal display (LCD), and an organic light emitting diode. (organic light emitting diode, OLED) substrate or the like; and semiconductor wafer/mask glass and the like. The substrate of a flat panel display and the semiconductor wafer differ from each other in terms of materials, usage, etc., but are similar in a series of manufacturing procedures, such as exposure, development, etching, stripping, rinsing, cleaning, and the like. These manufacturing processes are sequentially performed to fabricate the substrate. Hereinafter, a substrate for a liquid crystal display in a flat panel display will be representatively described by way of example. The substrate used for the liquid crystal display usually has to pass through a thin film transistor (TFT) manufacturing process, a liquid crystal cell manufacturing program, and a module manufacturing program, and the substrate is shipped as a product in the module manufacturing process. The thin film transistor manufacturing process is very similar to the semiconductor fabrication process. In the thin film transistor process, the thin film electromorphic system is arranged on the glass substrate after repeated deposition, lithography, and etching steps. 201029098 In the manufacturing process of the liquid crystal cell, an alignment film is formed to form a thin film electroplated lower plate which will be manufactured in the thin film transistor manufacturing process, and a color filter upper plate for color filter. The liquid crystal molecules are aligned; the spacers are inserted; and the sealant is printed to bond the upper and lower plates and the lower plate. In the module manufacturing process, the polarizing plate is fixed and the integrated circuit chip (1C) is mounted on the complete liquid crystal display panel, and a printed circuit board (PCB) is mounted on the panel. A backlight unit is disposed on the back side and the components are connected. In order to sequentially perform these above-described manufacturing processes and their sub-manufacturing programs, a substrate transfer device is disposed on the transfer line between the above-described manufacturing processes to receive the substrate from the preceding manufacturing process and successively transfer it to the next manufacturing process. For example, the manufacturing process of performing the polarizing plate attachment in the module manufacturing process is to separate the protective film attached to the polarizing plate for protecting the polarizing plate from the polarizing plate, and then attach it. Onto the substrate. In a polarizing plate attaching apparatus that performs a manufacturing process of a polarizing plate, a device for transferring a substrate is also required. A substrate transfer apparatus which has been widely used is mostly a horizontal transfer apparatus which is horizontally placed on the apparatus and transports the substrate. As a standard horizontal conveying device, a belt conveyor and a drum conveyor are known. The 澴-type transfer device used in the substrate transfer device includes a contact type and a f-contact type transfer device. In the contact type transmission device, the combination of the motor and the brocade: similar components are used to drive the rotary shaft rotating conveyor connected to the drum, and the magnet socket 201029098 has the advantages of less noise and fine particles. However, in a conventional non-contact conveying apparatus using a magnet (i.e., a magnetic floating type), the production cost of the conveying apparatus is increased due to the expensive magnet. Despite the use of expensive magnets, it is also possible to achieve high-speed transfer of substrates in accordance with manufacturing procedures. Further, if the rotating shaft hangs due to the carrier substrate, the front end of the substrate may collide with the roller adjacent to the rotating shaft during the substrate transfer, and the substrate may be damaged. For example, if you are going to build an eleventh generation substrate with a length/width of about 3 meters
:=則入工作場所’就傳送如此大尺寸的基板至相應設 備裝置來說，滚筒或支撐基板之熟可能因基板 而當轉轴下垂時，於基 滾筒會發生碰揸，因而使基板受損中端與前-轉軸的 傳送的基㈣時下垂的問題需進行研究T、。…且止轉軸與高速 同時，與前述的水平傳送裝置相反，在 垂直地賢起(實際上’以大約州度角傾斜)而傳送。 在垂直傳送裝置巾，儘管基板的面積大小基本上十 板相同w豎起傳送，對設於潔淨室内有限空_裝置^， 面積。此外，在將基板垂直置起而傳送的情況下，在 ^起之基板兩側均可進行加卫，工作效率因此而提高。尤其 將偏光板附著在基板兩側的偏光板貼 更高效的利用。因此，，於垂直傳送裝置需= 多的研究。 特例 同時’在水平或垂直傳送裝置中的趟浮式傳送裝置的這一 5 201029098 中，為解決前述問題，即高速傳送基板，已提出一種將基板經由 空氣懸浮模組懸浮至確定高度後傳送的基板傳送裝置。 所提出的傳送裝置設有複數傳送基板的空氣懸浮模組，在提出 2傳送裝置内空氣懸浮模組的表面形成有複數用於喷射空氣的空 軋噴射孔和用於防止表面劃痕的塗佈層。塗佈層形成有複數連通 孔，每一連通孔都具有與空氣嘴射孔相同的尺寸且經由一對一對 應的方式與空氣喷射孔連通。所以，供應至空氣懸浮模組内的空 氣忒射到形成於空氣懸浮模組表面的空氣喷射孔，然後再經由形 成於塗佈層上的連通孔將空氣向外喷射，以將基板懸浮在確定高 度。 然而，在此種基板傳送装置中，電動機需要被提供有較大的額 又功率以使具有上述結構的空氣喷射孔喷射的空氣來懸浮基板。 板越大，電動機需要的額定功率也越大。如此，若電動機具有 大的額定功率來喷射懸浮基板的空氣，會引起很多複雜的問題。 、’β果，難以實際利用大額定功率的電動機。另一方面如果電動 的額疋功率不足以懸浮基板，基板便不能被懸浮在所需高度。 此需要一種更尚效的、與傳統電動機相比不増加電動機額定 功率的基板懸浮結構。 【發明内容】 立本發明之一目的，係提供一種基板傳送裝置，該裝置能減少噪 曰和微粒，且具有比傳統結構改良的結構，並且高速傳送基板。 發月之s目的，係提供一種基板傳送裝置，該裝置能減少 、裝置的佔用面積，減少蜂音和微粒，具有高效率的結構並且高 201029098 速傳送基板。 本發明之再 便且簡單㈣構Γ係提供—種基板傳料置，該裝置具有方 二比傳統結構顯著増加電動機額定功率就可 增強懸洋基板的效率’並高速傳送基板。 一根據本發明之—目的’提供—種基板傳送裝置，該裝置包含： Γ抓握和傳送單元，抓握平行於地面放置的基板的至少-部分區 ❹ 域並施力料騎；錢―輔助傳送單元，㈣抓握和傳送單元 並支援基板的傳送》 根據本發明之另_ 一抓握和傳送單元， 域並施力傳送基板； 並支援基板的傳送。 目的，提供一種基板傳送裝置，該裝置包含： 抓握垂直於地面放置的基板的至少一部分區 以及一輔助傳送單元，鄰近抓握和傳送單元 根據本發明之再—目的，提供-種基板傳送裝置，該裝置包含： •X·氣懸浮模組’其包含在其表面形成的複數空氣喷射孔’用來 © 嘴射基板懸浮用的空氣；以及—基板保護層，設置在空氣懸浮模 組的表面以保護基板，基板保護層包含與空氣懸浮模組的空氣喷 射孔連通賴大孔，該孔擴大到大於空氣切孔，以增加自喷射 孔朝向基板的空氣嘴射面積。 【實施方式】 為更充分的理解本發明之内容及優點，請參閱用於舉例說明本 發明的實施例的附圖。 以下參閱附圖來解釋本發明的實施例，詳細描述本發明。圖中 201029098 相同的附圖標記表示相同的部件。 第1圖為根據本發明第一具體實施例的傳送基板裝置的立體 圓；第2圏為第】圖的平面圖；第3囷為抓握和傳送單元的局部 分解立體圖；第4圖為抓握和傳送單元的剖面示意圖；第$圖和 第6圖為第i _剖面圖，分別表示抓握和傳送單元的操作；以 及第7圖中⑴到（C)示意表示第1圖中的基板傳送裝置的操 作。 、 如圖中所示，於本實施例中的基板傳送裝置是水平傳送裝置。 基板傳送裝置包含：—抓握和傳送單元刚抓握水平放置即及平 盯於地面的基板的至少—個區域並施力傳送基板；以及一輔助傳 送單疋2QG，鄰近抓握和傳送單元1GG而設置，支援基板的傳送。 首先’本實施例中的輔助傳送單元2〇〇設置成非接觸式辅助傳 送單元非接觸式辅助傳送單元利用複數空氣懸浮模組21〇將基 板懸浮在預定高度， 第1圖和第2圖所示，複數空氣懸浮模組210相互平行排列 在裝置主體220上，且以預定距離相互隔開，以將其上承載的基 板懸浮在預定高度。 &氣懸浮模組21〇在其表面形成有複數貫穿孔211。當自 裝置t體220供應的空氣經由複數貫穿孔211排出時，基板可懸 浮在預^高度°參_圖’在裝置主體22G上設有六個空氣懸淨 模組210，但不限於此。選擇性地，空氣懸浮模組210的數量也可 以不同此外，空氣懸浮模組之間的間隔距離也可以不一致。 8 201029098 在空氣懸浮模組210之間的區域中的所選區域中設置抓握和傳 送單元100。在本實施例中，在空氣懸浮模組21〇的中間與空氣懸 浮模組210平行地設置一個抓握和傳送單元1〇()，但不限於此。 抓握和傳送單元100直接接觸藉由空氣懸浮模組21〇而懸浮在 預定高度的基板，並實質用以傳送基板。抓握和傳送單元包 含在内部形成有空氣流動空間ill的單元主體u〇和施力傳送帶 120 ° Φ 單元主體U0固定在相應位置上，而施力傳送帶120實質上接 觸基板並傳送基板。施力傳送帶120與單元主體1〇〇連接成可沿 單元主體100上的基板傳送方向相對於單元主體1〇〇移動。 此外，施力傳送帶120在其表面形成有複數真空孔121，真空孔 121與主體100的空氣流動空間llli4通以用真空吸住基板。複數 真空孔121沿施力傳送帶120的長度方向以固定間隔排列，但不 限於此。選擇性地’複數真空孔121也可以不㈣的間隔排列。 〇 Μ於真空孔121之操作，抓握和傳送單元1GG在傳送操作中須 上移，以便在-個高度放置抓握和傳送單元11〇的施力傳送帶12〇 的表面，此高度等於或低於空氣懸浮模組21〇的高度，施力傳送 帶12〇的表面可接觸並用真空吸住自空氣懸浮模組21〇懸浮在預 定高度的基板的底面。 為此，另設有-個連接至並駆動抓握和傳送單元刚的上下移 動的上/下驅動單元140。亦即是，當抓握和傳送單元議開始自 如第5圖所示的待用狀態傳送基板時，上/下驅動單元刚驅動抓 9 201029098 握和傳送單元100上移到高於如第6圖所示的空氣懸浮模組210, 以便允許施力傳送帶ί2〇將基板吸住並支撐基板。此處，可將動 力缸艎、線性電動機或類似裝置可作為上/下驅動器14〇。 施力傳送帶120具有如一般傳送帶般的閉環形狀。如第7圖所 示，抓握和傳送單元100包含：一主動皮帶輪131，設置在施力傳 送帶120的一内側；一被動皮帶輪132，設置在施力傳送帶12〇 的另一内侧；以及一驅動電動機133,連接於主動皮帶輪131並驅 動施力傳送帶120旋轉，當施力傳送帶120旋轉時可施力傳送基 板0 單元主艘110在其頂面形成有複數真空狹縫112，以與形成在施 力傳送帶120上的複數真空孔121連通。真空狹縫112形成在單 元主體11〇的頂面四陷的平台U4 β。此外，空氣通風通道113 形成在與真空狹縫112相對的單元主體110的下方。 在本實施例中’如第3圖所示，在單元主體u〇内的空氣流動 空間111劃分為複數各自抽為真空的區段Zl、Ζ2、乃 ^ . 以、乙乂，，。各個真 空狹縫112形成在單元主體110的頂面，分別與區段Zl、z2、z3 一對一對應。 因此，在單元主H 内的空氣流動空間1U包含複數被分 抽為真空的區段Z1、Z2、Z3且真空狹縫112被分別劃分為一對 對應於區段Zl、Z2、Z3...的情況下，儘管在區段a、^、幻 的其中之一會發生真空洩漏，但可經由其他區段Z1、z2、、 提供真空，㈣止施力傳送帶12G和基板之間的真空吸持= 且防止基板傳送失敗。 ' 201029098 二、而本發明的範圍不限於以上所述。與第3圖相反真空狹 縫112也可沿施力傳送帶12〇的長度方向連績形成在單元主趙⑽ 的頂面主雜110内的空氣流動空間111也可不劃分為複數將分 別抽為真空的區段Z1、Z2、Z3。 因此’备双於裝置之主體220内的真空泵（圖未示）工作時， I由如第4圖箭頭所示的真空孔i2i和真空狹縫ιΐ2自真空孔⑵ 的外部朝向空氣流動空間lu和單元主體m⑽空氣通風通道 ❹ 13形成真工’以在施力傳送帶⑽的表面用真空吸住基板。由實 ，試驗結果可知’施力傳送帶120的真空吸持力很強，以至於可 το全以间速傳送基板’縱即使基板係是具有長度/寬度約為3米的 第十一代基板。 參閱第7圖描述利用此配置的基板傳送之裝置的操作。 首先，當將被傳送的基板提供給本實施例中基板傳送裝置時， 自裝置主體220提供的空氣同時經由在空氣懸浮模組，表面形 ❹成的複數貫穿孔211以排出，以使基板可懸浮至在如第7圖中（a) 所示的預定高度》 當基板已懸浮時，抓握和傳送單元1〇〇進行操作。即，處於待 用狀態的抓握和傳送單元刚，其頂面設置在等於或低於第5圖所 示的空氣懸浮模組210高度的高度上，藉由上/下驅動器14〇的操 作上移高至如第6圖所示的空氣懸浮模組21〇，以讓施力傳送帶 120接觸到基板的底面。 然後，當設於裝董主體22〇内的真空泵（圖未示）工作時，經 11 201029098 由如第4圓箭頭所示的真空孔121和真空狹缝ιΐ2自真空孔i2i 的外部朝工氣流動工間1U和單元主艘11〇内的空氣通風通道⑴ 形成真I卩在施力傳送帶12〇的表面用真空吸住基板如第7 圖中（b)所示。 於施力傳送帶120用真空吸住基板後，驅動電動機m聪動施 力傳送帶120’繞著主動皮帶輪131和被動皮帶輪132卩閉環形式 旋轉’如第7圖中（e)所示的施力傳送帶12()可傳送已被空氣懸 浮模組210懸浮到預定高度的基板。:= Then into the workplace, in the case of transferring such a large-sized substrate to the corresponding equipment, the drum or the supporting substrate may be worn by the substrate when the rotating shaft hangs due to the substrate, thereby causing damage to the substrate. The problem of sagging during the transfer of the base (four) of the mid-end and the front-to-revolution axis needs to be studied. ... and the rotation axis is transmitted at the same time as the high speed, in contrast to the aforementioned horizontal conveying device, which is vertically (in fact, inclined at an approximate state angle). In the vertical conveyor wiper, although the area of the substrate is basically the same as the tenth board w erected, the area is set in the clean room finite space _ device ^. Further, in the case where the substrate is vertically placed and transported, the both sides of the substrate can be lifted, and the work efficiency is improved. In particular, the polarizing plate attached to both sides of the substrate is more efficiently utilized. Therefore, more research is needed on the vertical transfer device. In order to solve the aforementioned problem, that is, to transfer a substrate at a high speed, a special case has been proposed in which the substrate is suspended by the air suspension module to a certain height and transmitted after the 2010 2010098 of the floating conveyor in the horizontal or vertical conveying device. Substrate transfer device. The proposed conveying device is provided with an air suspension module for transmitting a plurality of substrates. In the surface of the air suspension module of the presenting device 2, a plurality of air-rolling injection holes for spraying air and coating for preventing surface scratches are formed on the surface of the air suspension module. Floor. The coating layer is formed with a plurality of communication holes each having the same size as the air nozzle perforation and communicating with the air ejection holes via a pair of corresponding means. Therefore, the air supplied into the air suspension module is ejected to the air injection hole formed on the surface of the air suspension module, and then the air is sprayed outward through the communication hole formed in the coating layer to suspend the substrate in the determination. height. However, in such a substrate transfer apparatus, the motor needs to be supplied with a large amount of power to suspend the substrate by the air jetted by the air injection hole having the above structure. The larger the board, the greater the rated power required by the motor. Thus, if the motor has a large rated power to spray the air suspended in the substrate, many complicated problems are caused. , 'β fruit, it is difficult to actually use a motor with a large rated power. On the other hand, if the electric front-end power is insufficient to suspend the substrate, the substrate cannot be suspended at the required height. This requires a more efficient substrate suspension structure that does not add motor power rating compared to conventional motors. SUMMARY OF THE INVENTION An object of the present invention is to provide a substrate transfer apparatus which can reduce noise and fine particles, and has a structure which is improved over a conventional structure and which transports a substrate at a high speed. The purpose of the moon is to provide a substrate transfer device which can reduce the footprint of the device, reduce buzz and particles, and has a high-efficiency structure and high substrate transfer speed of 201029098. The simple and simple (four) configuration of the present invention provides a substrate transfer device which has the effect of enhancing the efficiency of the suspended substrate by significantly increasing the rated power of the motor than the conventional structure and transmitting the substrate at a high speed. A substrate transfer apparatus according to the present invention is provided, comprising: a gripping and transporting unit that grips at least a portion of a region of a substrate placed parallel to the ground and applies a force ride; The transfer unit, (4) gripping and transporting the unit and supporting the transfer of the substrate. According to another aspect of the present invention, the gripping and transporting unit applies a force to the substrate; and supports the transfer of the substrate. [ </RTI> It is an object to provide a substrate transfer apparatus comprising: gripping at least a portion of a substrate placed perpendicular to the ground and an auxiliary transfer unit adjacent to the grip and transfer unit in accordance with the present invention, providing a substrate transfer device The device comprises: • an X-air suspension module comprising: a plurality of air jet holes formed on a surface thereof for air used for suspending the substrate; and a substrate protective layer disposed on the surface of the air suspension module To protect the substrate, the substrate protective layer includes a large hole connected to the air ejection hole of the air suspension module, and the hole is enlarged to be larger than the air cutting hole to increase the air nozzle area from the ejection hole toward the substrate. [Embodiment] For a fuller understanding of the contents and advantages of the present invention, reference should be made to the accompanying drawings. The invention will be described in detail below with reference to the accompanying drawings to illustrate embodiments of the invention. In the figure, 201029098 the same reference numerals denote the same components. 1 is a perspective circle of a transfer substrate device according to a first embodiment of the present invention; FIG. 2 is a plan view of the first drawing; FIG. 3 is a partially exploded perspective view of the grasping and transporting unit; FIG. 4 is a grasping view; And a cross-sectional view of the transfer unit; FIGS. $ and 6 are an i-th cross-sectional view showing the operation of the gripping and transporting unit, respectively; and (1) to (C) in the seventh drawing schematically showing the substrate transfer in the first drawing Operation of the device. As shown in the figure, the substrate transfer device in this embodiment is a horizontal transfer device. The substrate transfer device comprises: the gripping and conveying unit just grasps at least one area of the substrate placed horizontally and directly on the ground and applies a force transfer substrate; and an auxiliary transfer unit 2QG, adjacent to the gripping and conveying unit 1GG The setting supports the transfer of the substrate. First, the auxiliary transfer unit 2 in the present embodiment is configured as a non-contact auxiliary transfer unit. The contactless auxiliary transfer unit suspends the substrate at a predetermined height by using the plurality of air suspension modules 21, 1 and 2 It is shown that the plurality of air suspension modules 210 are arranged in parallel with each other on the apparatus main body 220, and are spaced apart from each other by a predetermined distance to suspend the substrate carried thereon at a predetermined height. The air suspension module 21 has a plurality of through holes 211 formed in its surface. When the air supplied from the apparatus t body 220 is discharged through the plurality of through holes 211, the substrate can be suspended at the pre-height level. The air main module 22G is provided with six air suspension modules 210, but is not limited thereto. Alternatively, the number of air suspension modules 210 may be different. In addition, the separation distance between the air suspension modules may also be inconsistent. 8 201029098 A gripping and transport unit 100 is provided in a selected area of the area between the air suspension modules 210. In the present embodiment, a gripping and conveying unit 1 is provided in the middle of the air suspension module 21A in parallel with the air suspension module 210, but is not limited thereto. The gripping and transporting unit 100 directly contacts the substrate suspended by the air suspension module 21 at a predetermined height and is substantially used to transport the substrate. The gripping and conveying unit includes a unit main body u〇 in which an air flow space ill is formed and a force applying belt 120. Φ The unit main body U0 is fixed at a corresponding position, and the force transmitting belt 120 substantially contacts the substrate and conveys the substrate. The urging belt 120 is coupled to the unit main body 1A so as to be movable relative to the unit main body 1 沿 along the substrate conveying direction on the unit main body 100. Further, the urging belt 120 is formed with a plurality of vacuum holes 121 formed in its surface, and the vacuum holes 121 communicate with the air flow space llli4 of the main body 100 to vacuum the substrate. The plurality of vacuum holes 121 are arranged at regular intervals along the longitudinal direction of the urging belt 120, but are not limited thereto. Alternatively, the plurality of vacuum holes 121 may be arranged at intervals other than (four). In the operation of the vacuum hole 121, the gripping and conveying unit 1GG has to be moved up during the conveying operation to place the surface of the biasing belt 12 of the gripping and conveying unit 11 at a height equal to or lower than the height. The height of the air suspension module 21〇, the surface of the force transmitting belt 12〇 can be contacted and vacuumed to the bottom surface of the substrate suspended from the air suspension module 21 at a predetermined height. To this end, there is additionally provided an up/down drive unit 140 that is connected to and moves the gripping and transporting unit just up and down. That is, when the grasping and transporting unit starts to transfer the substrate in the standby state as shown in FIG. 5, the up/down driving unit just drives the grip 9 201029098, and the grip and transport unit 100 moves up to be higher than the sixth figure. The air suspension module 210 is shown to allow the force transfer belt 吸2 to hold and support the substrate. Here, a power cylinder 艎, a linear motor or the like can be used as the upper/lower drive 14 〇. The force transmitting belt 120 has a closed loop shape like a general conveyor belt. As shown in FIG. 7, the gripping and conveying unit 100 includes: a driving pulley 131 disposed on an inner side of the urging belt 120; a passive pulley 132 disposed on the other inner side of the urging belt 12 ;; and a driving The motor 133 is connected to the driving pulley 131 and drives the urging belt 120 to rotate. When the urging belt 120 rotates, the base plate 110 can be urging the unit 0. The main vessel 110 is formed with a plurality of vacuum slits 112 on the top surface thereof. The plurality of vacuum holes 121 on the force transmission belt 120 are in communication. The vacuum slit 112 is formed on the land U4β which is recessed on the top surface of the unit body 11''. Further, an air venting passage 113 is formed below the unit main body 110 opposite to the vacuum slit 112. In the present embodiment, as shown in Fig. 3, the air flow space 111 in the unit main body u is divided into a plurality of sections Z1, Ζ2, and ^ which are each vacuumed, and 乂, . Each of the vacuum slits 112 is formed on the top surface of the unit main body 110, and corresponds to the sections Z1, z2, and z3, respectively, in a one-to-one correspondence. Therefore, the air flow space 1U in the unit main H contains a plurality of sections Z1, Z2, Z3 which are divided into vacuum and the vacuum slits 112 are respectively divided into a pair corresponding to the sections Z1, Z2, Z3... In the case, although vacuum leakage occurs in one of the sections a, ^, and phantom, vacuum can be supplied via the other sections Z1, z2, (4) vacuum holding between the force transmitting belt 12G and the substrate = and prevent substrate transfer failure. '201029098 II. The scope of the present invention is not limited to the above. In contrast to FIG. 3, the vacuum slit 112 may also be formed along the longitudinal direction of the biasing belt 12〇 to form an air flow space 111 formed in the top surface main body 110 of the unit main Zhao (10), or may be divided into a plurality of vacuums. Sections Z1, Z2, Z3. Therefore, when the vacuum pump (not shown) in the main body 220 of the apparatus is operated, the vacuum hole i2i and the vacuum slit ιΐ2 shown by the arrow in FIG. 4 are directed from the outside of the vacuum hole (2) toward the air flow space lu and The unit main body m (10) air venting passage ❹ 13 is formed to vacuum the substrate on the surface of the urging belt (10) by vacuum. As a result of the test, it is understood that the vacuum holding force of the urging belt 120 is so strong that the substrate can be transported at a constant speed, even if the substrate is an eleventh generation substrate having a length/width of about 3 meters. The operation of the apparatus for substrate transfer using this configuration will be described with reference to FIG. First, when the substrate to be transferred is supplied to the substrate transfer device in the embodiment, the air supplied from the device main body 220 is simultaneously discharged through a plurality of through holes 211 formed in the surface of the air suspension module, so that the substrate can be Suspended to a predetermined height as shown in (a) of Fig. 7" When the substrate has been suspended, the gripping and conveying unit 1 is operated. That is, the gripping and conveying unit in the standby state has its top surface set at a height equal to or lower than the height of the air suspension module 210 shown in FIG. 5 by the operation of the up/down driver 14〇. Move to the air suspension module 21A as shown in Fig. 6 to allow the force applying belt 120 to contact the bottom surface of the substrate. Then, when a vacuum pump (not shown) provided in the main body 22 is operated, the vacuum hole 121 and the vacuum slit ι 2 shown by the arrow 4 are turned from the outside of the vacuum hole i2i to the working air flow through 11 201029098. The air venting passage (1) in the working room 1U and the main vessel 11 形成 form a true I 吸 vacuum suctioning the substrate on the surface of the urging conveyor belt 12 如 as shown in Fig. 7(b). After the force applying belt 120 vacuums the substrate, the driving motor m smart force transmitting belt 120' rotates around the driving pulley 131 and the passive pulley 132 in a closed-loop form as shown in FIG. 7(e). 12() can transport a substrate that has been suspended by the air suspension module 210 to a predetermined height.
所以’在本實施例中，可用簡單配置製造基板傳送的裝置此 簡單配置包含空氣_漁21()和純和傳送單元跡無需傳統 的昂貴元件（例如磁鐵或類似部件），由此可降低生產成本。 首先，抓握和傳送單元100的施力傳送帶12〇冑用力抓住由空 氣懸浮模組懸制基板並進行傳送，傳送基㈣速度可快於 傳統速度，同時可減少噪音和微粒。因此，可高速傳送基板。類Therefore, in the present embodiment, the apparatus for manufacturing substrate transfer can be manufactured in a simple configuration. This simple configuration includes air_fishing 21 () and pure and transporting unit tracks without the need for conventional expensive components (such as magnets or the like), thereby reducing production. cost. First, the force applying belt 12 of the grasping and transporting unit 100 slams the suspended substrate by the air suspension module and transmits it, and the transport base (4) can be faster than the conventional speed while reducing noise and particles. Therefore, the substrate can be transferred at a high speed. class
似地，當高速魏基板時，基板的各製造程料速度加快，從而 可提高產量和生產率。 此外，在本實施例中，基板在由空氣懸浮模組21〇懸浮時傳送。 所以’可防止基板在傳送過程中由於與滾筒（圖未示）或轉轴（圖 未不）相碰撞而受損。 第8圖為根據本發明第二具體實施例的基板傳送的裝置中的抓 握和傳送單元的剖面示意圖；以及第9圏為顯示第8圓中操作狀 態的剖面圖；第10圖為第9圖中重要部分的放大圖。 12 201029098 在本實施例中，抓握和傳送單元100a與以上實施例中的抓握和 傳送單元100具有相同的功能，但具有不同的配置。 首先，單元主體110a具有不同的形狀。當然，單元主體 的形狀不限於本發明的範圍，但是要可為裝配基板傳送裝置提供 方便，因為此形狀容易以擠壓或類似方法製造，並具有可在其側 面與另一設備裝配的裝配單元ll〇b。 本實施例中的抓握和傳送單元10如中，施力傳送帶12〇的表面 Ο 另設有真空吸盤15卜而吸盤實質上接觸並支撐基板的底面，同時 保護基板不受劃痕。 如圖所示，真空吸盤151可分離地設置並連接於施力傳送帶12〇 的表面。選擇性地，也可用在施力傳送帶m表面塗佈膜的方式 來設置真空吸盤15卜在任何情況下，施力傳送帶12()的表面須包 含複數連通孔152以與在施力傳送帶12〇形成的複數真空孔i2i 連通’以便空氣可流經連通孔152、真空孔121和後面所述的通氣 管線丨53 ’從而用真空吸住基板。 同時，為使抓握和傳送單元l〇〇a的真空效率最大化，換言之， 為解決由於不必要的區域被抽為真空而導致的真空泡漏或損耗的 問題，在本實施例中的抓握和傳送單元1〇〇a中另設有一止回閥 154’以在沿製造程序線設置的抓握和傳送單元i〇〇a，僅在—個與 基板實質接觸且支撐的確定區域上抽為真空。 止回閥154係連接於真空吸盤151的連通孔152内的一個區域， 並且根據基板是否接觸真空吸盤丨51表面來選擇性地允許和阻擋 13 201029098 s 通過連通孔152的空氣流動。 止回閥154包含：一轴單元154a，垂直排列在連通孔152的區 域；一端頭單元154b，形成於轴單元154a的上端並且暴露於真空 吸盤151的表面；一孔開啟/閉合單元154c’設置在與端頭單元154b 相反的轴單元154a的下端並且選擇性地開啟/閉合連通孔152的確 定部分；以及一彈性構件154d，連接於轴單元154a並且在將端頭 單元154b暴露於真空吸盤151表面的方向彈性地偏置。如圖所 示，孔開啟/閉合單元154c設置成球，而彈性構件154d設置成壓 縮彈著’但不限於此® ⑬ 因此，如第8圖所示，從與基板不接觸的真空吸盤151表面的 狀態看來，如果基板與真空吸盤151的表面接觸，且由其支撑， 並且基板按壓設置在如第9圖和第1〇圖所示的真空吸盤151内的 止回闊154的端頭單元154b上，如此端頭單元154b、轴單元154a 和孔開啟/閉合單元154c由於基板的重量下移，使連通孔152可開 啟確定部分，以形成第9圖中箭頭所示的空氣流動。因此，基板 可用真空吸住於真空吸盤151的表面上。在這種情況下，彈性構 ◎ 件154d進入壓縮狀態。 另一方面，如第8圊所示，如果基板與真空吸盤151的表面分 離’那麼彈性構件154d自壓縮狀態釋放’以便端頭單元154b、軸 單元154a和孔開啟/閉合單元154c返回其初始位置，由此利用孔 開啟/閉合單元154c閉合連通孔152的確定部分，於是空氣流被阻。 藉由應用具有此配置的止回閥154和對真空吸盤151的操作， 僅當基板實質接觸真空吸盤151時產生真空，從而有效地解決上 201029098 述問題，諸如由於形成不必要的真空和真空洩漏而造成損耗β 在本實施例中，真空吸盤151係由超高分子量聚乙烯（ultra high molecular weight polyethylene，UHMW-PE)製成，止回閥 154 由 PEEK製成，但不限於此。選擇性地，真空吸盤^亦可由含氟橡 膠或類似材料製成。 此外，本實施例中的抓握和傳送單元1 〇〇a包含設置在單元主體 ll〇a内的防散射護板155,防散射護板155以覆蓋施力傳送帶12〇 〇 的相對的上部區域的方式將施力傳送帶120夾於其中，阻止傳送 基板時會產生的微粒散射。 防散射護板155可以分離地製造，然後將其連接於單元主體 ll〇a。不然，如本實施例般，防散射護板155可在製造單元主體 ll〇a時整體形成。 就防散射護板155而言，防散射護板155的上端高度H1須低於 真空吸盤151的表面高度H2,以便避免防散射護板155接觸基板 Q 的底面。如果沒有第一具體實施例中的真空吸盤15卜則防散射護 板155的上端高度H1須低於施力傳送帶120的表面。 本實施例的抓握和傳送單元100a中，在通氣管線153的一個區 域另設置篩檢器（圖未示）。經由此種方式，如果在通氣管線 的區域提供篩檢器，不僅可有利於清潔工作場所的環境還可有 利於循環由抓握和傳送單元l〇〇a吸入將於空氣懸浮模組2ι〇内重 新利用的空氣時，排除空氣中的異物。可供參考的是，在通氣管 線153的後面設置鼓風機以便吸入空氣。將筛檢器可分離地連接 15 201029098 於鼓風機的入口即足以滿足需要。 第11圖為根據本發明贫 ^ 贫刊第三具體實施例的基板傳送裝置的平面 圖。 在第具體實施例中，在六個空氣懸浮模組210之間沿傳送基 板的方向設置-個抓握和傳送單元·。 如以上簡述v在複數空氣懸浮模組21〇的區域之間的一個確 定區域（在任何的巾緣區域）設置―個或複數抓握和傳送 單元100。 然而，如果基板要傳送的距離遠，空氣懸浮模組 210或抓握和 傳送單it lOOiif沿傳送基板的χ軸線方向連接，㈣不可能製 造無限長的空氣歸模組21()或抓握和傳送單元跡在這種情況 下’可沿X轴線方向接續地連接抓握和傳送單元（圖未☆或如 第11圖所7F ’抓握和傳送單元丨嶋可在空氣懸浮模組21〇之間 以折線圈案排列’然後沿X抽線方向對直。 、在後It況下，如第u圖所示，在抓握和傳送單元ii〇b之間 軸線方向以折線囷案排列可以有重整部分⑼，以便保護基 板在其傳送過程t免受損壞。然而，該重叠部分⑼並非必不可 少。 第U圖為根據本發明第四具體實施例的基板傳送的裝置中的抓 和傳送單元的局部立體圖；以及第13圓為第12圖的分解立體 圖。 圖所示纟實施例中的抓握和傳送單元_0具有與上述實施 201029098 例中的抓握和傳送單元100、10〇3和100b相同的功能但部分不同 的結構。具體而言，本實施例中的抓握和傳送單元1〇〇(：在結構上 與第二實施例的抓握和傳送單元100c相似，為此，以與第二具體 實施例的抓握和傳送單元100a比較的方式進行描述。 本具體實施例中的抓握和傳送單元100C包含與第二具體實施例 的抓握和傳送單元10如相似的真空吸盤151，但是還包含與第二 具體實施例的真空吸盤形成對照的真空吸盤151上的安全承受翼 部 151a。 安全承受翼部151a是基板被安全放置和支撐的部位。安全承受 翼部151在其内表面凹陷以增加與基板的接觸面積，該安全承受 翼部151由彈性材料製成。 由於設有安全承受翼部l51a，儘管基板未水平放置而在安全承 受翼部151a的表面略微傾斜，由彈性材料製成的安全承受翼部 151a可對應於傾斜的基板變形並安全地支撐基板，由此減少基板 與真空吸盤151之間的洩漏。 在本實施例中，安全承受翼部151a形狀近似於橢圓且其内部的 連通孔152a形狀如細長孔，但不限於此。 此外，還在本實施例中的抓握和傳送單元100c的區域設置有止 回閥154,以僅使與基板實質上接觸並支撐的抓握和傳送單元1〇〇a 的確定區域可被抽為真空，藉此解決真空洩漏或由於不必要的區 域被抽為真空而引起的損耗問題。此處，止回閥154的結構和功 能相當於第一具趙實施例中止回閥的結構和功能，因此其重複性 17 201029098 的說明從略° 在本實施例中，平行伸出且相互隔開的一對軌道ιΐ5形成於單 元主體⑽的表面上，自-對軌道115外面接觸料主體魔 表面的多個軌道塊125形成在施力傳送帶12〇c内。 因-對軌道115和複數執道塊125以軌道形式相互排列，當施 力傳送帶12Ge相對於單元主趙·轉動時可施力傳送基板。 除此配置外，在施力傳送帶12〇c的複數轨道塊125之間設有圍 繞抓握和傳送單元100c用於吸入空氣的側吸入單元126。當複數❹ 軌道塊125以突出和按壓形式製造時，側吸人單元126可在複數 軌道塊125之間自然形成》有利地，側吸入單元126將傳送基板 時所產生之其物或微粒吸入單元主趙丨丨加内，並將其排出裝置外。 第14圖為根據本發明第五具體實施例的基板傳送裝置的側視示 意圖。 請參閱第14圖’本實施例中基板傳送裝置1是垂直傳送裝置 基板傳送裝置1包含一抓握和傳送單元1〇〇，用於抓握垂直放置及❹ 與地面垂直豎起的基板的至少一個區域並施力傳送基板；以及一 輔助傳送單元200’鄰接於抓握和傳送單元ι〇〇設置並支援基板的 傳送。 例如，垂直於地面放置亦即是基板相對於地面以大約8〇度角傾 斜放置，但不限於此。 抓握和傳送單元1〇〇和輔助傳送單元200的詳細結構請參閱第i 圖至第13圖所示的以上結構來進行描述。 18 201029098 與上述第-至第四具體實施例所描述的水平傳送裝置不同本 實施例中基板傳送裝置i具有一個其中基板以大約&到75度角 傾斜傳送的結構。因此，如果抓握和傳送單元丨⑻由於故障而停 止操作（亦即，若抓握和傳送單元1〇〇釋放基板），基板會自相應 路徑跌落，因此可能發生損耗和事故。 在本實施例中，如第14圖所示，設置有防跌落單元3〇〇來防止 這些損耗和事故。 e 喊落單元_可具有各種形狀。在本實施例中，防跌落單元 3〇〇包含：-接觸支魏輪31〇，垂直放置基板的下端與其接觸； -滚輪支架32G’驗支持接觸支舰輪31();以及—致動器33〇, 連接W袞輪支架320’並且在預定的距離移動接觸支擇滾輪31〇 和滾輪支架320。 作為用以使基板按預定距離跌落而接觸的部件接觸支撐滾輪 310較佳更係由彈性材料例如是㈣（仙·)或氨基甲酸乙醋 U )來製作。㈣第14 _是側視圖，所以看起來僅示出 一個接觸支撺滾輪編，但是實際上接觸支舰輪3H)的數量可根 據基板的下部區域的面積而不同。 可包含一動力缸艎，可選擇地操作以提升接觸支撐 滾輪3彳浪輪支架32〇達到如同基板下降的距離，從而將基板 返回到其初始位置。 利用此配置’基板和接觸支樓滚輪310在正常狀態下按某一距 離門隔1合’J如’可按數毫米到數十毫米的距離間隔開。然而， 19 201029098 如果抓握和傳送單元100由於故障而停止操作，亦即，如果是抓 握和傳送單元_釋放基板，即使基板自相應路徑跌落，基板可 與彈性接觸支撐滾輪31〇接觸’從而防止基板受損。在接觸支撐 滾輪3U)阻止基板跌落後，致動器330可有選擇性地操作以提升 接觸支撐滾輪310和滚輪支架320。 與具有以上結構的防跌落單元300相反，可利料形塊以部分 承受和支撲垂直放置的基板的下端（圓未示）。在利用”塊的情 況下’即使抓握和傳送單元100於眾多故障情況下將正傳送或準 備傳送的基板釋放’基板仍可由V形塊承受並支揮從而防止損❹ 耗和事故的發生。 第15圖為根據本發明第六具趙實施例的基板傳送裝置的側視 圏。 如上所述’在本實施例中的基板傳送裝置la是用於傳送垂直放 置即以大約8G度傾斜的基板的裝置’因此可利用其與用於將在初 始階段豎起即基板用於傾斜基板的傾斜單元4〇〇 一起使用。為此， 因而提供傾斜單元400。 如第15圓所示，在本實施例中的傾斜單元4〇〇包含一動力缸髏 彻’其具有與外框架221上樞接的一端，以及—活塞桿，其 可伸縮地連接於動力缸體41〇,且動力缸體41()具有可旋轉地連接 至裝置主趙22G之-端。換言之，本實施财的傾斜單元彻可 經由氣壓缸、液壓缸以及氣壓缸和液壓缸的組合來實現。 利用具有此配置的傾斜單元·，可將用於#抓握和傳送單元 20 201029098 100和辅助傳送單元200的裝置主體22〇以如第ls ^. 間中雙短劃線 所不，以大約80度角豎起，藉此克服人力作業的限制而 而傳送基板的效率。 ； 第16圖為根據本發明第七具體實施例的基板傳送裴置的立體一、 意圖；以及第17圖為沿第16圖中的線A_A的剖面阖。 ” 如圖所示，基板傳送裝置包含：一空氣懸浮模組 、 ’其表面形 成有複數空氣喷射孔Η，經由該等空氣喷射孔η嘴射 … Ο 用以懸浮基 板的空氣；以及一基板保護層550，設置在空氣懸浮棋級“ο 面並且保護基板。 如第1圖所示，空氣懸浮模組510形狀似盒子，且其具有可主 入空氣的一定空間》 、 ’ 在本實施例中，以矩形盒形式製造空氣懸浮模組51 但不限於 此。空氣懸浮模組510係連接用於供應空氣至空氣懸浮楔組5⑴ 的空氣噴射孔Η的裝置（圖未示），例如，用於喷射空氣的f電 Q 動機、噴嘴或類似裝置。 ’ 形成空氣懸浮模組510表面的頂壁511形成有複數空氣喷射孔 Η »複數空氣喷射孔Η的各個孔在頂壁511上設置為環狀。圖中 顯示了許多空氣喷射孔Η，但實際的氣喷射孔太多而難以計數係 因為它們是直徑非常細小的微孔。 基板保護層550設置在空氣喷射孔η的表面，用於保護基板。 空氣懸浮模組510係由金屬製成。因此，如果無基板保護層550 而僅利用空氣懸浮模組510將基板懸浮，當基板未被懸浮而與空 21 201029098 氣懸浮模組510接觸時’由於與空氣懸浮模組510表面接觸，玻 璃製成的基板可能因而受損。因此，為預防這種情況，在空氣懸 浮模組510表面另設置基板保護層550，以防止基板受損。 基板保護層550選自當接觸基板時不會在基板上造成劃痕和損 傷的材料。在本實施例中’基板保護層550係設置塗覆於空氣懸 洋模組510表面的盡佈層。例如’將由氧基甲酸乙醋（urethane ) 或類似材料製成的塗佈液體經由喷霧法或滾輪塗法塗佈於空氣懸 浮模組510的表面，然後將其固化，從而形成基板保護層550。 同時，基板保護層550形成有複數擴大孔551 ’與空氣懸浮單元 510的該等空氣喷射孔Η連通，且每個孔都被擴大至比空氣喷射 孔Η的尺寸（即直徑）大，從而增加自空氣喷射孔Η朝向基板的 空氣喷射面積。 在對空氣懸浮模組510表面塗佈基板保護層550後，經由對塗 佈層穿孔可容易地形成擴大孔551。 如上所述，擴大孔551被擴大至大於空氣喷射孔Η的尺寸’用 來增加自空氣喷射孔Η朝向基板的空氣喷射面積。在本實施例 中，將擴大孔551設置成一對一對應於空氣喷射孔Η。 因此，擴大孔551 —對一對應於空氣喷射孔Η而形成於基板保 護層550上，且大於空氣喷射孔Η，使空氣可通過空氣喷射孔Η 朝向基板噴射空氣，以在擴展時增加喷射面積用以懸浮基板。差 不多所有的空氣喷射孔Η形成為此結構，具有增加朝向基板喷射 的空氣喷射面積的作用。因此，無需顯著增加電動機額定功率就 22 201029098 可提高懸浮基板的效率。 同時’第π圖中的箭頭指示空氣的流動路徑。如第17圖中的 箭頭所示，如果空氣不能·流動而在空氣喷射孔Η區域產生旋 渦，則會降低懸浮基板的效率。 為防止出現漩渴，於本實施例中，空氣喷射孔㈣開口區域逐 漸增加而接近於擴大孔551。利用此配置，空氣自空氣噴射孔Η 朝擴大孔551在*形成㈣的情況下_流動，㈣可懸浮基板。 ❹ 因此’在本實_巾’提供可具#方便且簡單的結構的基板傳 送之裝置’並且無需使用比傳統電動機增大電㈣較功率來提 高傳送基板的效率。具體而言，由於懸浮基板的效率變高，更有 利於傳送基板，㈣可以高速傳送基板。基板的高速傳送將在以 下實施例中更加詳細地描述》 第18圖為根據本發明第人具體實施例的基板傳送裝置的立體示 意圖，以及第19圖為沿第18圖中線Β_Β的剖面囷。 〇 如圖所示，在本實施例的基板傳送裝置中，空氣懸浮模組520 包含複數在頂壁521上形成其表面的空氣喷射孔Η，在這一點上 與第17圖中的實施例相同》 然而，本實施例與第17圖中的實施例在擴大孔561的形狀上不 同，其形成在施加於空氣懸浮模組520表面之基板保護層56〇内’ 並保護基板。 在本實施例中，將形成於基板保護層560内的該等擴大孔561 設置為複數單元擴大孔561，每個單元擴大孔561都對應於複數空 23 201029098 氣喷射孔Η而排列。例如，在本實施例中—個單元 設置為對應於九個空氣喷射孔。 孔561 在此情況下，經由空氣喷射孔Η喷射且用於懸浮 喷射面積料7増加，_峰板擴展歸動，錢無 統的電動機顯”加較功率便可比傳統電動機提 效率。 ‘、吁丞扳的 這裡’一個單元擴大孔561對應於九個空氣喷射孔H僅β 實施例，並不限制本發明的範圍。 尺具體 第20圖為根據本發明第九具體實施例的基板傳送褒置的， 面圖。 。平 如圖所示，本實施例中的基板傳送裝置與第18圖所示的實施例 中的基板傳送裝置相似，其中複數單元擴大孔571 (圓形虛線）形 成在施加於空氣懸浮模組530表面的基板保護層57〇的表面上， 且每個單元擴大孔571係對應於複數空氣喷射孔Η排列，並且這 些單元擴大孔571按幾個一組再次分組到區段ζι、Ζ2、Ζ3…中。 換言之，第20圖顯示了每一對應於九個空氣喷射排列的複數 單元擴大孔571按三個一組再次分組到區段ζ 1、Ζ2、Ζ3...中。在 此情況下’在實際產品中不設置圓形虛線所示的單元擴大孔571。 在本實施例中’將複數單元擴大孔571分組的分組方向橫截於 空氣懸浮模組530的長度方向’即是傳送基板的方向，但不限於 此。如果需要，分組方向可與傳送基板的方向平行。 以這種方式，如果將複數單元擴大孔571用於再次按幾個一組 24 201029098 地分組到區段Zl、Z2、Z3...中，那麼不僅進一步增加了空氣朝向 基板的喷射面積。而且’在各區段Zi、Z2、Z3，…中之有選擇空 氣喷射流可有選擇地打開/關閉以減少能耗。也就是說，在第 圊的情況下，只有實質上放置和傳送基板的區段Z2、z3， 控制成嗔射空氣，然而其匕他區段均控制地成阻塞空氣流動，從 而減少由於對應的空氣喷射所產生之的能耗。 利用此實施例，可經由利用方便和簡單的結構提高懸浮基板的 效率，無需比傳統的電動機增加電動機的額定功率，並且可高速 傳送基板。 第21圖為根據本發明第十具體實施例的基板傳送裝置的立體 圖。 如圖所示’本實施例的基板傳送裝置包含複數用於懸浮基板的 空氣喷射模組540以及抓握和傳送單元1〇〇,抓握水平（即與底面 平行）放置的基板的至少一個區域並施力以傳送基板。 複數空氣喷射模組540與以上實施例中所描述的空氣喷射模組 510、520、530具有相同的功能，但其形狀和尺寸不同。也就是說， 基板保護層580形成於空氣懸浮模組540的表面，且設置在基板 保護層580上的擴大孔581形成大於設置在空氣噴射模組540上 的空氣喷射孔Η。此外，每一擴大孔581對應於複數空氣喷射孔η 而排列。以此種形式，設置複數空氣喷射模組540，以致無需電動 機有大的額定功率就可將基板經由複數空氣噴射模組540有效地 懸浮到所需高度。參閱第21圖，在裝置主體501上設置六個空氣 懸浮模組540 ’但不限於此。此外’也可將空氣懸浮模組54〇以不 25 201029098 固定的間距隔開。 抓握和傳送單元100實質上用來傳送由複數空氣喷射模組54〇 懸浮的基板。將抓握和傳送單元100設置於選自空氣喷射模組540 的區域之間的-個區域。在本實施例巾，將—個抓握和傳送單元 100設置在平行於空氣懸浮模組54G較氣懸浮模組 540的中間區 域’但不祕此m抓握和料單元1GG和輔助傳送單 το 200的結構和功能將參閱上述關於第i圖至第13圖之描述。 由上述顯見’本發明提供了一種以明顯低於傳統裝置的成本製 k的基板傳送裝置’裝置可高速傳送基板且防止基板由於傳送時 與滚筒、轉軸等的碰撞而受損。 此外，提供了一種基板傳送裝置，裝置可減少相對於裝置的佔 用面積’減少噪音和微粒，可製造成具有高效率的結構來高速傳 送基板。 此外，提供了一種基板傳送裝置，裝置具有方便和簡單的結構， 無需比傳統電動機顯著增加額定功率即可提高懸浮基板的效率並 高速傳送基板。 上述之實施例僅用來例舉本發明之實施態樣，以及闡釋本發明 之技術特徵，並非用來限制本發明之範疇。任何熟悉此技術者可 輕易完成之改變或均等性之安排均屬於本發明所主張之範圍，本 發明之權利範圍應以申請專利範圍為準。 【圖式簡單說明】 第圖為根據本發明第一具趙實施例的傳送基板裝置的一立體 26 201029098 圖； 第2圖為第1圖的一平面圖； 第3圖為抓握和傳送單元的一局部分解立體圖； 第4圖為抓握和傳送單元的一剖面圖； 第5圖和第6圖為第1圖的剖面圖，分別表示抓握和傳送單元 的操作； 第7圖中（a)到（c)為第1圖中基板傳送裝置的一操作示意 〇 圖； 第8圖為本發明第二具體實施例的基板傳送裝置中的抓握和傳 送單元的一剖面圖； 第9圖為顯示第8圖中操作狀態的一剖面圖； 第10圖為第9圖中重要部分的一放大圖； 第11圖為根據本發明第三具體實施例基板傳送裝置的一平面 Q 圖； 第12圖為根據本發明第四具體實施例基板傳送裝置中的抓握和 傳送單元之一局部立體圖； 第13圖為第12圖之一分解立體圖； 第14圖為根據本發明第五具體實施例基板傳送裝置之一側視 圖， 第15圖為根據本發明第六具體實施例的基板傳送裝置的一側視 27 201029098 圖； 第16圖為根據本發明第七具體具體實施例的基板傳送裝置的一 立體示意圖； 第17圖為沿第16圖中的線A-A之一剖面圖； 第18圖為根據本發明第八具體實施例的基板傳送裝置的一立體 圖； 第19圖為沿第18圖中線B-B的一剖面圖； 第20圖為根據本發明第九具體實施例的基板傳送裝置的一局部 平面圖；以及 第21圖為根據本發明第十具體實施例的基板傳送裝置的一立體 圖。 【主要元件符號說明】 la :基板傳送裝置 100a :抓握和傳送單元 100c :抓握和傳送單元 110a :單元主體 110c :單元主體 112 :真空狹縫 114 :平台 120 :施力傳送帶 1 :垂直傳送裝置 100 :抓握和傳送單元 100b :抓握和傳送單元 110 :單元主體 110b :裝配單元 111 :空氣流動空間 113 :空氣通風通道 115 :軌道 28 201029098Similarly, when the high-speed Wei substrate is used, the speed of each manufacturing process of the substrate is increased, thereby increasing the yield and productivity. Further, in the present embodiment, the substrate is transported while being suspended by the air suspension module 21. Therefore, it is possible to prevent the substrate from being damaged during collision with the roller (not shown) or the rotating shaft (not shown). Figure 8 is a cross-sectional view showing the gripping and conveying unit in the apparatus for transferring substrates according to the second embodiment of the present invention; and Figure 9 is a cross-sectional view showing an operating state in the eighth circle; An enlarged view of the important part of the figure. 12 201029098 In the present embodiment, the gripping and conveying unit 100a has the same function as the gripping and conveying unit 100 in the above embodiment, but has a different configuration. First, the unit main body 110a has a different shape. Of course, the shape of the unit body is not limited to the scope of the present invention, but it is convenient to assemble the substrate transfer device because the shape is easily manufactured by extrusion or the like, and has an assembly unit that can be assembled on the side with another device. Ll〇b. In the grip and transport unit 10 of the present embodiment, for example, the surface of the force transmitting belt 12 is further provided with a vacuum chuck 15 and the chuck substantially contacts and supports the bottom surface of the substrate while protecting the substrate from scratches. As shown, the vacuum chuck 151 is detachably disposed and attached to the surface of the force applying belt 12A. Alternatively, the vacuum chuck 15 may be provided by applying a film on the surface of the force transmitting belt m. In any case, the surface of the force transmitting belt 12 () must include a plurality of communication holes 152 to be attached to the force transmitting belt 12 The formed plurality of vacuum holes i2i are connected 'to allow air to flow through the communication holes 152, the vacuum holes 121, and the vent line 丨 53' described later to vacuum the substrate. At the same time, in order to maximize the vacuum efficiency of the gripping and conveying unit 10a, in other words, to solve the problem of vacuum bubble leakage or loss due to unnecessary vacuum being evacuated, the grip in the present embodiment A check valve 154' is additionally provided in the grip and transport unit 1A for picking and transporting unit i〇〇a disposed along the manufacturing line, and is only drawn on a certain area that is in substantial contact with the substrate and supported. It is a vacuum. The check valve 154 is connected to an area in the communication hole 152 of the vacuum chuck 151, and selectively allows and blocks the air flow through the communication hole 152 according to whether or not the substrate contacts the surface of the vacuum chuck 51. The check valve 154 includes: a shaft unit 154a vertically disposed in a region of the communication hole 152; an end unit 154b formed at an upper end of the shaft unit 154a and exposed to a surface of the vacuum chuck 151; and a hole opening/closing unit 154c' At a lower end of the shaft unit 154a opposite to the end unit 154b and selectively opening/closing a certain portion of the communication hole 152; and an elastic member 154d connected to the shaft unit 154a and exposing the end unit 154b to the vacuum chuck 151 The direction of the surface is elastically biased. As shown, the hole opening/closing unit 154c is provided as a ball, and the elastic member 154d is set to be compressed to be 'but is not limited thereto'. Therefore, as shown in Fig. 8, the surface of the vacuum chuck 151 which is not in contact with the substrate It is seen that if the substrate is in contact with and supported by the surface of the vacuum chuck 151, and the substrate presses the end unit of the check width 154 provided in the vacuum chuck 151 as shown in Fig. 9 and Fig. 1 On the 154b, the end unit 154b, the shaft unit 154a, and the hole opening/closing unit 154c are moved downward by the weight of the substrate, so that the communication hole 152 can open the determining portion to form the air flow indicated by the arrow in Fig. 9. Therefore, the substrate can be vacuumed on the surface of the vacuum chuck 151. In this case, the elastic member 154d enters a compressed state. On the other hand, as shown in Fig. 8, if the substrate is separated from the surface of the vacuum chuck 151 'the elastic member 154d is released from the compressed state' so that the end unit 154b, the shaft unit 154a, and the hole opening/closing unit 154c return to their original positions. Thereby, the hole opening/closing unit 154c is used to close the determined portion of the communication hole 152, and the air flow is blocked. By applying the check valve 154 having this configuration and the operation of the vacuum chuck 151, a vacuum is generated only when the substrate substantially contacts the vacuum chuck 151, thereby effectively solving the problem of the above 201029098, such as due to the formation of unnecessary vacuum and vacuum leakage. The loss β is caused in the present embodiment, the vacuum chuck 151 is made of ultra high molecular weight polyethylene (UHMW-PE), and the check valve 154 is made of PEEK, but is not limited thereto. Alternatively, the vacuum chuck can also be made of a fluorine-containing rubber or the like. Further, the grasping and transporting unit 1 〇〇a in the present embodiment includes an anti-scattering shield 155 disposed in the unit main body 11a, and the anti-scattering protective plate 155 covers the opposite upper region of the force applying belt 12〇〇 The manner in which the force transmitting belt 120 is sandwiched prevents scattering of particles generated when the substrate is transferred. The anti-scatter shield 155 can be manufactured separately and then attached to the unit body 11a. Otherwise, as in the present embodiment, the anti-scattering shield 155 can be integrally formed at the time of manufacturing the unit main body 11a. In the case of the anti-scattering shield 155, the upper end height H1 of the anti-scattering shield 155 must be lower than the surface height H2 of the vacuum chuck 151 in order to prevent the anti-scattering shield 155 from contacting the bottom surface of the substrate Q. If there is no vacuum chuck 15 in the first embodiment, the upper end height H1 of the anti-scattering shield 155 must be lower than the surface of the force applying belt 120. In the gripping and conveying unit 100a of the present embodiment, a screen (not shown) is additionally provided in an area of the vent line 153. In this way, if the screen is provided in the area of the vent line, not only can the environment in the workplace be cleaned, but also the circulation can be facilitated by the gripping and conveying unit l〇〇a to be sucked into the air suspension module 2 〇 When reusing the air, remove foreign matter from the air. For reference, a blower is provided behind the vent line 153 to take in air. Separately connect the filter to the 15 201029098 inlet to the blower is sufficient. Figure 11 is a plan view showing a substrate transfer apparatus according to a third embodiment of the present invention. In a specific embodiment, a gripping and transporting unit is disposed between the six air suspension modules 210 in the direction of the transport substrate. As described above, v or a plurality of gripping and transporting units 100 are disposed in a defined area (in any of the edge areas) between the areas of the plurality of air suspension modules 21A. However, if the substrate is to be transported a long distance, the air suspension module 210 or the gripping and transporting unit 100 l is connected along the axis of the transport substrate, and (4) it is impossible to manufacture an infinitely long air return module 21 () or grip and In this case, the transport unit track can be connected to the gripping and transporting unit in the direction of the X-axis (Fig. ☆ or 7F as shown in Fig. 11] gripping and transporting unit 丨嶋 in the air suspension module 21〇 Between the folding coil case 'and then straight in the X drawing direction. In the latter case, as shown in Figure u, the axis direction between the gripping and conveying unit ii 〇 b is arranged in a fold line There is a reforming portion (9) in order to protect the substrate from damage during its transfer process. However, the overlapping portion (9) is not indispensable. Fig. U is a grasping device in the apparatus for substrate transfer according to the fourth embodiment of the present invention. A partial perspective view of the transport unit; and a thirteenth circle is an exploded perspective view of Fig. 12. The grip and transport unit _0 in the embodiment shown has the grip and transport unit 100, 10 in the above-described implementation of the 201029098 example. 3 and 100b have the same function but Partially different structure. Specifically, the grasping and transporting unit 1〇〇 in the present embodiment is similar in structure to the grasping and transporting unit 100c of the second embodiment, and for this purpose, The gripping and conveying unit 100C of the present embodiment is described in a manner of comparison with the gripping unit 100. The gripping and conveying unit 100C in this embodiment includes a vacuum chuck 151 similar to the gripping and conveying unit 10 of the second embodiment, but further includes The safety receiving wing portion 151a on the vacuum chuck 151 in comparison with the vacuum chuck of the second embodiment. The safety receiving wing portion 151a is a portion where the substrate is safely placed and supported. The safety bearing wing portion 151 is recessed on the inner surface thereof to increase The safety receiving wing portion 151 is made of an elastic material. The safety receiving wing portion 151 is made of an elastic material. Since the safety receiving wing portion 51a is provided, although the substrate is not horizontally placed, the surface of the safety receiving wing portion 151a is slightly inclined, and is made of an elastic material. The safety receiving wing portion 151a can deform corresponding to the inclined substrate and securely support the substrate, thereby reducing leakage between the substrate and the vacuum chuck 151. The safety receiving wing portion 151a has a shape similar to an ellipse and the inner communication hole 152a is shaped like an elongated hole, but is not limited thereto. Further, a check valve is also provided in the region of the gripping and conveying unit 100c in this embodiment. 154. The determined area of the gripping and transporting unit 1A that is only in contact with and supported by the substrate can be evacuated, thereby solving the vacuum leakage or the loss due to the unnecessary area being evacuated. Problem: Here, the structure and function of the check valve 154 are equivalent to the structure and function of the check valve in the first embodiment, and therefore the repeatability of the description of 17 201029098 is slightly extended in this embodiment. A pair of spaced apart tracks ι 5 are formed on the surface of the unit body (10), and a plurality of track blocks 125 that contact the outer surface of the body of the material from the outer surface of the pair of tracks 115 are formed in the force applying belt 12〇c. Since the pair of tracks 115 and the plurality of blocks 125 are arranged in a track form, the substrate can be forcedly transferred when the force transmitting belt 12Ge is rotated relative to the unit. In addition to this configuration, a side suction unit 126 for sucking air around the grip and transport unit 100c is provided between the plurality of track blocks 125 of the force applying belt 12〇c. When the plurality of track blocks 125 are manufactured in a protruding and pressing form, the side suction unit 126 can be naturally formed between the plurality of track blocks 125. Advantageously, the side suction unit 126 will suck the substrate or the particle inhalation unit when the substrate is transferred. The main Zhao Weijia, and discharged it outside the device. Figure 14 is a side elevational view of a substrate transfer apparatus in accordance with a fifth embodiment of the present invention. Referring to Fig. 14, the substrate transfer device 1 in the present embodiment is a vertical transfer device. The substrate transfer device 1 includes a gripping and transporting unit 1 for grasping at least a substrate vertically placed and vertically erected with the ground. An area and a force transmitting substrate; and an auxiliary transfer unit 200' disposed adjacent to the grip and transport unit ι and supporting the transfer of the substrate. For example, placement perpendicular to the ground, i.e., the substrate is tilted at an angle of about 8 degrees with respect to the ground, but is not limited thereto. The detailed structure of the gripping and conveying unit 1A and the auxiliary conveying unit 200 will be described with reference to the above structures shown in Figs. 18 201029098 Unlike the horizontal transfer device described in the above-described fourth to fourth embodiments, the substrate transfer device i of the present embodiment has a structure in which the substrate is obliquely conveyed at an angle of about & Therefore, if the gripping and conveying unit 丨 (8) is stopped due to a malfunction (i.e., if the gripping and conveying unit 1 〇〇 releases the substrate), the substrate may fall from the corresponding path, so that loss and accident may occur. In the present embodiment, as shown in Fig. 14, a fall prevention unit 3 is provided to prevent these losses and accidents. e Shouting unit _ can have various shapes. In the present embodiment, the anti-drop unit 3〇〇 includes:-contacting the support wheel 31〇, the lower end of the vertical placement substrate is in contact with it; the roller support 32G′ is inspecting the contact support ship 31(); and the actuator 33〇, the W wheel wheel bracket 320' is connected and the contact roller 31〇 and the roller bracket 320 are moved at a predetermined distance. The contact roller 310 for contacting the member for dropping the substrate at a predetermined distance is preferably made of an elastic material such as (4) (sin) or urethane (U). (4) The 14th_ is a side view, so it seems that only one contact support roller is shown, but the number of contact cruise wheels 3H) may vary depending on the area of the lower region of the substrate. A power cylinder 可 can be included, optionally operable to lift the contact support roller 3 to the wheel bracket 32 to reach a distance as the substrate descends, thereby returning the substrate to its original position. With this configuration, the substrate and the contact roller 310 are spaced apart by a certain distance from the door in a normal state, and can be spaced by a distance of several millimeters to several tens of millimeters. However, 19 201029098 If the gripping and conveying unit 100 stops operating due to a malfunction, that is, if it is the gripping and conveying unit_release substrate, even if the substrate falls from the corresponding path, the substrate can be in contact with the elastic contact supporting roller 31. Prevent damage to the substrate. The actuator 330 is selectively operable to lift the contact support roller 310 and the roller bracket 320 after the contact support roller 3U) prevents the substrate from falling. In contrast to the anti-drop unit 300 having the above structure, the material block can partially receive and support the lower end of the substrate (circular not shown) placed vertically. In the case of using "blocks", even if the gripping and conveying unit 100 releases the substrate being conveyed or ready to be conveyed in the case of numerous failures, the substrate can be received and supported by the V-shaped block to prevent the occurrence of damage and accidents. Figure 15 is a side view of a substrate transfer apparatus according to a sixth embodiment of the present invention. As described above, the substrate transfer apparatus 1a in the present embodiment is for transferring a substrate which is vertically placed, i.e., inclined at about 8 G degrees. The device can therefore be used with the tilting unit 4 for erecting the substrate at the initial stage, ie for the tilting of the substrate. To this end, the tilting unit 400 is thus provided. As shown by the fifteenth circle, in this embodiment The tilting unit 4 例 in the example includes a power cylinder ' 'which has one end pivotally connected to the outer frame 221 , and a piston rod that is telescopically coupled to the power cylinder 41 〇 and the power cylinder 41 ( ) has a rotatably connected end to the device main Zhao 22G. In other words, the tilting unit of the present implementation can be realized through a pneumatic cylinder, a hydraulic cylinder, and a combination of a pneumatic cylinder and a hydraulic cylinder. The slanting unit can erect the device body 22 for the #grab and transport unit 20 201029098 100 and the auxiliary transport unit 200 with a double dashed line as in the ls ^. Thereby, the efficiency of transferring the substrate is overcome by the limitation of the manual work. Fig. 16 is a perspective view of the substrate transfer device according to the seventh embodiment of the present invention; and FIG. 17 is a line along the line of FIG. As shown in the figure, the substrate transfer device comprises: an air suspension module, 'the surface of which is formed with a plurality of air jet holes Η through which the nozzles are sprayed... 空气 air for suspending the substrate And a substrate protection layer 550 disposed on the air suspension board to "face and protect the substrate. As shown in Fig. 1, the air suspension module 510 is shaped like a box, and has a certain space for the main air to enter", ' In the present embodiment, the air suspension module 51 is manufactured in the form of a rectangular box, but is not limited thereto. The air suspension module 510 is connected to a device for supplying air to the air injection aperture of the air suspension wedge group 5 (1) (not shown). , For example, an electric Q engine for jetting air, a nozzle or the like. The top wall 511 forming the surface of the air suspension module 510 is formed with a plurality of air jet holes 各个 » respective holes of the plurality of air jet holes are on the top wall 511 It is set in a ring shape. Many air jet holes are shown in the figure, but the actual air jet holes are too many to count because they are micro holes with very small diameter. The substrate protective layer 550 is disposed on the surface of the air jet hole η. The air suspension module 510 is made of metal. Therefore, if there is no substrate protection layer 550 and only the air suspension module 510 is used to suspend the substrate, when the substrate is not suspended and the air 21 201029098 air suspension module When the 510 is in contact, the substrate made of glass may be damaged due to contact with the surface of the air suspension module 510. Therefore, in order to prevent this, a substrate protective layer 550 is additionally provided on the surface of the air suspension module 510 to prevent damage to the substrate. The substrate protective layer 550 is selected from materials that do not cause scratches and damage on the substrate when the substrate is contacted. In the present embodiment, the substrate protective layer 550 is provided with a layer of a coating applied to the surface of the air suspension module 510. For example, a coating liquid made of urethane or the like is applied to the surface of the air suspension module 510 by a spray method or a roller coating method, and then cured to form a substrate protective layer 550. . Meanwhile, the substrate protective layer 550 is formed with a plurality of enlarged holes 551' communicating with the air ejection holes 空气 of the air suspension unit 510, and each of the holes is enlarged to be larger than the size (ie, diameter) of the air ejection holes, thereby increasing The air ejection area from the air ejection orifice toward the substrate. After the substrate protective layer 550 is applied to the surface of the air suspension module 510, the enlarged hole 551 can be easily formed by perforating the coating layer. As described above, the enlarged hole 551 is enlarged to be larger than the size of the air ejection hole ’ to increase the air ejection area from the air ejection hole toward the substrate. In the present embodiment, the enlarged holes 551 are disposed to correspond one-to-one to the air ejection holes. Therefore, the enlarged hole 551 is formed on the substrate protective layer 550 corresponding to the air ejecting hole 550, and is larger than the air ejecting hole so that air can be ejected toward the substrate through the air ejecting hole to increase the ejection area when expanding. Used to suspend the substrate. Not much air jet holes are formed in this structure, and have an effect of increasing the air ejection area sprayed toward the substrate. Therefore, there is no need to significantly increase the rated power of the motor. 22 201029098 can improve the efficiency of the suspended substrate. At the same time, the arrow in the πth diagram indicates the flow path of the air. As indicated by the arrow in Fig. 17, if air cannot flow and vortex is generated in the area of the air jet hole, the efficiency of the suspended substrate is lowered. In order to prevent the occurrence of whirliness, in the present embodiment, the opening area of the air injection hole (4) gradually increases to approach the enlarged hole 551. With this configuration, air flows from the air ejection hole 朝 toward the enlarged hole 551 in the case of * formation (4), and (4) the substrate can be suspended. ❹ Therefore, the device in which the substrate can be transported with a convenient and simple structure is provided in the present invention, and it is not necessary to use a higher power than the conventional motor to increase the efficiency of the transfer substrate. Specifically, since the efficiency of the suspended substrate is increased, it is more advantageous to transfer the substrate, and (4) the substrate can be transferred at a high speed. The high-speed transfer of the substrate will be described in more detail in the following embodiments. Fig. 18 is a perspective view of the substrate transfer device according to the first embodiment of the present invention, and Fig. 19 is a cross-sectional view taken along line Β_Β of Fig. 18. . As shown in the figure, in the substrate transfer apparatus of the present embodiment, the air suspension module 520 includes a plurality of air ejection holes constituting a surface thereof on the top wall 521, which is the same as the embodiment in FIG. However, this embodiment differs from the embodiment of FIG. 17 in the shape of the enlarged hole 561 which is formed in the substrate protective layer 56 of the surface of the air suspension module 520 and protects the substrate. In the present embodiment, the enlarged holes 561 formed in the substrate protective layer 560 are provided as a plurality of unit enlarged holes 561, and each of the unit enlarged holes 561 is arranged corresponding to the plurality of empty holes 23 201029098. For example, in the present embodiment, a unit is provided to correspond to nine air injection holes. In this case, the hole 561 is sprayed through the air jet hole and used for the suspension spray area material 7 増, _ peak plate expansion and return, the money of the unconformed motor display "plus power can be compared with the traditional motor to improve efficiency." Here, a unit expansion hole 561 corresponds to nine air injection holes H only β embodiment, and does not limit the scope of the present invention. Fig. 20 is a substrate transfer device according to a ninth embodiment of the present invention. As shown in the figure, the substrate transfer device in this embodiment is similar to the substrate transfer device in the embodiment shown in Fig. 18, in which a plurality of unit enlarged holes 571 (circular dotted lines) are formed in application. On the surface of the substrate protective layer 57A on the surface of the air suspension module 530, and each of the unit enlarged holes 571 is arranged corresponding to the plurality of air ejection holes, and the unit enlarged holes 571 are grouped into sections in groups. In other words, Fig. 20 shows that each of the plurality of unit expansion holes 571 corresponding to the nine air ejection arrays is again grouped into sections ζ 1, Ζ 2, Ζ 3 ... in three groups. . In this case, the unit expansion hole 571 indicated by the circular dotted line is not provided in the actual product. In the present embodiment, the grouping direction of the grouping of the plurality of unit expansion holes 571 is transverse to the length direction of the air suspension module 530. It is the direction in which the substrate is transferred, but is not limited thereto. If necessary, the grouping direction may be parallel to the direction in which the substrate is transferred. In this way, if the plurality of unit enlarged holes 571 are used to group the zones again by several groups 24 201029098 In the segments Z1, Z2, Z3, ..., not only the injection area of the air toward the substrate is further increased, but also the selective air jets in each of the zones Zi, Z2, Z3, ... can be selectively opened/closed. In order to reduce the energy consumption, that is to say, in the case of the third, only the sections Z2, z3 which substantially place and transport the substrate are controlled to emit air, while the other sections are controlled to block the flow of air, Thereby reducing the energy consumption due to the corresponding air injection. With this embodiment, the efficiency of the suspended substrate can be improved by utilizing a convenient and simple structure without increasing the number of conventional motors. The power rating of the motive and the high speed transfer of the substrate. Fig. 21 is a perspective view of the substrate transfer apparatus according to the tenth embodiment of the present invention. The substrate transfer apparatus of the present embodiment includes a plurality of air for suspending the substrate. The jetting module 540 and the gripping and conveying unit 1 〇〇 grip the at least one region of the substrate placed horizontally (ie parallel to the bottom surface) and apply force to transfer the substrate. The plurality of air jet modules 540 are as described in the above embodiments. The air jet modules 510, 520, 530 have the same function but different shapes and sizes. That is, the substrate protective layer 580 is formed on the surface of the air suspension module 540 and is enlarged on the substrate protective layer 580. The aperture 581 is formed to be larger than the air ejection aperture provided on the air injection module 540. Further, each of the enlarged holes 581 is arranged corresponding to the plurality of air injection holes η. In this form, a plurality of air injection modules 540 are provided so that the substrate can be effectively suspended to a desired height via the plurality of air injection modules 540 without requiring a large power rating of the motor. Referring to Fig. 21, six air suspension modules 540' are provided on the apparatus main body 501, but are not limited thereto. In addition, the air suspension modules 54 can also be separated by a fixed distance of not 25 201029098. The grip and transfer unit 100 is essentially used to transport the substrate suspended by the plurality of air jet modules 54. The grip and transfer unit 100 is disposed in an area between the regions selected from the air injection module 540. In the embodiment of the present invention, a gripping and conveying unit 100 is disposed in an intermediate portion parallel to the air suspension module 54G and the air suspension module 540. However, the m gripping unit 1GG and the auxiliary conveying unit τ are not secret. The structure and function of 200 will be described with reference to the above description of Figs. From the above, it is apparent that the present invention provides a substrate transfer apparatus which is significantly lower than the cost of a conventional apparatus, and which can transport a substrate at a high speed and prevent the substrate from being damaged by collision with a drum, a rotating shaft or the like due to conveyance. Further, there is provided a substrate transfer apparatus which can reduce noise and fine particles with respect to the occupation area of the apparatus, and can be manufactured into a structure having high efficiency to transfer the substrate at a high speed. Further, there is provided a substrate transfer apparatus which has a convenient and simple structure, which can increase the efficiency of the suspended substrate and transfer the substrate at a high speed without significantly increasing the rated power than the conventional motor. The embodiments described above are only intended to illustrate the embodiments of the invention, and to illustrate the technical features of the invention, and are not intended to limit the scope of the invention. Any change or singularity that can be easily accomplished by those skilled in the art is within the scope of the invention, and the scope of the invention should be determined by the scope of the patent application. BRIEF DESCRIPTION OF THE DRAWINGS The figure is a perspective view of a three-dimensional 26 201029098 of a transfer substrate device according to a first embodiment of the present invention; FIG. 2 is a plan view of FIG. 1; FIG. 3 is a view of the grasping and transporting unit A partially exploded perspective view; Fig. 4 is a cross-sectional view of the gripping and transporting unit; Figs. 5 and 6 are cross-sectional views of Fig. 1 showing the operation of the gripping and transporting unit, respectively; (c) is a schematic view of an operation of the substrate transfer device in Fig. 1; Fig. 8 is a cross-sectional view showing the gripping and transporting unit in the substrate transfer device of the second embodiment of the present invention; 1 is a cross-sectional view showing an operation state in FIG. 8; FIG. 10 is an enlarged view of an important portion in FIG. 9; FIG. 11 is a plan view of a substrate transfer device according to a third embodiment of the present invention; 12 is a partial perspective view of a gripping and conveying unit in a substrate transfer apparatus according to a fourth embodiment of the present invention; FIG. 13 is an exploded perspective view of FIG. 12; and FIG. 14 is a fifth embodiment of the present invention. Side view of the substrate transfer device, number 1 5 is a side view of a substrate transfer device according to a sixth embodiment of the present invention; FIG. 16 is a perspective view of a substrate transfer device according to a seventh embodiment of the present invention; FIG. 18 is a perspective view of a substrate transfer device according to an eighth embodiment of the present invention; FIG. 19 is a cross-sectional view taken along line BB of FIG. 18; 1 is a partial plan view of a substrate transfer apparatus according to a ninth embodiment of the present invention; and FIG. 21 is a perspective view of a substrate transfer apparatus according to a tenth embodiment of the present invention. [Main component symbol description] la: substrate transfer device 100a: grip and transfer unit 100c: grip and transfer unit 110a: unit main body 110c: unit main body 112: vacuum slit 114: platform 120: force transfer belt 1: vertical transfer Device 100: Grip and transport unit 100b: Grip and transport unit 110: Unit body 110b: Assembly unit 111: Air flow space 113: Air venting passage 115: Track 28 201029098
120c :施力傳送帶 125 :軌道塊 131 :主動皮帶輪 133 :驅動電動機 151 :真空吸盤 152 :連通孔 153 :通氣管線 154a :軸單元 154c :孔開啟/閉合單元 155 :防散射護板 210 :空氣懸浮模組 220 :裝置主體 300 :防跌落單元 320 :滾輪支架 400 :傾斜單元 420 :活塞桿 511 :頂壁 521 :頂壁 540 :空氣喷射模組 121 :真空孔 126 :側吸入單元 132 :被動皮帶輪 140 :上/下驅動單元 151a :安全承受翼部 152a :連通孔 154 :止回閥 154b :端頭單元 154d :彈性構件 200 :輔助傳送單元 211 :貫穿孔 221 :外框架 310 :接觸支撐滚輪 330 :致動器 410 :動力缸體 510 :空氣懸浮模組 520 :空氣懸浮模組 530 :空氣懸浮模組 550 :基板保護層 29 201029098 551 :擴大孔 560 :基板保護層 561 :擴大孔 570 :基板保護層 571 :單元擴大孔 580 :基板保護層 581 :擴大孔 A-A :線 B-B :線 Η:空氣喷射孔 H1 :上端高度 Η2 :表面高度 Z1 ·區段》 Ζ2 :區段 Z3 :區段120c: force transmission belt 125: track block 131: drive pulley 133: drive motor 151: vacuum suction cup 152: communication hole 153: ventilation line 154a: shaft unit 154c: hole opening/closing unit 155: anti-scattering shield 210: air suspension Module 220: device main body 300: anti-drop unit 320: roller bracket 400: tilting unit 420: piston rod 511: top wall 521: top wall 540: air injection module 121: vacuum hole 126: side suction unit 132: passive pulley 140: upper/lower driving unit 151a: safety receiving wing portion 152a: communication hole 154: check valve 154b: end unit 154d: elastic member 200: auxiliary conveying unit 211: through hole 221: outer frame 310: contact supporting roller 330 Actuator 410: power cylinder 510: air suspension module 520: air suspension module 530: air suspension module 550: substrate protection layer 29 201029098 551: enlarged hole 560: substrate protection layer 561: enlarged hole 570: substrate Protective layer 571: unit enlarged hole 580: substrate protective layer 581: enlarged hole AA: line BB: line Η: air ejection hole H1: upper end height Η 2: surface height Z1 · section Ζ 2: section Z3: section
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