KR102066881B1 - Manufacturing method of test socket for small outline package ic - Google Patents

Abstract

Provided is a method for manufacturing a test socket for a surface-mounted integrated circuit package. Accordingly, the method for manufacturing a test socket for a surface-mounted integrated circuit package increases a yield by preventing defects due to damage or the like, which occur in a process for providing a substrate in advance, in a process of manufacturing a test socket for a surface-mounted integrated circuit package and manufactures a test socket for a surface-mounted integrated circuit package based on a high-quality substrate.

Description

Manufacturing method of test socket for surface mount integrated circuit package {MANUFACTURING METHOD OF TEST SOCKET FOR SMALL OUTLINE PACKAGE IC}

The present invention relates to a method of manufacturing a test socket for a surface-mount integrated circuit package, and more particularly, to prevent defects due to damage in the process for preparing a pre-substrate in the process of manufacturing a test socket for a surface-mount integrated circuit package. The present invention relates to a method of manufacturing a test socket for a surface mount integrated circuit package to increase a yield and to jet a test socket for a surface mount integrated circuit package based on a high quality substrate.

Using a socket for performing an integrated circuit package test, a technique for compactly testing a SOP IC with a single socket has been developed for a general purpose regardless of the size of the package body and the number and pitch of lead pins of a contact terminal. In the manufacturing process of such a socket, a substrate for IC mounting is used, and the substrate corresponds to one of the components that must be provided for manufacturing the entire test socket. However, in the process of manufacturing and preparing such a substrate, there is a possibility that a defect in handling of the substrate may occur, thereby causing a quality reliability problem throughout the manufacturing process and a manufacturing cost loss. Therefore, there is a disadvantage that it is not easy to secure the manufacturing process and to manufacture a test socket for a high quality surface mount integrated circuit package.

Korean Patent Publication No. 10-2015-0060079

The present invention improves the yield by preventing defects due to damage in the process for preparing a pre-substrate in the test socket manufacturing process for the surface-mount integrated circuit package, for the surface-mount integrated circuit package based on a high-quality substrate An object of the present invention is to provide a test socket manufacturing method for a surface mount integrated circuit package for depositing a test socket.

The present invention provides a test socket manufacturing method for a surface mount integrated circuit package, comprising: providing an SOP IC (100); Providing a substrate (P) for mounting the SOP IC (100); And mounting the SOP IC 100 on the substrate P, wherein the substrate P is processed through a factory value in advance, and the substrate value is a predetermined body portion BP. ) And a plurality of air blowers provided on the main body part BP and allowing a substrate to be processed to process the upper surface of the substrate, and injecting air from the lower part of the seated substrate to raise the seated substrate. It is formed and provided on the mounting unit 10, the main body portion (BP) and the conveying unit 40 for contacting the rollers on both sides of the substrate floated by the air blower to be conveyed in the conveying direction, and The main body part BP includes an expansion part 310 on which a fixing module 300 is mounted, and the fixing module 300 includes a first base module 320 on which the expansion part 310 is seated. And the first base module 320 to be fixed to the expansion part 310. It includes a first movable module 330 is driven so that, the first movable module 330, the first drive body 331 is provided so as to reciprocate flow in the first base module 320, and the first The first movable body 3311 pressurizes one side of the fixed module 300 in cooperation with the second driving body 332 provided in the first base module 320 to be reciprocated and the first driving body 331. ), And a second movable body 3321 which is linked to the second driving body 332 and presses the other side of the fixed module 300, wherein the first movable body 3311 and the second movable body are provided. 3331 is a predetermined depth entered into the expansion unit 310 to press the expansion unit 310, the first movable module 330 is linked to the first drive body 331, A second movable unit 3112 interlocked with a first auxiliary movable unit 3312 and the second driving unit 332 which press-fix the expansion unit 310 based on a tilting motion from above the first movable body 3311. Sieve (3 It provides a test socket manufacturing method for a surface-mounted integrated circuit package further comprises a second auxiliary actuator 3322 for pressing and fixing the expansion portion 310 based on the tilting operation from above.

According to the present invention, in the manufacturing process of the test socket for the surface mount integrated circuit package, the yield is improved by preventing defects due to damage in the process of preparing the pre-substrate, and the surface mount integrated circuit package based on a high quality substrate. It is effective to provide a test socket fabrication method for a surface mount integrated circuit package for depositing a test socket for a device.

1 to 4 are diagrams illustrating configurations of a test socket for a surface mount integrated circuit package according to an exemplary embodiment of the present invention.
5 to 12 are views showing the configuration of a substrate processing apparatus for processing a substrate for a test socket for a surface-mount integrated circuit package according to an embodiment of the present invention.
13 to 18 illustrate some of the components of the substrate processing apparatus of FIG. 5.
19 is a flowchart sequentially illustrating a method of manufacturing a test socket for a surface mount integrated circuit package according to an embodiment of the present invention.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 to 4 illustrate configurations of a test socket for a surface mount integrated circuit package according to an exemplary embodiment of the present invention. 1 to 4, the test socket 200 for a surface mount integrated circuit package includes a predetermined number of lead pins L from the package body 110 and both side surfaces of the package body 110 in the width direction. It is used to test a small outline package (SOP) IC 100 having a contact terminal 220 protruding in an L shape while maintaining a predetermined pitch. The lead provided in the SOP IC 100 is provided. The L-shaped shape, which is the shape of the pin L, is also commonly referred to as a chevron wing shape, and due to the shape of the lead pin L, the SOP IC 100 can be surface mounted on a PCB or the like. The SOP IC 100 has a different size of the package body 110 according to its type, and the number and pitch of the lead pins L of the contact terminal 220 are different from each other. The pitch of 0.5mm and 1.27mm is used, and the number of lead pins (L) is usually used as the pin of about 8 to 20 pins, the lead pins (L ', L' ', L '' ') is shown in all 20. Among the SOP ICs 100, the small SOP IC 100 ′ having a pitch of 0.5 mm between the lead pins L is generally formed such that the package body 110 ′ is small in size, and the SOP IC ( 100, the pitch between the lead pins L is 1.27 mm. In one embodiment of the present invention, the number of the lead pins L ″ and L ′ ″ is equal to 20 pieces, and the pitch is also 1.27 mm. Since the same length of the package body (110 '', 110 '' ') is the same, but according to the width of the package body (110' ', 110' '') as shown in Figure 3b Narrow Type SOP IC (100) '') And Wide Type SOP IC 100 '' '.

Hereinafter, a total of three types of SOP IPs 100, such as the small SOP IC 100 ′, the narrow type SOP IC 100 ″, and the wide type SOP IC 100 ″ ″ may be tested with one socket. A test socket 200 for a surface mount integrated circuit package according to an embodiment of the present invention will be described. The test socket 200 for a package package according to an embodiment of the present invention includes a substrate P, a printed electrode unit 220, a package guide dam 230, and a pressure jig 240. It is configured by. The substrate P is configured such that the printed electrode unit 220 and the package guide dam 230 may be printed or provided on an upper surface thereof, and the SOP IC 100 may be seated thereon. That is, the substrate P is in the form of a printed circuit board (PCB) substrate on which the printed electrode 220 is printed.

When the SOP IC 100 is seated on the substrate P, the printed electrode unit 220 contacts the lead pins L of the contact terminal 120 to be electrically connected to each other. According to an embodiment of the present invention, a plurality of lead electrodes E are printed on the substrate P in a pattern corresponding to the size and the number and pitch of the lead pins L of the contact terminal 120. As described above, according to the type of the SOP IC 100, a first side to which the central electrode unit 221 to which the small SOP IC 100 ′ is connected and the Narrow Type SOP IC 100 ″ are connected is connected. And an electrode unit 222, a second side electrode unit 223 to which the Wide Type SOPIC 100 '' 'is connected, and a signal processing electrode unit 224 to be electrically connected to the outside. A printed wiring 225 for connecting is provided.

That is, according to the type of the SOP IC 100, the printed electrode unit 220 according to the embodiment of the present invention, that is, the size of the package body 110 and the lead pin (L) of the contact terminal 120 Regardless of the number and pitch of the) will be configured to enable the test of the SOP IC (100). The central electrode unit 221 is configured such that the small SOP IC 100 ′ having the smallest width package body 110 ′ of the plurality of SOP ICs 100 is connected to the small SOP IC 100 ′. The lead pins L 'having a pitch of 0.5 mm are composed of a plurality of lead electrodes E' printed in a pattern to be contacted with each other. In an embodiment of the present invention, the number of the lead pins L 'is different. 20 lead electrodes E 'to correspond to Each of the first side electrode unit 222 and the second side electrode unit 223 may include the narrow type SOP IC 100 ″ and the wide type SOP IC 100 ′ ″ among a plurality of SOP ICs 100, respectively. Is printed on the outer side of the package body 110 ″, 110 ″ ″ with respect to the center electrode unit 221. The first side electrode unit 222 may be connected to the center electrode unit 221. 20 lead electrodes E ″ printed in a pattern in which lead pins L ″ having a pitch of 1.27 mm of the Narrow Type SOP IC 100 ″ may be contacted to the outside of the central electrode unit 221. And the second side electrode unit 223 has a lead pin L ″ having a 1.27 mm pitch of the wide type SOP IC 100 ′ ″ on the outer side of the first side electrode unit 222. ') Consists of twenty lead electrodes E' '' printed in a pattern to be in contact with each other.

The signal processing electrode unit 224 has the center electrode unit 221, the first side electrode unit 222, and the second side electrode unit () at an edge portion of the substrate P so as to be electrically connected to the outside. 223 is configured to correspond to the number of lead electrodes E ', E' ', and E' '' having the largest number, and in one embodiment of the present invention, The number of lead electrodes E ′, E ″, and E ′ ″ provided in each of the center electrode unit 221, the first side electrode unit 222, and the second side electrode unit 223 is 20. Since the number is the same, the number of lead electrodes E ″ ″ included in the signal processing electrode unit 224 is also equal to 20. Meanwhile, lead electrodes E ′ and E ′ provided in the center electrode unit 221, the first side electrode unit 222, the second side electrode unit 223, and the signal processing electrode unit 224, respectively. ', E' ',' E '' 'are provided with the same number as 20 and matched one by one with each other by the printed wiring 225 printed on the substrate P and are electrically connected to each other. . That is, when the printed wiring 225 is electrically connected to only the lead electrode E ″ ″ of the signal processing electrode unit 224 from the outside, the center electrode unit 221 and the first side electrode unit ( 222 and the lead electrodes E ', E' 'and E' '' of each of the second side electrode units 223 are matched one-to-one and electrically connected to each other, thereby eliminating a separate wiring and a dedicated socket. With just (P), you can test various SOP ICs (100 ', 100``, 100' '').

In addition, in an embodiment of the present invention, the number of lead pins L ', L' ', L' '' of the SOP ICSOP ICs 100 ', 100 ", 100' " Although all 20 are configured identically, the number of the lead pins L ', L' ', L' '' is smaller than the number of the lead electrodes E ', E' ', E' ''. If not, the test socket 200 for a surface mount integrated circuit package according to an embodiment of the present invention may be used in common without modification. The package guide dam 230 is configured to guide the SOP IC 100 seated on the substrate P, and the center electrode unit 221, the first side electrode unit 222, and the first electrode. The outer side of each of the second side electrode units 223 is provided to protrude upward on the substrate P.

That is, the package guide dam 230 is a small package guide dam 230 ′ surrounding the outer shell of the central electrode unit 221 and an outer shell of the first side electrode unit 222 in one embodiment of the present invention. A narrow type package guide dam 230 ″ surrounding the outer surface of the second side electrode unit 223 and a wide type package guide dam 230 ′ ″ surrounding the outer surface of the second side electrode unit 223. By supporting an edge of the lead pin L, the SOP IC 100 is guided so as not to be separated from the substrate P.

The protrusion height of the package guide dam 230 is determined by the shape of the contact terminal 120 between the substrate P and the package body 110 when the SOP IC 100 is seated on the substrate P. It is spaced apart by the interval of the package guide dam 230 to the height of about twice the height of the printed electrode 220 is printed on the substrate (P) so as not to interfere with the package body 110 It is preferable. As shown in FIG. 5, the pressure jig 240 has the SOP IC 100 in a state in which the lead pin L of the contact terminal 120 is in contact with the lead electrode E of the printed electrode unit 220. ) Is configured to press the package body 110 in the direction toward the substrate (P) so as to be fixed on the substrate (P). The pressure jig 240 may be configured as a cylinder capable of reciprocating in the vertical direction, if it is a means for applying the pressing force in one direction and release the pressing force will be within the protection scope of the present invention. For example, pressing the package body 110 with a gloved hand can also be said to be a kind of pressure jig 240.

<Substrate processing device for test socket for surface mount integrated circuit package>

5 to 12 are views showing the configuration of a substrate processing apparatus for processing a substrate for a test socket for a surface-mount integrated circuit package according to an embodiment of the present invention. 5 to 12, the substrate processing apparatus A includes a mounting unit 10, a nozzle unit 20, a cover unit 30, and a transfer unit 40. At least some of the mounting unit 10, the nozzle unit 20, the cover unit 30, and the transfer unit 40 are provided in a predetermined body part BP.

 The mounting unit 10 is provided in the form of a predetermined surface on which the substrate is seated, and a plurality of air blowers 11 are formed inside the air blower 11. In the form of a hole which is opened in one side, coupled to the air blower 11 on one side injection means for injecting air to the upper portion of the mounting unit 10 through the air blower 11 and a control means for controlling the same (not shown) Etc. may be provided. The nozzle unit 20 is positioned above the mounting unit 10 and is controlled to be transported along a predetermined driving shaft so that the nozzle unit 20 is sprayed onto the upper surface of the substrate seated on the mounting unit 10. The cover unit 30 is respectively installed on both sides of the mounting unit 10, and comprises a prevention cover 31 and the driving means (32). Here, the prevention cover 31 is formed to abut the side of the substrate seated when the substrate seated on the mounting unit 10 is smaller than the mounting unit 10, and at the same time the side of the mounting unit 10 from the side end of the substrate It is formed to cover up to the side end. The prevention cover 31 is moved to abut on the side end surface during coating processing, thereby preventing the coating liquid and the like sprayed from the above-described nozzle unit 20 flows down to the mounting unit 10. The driving means 32 includes a first driving means 321 and a second driving means 322. Here, the first driving means 321 is an actuator including a moving block 321a for feeding along the feed shaft, which is installed on the side of the mounting unit 10, the moving block 321a of the mounting unit 10 It is installed to move inward and outward.

In addition, the second driving means 322 is coupled to the moving block 321a of the first driving means 321, the front end is installed to move in the vertical direction, the front end is coupled to the above-described prevention cover 31. Such driving means 32 is preferably provided on both sides of the mounting unit 10 to be coupled to the prevention cover 31 can be driven to the stable prevention cover 10 to drive. That is, the prevention cover 31 is moved in and outward of the substrate by the first driving means 421, and is moved up and down by the second driving means 422, so that the substrate is seated on the mounting unit 10. On the side of the prevention cover 31 is able to abut. The transfer unit 40 may be disposed on both sides of the transfer direction of the substrate seated on the mounting unit 10, the roller unit 41, the first transfer unit 42, the second transfer unit 43 ). The roller part 41 includes a roller block 41a formed to extend in one direction and a roller 41b rotatably installed at one lower side of the roller block 41a.

The first transfer unit 42 is an actuator including a transfer block 42a that is movable along a transfer shaft. The first transfer unit 42 is installed at the side of the mounting unit 10 to move the transfer block 42a in and outward of the mounting unit 10. It is installed to move. At this time, one side of the transport block 42a is coupled to the roller block 41a through the interlocking block b, so that the roller portion 41 is movable in and outward of the mounting unit 10. The second transfer unit 43 is an actuator installed so that the tip 43a moves in the vertical direction. The second transfer unit 43 is coupled to the roller block 42a so that the tip 43a moves in the vertical direction from the inside of the roller block 42a described above. do. Further, the front end 43a is coupled to one side of the interlocking member a provided inside the roller block 42a, and the other side of the interlocking member a is coupled to the roller shaft 41b 'of the roller 41b. do.

That is, the roller 41b may move in the vertical direction by the second transfer unit 43 to be in contact with the side surface of the substrate seated on the mounting unit 10. The operation of the first embodiment of the substrate processing apparatus described above will now be described. Since the size of the seated substrate P is smaller than that of the mounting unit 10, the first driving means 32 drives the driving block 321a in the "c" direction, as shown in FIG. 7. Is driven to abut the side surface of the substrate (P). Thereafter, the nozzle unit 20 coats the substrate P by spraying a coating solution on the upper surface of the substrate P. Subsequently, when the coating processing is completed, as shown in Figure 8, by spraying the air upward through the air blower 11 formed in the mounting unit 10 to raise the seated substrate (P). At the same time, the first transfer unit 42 disposed on the side of the mounting unit 10 transfers the roller block 41a of the roller portion 41 in the inward direction of the mounting unit 10, but the roller portion 41 To a position in contact with the roller 41b.

At this time, the second transfer unit 43 has a height of the substrate P and the roller 41b of the roller portion 41 that rises before or after the first transfer unit 42 transfers the roller block 41a. The height of the roller 41b is adjusted by moving the roller 41b in the up and down direction so as to be in contact. That is, the roller 41b is formed by the first transfer unit 42 provided to transfer the roller 41b in the inner and outer directions, and the second transfer unit 43 provided to transfer the roller 41b in the vertical direction. It comes in contact with the side surface of (P). In this state, as shown in FIG. 9, the roller 41b disposed on the right side of the mounting unit 10 and contacting the substrate P rotates clockwise, and the roller 41b on the left rotates counterclockwise. As a result, the substrate P can be transferred to the outside of the mounting unit 10.

In addition, since the substrate P is floated from the upper surface of the mounting unit 10 by the air blower, it is possible to prevent physical damage or damage due to friction with the upper surface of the mounting unit 10. In addition, the substrate P is transferred by contacting only the side surface of the substrate P, thereby preventing physical damage and damage that may occur during the transfer process of the substrate. At this time, although not shown, after the coating is completed, the first driving means 321 drives the driving block 321a in a direction away from the mounting unit 10 to prevent the substrate 31 from being processed. It is preferred to be controlled without contact.

<Method of manufacturing test socket for surface mount integrated circuit package>

19, a method of manufacturing a test socket for a surface mount integrated circuit package, comprising: providing an SOP IC (100); Providing a substrate (P) for mounting the SOP IC (100); And mounting the SOP IC 100 on the substrate P, wherein the substrate P is processed through a factory value in advance, and the substrate value is a predetermined body portion BP. ) And a plurality of air blowers provided on the main body part BP and allowing a substrate to be processed to process the upper surface of the substrate, and injecting air from the lower part of the seated substrate to raise the seated substrate. It is formed and provided on the mounting unit 10, the main body portion (BP) and the conveying unit 40 for contacting the rollers on both sides of the substrate floated by the air blower to be conveyed in the conveying direction .

The main body part BP includes an expansion part 310 on which a fixing module 300 is mounted, and the fixing module 300 includes a first base module 320 on which the expansion part 310 is seated. And a first movable module 330 provided in the first base module 320 and driven to be fixed to the expansion unit 310, wherein the first movable module 330 is configured to include the first base. A first driver 331 provided to reciprocally flow in the module 320, a second driver 332 provided to reciprocately flow in the first base module 320, and the first drive body ( 331 interlocked with the first movable body 3311 to press the one side of the fixed module 300, the second drive unit 332 and the second movable to press the other side of the fixed module 300 Sieve 3321 is included.

The first movable body 3311 and the second movable body 3331 are deeply entered into the expansion part 310 to press the expansion part 310, and the first movable module 330 is And a first auxiliary movable body 3312 linked to the first driving body 331 to pressurize and secure the expansion part 310 based on a tilting motion above the first movable body 3331. It further includes a second auxiliary movable body 3322 linked to the second driving body 332 to pressurize and secure the expansion part 310 based on the tilting motion above the second movable body 3331.

The first auxiliary actuator 3312 may include a first auxiliary driver 3313 and an end portion rotatable vertically from the first auxiliary driver 3313 to contact the extension part 310. A first rotor 3314 is provided, and the second auxiliary actuator 3322 is rotatably mounted at an end thereof from the second auxiliary driver 3323 and the second auxiliary driver 3323. The second rotating body 3324 is in contact with the extension 310.

The first driving body 331 and the second driving body 332 are provided to be able to move forward and backward in the first base module 320, the first rotating body 3313 and the second rotating body 3323 ) Is joined to the receiving space of the expansion part 310 previously formed as a polygonal structure and enters a predetermined depth to generate a fixed force in a rotation.

The fixing module 300 includes a second movable module 340 provided in the first base module 320 and driven to fix the expansion part 310. The second processing module 340 includes: A third driver 341 provided on the first base module 320, a fourth driver 342 provided on the first base module 320, and the third driver ( A first flow structure 3411 and a second flow structure 3411 and a second flow structure 3411 and a second flow structure 3411 and a second flow structure 3411 and the second flow structure 3411 and the second flow structure 3411. Flow structures 341 may be connected to each other, but includes a connection structure 343 provided to penetrate the extension 310.

The connection structure 343 flows downward between the first flow structure 3411 and the second flow structure 341 to press the extension 310 downward. The connecting structure 343 is provided as a cross-sectional reference quadrangular body to be in engagement with the expansion portion 310, and is perpendicular to the first flow structure 3411 and the second flow structure 341 It is provided to enable rotation. The first flow structure 3411 and the second flow structure 341 are provided to be capable of lifting up and down from the third driving body 341 and the fourth driving body 342, respectively.

A test socket fabrication system for a surface mount integrated circuit package, wherein a substrate P on which the SOP IC 100 is mounted is processed through a factory value, and the substrate value is a predetermined body portion BP, and The mounting unit is provided on the main body part BP and the substrate is seated to process the upper surface of the substrate, and a plurality of air blowers are formed to inject the seated substrate by injecting air from the lower portion of the seated substrate. 10 and a conveying unit 40 provided on the main body portion BP and for conveying the rollers to both sides of the substrate floating by the air blower so as to be conveyed in the conveying direction. Meanwhile, a second fixing module 300 ′ adjacent to the fixing module 300 is further included, and ends of the first base module 320 and the second fixing module 300 of the fixing module 300 are further included. End of the first base module 320 of the) further comprises a connection fixing module 350 which is interlocked and fixed through each other. The connection fixing module 350 is provided at one side of the central fixing part 351 and the central fixing part 351 to form a first binding part for binding the first base module 320 of the holding unit 300 ( 352 and a second binding part 353 provided at the other side of the central fixing part 351 to bind the first base module 320 of the holding unit 300. The central fixing part 351 drives the first binding part 352 and the second binding part 353 to pull inward or push outward.

The central fixing part 351 of the connection fixing module 350 may include a first fixing part 3511 and a first handling part for handling the first binding part 352 at one side of the fixing module 3511. 3512 and a second handling part 3513 for handling the second binding part 353 at one side of the fixing module 3511. The first binding unit 352 is provided as a pair of structures for pressing the end of the first base module 320 of the holding unit 300 therebetween. The second binding unit 353 is provided as a pair of structures for pressing the end of the first base module 320 of the second holding unit 300 ′.

The first handling part 3512 exerts a tilting or rotational twisting force on the first binding part 352, and the second handling part 3313 is tilting on the first binding part 352. Fix by applying torsional force of rotation type. The second holding unit 300 'further includes a neighboring third holding unit 300', wherein the third holding unit 300 'and the second holding unit 300's are formed by the holding unit. 300 and the second holding unit 300 is interlocked and fixed in the same structure corresponding to the manner in which the interlocking. The holding unit 300 includes a first-first substructure 411 and a second-second substructure 412 at a lower portion thereof, and the second holding unit 300 ′ is provided at a lower portion of the first substructure 411. 2-2 substructure 421 and neighboring 2-1 substructure 412 and 2-2 substructure 422 are provided.

The third holding unit 300 ″ includes a 3-1 substructure 431 adjacent to the 2-2 substructure 422 and a 3-2 substructure 432 at a lower portion thereof. The stirring device includes a first binding module 510 for binding the second-1 substructure 421 to each other from the first-first substructure 411 and the first-first substructure 411. Bind the 2-1 substructure 421 to each other, the second binding module 520 provided on the lower portion of the first binding module 510 and the second-2 from the lower structure 422 A third binding module 530 which binds the 3-2 substructures 432 to each other, and the third-2 substructures 432 to each other from the second-2 substructures 422, wherein the third It further comprises a fourth binding module 540 provided at the bottom of the binding module 530.

The first binding module 510 is coupled to the first-first binding unit 511 bound to the first-first substructure 411 on one side and the second-first lower structure 421 to the other side. It comprises a 1-2 binding unit 512, and the first-first intermediate driving body 515 that is bound to the 1-2 substructure 412 in the middle portion. The second binding module 520 is one-third binding part 513 that is bound to the first-first substructure 411 on one side, and the other one to which the second-first substructure 421 is bound. The first-4 binding unit 514 and the first-2 intermediate driving unit 516 bound to the first and second substructures 412 in the middle portion, and the third binding module 530. Silver is a 2-1 binding portion 521 which is bound to the 1-2 substructure 412 to one side, and a 2-2 binding portion (521) to the other to the 3-2 substructure 432 ( 522 and a 2-1 intermediate driving body 525 which is coupled to the 3-1 substructure 431 at an intermediate portion thereof.

The fourth binding module 540 binds to the 2-3 binding part 523 which is bound to the 1-2 substructure 412 on one side, and to the third-2 substructure 432 on the other side. And a 2-4 intermediate drive unit 526 that is coupled to the 3-1 substructure 431 at an intermediate portion. The first-first binding unit 511 is provided with a first sensing module S1 to generate first sensing information by detecting a distance from the first-third binding unit 513 and the first-three binding unit 511. The binding unit 513 is provided with a second detection module S2 to detect the separation with the first-first binding unit 511 to generate second detection information, and the first-second binding unit 512. The third sensing module (S3) is provided to detect the degree of separation with the first-4 binding unit 514 to generate third detection information, the first-4 binding unit 514 is the fourth sensing module (S4) is provided to detect the degree of separation with the 1-2 binding unit 512 to generate the fourth detection information, the external monitoring means is preset based on the first detection information to the fourth detection information Status monitoring is performed by checking whether the reference range is out of range.

The 2-1 binding unit 521 is provided with a fifth sensing module S5 to generate a fifth sensing information by detecting a distance from the 2-3 binding unit 523 and generating the fifth sensing information. The binding unit 523 is provided with a sixth sensing module S6 to generate a sixth sensing information by detecting a separation degree from the 2-1 binding unit 521, and the second-2 binding unit 522. Is provided with a seventh detection module (S7) to detect the separation with the second-4 binding unit 524 to generate the seventh detection information, the second-4 binding unit 524 is an eighth detection module (S8) is provided to detect the separation with the second-2 binding unit 522 to generate the eighth sensing information, the external monitoring means is preset based on the fifth sensing information to the eighth sensing information Status monitoring is performed by checking whether the reference range is out of range.

The first binding module 510 and the second binding module 520 may be installed in a first separation installation mode installed to be spaced apart from each other, and in a first contact installation mode installed to be in contact with each other, and the third binding module may be installed. The 530 and the fourth binding module 540 may be installed in a second separation installation mode installed to be spaced apart from each other, and in a second contact installation mode installed to be in contact with each other. In the first contact installation mode, At least a part of the 1-1 intermediate drive body 515 is provided to be accommodated in the 1-2 intermediate drive body 516, and the 1-2 intermediate drive body 516 is provided as a pair to A first gripping portion 5151 is provided to press and fix at least a portion of the 1-2 intermediate intermediate body 516 therebetween, and in the second contact installation mode, the second intermediate intermediate body 525. ) Is provided so that at least a portion thereof is accommodated in the second-2 intermediate driving member 526, and the second-2 intermediate Body 526 is provided as a pair and a second grip portion (5261) for fixing to the pressure across at least a portion of the second-first middle driving body 525, it is provided.

Although the present invention has been described with reference to the embodiments shown in the drawings, this is merely exemplary, and it will be understood by those skilled in the art that various modifications and equivalent other embodiments are possible. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

100 SOP IC
110 package
120 contact terminal
200 test socket
210 substrates
220 printed electrode

Claims (6)

A method of manufacturing a test socket for a surface mount integrated circuit package,
Providing an SOP IC (100); Providing a substrate (P) for mounting the SOP IC (100); And mounting the SOP IC 100 on the substrate P.
The substrate P is processed in advance through the substrate factory value,
The substrate is factory installed, the substrate is provided on a predetermined body portion (BP) and the body portion (BP), the substrate is seated so as to process the upper surface of the substrate, by spraying air from the bottom of the seated substrate A plurality of air blowers for floating the seated substrate is formed to be provided on the mounting unit 10 and the main body portion (BP), the roller in contact with both sides of the substrate floated by the air blower in the transport direction It includes a conveying unit 40 to be conveyed,
The body portion (BP) is provided with an expansion portion 310 is mounted to the fixed module 300 at the bottom,
The fixing module 300 includes a first base module 320 on which the expansion part 310 is mounted, and a first base module 320 mounted on the first base module 320 and driven to be fixed to the expansion part 310. 1 includes a movable module 330,
The first movable module 330 may include a first driving body 331 provided to reciprocately flow in the first base module 320 and a first movable module 330 reciprocally flowable in the first base module 320. 2 driving body 332, the first movable body 3311 is interlocked with the first driving body 331, the first movable body 3311 for pressing one side of the fixed module 300, and the second driving body 332 It includes a second movable body (3321) for pressing the other side of the fixed module 300,
The first movable body 3311 and the second movable body 3331 are deeply entered into the expansion part 310 to press the expansion part 310.
The first movable module 330,
A first auxiliary movable body 3312 linked to the first driving body 331 and configured to pressurize and secure the expansion part 310 based on a tilting motion from above the first movable body 3311.
A surface further includes a second auxiliary movable body 3322 linked to the second driving body 332 to pressurize and secure the expansion part 310 based on a tilting motion above the second movable body 3331. Method of manufacturing test sockets for packaged integrated circuits. The method according to claim 1,
The first auxiliary movable body 3312 is
A first auxiliary driving body 3313 and an end portion of the first rotating body 3314 which are provided to be rotatable in the vertical direction from the first auxiliary driving body 3313 to be in contact with the expansion part 310 are provided.
The second auxiliary actuator 3322 is provided to be rotatable in a vertical direction from the second auxiliary driver 3323 and the second auxiliary driver 3323 at an end thereof and contacts the expansion part 310. 2 Method for manufacturing a test socket for a surface mount integrated circuit package having a rotor 3324.

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