JP2001044609A - Viscous fluid coating equipment and method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent imperfect coating due to warp of a board to a dispenser side and breakdown of the dispenser, the board, etc., in viscous fluid coating equipment having the dispenser which comes into contact with the surface of the board and spreads viscous fluid. SOLUTION: A light casting sensor 15 and a light receiving sensor 16 which detect warp to a dispenser side regarding a board 6 which is set by fixing the end portion are installed. Before a coating process is performed by using a dispenser 5, warp inspection wherein a sensor light is cast and received by the light casting sensor 15 and the light receiving sensor 16 is performed. As a result, it can be judged whether warp exists in the board 6 as an object to be coated. When it is judged that warp exists, a countermeasure can be applied.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a viscous fluid applying apparatus and method for applying a viscous fluid to a surface of a substrate of an electronic circuit.

[0002]

2. Description of the Related Art When mounting electronic circuit components on the surface of a substrate, an adhesive for temporarily fixing the components to the substrate, or a viscous fluid such as a solder paste or a conductive paste is applied. It is required that the rate of occurrence of coating defects such as stringing and scattering of a viscous fluid be reduced, and that high-speed coating be performed.

[0003] A conventional viscous fluid coating apparatus is as shown in FIGS. 9 and 10, and a Y table section 1 for holding a substrate.
Is attached to the robot arm 2 and is movable in the depth direction (Y-axis direction). The head unit 3 is held by another robot arm 4 movable in a direction (X-axis direction) perpendicular to the moving direction of the Y table unit 1 in a horizontal plane, and is movable in the X-axis direction. 3 is provided with a plurality of dispensers 5 that can move in the vertical direction (the Z-axis direction perpendicular to the XY plane).

The coating step will be described with reference to FIG. The substrate 6 conveyed into the Y table unit 1 is placed on a belt 7, sent along a rail 9 by rotation of a motor 8, and hits a stopper 10 and stops. The stop of the substrate 6 is detected by a sensor below the stopper 10, and the motor 8 is stopped after a predetermined time. At the same time, the support plate 11 is raised to a predetermined height by the operation of a cylinder (not shown), and the substrate 6 on the belt 7 is transferred to the support plate 11 and pressed against the upper rail 12. As a result, the end of the substrate 6 is sandwiched between the upper rail 12 and the support pins 13 on the support plate 11 from above and below, and the portion other than the ends is fixed by the support pins 13 while being supported from below. Along with that,
The dispenser 5 descends and the lower end is pressed against the surface of the substrate 6, and the viscous fluid pushed out from the nozzle 14
It is applied in a state of being transferred to the surface of the substrate.

[0005]

In the above-described conventional viscous fluid applying apparatus, the viscous fluid is applied regardless of whether the substrate 6 is warped or not. In the case where the substrate 6 is warped downward (the end protrudes upward), as described above, the end is sandwiched from above and below and the portion other than the end is supported from below, so that the warp is corrected. There is no. However, if the substrate 6 is warped (the center protrudes upward), the protruding portion is pushed down by the dispenser 5 during the transfer of the viscous fluid (lower dead center), and When the portion is released with the rise of the dispenser 5, the substrate 6 is vibrated, so that it is difficult to ensure good coating quality and coating position accuracy.

If the warpage is very large, the tip of the dispenser 5 may come into contact with the substrate 6 at times other than during transfer, and not only the dispenser 5, the substrate 6, the electronic components mounted on the substrate 6, but also the dispenser 5. There is a possibility that the robot or the like that operates 5 may be damaged. Even if the substrate 6 is warped,
Although it is possible to secure the coating quality by reducing the vertical movement speed of the dispenser 5 or increasing the stroke height, it is not advisable because tact is slowed down.

An object of the present invention is to solve the above-mentioned problems, and an object of the present invention is to prevent coating defects due to warpage of a substrate toward a dispenser side and to prevent damage to the dispenser and the substrate.

[0008]

According to a first aspect of the present invention, there is provided a viscous fluid applying apparatus having a dispenser for applying a viscous fluid in contact with a surface of a substrate. The apparatus is characterized in that a warp sensor for detecting a warp toward the dispenser side of a substrate fixedly installed at an end is provided.

According to this structure, the inspection by the warp sensor is performed before the coating process by the dispenser is started,
It is possible to determine whether or not the substrate to be coated has a warp toward the dispenser, and if it is determined that there is a warp, a corresponding measure can be taken. Thereby, it is possible to prevent the occurrence of coating failure due to the warpage of the substrate toward the dispenser side, and to make contact with the substrate and the dispenser, the substrate, the electronic component mounted on the substrate, the dispenser,
It is possible to prevent damage to the head unit and the robot unit that operate the dispenser.

According to a second aspect of the present invention, there is provided a viscous fluid applying apparatus according to the first aspect, wherein the warp sensors are disposed on both sides of the substrate so as to face each other, and the sensors are arranged in a direction along the surfaces of the ends of the substrates on both sides. It is a light emitting sensor and a light receiving sensor for transmitting and receiving light. According to this configuration, the sensor light from the light emitting sensor is received by the light receiving sensor by selecting the position where the sensor light is not blocked by the mounted component on the board and arranging the light emitting sensor and the light receiving sensor. If not, it can be determined that the substrate is warped.

According to a third aspect of the present invention, there is provided a viscous fluid applying apparatus according to the first aspect, wherein the warp sensor is provided so as to be able to approach and separate from the substrate, and when the warp sensor contacts the surface of the substrate at a predetermined detection position. It is a switch device that operates. According to this configuration, by setting the detection position at a position slightly closer to the dispenser than the surface of the substrate without warpage, it is possible to determine that the substrate is warped when the switch device operates.

According to a fourth aspect of the present invention, in the viscous fluid application device according to the first aspect, the warp sensor is capable of moving back and forth via a resilient material to a surface of a substrate support plate that supports the substrate on a side opposite to the dispenser. And a switch device that operates by contacting the surface of the substrate support plate when supporting the substrate and retreating to a predetermined substrate support position.

According to this configuration, if the switch device does not operate when the substrate support plate supports the substrate, the switch device does not retreat to a predetermined substrate support position, and the substrate is moved at the position of the switch device. It can be determined that it is warped. If multiple switch devices are provided at intervals,
It is possible to inspect warpage in multiple areas simultaneously. Further, in the method of applying a viscous fluid according to claim 5, when applying the viscous fluid in a state in which the dispenser is brought into contact with the surface of the substrate, the substrate fixed at the end portion is warped to the dispenser side prior to the application step. Is detected by a warp sensor, and when the warp is detected, a predetermined treatment selected from correction of the warpage of the substrate, replacement of the substrate, and adjustment of the stroke of the dispenser is performed, and thereafter, a coating process is executed.

According to this configuration, it is possible to prevent the occurrence of coating failure due to the warpage of the substrate toward the dispenser, and to prevent the occurrence of coating failure due to the contact between the substrate and the dispenser.
The substrate, the dispenser, and the accompanying components can be prevented from being damaged.

[0015]

Embodiments of the present invention will be described below with reference to the drawings. Since the viscous fluid application device according to the first embodiment of the present invention has substantially the same configuration as that of the conventional device described above with reference to FIGS. 9 and 10, illustration and description of the entire configuration are omitted. , The structure of the device near the Y-table unit 1 will be described with the same reference numerals as in FIGS.

As shown in FIGS. 1 and 2, the Y table 1
Is provided with a pair of rails 9 in the Y-axis direction along the carrying direction of the substrate 6, and along this rail 9, there is provided a belt 7 that travels by rotation of a motor 8 and conveys the substrate 6. An upper rail 12 for fixing the substrate 6 conveyed by 7 is provided. Further, a support plate 11 which is moved up and down by a cylinder (not shown) is provided, and the upper surface of the support plate 11 is brought into contact with the front end surface of the substrate 6 conveyed by the belt 7 to place the substrate 6 on a predetermined substrate. A stopper 10 that stops at the position is provided, and a plurality of support pins 13 that support the substrate 6 from below are attached. A sensor (not shown) for detecting the substrate 6 is provided below the stopper 10.

Further, as a warp sensor, a light-emitting sensor 15 and a light-receiving sensor 16 for transmitting and receiving sensor light S in a direction along the upper surface of the end of the substrate 6 are provided on the support plate 11 on the front side and the rear side of the substrate installation position. Are arranged to face each other. Here, the light emitting sensor 15 and the light receiving sensor 16 are provided so as to be easily inserted into and removed from a plurality of holes formed on the support plate 11, and the sensor light is blocked by the electronic components mounted on the substrate 6. Placed in a non-existent position.

The operation of the above configuration will be described. The substrate 6 conveyed into the Y table unit 1 is placed on a belt 7, sent along a rail 9 by rotation of a motor 8, and hits a stopper 10 and stops. The stop of the substrate 6 is detected by a sensor below the stopper 10, and after a certain time, the motor 8 is stopped.

When the substrate 6 stops, the support plate 11 is raised to a predetermined height by the operation of a cylinder (not shown), and the substrate 6 on the belt 7 is
And pressed against the upper rail 12. As a result, the end of the substrate 6 is sandwiched between the upper rail 12 and the support pins 13 on the support plate 11 from above and below, and the portion other than the ends is fixed by the support pins 13 while being supported from below.

In this state, the light emitting sensor 1
By projecting the sensor light S in a direction along the upper surface of the substrate end from 5, an upward warpage is inspected. When the sensor light S is received by the light receiving sensor 16, it is determined that the optical path is not blocked by the substrate 6 and the substrate 6 is not warped.
After the determination, the process proceeds to the application step, in which the dispenser 5 descends and the lower end is pressed against the surface of the substrate 6, and the viscous fluid pushed out from the nozzle 14 is applied in a state of being transferred to the surface of the substrate 6. When the application is completed, the dispenser 5 moves up to the next application position, and the operation of applying the viscous fluid is repeated, and the substrate 6 after the application is carried out of the apparatus in the reverse order to the above.

When the sensor light is not received by the light receiving sensor 16, it is determined that the optical path is blocked by the substrate 6 and the substrate 6 is warped. After the determination, the process is not shifted to the coating process, the apparatus is temporarily stopped, and the substrate 6 is carried out in the reverse procedure. After that, the loading of the substrate 6, the inspection of the warpage, the coating process (or without performing the coating process), and the transport of the substrate 6 are performed in the same manner as described above.

By performing the coating in this way, it is possible to prevent the occurrence of coating failure due to the warpage of the substrate 6, and to prevent the occurrence of coating failure caused by the contact between the substrate 6 and the dispenser 5.
It is possible to prevent the substrate 6, the electronic components mounted on the substrate 6, the dispenser 5, the head unit 3 that operates the dispenser 5, the robot arm 4, and the like from being damaged. When the upward warpage of the substrate 6 is detected, another measure such as correcting the warp by the correcting means or reducing the stroke speed of the dispenser 5 may be taken, whereby the same effect as described above can be obtained.

When the substrate 6 has a large warp as shown in FIG. 3, if the optical path in the Y-axis direction is set at the center of the substrate 6, the sensor light passes below the substrate 6 and As a result, since the warpage cannot be detected, the light-emitting sensor 15 and the light-receiving sensor 16 as shown in FIG.
Are arranged diagonally as much as possible. In the viscous fluid application device according to the second embodiment of the present invention, instead of the light projecting sensor 15 and the light receiving sensor 16 in the first embodiment, a contact with the upper surface of the substrate 6 as shown in FIG. Is provided.

The switch device 17 is connected to the dispenser 5
Is attached to the lower end of a cylinder 18 provided on the side of the substrate 6 and moves to an arbitrary position in the direction along the surface of the substrate 6 along with the dispenser 5 above the substrate 6, and then a predetermined detection is performed by the cylinder 18. It descends to the position (slightly above the upper surface of the substrate end). When the switch device 17 operates at this detection position, the upper surface of the substrate 6 is located above the upper surface of the substrate end at any position, and it is determined that the substrate 6 is warped. After the detection is completed, the switch device 17
Is returned to the standby position above the nozzle 14 by the cylinder 18.

In the viscous fluid application device according to the third embodiment of the present invention, instead of the light emitting sensor 15 and the light receiving sensor 16 in the first embodiment, a warp sensor is used as shown in FIGS.
As shown in FIG. 8, a switch unit 19 that operates by contact with the upper surface of the support plate 13 is provided.
In this case, the plurality of support pins 13 that support the substrate 6 from below fit into the holes 20 formed on the upper surface of the support plate 11 to a predetermined substrate support position (depth) depending on the flange portion 13a. ing. The support pin 13 at an arbitrary position among them has a spring 21 and the above-mentioned switch part 19 at the lower end, and the support pin 13, the spring 21 and the switch part 19 constitute a switch device. That is,
When no load is applied from the substrate 6, the support pins 13 advance to the upper standby position by the biasing force of the spring 21, while the substrate is fixed at the end as described above and forms a horizontal direction. When a load is applied from the position 6, the spring 21 is fitted to the substrate supporting position against the urging force of the spring 21, so that the switch portion 19 comes into contact with the bottom surface of the hole portion 20. However, in order to avoid warpage of the substrate 6 due to the spring 21, the fixed substrate 6
Of the spring 2 compared to the reaction force acting on the support pin 13 from the
The force by which 1 lifts the support pin 13 is set very small.

According to this configuration, the support plate 11
Is raised, the support pin 13 provided with the switch portion 19 comes into contact with the substrate 6, and is pressed while receiving a reaction force from the substrate 6 while compressing the spring 21. The portion 19 operates by contacting the bottom surface of the hole 20. Therefore, when the switch section 19 does not operate, the support pins 13 do not support the substrate 6 in the horizontal direction, and it is determined that the substrate 6 is warped. In this way, the warpage can be inspected simultaneously at arbitrary plural places on the substrate 6.

[0027]

As described above, according to the present invention, by providing the warp sensor for detecting the warpage of the substrate toward the dispenser side, it is possible to determine the presence or absence of the warp before proceeding to the coating process by the dispenser. When it is determined that there is a warp, measures such as stopping the apparatus, correcting the warp or removing the substrate, and reducing the stroke speed of the dispenser can be taken. As a result, it is possible to prevent the occurrence of coating defects due to warpage, and to prevent damage to the substrate, electronic components mounted on the substrate, the dispenser, and the head unit and the robot unit that operate the dispenser due to the contact between the substrate and the dispenser. Can be prevented.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a Y table portion of a viscous fluid application device according to a first embodiment of the present invention, which is provided with a light emitting sensor and a light receiving sensor.

FIG. 2 is an explanatory diagram showing a warpage inspection method using a light emitting sensor and a light receiving sensor of the viscous fluid application device of FIG. 1;

FIG. 3 is an explanatory view showing a state in which a warped substrate is inspected by a light emitting sensor and a light receiving sensor of the viscous fluid application device of FIG. 1;

FIG. 4 is an explanatory view showing that a light emitting sensor and a light receiving sensor of the viscous fluid application device of FIG. 1 are arranged diagonally with respect to a substrate.

FIG. 5 is an explanatory view showing a warp sensor of a viscous fluid application device according to a second embodiment of the present invention, showing a switch device attached to a dispenser.

FIG. 6 is an explanatory diagram showing a warp sensor of a viscous fluid application device according to a third embodiment of the present invention, showing a switch device attached to a support pin.

FIG. 7 is an explanatory diagram showing a state in which a warpage inspection is performed on a horizontal substrate by using the switch device shown in FIG. 6;

FIG. 8 is an explanatory diagram showing a state in which a board warped by the switch device shown in FIG. 6 is inspected for warpage;

FIG. 9 is an explanatory diagram showing a schematic overall configuration of a conventional viscous fluid application device.

FIG. 10 is a perspective view showing a Y table section of the viscous fluid application device of FIG. 9;

[Explanation of symbols]

 5 Dispenser 6 Substrate 11 Substrate support plate 15 Light emitting sensor 16 Light receiving sensor 17 Switching device 18 Cylinder 19 Switching device 21 Spring

──────────────────────────────────────────────────続 き Continuation of the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat 参考 (Reference) B05D 3/00 B05D 3/00 D 7/00 7/00 H B23K 1/00 B23K 1/00 A 3 / 06 3/06 ES (72) Inventor Naka Hachiro 1006 Kadoma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Inventor Eiichiro Terayama 1006 Odaka Makoto Kadoma City, Osaka Matsushita Electric Industrial Co., Ltd. 72) Inventor Joru Inaba 1006 Kazuma Kadoma, Kadoma City, Osaka Prefecture F-term (reference) 4D075 AC07 AC93 AC99 CA48 DA06 DB31 DC21 4F041 AA02 AA05 AB01 BA22 BA52 BA56 4F042 AA02 AA06 BA08 BA27 DF28 DF34 5319 CD45

Claims (5)

[Claims] 1. A viscous fluid application device having a dispenser for applying a viscous fluid in contact with a surface of a substrate, wherein a warp sensor for detecting a warp toward the dispenser side is provided for a substrate fixedly installed at an end. A viscous fluid application device. 2. A warp sensor, comprising: a light-emitting sensor and a light-receiving sensor which are arranged on both sides of a substrate so as to face each other, and which transmit and receive sensor light in a direction along a surface of an end portion of the substrate on both sides. The viscous fluid application device according to claim 1, wherein 3. The viscous fluid according to claim 1, wherein the warp sensor is a switch device that is provided so as to be able to approach and separate from the substrate, and that operates when it comes into contact with the surface of the substrate at a predetermined detection position. Coating device. 4. A warp sensor is provided on a surface of a substrate support plate for supporting a substrate on a side opposite to the dispenser so as to be able to move back and forth through an elastic material, and supports the substrate and retreats to a predetermined substrate support position. 2. The viscous fluid application device according to claim 1, wherein the device is a switch device that operates in contact with the surface of the substrate support plate. 5. When applying a viscous fluid in a state in which a dispenser is brought into contact with the surface of a substrate, prior to the application step, a warp sensor detects a warp toward a dispenser side of a substrate fixed and installed at an end portion, A method for applying a viscous fluid, comprising: when a warp is detected, performing a predetermined treatment selected from correction of the warp of the substrate, replacement of the substrate, and adjustment of a stroke of a dispenser, and thereafter performing an application step.