KR20230096516A - Automatic release of protective film on printed-circuit board - Google Patents

Abstract

The present invention relates to an automatic peeling machine for protective films of printed circuit boards, and more specifically to the automatic peeling machine for protective films of printed circuit boards in which an aligner aligns the boards with protective films attached to the top or bottom loaded on a table, the boards are fixed by a corner clamp pressing the same from the top, and pressure is applied to the boards except for ends where the protective films are peeled of when a pressure roller equipped with adhesive tape moves forward and backward while pressing the protective film to remove the protective film in an upper tape peeling robot. Thus, the boards are prevented from rising when the protective film is peeled off. The automatic peeling machine for protective films on printed circuit boards includes a corner clamp; a lower shuttle; and an upper tape peeling robot.

Description

Automatic release of protective film on printed-circuit board}

The present invention relates to an automatic protective film peeler for a printed circuit board, and more particularly, an aligner aligns a substrate loaded with a protective film on the upper or lower surface loaded on a table, and a corner clamp presses and fixes the upper tape from the upper side. In the robot, the pressure roller equipped with the adhesive tape moves forward and backward while the protective film is pressed, and pressurizes the protective film except for the end where the protective film is peeled off when removing the protective film so that the substrate does not rise when the protective film is peeled. It relates to an automatic peeler for protective film of a circuit board.

In general, a printed circuit board (PCB) connects each electronic device to each other and supplies power by printing the necessary circuit wiring on a thin board made of epoxy or phenol resin with copper foil. It means a substrate that can operate a circuit after application, and has a conductive function, an insulating function, and a supporting function. Therefore, since the design of the printed circuit board (PCB) is directly related to the operation, performance, lifespan, and reliability of the product, it is in a very important position in the manufacture of electronic products. The printed circuit board (PCB) as described above is an electronic component that serves to connect various components such as semiconductors, capacitors, resistors, etc. It is used in all electronic devices, from computers to mobile phones to satellites.

On the other hand, the printed circuit board (PCB) includes a flexible (flexible) printed circuit board (FPCB: Flexible Printed Circuits Board) and a rigid printed circuit board (RPCB: Rigid Printed Circuits Board). Such a printed circuit board (PCB) Unlike the conventional Rigid Printed Circuit Board (RPCB), which has a hard substrate, the flexible printed circuit board (FPCB) has a thin and flexible material, so the demand for it is rapidly increasing due to the multimedia and light-thin miniaturization of electronic products. Among circuit boards (PCBs), flexible printed circuit boards (FPCB) are electronic components developed to respond to the trend of miniaturization and complexity of electronic products. It has the advantage of being low in heat and resistant to heat, and can reduce working time during assembly work.

As described above, the printed circuit board (PCB) is a substrate by attaching a protective film to the upper and lower surfaces of the printed circuit board (PCB) for a product that has been checked for abnormalities by removing contaminants on the surface of the board during the manufacturing process. It is intended to protect the face. Therefore, in order to insert various components such as semiconductors, capacitors, and resistors on the printed circuit board, the protective film attached to the printed circuit board (PCB) surface must be removed.

On the other hand, although this protective film removal process was automated manually, there were many defects such as not being properly removed or circuit parts being damaged during the removal of the protective film, so it was cumbersome to manually select again.

Accordingly, Registered Patent Publication No. 10-0855078 discloses a printed circuit board transfer means for transferring an inputted printed circuit board in one direction, a printed circuit board support and fixing means for temporarily supporting and fixing the printed circuit board, and the printed circuit board support and fixing means. A protective film initial peeling means for initially peeling the protective film of the front end of the printed circuit board supported and fixed by, a protective film adhesive roller for adhering the protective film of the printed circuit board and completely peeling the protective film from the printed circuit board, and the printing In the printed circuit board protective film peeling device having a configuration including a means for discharging the protective film peeled off from the circuit board into a protective film collection box, the protective film ejection means is on the circumferential surface of the two protective film adhesive rollers installed vertically. Doedoe formed to a certain depth in the belt hanger grooves formed at regular intervals on a mutually corresponding position; first support rollers rotatably installed at a predetermined distance apart from each other on the upper and lower sides of the protective film adhesive roller so as to be combined with the upper and lower protective film adhesive rollers; upper and lower first protective film transfer belts that are wound around the belt hanging groove of the protective film adhesive roller and the first support roller with a constant tension and are rotated by the rotation of the protective film adhesive roller; a plurality of second support rollers installed on the outer periphery before and after the first protective film conveying belt on the upper side of the upper side of the conveying line of the printed circuit board conveying means; It is hung on the second support roller and is configured to rotate in the same direction as the upper first protective film conveying belt through surface contact on the rear and front outer surfaces of the upper first protective film conveying belt. The upper side that transfers the protective film peeled off from the upper side of the circuit board to the lower part of the front via the upper side from the rear of the first protective film transport belt on the upper side in a state of being pressed between the first protective film transport belt on the upper side. a second protective film transfer belt; third support rollers rotatably installed in parallel above and below the front side of the first protection film transfer belt at the lower side of the lower side of the transfer line of the printed circuit board transfer unit; The hook is wound around the third support roller and configured in parallel, but in surface contact with each other, the protective film transported by the upper first protective film conveying belt and the upper second protective film conveying belt is handed over between the parallel upper sides. a third protection film transfer belt on the upper side for transporting to the protection film collection box on the lower side; a plurality of fourth support rollers installed rotatably up and down on the rear side of the lower first protective film conveying belt; and the fourth support roller being hung and rotated in the same direction as the lower first protective film conveying belt through surface contact on the outer surface of the rear side of the lower first protective film conveying belt. The protective film peeled from the lower side of the lower side is transferred to the lower side of the lower side first protective film transport belt in a state of being pressed between the lower side first protective film transport belt and recovered to the protective film collection box. 2 A printed circuit board protective film peeling device consisting of a protective film transfer belt is posted. The prior art has disadvantages in that the peeling efficiency per hour is low, the accuracy of the peeling action is low, and the configuration of the device is complicated.

In order to solve this problem, Patent Registration No. 10-1119571 automatic peeling machine and film peeling method for semiconductor printed circuit boards tried to accurately and completely peel the protective film of the substrate, but the substrate (S) and the film (F ) The heat of the high-temperature heater heated by the scratching machine that forms a gap between the films creates gaps and scratches, which can damage the substrate. After peeling the upper protective film, the substrate is rotated to peel the lower protective film. As a result, the process was complicated and time-consuming.

KR 20-0433952 (registration number) 2006.12.07. KR 10-0855078 (registration number) 2008.08.22. KR 10-1119571 (registration number) 2012.02.16.

The present invention has been made to solve the above problems,

The aligner aligns the board with the protective film attached to the upper or lower surface loaded from the loading machine on the table, the corner clamp presses and fixes one edge of the board, and the pressure roller equipped with the adhesive tape in the upper tape peeling robot removes the protective film. The purpose is to provide an automatic peeler for the protective film of a printed circuit board that prevents the substrate from rising when the protective film is peeled by pressing except for the end where the protective film is peeled when the protective film is removed by moving forward and backward in a pressurized state. there is.

Another object of the present invention is to align the substrate in an aligner and fix the protective film overlapping the substrate at both edges of one corner of the substrate in a corner clamp, so that the edge of the substrate receiving a lifting force when the pressure roller rolls on the protective film It is to provide an automatic protective film peeler of a printed circuit board that stably holds the substrate so that the substrate does not rise along with the protective film by pressing it with a wide surface and easily peels the protective film from the upper tape peeling robot.

Another object of the present invention is to help reliable adhesion between the adhesive tape and the protective film by means of a pressure roller made of a rubber material having a predetermined elasticity, and to peel off the adhesive tape and the protective film without damage or damage to the printed circuit board It is to provide a protective film automatic peeling machine.

Another object of the present invention is that the protrusion directly presses the edge of the protective film overlapping the substrate in the corner clamp, but the protrusion presses and fixes the area excluding the area where the adhesive tape touches, so that the rolling operation of the pressure roller is not disturbed. It is to provide an automatic peeling machine for the protective film of a printed circuit board that prevents the board from rising along the film.

In order to achieve the above object, the present invention moves forward and backward and up and down at the edge around one edge of the substrate (S) to which the protective film is attached to the upper or lower surface, and the front surface of the substrate (S) without the protective film and the substrate (S) ) and a corner clamp 220 for pressing and fixing the overlapping protective film from the top; The lower part adsorbs the substrate (S) and operates the corner clamp 220 to clamp the front edge of the substrate (S), moves forward a certain distance and returns when the upper tape peeling robot 300 rises and moves backward. Shuttle 200 and; In the state where the substrate (S) is fixed, it descends onto the protective film located at the frontmost part of the upper surface of the substrate (S), moves backward while pressing the protective film, moves to the original position in the front, and then presses it back again, After moving, it rises and moves backward, and includes an upper tape peeling robot 300 including a pressure roller 330 made of rubber at the bottom, wherein the upper tape peeling robot 300 includes a plurality of guide rollers 320 and Between the providing roller 321 on which the adhesive tape 310 for removing the protective film is wound, the winding roller 322 for receiving and winding the adhesive tape 310, and the guide roller 320 It includes a driving roller 323 providing driving force.

In the present invention, when the upper tape peeling robot 300 descends and the adhesive tape 310 located outside the pressure roller 330 contacts the protective film and then moves back and forth, the drive roller 323 is rotated so that the adhesive tape ( 310) rotates on the pressure roller 330, and the upper tape peeling robot 300 rises and presses the protective film attached to the adhesive tape 310 located outside the pressure roller 330 before moving backward. A clamp holder 340 for fixing and fixing is installed on one side of the pressure roller 330.

The corner clamp 220 of the present invention fixes both sides of the corner except for the vertex portion of the substrate (S), and a protrusion 221 for fixing the protective film is further formed, and the protrusion 221 is attached to the adhesive tape in the protective film. The substrate (S) and the protective film are simultaneously fixed so that the substrate (S) does not go up by the adhesive tape (310) by pressing a portion except for the area contacted by (310).

The adhesive force of the adhesive tape 310 of the present invention is stronger than the adhesive force between the substrate (S) and the protective film, and the pressure roller 330 made of rubber is in close contact with the protective film when it is in contact with the upper part of the protective film. face to face

Therefore, in the automatic peeling machine for the protective film of the printed circuit board of the present invention, the aligner aligns the board with the protective film attached to the upper or lower surface loaded from the loading machine on the table, the corner clamp presses and fixes one corner of the board, and the upper tape In the peeling robot, the pressure roller equipped with the adhesive tape moves forward and backward while the protective film is pressed, so that the substrate does not rise when the protective film is peeled by pressurizing except for the end where the protective film is peeled when the protective film is removed. has the effect of

In addition, the present invention aligns the substrate in an aligner and fixes the protective film overlapping with the substrate at both edges of one corner of the substrate in a corner clamp, so that the edge of the substrate receiving a lifting force when the pressure roller rolls on the protective film Pressing with a wide surface stably holds the substrate together with the protective film so that the substrate does not go up, and has the effect of helping the protective film to be easily peeled from the upper tape peeling robot.

In addition, the present invention has the advantage of peeling without damage or damage to the adhesive tape and the protective film by helping reliable adhesion between the adhesive tape and the protective film by means of a pressure roller made of a rubber material having a predetermined elasticity.

In addition, in the present invention, the protrusion directly presses the edge of the protective film overlapping the substrate in the corner clamp, and the protrusion presses and fixes the area excluding the area where the adhesive tape touches, so that the substrate does not interfere with the rolling operation of the pressure roller. It also has the advantage of preventing it from climbing along the film.

1 is a schematic perspective view of an automatic peeling machine for a protective film of a printed circuit board according to an embodiment of the present invention;
2 is a perspective view showing a state in which a substrate is loaded and placed on a table in a loading machine of an automatic peeling machine for a protective film of a printed circuit board according to an embodiment of the present invention;
3 is a perspective view showing a state in which the substrate is aligned in the aligner of the lower shuttle of the automatic peeling machine for the protective film of the printed circuit board according to an embodiment of the present invention;
4 is a perspective view showing a state in which a corner clamp fixes a substrate according to an embodiment of the present invention;
5 (a) is a perspective view showing a state in which the right corner clamp moves forward and backward and ascends and descends according to an embodiment of the present invention;
5 (b) is a perspective view showing a state in which the left corner clamp moves according to an embodiment of the present invention;
6 is a perspective view showing a state in which the upper tape peeling robot of the automatic peeling machine for the protective film of the printed circuit board moves backward and descends according to an embodiment of the present invention;
7 is a perspective view showing a state in which the upper tape peeling robot of the automatic peeling machine for the protective film of the printed circuit board according to an embodiment of the present invention moves backward from the upper part of the substrate,
8 is a perspective view showing a state in which the upper tape peeling robot of the automatic peeling machine for the protective film of the printed circuit board according to an embodiment of the present invention moves forward from the top of the substrate;
9 is a perspective view showing a state in which the upper tape peeling robot of the automatic protective film peeling machine of the printed circuit board peels the upper film from the substrate according to an embodiment of the present invention;
10 is a perspective view showing a state in which the upper tape peeling robot of the automatic protective film peeler of the printed circuit board according to an embodiment of the present invention completely peels the upper film from the substrate,
11 is a state in which the upper tape peeling robot moves forward along the second horizontal rail and the lower shuttle moves backward along the third horizontal rail in the automatic peeling machine for the protective film of the printed circuit board according to the embodiment of the present invention. is a perspective view showing

Hereinafter, with reference to the accompanying drawings, a preferred embodiment of the present invention will be described so that those skilled in the art can easily implement it.

As shown in FIGS. 1 to 11, the present invention is an automatic protective film peeler for a printed circuit board (hereinafter, a substrate (S)),

An aligner 210 for aligning the substrate S to which the upper film F1 and the lower film are attached to the upper and lower surfaces loaded by the loader 100 on the table 10;

It moves forward and backward and ascends and descends at the edge around one edge of the aligned substrate (S), and a part of the upper film (F1) overlapping the substrate (S) together with the front surface of the substrate (S) without the upper film (F1). A corner clamp 220 that is pressed and fixed from the top,

The lower shuttle that adsorbs the substrate and operates the corner clamp 220 to clamp the front edge of the substrate S, and moves forward by a certain distance and returns when the upper tape peeling robot 300 moves backward and moves for a long time. (200) and

In the state where the substrate (S) is fixed, it descends onto the upper film (F1) located at the frontmost part of the upper surface of the substrate (S), presses the upper film (F1) and moves slightly backward by a certain distance, then returns to the original position in the front. It moves, and then moves while pressing the upper film F1 again diagonally, then rises and moves backward, and includes an upper tape peeling robot 300 including a pressure roller 330 made of rubber at the bottom. .

In the present invention, the front is the direction in which the loader 100 transfers the substrate S onto the table 10 of the lower shuttle 200, and the rear is the direction opposite to the front, in which the upper tape peeling robot 300 moves the table ( 10) means the direction of movement upward.

In the present invention, the film and the protective film are used in combination, and it is used to mark the upper or lower film.

The upper tape peeling robot 300 includes a plurality of guide rollers 320, a providing roller 321 wound with an adhesive tape 310 that is attached to the upper film F1 to remove the upper film F1, and It includes a winding roller 322 that receives and winds the tape 310 and a drive roller 323 that provides a driving force between the guide rollers 320 .

In addition, the upper tape peeling robot 300 descends, and the adhesive tape 310 located outside the pressure roller 330 contacts between the upper film F1, the end, and the corner clamp 220, and then moves forward and backward and diagonally. When the drive roller 323 is rotated, the adhesive tape 310 is rotated on the pressure roller 330, and the upper tape peeling robot 300 rises to the outside of the pressure roller 330 before moving backward. A clamp fixing table 340 for pressurizing and fixing the adhesive tape 310 and the attached upper film F1 located at is installed on one side of the pressure roller 330.

The substrate (S) is a printed circuit board (PCB), and the upper film (F1), which is a protective film, is attached to the upper surface, and the lower surface is attached to the lower surface by the loading machine 100. It is adsorbed, rotated 45 degrees, and loaded onto the table 10. Then, when the substrate (S) is loaded on the table 10, the aligner 210 aligns the substrate (S) on the side of the table (10).

The loader 100 includes a shuttle frame that reciprocates along a first horizontal rail R1, an upper and lower driving means integrally fixed to the shuttle frame, and an intermediate plate that is moved up and down by the upper and lower driving means, It is connected to the lower part of the middle plate by a spring and includes a suction plate part for adsorbing the substrate (S) by vacuum.

The substrate S loaded on the table 10 by the loader 100 is aligned by the aligner 210, and the upper film F1 ), and at the same time, the protruding part 221 protruding from the corner clamp 220 presses and fixes the part of the upper film F1 overlapping the substrate S from the top.

At this time, the aligner 210 moves forward and backward along the horizontal grooves 11 and vertical grooves 12 formed from the edge to the center of the table 10 by the first transport means 211, and By pressing the substrate (S) from the opposite side by the installed stopper (13), aligning the substrate (S) based on the stopper (13) at the front end of the table (10) and moving it back to the outside to release the pressurized state of the substrate (S) do.

The aligner 210 has a first transport unit 211 that moves forward and backward by a motor, and a fixing bar 212 installed in front of the first transport unit 211 . The fixing bar 212 is made of a shock-absorbing material to prevent damage to the substrate S when the substrate S is fixed. Such an aligner may exist in various forms, and a known substrate aligner may be used.

In addition, the lower shuttle 200 on which the aligner 210 is installed has a table 10 on the top and a corner clamp 220 is installed at the corner to clamp the front edge of the substrate S, and the upper tape When the peeling robot 300 ascends and moves backward for a long time, it is provided to move forward by a certain distance and then return.

The corner clamps 220 are two devices in which protrusions 221 are formed to fix both edges of the edge of the substrate S, A second transfer means 222 for forward and backward movement and a third transfer means 223 for ascending and descending are provided so that the substrate S overlaps with the substrate S at the corner of the substrate S at the same time. A portion of the upper film (F1) can be fixed.

At this time, the protruding portion 221 is a part of the upper film F1, one device (substrate S ) is protruded forward in a straight line on a device located on the left side of the center, and bent in a shape of a letter on the side of another device (a device located on the right side with respect to the substrate S). Accordingly, the protruding part 221 may be provided with a left protruding part 221a protruding from the left side and a right protruding part 221b protruding from the right side.

The protrusion 221 does not fix the edge of the upper film, but simultaneously presses the substrate and the upper film F1 at a position spaced apart from the edge. It becomes an enclosing rectangle. This can hinder the lifting force for raising the upper film (F1) and the substrate (S) with a wide surface contact, thereby preventing the substrate from rising when the protective film is removed. In addition, since the substrate and the protective film are simultaneously pressed, an error does not occur even if there is some clearance between the protrusions 221 . A substrate without a protective film has a very narrow space of only about 3mm, but a substrate with a protective film can be widened in the case of an edge, so there is no error in pressurization.

As such, the corner clamp 220 except for one corner of the substrate S and a portion of the upper film F1, in particular, the portion where the adhesive tape 310 wound around the pressure roller 330 touches the upper film F1. A portion is fixed using the protrusion 221, and when the pressure roller 330 moves forward, backward, forward again, backward again, and then rises, the second transfer means 222 moves backward and moves away from the substrate S and the upper film F1. Fall down.

The corner clamp 220 solves the problem that may occur due to the weak part holding the substrate S when only the substrate S is held by pressing the substrate S and a part of the upper film F1 at the same time. It holds the tape 310 except for the contact portion so as not to interfere with the rolling operation of the pressure roller 330.

As such, when the aligner 210 aligns the substrate S, the corner clamp 220 moves and fixes one corner of the substrate S and a portion of the upper film F1. At this time, the corner clamp When 220 strongly presses the substrate (S), the upper tape peeling robot 300 descends from the top of the table 10 and contacts the substrate (S), and the adhesive tape ( The pressure roller 330 provided with 310) reciprocates a certain distance to adsorb the upper film F1, and the clamp holder 340 catches the upper film F1 adsorbed to the pressure roller 330 and moves backward. It is made to peel from the board|substrate S.

In this way, the upper tape peeling robot 300 is the upper film F1 located at the frontmost part of the upper surface of the substrate S in a state where the substrate S is fixed by the corner clamp 220 of the lower shuttle 200. ) After descending upward, it moves slightly backward while pressing the upper film (F1), then moves to the original position in the front, and then moves diagonally while pressing the upper film (F1), then rises and moves backward for a long time.

In addition, when the upper tape peeling robot 300 ascends and moves backward for a long time, the lower shuttle 200 moves forward by a predetermined distance to facilitate peeling of the upper film F1.

Here, the reciprocating distance before the upper tape peeling robot 300 ascends is a small distance of about 1 to 2 cm, and the distance it moves after ascending should be a sufficient distance for the upper film F1 to be separated from the substrate.

As a result of the test, even when the adhesive force of the adhesive tape 310 of the upper tape peeling robot 300 is greater than the adhesive force between the upper film F1 and the substrate, some of the upper tape peeling robot 300 moving diagonally in the first order About 80% of the peeling was performed by, and 99.9% of the peeling effect was obtained when the second diagonal movement was performed.

On the other hand, the upper tape peeling robot 300 is attached to the plurality of guide rollers 320 and the upper film F1 to remove the upper film F1. The supply of the adhesive tape 310 is facilitated by including a driving roller 323 providing a driving force between the winding roller 322 and the guide roller 320 that receives and winds the tape 310 .

At this time, at the lower end of the upper tape peeling robot 300, a pressure roller 330 made of rubber, on which an adhesive tape 310 is disposed outside, is installed to elastically contact the substrate S and prevent damage to the substrate S. It will give a buffering effect.

In addition, the upper tape peeling robot 300 is provided with a lifting device 350 and moves along the rail in the vertical direction, descends and rises, contacts the substrate S, and falls, and is transported mounted on the lifting device 350. It is provided to move forward and backward along the second horizontal rail R2 made of a long bar shape by means 351.

On the other hand, the adhesive force of the adhesive tape 310 is stronger than the adhesive force between the substrate S and the upper film F1, and the pressure roller 330 made of rubber is in contact with the upper film F1. It adheres by pressing and makes surface contact. This pressurization must be continuously performed during the first movement, which slightly moves while contacting the upper film, and the second movement after returning to the original position.

In addition, the corner clamp 220 removes the vertex portion of the substrate (S) and fixes both sides of the corner and a part of the upper film (F1) to prevent the substrate (S) from being raised to the top by the adhesive tape (310). S) plays a role in holding it.

In addition, the loading machine 100 reciprocates along the first horizontal rail R1, and the upper tape peeling robot 300 reciprocates along the second horizontal rail R2 to remove the upper film F1. While transporting, the lower shuttle 200 reciprocates on the third horizontal rail R3 installed below the second horizontal rail R2.

And, the automatic protective film peeler of the printed circuit board includes a lower tape peeling robot that removes the lower film from the lower part of the substrate (S) in the same form as the upper tape peeling robot 300.

At this time, an upper shuttle is provided to adsorb and transfer the substrate S from which the upper film F1 is peeled off from the upper tape peeling robot 300 from the lower shuttle 200 to peel the lower film, and the upper shuttle A shuttle frame that reciprocates left and right along the horizontal rail, an upper and lower driving means integrally fixed to the shuttle frame, an intermediate plate that is moved up and down by the upper and lower driving means, and a spring connected to the lower part of the intermediate plate and includes an adsorption plate unit for adsorbing the substrate S by vacuum.

Further, in the present invention, a film dumper that picks up and discards the peeled upper film F1 and lower film attached to the adhesive tape in the upper tape peeling robot 300 and the lower tape peeling robot may be further provided.

The lower tape peeling robot, in a state where the substrate (S) is fixed by the upper shuttle, rises above the lower film located on the frontmost side of the lower surface of the substrate (S), presses the lower film, moves backward slightly, and then moves to the front original position. Then, after moving diagonally, it descends and moves backward to peel the lower film, and includes a pressure roller made of rubber to which an adhesive tape for peeling the lower film is attached to the top.

On the other hand, the upper tape peeling robot 300 descends and presses the adhesive tape 310 located outside the pressure roller 330 after contacting the upper film F1, and when moving forward and backward and diagonally, the driving roller 323 ) to rotate the adhesive tape 310 on the pressure roller 330, and before the upper tape peeling robot 300 moves backward for a long time, the adhesive tape 310 located outside the pressure roller 330 and A clamp holder 340 for pressurizing and fixing the attached upper film F1 is installed on one side of the pressure roller 530 to help peel the upper film F1.

In addition, the lower tape peeling robot has a plurality of guide rollers and a lower film attached to the lower film in the same manner as the upper tape peeling robot 300, a supply roller with an adhesive tape wound thereon, a winding roller and a guide that receives and winds the adhesive tape It includes a drive roller that provides a driving force between the rollers, and the lower tape peeling robot rises and the adhesive tape located outside the pressure roller contacts the lower film, and then rotates the drive roller when moving forward and backward and diagonally, so that the adhesive tape is removed. It rotates on the pressure roller.

In addition, even when the lower film is peeled off, even a part of the lower film overlapping the substrate (S) is fixed with the protrusion of the corner clamp in the same way as when the upper film (F1) is peeled off, but the substrate ( It is possible to peel the lower film from the substrate (S) in a state in which S) is fixed so that it does not go up along the lower film.

In the peeling method using the automatic peeling machine for the protective film of the printed circuit board according to the embodiment of the present invention, the substrate (S) to which the film is attached on the upper and lower surfaces is rotated by 45 degrees with the loading machine 100 and placed on the lower shuttle 200. After loading, aligning the substrate (S) with the aligner 210 disposed on the lower shuttle 200, adsorbing and holding, the front surface of the substrate (S) to which the upper film (F1) is not attached, and the substrate A part of the upper film (F1) overlapped with (S) is fixed with a corner clamp 220, and the upper tape peeling robot 300 descends to remove the adhesive tape 310 located outside the pressure roller 330. After making surface contact with the end of (F1), the upper film (F1) and the adhesive tape (310) are attached by moving the upper tape peeling robot 300 backward and forward simultaneously with the rotation of the drive roller 323. Then, in a state where the upper film (F1) is attached to the adhesive tape (310), the clamp holder (340) installed on the side of the pressure roller (330) is moved forward to fix the upper film (F1) to the pressure roller (330), In a state where the upper film F1 is fixed to the pressure roller 330, the upper tape peeling robot 300 is moved backward and at the same time the lower shuttle 200 is moved forward to remove the upper film F1.

At this time, the upper shuttle adsorbs the substrate S moved by the lower shuttle 200 while the upper film F1 is peeled off, and the lower shuttle 200 moves to its original position.

Then, the lower tape peeling robot rises from the lower part of the upper shuttle and, like the upper tape peeling robot, the adhesive tape located outside the pressure roller makes surface contact with the end of the lower film, and the lower tape peeling robot simultaneously rotates the drive roller. The lower film and the adhesive tape are attached by moving backward and forward, and while the lower film is attached to the adhesive tape, the clamp holder installed on the side of the pressure roller is moved forward to fix the lower film to the pressure roller, and the lower film is fixed to the pressure roller. In this state, the lower tape peeling robot is moved backward and the upper shuttle is raised at the same time to remove the lower film.

In the present invention, when the upper tape peeling robot 300 including the adhesive tape 310 disposed outside the pressure roller 330 is first moved backward, the film is peeled by about 80%, and the film is peeled by about 20%. is adhered to the substrate as it is, but in order to peel off about 20% of the film remaining on the substrate, the film is completely peeled off when the upper tape peeling robot 300 is moved forward and then moved diagonally.

On the other hand, the automatic peeling machine for the protective film of the printed circuit board according to another embodiment of the present invention (not shown),

The contact-type thickness measurement unit 230 measures the thickness of the substrate (S) in the alignment operation section before the substrate (S) is put into the separation unit to check whether two sheets of protective film are put in, and when two sheets are put into the input box An input unit aligning device (not shown) that receives the substrate S and proceeds with a re-insertion operation;

A knurling unit (not shown) that peels off the protective film by moving the circular knurling tool to the surface of the substrate (S) seated on the table of the peeling unit and then moving it left and right;

A peeling unit (not shown) performing a peeling operation by taping the spaced protective film using an adhesive tape after the knurling operation in the knurling unit;

and a detection unit (not shown) for detecting non-separation of the protective film or tearing of the protective film during separation by using a color sensor to detect minute color differences between the protective film and the core after the protective film peeling operation in the peeling unit.

The input unit aligning device aligns the substrate (S) on the table (10) before the substrate (S) is put into the separation unit, and then the thickness measuring unit (230) advances and descends along the rail made of a cylinder to measure the thickness. , Using the thickness measuring unit 230, based on the thickness value of the substrate (S) input by the operator, it is checked whether there are two sheets of protective film, and when two sheets are input, the substrate (S) is received in the input box and reloaded. In the process of inputting the substrate (S) by proceeding with the inputting operation, detection of two sheets of the protective film is prevented.

The knurling unit enters when the substrate (S) is seated on the peeling unit table, and performs a left and right separation operation by bringing the knurling tool into contact with the substrate (S). In this way, the knurling unit moves the knurling tool left and right after contacting the surface of the substrate (S) to facilitate the attachment of the adhesive tape before peeling off the protective film with the adhesive tape, thereby removing a portion of the protective film attached to the substrate (S). to peel off

In addition, the peeling unit performs a complete peeling operation by attaching and taping an adhesive tape to the protective film after the knurling operation in the knurling unit.

In addition, the detection unit has a function of detecting that the protective film is not separated from the substrate (S) after the peeling operation is performed in the peeling unit or is torn during separation, which is caused by a slight color difference between the protective film and the core in the color sensor. detect

In this way, the separation detection method through the detection unit includes a primary separation detection method and a secondary separation detection method, and the primary separation detection method moves the substrate S from the primary separation unit table to the secondary separation unit table. In the process of handing over, the color sensor installed on the table of the secondary separation unit inspects the surface of the substrate (S) adsorbed to the table of the primary separation unit, and the secondary separation detection method detects the substrate (S) after the secondary separation. The color sensor installed in the frame part of the separation unit inspects the surface of the substrate (S) adsorbed on the table of the secondary separation unit while transferring to the receiving unit.

As such, in the peeling method using the automatic peeler for the protective film of the printed circuit board according to another embodiment of the present invention, the thickness value of the substrate (S) input from the thickness measuring unit 230 is measured, and the thickness of the substrate (S) input by the operator is measured. Based on the thickness value, it is checked whether there are two sheets of protective film, and when two sheets are input, the substrate (S) is received in the input box, and the operation is performed again, and the adhesive tape is attached before the protective film is peeled off. To facilitate this, after contacting the surface of the substrate (S) through the knurling unit, the attachment portion is moved left and right to peel off a part of the protective film attached to the substrate (S), and after the knurling operation, the peeling unit is spaced apart from the substrate (S). A complete peeling operation is performed by taping the protective film, and after the peeling operation in the detection unit, a color sensor is used to detect a slight color difference between the protective film and the substrate (S) to detect unseparation of the protective film or tearing of the protective film during separation. do.

10: Table 11: Horizontal groove
12: vertical groove 13: stopper
100: loading machine
200: lower shuttle 210: aligner
211: first transport means 212: fixed bar
220: corner clamp 221: protrusion
222: second transport means 223: third transport means
230: thickness measuring unit
300: upper tape peeling robot 310: adhesive tape
320: guide roller 321: providing roller
322: winding roller 323: driving roller
330: pressure roller 340: clamp fixture
350: lifting device 351: means of transportation

Claims (4)

The upper or lower surface of the substrate (S) with a protective film attached is moved forward and backward from the edge around one edge, and the front surface of the substrate (S) without the protective film and the protective film overlapping the substrate (S) are removed from the top. A corner clamp 220 for pressing and fixing;
The lower part adsorbs the substrate (S) and operates the corner clamp 220 to clamp the front edge of the substrate (S), moves forward a certain distance and returns when the upper tape peeling robot 300 rises and moves backward. Shuttle 200 and;
In the state where the substrate (S) is fixed, it descends onto the protective film located at the frontmost part of the upper surface of the substrate (S), moves backward while pressing the protective film, moves to the original position in the front, and then presses it back again, After moving, it rises and moves backward, and the upper tape peeling robot 300 including a pressure roller 330 made of rubber at the bottom; includes,
The upper tape peeling robot 300 delivers a plurality of guide rollers 320, a providing roller 321 on which an adhesive tape 310 is wound to remove the protective film by attaching to the protective film, and the adhesive tape 310. Automatic peeling machine for the protective film of the printed circuit board, including a winding roller 322 for taking and winding, and a driving roller 323 for providing a driving force between the guide roller 320.
According to claim 1,
When the upper tape peeling robot 300 descends and the adhesive tape 310 located outside the pressure roller 330 contacts the protective film and then moves back and forth, the drive roller 323 is rotated so that the adhesive tape 310 is removed. It is rotated by the pressure roller 330, and the adhesive tape 310 located outside the pressure roller 330 and the protective film attached to it are pressed and fixed before the upper tape peeling robot 300 rises and moves backward. Automatic peeling machine for protective film of printed circuit board in which clamp holder 340 is installed on one side of the pressure roller 330. Automatic peeling machine for protective film on printed circuit board installed on one side of pressure roller 330.
According to claim 1,
The corner clamp 220 fixes both sides of the corner except for the vertex portion of the substrate (S), and a protrusion 221 for fixing the protective film is further formed, and the protrusion 221 is attached to the adhesive tape 310 in the protective film. An automatic protective film peeler of a printed circuit board that simultaneously fixes the substrate (S) and the protective film so that the substrate (S) does not go up by the adhesive tape (310) by pressing a portion except for the area in contact with the printed circuit board.
According to claim 2,
The adhesive force of the adhesive tape 310 is stronger than the adhesive force between the substrate (S) and the protective film, and the pressure roller 330 made of rubber is in close contact with the surface by pressing when in contact with the upper part of the protective film. Automatic peeling machine for protective film on printed circuit boards.

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