KR20230097519A - Automatic release of protective film of printed circuit board equipped with adsorption pad - Google Patents

Abstract

The present invention relates to an automatic peeling machine for protective film of a printed circuit board equipped with a suction pad, and more particularly, an aligner aligns a board with a protective film attached to an upper or lower surface loaded from a loader on a table, and a corner clamp When the protective film is removed by pressing and fixing it, and the pressure roller equipped with the adhesive tape in the upper tape peeling robot moves forward and backward while pressing the protective film, the suction plate and the suction pad pull the substrate to separate the substrate when the protective film is peeled off. It relates to an automatic peeling machine for a protective film of a printed circuit board equipped with a suction pad preventing the rise.

Description

Automatic release of protective film of printed circuit board equipped with adsorption pad}

The present invention relates to an automatic peeling machine for protective film of a printed circuit board equipped with a suction pad, and more particularly, an aligner aligns a board with a protective film attached to an upper or lower surface loaded from a loader on a table, and a corner clamp When the protective film is removed by pressing and fixing it, and the pressure roller equipped with the adhesive tape in the upper tape peeling robot moves forward and backward while pressing the protective film, the suction plate and the suction pad pull the substrate to separate the substrate when the protective film is peeled off. It relates to an automatic peeling machine for a protective film of a printed circuit board equipped with a suction pad preventing the rise.

In general, a printed circuit board (PCB) connects each electronic device to each other and supplies power by printing the necessary circuit wiring on a thin board made of epoxy or phenol resin with copper foil. It means a substrate that can operate a circuit after application, and has a conductive function, an insulating function, and a supporting function. Therefore, since the design of the printed circuit board (PCB) is directly related to the operation, performance, lifespan, and reliability of the product, it is in a very important position in the manufacture of electronic products. The printed circuit board (PCB) as described above is an electronic component that serves to connect various components such as semiconductors, capacitors, resistors, etc. It is used in all electronic devices, from computers to mobile phones to satellites.

On the other hand, the printed circuit board (PCB) includes a flexible (flexible) printed circuit board (FPCB: Flexible Printed Circuits Board) and a rigid printed circuit board (RPCB: Rigid Printed Circuits Board). Such a printed circuit board (PCB) Unlike the conventional Rigid Printed Circuit Board (RPCB), which has a hard substrate, the flexible printed circuit board (FPCB) has a thin and flexible material, so the demand for it is rapidly increasing due to the multimedia and light-thin miniaturization of electronic products. Among circuit boards (PCBs), flexible printed circuit boards (FPCB) are electronic components developed to respond to the trend of miniaturization and complexity of electronic products. It has the advantage of being low in heat and resistant to heat, and can reduce working time during assembly work.

As described above, the printed circuit board (PCB) is a substrate by attaching a protective film to the upper and lower surfaces of the printed circuit board (PCB) for a product that has been checked for abnormalities by removing contaminants on the surface of the board during the manufacturing process. It is intended to protect the face. Therefore, in order to insert various components such as semiconductors, capacitors, and resistors on the printed circuit board, the protective film attached to the printed circuit board (PCB) surface must be removed.

On the other hand, although this protective film removal process was automated manually, there were many defects such as not being properly removed or circuit parts being damaged during the removal of the protective film, so it was cumbersome to manually select again.

Accordingly, Registered Patent Publication No. 10-0855078 discloses a printed circuit board transfer means for transferring an inputted printed circuit board in one direction, a printed circuit board support and fixing means for temporarily supporting and fixing the printed circuit board, and the printed circuit board support and fixing means. A protective film initial peeling means for initially peeling the protective film of the front end of the printed circuit board supported and fixed by, a protective film adhesive roller for adhering the protective film of the printed circuit board and completely peeling the protective film from the printed circuit board, and the printing In the printed circuit board protective film peeling device having a configuration including a means for discharging the protective film peeled off from the circuit board into a protective film collection box, the protective film ejection means is on the circumferential surface of the two protective film adhesive rollers installed vertically. Doedoe formed to a certain depth in the belt hanger grooves formed at regular intervals on a mutually corresponding position; first support rollers rotatably installed at a predetermined distance apart from each other on the upper and lower sides of the protective film adhesive roller so as to be combined with the upper and lower protective film adhesive rollers; upper and lower first protective film transfer belts that are wound around the belt hanging groove of the protective film adhesive roller and the first support roller with a constant tension and are rotated by the rotation of the protective film adhesive roller; a plurality of second support rollers installed on the outer periphery before and after the first protective film conveying belt on the upper side of the upper side of the conveying line of the printed circuit board conveying means; It is hung on the second support roller and is configured to rotate in the same direction as the upper first protective film conveying belt through surface contact on the rear and front outer surfaces of the upper first protective film conveying belt. The upper side that transfers the protective film peeled off from the upper side of the circuit board to the lower part of the front via the upper side from the rear of the first protective film transport belt on the upper side in a state of being pressed between the first protective film transport belt on the upper side. a second protective film transfer belt; third support rollers rotatably installed in parallel above and below the front side of the first protection film transfer belt at the lower side of the lower side of the transfer line of the printed circuit board transfer unit; The hook is wound around the third support roller and configured in parallel, but in surface contact with each other, the protective film transported by the upper first protective film conveying belt and the upper second protective film conveying belt is handed over between the parallel upper sides. a third protection film transfer belt on the upper side for transporting to the protection film collection box on the lower side; a plurality of fourth support rollers installed rotatably up and down on the rear side of the lower first protective film conveying belt; and the fourth support roller being hung and rotated in the same direction as the lower first protective film conveying belt through surface contact on the outer surface of the rear side of the lower first protective film conveying belt. The protective film peeled off from the lower side of the lower side is transferred to the lower side of the first protective film transport belt in a state of being pressed between the lower side first protective film transport belt and recovered to the protective film collection box. 2 A printed circuit board protective film peeling device consisting of a protective film transfer belt is posted. The prior art has disadvantages in that the peeling efficiency per hour is low, the accuracy of the peeling action is low, and the configuration of the device is complicated.

In order to solve this problem, Patent Registration No. 10-1119571 automatic peeling machine and film peeling method for semiconductor printed circuit boards tried to accurately and completely peel the protective film of the substrate, but the substrate (S) and the film (F ) The heat of the high-temperature heater heated by the scratching machine that forms a gap between the films creates gaps and scratches, which can damage the substrate. After peeling the upper protective film, the substrate is rotated to peel the lower protective film. As a result, the process was complicated and time-consuming.

On the other hand, in the conventional automatic peeling machine for protective film of printed circuit boards, a circular vacuum suction pad is placed under the substrate so that the suction pad adsorbs the substrate to help peel the protective film from the substrate. There is a disadvantage that general suction pads are difficult to absorb.

KR 20-0433952 (registration number) 2006.12.07. KR 10-0855078 (registration number) 2008.08.22. KR 10-1119571 (registration number) 2012.02.16.

The present invention has been made to solve the above problems,

The aligner aligns the board with the protective film attached to the upper or lower surface loaded from the loading machine on the table, the corner clamp presses and fixes the edge of the board, and the pressure roller equipped with the adhesive tape in the tape peeling robot presses the protective film. When removing the protective film by moving forward and backward in the state, the suction plate and the suction pad pull the substrate from the bottom so that the substrate does not rise when the protective film is peeled. Its purpose is to provide

Another object of the present invention is a suction pad for adsorbing the apex portion of the substrate together with a suction plate for pulling the entire surface of the substrate when the protective film is peeled off the substrate. By fixing it, the press roller stably holds the board so that the board subjected to the lifting force does not go up along with the protective film when rolling on the protective film, and the printed circuit equipped with a suction pad that facilitates the peeling of the protective film in the tape peeling robot. It is to provide an automatic peeling machine for a protective film of a substrate.

Another object of the present invention is to provide an automatic peeler for protective film of a printed circuit board equipped with a suction pad capable of strong adsorption by taking air intake from the entire square rib because the ribs at the edges of the suction part are higher than the top of the intake hole in the suction pad. there is.

Another object of the present invention is a suction pad that helps reliable adhesion between the adhesive tape and the protective film by means of a pressure roller made of a rubber material having a predetermined elasticity, and peels the adhesive tape and the protective film without damage or damage. It is to provide an automatic peeling machine for the protective film of the printed circuit board provided.

In order to achieve the above object, the present invention is coupled at the top of the table 10, an intake port 21 for sucking air is formed, and a suction plate 20 for adsorbing the front surface of the substrate S disposed thereon; a suction pad (30) disposed at an edge of the suction plate (20) and adsorbing a vertex portion of the substrate (S) with an intake area larger than that of the suction port (21); A corner clamp 220 for pressing and fixing the front surface of the substrate (S) from the top by moving from the edge around the corner of the substrate (S) to which the protective film is attached to the upper or lower surface; The lower part adsorbs the substrate (S) and operates the corner clamp 220 to clamp the front edge of the substrate (S), moves forward a certain distance and returns when the upper tape peeling robot 300 rises and moves backward. Shuttle 200 and; In the state where the substrate (S) is fixed, it descends onto the protective film located at the frontmost part of the upper surface of the substrate (S), moves backward while pressing the protective film, moves to the original position in the front, and then presses it back again, After moving, it rises and moves backward, and includes an upper tape peeling robot 300 including a pressure roller 330 made of rubber at the bottom, wherein the upper tape peeling robot 300 includes a plurality of guide rollers 320 and Between the providing roller 321 on which the adhesive tape 310 for removing the protective film is wound, the winding roller 322 for receiving and winding the adhesive tape 310, and the guide roller 320 A suction pad including a driving roller 323 providing a driving force is provided.

In the present invention, when the upper tape peeling robot 300 descends and the adhesive tape 310 located outside the pressure roller 330 contacts the protective film and then moves back and forth, the drive roller 323 is rotated so that the adhesive tape ( 310) rotates on the pressure roller 330, and the upper tape peeling robot 300 rises and presses the protective film attached to the adhesive tape 310 located outside the pressure roller 330 before moving backward. A suction pad is provided with a clamp holder 340 for fixing and being installed on one side of the pressure roller 330.

The suction pad 30 of the present invention includes a holder portion 31 in the form of a square pillar; a suction part 32 extending from the holder part 31 and inserted into the suction pad insertion hole 22 of the suction plate 20 and adsorbing a vertex portion of the substrate S and widening toward the top; an intake hole 33 penetrating the holder part 31 and the suction part 32; The adsorption part 32 is provided with an adsorption pad in which the rib 32a protruding at the edge is higher than the upper end of the intake hole 33 so that air is sucked through the entire square rib 32a and the square surface sucks the air.

The adhesive force of the adhesive tape 310 of the present invention is stronger than the adhesive force between the substrate (S) and the protective film, and the pressure roller 330 made of rubber is in close contact with the protective film when it is in contact with the upper part of the protective film. A surface-contacting suction pad is provided.

The suction plate 20 and the suction pad 30 of the present invention are suction pads that hold the substrate S by pulling the substrate S from the bottom so that the substrate S does not go up by the adhesive tape 310. are provided

The suction pad 30 of the present invention is provided with a suction pad in which the holder portion 31 is inserted into the holder portion insertion portion 41 of the intake portion 40 and the suction port 42 and the intake hole 33 are connected. do.

Therefore, in the automatic peeling machine for protective film of a printed circuit board equipped with a suction pad of the present invention, the aligner aligns the substrate with the protective film attached to the upper or lower surface loaded from the loader on the table, and the corner clamp presses the edge of the substrate. When removing the protective film by moving forward and backward in the state where the pressure roller equipped with the adhesive tape in the tape peeling robot presses the protective film, the suction plate and the suction pad pull the substrate from the bottom to separate the substrate when the protective film is peeled off. This has the effect of preventing it from rising.

In addition, the present invention is a suction pad for adsorbing the apex portion of the substrate together with a suction plate for pulling the entire surface of the substrate when the protective film is peeled off the substrate. By fixing, the pressure roller stably holds the substrate so that the substrate receiving the lifting force does not rise along with the protective film when rolling on the protective film, and the peeling of the protective film is more easily performed in the tape peeling robot.

In addition, the present invention has an advantage in that the ribs at the edges of the adsorption part in the adsorption pad are higher than the upper end of the intake hole, so that the intake is performed over the entire square rib, so that strong adsorption can be achieved.

In addition, the present invention has the advantage of helping reliable adhesion between the adhesive tape and the protective film by means of a pressure roller made of a rubber material having a predetermined elasticity, and peeling the adhesive tape and the protective film without damage or damage.

1 is a perspective view of an adsorption plate and an adsorption pad combined with a table in an automatic peeler for protective film of a printed circuit board equipped with an adsorption pad according to an embodiment of the present invention;
2 is a perspective view of an intake unit coupled to a table and a substrate presence/absence sensor in an automatic peeler for protective film of a printed circuit board equipped with a suction pad according to an embodiment of the present invention;
3 is a perspective view showing a state in which the table, the suction plate, and the suction pad are separated in the automatic peeler of the protective film of the printed circuit board equipped with the suction pad according to an embodiment of the present invention;
4 is a perspective view showing a state in which a suction pad is coupled to an intake unit according to an embodiment of the present invention;
5 is a perspective view showing a state in which the suction pad and the intake unit are separated according to an embodiment of the present invention;
6 is a cross-sectional view of a state in which a substrate coupled with an upper film is disposed on a table to which a suction pad and an intake unit are coupled according to an embodiment of the present invention;
7 is a perspective view of an automatic protective film peeler for a printed circuit board equipped with a suction pad according to an embodiment of the present invention;
8 is a perspective view showing a state in which a substrate is fixed on an upper portion of a suction plate in an automatic peeler for protective film of a printed circuit board equipped with an suction pad according to an embodiment of the present invention;
9 is a perspective view showing a state in which an upper tape peeling robot moves backward and descends in an automatic protective film peeler for a printed circuit board equipped with a suction pad according to an embodiment of the present invention;
10 is a perspective view showing a state in which an upper tape peeling robot moves backward from an upper part of a substrate in an automatic peeling machine for protective film of a printed circuit board equipped with a suction pad according to an embodiment of the present invention;
11 is a perspective view showing a state in which an upper tape peeling robot moves forward from an upper part of a substrate in an automatic protective film peeler of a printed circuit board equipped with a suction pad according to an embodiment of the present invention;
12 is a perspective view showing a state in which an upper tape peeling robot peels an upper film from a substrate in an automatic protective film peeler of a printed circuit board equipped with a suction pad according to an embodiment of the present invention;
13 is a perspective view showing a state in which the upper tape peeling robot completely peels the upper film from the substrate in the automatic peeling machine for the protective film of the printed circuit board equipped with the suction pad according to an embodiment of the present invention;
14 shows that the upper tape peeling robot moves forward along the second horizontal rail and the lower shuttle moves along the third horizontal rail in the automatic peeling machine for the protective film of the printed circuit board equipped with the suction pad according to the embodiment of the present invention. The state of moving backward is a perspective view shown.

Hereinafter, with reference to the accompanying drawings, a preferred embodiment of the present invention will be described so that those skilled in the art can easily implement it.

As shown in FIGS. 1 to 14, the present invention is an automatic protective film peeler for a printed circuit board (hereinafter, a substrate (S)),

A suction plate 20 coupled at the top of the table 10, having an intake port 21 for sucking air, and adsorbing the front surface of the substrate S disposed thereon;

It is installed through the table 10 at the edge of the suction plate 20 to adsorb the apex portion of the substrate S, and has a larger intake area than the intake port 21 and adsorbs the apex portion of the substrate S. A suction pad 30 to do,

An aligner 210 for aligning the substrate S to which the upper film F1 and the lower film are attached to the upper and lower surfaces loaded by the loader 100 on the table 10;

A corner clamp 220 that moves forward and backward at the peripheral edge of the aligned substrate (S) and presses and fixes the front surface of the substrate (S) from the top;

A lower shuttle that adsorbs the substrate and operates the corner clamp 220 to clamp the front edge of the substrate S, and moves forward by a certain distance and returns when the upper tape peeling robot 300 rises and moves backward ( 200) and,

In the state where the substrate (S) is fixed, it descends onto the film located at the frontmost part of the upper surface of the substrate (S), moves backward while pressing the film, then moves to the original position of the front, and then moves to the original position in the front while pressing it again, then rises after moving. and moves backward, and includes an upper tape peeling robot 300 including a pressure roller 330 made of rubber at the bottom.

In the present invention, the front is the direction in which the loader 100 transfers the substrate (S) onto the table 10 of the lower shuttle 200, and the rear is the direction in which the upper tape peeling robot 300 transfers the substrate (S) onto the table where the substrate (S) is placed. (10) means the direction of moving upward.

In the present invention, the protective film is used interchangeably with the same meaning, and refers to an upper film or a lower film.

The upper tape peeling robot 300 includes a plurality of guide rollers 320, a providing roller 321 wound with an adhesive tape 310 that is attached to the upper film F1 to remove the upper film F1, and It includes a winding roller 322 that receives and winds the tape 310 and a drive roller 323 that provides a driving force between the guide rollers 320 .

In addition, when the upper tape peeling robot 300 descends and the adhesive tape 310 located outside the pressure roller 330 contacts the upper film F1 and the end, and then moves forward and backward and diagonally, the drive roller 323 is rotated to rotate the adhesive tape 310 on the pressure roller 330, and the adhesive tape 310 located outside the pressure roller 330 before the upper tape peeling robot 300 rises and moves backward. A clamp holder 340 for pressing and fixing the upper film F1 attached thereto is installed on one side of the pressure roller 330.

The substrate (S) is a printed circuit board (PCB), and the upper film (F1), which is a protective film, is attached to the upper surface, and the loader (100) in a state where the lower film (F2) is attached to the lower surface. ), rotated 45 degrees, and loaded on the table 10. Then, when the substrate (S) is loaded on the table 10, the aligner 210 aligns the substrate (S) on the side of the table (10).

The table 10 has horizontal grooves 11 and vertical grooves 12 concavely provided from the edge to the center in order to mount and move the aligner 210, forming a space in which air moves. A substrate adsorption unit 14 is provided, and an intake unit insertion hole 15 is formed through a vertex portion of one side of the substrate adsorption unit 14 . In addition, the substrate adsorption part 14 is formed through a sensor hole 16 for checking the presence/absence sensor 50 installed under the table 10 .

An upper portion of the table 10 is coupled with a suction plate 20 for sucking the substrate S.

The suction plate 20 has a substrate S disposed thereon, a plurality of intake ports 21 are formed at the portion where the substrate S is disposed, and an absorption pad insertion hole 22 is formed at one vertex portion of the suction plate 20 to attract suction. Pad 30 is inserted. Air can move from the substrate adsorption unit 14 to the inlet 21 .

The suction pad 30 inserted into the suction plate 20 strongly adsorbs the apex of the substrate S, and is disposed at a more edge than the suction plate 20 and adsorbs the apex of the substrate S to a wide area. A holder part 31 in the form of a square pillar and the suction pad insertion hole 22 of the suction plate 20 extending to the holder part 31 to prevent the substrate S from rising by simultaneously suctioning the area. It is inserted into the suction part 32 and is composed of two intake holes 33 penetrating the holder part 31 and the suction part 32 at the center side. At this time, since the rib 32a protruding from the edge of the adsorption unit 32 is higher than the upper end of the intake hole 33, air intake is made in the entire square rib 32a, and the apex of the substrate S can be strongly adsorbed. . Accordingly, the substrate (S) is held together with the protective film during rolling of the pressure roller 330 so as not to rise along with it. At this time, the rib 32a is made of a slightly hard material so as not to be sensitive to the movement of the substrate.

And, the suction part 40 coupled at the lower part of the suction pad 30 has a holder part insertion hole 41 into which the holder part 31 is inserted, and a suction port 42 penetrating through the center. . The inlet 42 is connected to a pipe (not shown) for sucking air and is connected to the intake hole 33 . A protrusion protruding from the outer circumferential surface of the holder portion 31 can be inserted into and fixed to the holder portion insertion hole 41 .

The suction pad 30 is coupled to the upper part of the suction part 40, the suction part 32 protrudes, and the suction part 32 becomes wider toward the top and is disposed on the upper part of the suction plate 20 (S). ), it is possible to stably pull the vertex part of

On the other hand, the loader 100 includes a shuttle frame that reciprocates along the first horizontal rail R1, an up and down driving means integrally fixed to the shuttle frame, and an intermediate plate that is moved up and down by the up and down driving means. And, it is configured to include a suction plate connected to the lower portion of the intermediate plate by a spring and adsorbing the substrate (S) by vacuum.

The substrate S loaded in the loader 100 is aligned by the aligner 210, and the corner clamp 220 presses and fixes the top of the substrate S at the peripheral edge of one corner of the aligned substrate S. do.

At this time, the aligner 210 moves forward and backward along the horizontal grooves 11 and vertical grooves 12 formed from the edge to the center of the table 10 by the first transport means 211, and By pressing the substrate (S) from the opposite side by the installed stopper (13), aligning the substrate (S) based on the stopper (13) at the front end of the table (10) and moving it back to the outside to release the pressurized state of the substrate (S) do.

The aligner 210 has a first transport unit 211 that moves forward and backward by a motor, and a fixing bar 212 installed in front of the first transport unit 211 . The fixing bar 212 is made of a shock-absorbing material to prevent damage to the substrate S when the substrate S is fixed. Such an aligner may exist in various forms, and a known substrate aligner may be used.

In addition, the lower shuttle 200 on which the aligner 210 is installed has a table 10 on the top and a corner clamp 220 is installed at the corner to clamp the front edge of the substrate S, and the upper tape When the peeling robot 300 ascends and moves backward for a long time, it is provided to move forward by a certain distance and then return.

The corner clamp 220 may fix only the corner portion of the substrate S at the corner portion of the substrate S or a portion of the protective film overlapping the substrate S at the same time.

At this time, the corner clamp 220 consists of two devices each having protrusions 221 that fix the edge of the substrate S and a portion of the protective film at the same time, or two devices without protrusions 221. It is made of one device that presses on both sides of the edge of the substrate (S) or presses only the edge of the edge of the substrate (S), and is provided capable of forward movement and elevation at the edge of the substrate (S).

When the protruding part 221 is formed on the corner clamp 220, one corner of the substrate S and a part of the upper film F1 (except for the part where the pressure roller 330 touches) are simultaneously fixed so that the pressure roller During the rolling operation of 330, the substrate S can be more stably fixed.

In this way, when the aligner 210 aligns the substrate S, the corner clamp 220 moves and fixes one corner of the substrate S. At this time, the corner clamp 220 holds the substrate S When strongly pressed, the upper tape peeling robot 300 descends from the top of the table 10 and contacts the substrate S, and the pressure roller 330 provided with the adhesive tape 310 diagonally from the edge of the substrate S to the center. ) adsorbs the upper film F1 while reciprocating a certain distance, and the clamp holder 340 catches the upper film F1 adsorbed to the pressure roller 330 and moves backward to separate it from the substrate S.

In this way, the upper tape peeling robot 300 is the upper film F1 located at the frontmost part of the upper surface of the substrate S in a state where the substrate S is fixed by the corner clamp 220 of the lower shuttle 200. ) After descending upward, it moves slightly backward while pressing the upper film (F1), then moves to the original position in the front, and then moves diagonally while pressing the upper film (F1), then rises and moves backward for a long time.

In addition, when the upper tape peeling robot 300 ascends and moves backward for a long time, the lower shuttle 200 moves forward by a predetermined distance to facilitate peeling of the upper film F1.

Here, the reciprocating distance before the upper tape peeling robot 300 ascends is a small distance of about 1 to 2 cm, and the distance it moves after ascending should be a sufficient distance for the upper film F1 to be separated from the substrate.

As a result of the test, even when the adhesive force of the adhesive tape 310 of the upper tape peeling robot 300 is greater than the adhesive force between the upper film F1 and the substrate, some of the upper tape peeling robot 300 moving diagonally in the first order About 80% of the peeling was performed by, and 99.9% of the peeling effect was obtained when the second diagonal movement was performed.

On the other hand, the upper tape peeling robot 300 includes a plurality of guide rollers 320 and a providing roller 321 wound with an adhesive tape 310 for removing the upper film F1 by attaching to the upper film F1, A winding roller 322 that receives and winds the adhesive tape 310 and a driving roller 323 that provides a driving force between the guide rollers 320 facilitates the supply of the adhesive tape 310 .

At this time, at the lower end of the upper tape peeling robot 300, a pressure roller 330 made of rubber, on which an adhesive tape 310 is disposed outside, is installed to elastically contact the substrate S and prevent damage to the substrate S. It will give a buffering effect.

In addition, the upper tape peeling robot 300 is provided with a lifting device 350 and moves along the rail in the vertical direction, descends and rises, contacts the substrate S, and falls, and is transported mounted on the lifting device 350. It is provided to move forward and backward along the second horizontal rail R2 made of a long bar shape by means 351.

On the other hand, the adhesive force of the adhesive tape 310 is stronger than the adhesive force between the substrate S and the upper film F1, and the pressure roller 330 made of rubber is in contact with the upper film F1. It adheres by pressing and makes surface contact. This pressurization must be continuously performed during the first movement, which slightly moves while contacting the upper film, and the second movement after returning to the original position.

In addition, the corner clamp 220 serves to hold the substrate (S) so that the substrate (S) does not go up by the adhesive tape (310) by fixing both sides of the corner by subtracting the vertex portion of the substrate (S). .

In addition, the loading machine 100 reciprocates along the first horizontal rail R1, and the upper tape peeling robot 300 reciprocates along the second horizontal rail R2 to remove the upper film F1. While transporting, the lower shuttle 200 reciprocates on the third horizontal rail R3 installed below the second horizontal rail R2.

In addition, the automatic peeling machine for the protective film of the printed circuit board equipped with the suction pad of the present invention includes a lower tape peeling robot that removes the lower film from the lower part of the substrate (S) in the same form as the upper tape peeling robot 300.

At this time, an upper shuttle is provided to adsorb and transfer the substrate S from which the upper film F1 is peeled off from the upper tape peeling robot 300 from the lower shuttle 200 to peel the lower film, and the upper shuttle A shuttle frame that reciprocates left and right along the horizontal rail, an upper and lower driving means integrally fixed to the shuttle frame, an intermediate plate that is moved up and down by the upper and lower driving means, and a spring connected to the lower part of the intermediate plate and includes an adsorption plate unit for adsorbing the substrate S by vacuum.

Further, in the present invention, a film dumper that picks up and discards the peeled upper film F1 and lower film attached to the adhesive tape in the upper tape peeling robot 300 and the lower tape peeling robot may be further provided.

The lower tape peeling robot, in a state where the substrate (S) is fixed by the upper shuttle, rises above the lower film located on the frontmost side of the lower surface of the substrate (S), presses the lower film and moves backward slightly, and then returns to the front position. Then, after moving diagonally, it descends and moves backward for a long time to peel the lower film, and includes a pressure roller made of rubber to which an adhesive tape for peeling the lower film is attached to the top.

On the other hand, the upper tape peeling robot 300 descends and presses the adhesive tape 310 located outside the pressure roller 330 after contacting the upper film F1, and when moving forward and backward and diagonally, the driving roller 323 ) to rotate the adhesive tape 310 on the pressure roller 330, and before the upper tape peeling robot 300 moves backward for a long time, the adhesive tape 310 located outside the pressure roller 330 and A clamp holder 340 for pressurizing and fixing the attached upper film F1 is installed on one side of the pressure roller 530 to help peel the upper film F1.

In addition, the lower tape peeling robot has a plurality of guide rollers and a lower film attached to the lower film in the same manner as the upper tape peeling robot 300, a supply roller with an adhesive tape wound thereon, a winding roller and a guide that receives and winds the adhesive tape It includes a drive roller that provides a driving force between the rollers, and the lower tape peeling robot rises and the adhesive tape located outside the pressure roller contacts the lower film, and then rotates the drive roller when moving forward and backward and diagonally, so that the adhesive tape is removed. It rotates on the pressure roller.

In the peeling method using the automatic peeling machine for the protective film of the printed circuit board equipped with the suction pad according to the embodiment of the present invention, the substrate (S) with the film attached to the upper and lower surfaces is rotated by 45 degrees with the loading machine 100 to lower the shuttle After loading on the 200, aligning the substrate S with the aligner 210 disposed on the lower shuttle 200, adsorbing and gripping the substrate S with the suction plate 20 and the suction pad 30, the substrate ( The front surface of S) is fixed with the corner clamp 220, and the upper tape peeling robot 300 descends to bring the adhesive tape 310 located outside the pressure roller 330 into surface contact with the end of the upper film F1. After that, the top film F1 and the adhesive tape 310 are attached by moving the upper tape peeling robot 300 backward and forward simultaneously with the rotation of the driving roller 323. Then, in a state where the upper film (F1) is attached to the adhesive tape (310), the clamp holder (340) installed on the side of the pressure roller (330) is moved forward to fix the upper film (F1) to the pressure roller (330), In a state where the upper film F1 is fixed to the pressure roller 330, the upper tape peeling robot 300 is moved backward and at the same time the lower shuttle 200 is moved forward to remove the upper film F1.

At this time, the upper shuttle adsorbs the substrate S moved by the lower shuttle 200 while the upper film F1 is peeled off, and the lower shuttle 200 moves to its original position.

Then, the lower tape peeling robot rises from the lower part of the upper shuttle and, like the upper tape peeling robot, the adhesive tape located outside the pressure roller makes surface contact with the end of the lower film, and the lower tape peeling robot simultaneously rotates the drive roller. The lower film and the adhesive tape are attached by moving backward and forward, and while the lower film is attached to the adhesive tape, the clamp holder installed on the side of the pressure roller is moved forward to fix the lower film to the pressure roller, and the lower film is fixed to the pressure roller. In this state, the lower tape peeling robot is moved backward and the upper shuttle is raised at the same time to remove the lower film.

In the present invention, when the upper tape peeling robot 300 including the adhesive tape 310 disposed outside the pressure roller 330 is first moved backward, the film is peeled by about 80%, and the film is peeled by about 20%. is adhered to the substrate as it is, but in order to peel off about 20% of the film remaining on the substrate, the film is completely peeled off when the upper tape peeling robot 300 is moved forward and then moved diagonally.

As described above, the present invention can eliminate errors of workers due to manual work, thereby improving the quality of the product, and additionally applied between conventionally installed printed circuit board manufacturing facilities without moving to separate equipment for peeling off the protective film, thereby providing protection. By peeling the film, the time required to peel the protective film from the printed circuit board can be shortened, and the protective film can be simply peeled off with a simple structure, which greatly improves workability and economy, as well as scratch damage to the board, Damage such as bending deformation is prevented and reliability is greatly improved.

On the other hand, the automatic peeling machine for the protective film of the printed circuit board equipped with the suction pad according to another embodiment of the present invention,

The contact-type thickness measurement unit 230 measures the thickness of the substrate (S) in the alignment operation section before the substrate (S) is put into the separation unit to check whether two sheets of protective film are put in, and when two sheets are put into the input box An input unit aligning device (not shown) that receives the substrate S and proceeds with a re-insertion operation;

A knurling unit (not shown) that peels off the protective film by moving the circular knurling tool to the surface of the substrate (S) seated on the table of the peeling unit and then moving it left and right;

A peeling unit (not shown) performing a peeling operation by taping the spaced protective film using an adhesive tape after the knurling operation in the knurling unit;

and a detection unit (not shown) for detecting non-separation of the protective film or tearing of the protective film during separation by using a color sensor to detect minute color differences between the protective film and the core after the protective film peeling operation in the peeling unit.

The input unit aligning device aligns the substrate (S) on the input unit table before the substrate (S) is put into the separating unit, and then the thickness measuring unit 230 advances and descends to measure the thickness, but the thickness measuring unit 230 Based on the thickness value of the substrate (S) input by the operator, it is checked whether there are two protective films, and when two sheets are input, the substrate (S) is received in the input box and the substrate (S) is received and re-inserted to proceed with the substrate ( In the process of introducing S), the detection of two sheets of the protective film is prevented.

The knurling unit enters when the substrate (S) is seated on the peeling unit table, and performs a left and right separation operation by bringing the knurling tool into contact with the substrate (S). In this way, the knurling unit moves the knurling tool left and right after contacting the surface of the substrate (S) to facilitate the attachment of the adhesive tape before peeling off the protective film with the adhesive tape, thereby removing a portion of the protective film attached to the substrate (S). to peel off

In addition, the peeling unit performs a complete peeling operation by attaching and taping an adhesive tape to the protective film after the knurling operation in the knurling unit.

In addition, the detection unit has a function of detecting that the protective film is not separated from the substrate (S) after the peeling operation is performed in the peeling unit or is torn during separation, which is caused by a slight color difference between the protective film and the core in the color sensor. detect

In this way, the separation detection method through the detection unit includes a primary separation detection method and a secondary separation detection method, and the primary separation detection method moves the substrate S from the primary separation unit table to the secondary separation unit table. In the process of handing over, the color sensor installed on the table of the secondary separation unit inspects the surface of the substrate (S) adsorbed to the table of the primary separation unit, and the secondary separation detection method detects the substrate (S) after the secondary separation. The color sensor installed in the frame part of the separation unit inspects the surface of the substrate (S) adsorbed on the table of the secondary separation unit while transferring to the receiving unit.

As such, in the peeling method using the automatic peeler for the protective film of the printed circuit board equipped with the suction pad according to another embodiment of the present invention, the thickness value of the substrate (S) input from the thickness measuring unit 230 is measured and the operator inputs Based on the thickness of the substrate (S), it is checked whether there are two sheets of protective film, and when the input of two sheets is detected, the substrate (S) is received in the input box, re-insertion is performed, and the protective film is peeled off with adhesive tape. Before attaching the adhesive tape, the attachment part contacts the surface of the substrate (S) through the knurling unit, then moves left and right to peel off a part of the protective film attached to the substrate (S), and after the knurling operation, the substrate ( A complete peeling operation is performed by taping the protective film spaced apart from S), and after the peeling operation in the detection unit, the minute color difference between the protective film and the substrate (S) is detected by using a color sensor to protect the protective film from unseparation or during separation. Detect tearing of film.

10: Table 11: Horizontal groove
12: vertical groove 13: stopper
14: substrate adsorption part 15: intake part insertion hole
16: sensor hole
20: suction plate 21: intake port
22: suction pad insertion hole
30: suction pad 31: holder part
32: suction part 33: intake hole
40: intake part 41: holder part insertion hole
42: inlet
50: substrate presence/absence sensor
100: loading machine
200: lower shuttle 210: aligner
211: first transport means 212: fixed bar
220: corner clamp 221: protrusion
222: second transport means 223: third transport means
230: thickness measuring unit
300: upper tape peeling robot 310: adhesive tape
320: guide roller 321: providing roller
322: winding roller 323: driving roller
330: pressure roller 340: clamp fixture
350: lifting device 351: means of transportation

Claims (6)

a suction plate 20 coupled at the top of the table 10, having an intake port 21 for sucking air, and adsorbing the front surface of the substrate S disposed thereon;
a suction pad (30) disposed at an edge of the suction plate (20) and adsorbing a vertex portion of the substrate (S) with an intake area larger than that of the suction port (21);
A corner clamp 220 for pressing and fixing the front surface of the substrate (S) from the top by moving from the edge around the corner of the substrate (S) to which the protective film is attached to the upper or lower surface;
The lower part adsorbs the substrate (S) and operates the corner clamp 220 to clamp the front edge of the substrate (S), moves forward a certain distance and returns when the upper tape peeling robot 300 rises and moves backward. Shuttle 200 and;
In the state where the substrate (S) is fixed, it descends onto the protective film located at the frontmost part of the upper surface of the substrate (S), moves backward while pressing the protective film, moves to the original position in the front, and then presses it back again, After moving, it rises and moves backward, and the upper tape peeling robot 300 including a pressure roller 330 made of rubber at the bottom; includes,
The upper tape peeling robot 300 delivers a plurality of guide rollers 320, a providing roller 321 on which an adhesive tape 310 is wound to remove the protective film by attaching to the protective film, and the adhesive tape 310. An automatic peeler for protective film of a printed circuit board equipped with a suction pad including a winding roller 322 for receiving and winding and a driving roller 323 for providing a driving force between the guide roller 320.
According to claim 1,
When the upper tape peeling robot 300 descends and the adhesive tape 310 located outside the pressure roller 330 contacts the protective film and then moves back and forth, the drive roller 323 is rotated so that the adhesive tape 310 is removed. It is rotated by the pressure roller 330, and the adhesive tape 310 located outside the pressure roller 330 and the protective film attached to it are pressed and fixed before the upper tape peeling robot 300 rises and moves backward. An automatic peeler for protective film of a printed circuit board having a suction pad in which a clamp holder 340 is installed on one side of the pressure roller 330.
According to claim 1,
The suction pad 30 includes a holder part 31 in the form of a square pillar;
a suction part 32 extending from the holder part 31 and inserted into the suction pad insertion hole 22 of the suction plate 20 and adsorbing a vertex portion of the substrate S and widening toward the top;
an intake hole 33 penetrating the holder part 31 and the suction part 32;
The suction part 32 has a rib 32a protruding at the edge higher than the upper end of the intake hole 33, so air intake is made over the entire square rib 32a, and the square surface protects the printed circuit board equipped with the suction pad for intake. Automatic film peeler.
According to claim 2,
The adhesive force of the adhesive tape 310 is stronger than the adhesive force between the substrate (S) and the protective film, and the pressure roller 330 made of rubber is in close contact with the surface by pressing when in contact with the upper part of the protective film. Automatic peeling machine for protective film of printed circuit board equipped with suction pad.
According to claim 1,
The suction plate 20 and the suction pad 30 pull the substrate S from the bottom so that the substrate S does not go up by the adhesive tape 310. Automatic peeling machine for protective film on circuit board.
According to claim 3,
In the suction pad 30, the holder part 31 is inserted into the holder part insertion part 41 of the intake part 40, and the suction port 42 and the intake hole 33 are connected to the printed circuit provided with a suction pad. Automatic peeling machine for protective film on board.

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