KR20160135073A - Conductive tape attachment apparatus and attaching using the same - Google Patents
Conductive tape attachment apparatus and attaching using the same Download PDFInfo
- Publication number
- KR20160135073A KR20160135073A KR1020150068241A KR20150068241A KR20160135073A KR 20160135073 A KR20160135073 A KR 20160135073A KR 1020150068241 A KR1020150068241 A KR 1020150068241A KR 20150068241 A KR20150068241 A KR 20150068241A KR 20160135073 A KR20160135073 A KR 20160135073A
- Authority
- KR
- South Korea
- Prior art keywords
- tape
- unit
- release paper
- attaching
- substrate
- Prior art date
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H37/00—Article or web delivery apparatus incorporating devices for performing specified auxiliary operations
- B65H37/02—Article or web delivery apparatus incorporating devices for performing specified auxiliary operations for applying adhesive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H37/00—Article or web delivery apparatus incorporating devices for performing specified auxiliary operations
- B65H37/04—Article or web delivery apparatus incorporating devices for performing specified auxiliary operations for securing together articles or webs, e.g. by adhesive, stitching or stapling
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2701/00—Handled material; Storage means
- B65H2701/30—Handled filamentary material
- B65H2701/37—Tapes
- B65H2701/377—Adhesive tape
Abstract
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a tape attaching apparatus and an attaching method using the same, and a tape attaching apparatus and a attaching method using the same, including a stage unit on which a substrate to be attached with a tape is seated; A cartridge unit for supplying a tape with a release paper of a predetermined length; A transfer unit for holding and transferring the tape; A peeling unit installed to peel off the release paper of the tape during the conveyance of the tape by the conveying unit; A buffer unit in which a tape on which release paper has been peeled off by the peeling unit is conveyed and settled by the conveying unit; And an attachment unit for gripping and transferring the tape seated on the buffer unit and attaching the tape to the substrate mounted on the stage unit. Thereby, a tape attaching apparatus and a mounting method using the same that can reduce the manufacturing cost by improving the productivity can be provided by automatically attaching the conductive tape or the spacer tape adhering to the substrate.
Description
BACKGROUND OF THE
In general, portable electronic devices such as mobile phones, notebooks, PDAs, and navigation devices are driven by liquid crystal displays, and various types of high-density semiconductor packages are mounted in the interior thereof to realize low-voltage driving, low power consumption, and full color implementation.
As a technique for manufacturing such a high-density semiconductor package, a tape carrier package (TCP) called a tape carrier system is typically used in a manner such that semiconductor chips, which are a plurality of integrated circuit elements, can be mounted on a single panel with high density .
In recent years, however, demand for higher light weight shortening and fine pitch of liquid crystal panels have been demanded. As a semiconductor package technology to cope with this demand, technologies such as COB (chip on board) and COG There is a limitation in driving a high-performance semiconductor chip which is used to mount a chip but requires a fine pitch, and it has been difficult to follow the tendency to widen the liquid crystal screen.
In this background, it has been demanded to develop a thinner, lighter and flexible component, and as a new semiconductor package technology, there is a method of bonding a semiconductor chip on a
1, a
Conventionally, in the method of attaching the
Such a tape attached to two corner portions of the substrate is provided attached to a removable release paper.
That is, it has been difficult for the operator to attach the substrate to the edge of the substrate after removing the release paper directly, and to attach the substrate at a high precision level.
Accordingly, a jig is used to improve the accuracy of attachment. It is necessary to attach the tape to the edge of the panel after the reference hole is pierced, the tape is fixed with respect to the hole, and the release paper of the tape is removed. This type of manual work was required to have a workforce of 10,000 employees.
This conventional manual method has a problem in that the work efficiency and the defect rate are different according to the competence of the operator because the removal of the release paper of the tape and the process of attaching to the edge of the panel all depend on the personal capacity of the worker.
As a result, there is a problem that it is difficult to meet a constant production amount requirement, and also there is a problem that it can not respond quickly to a change in size of a substrate.
SUMMARY OF THE INVENTION It is an object of the present invention to provide a tape attaching apparatus capable of automatically attaching a conductive tape or a spacer tape to be attached to a substrate and a mounting method using the same, .
It is another object of the present invention to provide a tape attaching apparatus and an attaching method using the tape attaching apparatus which can automate the tape attaching process and improve the productivity.
Another object of the present invention is to provide a tape attaching apparatus and an attaching method using the tape attaching apparatus which can reduce the manufacturing cost by automating the tape attaching process.
According to the present invention, the above object is achieved by a stage unit in which a substrate to which a tape is to be attached is seated; A cartridge unit for supplying a tape with a release paper of a predetermined length; A transfer unit for holding and transferring the tape; A peeling unit installed to peel off the release paper of the tape during the conveyance of the tape by the conveying unit; A buffer unit in which a tape on which release paper has been peeled off by the peeling unit is conveyed and settled by the conveying unit; And an attachment unit for gripping and transferring the tape seated on the buffer unit and attaching the tape to the substrate mounted on the stage unit.
Here, the cartridge unit may include a cartridge base and a cartridge in which a tape having a plurality of the release paper sheets is stacked upward.
In addition, the tape having the release paper may be laminated on the cartridge in a convex shape with the central portion upwardly convex.
In addition, the cartridge may include a lamination portion including a bottom surface on which the tape with the release paper is placed, and a left side wall and a right side wall that support both longitudinal side surfaces of the tape on which the release paper is laminated.
The left side wall and the right side wall of the lamination part may be provided so as to be adjustable according to the length of the tape to which the release paper is attached.
The cartridge unit may further include a level sensor for sensing the top of the tape having the release paper stacked on the cartridge and a drive unit for moving the tape having the release paper stacked in accordance with the sensed value from the sensor upward .
The transfer unit may include a plurality of suction pad portions that are adsorbed at a plurality of portions along a longitudinal direction of the tape having the predetermined length of release paper. The tape having the release paper having the predetermined length may have a center portion And it can be installed so as to grip in a convex shape upward.
The transfer unit may further include an arcuate forming bar which is formed along the longitudinal direction of the tape to which the release paper is attached and has an arcuate upward convex shape at the center thereof and is disposed so as to abut the upper surface of the tape to which the release paper is attached have.
In addition, the peeling unit may include at least one gripper installed on a conveying path of the tape having the predetermined length of the releasing paper conveyed by the conveying unit and provided so as to abut against the releasing paper, And a cylinder for separating the release paper from the tape by moving the gripper downward in a direction opposite to the transfer unit while the gripper grips the release paper.
In addition, the cylinder may be installed to move in a downward slanting direction.
When the grippers are provided in a plurality of grippers, the release papers may be spaced apart from each other in the longitudinal direction of the tape.
In addition, the gripper may be installed to press and grip both sides of the release paper.
The buffer unit may include a buffer panel on which the tape is mounted by being conveyed by the transfer unit and an alignment portion for pressing the longitudinal side surface and the width side surface of the tape seated on the buffer panel to align the tape can do.
In addition, a plurality of protrusions may be formed on the upper surface of the buffer panel.
The buffer panel may be made of silicon.
In addition, the attachment unit may include a suction grip portion formed to be long in one direction to suck and hold the tape, and an elastic member may be provided on the bottom surface of the suction grip portion.
Further, the stage unit may further include a vision inspection unit for inspecting the position of the substrate to be mounted, wherein the stage unit is configured to detect a position of the substrate in the x direction and the y direction, And can be installed so as to be adjustable in the rotating &thetas; direction
On the other hand, the above-described method for attaching a tape using a tape attaching apparatus includes the steps of: placing a substrate to which a tape is to be attached on a stage unit; Preparing a cartridge in which a tape having a predetermined length of a release paper is laminated upward; The tape having the topmost release paper of the tape having the release paper stacked on the cartridge is gripped through the transfer unit and transferred in one direction; Peeling the release paper from the tape by a peeling unit provided to grip and peel one side of the release paper while the tape with the releasing paper is being conveyed by the conveying unit; Releasing the tape whose release paper has been peeled off by the conveying unit and placing it in the buffer unit; Gripping a tape seated on the buffer unit through an attaching unit; And transferring the tape gripped by the attachment unit to the substrate side, and attaching a tape to a corresponding area of the substrate.
Here, it is preferable that the tape having the release paper is laminated so as to have an arcuate shape convex upward in the central part when the tape is laminated on the cartridge unit.
The step of peeling the release paper from the tape having the release paper by the release unit includes the steps of: contacting the release paper side of the tape with the release paper held by the transfer unit during transfer by the transfer unit with the gripper; The gripper gripping the upper and lower sides of the release paper side; And separating the release paper from the tape by moving the gripper in a direction opposite to the transfer direction of the transfer unit and downwardly inclining the release paper.
The method may further include pressing the lengthwise and widthwise ends of the tape through the alignment portions to align the tape in the longitudinal and width directions after the tape is seated in the buffer unit.
The method may further include aligning the substrate such that the tape attaching region of the substrate is at a position corresponding to an area to be attached by the attaching unit after the substrate is placed on the stage unit.
According to the present invention, there is provided a tape adhering apparatus capable of automatically attaching a conductive tape or a spacer tape adhering to a substrate, and an adhering method using the tape adhering apparatus.
There is also provided a tape attaching apparatus and an attaching method using the tape attaching apparatus which can improve the productivity by automating the tape attaching step.
Further, there is provided a tape attaching apparatus and a mounting method using the tape attaching apparatus, which can reduce the manufacturing cost by automating the tape attaching step.
1 is a state in which a tape is attached to a substrate,
2 is a perspective view of a tape adhering apparatus according to the first embodiment of the present invention,
Fig. 3 is a detailed view of the stage unit of Fig. 2,
Fig. 4 is a detailed view of the cartridge unit of Fig. 2,
Fig. 5 is a detailed view of the lamination portion of Fig. 4,
Fig. 6 is a detailed view of the transfer unit of Fig. 2,
7 is a partially enlarged view of Fig. 6,
Fig. 8 is a detailed view of the peeling unit of Fig. 2,
Figure 9 is an enlarged view of the gripper portion of Figure 8,
Fig. 10 is a detailed view of the buffer unit of Fig. 2,
Fig. 11 is a detailed view of the attachment unit of Fig. 2,
12 to 20 are operational state diagrams of a tape adhering apparatus according to the first embodiment of the present invention.
Prior to the description, components having the same configuration are denoted by the same reference numerals as those in the first embodiment. In other embodiments, configurations different from those of the first embodiment will be described do.
Hereinafter, a tape attaching apparatus according to a first embodiment of the present invention will be described in detail with reference to the accompanying drawings. 2 is a perspective view of a tape adhering apparatus according to a first embodiment of the present invention. 2, the tape attaching apparatus according to the first embodiment of the present invention includes a
3 is a detailed view of the stage unit of Fig. Referring to FIG. 3, the stage unit includes a
The
The
The
In this case, a
The pair of
That is, the substrate mounted on the
Thereby, it is possible to align the substrate precisely at the position of the tape to be attached by the attaching
Further, the
Based on the inspection result of the image inspection unit, the mounted substrate can be aligned in the x direction, the y direction, and the? Direction.
This can simplify the structure of the attaching
Fig. 4 is a detailed view of the cartridge unit of Fig. 2, and Fig. 5 is a detailed view of the lamination portion of Fig. 4 and 5, the
The
The
Here, the
As described above, when the center portion of the
It is impossible to stack a plurality of sheets by various kinds of grooves and protrusions formed on the longitudinal side surface of the
The width of the
On the other hand, the
The leveling
The driving
That is, when the position of the
Fig. 6 is a detailed view of the transfer unit of Fig. 2, and Fig. 7 is a partial enlarged view of Fig. 6 and 7, the
Specifically, the first moving
The second moving
The
The
More specifically, the arc-shaped
The
The supporting
The
In addition, the two
Fig. 8 is a detailed view of the peeling unit of Fig. 2, and Fig. 9 is an enlarged view of the
The
The
At this time, the
In addition, each
Fig. 10 is a detailed view of the buffer unit of Fig. 2; Referring to FIG. 10, the
The
In addition, the material of the
A plurality of
The
The first aligning
The second aligning
It is possible to align the
11 is a detailed view of the attachment unit of Fig. Referring to FIG. 11, the
The
The
The
Further, an
Next, the operation state of the above-described tape adhering apparatus will be described. 12 to 20 are operational state diagrams of a tape adhering apparatus according to the first embodiment of the present invention.
First, the substrate to which the tape is to be affixed is placed on the
Then, a
Here, the
12, the
Here, when the vacuum is suctioned through the
13, when the
16, the two
Referring to FIG. 18, the
20, after the
The entirety of the
The scope of the present invention is not limited to the above-described embodiments, but may be embodied in various forms of embodiments within the scope of the appended claims. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present invention as defined by the appended claims.
[Description of Reference Numerals]
10: stage unit 11: base
12: seat part 121: seat part body
122: alignment panel section 123: seat groove
13:
20: cartridge unit 21: cartridge base
22: Cartridge 221: Lamination part
221a:
23: leveling section 231: level sensor
232:
30: transfer unit 31: first moving part
32: first link 33: second moving part
331: Interlocking block 332: Drive motor
34: third moving part 35: arc-shaped grip part
351: second link 352: support bar
353: arc-shaped support bar 354:
40: peeling unit
41: peeling unit body 42: cylinder
43:
43b: gripper
50: buffer unit 51: buffer unit main body
52:
53:
53b: Second Alignment
60: attaching unit 61: linear drive part
62: lift portion 63: suction grip portion
63a:
Claims (22)
A cartridge unit for supplying a tape with a release paper of a predetermined length;
A transfer unit for holding and transferring the tape;
A peeling unit installed to peel off the release paper of the tape during the conveyance of the tape by the conveying unit;
A buffer unit in which a tape on which release paper has been peeled off by the peeling unit is conveyed and settled by the conveying unit; And
And an attaching unit for gripping and transferring the tape seated on the buffer unit and attaching the tape to the substrate mounted on the stage unit.
Wherein the cartridge unit includes a cartridge base and a cartridge in which a tape having a plurality of the release papers is stacked upward.
Wherein the tape having the release paper is laminated on the cartridge in a convex shape with its center portion upward.
Wherein the cartridge includes a lamination portion including a bottom surface on which the tape with the release paper is placed and a left side wall and a right side wall that support both longitudinal side surfaces of the tape with the release paper laminated thereon.
Wherein the left side wall and the right side wall of the lamination portion are adjustable in accordance with the length of the tape to which the release paper is attached.
Wherein the cartridge unit further comprises a level sensor for sensing the top of the tape having the release paper stacked on the cartridge and a driving unit for moving the tape with the release paper stacked up according to the sensed value from the sensor upward Tape attaching device.
Wherein the transfer unit includes a plurality of suction pad portions that are adsorbed at a plurality of portions along the longitudinal direction of the tape having the predetermined length of the release paper,
Wherein the suction pad portion is provided so that the tape having the release paper having the predetermined length is gripped in a convex shape with the central portion upward.
Wherein the transfer unit further comprises an arcuate forming bar which is formed along the longitudinal direction of the tape to which the release paper is attached and has a circular arcuate shape which is convex upward at an upper part thereof so as to abut the upper surface of the tape to which the release paper is attached, .
Wherein the peeling unit comprises at least one gripper installed on a conveying path of the tape having the predetermined length of the releasing paper conveyed by the conveying unit,
And a cylinder coupled to the gripper and moving the gripper downwardly in a direction opposite to the transfer unit while the gripper grips the release paper to peel the release paper from the tape.
And the cylinder is provided so as to move in a downward inclination direction.
Wherein when the grippers are provided in a plurality of the grippers, the release papers are spaced apart from each other in a longitudinal direction of the tape.
Wherein the gripper is provided so as to press and hold both upper and lower surfaces of the release paper.
Wherein the buffer unit comprises a buffer panel on which the tape is mounted by being conveyed by the transfer unit and an alignment portion for pressing the longitudinal side surface and the width side surface of the tape seated on the buffer panel to align the tape, Attaching device.
And a plurality of projections are formed on an upper surface of the buffer panel.
Wherein the buffer panel is made of silicon.
Wherein the attaching unit includes a suction gripping portion formed to be long in one direction to suck and hold the tape, and an elastic member is provided on the bottom surface of the suction gripping portion.
Wherein the stage unit further comprises a vision inspection unit for inspecting the position of the substrate to be mounted,
Wherein the stage unit is adjustably arranged in the x direction and the y direction which form a plane so as to align the substrates placed according to the inspection of the vision inspection unit, and in the &thetas;
Preparing a cartridge in which a tape having a predetermined length of a release paper is laminated upward;
The tape having the topmost release paper of the tape having the release paper stacked on the cartridge is gripped through the transfer unit and transferred in one direction;
Peeling the release paper from the tape by a peeling unit provided to grip and peel one side of the release paper while the tape with the releasing paper is being conveyed by the conveying unit;
Releasing the tape whose release paper has been peeled off by the conveying unit and placing it in the buffer unit;
Gripping a tape seated on the buffer unit through an attaching unit; And
Transferring the tape gripped by the attachment unit to the substrate side, and attaching a tape to a corresponding area of the substrate.
Wherein a tape having the release paper is stacked on the cartridge unit so that a center portion of the tape is convex upward in an arcuate shape.
Wherein the step of peeling the release paper from the tape to which the release paper is attached by the peeling unit comprises:
Contacting the gripper with the release side of the tape attached to the transfer unit held by the transfer unit during transfer by the transfer unit;
The gripper gripping the upper and lower sides of the release paper side; And
And moving the gripper so as to be inclined downwardly in a direction opposite to the conveying direction of the transfer unit to peel off the release paper from the tape.
Further comprising pressing the lengthwise and widthwise ends of the tape through an alignment portion to align the tape in the longitudinal and width directions after the tape is seated in the buffer unit.
Further comprising aligning the substrate such that the tape attaching area of the substrate is at a position corresponding to the area to be attached by the attaching unit after seating the substrate to the stage unit.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020150068241A KR20160135073A (en) | 2015-05-15 | 2015-05-15 | Conductive tape attachment apparatus and attaching using the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020150068241A KR20160135073A (en) | 2015-05-15 | 2015-05-15 | Conductive tape attachment apparatus and attaching using the same |
Publications (1)
Publication Number | Publication Date |
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KR20160135073A true KR20160135073A (en) | 2016-11-24 |
Family
ID=57705662
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR1020150068241A KR20160135073A (en) | 2015-05-15 | 2015-05-15 | Conductive tape attachment apparatus and attaching using the same |
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Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107732309A (en) * | 2017-09-26 | 2018-02-23 | 东莞阿李自动化股份有限公司 | A kind of rubberizing paper equipment |
CN108565230A (en) * | 2018-04-17 | 2018-09-21 | 无锡市精电技术有限公司 | A kind of solar battery sheet typesetting is taped device |
CN110451326A (en) * | 2019-08-30 | 2019-11-15 | 昆山新创力电子设备有限公司 | A kind of seamless rubberizing machine |
KR20200063007A (en) * | 2018-11-27 | 2020-06-04 | 코스텍시스템(주) | Lamination apparatus of temporary bonding film and method thereof |
KR20200088939A (en) | 2019-01-15 | 2020-07-24 | 주식회사 진영엠에스씨 | attachment for dense tape |
KR20220054481A (en) | 2020-10-23 | 2022-05-03 | 주식회사 진영엠에스씨 | multi tape attachment device |
KR20230154331A (en) * | 2022-04-29 | 2023-11-08 | 유진디스컴 주식회사 | Method for laminating a flexible film on a panel using an adhesive film and an apparatus therefor |
CN107732309B (en) * | 2017-09-26 | 2024-04-26 | 南京金崎新能源动力研究院有限公司 | Rubberizing paper equipment |
-
2015
- 2015-05-15 KR KR1020150068241A patent/KR20160135073A/en not_active Application Discontinuation
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107732309A (en) * | 2017-09-26 | 2018-02-23 | 东莞阿李自动化股份有限公司 | A kind of rubberizing paper equipment |
CN107732309B (en) * | 2017-09-26 | 2024-04-26 | 南京金崎新能源动力研究院有限公司 | Rubberizing paper equipment |
CN108565230A (en) * | 2018-04-17 | 2018-09-21 | 无锡市精电技术有限公司 | A kind of solar battery sheet typesetting is taped device |
CN108565230B (en) * | 2018-04-17 | 2024-03-29 | 无锡市精电技术有限公司 | Typesetting and tape adhering device for solar cell |
KR20200063007A (en) * | 2018-11-27 | 2020-06-04 | 코스텍시스템(주) | Lamination apparatus of temporary bonding film and method thereof |
KR20200088939A (en) | 2019-01-15 | 2020-07-24 | 주식회사 진영엠에스씨 | attachment for dense tape |
CN110451326A (en) * | 2019-08-30 | 2019-11-15 | 昆山新创力电子设备有限公司 | A kind of seamless rubberizing machine |
KR20220054481A (en) | 2020-10-23 | 2022-05-03 | 주식회사 진영엠에스씨 | multi tape attachment device |
KR20230154331A (en) * | 2022-04-29 | 2023-11-08 | 유진디스컴 주식회사 | Method for laminating a flexible film on a panel using an adhesive film and an apparatus therefor |
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