JP2015060925A - Support mechanism and carrier device - Google Patents

Support mechanism and carrier device Download PDF

Info

Publication number
JP2015060925A
JP2015060925A JP2013193147A JP2013193147A JP2015060925A JP 2015060925 A JP2015060925 A JP 2015060925A JP 2013193147 A JP2013193147 A JP 2013193147A JP 2013193147 A JP2013193147 A JP 2013193147A JP 2015060925 A JP2015060925 A JP 2015060925A
Authority
JP
Japan
Prior art keywords
support
substrate
support mechanism
air
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2013193147A
Other languages
Japanese (ja)
Other versions
JP6079529B2 (en
Inventor
康智 岡島
Yasutomo Okajima
康智 岡島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Priority to JP2013193147A priority Critical patent/JP6079529B2/en
Priority to TW103114167A priority patent/TWI615255B/en
Priority to KR20140061300A priority patent/KR20150032456A/en
Priority to CN201410354133.9A priority patent/CN104446370B/en
Publication of JP2015060925A publication Critical patent/JP2015060925A/en
Application granted granted Critical
Publication of JP6079529B2 publication Critical patent/JP6079529B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

Abstract

PROBLEM TO BE SOLVED: To provide an air levitation-type noncontact support mechanism that makes the used amount of air smaller than ever, and a carrier device comprising the same.SOLUTION: A support mechanism, the top surface of which assumes a flat disc shape, supports a support object in a noncontact state by generating an air flow between the top surface and the support object. In the support mechanism, a groove part assuming a circular shape in a view from the top surface and inclined by an angle of 20-60° with respect to a radial direction of the top surface is provided in a position near an outer periphery of the top surface.

Description

本発明は、物体を支持する機構に関し、特に、エア浮上式の非接触支持機構に関する。   The present invention relates to a mechanism for supporting an object, and more particularly to an air floating non-contact support mechanism.

液晶パネルは、概略、２枚の矩形状のガラス基板の間に液晶を封入した構成の大面積の貼り合わせ基板（母基板）を所定のサイズに分断することにより作製される。近年、液晶パネルの大面積化が進むことにより、母基板もしくはこれを構成するガラス基板についても、従来よりも大面積のものが用いられるようになっている。必然的に、液晶パネルの製造プロセスにおいては、係る大面積化した基板を一の工程内あるいは連続して行われる工程間で好適に搬送もしくは移動することが求められる。   The liquid crystal panel is generally manufactured by dividing a large-area bonded substrate (mother substrate) having a configuration in which liquid crystal is sealed between two rectangular glass substrates into a predetermined size. In recent years, as the area of liquid crystal panels is increased, a mother substrate or a glass substrate constituting the mother substrate has been used with a larger area than before. Inevitably, in the manufacturing process of the liquid crystal panel, it is required to suitably transport or move the large-area substrate within one process or between consecutive processes.

このような大面積化した基板を移動させる際の保持手段（クランプ）の負担を軽減する目的で、基板をエアにより浮上させつつ搬送を行う装置が既に公知である（例えば、特許文献１参照）。また、基板の位置決めに際して、基板をエアにより浮上させるようにした装置も既に公知である（例えば、特許文献２参照）。   For the purpose of reducing the burden on the holding means (clamp) when moving the substrate having such a large area, an apparatus for carrying the substrate while floating the substrate with air is already known (see, for example, Patent Document 1). . In addition, an apparatus in which a substrate is levitated by air when positioning the substrate is already known (see, for example, Patent Document 2).

特許第４９６５６３２号公報Japanese Patent No. 4965632 特許第４３７３９８０号公報Japanese Patent No. 4373980

特許文献１および特許文献２に開示された装置においては、上面が平坦な円板状をなす複数の支持機構が平面視で格子状に配置されてなる。そして、基板を該複数の支持機構によって接触支持した状態でそれぞれの支持機構の円板部分の中央位置から上方に向けてエアを噴出させて支持機構と基板との間にエアの流れを生じさせることにより、基板を支持機構から浮上させ、非接触状態で支持することができるようになっている。   In the devices disclosed in Patent Document 1 and Patent Document 2, a plurality of support mechanisms having a disk shape with a flat upper surface are arranged in a lattice shape in plan view. Then, in a state where the substrate is in contact with and supported by the plurality of support mechanisms, air is ejected upward from the center position of the disk portion of each support mechanism to generate an air flow between the support mechanism and the substrate. Thus, the substrate can be lifted from the support mechanism and supported in a non-contact state.

係る装置において非接触状態を維持するためには、支持機構と基板との間のエアの流れを形成し続ける必要があり、そのためには、多量のエアを連続的に供給し続ける必要がある。これは、コスト面で非効率である。また、基板の単位面積当たりの重量が大きくなるほど、より多くのエアを供給する必要がある。   In order to maintain a non-contact state in such an apparatus, it is necessary to continue to form an air flow between the support mechanism and the substrate. For this purpose, it is necessary to continuously supply a large amount of air. This is inefficient in terms of cost. Further, as the weight per unit area of the substrate increases, it is necessary to supply more air.

本発明は、上記課題に鑑みてなされたものであり、従来よりもエア使用量が低減されてなるエア浮上式の非接触支持機構およびこれを備える搬送装置を提供することを目的とする。   The present invention has been made in view of the above problems, and an object of the present invention is to provide an air-floating non-contact support mechanism in which the amount of air used is reduced as compared with the prior art, and a transport device including the same.

上記課題を解決するため、請求項１の発明は、上面が平坦な円板状をなし、前記上面と支持対象物との間にエアの流れを生じさせることで前記支持対象物を非接触状態で支持する支持機構であって、前記上面の中央部分にエアの噴出口を備えるとともに、前記上面の外周近傍の位置に、前記上面の径方向に対して所定の角度だけ傾斜する上面視円形状の溝部を備える、ことを特徴とする。   In order to solve the above-mentioned problem, the invention of claim 1 is a disk-shaped upper surface, and the support object is brought into a non-contact state by generating an air flow between the upper surface and the support object. A top view circular shape that includes an air outlet at the center of the upper surface and is inclined at a predetermined angle with respect to the radial direction of the upper surface at a position near the outer periphery of the upper surface. It is characterized by providing the groove part.

請求項２の発明は、請求項１に記載の支持機構であって、前記溝部と前記上面の径方向とがなす角が、２０°以上６０°以下である、ことを特徴とする。   A second aspect of the present invention is the support mechanism according to the first aspect, characterized in that an angle formed by the groove and the radial direction of the upper surface is 20 ° or more and 60 ° or less.

請求項３の発明は、搬送装置が、請求項１または請求項２に記載の支持機構を複数備え、一の前記支持対象物を複数の前記支持機構によって非接触支持しつつ搬送する、ことを特徴とする。   According to a third aspect of the present invention, there is provided a conveying device comprising a plurality of support mechanisms according to the first or second aspect, wherein the one support object is conveyed while being non-contact supported by the plurality of support mechanisms. Features.

請求項１ないし請求項３の発明によれば、溝部の入口近傍の領域にエア溜まりが形成されることで、溝部支持機構と支持対象物との間からのエアの漏れを抑制することができるので、従来よりも十分に少ないエア供給量によって支持対象物を非接触支持することができる。   According to the first to third aspects of the present invention, the air reservoir is formed in the region near the inlet of the groove portion, so that leakage of air from between the groove portion support mechanism and the support object can be suppressed. Therefore, the support object can be supported in a non-contact manner with an air supply amount that is sufficiently smaller than that of the conventional art.

支持機構１の構成を示す図である。2 is a diagram illustrating a configuration of a support mechanism 1. FIG. 支持機構１により平板状の支持対象物Ｗを支持する様子を示す図である。It is a figure which shows a mode that the flat support target object W is supported by the support mechanism. 複数の支持機構１を備えるスクライブ装置１００の概略的な透過平面図である。1 is a schematic transparent plan view of a scribing device 100 including a plurality of support mechanisms 1. 非接触支持部１０２（１０２Ａ）のより詳細な平面図である。It is a more detailed plan view of the non-contact support part 102 (102A). 基板Ｗをエアの流れによって非接触支持している状態の非接触支持部１０２（１０２Ａ）の側面図である。It is a side view of the non-contact support part 102 (102A) of the state which is carrying out the non-contact support of the board | substrate W with the flow of air. 位置決め装置２００の概略的な透過平面図である。2 is a schematic transparent plan view of a positioning device 200. FIG.

＜支持機構＞
図１は、本実施の形態に係る支持機構１の構成を示す図である。図１（ａ）は平面図であり、図１（ｂ）は断面図である。支持機構１は、概略、平面視円形の円板状をなしており、その上面１ａが、例えば脆性材料基板などの載置面とされてなる。 <Support mechanism>
FIG. 1 is a diagram illustrating a configuration of a support mechanism 1 according to the present embodiment. FIG. 1A is a plan view, and FIG. 1B is a cross-sectional view. The support mechanism 1 has a generally circular disk shape in plan view, and its upper surface 1a is a mounting surface such as a brittle material substrate.

係る上面１ａの中央部分には、エア噴出口２が設けられている。なお、図１においては複数のエア噴出口２が上面１ａの周方向に沿って二列にかつ離散的に設けられてなる態様を例示しているが、これはあくまで例示であって、エア噴出口２は上面１ａの中央位置に１つのみ設けられる態様であってもよい。   An air outlet 2 is provided at the center of the upper surface 1a. FIG. 1 illustrates an example in which a plurality of air outlets 2 are provided in two rows and discretely along the circumferential direction of the upper surface 1a. Only one outlet 2 may be provided at the center position of the upper surface 1a.

エア噴出口２は、支持機構１の裏面１ｂの側に設けられたエア供給口３と連通してなる。エア供給口３には、図示しないエア供給源が接続可能となっている。なお、エア供給口３が裏面１ｂに設けられるのは必須ではなく、支持機構１の側面に設けられる態様であってもよい。   The air outlet 2 communicates with an air supply port 3 provided on the back surface 1 b side of the support mechanism 1. An air supply source (not shown) can be connected to the air supply port 3. In addition, it is not essential that the air supply port 3 is provided in the back surface 1b, and the aspect provided in the side surface of the support mechanism 1 may be sufficient.

さらに、上面１ａの外周近傍の位置（外周よりもやや内側の位置）には、上面視円形状の溝部４が設けられてなる。係る溝部４は、上面１ａの径方向に対して所定の角度θだけ傾斜する態様にて設けられてなる。   Further, a groove portion 4 having a circular shape in a top view is provided at a position near the outer periphery of the upper surface 1a (a position slightly inside the outer periphery). The groove portion 4 is provided in such a manner that it is inclined by a predetermined angle θ with respect to the radial direction of the upper surface 1a.

図２は、支持機構１により平板状の支持対象物（以下、基板とも称する）Ｗを支持する様子を示す図である。なお、図２においては、説明の簡単のため、一の支持機構１により一の基板Ｗを支持する様子を例示しているが、実際の支持態様はこれには限定されず、複数の支持機構１により一の基板Ｗを支持する態様であってもよい。また、支持対象物は、下面が概ね平坦であれば必ずしも平板である必要はない。   FIG. 2 is a diagram showing a state in which a support object 1 (hereinafter also referred to as a substrate) W is supported by the support mechanism 1. In FIG. 2, for the sake of simplicity of explanation, a state in which one substrate W is supported by one support mechanism 1 is illustrated, but an actual support mode is not limited to this, and a plurality of support mechanisms is provided. 1 may support one substrate W. Further, the supporting object does not necessarily need to be a flat plate if the lower surface is substantially flat.

図２（ａ）に示すように、基板Ｗはいったん支持機構１の上面１ａに載置される。そして、係る状態において、矢印ＡＲ１にて示すように、エア供給口３からエアが供給される。所定のしきい値以上の流量でエアが供給されると、図２（ｂ）に矢印ＡＲ２にて示すように、エアがエア噴出口２から噴出して基板Ｗと支持機構１の上面１ａとの間を流れ、矢印ＡＲ３にて示すように、エアによる浮力（揚力）と基板Ｗの自重とがバランスする高さにまで、基板Ｗが上昇する。すなわち、基板Ｗが上面１ａから浮上した状態、換言すれば基板Ｗが支持機構１によって非接触で支持される状態が実現される。   As shown in FIG. 2A, the substrate W is once placed on the upper surface 1 a of the support mechanism 1. In this state, air is supplied from the air supply port 3 as indicated by an arrow AR1. When air is supplied at a flow rate equal to or higher than a predetermined threshold value, air is ejected from the air outlet 2 as shown by an arrow AR2 in FIG. 2B, and the substrate W and the upper surface 1a of the support mechanism 1 As shown by an arrow AR3, the substrate W rises to a height at which the buoyancy (lift) by the air and the weight of the substrate W are balanced. That is, a state where the substrate W is floated from the upper surface 1 a, in other words, a state where the substrate W is supported by the support mechanism 1 in a non-contact manner is realized.

より詳細にいえば、このとき、支持機構１においては、エア噴出口２から噴出し外周方向へと向かうエアが、矢印ＡＲ４にて示すように、いったん溝部４に入り込んだ後、溝部４から外へ出ようとするようになる。これにより、溝部４の入口近傍の領域ＲＥにエア溜まりが形成される。係るエア溜まりが形成されることで、領域ＲＥにおけるエアの流速は、エア噴出口２から外周方向へと向かおうとするエアの流速よりも小さくなるので、ベルヌイの定理により、領域ＲＥに近傍におけるエアの圧力は、エア噴出口２の近傍におけるエアの圧力よりも高くなる。その結果として、領域ＲＥの近傍に滞留するエアは、上面１ａと基板Ｗとの間から外部へと漏れ出そうとするよりもむしろ、基板Ｗを上方へと押し上げるようになる。   More specifically, at this time, in the support mechanism 1, the air that is ejected from the air ejection port 2 toward the outer peripheral direction once enters the groove portion 4 as indicated by an arrow AR 4, and then exits from the groove portion 4. Trying to go out. As a result, an air reservoir is formed in the region RE in the vicinity of the inlet of the groove 4. By forming such an air reservoir, the flow velocity of air in the region RE is smaller than the flow velocity of air going from the air outlet 2 toward the outer peripheral direction. The air pressure is higher than the air pressure in the vicinity of the air outlet 2. As a result, the air staying in the vicinity of the region RE pushes the substrate W upward rather than trying to leak from between the upper surface 1a and the substrate W to the outside.

換言すれば、支持機構１においては、エア噴出口２から噴出したエアの外部への流出（エア漏れ）が、エアの流れ自身によって好適に遮断もしくは抑制され、エア噴出口２から噴出したエアの大部分が、流出することなく基板Ｗの浮上に用いられる状態が実現されてなる。   In other words, in the support mechanism 1, the outflow (air leakage) of the air ejected from the air ejection port 2 is suitably blocked or suppressed by the air flow itself, and the air ejected from the air ejection port 2 A state in which the majority is used for floating the substrate W without flowing out is realized.

係る態様にてエア漏れが抑制されることにより、支持機構１においては、溝部４を有さない従来の支持機構に比してより少ないエアの供給流量であっても、基板Ｗを非接触支持することが可能となっている。換言すれば、基板Ｗを浮上させるために供給するエアの流量のしきい値が、従来よりも低減されたものとなっている。あるいは、別の見方をすれば、本実施の形態に係る支持機構１においては、基板Ｗを支持するために供給されるエアが、従来の溝部４を有さない支持機構よりも効率的に基板Ｗの浮上に利用されるようになっているともいえる。いずれにせよ、本実施の形態に係る支持機構１を用いることで、従来よりもエアの供給コストを低減することが可能となる。   By suppressing air leakage in this manner, the support mechanism 1 supports the substrate W in a non-contact manner even when the air supply flow rate is smaller than that of the conventional support mechanism that does not have the groove 4. It is possible to do. In other words, the threshold value of the flow rate of air supplied to float the substrate W is reduced as compared with the conventional case. Alternatively, from another viewpoint, in the support mechanism 1 according to the present embodiment, the air supplied to support the substrate W is more efficient than the conventional support mechanism that does not have the groove 4. It can be said that it is used for the rise of W. In any case, the use of the support mechanism 1 according to the present embodiment makes it possible to reduce the air supply cost as compared with the conventional case.

このような溝部４の具備によってエア漏れを効率的に抑制するには、溝部４の形状や支持機構１における配置位置を好適に定めることが重要である。実際の好適な形状は、支持機構１自体のサイズによっても異なるが、例えば、角度θは２０°〜６０°程度であるのが好適であり、２０°〜４０°程度であるのがより好適である。また、平面視における直径が１００ｍｍφ〜３００ｍｍφの支持機構１の場合であれば、溝部４の幅（深さ方向に垂直な面における幅）ｗは２ｍｍ〜５ｍｍであるのが好適であり、溝部４の深さは、溝部４の上面１ａにおける開口部の中心寄り端部からの深さｄ１が５ｍｍ〜１５ｍｍであり、該開口部の外周寄り端部からの深さｄ２が３ｍｍ〜１０ｍｍであるのが好適である。さらには、支持機構１の上面１ａにおける外周端部から溝部４までの距離ｒは、６ｍｍ〜１５ｍｍであるのが好適である。   In order to efficiently suppress air leakage by providing such a groove portion 4, it is important to suitably determine the shape of the groove portion 4 and the arrangement position in the support mechanism 1. The actual preferred shape varies depending on the size of the support mechanism 1 itself. For example, the angle θ is preferably about 20 ° to 60 °, and more preferably about 20 ° to 40 °. is there. In the case of the support mechanism 1 having a diameter in a plan view of 100 mmφ to 300 mmφ, the width of the groove portion 4 (width in a plane perpendicular to the depth direction) w is preferably 2 mm to 5 mm. The depth d1 from the end portion near the center of the opening in the upper surface 1a of the groove 4 is 5 mm to 15 mm, and the depth d2 from the end near the outer periphery of the opening is 3 mm to 10 mm. Is preferred. Furthermore, the distance r from the outer peripheral end to the groove 4 on the upper surface 1a of the support mechanism 1 is preferably 6 mm to 15 mm.

＜搬送装置への適用例＞
図２（ｂ）に示した態様にて浮上させられた後の基板Ｗの搬送態様には、種々のものがある。例えば、支持機構１と搬送機構とが一体に（同期的に移動可能に）設けられており、非接触支持状態を保ちつつ支持機構１が移動することによって基板Ｗを搬送する態様であってもよい。あるいは、支持機構１自体は水平面内において移動することのない固定的な態様にて配置されてなる一方、支持機構１とは独立した搬送手段が存在し、該搬送手段によって浮上状態の基板Ｗが保持され、別の場所に搬送される態様であってもよい。係る場合、支持機構１は一種のリフターとしても機能していることになる。あるいはさらに、複数の支持機構１が固定的に列設されてなり、それらと別個に設けられた搬送手段によって基板Ｗを搬送しつつ、個々の支持機構１によって順次に基板Ｗを支持する態様であってもよい。換言すれば、このことは、支持機構１が種々の搬送装置に組み込み可能なことを意味している。 <Example of application to transfer device>
There are various modes for transporting the substrate W after it has been levitated in the mode shown in FIG. For example, even if the support mechanism 1 and the transport mechanism are integrally provided (movable synchronously) and the support mechanism 1 moves while maintaining the non-contact support state, the substrate W may be transported. Good. Alternatively, the support mechanism 1 itself is arranged in a fixed manner that does not move in a horizontal plane, while there is a transport means independent of the support mechanism 1, and the substrate W in a floating state is formed by the transport means. It may be held and transported to another place. In such a case, the support mechanism 1 also functions as a kind of lifter. Alternatively, a plurality of support mechanisms 1 are fixedly arranged, and the substrate W is sequentially supported by the individual support mechanisms 1 while the substrate W is transported by transport means provided separately from the support mechanisms 1. There may be. In other words, this means that the support mechanism 1 can be incorporated into various transport devices.

図３は、そのような搬送装置を含む装置の例示的な一態様である、複数の支持機構１を備えるスクライブ装置１００の概略的な透過平面図である。スクライブ装置１００は、概略、基台１００Ａの上に、基板Ｗを接触状態で下方から支持する複数の接触支持部１０１と、それぞれが複数の支持機構１を備える複数の非接触支持部１０２とを備える。図３においては、スクライブ装置１００が、支持機構１の配置個数および配置態様が相異なる４種類の非接触支持部１０２（１０２Ａ、１０２Ｂ、１０２Ｃ、１０２Ｄ）を備える場合を例示している。なお、図３においては、スクライブ装置１００の水平面内における短手方向をＸ軸方向とし、スクライブ装置１００の水平面内における長手方向でもある基板Ｗの搬送方向をＹ軸方向とし、鉛直方向をＺ軸方向とする右手系のＸＹＺ座標を付している。   FIG. 3 is a schematic transparent plan view of a scribing apparatus 100 including a plurality of support mechanisms 1, which is an exemplary embodiment of an apparatus including such a transport apparatus. The scribing apparatus 100 generally includes a plurality of contact support portions 101 that support the substrate W from below in a contact state on a base 100A, and a plurality of non-contact support portions 102 each including a plurality of support mechanisms 1. Prepare. FIG. 3 illustrates a case where the scribing apparatus 100 includes four types of non-contact support portions 102 (102A, 102B, 102C, and 102D) that are different in the number and arrangement of the support mechanisms 1. In FIG. 3, the lateral direction of the scribing apparatus 100 in the horizontal plane is the X-axis direction, the transport direction of the substrate W, which is also the longitudinal direction in the horizontal plane of the scribing apparatus 100, is the Y-axis direction, and the vertical direction is the Z-axis. A right-handed XYZ coordinate as a direction is attached.

より詳細には、スクライブ装置１００においては、接触支持部１０１が、Ｙ軸方向の上流側、下流側の２箇所でＸ軸方向において互いに離間して備わり、それらの接触支持部１０１の間に、非接触支持部１０２が設けられてなる。非接触支持部１０２としては、１０個の支持機構１がＹ軸方向に沿って５個ずつ二列に配列してなる非接触支持部１０２Ａと、５個の支持機構１がＹ軸方向に沿って一列に配列してなる非接触支持部１０２Ｂと、１８個の支持機構１がＹ軸方向に沿って９個ずつ二列に配列してなる非接触支持部１０２Ｃと、９個の支持機構１がＹ軸方向に沿って一列に配列してなる非接触支持部１０２Ｄとがある。なお、接触支持部１０１は、単に基板Ｗを下方から接触支持するだけではなく、例えば、ベルトコンベアなどによって構成されることで、基板を接触支持しつつ搬送可能とされていてもよい。   More specifically, in the scribing apparatus 100, the contact support portions 101 are provided at two positions on the upstream side and the downstream side in the Y-axis direction so as to be separated from each other in the X-axis direction, and between the contact support portions 101, A non-contact support portion 102 is provided. As the non-contact support part 102, 10 support mechanisms 1 are arranged in two rows of 5 along the Y-axis direction, and the non-contact support part 102A includes five support mechanisms 1 along the Y-axis direction. Non-contact support portions 102B arranged in a row, 18 non-contact support portions 102C in which 18 support mechanisms 1 are arranged in two rows along the Y-axis direction, and nine support mechanisms 1 Are non-contact support portions 102D arranged in a line along the Y-axis direction. Note that the contact support unit 101 may not only simply contact and support the substrate W from below, but may be configured to be transported while supporting and supporting the substrate, for example, by a belt conveyor.

以降、上流側の接触支持部１０１と非接触支持部１０２とを上流側支持部１００Ｕとも称し、下流側の接触支持部１０１と非接触支持部１０２とを下流側支持部１００Ｄとも称する。   Hereinafter, the upstream contact support portion 101 and the non-contact support portion 102 are also referred to as an upstream support portion 100U, and the downstream contact support portion 101 and the non-contact support portion 102 are also referred to as a downstream support portion 100D.

また、図４は、非接触支持部１０２（１０２Ａ）のより詳細な平面図である。図４においては、非接触支持部１０２に備わる支持機構１が、その平面視中央部分に一のエア噴出口２を備える場合を例示している。また、上述の場合と同様、それぞれの支持機構１には溝部４が設けられてなる。   FIG. 4 is a more detailed plan view of the non-contact support portion 102 (102A). In FIG. 4, the case where the support mechanism 1 provided in the non-contact support part 102 is provided with one air jet outlet 2 in the plan view center part is illustrated. Moreover, the groove part 4 is provided in each support mechanism 1 like the above-mentioned case.

さらに、図５は、基板Ｗをエアの流れによって非接触支持している状態の非接触支持部１０２（１０２Ａ）の側面図である。図５に示すように、非接触支持部１０２においてもそれぞれの支持機構１にはエア供給口３が備わっている。係るエア供給口３は、非接触支持部１０２の裏面側（支持機構１が備わる側とＺ軸方向において反対側）に設けられた、装置外部からのエア配管が接続される接続口１０５と連通してなる。   FIG. 5 is a side view of the non-contact support portion 102 (102A) in a state where the substrate W is supported in a non-contact manner by an air flow. As shown in FIG. 5, each support mechanism 1 also includes an air supply port 3 in the non-contact support portion 102. The air supply port 3 communicates with a connection port 105 provided on the back surface side of the non-contact support portion 102 (on the side opposite to the side where the support mechanism 1 is provided in the Z-axis direction) to which an air pipe from the outside of the apparatus is connected. Do it.

好ましくは、図５に示すように、非接触支持部１０２においては、それぞれの支持機構１が緩衝機構１０６によって保持される。緩衝機構１０６は、支持機構１を、図示しないコイルスプリングによって弾性的に、一定範囲内で傾斜自在および昇降自在に保持してなる。係る態様にて支持機構１が備わる場合、支持機構１が、指示対象たる基板Ｗの撓みやうねりに追従してその姿勢を変えつつ基板Ｗを非接触支持することが可能となる。   Preferably, as shown in FIG. 5, in the non-contact support portion 102, each support mechanism 1 is held by a buffer mechanism 106. The buffer mechanism 106 is configured to hold the support mechanism 1 elastically by a coil spring (not shown) so that the support mechanism 1 can be tilted and raised and lowered within a certain range. When the support mechanism 1 is provided in this manner, the support mechanism 1 can support the substrate W in a non-contact manner while changing its posture following the bending or undulation of the instruction target substrate W.

また、Ｙ軸方向の上流側支持部１００Ｕよりも負側には、基板Ｗの後方端部を保持する１対のクランプ１０３が備わっている。１対のクランプ１０３は、基板Ｗの高さ位置に応じてその高さ位置を可変自在に設けられてなる。１対のクランプ１０３はさらに、基板Ｗの後方端部を保持した状態で、上流側支持部１００Ｕと干渉することなくＹ軸方向に移動自在とされてなる。   A pair of clamps 103 that hold the rear end of the substrate W are provided on the negative side of the upstream support portion 100U in the Y-axis direction. The pair of clamps 103 is provided such that the height position thereof can be varied according to the height position of the substrate W. Further, the pair of clamps 103 is movable in the Y-axis direction without interfering with the upstream support portion 100U while holding the rear end portion of the substrate W.

さらに、上流側支持部１００Ｕと下流側支持部１００Ｄとの間には、スクライブ機構１０４が備わっている。スクライブ機構１０４は、Ｘ軸方向に往復自在な図示しないスクライブヘッドを有し、該スクライブヘッドに備わるスクライブ手段を、上流側支持部１００Ｕと下流側支持部１００Ｄとによって支持されてなる基板Ｗの両支持部の間の位置において、Ｘ軸方向に移動させることにより、基板Ｗにスクライブラインを形成することが出来るようになっている。   Furthermore, a scribe mechanism 104 is provided between the upstream support portion 100U and the downstream support portion 100D. The scribing mechanism 104 has a scribing head (not shown) that can reciprocate in the X-axis direction, and the scribing means provided in the scribing head is supported on both the substrates W formed by the upstream support unit 100U and the downstream support unit 100D. A scribe line can be formed on the substrate W by moving in the X-axis direction at a position between the support portions.

係る構成のスクライブ装置１００においては、外部から搬送されてきた基板Ｗがいったん、上流側支持部１００Ｕに属する全ての接触支持部１０１および非接触支持部１０２によって接触支持されるように配置される。そして、１対のクランプ１０３によって後方端部を保持された状態で、上流側支持部１００Ｕの非接触支持部１０２（１０２Ａ、１０２Ｂ）に備わる支持機構１のエア供給口３に対しエアが供給されることで、基板Ｗは、非接触支持部１０２に備わる支持機構１のエア噴出口２から噴出するエアによって浮上させられる。すなわち、基板Ｗは、その下方から非接触支持部１０２によって非接触状態で支持される。   In the scribing apparatus 100 having such a configuration, the substrate W transported from the outside is once arranged so as to be contact-supported by all the contact support portions 101 and the non-contact support portions 102 belonging to the upstream support portion 100U. Then, air is supplied to the air supply port 3 of the support mechanism 1 provided in the non-contact support part 102 (102A, 102B) of the upstream support part 100U in a state where the rear end part is held by the pair of clamps 103. Thus, the substrate W is levitated by the air ejected from the air ejection port 2 of the support mechanism 1 provided in the non-contact support unit 102. That is, the substrate W is supported in a non-contact state by the non-contact support portion 102 from below.

続いて、係る非接触状態を保ちつつ、クランプ１０３が、基板ＷをＹ軸正方向の所定のスクライブ位置にまで搬送する。そして、基板Ｗがスクライブ位置に到達すると、スクライブ機構１０４によるスクライブが実施される。   Subsequently, while maintaining such a non-contact state, the clamp 103 transports the substrate W to a predetermined scribe position in the Y-axis positive direction. When the substrate W reaches the scribe position, scribing by the scribe mechanism 104 is performed.

スクライブ機構１０４によってスクライブラインが形成された基板Ｗは、さらにＹ軸正方向へと搬送する。係る搬送が進むに伴って、上流側支持部１００Ｕの非接触支持部１０２（１０２Ａ、１０２Ｂ）によって非接触支持されていた基板Ｗは徐々に、下流側支持部１００Ｄの非接触支持部１０２（１０２Ｃ、１０２Ｄ）によって支持されるようになる。   The substrate W on which the scribe line is formed by the scribe mechanism 104 is further conveyed in the Y axis positive direction. As the conveyance proceeds, the substrate W that has been non-contact supported by the non-contact support portions 102 (102A, 102B) of the upstream support portion 100U gradually becomes non-contact support portions 102 (102C) of the downstream support portion 100D. , 102D).

係る態様にて基板Ｗの搬送とスクライブを行うスクライブ装置１００においても、それぞれの支持機構１に溝部４を設けておくことで、従来よりも少ないエア供給量で、基板Ｗを非接触支持しつつ、基板Ｗにスクライブラインを形成することが可能である。また、それぞれの支持機構１においてエア漏れがほとんど生じることなく安定的に基板Ｗを支持できることから、溝部４を備えていない支持機構を用いる場合に比して、基板Ｗをバランス良く支持しながら搬送することができる。   Even in the scribing apparatus 100 that transports and scribes the substrate W in this manner, by providing the groove portions 4 in the respective support mechanisms 1, the substrate W is supported in a non-contact manner with a smaller air supply amount than in the past. It is possible to form a scribe line on the substrate W. In addition, since each support mechanism 1 can stably support the substrate W with almost no air leakage, the substrate W can be transported while supporting the substrate W in a balanced manner as compared with the case where a support mechanism without the groove 4 is used. can do.

図６は、支持機構１を具備する搬送装置の別の態様である、位置決め装置２００の概略的な透過平面図である。なお、図６においては、水平面内の互いに直交する方向をＸ軸方向およびＹ軸方向とし、鉛直方向をＺ軸方向とする右手系のＸＹＺ座標を付している。   FIG. 6 is a schematic transparent plan view of a positioning device 200, which is another aspect of the transport device including the support mechanism 1. In FIG. 6, right-handed XYZ coordinates are given with the directions orthogonal to each other in the horizontal plane being the X-axis direction and the Y-axis direction, and the vertical direction being the Z-axis direction.

位置決め装置２００は、基台２００Ａの水平な上面２００Ｓに、複数の支持機構１をＸ軸方向およびＹ軸方向に沿った直交格子状に備える。また、位置決め装置２００は、基台２００Ａの上面２００ＳのＸ軸方向負側の端部近傍に、Ｙ軸方向において離間する態様にて、複数の位置決めピン２０１（２０１Ａ）を備えるとともに、Ｙ軸方向正側の端部近傍に、Ｘ軸方向において離間する態様にて、複数の位置決めピン２０１（２０１Ｂ）を備える。   The positioning device 200 includes a plurality of support mechanisms 1 in an orthogonal lattice shape along the X-axis direction and the Y-axis direction on the horizontal upper surface 200S of the base 200A. In addition, the positioning device 200 includes a plurality of positioning pins 201 (201A) in the manner of being spaced apart in the Y-axis direction near the end on the negative side in the X-axis direction of the upper surface 200S of the base 200A, and in the Y-axis direction A plurality of positioning pins 201 (201 </ b> B) are provided in the vicinity of the end portion on the positive side so as to be separated in the X-axis direction.

さらに、位置決め装置２００は、基台２００Ａの外側位置であって、位置決めピン２０１Ａに対向する位置に、Ｘ軸方向に離間する態様にて、複数のプッシャー２０２（２０２Ａ）を備えるとともに、位置決めピン２０１Ｂに対向する位置に、Ｙ軸方向に離間する態様にて、複数のプッシャー２０２（２０２Ｂ）を備える。   Furthermore, the positioning device 200 includes a plurality of pushers 202 (202A) at positions outside the base 200A and facing the positioning pins 201A in a manner of being spaced apart in the X-axis direction, and positioning pins 201B. Are provided with a plurality of pushers 202 (202B) in a manner of being spaced apart in the Y-axis direction.

なお、図６においては、位置決め装置２００が、１５個の支持機構１をＸ軸方向に５個ずつ、Ｙ軸方向に３個ずつ有するとともに、５個の位置決めピン２０１Ａと、３個の位置決めピン２０１Ｂと、２個のプッシャー２０２Ａと、２個のプッシャー２０２Ｂとを備える態様を例示しているが、支持機構１、位置決めピン２０１およびプッシャー２０２の個数はこれに限られるものではない。   In FIG. 6, the positioning device 200 has 15 support mechanisms 1 in the X-axis direction and 5 in the Y-axis direction, and 3 in the Y-axis direction, and includes 5 positioning pins 201A and 3 positioning pins. The embodiment includes 201B, two pushers 202A, and two pushers 202B, but the number of support mechanisms 1, positioning pins 201, and pushers 202 is not limited thereto.

係る位置決め装置２００においては、外部から搬送された基板Ｗが、いったん全ての支持機構１にて接触支持されるように配置される。そして、支持機構１に備わる支持機構１のエア供給口３に対しエアが供給されることで、基板Ｗは、非接触支持部１０２に備わる支持機構１のエア噴出口２から噴出するエアによって浮上させられる。すなわち、基板Ｗは、その下方から非接触支持部１０２によって非接触状態で支持される。   In the positioning apparatus 200, the substrate W transported from the outside is arranged so as to be contacted and supported by all the support mechanisms 1 once. Then, by supplying air to the air supply port 3 of the support mechanism 1 provided in the support mechanism 1, the substrate W is floated by the air ejected from the air outlet 2 of the support mechanism 1 provided in the non-contact support unit 102. Be made. That is, the substrate W is supported in a non-contact state by the non-contact support portion 102 from below.

続いて、係る非接触状態を保ちつつ、プッシャー２０２ＡがＹ軸正方向へ移動して基板Ｗを当該方向へと押し出し、かつ、プッシャー２０２ＢがＸ軸負方向へ移動して基板Ｗを当該方向へと押し出す。その結果、基板Ｗは、そのＸ軸方向正側の端部が位置決めピン２０１Ａに当接し、そのＹ軸方向負側の端部が位置決めピン２０１Ａに当接するように移動する。係る状態で、エア噴出口２からのエアの噴出を停止させると、基板Ｗは、それら当接状態を保ちつつ、再び支持機構１にて接触支持されるようになる。これにより、基板Ｗの位置決めが完了する。   Subsequently, while maintaining such a non-contact state, the pusher 202A moves in the positive Y-axis direction to push out the substrate W in this direction, and the pusher 202B moves in the negative X-axis direction to move the substrate W in this direction. And extrude. As a result, the substrate W moves so that the end on the positive side in the X-axis direction comes into contact with the positioning pin 201A and the end on the negative side in the Y-axis direction comes into contact with the positioning pin 201A. In this state, when the ejection of air from the air ejection port 2 is stopped, the substrate W is again contacted and supported by the support mechanism 1 while maintaining the contact state. Thereby, the positioning of the substrate W is completed.

係る態様にて基板Ｗの位置決めを行う位置決め装置２００においても、それぞれの支持機構１に溝部４を設けておくことで、従来よりも少ないエア供給量で、基板Ｗを非接触支持しつつ、基板Ｗの位置決め、つまりは基板Ｗの所定位置への搬送を行うことが可能である。また、それぞれの支持機構１においてエア漏れがほとんど生じることなく安定的に基板Ｗを支持できることから、溝部４を備えていない支持機構を用いる場合に比して、基板Ｗをバランス良く支持しながら位置決めすることができる。   Also in the positioning apparatus 200 that positions the substrate W in such a manner, by providing the groove portions 4 in the respective support mechanisms 1, the substrate W can be supported in a non-contact manner with a smaller air supply amount than in the past. It is possible to position W, that is, transport the substrate W to a predetermined position. In addition, since each support mechanism 1 can stably support the substrate W with almost no air leakage, positioning is performed while supporting the substrate W in a balanced manner as compared with the case where a support mechanism that does not include the groove 4 is used. can do.

以上、説明したように、本実施の形態によれば、上面が平坦な円板状をなし、該上面に支持対象物を載置した状態で該上面の中央位置から上方に向けてエアを噴出させて支持対象物との間にエアの流れを生じさせることにより、支持対象物を浮上させて非接触状態で支持する支持機構において、上面の外周近傍の位置に、上面の径方向に対して所定の角度だけ傾斜する態様にて上面視円形状の溝部を設けることで、支持機構と支持対象物との間からのエアの漏れを抑制することができ、結果として、従来よりも十分に少ないエア供給量によって支持対象物を非接触支持することが可能となる。   As described above, according to the present embodiment, the upper surface has a flat disk shape, and air is ejected upward from the center position of the upper surface in a state where the support object is placed on the upper surface. In the support mechanism that floats the support object and supports it in a non-contact state by generating an air flow between the support object and the support object, the position is near the outer periphery of the upper surface with respect to the radial direction of the upper surface. By providing a groove having a circular shape when viewed from above in a manner that is inclined by a predetermined angle, air leakage from between the support mechanism and the support object can be suppressed, and as a result, it is sufficiently less than in the past. The object to be supported can be supported in a non-contact manner by the air supply amount.

実施例として、図１および図２に示す形状を有し、外径が１２０ｍｍφの支持機構１を用意し、重さが３０ｋｇの支持対象物を非接触支持するようにした。それぞれのエア噴出口２の直径は２ｍｍφとした。溝部４は、支持機構１の上面１ａとなす角度θを３０°としたほか、幅ｗが３．５ｍｍ、深さｄ１が１０ｍｍ、深さｄ２が６．５ｍｍ、上面１ａにおける外周端部から溝部４までの距離ｒが１０．５ｍｍとなるように形成した。   As an example, a support mechanism 1 having the shape shown in FIGS. 1 and 2 and having an outer diameter of 120 mmφ was prepared, and a support object having a weight of 30 kg was supported in a non-contact manner. The diameter of each air jet 2 was 2 mmφ. The groove portion 4 has an angle θ with the upper surface 1a of the support mechanism 1 of 30 °, a width w of 3.5 mm, a depth d1 of 10 mm, a depth d2 of 6.5 mm, and a groove portion from the outer peripheral end of the upper surface 1a. The distance r up to 4 was 10.5 mm.

係る実施例においては、エア供給口３から供給するエアの供給圧が０．１ＭＰａであり、流量が３Ｌ（リットル）／ｍｉｎ．で支持対象物を非接触支持することができた。   In such an embodiment, the supply pressure of air supplied from the air supply port 3 is 0.1 MPa, and the flow rate is 3 L (liter) / min. The support object could be supported in a non-contact manner.

一方、比較例として、溝部４を有さない他は、実施例と同様の形状を有する支持機構を用意し、同様に、重さが３０ｋｇの支持対象物を非接触支持するようにした。   On the other hand, as a comparative example, a support mechanism having the same shape as in the example except that the groove portion 4 is not provided was prepared, and similarly, a support object having a weight of 30 kg was supported in a non-contact manner.

係る比較例においては、エア供給口３から供給するエアの供給圧を４ＭＰａとし、流量が１００Ｌ（リットル）／ｍｉｎ．とすることで、支持対象物を非接触支持することができた。   In this comparative example, the supply pressure of air supplied from the air supply port 3 is 4 MPa, and the flow rate is 100 L (liter) / min. By doing so, the support object could be supported in a non-contact manner.

これら実施例と比較例の結果は、上述の実施の形態のように支持機構１が溝部４を備えることで、従来よりも十分に少ないエア供給量によって支持対象物を非接触支持することができることを示している。   As a result of these examples and comparative examples, the support mechanism 1 includes the groove portion 4 as in the above-described embodiment, so that the support object can be supported in a non-contact manner with an air supply amount that is sufficiently smaller than the conventional one. Is shown.

１ 支持機構
２ エア噴出口
３ エア供給口
４ 溝部
１００ スクライブ装置
１００Ａ 基台
１００Ｄ 下流側支持部
１００Ｕ 上流側支持部
１０１ 接触支持部
１０２（１０２Ａ、１０２Ｂ、１０２Ｃ、１０２Ｄ） 非接触支持部
１０３ クランプ
１０４ スクライブ機構
１０５ 接続口
１０６ 緩衝機構
２００ 位置決め装置
２００Ａ 基台
２００Ｓ 上面
２０１（２０１Ａ、２０１Ｂ） 位置決めピン
２０２（２０２Ａ、２０２Ｂ） プッシャー
Ｗ 支持対象物（基板） DESCRIPTION OF SYMBOLS 1 Support mechanism 2 Air ejection port 3 Air supply port 4 Groove part 100 Scribing apparatus 100A Base 100D Downstream side support part 100U Upstream side support part 101 Contact support part 102 (102A, 102B, 102C, 102D) Non-contact support part 103 Clamp 104 Scribe mechanism 105 Connection port 106 Buffer mechanism 200 Positioning device 200A Base 200S Upper surface 201 (201A, 201B) Positioning pin 202 (202A, 202B) Pusher W Support object (substrate)

Claims (3)

上面が平坦な円板状をなし、前記上面と支持対象物との間にエアの流れを生じさせることで前記支持対象物を非接触状態で支持する支持機構であって、
前記上面の中央部分にエアの噴出口を備えるとともに、前記上面の外周近傍の位置に、前記上面の径方向に対して所定の角度だけ傾斜する上面視円形状の溝部を備える、
ことを特徴とする支持機構。 A support mechanism for supporting the support object in a non-contact state by forming an air flow between the upper surface and the support object by forming a flat disk shape on the upper surface,
An air outlet is provided in the central portion of the upper surface, and a groove portion having a circular shape in a top view that is inclined at a predetermined angle with respect to the radial direction of the upper surface at a position near the outer periphery of the upper surface
A support mechanism characterized by that. 請求項１に記載の支持機構であって、
前記溝部と前記上面の径方向とがなす角が、２０°以上６０°以下である、
ことを特徴とする支持機構。 The support mechanism according to claim 1,
The angle formed by the groove and the radial direction of the upper surface is 20 ° or more and 60 ° or less.
A support mechanism characterized by that. 請求項１または請求項２に記載の支持機構を複数備え、
一の前記支持対象物を複数の前記支持機構によって非接触支持しつつ搬送する、
ことを特徴とする搬送装置。 A plurality of support mechanisms according to claim 1 or claim 2,
Transporting one of the supporting objects in a non-contact manner by a plurality of the supporting mechanisms;
A conveying apparatus characterized by that.
JP2013193147A 2013-09-18 2013-09-18 Support mechanism and transfer device Expired - Fee Related JP6079529B2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2013193147A JP6079529B2 (en) 2013-09-18 2013-09-18 Support mechanism and transfer device
TW103114167A TWI615255B (en) 2013-09-18 2014-04-18 Support mechanism and transport device
KR20140061300A KR20150032456A (en) 2013-09-18 2014-05-22 Holding apparatus and transporting apparatus
CN201410354133.9A CN104446370B (en) 2013-09-18 2014-07-23 Supporting mechanism and carrying device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013193147A JP6079529B2 (en) 2013-09-18 2013-09-18 Support mechanism and transfer device

Publications (2)

Publication Number Publication Date
JP2015060925A true JP2015060925A (en) 2015-03-30
JP6079529B2 JP6079529B2 (en) 2017-02-15

Family

ID=52818223

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013193147A Expired - Fee Related JP6079529B2 (en) 2013-09-18 2013-09-18 Support mechanism and transfer device

Country Status (4)

Country Link
JP (1) JP6079529B2 (en)
KR (1) KR20150032456A (en)
CN (1) CN104446370B (en)
TW (1) TWI615255B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230094970A (en) 2021-12-21 2023-06-28 미쓰보시 다이야몬도 고교 가부시키가이샤 Scribe Head and Scribe Apparatus

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5879733A (en) * 1981-11-06 1983-05-13 Hitachi Ltd Wafer transferring apparatus
JPH07508961A (en) * 1992-07-15 1995-10-05 ミネソタ・マイニング・アンド・マニュファクチュアリング・カンパニー Fluid transfer device for transferring goods
JP2007194508A (en) * 2006-01-20 2007-08-02 Tokyo Electron Ltd Substrate transport device, substrate transport method, and computer program
WO2007088614A1 (en) * 2006-02-01 2007-08-09 Hirata Corporation Nozzle plate and device that floats by gas flow and uses the nozzle plate
JP2008130892A (en) * 2006-11-22 2008-06-05 Shinko Electric Co Ltd Air float carrying apparatus and air carrying method
JP2008177239A (en) * 2007-01-16 2008-07-31 Tokyo Electron Ltd Substrate conveyor and vertical heat treatment apparatus
JP2010123970A (en) * 2008-11-24 2010-06-03 Sfa Engineering Corp Substrate transfer apparatus
JP2010192684A (en) * 2009-02-18 2010-09-02 Tokyo Electron Ltd Substrate transfer apparatus and substrate treatment system
JP2012119431A (en) * 2010-11-30 2012-06-21 Nitto Denko Corp Method and device for conveying semiconductor wafer

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4373175B2 (en) * 2003-10-17 2009-11-25 オリンパス株式会社 Substrate transfer device
EP1741527A1 (en) * 2004-03-15 2007-01-10 Mitsuboshi Diamond Industrial Co., Ltd. Substrate dividing system, substrate manufacturing equipment, substrate scribing method and substrate dividing method
CN100510874C (en) * 2004-11-24 2009-07-08 喜开理株式会社 Floating unit and floating device with tilting function
US20110141448A1 (en) * 2009-11-27 2011-06-16 Nikon Corporation Substrate carrier device, substrate carrying method, substrate supporting member, substrate holding device, exposure apparatus, exposure method and device manufacturing method
TWI587430B (en) * 2010-02-17 2017-06-11 尼康股份有限公司 A conveyance device, a conveying method, an exposure apparatus, and an element manufacturing method
JP5210407B2 (en) * 2011-04-06 2013-06-12 三星ダイヤモンド工業株式会社 Break device and break method
US8888271B2 (en) * 2012-05-04 2014-11-18 Xerox Corporation Air bearing substrate media transport

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5879733A (en) * 1981-11-06 1983-05-13 Hitachi Ltd Wafer transferring apparatus
JPH07508961A (en) * 1992-07-15 1995-10-05 ミネソタ・マイニング・アンド・マニュファクチュアリング・カンパニー Fluid transfer device for transferring goods
JP2007194508A (en) * 2006-01-20 2007-08-02 Tokyo Electron Ltd Substrate transport device, substrate transport method, and computer program
WO2007088614A1 (en) * 2006-02-01 2007-08-09 Hirata Corporation Nozzle plate and device that floats by gas flow and uses the nozzle plate
JP2008130892A (en) * 2006-11-22 2008-06-05 Shinko Electric Co Ltd Air float carrying apparatus and air carrying method
JP2008177239A (en) * 2007-01-16 2008-07-31 Tokyo Electron Ltd Substrate conveyor and vertical heat treatment apparatus
JP2010123970A (en) * 2008-11-24 2010-06-03 Sfa Engineering Corp Substrate transfer apparatus
JP2010192684A (en) * 2009-02-18 2010-09-02 Tokyo Electron Ltd Substrate transfer apparatus and substrate treatment system
JP2012119431A (en) * 2010-11-30 2012-06-21 Nitto Denko Corp Method and device for conveying semiconductor wafer

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230094970A (en) 2021-12-21 2023-06-28 미쓰보시 다이야몬도 고교 가부시키가이샤 Scribe Head and Scribe Apparatus

Also Published As

Publication number Publication date
TW201511910A (en) 2015-04-01
KR20150032456A (en) 2015-03-26
CN104446370B (en) 2018-04-10
TWI615255B (en) 2018-02-21
CN104446370A (en) 2015-03-25
JP6079529B2 (en) 2017-02-15

Similar Documents

Publication Publication Date Title
TWI665146B (en) Non-contact transferring device and non-contact suction plate
JP5265099B2 (en) Board inspection equipment
KR102252839B1 (en) Plate-shaped object carrying device and processing device
JP2013086241A (en) Chuck device and chuck method
JP2007008644A (en) Conveying device for plate-like work
JP2003063643A (en) Thin plate conveying system and apparatus
JP2008066675A (en) Substrate conveying apparatus, and substrate conveying method
KR101434169B1 (en) An apparatus for Moving and Floating the Substrate by Air Blowing Type
JP2015139968A (en) Scribe device
TWI675788B (en) Substrate suspension transport device
CN105270889A (en) Method And Apparatus For Transporting Brittle Material Substrate
JP2004244186A (en) Supporting device for transport of sheet
JP2006176255A (en) Conveying system
JP2008162783A (en) Sucking/holding device and sucking/holding method
JP2010143733A (en) Substrate handling system and substrate handling method
JP6079529B2 (en) Support mechanism and transfer device
JP5399153B2 (en) Vacuum processing apparatus, vacuum processing system and processing method
JPWO2018180651A1 (en) Method for manufacturing glass plate and apparatus for manufacturing the same
KR20130017443A (en) Substrate coating apparatus, substrate conveyance apparatus having the function for floating the surface and the method of conveying floating the substrate
JP5621410B2 (en) Work holding device
KR101261313B1 (en) Apparatus for aligning and pick up transporting of moving object
JP2013159407A (en) Carrying device
JP5888891B2 (en) Substrate transfer device
JP2015199162A (en) Non-contact conveyance apparatus
JP4882726B2 (en) Single wafer transfer method and single wafer transfer device

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20160726

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20161220

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20170102

R150 Certificate of patent or registration of utility model

Ref document number: 6079529

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

LAPS Cancellation because of no payment of annual fees