KR20080002981A - 연마 패드 - Google Patents
연마 패드 Download PDFInfo
- Publication number
- KR20080002981A KR20080002981A KR1020077026853A KR20077026853A KR20080002981A KR 20080002981 A KR20080002981 A KR 20080002981A KR 1020077026853 A KR1020077026853 A KR 1020077026853A KR 20077026853 A KR20077026853 A KR 20077026853A KR 20080002981 A KR20080002981 A KR 20080002981A
- Authority
- KR
- South Korea
- Prior art keywords
- polishing pad
- polishing
- polyurethane resin
- resin foam
- molecular weight
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 375
- 229920005749 polyurethane resin Polymers 0.000 claims abstract description 139
- 239000006260 foam Substances 0.000 claims abstract description 121
- 229920005862 polyol Polymers 0.000 claims description 106
- 150000003077 polyols Chemical class 0.000 claims description 106
- 238000000034 method Methods 0.000 claims description 92
- 239000012948 isocyanate Substances 0.000 claims description 78
- 150000002513 isocyanates Chemical class 0.000 claims description 77
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 59
- 238000006243 chemical reaction Methods 0.000 claims description 47
- -1 polytetramethylene Polymers 0.000 claims description 39
- 229920001296 polysiloxane Polymers 0.000 claims description 35
- 239000002736 nonionic surfactant Substances 0.000 claims description 34
- 238000003756 stirring Methods 0.000 claims description 34
- 239000004970 Chain extender Substances 0.000 claims description 30
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 28
- 230000005484 gravity Effects 0.000 claims description 27
- 230000002209 hydrophobic effect Effects 0.000 claims description 25
- 238000004519 manufacturing process Methods 0.000 claims description 23
- 239000004065 semiconductor Substances 0.000 claims description 21
- 150000004984 aromatic diamines Chemical group 0.000 claims description 18
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 18
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical group CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 claims description 16
- 230000008569 process Effects 0.000 claims description 15
- 239000002994 raw material Substances 0.000 claims description 11
- AOFIWCXMXPVSAZ-UHFFFAOYSA-N 4-methyl-2,6-bis(methylsulfanyl)benzene-1,3-diamine Chemical group CSC1=CC(C)=C(N)C(SC)=C1N AOFIWCXMXPVSAZ-UHFFFAOYSA-N 0.000 claims description 10
- TXDBDYPHJXUHEO-UHFFFAOYSA-N 2-methyl-4,6-bis(methylsulfanyl)benzene-1,3-diamine Chemical compound CSC1=CC(SC)=C(N)C(C)=C1N TXDBDYPHJXUHEO-UHFFFAOYSA-N 0.000 claims description 9
- 239000006185 dispersion Substances 0.000 claims description 9
- 229920000728 polyester Polymers 0.000 claims description 9
- KXBFLNPZHXDQLV-UHFFFAOYSA-N [cyclohexyl(diisocyanato)methyl]cyclohexane Chemical group C1CCCCC1C(N=C=O)(N=C=O)C1CCCCC1 KXBFLNPZHXDQLV-UHFFFAOYSA-N 0.000 claims description 7
- 229910052736 halogen Inorganic materials 0.000 claims description 3
- 150000002367 halogens Chemical class 0.000 claims description 3
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 87
- 235000012431 wafers Nutrition 0.000 description 44
- 239000000463 material Substances 0.000 description 26
- 239000000203 mixture Substances 0.000 description 23
- 239000002002 slurry Substances 0.000 description 19
- IBOFVQJTBBUKMU-UHFFFAOYSA-N 4,4'-methylene-bis-(2-chloroaniline) Chemical compound C1=C(Cl)C(N)=CC=C1CC1=CC=C(N)C(Cl)=C1 IBOFVQJTBBUKMU-UHFFFAOYSA-N 0.000 description 17
- 238000000227 grinding Methods 0.000 description 17
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 15
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 14
- 230000000052 comparative effect Effects 0.000 description 13
- 150000001875 compounds Chemical class 0.000 description 13
- 238000005187 foaming Methods 0.000 description 12
- 239000004745 nonwoven fabric Substances 0.000 description 11
- 229920002635 polyurethane Polymers 0.000 description 11
- 239000004814 polyurethane Substances 0.000 description 11
- 239000010408 film Substances 0.000 description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 9
- 239000007789 gas Substances 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 238000002156 mixing Methods 0.000 description 9
- 239000004417 polycarbonate Substances 0.000 description 9
- 229920000515 polycarbonate Polymers 0.000 description 9
- 229910052710 silicon Inorganic materials 0.000 description 9
- 239000010703 silicon Substances 0.000 description 9
- 239000000243 solution Substances 0.000 description 9
- 238000005299 abrasion Methods 0.000 description 8
- 239000003795 chemical substances by application Substances 0.000 description 8
- 230000007423 decrease Effects 0.000 description 8
- 229940058015 1,3-butylene glycol Drugs 0.000 description 7
- 239000004721 Polyphenylene oxide Substances 0.000 description 7
- 235000019437 butane-1,3-diol Nutrition 0.000 description 7
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 7
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 7
- 230000000704 physical effect Effects 0.000 description 7
- 229920000570 polyether Polymers 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- 238000005259 measurement Methods 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- 229920000768 polyamine Polymers 0.000 description 6
- 229920005906 polyester polyol Polymers 0.000 description 6
- 239000002699 waste material Substances 0.000 description 6
- 229920001971 elastomer Polymers 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 5
- 238000010030 laminating Methods 0.000 description 5
- 239000011159 matrix material Substances 0.000 description 5
- 239000000047 product Substances 0.000 description 5
- 230000009467 reduction Effects 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 4
- 239000003522 acrylic cement Substances 0.000 description 4
- 239000012790 adhesive layer Substances 0.000 description 4
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 4
- 229910003460 diamond Inorganic materials 0.000 description 4
- 239000010432 diamond Substances 0.000 description 4
- 125000005442 diisocyanate group Chemical group 0.000 description 4
- 229910021645 metal ion Inorganic materials 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 229920001610 polycaprolactone Polymers 0.000 description 4
- 239000004632 polycaprolactone Substances 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 239000005060 rubber Substances 0.000 description 4
- YPFDHNVEDLHUCE-UHFFFAOYSA-N 1,3-propanediol Substances OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 3
- 239000006061 abrasive grain Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000012295 chemical reaction liquid Substances 0.000 description 3
- 238000013329 compounding Methods 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 125000000524 functional group Chemical group 0.000 description 3
- 238000005227 gel permeation chromatography Methods 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 125000002816 methylsulfanyl group Chemical group [H]C([H])([H])S[*] 0.000 description 3
- 229920001228 polyisocyanate Polymers 0.000 description 3
- 239000005056 polyisocyanate Substances 0.000 description 3
- 229920001451 polypropylene glycol Polymers 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 2
- KMTRUDSVKNLOMY-UHFFFAOYSA-N Ethylene carbonate Chemical compound O=C1OCCO1 KMTRUDSVKNLOMY-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- 229920005830 Polyurethane Foam Polymers 0.000 description 2
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000007542 hardness measurement Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 230000014759 maintenance of location Effects 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 239000011496 polyurethane foam Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000011541 reaction mixture Substances 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 150000005846 sugar alcohols Polymers 0.000 description 2
- DNIAPMSPPWPWGF-VKHMYHEASA-N (+)-propylene glycol Chemical compound C[C@H](O)CO DNIAPMSPPWPWGF-VKHMYHEASA-N 0.000 description 1
- HOVAGTYPODGVJG-UVSYOFPXSA-N (3s,5r)-2-(hydroxymethyl)-6-methoxyoxane-3,4,5-triol Chemical compound COC1OC(CO)[C@@H](O)C(O)[C@H]1O HOVAGTYPODGVJG-UVSYOFPXSA-N 0.000 description 1
- ZTNJGMFHJYGMDR-UHFFFAOYSA-N 1,2-diisocyanatoethane Chemical compound O=C=NCCN=C=O ZTNJGMFHJYGMDR-UHFFFAOYSA-N 0.000 description 1
- RTTZISZSHSCFRH-UHFFFAOYSA-N 1,3-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC(CN=C=O)=C1 RTTZISZSHSCFRH-UHFFFAOYSA-N 0.000 description 1
- VGHSXKTVMPXHNG-UHFFFAOYSA-N 1,3-diisocyanatobenzene Chemical compound O=C=NC1=CC=CC(N=C=O)=C1 VGHSXKTVMPXHNG-UHFFFAOYSA-N 0.000 description 1
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- OHLKMGYGBHFODF-UHFFFAOYSA-N 1,4-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=C(CN=C=O)C=C1 OHLKMGYGBHFODF-UHFFFAOYSA-N 0.000 description 1
- ALQLPWJFHRMHIU-UHFFFAOYSA-N 1,4-diisocyanatobenzene Chemical compound O=C=NC1=CC=C(N=C=O)C=C1 ALQLPWJFHRMHIU-UHFFFAOYSA-N 0.000 description 1
- CDMDQYCEEKCBGR-UHFFFAOYSA-N 1,4-diisocyanatocyclohexane Chemical compound O=C=NC1CCC(N=C=O)CC1 CDMDQYCEEKCBGR-UHFFFAOYSA-N 0.000 description 1
- SBJCUZQNHOLYMD-UHFFFAOYSA-N 1,5-Naphthalene diisocyanate Chemical compound C1=CC=C2C(N=C=O)=CC=CC2=C1N=C=O SBJCUZQNHOLYMD-UHFFFAOYSA-N 0.000 description 1
- VZXPHDGHQXLXJC-UHFFFAOYSA-N 1,6-diisocyanato-5,6-dimethylheptane Chemical compound O=C=NC(C)(C)C(C)CCCCN=C=O VZXPHDGHQXLXJC-UHFFFAOYSA-N 0.000 description 1
- 229940008841 1,6-hexamethylene diisocyanate Drugs 0.000 description 1
- LFSYUSUFCBOHGU-UHFFFAOYSA-N 1-isocyanato-2-[(4-isocyanatophenyl)methyl]benzene Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=CC=C1N=C=O LFSYUSUFCBOHGU-UHFFFAOYSA-N 0.000 description 1
- VOZKAJLKRJDJLL-UHFFFAOYSA-N 2,4-diaminotoluene Chemical compound CC1=CC=C(N)C=C1N VOZKAJLKRJDJLL-UHFFFAOYSA-N 0.000 description 1
- PISLZQACAJMAIO-UHFFFAOYSA-N 2,4-diethyl-6-methylbenzene-1,3-diamine Chemical compound CCC1=CC(C)=C(N)C(CC)=C1N PISLZQACAJMAIO-UHFFFAOYSA-N 0.000 description 1
- HQCHAOKWWKLXQH-UHFFFAOYSA-N 2,6-Dichloro-para-phenylenediamine Chemical compound NC1=CC(Cl)=C(N)C(Cl)=C1 HQCHAOKWWKLXQH-UHFFFAOYSA-N 0.000 description 1
- BSYVFGQQLJNJJG-UHFFFAOYSA-N 2-[2-(2-aminophenyl)sulfanylethylsulfanyl]aniline Chemical compound NC1=CC=CC=C1SCCSC1=CC=CC=C1N BSYVFGQQLJNJJG-UHFFFAOYSA-N 0.000 description 1
- WTPYFJNYAMXZJG-UHFFFAOYSA-N 2-[4-(2-hydroxyethoxy)phenoxy]ethanol Chemical compound OCCOC1=CC=C(OCCO)C=C1 WTPYFJNYAMXZJG-UHFFFAOYSA-N 0.000 description 1
- SXFJDZNJHVPHPH-UHFFFAOYSA-N 3-methylpentane-1,5-diol Chemical compound OCCC(C)CCO SXFJDZNJHVPHPH-UHFFFAOYSA-N 0.000 description 1
- RQEOBXYYEPMCPJ-UHFFFAOYSA-N 4,6-diethyl-2-methylbenzene-1,3-diamine Chemical compound CCC1=CC(CC)=C(N)C(C)=C1N RQEOBXYYEPMCPJ-UHFFFAOYSA-N 0.000 description 1
- PPUHQXZSLCCTAN-UHFFFAOYSA-N 4-[(4-amino-2,3-dichlorophenyl)methyl]-2,3-dichloroaniline Chemical compound ClC1=C(Cl)C(N)=CC=C1CC1=CC=C(N)C(Cl)=C1Cl PPUHQXZSLCCTAN-UHFFFAOYSA-N 0.000 description 1
- QJENIOQDYXRGLF-UHFFFAOYSA-N 4-[(4-amino-3-ethyl-5-methylphenyl)methyl]-2-ethyl-6-methylaniline Chemical compound CC1=C(N)C(CC)=CC(CC=2C=C(CC)C(N)=C(C)C=2)=C1 QJENIOQDYXRGLF-UHFFFAOYSA-N 0.000 description 1
- 101100366707 Arabidopsis thaliana SSL11 gene Proteins 0.000 description 1
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 1
- FBPFZTCFMRRESA-KVTDHHQDSA-N D-Mannitol Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-KVTDHHQDSA-N 0.000 description 1
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 description 1
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- 229930195725 Mannitol Natural products 0.000 description 1
- 241001112258 Moca Species 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 101100366562 Panax ginseng SS12 gene Proteins 0.000 description 1
- YGYAWVDWMABLBF-UHFFFAOYSA-N Phosgene Chemical compound ClC(Cl)=O YGYAWVDWMABLBF-UHFFFAOYSA-N 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- CZMRCDWAGMRECN-UGDNZRGBSA-N Sucrose Chemical compound O[C@H]1[C@H](O)[C@@H](CO)O[C@@]1(CO)O[C@@H]1[C@H](O)[C@@H](O)[C@H](O)[C@@H](CO)O1 CZMRCDWAGMRECN-UGDNZRGBSA-N 0.000 description 1
- 229930006000 Sucrose Natural products 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- 206010052428 Wound Diseases 0.000 description 1
- 208000027418 Wounds and injury Diseases 0.000 description 1
- RTWAGNSZDMDWRF-UHFFFAOYSA-N [1,2,2-tris(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1(CO)CCCCC1(CO)CO RTWAGNSZDMDWRF-UHFFFAOYSA-N 0.000 description 1
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 1
- ISKQADXMHQSTHK-UHFFFAOYSA-N [4-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=C(CN)C=C1 ISKQADXMHQSTHK-UHFFFAOYSA-N 0.000 description 1
- YIMQCDZDWXUDCA-UHFFFAOYSA-N [4-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1CCC(CO)CC1 YIMQCDZDWXUDCA-UHFFFAOYSA-N 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- JKJWYKGYGWOAHT-UHFFFAOYSA-N bis(prop-2-enyl) carbonate Chemical compound C=CCOC(=O)OCC=C JKJWYKGYGWOAHT-UHFFFAOYSA-N 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- UBAZGMLMVVQSCD-UHFFFAOYSA-N carbon dioxide;molecular oxygen Chemical compound O=O.O=C=O UBAZGMLMVVQSCD-UHFFFAOYSA-N 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 150000005676 cyclic carbonates Chemical class 0.000 description 1
- HPXRVTGHNJAIIH-UHFFFAOYSA-N cyclohexanol Chemical compound OC1CCCCC1 HPXRVTGHNJAIIH-UHFFFAOYSA-N 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 150000002009 diols Chemical class 0.000 description 1
- ROORDVPLFPIABK-UHFFFAOYSA-N diphenyl carbonate Chemical compound C=1C=CC=CC=1OC(=O)OC1=CC=CC=C1 ROORDVPLFPIABK-UHFFFAOYSA-N 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 239000003480 eluent Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000007730 finishing process Methods 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- FBPFZTCFMRRESA-GUCUJZIJSA-N galactitol Chemical compound OC[C@H](O)[C@@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-GUCUJZIJSA-N 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 210000004209 hair Anatomy 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- TZMQHOJDDMFGQX-UHFFFAOYSA-N hexane-1,1,1-triol Chemical compound CCCCCC(O)(O)O TZMQHOJDDMFGQX-UHFFFAOYSA-N 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 229920003049 isoprene rubber Polymers 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 229940018564 m-phenylenediamine Drugs 0.000 description 1
- 239000000594 mannitol Substances 0.000 description 1
- 235000010355 mannitol Nutrition 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- HOVAGTYPODGVJG-UHFFFAOYSA-N methyl beta-galactoside Natural products COC1OC(CO)C(O)C(O)C1O HOVAGTYPODGVJG-UHFFFAOYSA-N 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- FSWDLYNGJBGFJH-UHFFFAOYSA-N n,n'-di-2-butyl-1,4-phenylenediamine Chemical compound CCC(C)NC1=CC=C(NC(C)CC)C=C1 FSWDLYNGJBGFJH-UHFFFAOYSA-N 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 150000002894 organic compounds Chemical group 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920006149 polyester-amide block copolymer Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001195 polyisoprene Polymers 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920000909 polytetrahydrofuran Polymers 0.000 description 1
- 229920000166 polytrimethylene carbonate Polymers 0.000 description 1
- 238000011417 postcuring Methods 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- RUOJZAUFBMNUDX-UHFFFAOYSA-N propylene carbonate Chemical compound CC1COC(=O)O1 RUOJZAUFBMNUDX-UHFFFAOYSA-N 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 125000000467 secondary amino group Chemical group [H]N([*:1])[*:2] 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000005720 sucrose Substances 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004634 thermosetting polymer Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 1
- 238000005809 transesterification reaction Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 125000003258 trimethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
- B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/08—Processes
- C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/08—Processes
- C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
- C08G18/12—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step using two or more compounds having active hydrogen in the first polymerisation step
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/42—Polycondensates having carboxylic or carbonic ester groups in the main chain
- C08G18/4236—Polycondensates having carboxylic or carbonic ester groups in the main chain containing only aliphatic groups
- C08G18/4238—Polycondensates having carboxylic or carbonic ester groups in the main chain containing only aliphatic groups derived from dicarboxylic acids and dialcohols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/48—Polyethers
- C08G18/4854—Polyethers containing oxyalkylene groups having four carbon atoms in the alkylene group
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/721—Two or more polyisocyanates not provided for in one single group C08G18/73 - C08G18/80
- C08G18/724—Combination of aromatic polyisocyanates with (cyclo)aliphatic polyisocyanates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
- C08G18/75—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic
- C08G18/758—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing two or more cycloaliphatic rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
- C08G18/76—Polyisocyanates or polyisothiocyanates cyclic aromatic
- C08G18/7614—Polyisocyanates or polyisothiocyanates cyclic aromatic containing only one aromatic ring
- C08G18/7621—Polyisocyanates or polyisothiocyanates cyclic aromatic containing only one aromatic ring being toluene diisocyanate including isomer mixtures
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/30—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof by mixing gases into liquid compositions or plastisols, e.g. frothing with air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2110/00—Foam properties
- C08G2110/0025—Foam properties rigid
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2110/00—Foam properties
- C08G2110/0041—Foam properties having specified density
- C08G2110/0066—≥ 150kg/m3
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2375/00—Characterised by the use of polyureas or polyurethanes; Derivatives of such polymers
- C08J2375/04—Polyurethanes
- C08J2375/08—Polyurethanes from polyethers
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Polyurethanes Or Polyureas (AREA)
Abstract
Description
Claims (36)
- 미세 기포를 가지는 폴리우레탄 수지 발포체로 이루어지는 연마층을 포함하는 연마 패드에 있어서, 상기 폴리우레탄 수지 발포체는, 인장 파단 연신이 25∼120%인 것을 특징으로 하는 연마 패드.
- 제1항에 있어서,상기 폴리우레탄 수지 발포체는, 고분자량 폴리올 성분과 이소시아네이트 성분을 함유하여 이루어지는 1종 또는 2종 이상의 이소시아네이트 말단 프리폴리머와 쇄연장제와의 반응 경화체이며, 또한 상기 이소시아네이트 말단 프리폴리머의 NCO 중량%(2종 이상의 경우에는, 평균 NCO 중량%)가 9.3∼15중량%인 것을 특징으로 하는 연마 패드.
- 제2항에 있어서,상기 고분자량 폴리올 성분이, 수평균 분자량 500∼850의 고분자량 폴리올 A와 수평균 분자량 900∼1500의 고분자량 폴리올 B이며, 그 함유 비율이 A/B=36/64∼99/1(중량%)인 것을 특징으로 하는 연마 패드.
- 제1항에 있어서,상기 폴리우레탄 수지 발포체는, 비중이 0.7∼0.85인 것을 특징으로 하는 연 마 패드.
- 제1항에 있어서,상기 폴리우레탄 수지 발포체는, 아스카 D 경도가 56∼70도인 것을 특징으로 하는 연마 패드.
- 제1항에 있어서,상기 폴리우레탄 수지 발포체는, 인장 강도가 15∼25MPa인 것을 특징으로 하는 연마 패드.
- 제2항에 있어서,상기 쇄연장제는, 방향족 디아민인 것을 특징으로 하는 연마 패드.
- 제7항에 있어서,상기 방향족 디아민은, 3,5-비스(메틸티오)-2,4-톨루엔디아민 및/또는 3,5-비스(메틸티오)-2,6-톨루엔디아민인 것을 특징으로 하는 연마 패드.
- 제2항에 있어서,상기 이소시아네이트 성분은, 방향족 디이소시아네이트 및 지환식 디이소시아네이트인 것을 특징으로 하는 연마 패드.
- 제9항에 있어서,상기 방향족 디이소시아네이트는 톨루엔디이소시아네이트이며, 상기 지환식 디이소시아네이트는 디시클로헥실메탄디이소시아네이트인 것을 특징으로 하는 연마 패드.
- 제1항에 있어서,상기 폴리우레탄 수지 발포체는, 수산기를 가지고 않는 실리콘계 비이온 계면활성제를 0.05중량% 이상 5중량% 미만 함유하는 것을 특징으로 하는 연마 패드.
- 미세 기포를 가지는 폴리우레탄 수지 발포체로 이루어지는 연마층을 가지는 연마 패드에 있어서, 상기 폴리우레탄 수지 발포체의 원료 성분인 고분자량 폴리올 성분이, 수평균 분자량 500∼850의 소수성 고분자량 폴리올이며, 또한 상기 폴리우레탄 수지 발포체는, 수산기를 가지지 않는 실리콘계 비이온 계면활성제를 10∼20중량% 함유하는 것을 특징으로 하는 연마 패드.
- 제12항에 있어서,상기 폴리우레탄 수지 발포체는, 상기 소수성 고분자량 폴리올과 이소시아네이트 성분을 함유하여 이루어지는 이소시아네이트 말단 프리폴리머와 쇄연장제와의 반응 경화체인 것을 특징으로 하는 연마 패드.
- 제12항에 있어서,상기 소수성 고분자량 폴리올은, 폴리에스테르폴리올인 것을 특징으로 하는 연마 패드.
- 제12항에 있어서,상기 소수성 고분자량 폴리올은, 폴리테트라메틸렌글리콜인 것을 특징으로 하는 연마 패드.
- 제13항에 있어서,상기 이소시아네이트 성분는, 방향족 디이소시아네이트 및 지환식 디이소시아네이트인 것을 특징으로 하는 연마 패드.
- 제16항에 있어서,상기 방향족 디이소시아네이트는 톨루엔디이소시아네이트이며, 지환식 디이소시아네이트는 디시클로헥실메탄디이소시아네이트인 것을 특징으로 하는 연마 패드.
- 제13항에 있어서,상기 쇄연장제는, 방향족 디아민인 것을 특징으로 하는 연마 패드.
- 제18항에 있어서,상기 방향족 디아민은, 비할로겐계 방향족 디아민인 것을 특징으로 하는 연마 패드.
- 제12항에 있어서,상기 폴리우레탄 수지 발포체는, 비중이 0.65∼0.86인 것을 특징으로 하는 연마 패드.
- 제12항에 있어서,상기 폴리우레탄 수지 발포체는, 아스카 D 경도가 50∼65도인 것을 특징으로 하는 연마 패드.
- 제12항에 있어서,상기 폴리우레탄 수지 발포체는, 인장 강도가 15∼25MPa인 것을 특징으로 하는 연마 패드.
- 제12항에 있어서,상기 폴리우레탄 수지 발포체는, 인장 파단 연신이 25∼100%인 것을 특징으로 하는 연마 패드.
- 이소시아네이트 말단 프리폴리머를 포함하는 제1 성분과 쇄연장제를 포함하는 제2 성분을 혼합하고, 경화하여 폴리우레탄 수지 발포체를 제조하는 공정(1)을 포함하는 연마 패드의 제조 방법에 있어서,상기 공정(1)은, 상기 이소시아네이트 말단 프리폴리머를 포함하는 제1 성분에 수산기를 가지지 않는 실리콘계 비이온 계면활성제를 폴리우레탄 수지 발포체 중에 10∼20중량% 첨가하고, 또한 상기 제1 성분을 비반응성 기체와 교반하여 상기 비반응성 기체를 미세 기포로서 분산시킨 기포 분산액을 조제한 후, 상기 기포 분산액에 상기 쇄연장제를 포함하는 제2 성분을 혼합하고, 경화하여 폴리우레탄 수지 발포체를 제조하는 공정이며, 상기 이소시아네이트 말단 프리폴리머의 원료 성분인 고분자량 폴리올 성분은, 수평균 분자량 500∼850의 소수성 고분자량 폴리올인 것을 특징으로 하는 연마 패드의 제조 방법.
- 제24항의 방법에 따라 제조되는 연마 패드.
- 미세 기포를 가지는 폴리우레탄 수지 발포체로 이루어지고, 연마 표면에 요철 구조를 가지는 연마층을 포함하는 연마 패드에 있어서, 상기 폴리우레탄 수지 발포체는, 아스카 D 경도가 45∼55도, 비중이 0.8∼0.86, 및 인장 파단 연신이 120∼150%인 것을 특징으로 하는 연마 패드.
- 제26항에 있어서,상기 폴리우레탄 수지 발포체는, 고분자량 폴리올 성분과 이소시아네이트 성분을 함유하여 이루어지는 1종 또는 2종 이상의 이소시아네이트 말단 프리폴리머와 쇄연장제와의 반응 경화체이며, 또한 상기 이소시아네이트 말단 프리폴리머의 NCO 중량%(2종 이상의 경우에는, 평균 NCO 중량%)는 9.3∼10.5중량%인 것을 특징으로 하는 연마 패드.
- 제27항에 있어서,상기 고분자량 폴리올 성분은, 수평균 분자량 500∼850의 고분자량 폴리올 A와 수평균 분자량 900∼1500의 고분자량 폴리올 B이며, 그 함유 비율이 A/B=5/95∼35/65(중량%)인 것을 특징으로 하는 연마 패드.
- 제26항에 있어서,상기 폴리우레탄 수지 발포체는, 인장 강도가 15∼25MPa인 것을 특징으로 하는 연마 패드.
- 제27항에 있어서,상기 쇄연장제는, 방향족 디아민인 것을 특징으로 하는 연마 패드.
- 제30항에 있어서,상기 방향족 디아민은, 3,5-비스(메틸티오)-2,4-톨루엔디아민 및/또는 3,5-비스(메틸티오)-2,6-톨루엔디아민인 것을 특징으로 하는 연마 패드.
- 제27항에 있어서,상기 이소시아네이트 성분은, 방향족 디이소시아네이트 및 지환식 디이소시아네이트인 것을 특징으로 하는 연마 패드.
- 제32항에 있어서,상기 방향족 디이소시아네이트는 톨루엔디이소시아네이트이며, 지환식 디이소시아네이트는 디시클로헥실메탄디이소시아네이트인 것을 특징으로 하는 연마 패드.
- 제26항에 있어서,상기 폴리우레탄 수지 발포체는, 수산기를 가지지 않는 실리콘계 비이온 계면활성제를 O.05 ∼10중량% 함유하는 것을 특징으로 하는 연마 패드.
- 제26항에 있어서,드레싱 속도가 5∼10μm/min인 것을 특징으로 하는 연마 패드.
- 제1항, 제12항 및 제26항 중 어느 한 항에 따른 연마 패드를 사용하여 반도 체 웨이퍼의 표면을 연마하는 공정를 포함하는 반도체 디바이스의 제조 방법.
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005144304A JP4979200B2 (ja) | 2005-05-17 | 2005-05-17 | 研磨パッド |
JP2005144292A JP4897238B2 (ja) | 2005-05-17 | 2005-05-17 | 研磨パッド |
JPJP-P-2005-00144318 | 2005-05-17 | ||
JPJP-P-2005-00144304 | 2005-05-17 | ||
JPJP-P-2005-00144292 | 2005-05-17 | ||
JP2005144318A JP2006320982A (ja) | 2005-05-17 | 2005-05-17 | 研磨パッド |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020097013449A Division KR101134432B1 (ko) | 2005-05-17 | 2006-05-10 | 연마 패드 |
KR1020097013450A Division KR101134058B1 (ko) | 2005-05-17 | 2006-05-10 | 연마 패드 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20080002981A true KR20080002981A (ko) | 2008-01-04 |
KR100949560B1 KR100949560B1 (ko) | 2010-03-25 |
Family
ID=37431136
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020097013449A KR101134432B1 (ko) | 2005-05-17 | 2006-05-10 | 연마 패드 |
KR1020077026853A KR100949560B1 (ko) | 2005-05-17 | 2006-05-10 | 연마 패드 |
KR1020097013450A KR101134058B1 (ko) | 2005-05-17 | 2006-05-10 | 연마 패드 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020097013449A KR101134432B1 (ko) | 2005-05-17 | 2006-05-10 | 연마 패드 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020097013450A KR101134058B1 (ko) | 2005-05-17 | 2006-05-10 | 연마 패드 |
Country Status (5)
Country | Link |
---|---|
US (3) | US8304467B2 (ko) |
KR (3) | KR101134432B1 (ko) |
MY (1) | MY146929A (ko) |
TW (1) | TW200709891A (ko) |
WO (1) | WO2006123559A1 (ko) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20140051438A (ko) * | 2011-12-16 | 2014-04-30 | 도요 고무 고교 가부시키가이샤 | 연마 패드 |
US10414025B2 (en) | 2015-08-11 | 2019-09-17 | Hubei Dinglong Co., Ltd. | Weather-resistant polishing pad |
Families Citing this family (61)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006095591A1 (ja) * | 2005-03-08 | 2006-09-14 | Toyo Tire & Rubber Co., Ltd. | 研磨パッド及びその製造方法 |
KR101134432B1 (ko) * | 2005-05-17 | 2012-04-10 | 도요 고무 고교 가부시키가이샤 | 연마 패드 |
JP4884725B2 (ja) * | 2005-08-30 | 2012-02-29 | 東洋ゴム工業株式会社 | 研磨パッド |
JP5031236B2 (ja) * | 2006-01-10 | 2012-09-19 | 東洋ゴム工業株式会社 | 研磨パッド |
US8993648B2 (en) * | 2006-08-28 | 2015-03-31 | Toyo Tire & Rubber Co., Ltd. | Polishing pad |
JP5008927B2 (ja) | 2006-08-31 | 2012-08-22 | 東洋ゴム工業株式会社 | 研磨パッド |
JP5078000B2 (ja) | 2007-03-28 | 2012-11-21 | 東洋ゴム工業株式会社 | 研磨パッド |
US20090062414A1 (en) * | 2007-08-28 | 2009-03-05 | David Picheng Huang | System and method for producing damping polyurethane CMP pads |
US8052507B2 (en) * | 2007-11-20 | 2011-11-08 | Praxair Technology, Inc. | Damping polyurethane CMP pads with microfillers |
JP2012528487A (ja) * | 2009-05-27 | 2012-11-12 | ロジャーズ コーポレーション | 研磨パッド、それを用いた組成物および、その製造と使用方法 |
US20110028074A1 (en) * | 2009-08-03 | 2011-02-03 | Canon Kabushiki Kaisha | Polishing method for a workpiece and polishing tool used for the polishing method |
US8551201B2 (en) * | 2009-08-07 | 2013-10-08 | Praxair S.T. Technology, Inc. | Polyurethane composition for CMP pads and method of manufacturing same |
JP5634903B2 (ja) * | 2010-02-25 | 2014-12-03 | 東洋ゴム工業株式会社 | 研磨パッド |
JP5350309B2 (ja) * | 2010-03-31 | 2013-11-27 | 東洋ゴム工業株式会社 | 研磨パッドおよびその製造方法、ならびに半導体デバイスの製造方法 |
US9156124B2 (en) * | 2010-07-08 | 2015-10-13 | Nexplanar Corporation | Soft polishing pad for polishing a semiconductor substrate |
US20130017762A1 (en) * | 2011-07-15 | 2013-01-17 | Infineon Technologies Ag | Method and Apparatus for Determining a Measure of a Thickness of a Polishing Pad of a Polishing Machine |
US9421666B2 (en) | 2013-11-04 | 2016-08-23 | Applied Materials, Inc. | Printed chemical mechanical polishing pad having abrasives therein |
US9993907B2 (en) | 2013-12-20 | 2018-06-12 | Applied Materials, Inc. | Printed chemical mechanical polishing pad having printed window |
US9873180B2 (en) | 2014-10-17 | 2018-01-23 | Applied Materials, Inc. | CMP pad construction with composite material properties using additive manufacturing processes |
US10875153B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Advanced polishing pad materials and formulations |
US10399201B2 (en) | 2014-10-17 | 2019-09-03 | Applied Materials, Inc. | Advanced polishing pads having compositional gradients by use of an additive manufacturing process |
US10875145B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
KR102295988B1 (ko) | 2014-10-17 | 2021-09-01 | 어플라이드 머티어리얼스, 인코포레이티드 | 애디티브 제조 프로세스들을 이용한 복합 재료 특성들을 갖는 cmp 패드 구성 |
US10821573B2 (en) | 2014-10-17 | 2020-11-03 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
US11745302B2 (en) | 2014-10-17 | 2023-09-05 | Applied Materials, Inc. | Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process |
US9776361B2 (en) | 2014-10-17 | 2017-10-03 | Applied Materials, Inc. | Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles |
WO2017074773A1 (en) | 2015-10-30 | 2017-05-04 | Applied Materials, Inc. | An apparatus and method of forming a polishing article that has a desired zeta potential |
US10593574B2 (en) | 2015-11-06 | 2020-03-17 | Applied Materials, Inc. | Techniques for combining CMP process tracking data with 3D printed CMP consumables |
US10391605B2 (en) | 2016-01-19 | 2019-08-27 | Applied Materials, Inc. | Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process |
CN117283450A (zh) | 2016-01-19 | 2023-12-26 | 应用材料公司 | 多孔化学机械抛光垫 |
KR101853021B1 (ko) * | 2017-01-12 | 2018-04-30 | 에스케이씨 주식회사 | 다공성 폴리우레탄 연마패드 및 이의 제조방법 |
KR101835087B1 (ko) * | 2017-05-29 | 2018-03-06 | 에스케이씨 주식회사 | 다공성 폴리우레탄 연마패드 및 이를 사용하여 반도체 소자를 제조하는 방법 |
KR101835090B1 (ko) * | 2017-05-29 | 2018-03-06 | 에스케이씨 주식회사 | 다공성 폴리우레탄 연마패드 및 이를 사용하여 반도체 소자를 제조하는 방법 |
US11471999B2 (en) | 2017-07-26 | 2022-10-18 | Applied Materials, Inc. | Integrated abrasive polishing pads and manufacturing methods |
US11072050B2 (en) | 2017-08-04 | 2021-07-27 | Applied Materials, Inc. | Polishing pad with window and manufacturing methods thereof |
WO2019032286A1 (en) | 2017-08-07 | 2019-02-14 | Applied Materials, Inc. | ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME |
WO2019050365A1 (ko) * | 2017-09-11 | 2019-03-14 | 에스케이씨 주식회사 | 다공성 폴리우레탄 연마패드 및 이의 제조방법 |
KR102058877B1 (ko) * | 2018-04-20 | 2019-12-24 | 에스케이씨 주식회사 | 다공성 폴리우레탄 연마패드 및 이의 제조방법 |
SG11202010448TA (en) | 2018-05-07 | 2020-11-27 | Applied Materials Inc | Hydrophilic and zeta potential tunable chemical mechanical polishing pads |
WO2020050932A1 (en) | 2018-09-04 | 2020-03-12 | Applied Materials, Inc. | Formulations for advanced polishing pads |
CN109596446B (zh) * | 2018-11-13 | 2021-06-18 | 江苏大学 | 一种检测产品耐磨性能的测量装置 |
KR102202076B1 (ko) * | 2018-12-26 | 2021-01-12 | 에스케이씨 주식회사 | 연마패드용 조성물, 연마패드 및 이의 제조방법 |
KR102283399B1 (ko) * | 2018-12-26 | 2021-07-30 | 에스케이씨솔믹스 주식회사 | 연마패드용 조성물, 연마패드 및 이의 제조방법 |
TWI735101B (zh) * | 2018-12-26 | 2021-08-01 | 南韓商Skc索密思股份有限公司 | 用於研磨墊之組成物、研磨墊及用於製備其之方法 |
US11071860B2 (en) | 2019-02-06 | 2021-07-27 | Oncosec Medical Incorporated | Systems and methods for detecting fault conditions in electroporation therapy |
US11851570B2 (en) | 2019-04-12 | 2023-12-26 | Applied Materials, Inc. | Anionic polishing pads formed by printing processes |
KR102237357B1 (ko) * | 2019-06-17 | 2021-04-07 | 에스케이씨솔믹스 주식회사 | 연마패드용 조성물, 연마패드 및 반도체 소자의 제조방법 |
KR102237367B1 (ko) * | 2019-06-17 | 2021-04-07 | 에스케이씨솔믹스 주식회사 | 연마패드용 조성물, 연마패드 및 반도체 소자의 제조방법 |
US11207757B2 (en) * | 2019-06-17 | 2021-12-28 | Skc Solmics Co., Ltd. | Composition for polishing pad, polishing pad and preparation method of semiconductor device |
KR102237351B1 (ko) * | 2019-06-17 | 2021-04-07 | 에스케이씨솔믹스 주식회사 | 연마패드용 조성물, 연마패드 및 반도체 소자의 제조방법 |
KR102237362B1 (ko) * | 2019-06-17 | 2021-04-07 | 에스케이씨솔믹스 주식회사 | 연마패드용 조성물, 연마패드 및 반도체 소자의 제조방법 |
JP2022541138A (ja) * | 2019-07-12 | 2022-09-22 | シーエムシー マテリアルズ,インコーポレイティド | ポリアミンおよびシクロヘキサンジメタノール硬化剤を使用した研磨パッド |
CN110528287B (zh) * | 2019-08-08 | 2022-03-08 | 安徽安利材料科技股份有限公司 | 一种毛刷式高耐用化学机械抛光聚氨酯材料及其制备方法 |
US11813712B2 (en) | 2019-12-20 | 2023-11-14 | Applied Materials, Inc. | Polishing pads having selectively arranged porosity |
CN113896856B (zh) * | 2020-06-19 | 2023-05-12 | 中国科学院微电子研究所 | 一种抛光垫材料及抛光垫 |
US11806829B2 (en) | 2020-06-19 | 2023-11-07 | Applied Materials, Inc. | Advanced polishing pads and related polishing pad manufacturing methods |
US11878389B2 (en) | 2021-02-10 | 2024-01-23 | Applied Materials, Inc. | Structures formed using an additive manufacturing process for regenerating surface texture in situ |
CN113956421A (zh) * | 2021-11-16 | 2022-01-21 | 上海映智研磨材料有限公司 | 聚氨酯抛光垫材料及其制备方法和应用 |
KR20230153739A (ko) | 2022-04-29 | 2023-11-07 | 케이피엑스케미칼 주식회사 | 개선된 연마속도를 제공하는 연마패드 및 이의 제조방법 |
KR20240026409A (ko) | 2022-08-19 | 2024-02-28 | 케이피엑스케미칼 주식회사 | 연마패드, 이의 제조방법, 및 연마패드의 연마성능 추정방법 |
WO2024050141A2 (en) * | 2022-09-03 | 2024-03-07 | Rajeev Bajaj | Multilayer cmp pads |
Family Cites Families (84)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE618837A (ko) | 1961-06-12 | |||
US4410668A (en) * | 1982-01-29 | 1983-10-18 | Ppg Industries, Inc. | Elastomeric coating compositions |
JPH0291279A (ja) | 1988-09-29 | 1990-03-30 | Achilles Corp | 合成皮革及びその製造方法 |
JP3137260B2 (ja) | 1989-06-12 | 2001-02-19 | 凸版印刷株式会社 | ラジアルラインスロットアンテナ |
WO1993002856A1 (en) * | 1991-08-07 | 1993-02-18 | Ppg Industries, Inc. | Impregnated fiber bundles having independently crosslinkable polyurethane |
GB9216631D0 (en) * | 1992-08-05 | 1992-09-16 | Ici Plc | Reaction system for preparing microcellular elastomers |
MY114512A (en) * | 1992-08-19 | 2002-11-30 | Rodel Inc | Polymeric substrate with polymeric microelements |
JPH06220151A (ja) | 1993-01-22 | 1994-08-09 | Sanyo Chem Ind Ltd | 研磨材用ポリウレタン樹脂 |
JPH0871378A (ja) | 1994-09-09 | 1996-03-19 | Kanegafuchi Chem Ind Co Ltd | 中空糸膜ポッティング用ウレタン樹脂 |
US5670599A (en) * | 1995-03-08 | 1997-09-23 | Air Products And Chemicals, Inc. | Ultra low voc polyurethane coatings |
US5614575A (en) * | 1995-04-24 | 1997-03-25 | Rpg. Inc. | Sprayable polyurethane compositions |
US5587502A (en) * | 1995-06-02 | 1996-12-24 | Minnesota Mining & Manufacturing Company | Hydroxy functional alkoxysilane and alkoxysilane functional polyurethane made therefrom |
JP2001518852A (ja) | 1997-04-04 | 2001-10-16 | ローデル ホールディングス インコーポレイテッド | 改良研磨パッド及びこれに関連する方法 |
JP2001513450A (ja) | 1997-08-06 | 2001-09-04 | ローデル ホールディングス インコーポレイテッド | 改良研磨パッド及びこれに関連する方法 |
JP2000017252A (ja) | 1998-06-29 | 2000-01-18 | Dainippon Ink & Chem Inc | 研磨材組成物及びその研磨材 |
JP3516874B2 (ja) | 1998-12-15 | 2004-04-05 | 東洋ゴム工業株式会社 | ポリウレタン発泡体の製造方法及び研磨シート |
JP2002535843A (ja) | 1999-01-21 | 2002-10-22 | ロデール ホールディングス インコーポレイテッド | 改良された研磨パッド、及び、これに関連する方法 |
JP2000248034A (ja) | 1999-03-02 | 2000-09-12 | Mitsubishi Chemicals Corp | 研磨材用ポリウレタン系樹脂組成物及びその発泡体 |
JP3316756B2 (ja) | 1999-06-04 | 2002-08-19 | 富士紡績株式会社 | 研磨パッド用ウレタン成形物の製造方法及び研磨パッド用ウレタン成形物 |
JP3880028B2 (ja) | 1999-08-06 | 2007-02-14 | Jsr株式会社 | 研磨パッド用重合体組成物及びそれを用いた研磨パッド |
JP3558273B2 (ja) | 1999-09-22 | 2004-08-25 | 東洋ゴム工業株式会社 | ポリウレタン発泡体の製造方法及び研磨シート |
JP4296655B2 (ja) | 1999-10-12 | 2009-07-15 | 東レ株式会社 | 半導体基板用研磨パッド |
JP2001277101A (ja) | 2000-03-28 | 2001-10-09 | Rodel Nitta Co | 研磨布 |
AU2001262716A1 (en) * | 2000-06-13 | 2001-12-24 | Toyo Boseki Kabushiki Kaisha | Process for producing polyurethane foam, polyurethane foam, and abrasive sheet |
JP2003011066A (ja) | 2000-07-25 | 2003-01-15 | Ebara Corp | 研磨工具及びその製造方法 |
US20020016139A1 (en) | 2000-07-25 | 2002-02-07 | Kazuto Hirokawa | Polishing tool and manufacturing method therefor |
JP2002059358A (ja) | 2000-08-24 | 2002-02-26 | Toray Ind Inc | 研磨用パッドおよびそれを用いた研磨装置ならびに研磨方法 |
US6477926B1 (en) * | 2000-09-15 | 2002-11-12 | Ppg Industries Ohio, Inc. | Polishing pad |
US6641471B1 (en) * | 2000-09-19 | 2003-11-04 | Rodel Holdings, Inc | Polishing pad having an advantageous micro-texture and methods relating thereto |
US6679769B2 (en) | 2000-09-19 | 2004-01-20 | Rodel Holdings, Inc | Polishing pad having an advantageous micro-texture and methods relating thereto |
JP3826702B2 (ja) | 2000-10-24 | 2006-09-27 | Jsr株式会社 | 研磨パッド用組成物及びこれを用いた研磨パッド |
US6706383B1 (en) * | 2001-11-27 | 2004-03-16 | Psiloquest, Inc. | Polishing pad support that improves polishing performance and longevity |
CN1217981C (zh) | 2000-12-08 | 2005-09-07 | 可乐丽股份有限公司 | 热塑性聚氨酯泡沫体、其制造方法和由该泡沫体制成的研磨垫料 |
EP1353969A2 (en) * | 2001-01-24 | 2003-10-22 | Huntsman International Llc | Molded foam articles prepared with reduced mold residence time and improved quality |
JP3455187B2 (ja) | 2001-02-01 | 2003-10-14 | 東洋ゴム工業株式会社 | 研磨パッド用ポリウレタン発泡体の製造装置 |
JP2002239905A (ja) | 2001-02-21 | 2002-08-28 | Allied Material Corp | Cmp用パッドコンディショナー及びその製造方法 |
WO2002083757A1 (fr) * | 2001-04-09 | 2002-10-24 | Toyo Boseki Kabushiki Kaisha | Composition de polyurethanne et tampon a polir |
JP3359629B1 (ja) | 2001-04-09 | 2002-12-24 | 東洋紡績株式会社 | ポリウレタン組成物からなる研磨パッド |
JP2003062748A (ja) | 2001-08-24 | 2003-03-05 | Inoac Corp | 研磨用パッド |
JP2003089051A (ja) | 2001-09-17 | 2003-03-25 | Tokyo Seimitsu Co Ltd | 研磨装置 |
JP3851135B2 (ja) | 2001-10-17 | 2006-11-29 | ニッタ・ハース株式会社 | 研磨パッド |
JP3325562B1 (ja) | 2001-12-07 | 2002-09-17 | 東洋ゴム工業株式会社 | 発泡ポリウレタン研磨パッドの製造方法 |
JP3455208B2 (ja) | 2001-11-13 | 2003-10-14 | 東洋紡績株式会社 | 半導体ウエハ研磨パッド、半導体ウエハの研磨方法、研磨パッド用研磨シート、及び研磨シート用発泡体ブロック |
KR100877388B1 (ko) | 2001-11-13 | 2009-01-07 | 도요 고무 고교 가부시키가이샤 | 연마 패드 및 그 제조 방법 |
JP2003145414A (ja) | 2001-11-13 | 2003-05-20 | Toyobo Co Ltd | 研磨パッド及びその製造方法 |
JP3494641B1 (ja) | 2001-12-12 | 2004-02-09 | 東洋紡績株式会社 | 半導体ウエハ研磨用研磨パッド |
JP2003224094A (ja) | 2002-01-29 | 2003-08-08 | Ebara Corp | 研磨工具 |
US6866565B2 (en) * | 2002-01-29 | 2005-03-15 | Ebara Corporation | Polishing tool and polishing apparatus |
KR100467765B1 (ko) * | 2002-02-04 | 2005-01-24 | 에스케이씨 주식회사 | 고경도 및 우수한 내마모성을 갖는 폴리우레탄 탄성체제조용 조성물 |
JP3571334B2 (ja) | 2002-05-20 | 2004-09-29 | 東洋紡績株式会社 | 研磨パッド |
JP2004167680A (ja) | 2002-05-20 | 2004-06-17 | Toyobo Co Ltd | 研磨パッド |
US6824854B2 (en) | 2002-07-29 | 2004-11-30 | E. I. Du Pont De Nemours And Company | Carpets treated for soil resistance |
JP4101584B2 (ja) | 2002-08-09 | 2008-06-18 | 東洋ゴム工業株式会社 | 研磨シート用ポリウレタン発泡体及びその製造方法、研磨パッド用研磨シート、並びに研磨パッド |
WO2004028745A1 (en) | 2002-09-25 | 2004-04-08 | Ppg Industries Ohio, Inc. | Polishing pad for planarization |
US7094811B2 (en) * | 2002-10-03 | 2006-08-22 | Bayer Corporation | Energy absorbing flexible foams produced in part with a double metal cyanide catalyzed polyol |
US8845852B2 (en) * | 2002-11-27 | 2014-09-30 | Toyo Tire & Rubber Co., Ltd. | Polishing pad and method of producing semiconductor device |
JP4078643B2 (ja) | 2002-12-10 | 2008-04-23 | 東洋ゴム工業株式会社 | 研磨パッドの製造方法、研磨パッド、及び半導体デバイスの製造方法 |
JP4233319B2 (ja) | 2002-12-12 | 2009-03-04 | 東洋ゴム工業株式会社 | 研磨パッドの製造方法及び研磨パッド |
TWI313693B (en) | 2002-12-17 | 2009-08-21 | Dainippon Ink & Chemicals | Two-component curable polyol composition for foamed grindstone, two-component curable composition for foamed grindstone, foamed grindstone, and method for producing foamed grindstone |
JP2004235446A (ja) | 2003-01-30 | 2004-08-19 | Toyobo Co Ltd | 研磨パッド |
JP4324785B2 (ja) | 2003-04-15 | 2009-09-02 | Jsr株式会社 | 研磨パッドの製造方法 |
US20040224622A1 (en) * | 2003-04-15 | 2004-11-11 | Jsr Corporation | Polishing pad and production method thereof |
JP2005052907A (ja) * | 2003-08-07 | 2005-03-03 | Diatex Co Ltd | 研磨パッド用下地材 |
JP4189963B2 (ja) | 2003-08-21 | 2008-12-03 | 東洋ゴム工業株式会社 | 研磨パッド |
JP4189962B2 (ja) | 2003-08-21 | 2008-12-03 | 東洋ゴム工業株式会社 | 研磨パッドの製造方法 |
JP4265366B2 (ja) | 2003-10-17 | 2009-05-20 | 日本ポリウレタン工業株式会社 | 軟質ポリウレタンフォームの製造方法 |
US20050171224A1 (en) * | 2004-02-03 | 2005-08-04 | Kulp Mary J. | Polyurethane polishing pad |
TWI450911B (zh) * | 2004-03-11 | 2014-09-01 | Toyo Tire & Rubber Co | Production method of polishing pad and semiconductor device (1) |
JP4627149B2 (ja) | 2004-05-10 | 2011-02-09 | 東洋ゴム工業株式会社 | 研磨パッド及び半導体デバイスの製造方法 |
US7018581B2 (en) | 2004-06-10 | 2006-03-28 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method of forming a polishing pad with reduced stress window |
EP1647588A3 (en) * | 2004-10-13 | 2006-11-02 | Rohm and Haas Company | Surface promoted Michael Cure Compositions |
US20060089095A1 (en) * | 2004-10-27 | 2006-04-27 | Swisher Robert G | Polyurethane urea polishing pad |
CN102554766B (zh) * | 2004-12-10 | 2014-11-05 | 东洋橡胶工业株式会社 | 研磨垫及研磨垫的制造方法 |
JP2006190826A (ja) | 2005-01-06 | 2006-07-20 | Toyo Tire & Rubber Co Ltd | 研磨パッド及び半導体デバイスの製造方法 |
JP2006231429A (ja) | 2005-02-22 | 2006-09-07 | Inoac Corp | 研磨パッドおよびその製造方法 |
WO2006095591A1 (ja) | 2005-03-08 | 2006-09-14 | Toyo Tire & Rubber Co., Ltd. | 研磨パッド及びその製造方法 |
KR101134432B1 (ko) | 2005-05-17 | 2012-04-10 | 도요 고무 고교 가부시키가이샤 | 연마 패드 |
JP4884725B2 (ja) * | 2005-08-30 | 2012-02-29 | 東洋ゴム工業株式会社 | 研磨パッド |
JP4884726B2 (ja) * | 2005-08-30 | 2012-02-29 | 東洋ゴム工業株式会社 | 積層研磨パッドの製造方法 |
TWI403387B (zh) * | 2005-09-22 | 2013-08-01 | Kuraray Co | 高分子材料、由它得到之發泡體及使用它之研磨墊 |
JP5031236B2 (ja) * | 2006-01-10 | 2012-09-19 | 東洋ゴム工業株式会社 | 研磨パッド |
US8993648B2 (en) * | 2006-08-28 | 2015-03-31 | Toyo Tire & Rubber Co., Ltd. | Polishing pad |
JP5008927B2 (ja) * | 2006-08-31 | 2012-08-22 | 東洋ゴム工業株式会社 | 研磨パッド |
JP5078000B2 (ja) * | 2007-03-28 | 2012-11-21 | 東洋ゴム工業株式会社 | 研磨パッド |
-
2006
- 2006-05-10 KR KR1020097013449A patent/KR101134432B1/ko active IP Right Grant
- 2006-05-10 WO PCT/JP2006/309380 patent/WO2006123559A1/ja active Application Filing
- 2006-05-10 KR KR1020077026853A patent/KR100949560B1/ko active IP Right Grant
- 2006-05-10 US US11/914,547 patent/US8304467B2/en not_active Expired - Fee Related
- 2006-05-10 KR KR1020097013450A patent/KR101134058B1/ko active IP Right Grant
- 2006-05-12 TW TW095116870A patent/TW200709891A/zh not_active IP Right Cessation
- 2006-05-16 MY MYPI20062241A patent/MY146929A/en unknown
-
2011
- 2011-05-13 US US13/107,347 patent/US8530535B2/en not_active Expired - Fee Related
-
2012
- 2012-09-07 US US13/607,125 patent/US8779020B2/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20140051438A (ko) * | 2011-12-16 | 2014-04-30 | 도요 고무 고교 가부시키가이샤 | 연마 패드 |
US10414025B2 (en) | 2015-08-11 | 2019-09-17 | Hubei Dinglong Co., Ltd. | Weather-resistant polishing pad |
Also Published As
Publication number | Publication date |
---|---|
US20110218263A1 (en) | 2011-09-08 |
US8779020B2 (en) | 2014-07-15 |
US20130005228A1 (en) | 2013-01-03 |
MY146929A (en) | 2012-10-15 |
TW200709891A (en) | 2007-03-16 |
TWI295948B (ko) | 2008-04-21 |
KR101134058B1 (ko) | 2012-04-16 |
US8304467B2 (en) | 2012-11-06 |
US8530535B2 (en) | 2013-09-10 |
KR20090078845A (ko) | 2009-07-20 |
WO2006123559A1 (ja) | 2006-11-23 |
KR100949560B1 (ko) | 2010-03-25 |
KR20090078846A (ko) | 2009-07-20 |
US20090093201A1 (en) | 2009-04-09 |
KR101134432B1 (ko) | 2012-04-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100949560B1 (ko) | 연마 패드 | |
KR100949561B1 (ko) | 연마 패드 | |
KR100909605B1 (ko) | 연마 패드 및 그 제조 방법 | |
KR101107043B1 (ko) | 연마 패드 | |
JP4897238B2 (ja) | 研磨パッド | |
JP4884726B2 (ja) | 積層研磨パッドの製造方法 | |
JP5031236B2 (ja) | 研磨パッド | |
KR101084502B1 (ko) | 연마 패드 | |
KR20090123852A (ko) | 연마 패드 | |
JP4786347B2 (ja) | 研磨パッド | |
KR20140039080A (ko) | 연마 패드 | |
KR20120082445A (ko) | 연마 패드 | |
JP4859110B2 (ja) | 研磨パッド | |
JP5013447B2 (ja) | 研磨パッド及びその製造方法 | |
JP5506008B2 (ja) | 研磨パッド | |
JP2006320982A (ja) | 研磨パッド | |
JP4986274B2 (ja) | 研磨パッド及びその製造方法 | |
JP2017113856A (ja) | 研磨パッド及びその製造方法 | |
JP4979200B2 (ja) | 研磨パッド | |
JP5105461B2 (ja) | 研磨パッド | |
JP2017113857A (ja) | 研磨パッド |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
A107 | Divisional application of patent | ||
AMND | Amendment | ||
E601 | Decision to refuse application | ||
J201 | Request for trial against refusal decision | ||
AMND | Amendment | ||
B701 | Decision to grant | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20130227 Year of fee payment: 4 |
|
FPAY | Annual fee payment |
Payment date: 20140220 Year of fee payment: 5 |
|
FPAY | Annual fee payment |
Payment date: 20150224 Year of fee payment: 6 |
|
FPAY | Annual fee payment |
Payment date: 20160218 Year of fee payment: 7 |
|
FPAY | Annual fee payment |
Payment date: 20170220 Year of fee payment: 8 |
|
FPAY | Annual fee payment |
Payment date: 20180219 Year of fee payment: 9 |
|
FPAY | Annual fee payment |
Payment date: 20200218 Year of fee payment: 11 |