TW200709891A - Polishing pad - Google Patents

Polishing pad

Info

Publication number
TW200709891A
TW200709891A TW095116870A TW95116870A TW200709891A TW 200709891 A TW200709891 A TW 200709891A TW 095116870 A TW095116870 A TW 095116870A TW 95116870 A TW95116870 A TW 95116870A TW 200709891 A TW200709891 A TW 200709891A
Authority
TW
Taiwan
Prior art keywords
polishing
polishing pad
polyurethane resin
resin foam
pad
Prior art date
Application number
TW095116870A
Other languages
English (en)
Other versions
TWI295948B (zh
Inventor
Atsushi Kazuno
Kazuyuki Ogawa
Masahiko Nakamori
Takatoshi Yamada
Tetsuo Shimomura
Original Assignee
Toyo Tire & Rubber Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2005144304A external-priority patent/JP4979200B2/ja
Priority claimed from JP2005144292A external-priority patent/JP4897238B2/ja
Priority claimed from JP2005144318A external-priority patent/JP2006320982A/ja
Application filed by Toyo Tire & Rubber Co filed Critical Toyo Tire & Rubber Co
Publication of TW200709891A publication Critical patent/TW200709891A/zh
Application granted granted Critical
Publication of TWI295948B publication Critical patent/TWI295948B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
    • C08G18/12—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step using two or more compounds having active hydrogen in the first polymerisation step
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/42—Polycondensates having carboxylic or carbonic ester groups in the main chain
    • C08G18/4236—Polycondensates having carboxylic or carbonic ester groups in the main chain containing only aliphatic groups
    • C08G18/4238—Polycondensates having carboxylic or carbonic ester groups in the main chain containing only aliphatic groups derived from dicarboxylic acids and dialcohols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/48—Polyethers
    • C08G18/4854—Polyethers containing oxyalkylene groups having four carbon atoms in the alkylene group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/721—Two or more polyisocyanates not provided for in one single group C08G18/73 - C08G18/80
    • C08G18/724—Combination of aromatic polyisocyanates with (cyclo)aliphatic polyisocyanates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
    • C08G18/75—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic
    • C08G18/758—Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic containing two or more cycloaliphatic rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
    • C08G18/76—Polyisocyanates or polyisothiocyanates cyclic aromatic
    • C08G18/7614—Polyisocyanates or polyisothiocyanates cyclic aromatic containing only one aromatic ring
    • C08G18/7621—Polyisocyanates or polyisothiocyanates cyclic aromatic containing only one aromatic ring being toluene diisocyanate including isomer mixtures
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C08J9/30—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof by mixing gases into liquid compositions or plastisols, e.g. frothing with air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2110/00—Foam properties
    • C08G2110/0025—Foam properties rigid
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2110/00—Foam properties
    • C08G2110/0041—Foam properties having specified density
    • C08G2110/0066—≥ 150kg/m3
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2375/00—Characterised by the use of polyureas or polyurethanes; Derivatives of such polymers
    • C08J2375/04—Polyurethanes
    • C08J2375/08—Polyurethanes from polyethers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polyurethanes Or Polyureas (AREA)
TW095116870A 2005-05-17 2006-05-12 Polishing pad TW200709891A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005144304A JP4979200B2 (ja) 2005-05-17 2005-05-17 研磨パッド
JP2005144292A JP4897238B2 (ja) 2005-05-17 2005-05-17 研磨パッド
JP2005144318A JP2006320982A (ja) 2005-05-17 2005-05-17 研磨パッド

Publications (2)

Publication Number Publication Date
TW200709891A true TW200709891A (en) 2007-03-16
TWI295948B TWI295948B (zh) 2008-04-21

Family

ID=37431136

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095116870A TW200709891A (en) 2005-05-17 2006-05-12 Polishing pad

Country Status (5)

Country Link
US (3) US8304467B2 (zh)
KR (3) KR101134058B1 (zh)
MY (1) MY146929A (zh)
TW (1) TW200709891A (zh)
WO (1) WO2006123559A1 (zh)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10513007B2 (en) 2017-05-29 2019-12-24 Skc Co., Ltd. Porous polyurethane polishing pad and process for preparing a semiconductor device by using the same
US10518383B2 (en) 2017-05-29 2019-12-31 Skc Co., Ltd. Porous polyurethane polishing pad and process for preparing a semiconductor device by using the same
TWI694103B (zh) * 2018-04-20 2020-05-21 南韓商Ｓｋｃ股份有限公司 多孔性聚胺甲酸酯拋光墊及其製造方法
TWI707744B (zh) * 2017-01-12 2020-10-21 南韓商Ｓｋｃ股份有限公司 多孔性聚胺甲酸酯拋光墊及其製備方法

Families Citing this family (59)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100909605B1 (ko) * 2005-03-08 2009-07-27 도요 고무 고교 가부시키가이샤 연마 패드 및 그 제조 방법
US8304467B2 (en) * 2005-05-17 2012-11-06 Toyo Tire & Rubber Co., Ltd. Polishing pad
JP4884725B2 (ja) * 2005-08-30 2012-02-29 東洋ゴム工業株式会社 研磨パッド
JP5031236B2 (ja) * 2006-01-10 2012-09-19 東洋ゴム工業株式会社 研磨パッド
CN102152233B (zh) * 2006-08-28 2013-10-30 东洋橡胶工业株式会社 抛光垫
JP5008927B2 (ja) 2006-08-31 2012-08-22 東洋ゴム工業株式会社 研磨パッド
JP5078000B2 (ja) 2007-03-28 2012-11-21 東洋ゴム工業株式会社 研磨パッド
US20090062414A1 (en) * 2007-08-28 2009-03-05 David Picheng Huang System and method for producing damping polyurethane CMP pads
US8052507B2 (en) * 2007-11-20 2011-11-08 Praxair Technology, Inc. Damping polyurethane CMP pads with microfillers
JP2012528487A (ja) * 2009-05-27 2012-11-12 ロジャーズ コーポレーション 研磨パッド、それを用いた組成物および、その製造と使用方法
US20110028074A1 (en) * 2009-08-03 2011-02-03 Canon Kabushiki Kaisha Polishing method for a workpiece and polishing tool used for the polishing method
US8551201B2 (en) * 2009-08-07 2013-10-08 Praxair S.T. Technology, Inc. Polyurethane composition for CMP pads and method of manufacturing same
JP5634903B2 (ja) * 2010-02-25 2014-12-03 東洋ゴム工業株式会社 研磨パッド
JP5350309B2 (ja) * 2010-03-31 2013-11-27 東洋ゴム工業株式会社 研磨パッドおよびその製造方法、ならびに半導体デバイスの製造方法
US9156124B2 (en) * 2010-07-08 2015-10-13 Nexplanar Corporation Soft polishing pad for polishing a semiconductor substrate
US20130017762A1 (en) * 2011-07-15 2013-01-17 Infineon Technologies Ag Method and Apparatus for Determining a Measure of a Thickness of a Polishing Pad of a Polishing Machine
US20140342641A1 (en) * 2011-12-16 2014-11-20 Toyo Tire & Rubber Co., Ltd. Polishing pad
US9421666B2 (en) 2013-11-04 2016-08-23 Applied Materials, Inc. Printed chemical mechanical polishing pad having abrasives therein
US9993907B2 (en) 2013-12-20 2018-06-12 Applied Materials, Inc. Printed chemical mechanical polishing pad having printed window
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US10399201B2 (en) 2014-10-17 2019-09-03 Applied Materials, Inc. Advanced polishing pads having compositional gradients by use of an additive manufacturing process
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
US10821573B2 (en) 2014-10-17 2020-11-03 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US10875145B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
CN113579992A (zh) 2014-10-17 2021-11-02 应用材料公司 使用加成制造工艺的具复合材料特性的cmp衬垫建构
CN105171593B (zh) 2015-08-11 2017-12-26 湖北鼎龙控股股份有限公司 耐候性化学机械抛光垫
WO2017074773A1 (en) 2015-10-30 2017-05-04 Applied Materials, Inc. An apparatus and method of forming a polishing article that has a desired zeta potential
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
KR20240015161A (ko) 2016-01-19 2024-02-02 어플라이드 머티어리얼스, 인코포레이티드 다공성 화학적 기계적 연마 패드들
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
US11072050B2 (en) 2017-08-04 2021-07-27 Applied Materials, Inc. Polishing pad with window and manufacturing methods thereof
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
EP3683019B1 (en) * 2017-09-11 2024-07-10 SK enpulse Co., Ltd. Porous polyurethane polishing pad and method for manufacturing same
CN112088069B (zh) 2018-05-07 2024-03-19 应用材料公司 亲水性和z电位可调谐的化学机械抛光垫
CN112654655A (zh) 2018-09-04 2021-04-13 应用材料公司 先进抛光垫配方
CN109596446B (zh) * 2018-11-13 2021-06-18 江苏大学 一种检测产品耐磨性能的测量装置
KR102283399B1 (ko) * 2018-12-26 2021-07-30 에스케이씨솔믹스 주식회사 연마패드용 조성물, 연마패드 및 이의 제조방법
TWI735101B (zh) * 2018-12-26 2021-08-01 南韓商Ｓｋｃ索密思股份有限公司 用於研磨墊之組成物、研磨墊及用於製備其之方法
KR102202076B1 (ko) * 2018-12-26 2021-01-12 에스케이씨 주식회사 연마패드용 조성물, 연마패드 및 이의 제조방법
US11071860B2 (en) 2019-02-06 2021-07-27 Oncosec Medical Incorporated Systems and methods for detecting fault conditions in electroporation therapy
US11851570B2 (en) 2019-04-12 2023-12-26 Applied Materials, Inc. Anionic polishing pads formed by printing processes
KR102237362B1 (ko) * 2019-06-17 2021-04-07 에스케이씨솔믹스 주식회사 연마패드용 조성물, 연마패드 및 반도체 소자의 제조방법
KR102237351B1 (ko) * 2019-06-17 2021-04-07 에스케이씨솔믹스 주식회사 연마패드용 조성물, 연마패드 및 반도체 소자의 제조방법
KR102237367B1 (ko) * 2019-06-17 2021-04-07 에스케이씨솔믹스 주식회사 연마패드용 조성물, 연마패드 및 반도체 소자의 제조방법
KR102237357B1 (ko) * 2019-06-17 2021-04-07 에스케이씨솔믹스 주식회사 연마패드용 조성물, 연마패드 및 반도체 소자의 제조방법
TWI743831B (zh) * 2019-06-17 2021-10-21 南韓商Ｓｋｃ索密思股份有限公司 用於研磨墊之組成物、研磨墊及半導體裝置之製備方法
US11845156B2 (en) * 2019-07-12 2023-12-19 Cmc Materials, Inc. Polishing pad employing polyamine and cyclohexanedimethanol curatives
CN110528287B (zh) * 2019-08-08 2022-03-08 安徽安利材料科技股份有限公司 一种毛刷式高耐用化学机械抛光聚氨酯材料及其制备方法
US11813712B2 (en) 2019-12-20 2023-11-14 Applied Materials, Inc. Polishing pads having selectively arranged porosity
CN113896856B (zh) * 2020-06-19 2023-05-12 中国科学院微电子研究所 一种抛光垫材料及抛光垫
US11806829B2 (en) 2020-06-19 2023-11-07 Applied Materials, Inc. Advanced polishing pads and related polishing pad manufacturing methods
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
CN113956421A (zh) * 2021-11-16 2022-01-21 上海映智研磨材料有限公司 聚氨酯抛光垫材料及其制备方法和应用
KR20230153739A (ko) 2022-04-29 2023-11-07 케이피엑스케미칼 주식회사 개선된 연마속도를 제공하는 연마패드 및 이의 제조방법
KR20240026409A (ko) 2022-08-19 2024-02-28 케이피엑스케미칼 주식회사 연마패드, 이의 제조방법, 및 연마패드의 연마성능 추정방법
WO2024050141A2 (en) * 2022-09-03 2024-03-07 Rajeev Bajaj Multilayer cmp pads

Family Cites Families (84)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE618837A (zh) 1961-06-12
US4410668A (en) 1982-01-29 1983-10-18 Ppg Industries, Inc. Elastomeric coating compositions
JPH0291279A (ja) 1988-09-29 1990-03-30 Achilles Corp 合成皮革及びその製造方法
JP3137260B2 (ja) 1989-06-12 2001-02-19 凸版印刷株式会社 ラジアルラインスロットアンテナ
JP2925736B2 (ja) 1991-08-07 1999-07-28 ピーピージー インダストリーズ インコーポレーテッド 独立して架橋しうるポリウレタンを有する含浸された繊維の束
GB9216631D0 (en) 1992-08-05 1992-09-16 Ici Plc Reaction system for preparing microcellular elastomers
MY114512A (en) 1992-08-19 2002-11-30 Rodel Inc Polymeric substrate with polymeric microelements
JPH06220151A (ja) 1993-01-22 1994-08-09 Sanyo Chem Ind Ltd 研磨材用ポリウレタン樹脂
JPH0871378A (ja) 1994-09-09 1996-03-19 Kanegafuchi Chem Ind Co Ltd 中空糸膜ポッティング用ウレタン樹脂
US5670599A (en) 1995-03-08 1997-09-23 Air Products And Chemicals, Inc. Ultra low voc polyurethane coatings
US5614575A (en) * 1995-04-24 1997-03-25 Rpg. Inc. Sprayable polyurethane compositions
US5587502A (en) 1995-06-02 1996-12-24 Minnesota Mining & Manufacturing Company Hydroxy functional alkoxysilane and alkoxysilane functional polyurethane made therefrom
KR100485847B1 (ko) 1997-04-04 2005-04-28 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 개선된 연마용 패드 및 이에 관한 방법
WO1999007515A1 (en) 1997-08-06 1999-02-18 Rodel Holdings, Inc. Improved polishing pads and methods relating thereto
JP2000017252A (ja) 1998-06-29 2000-01-18 Dainippon Ink & Chem Inc 研磨材組成物及びその研磨材
JP3516874B2 (ja) 1998-12-15 2004-04-05 東洋ゴム工業株式会社 ポリウレタン発泡体の製造方法及び研磨シート
CN1137013C (zh) 1999-01-21 2004-02-04 罗德尔控股公司 改进的抛光垫及其抛光方法
JP2000248034A (ja) 1999-03-02 2000-09-12 Mitsubishi Chemicals Corp 研磨材用ポリウレタン系樹脂組成物及びその発泡体
JP3316756B2 (ja) 1999-06-04 2002-08-19 富士紡績株式会社 研磨パッド用ウレタン成形物の製造方法及び研磨パッド用ウレタン成形物
JP3880028B2 (ja) 1999-08-06 2007-02-14 Ｊｓｒ株式会社 研磨パッド用重合体組成物及びそれを用いた研磨パッド
JP3558273B2 (ja) * 1999-09-22 2004-08-25 東洋ゴム工業株式会社 ポリウレタン発泡体の製造方法及び研磨シート
JP4296655B2 (ja) 1999-10-12 2009-07-15 東レ株式会社 半導体基板用研磨パッド
JP2001277101A (ja) 2000-03-28 2001-10-09 Rodel Nitta Co 研磨布
WO2001096434A1 (fr) 2000-06-13 2001-12-20 Toyo Tire & Rubber Co., Ltd. Procede de production de mousse de polyurethanne, mousse de polyurethanne et feuille abrasive
JP2003011066A (ja) 2000-07-25 2003-01-15 Ebara Corp 研磨工具及びその製造方法
US20020016139A1 (en) 2000-07-25 2002-02-07 Kazuto Hirokawa Polishing tool and manufacturing method therefor
JP2002059358A (ja) 2000-08-24 2002-02-26 Toray Ind Inc 研磨用パッドおよびそれを用いた研磨装置ならびに研磨方法
US6477926B1 (en) * 2000-09-15 2002-11-12 Ppg Industries Ohio, Inc. Polishing pad
US6679769B2 (en) 2000-09-19 2004-01-20 Rodel Holdings, Inc Polishing pad having an advantageous micro-texture and methods relating thereto
US6641471B1 (en) 2000-09-19 2003-11-04 Rodel Holdings, Inc Polishing pad having an advantageous micro-texture and methods relating thereto
JP3826702B2 (ja) 2000-10-24 2006-09-27 Ｊｓｒ株式会社 研磨パッド用組成物及びこれを用いた研磨パッド
US6706383B1 (en) 2001-11-27 2004-03-16 Psiloquest, Inc. Polishing pad support that improves polishing performance and longevity
KR100784656B1 (ko) 2000-12-08 2007-12-12 가부시키가이샤 구라레 열가소성 폴리우레탄 발포체, 이의 제조방법 및 이로부터제조된 연마 패드
BR0206681A (pt) * 2001-01-24 2006-01-17 Huntsman Int Llc Sistema de reação adequado para a produção de moldes expandidos pelo processo rim, e, artigo de espuma moldado por ld-s-rim reforçado por esteira
JP3455187B2 (ja) 2001-02-01 2003-10-14 東洋ゴム工業株式会社 研磨パッド用ポリウレタン発泡体の製造装置
JP2002239905A (ja) 2001-02-21 2002-08-28 Allied Material Corp Ｃｍｐ用パッドコンディショナー及びその製造方法
JP3359629B1 (ja) 2001-04-09 2002-12-24 東洋紡績株式会社 ポリウレタン組成物からなる研磨パッド
WO2002083757A1 (fr) 2001-04-09 2002-10-24 Toyo Boseki Kabushiki Kaisha Composition de polyurethanne et tampon a polir
JP2003062748A (ja) 2001-08-24 2003-03-05 Inoac Corp 研磨用パッド
JP2003089051A (ja) 2001-09-17 2003-03-25 Tokyo Seimitsu Co Ltd 研磨装置
JP3851135B2 (ja) 2001-10-17 2006-11-29 ニッタ・ハース株式会社 研磨パッド
JP2003145414A (ja) * 2001-11-13 2003-05-20 Toyobo Co Ltd 研磨パッド及びその製造方法
US7651761B2 (en) 2001-11-13 2010-01-26 Toyo Tire & Rubber Co., Ltd. Grinding pad and method of producing the same
JP3455208B2 (ja) 2001-11-13 2003-10-14 東洋紡績株式会社 半導体ウエハ研磨パッド、半導体ウエハの研磨方法、研磨パッド用研磨シート、及び研磨シート用発泡体ブロック
JP3325562B1 (ja) 2001-12-07 2002-09-17 東洋ゴム工業株式会社 発泡ポリウレタン研磨パッドの製造方法
JP3494641B1 (ja) 2001-12-12 2004-02-09 東洋紡績株式会社 半導体ウエハ研磨用研磨パッド
JP2003224094A (ja) 2002-01-29 2003-08-08 Ebara Corp 研磨工具
US6866565B2 (en) 2002-01-29 2005-03-15 Ebara Corporation Polishing tool and polishing apparatus
KR100467765B1 (ko) 2002-02-04 2005-01-24 에스케이씨 주식회사 고경도 및 우수한 내마모성을 갖는 폴리우레탄 탄성체제조용 조성물
JP2004167680A (ja) 2002-05-20 2004-06-17 Toyobo Co Ltd 研磨パッド
JP3571334B2 (ja) 2002-05-20 2004-09-29 東洋紡績株式会社 研磨パッド
US6824854B2 (en) 2002-07-29 2004-11-30 E. I. Du Pont De Nemours And Company Carpets treated for soil resistance
JP4101584B2 (ja) 2002-08-09 2008-06-18 東洋ゴム工業株式会社 研磨シート用ポリウレタン発泡体及びその製造方法、研磨パッド用研磨シート、並びに研磨パッド
KR100697904B1 (ko) 2002-09-25 2007-03-20 피피지 인더스트리즈 오하이오 인코포레이티드 평탄화를 위한 연마 패드
US7094811B2 (en) 2002-10-03 2006-08-22 Bayer Corporation Energy absorbing flexible foams produced in part with a double metal cyanide catalyzed polyol
TW200416102A (en) 2002-11-27 2004-09-01 Toyo Boseki Polishing pad and method for manufacturing semiconductor device
JP4078643B2 (ja) 2002-12-10 2008-04-23 東洋ゴム工業株式会社 研磨パッドの製造方法、研磨パッド、及び半導体デバイスの製造方法
JP4233319B2 (ja) 2002-12-12 2009-03-04 東洋ゴム工業株式会社 研磨パッドの製造方法及び研磨パッド
TWI313693B (en) 2002-12-17 2009-08-21 Dainippon Ink & Chemicals Two-component curable polyol composition for foamed grindstone, two-component curable composition for foamed grindstone, foamed grindstone, and method for producing foamed grindstone
JP2004235446A (ja) 2003-01-30 2004-08-19 Toyobo Co Ltd 研磨パッド
US20040224622A1 (en) 2003-04-15 2004-11-11 Jsr Corporation Polishing pad and production method thereof
JP4324785B2 (ja) 2003-04-15 2009-09-02 Ｊｓｒ株式会社 研磨パッドの製造方法
JP2005052907A (ja) * 2003-08-07 2005-03-03 Diatex Co Ltd 研磨パッド用下地材
JP4189963B2 (ja) 2003-08-21 2008-12-03 東洋ゴム工業株式会社 研磨パッド
JP4189962B2 (ja) 2003-08-21 2008-12-03 東洋ゴム工業株式会社 研磨パッドの製造方法
JP4265366B2 (ja) 2003-10-17 2009-05-20 日本ポリウレタン工業株式会社 軟質ポリウレタンフォームの製造方法
US20050171224A1 (en) 2004-02-03 2005-08-04 Kulp Mary J. Polyurethane polishing pad
WO2005088690A1 (ja) 2004-03-11 2005-09-22 Toyo Tire & Rubber Co., Ltd. 研磨パッドおよび半導体デバイスの製造方法
JP4627149B2 (ja) 2004-05-10 2011-02-09 東洋ゴム工業株式会社 研磨パッド及び半導体デバイスの製造方法
US7018581B2 (en) 2004-06-10 2006-03-28 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of forming a polishing pad with reduced stress window
EP1647588A3 (en) 2004-10-13 2006-11-02 Rohm and Haas Company Surface promoted Michael Cure Compositions
US20060089095A1 (en) 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
KR101107044B1 (ko) 2004-12-10 2012-01-25 도요 고무 고교 가부시키가이샤 연마 패드 및 연마 패드의 제조 방법
JP2006190826A (ja) 2005-01-06 2006-07-20 Toyo Tire & Rubber Co Ltd 研磨パッド及び半導体デバイスの製造方法
JP2006231429A (ja) 2005-02-22 2006-09-07 Inoac Corp 研磨パッドおよびその製造方法
KR100909605B1 (ko) 2005-03-08 2009-07-27 도요 고무 고교 가부시키가이샤 연마 패드 및 그 제조 방법
US8304467B2 (en) * 2005-05-17 2012-11-06 Toyo Tire & Rubber Co., Ltd. Polishing pad
JP4884725B2 (ja) 2005-08-30 2012-02-29 東洋ゴム工業株式会社 研磨パッド
JP4884726B2 (ja) 2005-08-30 2012-02-29 東洋ゴム工業株式会社 積層研磨パッドの製造方法
TWI403387B (zh) 2005-09-22 2013-08-01 Kuraray Co 高分子材料、由它得到之發泡體及使用它之研磨墊
JP5031236B2 (ja) 2006-01-10 2012-09-19 東洋ゴム工業株式会社 研磨パッド
CN102152233B (zh) 2006-08-28 2013-10-30 东洋橡胶工业株式会社 抛光垫
JP5008927B2 (ja) 2006-08-31 2012-08-22 東洋ゴム工業株式会社 研磨パッド
JP5078000B2 (ja) 2007-03-28 2012-11-21 東洋ゴム工業株式会社 研磨パッド

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI707744B (zh) * 2017-01-12 2020-10-21 南韓商Ｓｋｃ股份有限公司 多孔性聚胺甲酸酯拋光墊及其製備方法
US10513007B2 (en) 2017-05-29 2019-12-24 Skc Co., Ltd. Porous polyurethane polishing pad and process for preparing a semiconductor device by using the same
US10518383B2 (en) 2017-05-29 2019-12-31 Skc Co., Ltd. Porous polyurethane polishing pad and process for preparing a semiconductor device by using the same
TWI728246B (zh) * 2017-05-29 2021-05-21 南韓商Ｓｋｃ索密思股份有限公司 多孔性聚胺甲酸酯拋光墊及使用其來製備半導體裝置的方法
TWI743356B (zh) * 2017-05-29 2021-10-21 南韓商Ｓｋｃ索密思股份有限公司 多孔性聚胺甲酸酯拋光墊及使用其來製備半導體裝置的方法
TWI694103B (zh) * 2018-04-20 2020-05-21 南韓商Ｓｋｃ股份有限公司 多孔性聚胺甲酸酯拋光墊及其製造方法
US11766759B2 (en) 2018-04-20 2023-09-26 Sk Enpulse Co., Ltd. Porous polyurethane polishing pad and process for producing the same

Also Published As

Publication number Publication date
US20090093201A1 (en) 2009-04-09
KR20090078846A (ko) 2009-07-20
KR20090078845A (ko) 2009-07-20
TWI295948B (zh) 2008-04-21
MY146929A (en) 2012-10-15
US20130005228A1 (en) 2013-01-03
US20110218263A1 (en) 2011-09-08
WO2006123559A1 (ja) 2006-11-23
KR101134432B1 (ko) 2012-04-10
KR100949560B1 (ko) 2010-03-25
KR101134058B1 (ko) 2012-04-16
US8304467B2 (en) 2012-11-06
US8530535B2 (en) 2013-09-10
KR20080002981A (ko) 2008-01-04
US8779020B2 (en) 2014-07-15

Similar Documents

Publication Publication Date Title
TW200709891A (en) Polishing pad
AU2003299550A8 (en) Semiconductor device with tensile strain silicon introduced by compressive material in a buried oxide layer
WO2010139342A8 (en) Lens and method for manufacturing same
TW200620448A (en) Process for manufacturing optical and semiconductor elements
WO2006085614A3 (ja) 研磨パッド用クッション材
EP1943881A4 (en) METHOD OF MANUFACTURING DEVICE WITH A FLEXIBLE SUBSTRATE AND THEREFORE PRODUCED DEVICE WITH FLEXIBLE SUBSTRATE
PT1665880E (pt) Transdutores de polímero electroactivo para deformação de superfícies
WO2005092010A3 (en) Chemical mechanical polishing retaining ring
AU2003236328A1 (en) Polishing pad and semiconductor substrate manufacturing method using the polishing pad
TW200706551A (en) Layered sheets and processes for producing the same
WO2009059128A3 (en) Crystalline-thin-film photovoltaic structures and methods for forming the same
WO2006127093A3 (en) Methods of fabricating silicon carbide devices having a smooth surface of the channel regions
EP1783828A4 (en) SEMICONDUCTOR RESIN BLADDER AND SEMICONDUCTOR MANUFACTURING METHOD THEREWITH
WO2009041422A1 (ja) 研磨パッド
WO2007124209A3 (en) Stressor integration and method thereof
TW200603946A (en) Polishing pad for electrochemical mechanical polishing
TW200625529A (en) Contact hole structures and contact structures and fabrication methods thereof
WO2010096473A3 (en) Semiconductor chip with reinforcement layer
WO2009154767A3 (en) A heat-transfer structure
WO2009034697A1 (ja) シリコン構造体およびその製造方法並びにセンサチップ
DE602005005864D1 (de) Elastische Membran für einen Polierkopf sowie CMP-Vorrichtung, die diesen enthält
TW200702417A (en) Waterproof and airtight pressure-sensitive adhesive tape
TW200730300A (en) Polishing pad and polishing apparatus
EP1837901A4 (en) PROCESS FOR PRODUCING ABRASIVE MATERIAL, ABRASIVE MATERIAL MANUFACTURED IN ACCORDANCE WITH THE METHOD AND METHOD FOR MANUFACTURING SILICON PLATEBOARD
MX2007003029A (es) Dispositivo de cojinete.

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees