WO2006085614A3 - 研磨パッド用クッション材 - Google Patents

研磨パッド用クッション材 Download PDF

Info

Publication number
WO2006085614A3
WO2006085614A3 PCT/JP2006/302355 JP2006302355W WO2006085614A3 WO 2006085614 A3 WO2006085614 A3 WO 2006085614A3 JP 2006302355 W JP2006302355 W JP 2006302355W WO 2006085614 A3 WO2006085614 A3 WO 2006085614A3
Authority
WO
WIPO (PCT)
Prior art keywords
water
polyurethane foam
cushioning material
polishing
wafer
Prior art date
Application number
PCT/JP2006/302355
Other languages
English (en)
French (fr)
Other versions
WO2006085614A2 (ja
Inventor
Hiromasa Kawaguchi
Toshiaki Kimura
Takeshi Kawakami
Original Assignee
Nhk Spring Co Ltd
Hiromasa Kawaguchi
Toshiaki Kimura
Takeshi Kawakami
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nhk Spring Co Ltd, Hiromasa Kawaguchi, Toshiaki Kimura, Takeshi Kawakami filed Critical Nhk Spring Co Ltd
Priority to US11/815,900 priority Critical patent/US7749599B2/en
Publication of WO2006085614A2 publication Critical patent/WO2006085614A2/ja
Publication of WO2006085614A3 publication Critical patent/WO2006085614A3/ja

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249987—With nonvoid component of specified composition
    • Y10T428/249988—Of about the same composition as, and adjacent to, the void-containing component
    • Y10T428/249989—Integrally formed skin
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249987—With nonvoid component of specified composition
    • Y10T428/249991—Synthetic resin or natural rubbers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249987—With nonvoid component of specified composition
    • Y10T428/249991—Synthetic resin or natural rubbers
    • Y10T428/249992—Linear or thermoplastic

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)

Abstract

【課題】　うねりのある半導体ウェーハや回路形成過程で局所の段差が生じたウェーハでも、そのうねりや段差に沿ってウェーハ全面を均一に高低差を緩和するように研磨できるポリウレタン発泡体であって、吸水性、水膨潤性が極めて低く、水による膨潤変形が生じ難い研磨パッド用クッション材を提供する。 【解決手段】　ポリオールとポリイソシアネートの反応で得られるポリウレタン発泡体であって、水との接触角が９０°以上であるポリウレタン発泡体であることを特徴とする。このポリウレタン発泡体は、疎水性ポリオールを使用したものが好ましく、また、自己スキン層が形成されたものが好ましい。
PCT/JP2006/302355 2005-02-14 2006-02-10 研磨パッド用クッション材 WO2006085614A2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US11/815,900 US7749599B2 (en) 2005-02-14 2006-02-10 Cushioning material for a polishing pad

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005-035818 2005-02-14
JP2005035818A JP4862189B2 (ja) 2005-02-14 2005-02-14 研磨パッド用クッション材

Publications (2)

Publication Number Publication Date
WO2006085614A2 WO2006085614A2 (ja) 2006-08-17
WO2006085614A3 true WO2006085614A3 (ja) 2007-01-25

Family

ID=36793455

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2006/302355 WO2006085614A2 (ja) 2005-02-14 2006-02-10 研磨パッド用クッション材

Country Status (4)

Country Link
US (1) US7749599B2 (ja)
JP (1) JP4862189B2 (ja)
TW (1) TWI415178B (ja)
WO (1) WO2006085614A2 (ja)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG162797A1 (en) 2005-07-15 2010-07-29 Toyo Tire & Rubber Co Layered sheets and processes for producing the same
JP4884726B2 (ja) 2005-08-30 2012-02-29 東洋ゴム工業株式会社 積層研磨パッドの製造方法
WO2008029538A1 (fr) 2006-09-08 2008-03-13 Toyo Tire & Rubber Co., Ltd. Tampon à polir
CN101511536A (zh) * 2006-09-08 2009-08-19 东洋橡胶工业株式会社 抛光垫的制造方法
MY157714A (en) 2007-01-15 2016-07-15 Rohm & Haas Elect Mat Polishing pad and a method for manufacturing the same
JP4970963B2 (ja) * 2007-01-15 2012-07-11 東洋ゴム工業株式会社 研磨パッドの製造方法
JP5308637B2 (ja) * 2007-07-11 2013-10-09 東洋ゴム工業株式会社 研磨パッド
JP4593643B2 (ja) 2008-03-12 2010-12-08 東洋ゴム工業株式会社 研磨パッド
US10426453B2 (en) * 2009-03-17 2019-10-01 Pivot Medical, Inc. Method and apparatus for distracting a joint
JP5521243B2 (ja) * 2009-07-03 2014-06-11 日本発條株式会社 研磨保持用パッド
US10426456B2 (en) * 2009-07-17 2019-10-01 Pivot Medical, Inc. Method and apparatus for re-attaching the labrum to the acetabulum, including the provision and use of a novel suture anchor system
JP5557578B2 (ja) * 2010-03-31 2014-07-23 日本発條株式会社 発泡ポリウレタンシート
JP5935159B2 (ja) * 2010-04-01 2016-06-15 日本発條株式会社 研磨保持用パッド
JP5759888B2 (ja) * 2011-12-28 2015-08-05 東洋ゴム工業株式会社 研磨パッド
JP6178190B2 (ja) * 2012-09-28 2017-08-09 富士紡ホールディングス株式会社 研磨パッド
JP6178191B2 (ja) * 2012-09-28 2017-08-09 富士紡ホールディングス株式会社 研磨パッド
CN110835503B (zh) * 2019-11-14 2023-12-29 广东弘擎电子材料科技有限公司 一种发泡压敏胶带及其制备方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002154050A (ja) * 2000-11-20 2002-05-28 Toray Ind Inc 研磨用パッドおよびそれを用いた研磨装置ならびに研磨方法
JP2003145415A (ja) * 2001-11-16 2003-05-20 Toyobo Co Ltd 研磨パッド
JP2003170347A (ja) * 2001-12-06 2003-06-17 Teijin Ltd 研磨基布および研磨方法
JP2003343413A (ja) * 2002-05-27 2003-12-03 Kansai Electric Power Co Inc:The 水力発電設備
JP2004311722A (ja) * 2003-04-07 2004-11-04 Rodel Nitta Co 研磨パッドおよび研磨パッドの製造方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5477697A (en) * 1977-12-03 1979-06-21 Nhk Spring Co Ltd Production of hydrophobic urethane foamed body
US4264743A (en) * 1979-04-23 1981-04-28 Nhk Spring Co., Ltd. Polyurethane foam sealing material and process for producing the same
JPS6458475A (en) * 1987-08-25 1989-03-06 Rodeele Nitta Kk Grinding pad
JP3642822B2 (ja) * 1995-02-28 2005-04-27 株式会社イノアックコーポレーション 防水性樹脂発泡体
JP3152188B2 (ja) 1997-11-28 2001-04-03 日本電気株式会社 研磨パッド
JP4080589B2 (ja) * 1998-04-10 2008-04-23 日本発条株式会社 粘着剤付きフォーム体
JP3204244B2 (ja) * 1998-04-17 2001-09-04 荒川化学工業株式会社 非水系コーティング用組成物およびコーティング方法
JP2000220467A (ja) * 1999-01-28 2000-08-08 Tokai Rubber Ind Ltd 低吸水・低吸油性防音材
JP4576101B2 (ja) 2002-12-26 2010-11-04 東洋インキ製造株式会社 両面粘着シート
JP2004358584A (ja) * 2003-06-03 2004-12-24 Fuji Spinning Co Ltd 研磨布及び研磨加工方法
JP4181930B2 (ja) * 2003-06-27 2008-11-19 東洋インキ製造株式会社 研磨パッド積層体
FR2858328B1 (fr) * 2003-08-01 2008-01-04 Saint Gobain Performance Plast Mousse de polyurethanne, procede de fabrication et utilisation
JP4378624B2 (ja) * 2004-02-10 2009-12-09 株式会社イノアックコーポレーション シール部材の製造方法
US20050282989A1 (en) * 2004-06-17 2005-12-22 Rosthauser James W TDI prepolymers with improved processing characteristics

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002154050A (ja) * 2000-11-20 2002-05-28 Toray Ind Inc 研磨用パッドおよびそれを用いた研磨装置ならびに研磨方法
JP2003145415A (ja) * 2001-11-16 2003-05-20 Toyobo Co Ltd 研磨パッド
JP2003170347A (ja) * 2001-12-06 2003-06-17 Teijin Ltd 研磨基布および研磨方法
JP2003343413A (ja) * 2002-05-27 2003-12-03 Kansai Electric Power Co Inc:The 水力発電設備
JP2004311722A (ja) * 2003-04-07 2004-11-04 Rodel Nitta Co 研磨パッドおよび研磨パッドの製造方法

Also Published As

Publication number Publication date
WO2006085614A2 (ja) 2006-08-17
US20090011221A1 (en) 2009-01-08
TWI415178B (zh) 2013-11-11
JP4862189B2 (ja) 2012-01-25
JP2006222349A (ja) 2006-08-24
TW200636848A (en) 2006-10-16
US7749599B2 (en) 2010-07-06

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