KR20060120113A - 표면보호용 시트 및 반도체 웨이퍼의 연삭방법 - Google Patents

표면보호용 시트 및 반도체 웨이퍼의 연삭방법 Download PDF

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Publication number
KR20060120113A
KR20060120113A KR1020067009385A KR20067009385A KR20060120113A KR 20060120113 A KR20060120113 A KR 20060120113A KR 1020067009385 A KR1020067009385 A KR 1020067009385A KR 20067009385 A KR20067009385 A KR 20067009385A KR 20060120113 A KR20060120113 A KR 20060120113A
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KR
South Korea
Prior art keywords
adhesive layer
semiconductor wafer
sheet
wafer
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020067009385A
Other languages
English (en)
Korean (ko)
Inventor
고이치 나가모토
히토시 오하시
가즈히로 다카하시
Original Assignee
린텍 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=34463200&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=KR20060120113(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 린텍 가부시키가이샤 filed Critical 린텍 가부시키가이샤
Publication of KR20060120113A publication Critical patent/KR20060120113A/ko
Withdrawn legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H10P72/7404—Wafer tapes, e.g. grinding or dicing support tapes the wafer tape being a laminate of three or more layers, e.g. including additional layers beyond a base layer and an uppermost adhesive layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H10P72/7404—Wafer tapes, e.g. grinding or dicing support tapes the wafer tape being a laminate of three or more layers, e.g. including additional layers beyond a base layer and an uppermost adhesive layer
    • H10P72/7406—Wafer tapes, e.g. grinding or dicing support tapes the wafer tape being a laminate of three or more layers, e.g. including additional layers beyond a base layer and an uppermost adhesive layer the wafer tape being a laminate of four or more layers, e.g. including two or more additional layers beyond a base layer and an uppermost adhesive layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7448—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the bond interface between the auxiliary support and the wafer comprising two or more, e.g. multilayer adhesive or adhesive and release layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/204—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive coating being discontinuous
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7422—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
KR1020067009385A 2003-10-16 2004-10-14 표면보호용 시트 및 반도체 웨이퍼의 연삭방법 Withdrawn KR20060120113A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003356280A JP4447280B2 (ja) 2003-10-16 2003-10-16 表面保護用シートおよび半導体ウエハの研削方法
JPJP-P-2003-00356280 2003-10-16

Publications (1)

Publication Number Publication Date
KR20060120113A true KR20060120113A (ko) 2006-11-24

Family

ID=34463200

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020067009385A Withdrawn KR20060120113A (ko) 2003-10-16 2004-10-14 표면보호용 시트 및 반도체 웨이퍼의 연삭방법

Country Status (7)

Country Link
US (1) US7438631B2 (enExample)
EP (1) EP1681713A4 (enExample)
JP (1) JP4447280B2 (enExample)
KR (1) KR20060120113A (enExample)
CN (1) CN1868040A (enExample)
TW (1) TWI349315B (enExample)
WO (1) WO2005038894A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101676025B1 (ko) 2016-06-30 2016-11-15 (주) 화인테크놀리지 반도체 웨이퍼의 하프커팅 후 이면 연삭 가공용 자외선 경화형 점착시트

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JP4647228B2 (ja) * 2004-04-01 2011-03-09 株式会社ディスコ ウェーハの加工方法
DE102004018249B3 (de) * 2004-04-15 2006-03-16 Infineon Technologies Ag Verfahren zum Bearbeiten eines Werkstücks an einem Werkstückträger
JP5063026B2 (ja) * 2005-05-10 2012-10-31 リンテック株式会社 半導体ウエハ加工用シートおよび半導体ウエハの加工方法
JP4808458B2 (ja) * 2005-09-28 2011-11-02 株式会社ディスコ ウェハ加工方法
JP4749849B2 (ja) * 2005-11-28 2011-08-17 株式会社ディスコ ウェーハの分割方法
JP4749851B2 (ja) * 2005-11-29 2011-08-17 株式会社ディスコ ウェーハの分割方法
DE102006000687B4 (de) 2006-01-03 2010-09-09 Thallner, Erich, Dipl.-Ing. Kombination aus einem Träger und einem Wafer, Vorrichtung zum Trennen der Kombination und Verfahren zur Handhabung eines Trägers und eines Wafers
JP4836827B2 (ja) * 2007-02-22 2011-12-14 日東電工株式会社 粘着テープ貼付け装置
SG147330A1 (en) * 2007-04-19 2008-11-28 Micron Technology Inc Semiconductor workpiece carriers and methods for processing semiconductor workpieces
JP5379377B2 (ja) * 2007-12-10 2013-12-25 リンテック株式会社 表面保護用シートおよび半導体ウエハの研削方法
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JP5361200B2 (ja) * 2008-01-30 2013-12-04 株式会社東京精密 バンプが形成されたウェーハを処理するウェーハ処理方法
JP5197037B2 (ja) * 2008-01-30 2013-05-15 株式会社東京精密 バンプが形成されたウェーハを処理するウェーハ処理方法
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KR101735976B1 (ko) 2011-09-30 2017-05-15 인텔 코포레이션 트랜지스터 게이트용 캡핑 유전체 구조를 형성하는 방법
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JP5997477B2 (ja) * 2012-03-30 2016-09-28 リンテック株式会社 表面保護用シート
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JP6045817B2 (ja) * 2012-05-28 2016-12-14 株式会社ディスコ 貼着方法
JP6061590B2 (ja) * 2012-09-27 2017-01-18 株式会社ディスコ 表面保護部材および加工方法
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JP6230354B2 (ja) * 2013-09-26 2017-11-15 株式会社ディスコ デバイスウェーハの加工方法
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JP6648907B2 (ja) * 2014-10-20 2020-02-14 リンテック株式会社 表面保護シート用基材及び表面保護シート
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JP6850099B2 (ja) * 2016-09-23 2021-03-31 株式会社岡本工作機械製作所 半導体装置の製造方法及び半導体製造装置
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KR102345923B1 (ko) * 2017-05-18 2022-01-03 가부시기가이샤 디스코 웨이퍼를 프로세싱하는데 사용하기 위한 보호 시팅, 웨이퍼에 대한 핸들링 시스템, 및 웨이퍼 및 보호 시팅의 조합체
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Publication number Priority date Publication date Assignee Title
KR101676025B1 (ko) 2016-06-30 2016-11-15 (주) 화인테크놀리지 반도체 웨이퍼의 하프커팅 후 이면 연삭 가공용 자외선 경화형 점착시트

Also Published As

Publication number Publication date
TWI349315B (en) 2011-09-21
EP1681713A1 (en) 2006-07-19
EP1681713A4 (en) 2007-10-10
US7438631B2 (en) 2008-10-21
US20070066184A1 (en) 2007-03-22
WO2005038894A1 (ja) 2005-04-28
TW200524057A (en) 2005-07-16
CN1868040A (zh) 2006-11-22
JP2005123382A (ja) 2005-05-12
JP4447280B2 (ja) 2010-04-07

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