KR20050033434A - 반도체장치 및 그의 제조방법 - Google Patents

반도체장치 및 그의 제조방법 Download PDF

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Publication number
KR20050033434A
KR20050033434A KR1020040077760A KR20040077760A KR20050033434A KR 20050033434 A KR20050033434 A KR 20050033434A KR 1020040077760 A KR1020040077760 A KR 1020040077760A KR 20040077760 A KR20040077760 A KR 20040077760A KR 20050033434 A KR20050033434 A KR 20050033434A
Authority
KR
South Korea
Prior art keywords
substrate
semiconductor device
semiconductor
adhesive bonding
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020040077760A
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English (en)
Korean (ko)
Inventor
카즈오 니시
히로키 아다치
나오토 쿠스모토
유스케 스가와라
히데카즈 타카하시
다이키 야마다
요시카즈 히우라
Original Assignee
가부시키가이샤 한도오따이 에네루기 켄큐쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 한도오따이 에네루기 켄큐쇼 filed Critical 가부시키가이샤 한도오따이 에네루기 켄큐쇼
Publication of KR20050033434A publication Critical patent/KR20050033434A/ko
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/657—Shapes or dispositions of interconnections on sidewalls or bottom surfaces of the package substrates, interposers or redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/074—Connecting or disconnecting of anisotropic conductive adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers

Landscapes

  • Light Receiving Elements (AREA)
  • Wire Bonding (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Photovoltaic Devices (AREA)
KR1020040077760A 2003-10-06 2004-09-30 반도체장치 및 그의 제조방법 Ceased KR20050033434A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2003-00347678 2003-10-06
JP2003347678 2003-10-06

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020090082612A Division KR20090114343A (ko) 2003-10-06 2009-09-02 반도체장치 제조방법

Publications (1)

Publication Number Publication Date
KR20050033434A true KR20050033434A (ko) 2005-04-12

Family

ID=34509704

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020040077760A Ceased KR20050033434A (ko) 2003-10-06 2004-09-30 반도체장치 및 그의 제조방법
KR1020090082612A Ceased KR20090114343A (ko) 2003-10-06 2009-09-02 반도체장치 제조방법

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020090082612A Ceased KR20090114343A (ko) 2003-10-06 2009-09-02 반도체장치 제조방법

Country Status (5)

Country Link
US (2) US7180197B2 (https=)
EP (1) EP1542272B1 (https=)
JP (1) JP4679106B2 (https=)
KR (2) KR20050033434A (https=)
CN (1) CN100499175C (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100898503B1 (ko) 2007-09-04 2009-05-20 주식회사 아이에스시테크놀러지 고주파 인터포저

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100898503B1 (ko) 2007-09-04 2009-05-20 주식회사 아이에스시테크놀러지 고주파 인터포저

Also Published As

Publication number Publication date
CN1606169A (zh) 2005-04-13
KR20090114343A (ko) 2009-11-03
US8481370B2 (en) 2013-07-09
US20050082655A1 (en) 2005-04-21
EP1542272A3 (en) 2012-03-07
EP1542272B1 (en) 2016-07-20
CN100499175C (zh) 2009-06-10
JP4679106B2 (ja) 2011-04-27
US7180197B2 (en) 2007-02-20
JP2005175436A (ja) 2005-06-30
US20060270114A1 (en) 2006-11-30
EP1542272A2 (en) 2005-06-15

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St.27 status event code: A-6-3-E10-E12-rex-PB0901

B601 Maintenance of original decision after re-examination before a trial
E801 Decision on dismissal of amendment
PB0601 Maintenance of original decision after re-examination before a trial

St.27 status event code: N-3-6-B10-B17-rex-PB0601

PE0801 Dismissal of amendment

St.27 status event code: A-2-2-P10-P12-nap-PE0801

J301 Trial decision

Free format text: TRIAL DECISION FOR APPEAL AGAINST DECISION TO DECLINE REFUSAL REQUESTED 20111223

Effective date: 20130320

Free format text: TRIAL NUMBER: 2011101010170; TRIAL DECISION FOR APPEAL AGAINST DECISION TO DECLINE REFUSAL REQUESTED 20111223

Effective date: 20130320

PJ1301 Trial decision

St.27 status event code: A-3-3-V10-V15-crt-PJ1301

Decision date: 20130320

Appeal event data comment text: Appeal Kind Category : Appeal against decision to decline refusal, Appeal Ground Text : 2004 0077760

Appeal request date: 20111223

Appellate body name: Patent Examination Board

Decision authority category: Office appeal board

Decision identifier: 2011101010170

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000