JP4679106B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP4679106B2
JP4679106B2 JP2004292650A JP2004292650A JP4679106B2 JP 4679106 B2 JP4679106 B2 JP 4679106B2 JP 2004292650 A JP2004292650 A JP 2004292650A JP 2004292650 A JP2004292650 A JP 2004292650A JP 4679106 B2 JP4679106 B2 JP 4679106B2
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JP
Japan
Prior art keywords
substrate
film
electrode
optical sensor
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004292650A
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English (en)
Japanese (ja)
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JP2005175436A5 (https=
JP2005175436A (ja
Inventor
和夫 西
広樹 安達
直人 楠本
裕輔 菅原
秀和 高橋
大幹 山田
吉和 樋浦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semiconductor Energy Laboratory Co Ltd
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Semiconductor Energy Laboratory Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semiconductor Energy Laboratory Co Ltd filed Critical Semiconductor Energy Laboratory Co Ltd
Priority to JP2004292650A priority Critical patent/JP4679106B2/ja
Publication of JP2005175436A publication Critical patent/JP2005175436A/ja
Publication of JP2005175436A5 publication Critical patent/JP2005175436A5/ja
Application granted granted Critical
Publication of JP4679106B2 publication Critical patent/JP4679106B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/657—Shapes or dispositions of interconnections on sidewalls or bottom surfaces of the package substrates, interposers or redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/074—Connecting or disconnecting of anisotropic conductive adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers

Landscapes

  • Light Receiving Elements (AREA)
  • Wire Bonding (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Photovoltaic Devices (AREA)
JP2004292650A 2003-10-06 2004-10-05 半導体装置 Expired - Fee Related JP4679106B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004292650A JP4679106B2 (ja) 2003-10-06 2004-10-05 半導体装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003347678 2003-10-06
JP2004292650A JP4679106B2 (ja) 2003-10-06 2004-10-05 半導体装置

Publications (3)

Publication Number Publication Date
JP2005175436A JP2005175436A (ja) 2005-06-30
JP2005175436A5 JP2005175436A5 (https=) 2007-10-11
JP4679106B2 true JP4679106B2 (ja) 2011-04-27

Family

ID=34509704

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004292650A Expired - Fee Related JP4679106B2 (ja) 2003-10-06 2004-10-05 半導体装置

Country Status (5)

Country Link
US (2) US7180197B2 (https=)
EP (1) EP1542272B1 (https=)
JP (1) JP4679106B2 (https=)
KR (2) KR20050033434A (https=)
CN (1) CN100499175C (https=)

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CN102569247A (zh) * 2012-01-17 2012-07-11 华为终端有限公司 集成模块、集成系统板和电子设备
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KR102173801B1 (ko) 2012-07-12 2020-11-04 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치, 및 표시 장치의 제작 방법
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KR102423292B1 (ko) * 2021-09-07 2022-07-20 한국기계연구원 식각 장치 및 이를 포함하는 인터포저 제조 시스템

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Also Published As

Publication number Publication date
CN1606169A (zh) 2005-04-13
KR20090114343A (ko) 2009-11-03
US8481370B2 (en) 2013-07-09
US20050082655A1 (en) 2005-04-21
KR20050033434A (ko) 2005-04-12
EP1542272A3 (en) 2012-03-07
EP1542272B1 (en) 2016-07-20
CN100499175C (zh) 2009-06-10
US7180197B2 (en) 2007-02-20
JP2005175436A (ja) 2005-06-30
US20060270114A1 (en) 2006-11-30
EP1542272A2 (en) 2005-06-15

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