US8563431B2 - Method for manufacturing semiconductor device - Google Patents

Method for manufacturing semiconductor device Download PDF

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US8563431B2
US8563431B2 US11840435 US84043507A US8563431B2 US 8563431 B2 US8563431 B2 US 8563431B2 US 11840435 US11840435 US 11840435 US 84043507 A US84043507 A US 84043507A US 8563431 B2 US8563431 B2 US 8563431B2
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layer
formed
light absorption
laser beam
light
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US20080050895A1 (en )
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Hidekazu Miyairi
Eiji Higa
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Semiconductor Energy Laboratory Co Ltd
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Semiconductor Energy Laboratory Co Ltd
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1259Multistep manufacturing methods
    • H01L27/1288Multistep manufacturing methods employing particular masking sequences or specially adapted masks, e.g. half-tone mask
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers
    • H01L21/3105After-treatment
    • H01L21/311Etching the insulating layers by chemical or physical means
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers
    • H01L21/3205Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321After treatment
    • H01L21/3213Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
    • H01L21/32139Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer using masks
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs

Abstract

In a manufacturing process of a semiconductor device, a manufacturing technique for reducing the number of lithography processes using a photoresist and simplifying the process is provided, and the throughput is improved. An etching mask for forming a pattern of a layer to be processed such as a conductive layer or a semiconductor layer is manufactured without using a lithography technique that uses a photoresist. The etching mask is formed of a stacked layer structure of a light absorption layer and an insulating layer utilizing laser ablation by laser beam irradiation through a photomask.

Description

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a method for manufacturing a semiconductor device, and in particular, relates to a method for forming a pattern of a conductive layer, a semiconductor layer, or the like.

2. Description of the Related Art

Conventionally, a large number of thin films such as an insulating layer and a conductive layer are formed over a substrate and a lithography technique is appropriately used to manufacture a MOS transistor, a thin film transistor (hereinafter also referred to as a TFT), and a semiconductor device including such a transistor. A lithography technique is a technique in which a pattern of a circuit or the like called a photomask, which is formed using a light-blocking material over a transparent flat plate, is transferred to an aimed object by utilizing light. The lithography technique is widely used in a process of manufacturing a semiconductor integrated circuit and the like.

The manufacturing process using a lithography technique requires multiple steps such as resist application using a photosensitive resin called a photoresist, light exposure, development, etching using a resist as a mask, and resist removal. Therefore, the throughput is inevitably decreased as the number of lithography processes is increased.

For example, a technique for processing a pattern into a linear shape without using a photoresist is proposed in Patent Document 1 (Japanese Published Patent Application No. S63-84789). Patent Document 1 describes a technique in which a transparent conductive film (ITO) is linearly irradiated with an excimer laser beam to form a linear opening, so that a pattern is formed.

In addition, Patent Document 2 (Japanese Published Patent Application No. 2005-099500) describes a technique, in which a resist including aliphatic polyester is used; and the resist is selectively exposed to ultraviolet ray so that the resist in the ultraviolet-irradiated region is removed, thereby making a development step using a developing solution unnecessary and simplifying the lithography process.

SUMMARY OF THE INVENTION

An object of the present invention is to improve the throughput in a manufacturing process of a semiconductor device by reducing the number of lithography processes.

Another object of the present invention is to provide a pattern formation technique in a manufacturing process of a semiconductor device, which can also be applied to a large substrate.

One feature of the present invention is to form a mask for forming a pattern of a layer such as a semiconductor layer, a wiring layer, or an electrode layer, by utilizing laser ablation, instead of using a photoresist. A process for forming a pattern by utilizing laser ablation as in the present invention is also called a laser ablation patterning process (LAPP).

First, a light absorption layer and an insulating layer are stacked over a layer to be processed, and a mask formed from the insulating layer (or the insulating layer and the light absorption layer) is formed by laser beam irradiation through a photomask. By laser beam irradiation through a photomask, even a large area can be selectively irradiated at a time. Accordingly, it is possible to form a mask for processing a large area at a time.

When the insulating layer is stacked over the light absorption layer, a thick layer can be easily formed over the layer to be processed. By formation of the thick layer over the layer to be processed in this manner, damage to the layer to be processed due to laser beam irradiation can be prevented.

Next, by using the mask formed of the insulating layer (or the insulating layer and the light absorption layer) as an etching mask, the layer to be processed is etched, so that a layer having a desired pattern shape is formed.

The light absorption layer is formed using a material which absorbs a laser beam. The insulating layer is formed using a material which transmits a laser beam. In the light absorption layer and the insulating layer stacked over the layer to be processed, by laser beam irradiation from the insulating layer side, the laser beam is transmitted through the insulating layer and is absorbed by the light absorption layer. The light absorption layer is heated by energy of the absorbed laser beam, and at least the insulating layer stacked over the light absorption layer is (partially) broken and removed. A phenomenon in which an irradiated region is partially or entirely removed by energy of the laser beam as described above is called laser ablation. At this time, the light absorption layer may also be removed by the laser beam.

Laser beam irradiation is performed through a photomask. The photomask is formed of a region which transmits a laser beam and a region which blocks a laser beam, so that a desired pattern is formed. In the present invention, since laser beam irradiation is performed through the photomask, a laser beam transmitted through the light-transmitting region of the photomask is transmitted through the insulating layer and absorbed by the light absorption layer. Accordingly, in accordance with the formed pattern of the photomask, the insulating layer is subjected to laser ablation and removed. At this time, the light absorption layer may also be subjected to laser ablation and removed.

Next, the layer to be processed is etched using the left insulating layer (or the insulating layer and the light absorption layer) as a mask. The layer to be processed is left in accordance with the insulating layer (or the insulating layer and the light absorption layer) used as a mask. Accordingly, the layer to be processed is formed to have a pattern corresponding to the photomask. After the layer to be processed is processed into a desired shape, the insulating layer (or the insulating layer and the light absorption layer) used as a mask may be removed as needed.

The layer to be processed is formed using a conductive material or a semiconductor material. By utilizing laser ablation, a conductive layer or a semiconductor layer can be formed without using a lithography process using a photoresist.

One feature of the present invention is to include the steps of forming a layer to be processed; forming a light absorption layer over the layer to be processed; forming an insulating layer over the light absorption layer; irradiating the light absorption layer and the insulating layer with a laser beam through a photomask, so that at least an irradiated region of the insulating layer is removed; and etching the layer to be processed using a left part of the insulating layer as a mask.

Another feature of the present invention is to include the steps of forming a layer to be processed; forming a light absorption layer over the layer to be processed; forming an insulating layer over the light absorption layer; irradiating the light absorption layer and the insulating layer with a laser beam through a photomask, so that at least an irradiated region of the insulating layer is removed; and etching the layer to be processed using a left part of the light absorption layer as a mask, so that a layer having a tapered shape is formed.

Further, the layer having a tapered shape is formed by etching using a wet etching method or a combination of a dry etching method and a wet etching method.

Another feature of the present invention is to include the steps of forming a layer to be processed; forming a light absorption layer over the layer to be processed; forming an insulating layer over the light absorption layer; irradiating the light absorption layer and the insulating layer with a laser beam through a photomask, so that at least an irradiated region of the insulating layer is removed; and etching the layer to be processed using a left part of the insulating layer as a mask, so that a layer having a perpendicular shape is formed.

Further, the layer having a perpendicular shape is formed by etching using a dry etching method.

Another feature of the present invention is that the layer to be processed is formed using a conductive material or a semiconductor material.

Another feature of the present invention is that the light absorption layer is formed using a material which absorbs a laser beam.

Still another feature of the present invention is that the light absorption layer is formed using a conductive material, a semiconductor material, or an insulating material.

Further, another feature of the present invention is to form the light absorption layer using at least one of elements of chromium (Cr), molybdenum (Mo), nickel (Ni), titanium (Ti), cobalt (Co), copper (Cu), and aluminum (Al).

Further, another feature of the present invention is that the insulating layer is formed using a material which transmits a laser beam

Further, another feature of the present invention is that a photomask including a pattern formed of a region which transmits the laser beam and a region which blocks the laser beam is used.

In the present invention, a mask formed of an insulating layer or a stacked layer structure of an insulating layer and a light absorption layer can be manufactured by laser beam irradiation through a photomask. By using the mask, a semiconductor layer, a conductive layer, and the like can be processed into a desired shape.

By employing the present invention, lithography processes in manufacturing a semiconductor device can be reduced, and the throughput can be improved.

BRIEF DESCRIPTION OF THE DRAWINGS

In the accompanying drawings:

FIGS. 1A to 1D are conceptual diagrams for explaining the present invention;

FIGS. 2A and 2B are conceptual diagrams for explaining the present invention;

FIGS. 3A to 3E are conceptual diagrams for explaining the present invention;

FIGS. 4A1 to 4D2 are conceptual diagrams for explaining the present invention;

FIG. 5 shows an example of a manufacturing method of a semiconductor device of the present invention;

FIGS. 6A to 6C show an example of a manufacturing method of a semiconductor device of the present invention;

FIGS. 7A to 7C show an example of a manufacturing method of a semiconductor device of the present invention;

FIGS. 8A to 8C show an example of a manufacturing method of a semiconductor device of the present invention;

FIGS. 9A and 9B show an example of a manufacturing method of a semiconductor device of the present invention;

FIGS. 10A and 10B are conceptual diagrams for explaining the present invention;

FIGS. 11A to 11C show an example of a manufacturing method of a display device of the present invention;

FIGS. 12A to 12C show an example of a manufacturing method of a display device of the present invention;

FIG. 13 shows a structure of a light emitting element which can be applied to the present invention;

FIGS. 14A to 14C show structures of a light emitting element which can be applied to the present invention;

FIGS. 15A to 15C show structures of a light emitting element which can be applied to the present invention;

FIG. 16 is a conceptual diagram for explaining the present invention;

FIGS. 17A to 17C are top views of display devices of the present invention;

FIGS. 18A and 18B are top views of display devices of the present invention;

FIGS. 19A and 19B show an example of a display device of the present invention;

FIGS. 20A to 20D are conceptual diagrams for explaining the present invention;

FIGS. 21A to 21C show an example of a manufacturing method of a semiconductor device of the present invention;

FIGS. 22A to 22D show an example of a manufacturing method of a semiconductor device of the present invention;

FIGS. 23A to 23C show an example of a manufacturing method of a semiconductor device of the present invention;

FIG. 24 shows an example of a display device of the present invention;

FIG. 25 shows an example of a display device of the present invention;

FIGS. 26A and 26B show an example of a display device of the present invention;

FIG. 27 shows an example of a display device of the present invention;

FIGS. 28A and 28B show structural examples of a display module of the present invention;

FIG. 29 shows an example of a display device of the present invention;

FIG. 30 is a block diagram showing a main configuration of an electronic device to which the present invention is applied;

FIG. 31 shows an example of a circuit configuration of a display device of the present invention;

FIG. 32 shows an example of a circuit configuration of a display device of the present invention;

FIG. 33 shows an example of a circuit configuration of a display device of the present invention;

FIGS. 34A and 34B show examples of electronic devices to which the present invention is applied;

FIGS. 35A to 35E show examples of electronic devices to which the present invention is applied;

FIG. 36 shows a structural example of a laser irradiation apparatus which can be applied to the present invention;

FIG. 37 shows an example of a display device of the present invention;

FIGS. 38A to 38C are conceptual diagrams for explaining the present invention; and

FIG. 39 shows an example of a display device of the present invention.

DESCRIPTION OF THE INVENTION

Hereinafter, Embodiment Modes of the present invention will be described with reference to the accompanying drawings. It is to be noted that the present invention is not limited to the following description, and it is easily understood by those skilled in the art that modes and details thereof can be modified in various ways without departing from the spirit and scope of the present invention. Therefore, the present invention should not be interpreted as being limited to the following description of the embodiment modes. In the structures of the present invention which will be described below, the same portions or portions having similar functions are denoted by the same reference numerals in different drawings in some cases.

Embodiment Mode 1

One feature of the present invention is to form a layer such as a conductive layer or a semiconductor layer having a desired shape without using a lithography technique using a photoresist. A layer which is processed by using the present invention is also referred to as a layer to be processed. In this embodiment mode, a conductive layer such as a wiring layer, a gate electrode layer, a source electrode layer, or a drain electrode layer, or a semiconductor layer, which forms a transistor or the like for example, is processed.

One mode of a manufacturing method of a layer to be processed, to which the present invention is applied, will be described with reference to FIGS. 1A to 1D and FIGS. 2A and 2B.

First, a substrate 100, over which a layer to be processed 102, a light absorption layer 104, and an insulating layer 106 are sequentially stacked, is prepared. Then, the insulating layer 106 side of the substrate 100 is irradiated with a laser beam 114 through a photomask 108 (refer to FIG. 1A).

As the substrate 100, a glass substrate, a quartz substrate, a sapphire substrate, a ceramic substrate, a semiconductor substrate, or the like is used. A base insulating layer may be formed over the substrate 100. In that case, the base insulating layer is preferably formed using an insulating material such as silicon oxide (SiOx), silicon nitride (SiNx), silicon oxynitride (SiOxNy) (x>y), or silicon nitride oxide (SiNxOy) (x>y).

The layer to be processed 102 is formed of a material appropriate for its purpose. For example, when a conductive layer functioning as an electrode or a wiring is desired to be formed as the layer to be processed 102, the layer to be processed 102 is formed using a conductive material. As the conductive material, an element such as silver (Ag), gold (Au), nickel (Ni), platinum (Pt), palladium (Pd), iridium (Ir), rhodium (Rh), tantalum (Ta), tungsten (W), titanium (Ti), molybdenum (Mo), aluminum (Al), or copper (Cu), or an alloy material or a compound material containing the element as its main component can be used. The layer to be processed 102 can be formed by a sputtering method, a CVD method, or the like using the conductive material with a single layer structure or a stacked layer structure.

When a semiconductor layer forming a channel or the like is desired to be formed as the layer to be processed 102, the layer to be processed 102 is formed using a semiconductor material. As the semiconductor material, silicon, silicon germanium, or the like can be used. Further, as the layer to be processed 102, an amorphous semiconductor layer may be formed, or a crystalline semiconductor layer may be formed. The layer to be processed 102 can be formed by a sputtering method, a CVD method, or the like using the semiconductor material with a single layer structure or a stacked layer structure.

The light absorption layer 104 is formed of a material which can absorb a laser beam. Further, it is preferable to use a material having a boiling point or a sublimation point lower than a melting point of the layer to be processed 102, which is placed below the light absorption layer 104, for the light absorption layer 104. For example, the light absorption layer 104 can be formed using a conductive material, a semiconductor material, or an insulating material. Specifically, a conductive material such as any element of chromium (Cr), molybdenum (Mo), nickel (Ni), titanium (Ti), cobalt (Co), copper (Cu), and aluminum (Al); or an alloy material or a compound containing the element as its main component can be used. As the compound containing the element as its main component, a nitrogen compound, an oxygen compound, a carbon compound, a halogen compound, or the like can be used, and for example, aluminum nitride, tungsten nitride, tantalum nitride, or the like can be used. Alternatively, a semiconductor material such as silicon, germanium, silicon germanium, molybdenum oxide, tin oxide, bismuth oxide, vanadium oxide, nickel oxide, zinc oxide, gallium arsenide, gallium nitride, indium oxide, indium phosphide, indium nitride, cadmium sulfide, cadmium telluride, or strontium titanate can be used. Further alternatively, an organic resin material such as polyimide, acrylic, polyamide, polyimideamide, resist, or benzocyclobutene; or an insulating material such as siloxane or polysilazane can be used. Further, zinc sulfide, silicon nitride, mercury sulfide, aluminum chloride, or the like can be used. The light absorption layer 104 can be formed by an evaporation method, a sputtering method, a CVD method, or the like using the above-described material with a single layer structure or a stacked layer structure. In the case where the light absorption layer 104 is formed using the insulating material, it can be formed by a coating method. Further, hydrogen or an inert gas (rare gas such as helium (He), argon (Ar), krypton (Kr), neon (Ne), or xenon (Xe)) can be added to the light absorption layer 104. When hydrogen or an inert gas is added to the light absorption layer 104, discharge of a gas from the light absorption layer 104 or evaporation of the light absorption layer 104 can be easily caused in subsequent laser beam irradiation.

The insulating layer 106 is formed using a material which can transmit a laser beam. For example, a light-transmitting inorganic insulating material or organic insulating material, or the like can be used. As the inorganic insulating material, silicon oxide, silicon nitride, silicon oxynitride, silicon nitride oxide, or the like can be used. As the organic insulating material, an organic resin such as polyimide, acrylic, polyamide, polyimide amide, benzocyclobutene, or an epoxy resin can be used. The insulating layer 106 can be formed by a sputtering method, a CVD method, a coating method, or the like using the above material with a single layer structure or a stacked layer structure.

The photomask 108 includes a region which transmits a laser beam (hereinafter also referred to as a light-transmitting region) 110 and a region which blocks a laser beam (hereinafter also referred to as a light-blocking region) 112, and the light-transmitting region 110 and the light-blocking region 112 form a desired pattern. For example, in the photomask 108, a desired pattern is formed using a light-blocking material on a surface of a light-transmitting substrate. It is to be noted that a material for forming the light-blocking region 112 needs to be favorable in light-blocking property and resistant to energy of the laser beam 114. For example, in the case of using an excimer laser beam for the laser beam 114, tungsten, molybdenum, or aluminum can be used.

For the laser beam 114, a laser beam having such energy that can be absorbed by the light absorption layer 104 is appropriately selected. Typically, a laser beam of an ultraviolet region, a visible region, or an infrared region can be appropriately selected for irradiation.

As a laser oscillator which can produce such laser beams, the following can be used: an excimer laser such as a KrF, ArF, or XeCl laser; a gas laser such as a He, He—Cd, Ar, He—Ne, or HF laser; a solid-state laser using, as a medium, single crystalline YAG, YVO4, forsterite (Mg2SiO4), YAlO3, or GdVO4, or polycrystalline (ceramic) YAG, Y2O3, YVO4, YAlO3, or GdVO4, which is doped with one or more of Nd, Yb, Cr, Ti, Ho, Er, Tm, and Ta as a dopant; or a semiconductor laser such as a GaN, GaAs, GaAlAs, or InGaAsP laser. It is to be noted that in the case of using a solid-state laser, it is preferable to use a laser beam having a wave that is appropriately selected from the fundamental wave to the fifth harmonic.

For the laser beam 114, a continuous wave laser beam or a pulsed laser beam can appropriately be used. For the pulsed laser beam, a repetition rate of several tens of Hz to several KHz is usually used. Alternatively, a pulsed laser, which can emit a laser beam at a repetition rate of 10 MHz or more, that is much higher than the usual, and with a pulse width in the range of picoseconds or in the range of femtoseconds (10−15 seconds), may be used.

A cross-sectional shape of the laser beam 114 may be a circular shape, an elliptic shape, a rectangular shape, or a linear shape (in a strict sense, a narrow rectangular shape) as appropriate. The laser beam 114 is preferably shaped to have such a cross-sectional shape by an optical system.

Energy of the laser beam 114 preferably has such a level that can cause a gas in the light absorption layer 104 to be discharged or the light absorption layer 104 to be evaporated.

In FIG. 1A, the laser beam 114 is transmitted through the light-transmitting region 110 of the photomask 108 to reach the surface of the insulating layer 106.

Further, the laser beam 114 is transmitted through the insulating layer 106 and absorbed by the light absorption layer 104. A region which the laser beam 114 reaches (hereinafter also referred to as an irradiated region) of the light absorption layer 104 is subjected to laser ablation, and the light absorption layer 104 as well as the insulating layer 106 stacked thereover is partially removed (refer to FIG. 1B). A left portion of the light absorption layer 104 is separated into light absorption layers 116 a, 116 b, 116 c, and 116 d. At the same time, the insulating layer 106 is separated into insulating layers 118 a, 118 b, 118 c, and 118 d. The left light absorption layers 116 a to 116 d and insulating layers 118 a to 118 d function as etching masks in etching the layer to be processed 102. It is to be noted that a pattern of the left light absorption layers 116 a to 116 d and insulating layers 118 a to 118 d corresponds to the pattern formed in the photomask 108, specifically the pattern formed of the light-blocking region 112.

In the laser ablation caused here, the irradiated region of the light absorption layer 104 is evaporated, and the irradiated region of the light absorption layer 104 and a part of the insulating layer 106 over the irradiated region are removed (or scattered) by energy of the laser beam 114 absorbed by the light absorption layer 104.

Since the etching masks are formed by utilizing laser ablation in the above-described manner, a step for applying a resist and a development step using a developing solution in a lithography process using a photoresist can be omitted. Accordingly, loss of materials such as a photoresist material and a developing solution can be prevented. Further, since the substrate does not need to be rotated, the present invention can more easily be applied to a large substrate. Further, since laser beam irradiation is performed through a photomask, even a large area can be selectively irradiated at a time. Accordingly, it is possible to form a mask pattern in a large area at a time.

Further, in the present invention, a layer functioning as a mask has a stacked layer structure of the light absorption layer and the insulating layer. By formation of the insulating layer over the light absorption layer in this manner, the mask can be easily thickened. Therefore, in laser beam irradiation, damage to the layer to be processed formed below the mask can be prevented.

In a usual lithography process, a mask pattern for etching a layer to be processed is formed through steps such as resist coating, light exposure, development, etching, and removal of the resist, with an exposure apparatus including a complex optical system such as a stepper. On the other hand, in the present invention, since a mask pattern is formed by utilizing laser ablation, an apparatus for resist coating, development, removal of the resist, and the like is not needed. By applying the present invention, maintenance of an apparatus for forming a pattern can be facilitated.

After irradiation with the laser beam 114, a gas such as N2 or air may be jetted to the side of the substrate 100, which is irradiated with the laser beam 114. Alternatively, the substrate 100 may be washed with a liquid that is a non-reactant such as water. Thus, by jetting a gas or washing with a liquid, dusts, residues, and the like due to ablation can be reduced.

Next, by using the left light absorption layers 116 a to 116 d and insulating layers 118 a to 118 b as masks, the layer to be processed 102 is etched to form layers to be processed 120 a, 120 b, 120 c, and 120 d (refer to FIG. 1C). The layers to be processed 120 a to 120 d each have a desired pattern shape, and a conductive layer functioning as a wiring, an electrode, or the like or a semiconductor layer is formed. The pattern shape of the layers to be processed 120 a to 120 d corresponds to the pattern formed in the photomask 108. Specifically, the pattern shape of the layers to be processed 120 a to 120 d corresponds to the pattern of the light-blocking region 112 formed in the photomask 108. The left light-absorption layers 116 a to 116 d and insulating layers 118 a to 118 d function as etching masks.

The layer to be processed 102 is subjected to anisotropic etching or isotropic etching, so that the layers to be processed 120 a to 120 d are formed. Etching may be performed by a dry etching method, a wet etching method, or a combination of a dry etching method and a wet etching method.

In general, when a wet etching method is used, an object to be etched (in this embodiment mode, the layers to be processed 120 a to 120 d) has an isotropic shape. Therefore, a wet etching method is employed for the isotropic etching. On the other hand, a dry etching method has a chemical etching aspect in which etching is performed by a chemical reaction and a physical etching aspect in which etching is performed physically by a sputtering effect or the like. The chemical etching is isotropic, the physical etching is anisotropic, and the ratio of both the etchings is changed depending on the structure of an apparatus or the like. Since both anisotropic etching and isotropic etching can be performed depending on the ratio of the chemical etching aspect and the physical etching aspect when using a dry etching method, a dry etching method can be applied to both etchings.

When using a dry etching method, a gas, by which a selection ratio of the etching rate of the layer to be processed 102 to the etching rate of the insulating layers 118 a to 118 d and the light absorption layers 116 a to 116 d is high, is used as an etching gas. For example, a fluorine-based gas or a chlorine-based gas such as CF4, CHF3, NF3, Cl2, or BCl3 can be employed. An inert gas such as He or argon or an O2 gas may be appropriately added to the etching gas. For example, in the case where the layer to be processed 102 is formed of tungsten, the light absorption layers 116 a to 116 d are formed of chromium, and the insulating layers 118 a to 118 d are formed of silicon oxynitride, a mixed gas of CF4, Cl2, and O2 is used as an etching gas.

In the case where a dry etching method is used, an uppermost layer portion, which is upper layer portions of the insulating layers 118 a to 118 d here, may also be etched, so that the film thicknesses thereof are reduced (referred to as film-reduction).

In the case where a wet etching method is used, a solution, by which a selection ratio of the etching rate of the layer to be processed 102 to the etching rate of the insulating layers 118 a to 118 d and the light absorption layers 116 a to 116 d can be obtained, is used as an etchant. For example, an acidic solution of hydrofluoric acid, phosphoric acid, nitric acid, acetic acid, sulfuric acid, or the like or an alkaline solution of potassium hydroxide, hydrazine, ethylenediamine, or the like can be used. Further, pure water or a buffering agent may be appropriately added to the etchant. For example, in the case where the layer to be processed 102 is formed of molybdenum, the light absorption layer 104 is formed of chromium, and the insulating layer 106 is formed of silicon oxynitride, an acid in which phosphoric acid, acetic acid, nitric acid, and pure water are mixed at a ratio of 85:5:5:5 by vol % (in this specification, also referred to as an aluminum mixed acid solution) can be used as an etchant. Further, in the case where the layer to be processed 102 is formed using tungsten, a solution in which a 28 wt % ammonia solution, a 31 wt % hydrogen peroxide solution, and pure water are mixed at a ratio of 3:5:2 by vol % (in this specification, hereinafter also referred to as an ammonia hydrogen peroxide mixture) can be used. For example, the etching rate of tungsten (W) is about 24 nm/min in the ammonia hydrogen peroxide mixture. Further, the etching rate of tungsten nitride is about 250 nm/min in the ammonia hydrogen peroxide mixture.

FIG. 1C shows an example in which part of the layer to be processed 102 is removed by anisotropic etching, so that the layers to be processed 120 a to 120 d are formed. Side surfaces (sidewalls) of the layers to be processed 120 a to 120 d, which are etched by anisotropic etching, each have a perpendicular shape.

FIG. 2A shows an example in which part of the layer to be processed 102 is removed by isotropic etching, so that layers to be processed 220 a, 220 b, 220 c, and 220 d are formed. The process up to the step for forming the light absorption layers 116 a to 116 d and the insulating layers 118 a to 118 d to serve as etching masks is the same as that of FIG. 1B. Side surfaces (sidewalls) of the layers to be processed 220 a to 220 d, which are etched by isotropic etching, each have a tapered shape.

In the present invention, the layer functioning as the etching mask has a stacked layer structure of the light absorption layer and the insulating layer; therefore, a selection ratio of the etching rate of a layer to be etched to the etching rate of the mask can be easily high. In addition, since the mask can be thick by forming the insulating layer over the light absorption layer, a film-reduction in dry etching does not have a level to arise a big problem.

In forming a mask from an insulating layer and a light absorption layer by laser ablation, an influence to a layer to be processed, which exists in a lower layer, is a concern. However, since the layer to be processed placed below an irradiated region with a laser beam is removed at the time of etching, there are no particular problems.

Next, the light absorption layers 116 a to 116 d and the insulating layers 118 a to 118 d are removed (refer to FIG. 1D and FIG. 2B). The light absorption layers 116 a to 116 d and the insulating layers 118 a to 118 d may be removed by appropriately selecting: a method for etching the layers by etching utilizing a dry etching method or a wet etching method, or a method for removing the layers by laser ablation through laser beam irradiation. Further, when the light absorption layers 116 a to 116 d and the insulating layers 118 a to 118 d are removed by laser ablation, jetting of a gas such as N2 or air or washing with a liquid may be performed from the laser beam irradiation side. In the above-described manner, the layers to be processed 120 a to 120 d having a desired pattern shape can be obtained.

Further, by employing the present invention, a conductive layer formed over a wiring substrate or a conductive layer functioning as an antenna used for an RF tag or the like can be formed as well.

By employing the present invention, a layer having a desired pattern shape can be formed without using a lithography process using a photoresist. Accordingly, a lithography process can be simplified, and the throughput can be improved.

Further, with the use of a linear laser beam or a planar laser beam having a large area such as a rectangular laser beam or a circular laser beam, a plurality of regions can be irradiated with a laser beam in a short time. Accordingly, by employing the present invention to a large substrate, a lot of patterns can be formed in a short time, whereby mass productivity can be improved.

Embodiment Mode 2

In this embodiment mode, a method for manufacturing a plurality of conductive layers, which function as gate electrode layers or wiring layers, using the present invention, will be described with reference to FIGS. 4A1 to 4D2.

First, a substrate 400, over which a conductive layer 402, a light absorption layer 404, and an insulating layer 406 are sequentially stacked, is prepared. Then, the insulating layer 406 side of the substrate 400 is irradiated with a laser beam 414 through a photomask 408 (refer to FIG. 4A1).

The substrate 400 may be a glass substrate, a quartz substrate, a sapphire substrate, a ceramic substrate, a semiconductor substrate, or the like. Over the substrate 400, a base insulating layer may be formed using an insulating material such as silicon oxide, silicon nitride, silicon oxynitride, or silicon nitride oxide.

The conductive layer 402 is formed of a conductive material such as an element, e.g. silver (Ag), gold (Au), nickel (Ni), platinum (Pt), palladium (Pd), iridium (Ir), rhodium (Rh), tantalum (Ta), tungsten (W), titanium (Ti), molybdenum (Mo), aluminum (Al), or copper (Cu) or an alloy material or a compound material containing the element as its main component. Further, the conductive layer 402 may have a single layer structure or a stacked layer structure. For example, a single layer structure using a tungsten layer; a two-layer structure in which a tantalum nitride layer and a tungsten layer are stacked or a tungsten nitride layer and a molybdenum layer are stacked; a three-layer structure in which a molybdenum layer, an aluminum layer, and a molybdenum layer are stacked; or the like can be formed.

The conductive layer 402 is formed by a sputtering method, a physical vapor deposition (PVD) method, a chemical vapor deposition (CVD) method such as a low pressure CVD (LPCVD) method or a plasma CVD method, or the like.

The light absorption layer 404 is formed by using a material which can absorb the laser beam 414. For the light absorption layer 404, it is preferable to use a material having a boiling point or a sublimation point lower than a melting point of the conductive layer 402, which is placed below the light absorption layer 404. For example, the light absorption layer 404 can be formed using a conductive material, a semiconductor material, or an insulating material. For the light absorption layer 404, a conductive material such as any element of Cr, Mo, Ni, Ti, Co, Cu, and Al; or an alloy material or a compound containing the element as its main component can be used. As the compound, a nitrogen compound, an oxygen compound, a carbon compound, a halogen compound, or the like can be used, and for example, aluminum nitride, tungsten nitride, tantalum nitride, or the like can be used. Alternatively, a semiconductor material such as silicon, germanium, silicon germanium, molybdenum oxide, tin oxide, bismuth oxide, vanadium oxide, nickel oxide, zinc oxide, gallium arsenide, gallium nitride, indium oxide, indium phosphide, indium nitride, cadmium sulfide, cadmium telluride, or strontium titanate can be used. Further alternatively, an organic resin material such as polyimide, acrylic, polyamide, polyimideamide, resist, or benzocyclobutene; or an insulating material such as siloxane or polysilazane can be used. Further, zinc sulfide, silicon nitride, mercury sulfide, aluminum chloride, or the like can be used. The light absorption layer 404 can be formed with a single layer structure or a stacked layer structure.

The light absorption layer 404 is formed by an evaporation method, a sputtering method, a CVD method, or the like. In the case where the light absorption layer 404 is formed using an insulating material, it can be formed by a coating method. Further, hydrogen or an inert gas (rare gas such as helium (He), argon (Ar), krypton (Kr), neon (Ne), or xenon (Xe)) may be added to the light absorption layer 404. When hydrogen or an inert gas is added to the light absorption layer 404, discharge of a gas from the light absorption layer 404 or evaporation of the light absorption layer 404 can be easily caused in subsequent laser beam irradiation.

The insulating layer 406 is formed using a material which can transmit a laser beam. For example, a light-transmitting inorganic insulating material or organic insulating material, or the like can be used. As the inorganic insulating material, silicon oxide, silicon nitride, silicon oxynitride, silicon nitride oxide, or the like can be used. As the organic insulating material, an organic resin such as polyimide, acrylic, polyamide, polyimide amide, benzocyclobutene, or an epoxy resin can be used. The insulating layer 406 can be formed by a sputtering method, a CVD method, a coating method, or the like using the above material with a single layer structure or a stacked layer structure.

The photomask 408 includes a light-transmitting region 410 which transmits the laser beam 414 and a light-blocking region 412 which blocks the laser beam 414, and the light-transmitting region 410 and the light-blocking region 412 form a desired pattern. For example, the photomask 408 is formed of a substrate obtained by forming a desired pattern using a light-blocking material on a surface of a light-transmitting substrate. It is to be noted that a material for forming the light-blocking region 412 needs to be a material favorable in light-blocking property and resistant to energy of the laser beam 114. For example, in the case of using an excimer laser beam, tungsten, molybdenum, or aluminum can be used.

As the laser beam 414, a laser beam having such energy that can be absorbed by the light absorption layer 404 may be appropriately selected. Typically, a laser beam of an ultraviolet region, a visible region, or an infrared region may be appropriately selected.

As a laser oscillator which can produce such laser beams, the following can be used: an excimer laser such as a KrF, ArF, or XeCl laser; a gas laser such as a He, He—Cd, Ar, He—Ne, or HF laser; a solid-state laser using, as a medium, single crystalline YAG, YVO4, forsterite (Mg2SiO4), YAlO3, or GdVO4, or polycrystalline (ceramic) YAG, Y2O3, YVO4, YAlO3, or GdVO4, which is doped with one or more of Nd, Yb, Cr, Ti, Ho, Er, Tm, and Ta as a dopant; or a semiconductor laser such as a GaN, GaAs, GaAlAs, or InGaAsP laser. It is to be noted that in the case of using a solid-state laser, it is preferable to use a laser beam having a wave that is appropriately selected from the fundamental wave to the fifth harmonic.

For the laser beam 414, a continuous wave laser beam or a pulsed laser beam can appropriately be used. For the pulsed laser beam, a repetition rate of several tens of Hz to several KHz is usually used. Alternatively, a pulsed laser, which can emit a laser beam at a repetition rate of 10 MHz or more, that is much higher than the usual, and with a pulse width in the range of picoseconds or in the range of femtoseconds (10−15 seconds), may be used.

A cross-sectional shape of the laser beam 414 may be a circular shape, an elliptic shape, a rectangular shape, or a linear shape (in a strict sense, a narrow rectangular shape) as appropriate. The laser beam 414 is preferably shaped to have such a cross-sectional shape by an optical system. Energy of the laser beam 414 preferably has such a level that can cause a gas in the light absorption layer 404 to be discharged or the light absorption layer 404 to be evaporated.

In FIG. 4A1, the laser beam 414 is transmitted through the light-transmitting region 410 of the photomask 408 and reaches the surface of the insulating layer 406.

FIG. 4A2 is a schematic top diagram of FIG. 4A1. FIG. 4A1 corresponds to a cross-sectional view taken along a line OP of FIG. 4A2. It is to be noted that in the top diagram, the photomask 408 and the laser beam 414 are omitted.

The laser beam 414 which has reached the surface of the insulating layer 406 is transmitted through the insulating layer 406 and is absorbed by the light absorption layer 404 formed in a lower layer. An irradiated region of the light absorption layer 404 with the laser beam 414 is subjected to laser ablation, and the light absorption layer 404 as well as the insulating layer 406 stacked thereover is partially removed. Then, light absorption layers 416 a, 416 b, 416 c, and 416 d, and insulating layers 418 a, 418 b, 418 c, and 418 d are left (refer to FIGS. 4B1 and 4B2). A pattern of the left absorption layers 416 a to 416 d and insulating layers 418 a to 418 d corresponds to the pattern formed in the photomask 408, specifically the pattern formed of the light-blocking region 412.

In the laser ablation caused here, the irradiated region of the light absorption layer 404 is evaporated, and the irradiated region of the light absorption layer 404 and a part of the insulating layer 406 over the irradiated region are removed (or scattered) by energy of the laser beam 414 absorbed by the light absorption layer 404.

After irradiation with the laser beam 414, a gas such as N2 or air may be jetted to the side of the substrate 400, which is irradiated with the laser beam 414. Alternatively, the substrate 400 may be washed with a liquid that is a non-reactant such as water. Thus, by jetting a gas or washing with a liquid, dusts, residues, and the like due to ablation can be reduced.

Next, using the light absorption layers 416 a to 416 d and the insulating layers 418 a to 418 d as masks, the conductive layer 402 is etched to form conductive layers 420 a, 420 b, 420 c, and 420 d (refer to FIG. 4C1 and FIG. 4C2). The pattern of the conductive layers 420 a to 420 d corresponds to the pattern formed in the photomask 408.

The conductive layers 420 a to 420 d can be formed by using the light absorption layers 416 a to 416 d and the insulating layers 418 a to 418 d as etching masks, and performing anisotropic etching or isotropic etching to the conductive layer 402. Etching may be performed by appropriately selecting an etching method, an etching gas, an etchant, and the like under conditions where a selection ratio of the etching rate of the conductive layer 402 to the etching rate of the etching masks (the light absorption layers 416 a to 416 d and the insulating layers 418 a to 418 d) is high.

In this embodiment mode, anisotropic etching is performed, so that the conductive layers 420 a to 420 d each having a perpendicular side surface are formed (refer to FIG. 4C1). For the anisotropic etching, a dry etching method can be used. As an etching gas, a fluorine-based gas or a chlorine-based gas such as CF4, CHF3, NF3, Cl2, or BCl3 can be employed. An inert gas such as He or Ar, an O2 gas, or the like may be appropriately added to the etching gas.

After the anisotropic etching, isotropic etching may continuously be performed, so that conductive layers each having a tapered side surface (sidewall) may be formed (refer to FIG. 38). For example, the conductive layers 420 a to 420 d each having a perpendicular side surface are formed by a dry etching method (refer to FIG. 38A), and then conductive layers 422 a, 422 b, 422 c, and 422 d each having a tapered side surface are continuously formed by a wet etching method (refer to FIG. 38B). By a wet etching method, an etchant goes into a portion below the mask (the light absorption layers 416 a to 416 d and the insulating layers 418 a to 418 d), thereby forming the side surfaces of the conductive layers 420 a to 420 d into tapered shapes. Accordingly, the conductive layers 422 a to 422 d as shown in FIG. 38C can be formed. As the etchant used for wet etching, an acidic solution of HF, H3PO4, HNO3, CH3COOH, H2SO4, or the like or an alkaline solution of KOH, N2H2, NH2(CH2)2NH2, or the like can be used. Further, pure water or a buffering agent may be appropriately added to the etchant.

Alternatively, only wet etching may be performed to form the conductive layers each having a tapered side surface.

For example, in the case where the conductive layer 402 is formed of tungsten, the light absorption layer 404 (416 a to 416 d) is formed of chromium, and the insulating layer 406 (418 a to 418 d) is formed of silicon oxynitride, dry etching using a mixed gas of CF4, Cl2, and O2 can be performed.

In the case where the conductive layer 402 is formed of molybdenum, the light absorption layer 404 (416 a to 416 d) is formed of chromium, and the insulating layer 406 (418 a to 418 d) is formed of silicon oxynitride, wet etching can be performed using an aluminum mixed acid solution. In the case where the conductive layer is formed using tungsten, etching can be performed using an ammonia hydrogen peroxide mixture.

It is to be noted that in the case of using a dry etching method for etching, upper layer portions of the insulating layers serving as masks may sometimes be etched, so that the film thicknesses thereof are reduced (referred to as film-reduction).

Next, the light absorption layers 416 a to 416 d and the insulating layers 418 a to 418 d, which have been used as the masks, are removed (refer to FIGS. 4D1 and 4D2). The light absorption layers 416 a to 416 d and the insulating layers 418 a to 418 d may be removed by using a method for removing the layers utilizing a dry etching method or a wet etching method, or a method for removing the layers by laser ablation through laser beam irradiation. In the case where the light absorption layers 416 a to 416 d and the insulating layers 418 a to 418 d are removed by utilizing laser ablation, it is preferable that dusts, residues, and the like be removed by jetting a gas such as N2 or air or washing with a liquid that is a non-reactant such as water, at the laser beam irradiation side. In the above-described manner, the conductive layers 420 a to 420 d forming a desired pattern shape can be obtained.

It is also possible that the light absorption layers 416 a to 416 d (light absorption layer 404) are formed using a conductive material (refer to FIG. 10A) and only the insulating layers 418 a to 418 d are removed to form conductive layers 424 a to 424 d formed of stacked layer structures of the light absorption layers 416 a to 416 d and the conductive layers 420 a to 420 d (refer to FIG. 10B). In order to remove only the insulating layers 418 a to 418 d, etching may be performed under conditions where a selection ratio of the etching rate of the insulating layers 418 a to 418 d to the etching rate of the light absorption layers 416 a to 416 d is high.

Further, by employing the present invention, a conductive layer formed over a wiring substrate or a conductive layer functioning as an antenna used for an RF tag or the like can be formed as well.

By employing the present invention, a layer having a desired pattern shape can be formed without using a lithography process using a photoresist. Accordingly, a lithography process can be simplified, and the throughput can be improved.

Further, with the use of a linear laser beam or a planar laser beam having a large area such as a rectangular laser beam or a circular laser beam, a plurality of regions can be irradiated with a laser beam in a short time. Accordingly, by employing the present invention to a large substrate, a lot of patterns can be formed in a short time, whereby mass productivity can be improved.

Embodiment Mode 3

In this embodiment mode, one mode of a method for manufacturing a layer to be processed, which is different from that of Embodiment Mode 1, will be described with reference to FIGS. 3A to 3E.

First, a substrate 300, over which a layer to be processed 302, a light absorption layer 304, and an insulating layer 306 are sequentially stacked, is prepared. Then, the insulating layer 306 side of the substrate 300 is irradiated with a laser beam 314 through a photomask 308 (refer to FIG. 3A).

Substrates similar to those for the substrate 100 may be used for the substrate 300. In addition, the layer to be processed 302, the light absorption layer 304, and the insulating layer 306 may be formed using materials similar to those for the layer to be processed 102, the light absorption layer 104, and the insulating layer 106, respectively.

The photomask 308 has a light-transmitting region 330 which transmits the laser beam 314 and a light-blocking region 312 which blocks the laser beam 314, and the light-transmitting region 314 and the light-blocking region 312 form a desired pattern. For example, the photomask 308 is formed of a substrate obtained by forming a desired pattern using a light-blocking material on a surface of a light-transmitting substrate. It is to be noted that a material forming the light-blocking region 312 needs to be favorable in light-blocking property and resistant to energy of the laser beam 314, For example, in the case where an excimer laser is used, tungsten, molybdenum, or aluminum can be used.

As the laser beam 314, a laser beam which has such energy that can be absorbed by the light absorption layer 304 is appropriately selected. Typically, a laser beam of an ultraviolet region, a visible region, or an infrared region is appropriately selected for irradiation. Specific laser beams and laser oscillators are based on those in Embodiment Mode 1; therefore, detailed description will be omitted.

In FIG. 3A, the laser beam 314 is transmitted through the light-transmitting region 330 of the photomask 308 and reaches the surface of the insulating layer 306.

Further, the laser beam 314 is transmitted through the insulating layer 306 and absorbed by the light absorption layer 304. Laser ablation is caused due to energy of the laser beam 314 absorbed by the light absorption layer 304, and only a part of the insulating layer 306 in an irradiated region is removed by the laser ablation. Then, insulating layers 318 a, 318 b, 318 c, and 318 d are formed (refer to FIG. 3B).

This embodiment mode is different from Embodiment Mode 1 in that only a part of the insulating layer 306 in the irradiated region is removed by the laser ablation and the light absorption layer 304 is left. The light absorption layer 304 can be left depending on the energy of the laser beam 314 used for irradiation or by appropriately selecting a material forming the light absorption layer 304. Therefore, only the part of the insulating layer 306 can be removed by laser ablation due to the energy of the laser beam 314 absorbed by the light absorption layer 304.

In addition, a part of the insulating layer 306 and an upper layer portion of the light absorption layer 304 in an irradiated region with the laser beam 314 may be removed by laser ablation in some cases. For example, as shown in FIG. 3A, the insulating layer 306 side of the substrate 300 is irradiated with the laser beam 314 through the photomask 308. The laser beam 314 is transmitted through the insulating layer 306 and absorbed by the light absorption layer 304. The light absorption layer 304 in the irradiated region with the laser beam 314 is subjected to laser ablation by energy of the laser beam 314, and the upper portion thereof is removed. Further, in addition to the upper portion of the light absorption layer 314, the part of the insulating layer 306 in the irradiated region is also removed. As a result, the insulating layers 318 a, 318 b, 318 c, and 318 d are formed. In addition, the thickness of the light absorption layer 304 in a portion not covered with the insulating layers 318 a to 318 d is thinner than that of other portions (refer to FIG. 16).

After irradiation with the laser beam 314, a gas such as N2 or air may be jetted from the irradiation side of the laser beam 314. Alternatively, the substrate 300 may be washed with a liquid that is a non-reactant, such as water. In this manner, when a gas is jetted or washing with a liquid is performed, dusts, residues, and the like due to ablation can be removed.

Next, with the insulating layers 318 a to 318 d as masks, parts of the light absorption layer 304 and the layer to be processed 302 are removed by etching, and light absorption layers 316 a, 316 b, 316 c, and 316 d, and layers to be processed 320 a, 320 b, 320 c, and 320 d are formed (refer to FIG. 3C). The layers to be processed 320 a to 320 d form a desired pattern shape, and a conductive layer functioning as a wiring, an electrode, or the like or a semiconductor layer is formed.

Etching of parts of the light absorption layer 304 and the layer to be processed 302 can be performed by appropriately selecting anisotropic etching or isotropic etching. Specifically, a dry etching method or a wet etching method is used, and conditions may be appropriately selected. In general, a dry etching method is used for anisotropic etching, and a wet etching method is used for isotropic etching. Both of them can also be combined. In this embodiment mode, anisotropic etching is performed using a dry etching method, so that a light absorption layer and a layer to be processed having a perpendicular side surface are formed. It is to be noted that when a dry etching method is used, the upper layer portion of the insulating layer may also be etched and the thickness thereof may be reduced in some cases (film-reduction).

Of course, the light absorption layer 304 and the layer to be processed 302 can be subjected to isotropic etching, so that a light absorption layer and a layer to be processed having a tapered side surface can be formed. In this case, a wet etching method may be used, or a dry etching method and a wet etching method may be continuously performed.

Alternatively, the light absorption layer 304 and the layer to be processed 302 may be etched through two steps. In other words, the light absorption layer 304 may be etched using the insulating layers 318 a to 318 d as masks, and then, the layer to be processed 302 may be etched using the insulating layers 318 a to 318 d and the left light absorption layers 316 a to 316 d as masks. In this case, the light absorption layer 304 may be etched by a dry etching method, and then, the layer to be processed 302 may be etched by a wet etching method.

Next, the light absorption layers 316 a to 316 d and the insulating layers 318 a to 318 d are removed. The light absorption layers 316 a to 316 d and the insulating layers 318 a to 318 d may be removed by appropriately selecting: a method for removing the layers by etching utilizing a dry etching method or a wet etching method, or a method for removing the layers by laser ablation through laser beam irradiation. It is also possible to remove the light absorption layers 316 a to 316 d by selecting energy conditions of the laser beam and the like. Further, when the light absorption layers 316 a to 316 d and the insulating layers 318 a to 318 d are removed by utilizing laser ablation, dusts, residues, and the like may be removed by jetting a gas such as N2 or by using a liquid that is a non-reactant such as water after laser beam irradiation. In this manner, layers to be processed 324 a, 324 b, 324 c, and 324 d having a desired pattern shape can be obtained (refer to FIG. 3D).

Alternatively, only the insulating layers 318 a to 318 d may be removed, so that processed layers 322 a, 322 b, 322 c, and 322 d formed of stacked layer structures of the light absorptions layers 316 a to 316 d and the layers to be processed 320 a to 320 d can be formed (refer to FIG. 3E). For example, the light absorption layers 316 a to 316 d (light absorption layer 304) and the layers to be processed 320 a to 320 d (layer to be processed 302) are formed using a conductive material, so that conductive layers (layers to be processed) having a stacked layer structure can be formed. In order to remove only the insulating layers 318 a to 318 d, etching may be performed under conditions where a selection ratio of the etching rate of the insulating layers 318 a to 318 d to the etching rate of the light absorption layers 316 a to 316 d is high.

By employing the present invention, a layer having a desired pattern shape can be formed without using a lithography process using a photoresist. Therefore, a lithography process can be simplified, and the throughput can be improved.

In addition, with the use of a linear laser beam or a planar laser beam having a large area such as a rectangular laser beam or a circular laser beam, a plurality of regions can be irradiated with a laser beam in a short time. Therefore, by applying the present invention to a large substrate, a lot of patterns can be formed in a short time, whereby mass productivity can be improved.

Embodiment Mode 4

In this embodiment mode, one mode of a method for manufacturing layers such as a conductive layer and a semiconductor layer, which is different from that of Embodiment Mode 1, will be described with reference to FIGS. 20A to 20D.

First, a substrate 2000 over which a light absorption layer 2002 and an insulating layer 2004 are stacked is prepared. Then, the insulating layer 2004 side of the substrate 2000 is irradiated with a laser beam 2006 through a photomask 2008 (refer to FIG. 20A).

A glass substrate, a quartz substrate, a sapphire substrate, a ceramic substrate, a semiconductor substrate, or the like is used for the substrate 2000. It is to be noted that a base insulating layer may be formed over the substrate 2000. In such a case, the base insulating layer may be formed using an insulating material such as silicon oxide, silicon nitride, silicon oxynitride, or silicon nitride oxide.

The light absorption layer 2002 is formed using a conductive material which can absorb the laser beam 2006. For example, the light absorption layer 2002 is formed using a conductive material, a semiconductor material, or an insulating material. Specifically, the light absorption layer 2002 is formed by an evaporation method, a sputtering method, a CVD method, or the like using a conductive material such as an element, e.g. chromium (Cr), molybdenum (Mo), nickel (Ni), titanium (Ti), cobalt (Co), copper (Cu), or aluminum (Al), or an alloy material or a compound (such as a nitrogen compound, an oxygen compound, a carbon compound, or a halogen compound) containing the element as its main component. In addition, as the light absorption layer 2002, a semiconductor material such as silicon, germanium, silicon-germanium, molybdenum oxide, tin oxide, bismuth oxide, vanadium oxide, nickel oxide, zinc oxide, gallium arsenide, gallium nitride, indium oxide, indium phosphide, indium nitride, cadmium sulfide, cadmium telluride, or strontium titanate; an organic resin material such as polyimide, acrylic, polyamide, polyimide amide, resist, or benzocyclobutene; or an insulating material such as siloxane or polysilazane can also be used. Further, zinc sulfide, silicon nitride, mercury sulfide, aluminum chloride, or the like can also be used. When the light absorption layer 2002 is formed using an insulating material, a coating method may be used. Furthermore, the light absorption layer 2002 may have either a single layer structure or a stacked layer structure.

The insulating layer 2004 is formed using a material which can transmit a laser beam. For example, a light-transmitting inorganic insulating material or organic insulating material, or the like can be used. As the inorganic insulating material, silicon oxide, silicon nitride, silicon oxynitride, silicon nitride oxide, or the like can be used. As the organic insulating material, an organic resin such as polyimide, acrylic, polyamide, polyimide amide, benzocyclobutene, or an epoxy resin can be used. The insulating layer 2004 can be formed by a sputtering method, a CVD method, a coating method, or the like using the above materials with a single layer structure or a stacked layer structure.

In the photomask 2008, a light-transmitting region 2010 and a light-blocking region 2012 form a desired pattern. The laser beam 2006 is transmitted through the light-transmitting region 2010 and blocked in the light-blocking region 2012. For example, the photomask 2008 is formed of a substrate obtained by forming a desired pattern using a light-blocking material on a surface of a light-transmitting substrate. It is to be noted that a material forming the light-blocking region 2012 needs to be favorable in light-blocking property and resistant to energy of the laser beam 2006. For example, in the case where an excimer laser is used, tungsten, molybdenum, or aluminum can be used.

As the laser beam 2006, a laser beam which has such energy that can be absorbed by the light absorption layer 2002 may be appropriately selected. Typically, a laser beam of an ultraviolet region, a visible region, or an infrared region may be appropriately selected.

A cross-sectional shape of the laser beam 2006 may be a circular shape, an elliptic shape, a rectangular shape, or a linear shape (in a strict sense, a narrow rectangular shape) as appropriate, and the laser beam 2006 is preferably shaped to have such a cross-sectional shape by an optical system. In addition, energy of the laser beam 2006 preferably has such a level that can cause a gas in the light absorption layer 2002 to be discharged or the light absorption layer 2002 to be evaporated.

The laser beam 2006 which has reached the surface of the insulating layer 2004 is transmitted through the insulating layer 2004 and absorbed by the light absorption layer 2002. The light absorption layer 2002 is subjected to laser ablation in an irradiated region with the laser beam 2006, a part of the insulating layer 2004 in the irradiated region is removed, and insulating layers 2016 a, 2016 b, 2016 c, and 2016 d are left (refer to FIG. 20B). A pattern formed of the left insulating layers 2016 a to 2016 d corresponds to a pattern formed in the photomask 2008, specifically, a pattern formed of the light-blocking region 2012.

In the laser ablation caused here, an irradiated region of the light absorption layer 2002 is evaporated by energy of the laser beam 2006 absorbed by the light absorption layer 2002, and a part of the insulating layer 2004 in the irradiated region is removed (or scattered).

Next, with the insulating layers 2016 a to 2016 d as masks, the light absorption layer 2002 is etched, and light absorption layers 2018 a, 2018 b, 2018 c, and 2018 d are formed (refer to FIG. 20C). The light absorption layers 2018 a to 2018 d correspond to the pattern formed in the photomask 2008.

The light absorption layer 2002 may be etched by anisotropic etching or isotropic etching using a wet etching method or a dry etching method.

This embodiment mode explains the case where only the insulating layer 2004 is removed by laser ablation and the left light absorption layer 2002 is etched, but the present invention is not limited thereto. For example, conditions such as the energy of the laser beam 2006 and the material forming the light absorption layer 2002 are appropriately selected to also remove the irradiated region of the light absorption layer 2002.

It is to be noted that an influence of the laser ablation on the irradiated region of the light absorption layer 2002 is a concern; however, the irradiated region is removed by etching, and there are no particular problems.

Next, the insulating layers 2016 a to 2016 d are removed, and the light absorption layers 2018 a to 2018 d can be obtained. The light absorption layers 2018 a to 2018 d form a pattern corresponding to the photomask 2008.

The insulating layers 2016 a to 2016 d may be removed by a method for removing the layers by etching utilizing a dry etching method or a wet etching method, or a method for removing the layers by laser ablation through laser beam irradiation.

When the light absorption layers 2018 a to 2018 d are formed using a conductive material, a conductive layer which functions as a wiring, an electrode, or the like can be formed. In addition, when the light absorption layers 2018 a to 2018 d are formed using a semiconductor material, a semiconductor layer which forms a channel can be formed. Besides, a conductive layer formed over a wiring board or a conductive layer functioning as an antenna used for an RF tag or the like can also be formed.

In this embodiment mode, the light absorption layer can be used as a conductive layer or a semiconductor layer as it is; therefore, the process can be more simplified.

By employing the present invention, a layer having a desired pattern shape can be formed without using a lithography process using a photoresist. Therefore, a lithography process can be simplified, and the throughput can be improved.

In addition, with the use of a linear laser beam or a planar laser beam having a large area such as a rectangular laser beam or a circular laser beam, a plurality of regions can be irradiated with a laser beam in a short time. Therefore, by applying the present invention to a large substrate, a lot of patterns can be formed in a short time, whereby mass productivity can be improved.

Embodiment Mode 5

In this embodiment mode, a structural example of a laser irradiation apparatus which is used in employing the present invention will be described.

FIG. 36 is a schematic diagram of a laser irradiation apparatus. In FIG. 36, a laser irradiation apparatus 700 includes a laser oscillation device 702; a first optical system 704, which shapes a laser beam; a second optical system 706, which homogenizes a laser beam; a mask holder 720; a third optical system 710; and a stage 712. A photomask 708 is provided in the mask holder 720. A substrate 714 is provided on the stage 712.

A laser beam obtained by being emitted from an oscillator of the laser oscillation device 702 is shaped by passing through the first optical system 704. The shaped laser beam is homogenized by passing through the second optical system 706. Then, the shaped and homogenized laser beam passes through the photomask 708, it is reduced in size to a desired magnification in the third optical system 710, and an image of a pattern is formed on the substrate 714 held on the stage 712.

The laser oscillation device 702 includes a laser oscillator with high output. For example, an excimer laser oscillator, a gas laser oscillator, a solid state laser oscillator, a semiconductor laser oscillator, or the like is included. A laser oscillator which can produce a continuous wave laser beam or a pulsed laser beam can be appropriately used. Specifically, the laser oscillator exemplified in Embodiment Mode 1 or the like can be used.

The first optical system 704 is an optical system for shaping a laser beam obtained from the laser oscillation device 702 into a desired shape. Specifically, a cross-sectional shape of the laser beam is formed into a planar shape such as a circular shape, an elliptic shape, or a rectangular shape; a linear shape (in a strict sense, a narrow rectangular shape); or the like. For example, the beam diameter of the laser beam is preferably adjusted using an expander or the like for the first optical system 704. Further, a polarizer, which aligns a polarization direction of a laser beam; an attenuator, which adjusts energy of a laser beam; a spectrometer; or the like may be used.

The second optical system 706 is an optical system for homogenizing energy distributions of the laser beam shaped by the first optical system 704. Specifically, the second optical system 706 homogenizes energy distributions of the laser beam, with which the photomask 708 is irradiated. For example, using a homogenizer or the like, energy distributions of the laser beam may be homogenized. Further, in order to efficiently irradiate the photomask 708 with the laser beam, a field lens or the like may be provided between a homogenizer and the photomask 708 so that the laser beam may be condensed.

The photomask 708 is a mask used when applying the present invention and corresponds to the photomask used in Embodiment Modes 1 to 4. That is, in the photomask 708, a desired pattern is formed of a light-transmitting region and a light-blocking region. For the light-blocking region, a material which is favorable in light-blocking property and resistant to energy of the laser beam used for irradiation is used. For the light-transmitting region, a light-transmitting material may be used, or a slit may be provided there.

The third optical system 710 is an optical system for reducing the laser beam in size which is patterned by passing through the photomask 708. Since the laser beam is transmitted through only the light-transmitting region of the photomask 708, the laser beam transmitted through the photomask 708 corresponds to a pattern formed of the light-transmitting region. The third optical system 710 is an optical system which reduces the laser beam in size while maintaining the pattern shape of the laser beam formed by the photomask 708 and forms an image on the substrate 714. For example, a reducing glass, which reduces a laser beam to a size of ⅕, 1/10, or the like of the original size may be used.

As the substrate 714, as described in Embodiment Modes 1 to 4, a substrate, over which at least a light absorption layer and an insulating layer are stacked, is used. A material and the like of the light absorption layer and the insulating layer are based on Embodiment Modes 1 to 4. A material which absorbs energy of a laser beam is used for the light absorption layer. A material which transmits a laser beam is used for the insulating layer. Various layers (e.g. a layer to be processed such as a semiconductor layer or a conductive layer) may be provided between the light absorption layer and the substrate. The substrate 714 is held on the stage 712 and can move in XYZθ directions.

The laser irradiation apparatus 700 may be provided with a light receiving element 716 for monitoring whether the photomask 708 is uniformly irradiated with a laser beam and controlling the uniformity. Further, a light receiving element 718 may be provided as an autofocus mechanism for focusing the laser beam on the substrate. As the light receiving elements 716 and 718, a CCD camera or the like may be used.

Further, a mirror or the like may be appropriately provided for the laser irradiation apparatus 700, so that a traveling direction of the laser beam may be controlled.

One feature of the present invention is to form a mask for forming a pattern of a layer such as a semiconductor layer, a wiring layer, or an electrode layer by utilizing laser ablation. By using the laser irradiation apparatus described in this embodiment mode, a mask having a finer pattern shape can be manufactured.

Further, when a laser beam is processed into a linear laser beam or a planar laser beam having a large area such as a rectangular laser beam or a circular laser beam using an optical system, a plurality of regions can be irradiated with a laser beam in a short time. Accordingly, a lot of patterns can be formed over a large substrate in a short time, whereby mass productivity can be improved.

This embodiment mode can be appropriately combined with Embodiment Modes 1 to 4.

Embodiment Mode 6

In this embodiment mode, a method for manufacturing an inverted staggered transistor using the present invention will be described with reference to FIGS. 5, 6A to 6C, 7A to 7C, and 8A to 8C.

First, one mode of an inverted staggered transistor manufactured by employing the present invention is shown in FIG. 5. The transistor shown in FIG. 5 is provided with a conductive layer 504 functioning as a gate electrode over a substrate 500 with a base insulating layer 502 interposed therebetween. Over the conductive layer 504, a semiconductor layer 508 and semiconductor layers 510 a and 510 b each having one conductivity type are provided with a gate insulating layer 506 interposed therebetween. The semiconductor layers 510 a and 510 b each having one conductivity type are separated from each other. Further, over the semiconductor layers 510 a and 510 b, conductive layers 512 a and 512 b, each of which functions as a source electrode or a drain electrode, are provided. The conductive layers 512 a and 512 b are separated from each other. The conductive layer 512 a is provided in contact with the semiconductor layer 510 a, and the conductive layer 512 b is provided in contact with the semiconductor layer 510 b. A specific manufacturing method will be described below.

The base insulating layer 502 is formed over the substrate 500, and a conductive layer 503 is formed over the base insulating layer 502 (refer to FIG. 6A). As the substrate 500, a glass substrate of barium borosilicate glass, aluminoborosilicate glass, or the like; a quartz substrate; a sapphire substrate; a ceramic substrate; or a plastic substrate having heat resistance which can withstand processing temperature in the present manufacturing process is used. Further, in order to planarize the surface of the substrate 500, the substrate may be polished by a CMP method or the like.

The base insulating layer 502 is formed by various methods such as a CVD method, a sputtering method, and a spin coating method using an insulating material such as silicon oxide, silicon nitride, silicon oxynitride, or silicon nitride oxide with a single layer structure or a stacked layer structure. It is not always necessary to form the base insulating layer 502, but it has an effect of blocking a contamination substance from the substrate 500.

The conductive layer 503 may be formed of an element such as Ag, Au, Ni, Pt, Pd, Ir, Rh, Ta, W, Ti, Mo, Al, or Cu or an alloy material or a compound material containing the above element as its main component. Alternatively, a semiconductor material typified by polycrystalline silicon doped with an impurity element such as phosphorus, or an AgPdCu alloy may be used. Either a single layer structure or a stacked layer structure may be used. For example, a two-layer structure of a tungsten nitride film and a molybdenum (Mo) film or a three-layer structure in which a tungsten film having a thickness of 50 nm, an alloy film of aluminum and silicon (Al—Si) having a thickness of 500 nm, and a titanium nitride film having a thickness of 30 nm are sequentially stacked may be used. Further, in the case of the three-layer structure, tungsten nitride may be used instead of tungsten for a first conductive layer, an alloy film of aluminum and titanium (Al—Ti) may be used instead of the alloy film of aluminum and silicon (Al—Si) for a second conductive layer, and a titanium film may be used instead of the titanium nitride film for a third conductive layer.

The conductive layer 503 is formed by a sputtering method, a physical vapor deposition (PVD) method, a chemical vapor deposition (CVD) method such as a low pressure CVD (LPCVD) method or a plasma CVD method, or the like.

A light absorption layer 550 is formed over the conductive layer 503, and an insulating layer 552 is formed over the light absorption layer 550. Then, the insulating layer 552 side of the substrate 500 is irradiated with a laser beam 560 through a photomask 554 for laser ablation. The laser beam 560 is transmitted through a light-transmitting region 556 of the photomask 554 and is blocked in a light-blocking region 558 of the photomask 554 (refer to FIG. 6A).

The light absorption layer 550 is formed using a material which can absorb a laser beam. For example, the light absorption layer 550 can be formed using a conductive material, a semiconductor material, or an insulating material. Specifically, a conductive material such as any element of chromium (Cr), molybdenum (Mo), nickel (Ni), titanium (Ti), cobalt (Co), copper (Cu), and aluminum (Al); or an alloy material or a compound (nitrogen compound, oxygen compound, carbon compound, halogen compound, or the like) containing the element as its main component may be used. Alternatively, a semiconductor material such as silicon, germanium, silicon germanium, molybdenum oxide, tin oxide, bismuth oxide, vanadium oxide, nickel oxide, zinc oxide, gallium arsenide, gallium nitride, indium oxide, indium phosphide, indium nitride, cadmium sulfide, cadmium telluride, or strontium titanate can be used. Further alternatively, an organic resin material such as polyimide, acrylic, polyamide, polyimideamide, resist, or benzocyclobutene; or an insulating material such as siloxane or polysilazane can be used. Further, zinc sulfide, silicon nitride, mercury sulfide, aluminum chloride, or the like can be used. The light absorption layer 550 may have either a single layer structure or a stacked structure, and for example, a chromium (Cr) film, zinc oxide film, or aluminum nitride film having a thickness of 20 nm can be used.

The light absorption layer 550 is formed by an evaporation method, a sputtering method, a CVD method, or the like. In the case where the light absorption layer 550 is formed using an insulating material, it can be formed by a coating method. Further, hydrogen or an inert gas (rare gas such as helium (He), argon (Ar), krypton (Kr), neon (Ne), or xenon (Xe)) can be added to the light absorption layer 550.

The insulating layer 552 is formed using a material which can transmit a laser beam. For example, a light-transmitting inorganic insulating material such as silicon oxide, silicon nitride, silicon oxynitride, or silicon nitride oxide, or an organic insulating material such as polyimide, acrylic, polyamide, polyimide amide, benzocyclobutene, or an epoxy resin can be used. The insulating layer 552 may have a single layer structure or a stacked layer structure. The insulating layer 552 can be formed by various methods such as a sputtering method, a CVD method, and a spin-coating method.

The photomask 554 includes the light-transmitting region 556 which transmits the laser beam 560 and the light-blocking region 558 which blocks the laser beam 560, and the light-transmitting region 556 and the light-blocking region 558 form a desired pattern. In more detail, the conductive layer 503 is processed correspondingly to a pattern of the light-blocking region 558 and part of the conductive layer 503 is left. For the photomask 554, a substrate obtained by forming a pattern using a light-blocking material on a surface of a light-transmitting substrate, may be used, for example. It is to be noted that the light-blocking region 558 included in the photomask 554 is formed of a material favorable in light-blocking property and resistant to energy of the laser beam 560.

For the laser beam 560, a laser beam having such energy that can be absorbed by the light absorption layer 550 is appropriately selected. Typically, a laser beam of an ultraviolet region, a visible region, or an infrared region can be appropriately selected for irradiation.

As a laser oscillator which can produce the laser beam 560, the following can be used: an excimer laser such as a KrF, ArF, or XeCl laser; a gas laser such as a He, He—Cd, Ar, He—Ne, or HF laser; a solid-state laser using, as a medium, single crystalline YAG, YVO4, forsterite (Mg2SiO4), YAlO3, or GdVO4, or polycrystalline (ceramic) YAG, Y2O3, YVO4, YAlO3, or GdVO4, which is doped with one or more of Nd, Yb, Cr, Ti, Ho, Er, Tm, and Ta as a dopant; or a semiconductor laser such as a GaN, GaAs, GaAlAs, or InGaAsP laser. It is to be noted that in the case of using a solid-state laser, it is preferable to use a laser beam having a wave that is appropriately selected from the fundamental wave to the fifth harmonic.

For the laser beam 560, a continuous wave laser beam or a pulsed laser beam can appropriately be used. For the pulsed laser beam, a repetition rate of several tens of Hz to several KHz is usually used. Alternatively, a pulsed laser, which can emit a laser beam at a repetition rate of 10 MHz or more, that is much higher than the usual, and with a pulse width in the range of picoseconds or in the range of femtoseconds (10−15 seconds), may be used.

A cross-sectional shape of the laser beam 560 may be a circular shape, an elliptic shape, a rectangular shape, or a linear shape (in a strict sense, a narrow rectangular shape) as appropriate. The laser beam 560 is preferably processed to have such a cross-sectional shape by an optical system.

Energy of the laser beam 560 preferably has such a level that can cause a gas in the light absorption layer 550 to be discharged or the light absorption layer 550 to be evaporated.

The laser beam 560 transmitted through the photomask 554 is transmitted through the insulating layer 552 and absorbed by the light absorption layer 550. The light absorption layer 550 is subjected to laser ablation in an irradiated region with the laser beam 560, and the light absorption layer 550 as well as the insulating layer 552 stacked thereover in the irradiated region is partially removed. That is, by energy of the laser beam 560 absorbed by the light absorption layer 550, the irradiated region of the light absorption layer 550 is subjected to laser ablation, and a part of the light absorption layer 550 and a part of the insulating layer 552 in the irradiated region are removed. Accordingly, a light absorption layer 551 and an insulating layer 553 are left (refer to FIG. 6B).

After irradiation with the laser beam 560, a gas such as N2 or air may be jetted from the laser beam irradiation side, or washing with a liquid or the like that is a non-reactant such as water may be performed. Thus, by jetting a gas or washing with a liquid, dusts, residues, and the like due to ablation can be removed.

Next, part of the conductive layer 503 is etched and removed using the light absorption layer 551 and the insulating layer 553 as etching masks, so that the conductive layer 504 is formed (refer to FIG. 6C). The conductive layer 504 may be formed by anisotropic etching or isotropic etching using a dry etching method or a wet etching method appropriately.

In this embodiment mode, the conductive layer 504 is formed by isotropic etching. The formed conductive layer 504 has a tapered side surface. For the isotropic etching, a wet etching method may be employed. A solution, by which a selection ratio of the etching rate of the conductive layer 503 to the etching rate of the light absorption layer 551 and the insulating layer 553 is high, is used as an etchant. For example, an acidic solution of hydrofluoric acid, phosphoric acid, nitric acid, acetic acid, sulfuric acid, or the like or an alkaline solution of potassium hydroxide, hydrazine, ethylenediamine, or the like can be used. Further, pure water or a buffering agent may be appropriately added to the etchant.

The side surface of the conductive layer can be etched into a tapered shape by using an ICP (Inductively Coupled Plasma) etching method and appropriately adjusting the etching condition (e.g., the amount of electric power applied to a coiled electrode, the amount of electric power applied to an electrode on a substrate side, or the temperature of the electrode on the substrate side). As the etching gas, a chlorine-based gas typified by Cl2, BCl3, SiCl4, CCl4, or the like; a fluorine-based gas typified by CF4, CHF3, SF6, NF3, or the like; or O2 can be appropriately used. Further, an inert gas such as He or argon; an O2 gas; or the like may appropriately be added to the etching gas.

For example, in the case where the conductive layer 503 is formed using molybdenum, a wet etching method using an aluminum mixed acid solution can be performed. In the case where the conductive layer 503 is formed using tungsten, a wet etching method using an ammonia hydrogen peroxide mixture can be performed.

The conductive layer 504 having a perpendicular side surface (sidewall) may also be formed by anisotropic etching. The base insulating layer 502 has an effect of preventing the substrate 500 from being etched in the case of using a dry etching method.

After the conductive layer 504 having a desired shape is formed by etching, the light absorption layer 551 and the insulating layer 553 used as the masks are removed. The light absorption layer 551 and the insulating layer 553 may be removed by a method for removing the layers by etching utilizing a dry etching method or a wet etching method, or a method for removing the layers utilizing laser ablation through laser beam irradiation. In the case of utilizing laser ablation, it is preferable that dusts, residues, and the like due to ablation be removed by jetting a gas such as N2 or washing with a liquid.

Without using the method of forming a mask by utilizing laser ablation as described in Embodiment Mode 1 or the like, the conductive layer 504 may be formed by various printing methods (a method by which a desired pattern is formed, such as screen (mimeograph) printing, offset (planographic) printing, relief printing, or gravure (intaglio) printing), a nanoimprinting method, a droplet-discharging method, a dispenser method, a selective coating method, or the like. When using any of these methods, a conductive layer can be selectively formed in a desired place.

The conductive layer 504 may also be formed by a lithography technique that uses a photoresist.

The formed conductive layer 504 functions as a gate electrode layer of a completed transistor.

Next, the gate insulating layer 506 is formed over the conductive layer 504 (refer to FIG. 7A).

The gate insulating layer 506 is formed by a CVD method, a sputtering method, or the like using an insulating material such as silicon oxide, silicon nitride, silicon oxynitride, or silicon nitride oxide. The gate insulating layer 506 may have a single layer structure or a stacked layer structure. For example, for the gate insulating layer 506, a single layer structure of a silicon oxynitride layer or a two-layer structure of a silicon nitride layer and a silicon oxide layer may be used. Alternatively, a stacked layer structure including three or more layers may be employed. Preferably, silicon nitride, which enables a dense film, is used. In the case where the conductive layer 504 positioned in a lower layer is formed using silver or copper by a droplet-discharging method, the gate insulating layer 506 is preferably formed using silicon nitride or NiB. These films have an effect of preventing diffusion of an impurity and planarizing a surface. It is to be noted that a rare gas element such as argon may be included in a reaction gas when forming the gate insulating layer 506. When a rare gas element is included in a reaction gas, a dense insulating layer with little leakage current can be obtained at a low film formation temperature.

Then, a semiconductor layer is formed over the gate insulating layer 506 (refer to FIG. 7A). In this embodiment mode, a stacked layer structure of a semiconductor layer 507 and a semiconductor layer 509 having one conductivity type is formed. The semiconductor layer 509 having one conductivity type may be formed according to need. It is preferable to form the semiconductor layer 509 having one conductivity type because favorable ohmic contact between the semiconductor layer forming a channel and a conductive layer functioning as a source electrode or a drain electrode can be obtained.

For example, an NMOS structure of an n-channel transistor can be manufactured by forming the semiconductor layer 509 having n-type conductivity over the semiconductor layer 507, or a PMOS structure of a p-channel transistor can be manufactured by forming the semiconductor layer 509 having p-type conductivity over the semiconductor layer 507. When an element imparting a conductivity type is added to the semiconductor layer 507 by doping to form an impurity region, an n-channel transistor or a p-channel transistor can be formed. Instead of forming the semiconductor layer 509 having n-type conductivity, plasma treatment with a PH3 gas may be performed, so that a conductivity type may be imparted to the semiconductor layer 507.

A material for forming the semiconductor layer can be an amorphous semiconductor (hereinafter also referred to as “AS”) formed by a vapor deposition method using a semiconductor source gas typified by silane or germane or a sputtering method, a polycrystalline semiconductor formed by crystallizing the amorphous semiconductor using light energy or thermal energy, a semi-amorphous semiconductor (also referred to as microcrystal and hereinafter also referred to as “SAS”), or the like. The semiconductor layer can be formed by various methods (a sputtering method, an LPCVD method, a plasma CVD method, and the like).

An SAS is a semiconductor having an intermediate structure between amorphous and crystalline (including single crystalline and polycrystalline) structures and a third state which is stable in terms of free energy. Moreover, an SAS includes a crystalline region with a short-distance order and lattice distortion. A crystal region having a diameter of 0.5 nm to 20 nm can be observed at least in a portion of the film. In the case where silicon is contained as a main component, Raman spectrum is shifted to the low wave number side that is lower than 520 cm−1. The diffraction peaks of (111) and (220), which are believed to be derived from silicon crystal lattice, are observed by X-ray diffraction. An SAS contains hydrogen or halogen by at least 1 atomic % or more for terminating dangling bonds. An SAS is formed by glow discharge decomposition (plasma CVD) of a gas containing silicon. As the gas containing silicon, SiH4 can be used, and alternatively, Si2H6, SiH2Cl2, SiHCl3, SiCl4, SiF4, or the like can also be used. Further, F2 or GeF4 may be mixed. The gas containing silicon may be diluted with H2, or H2 and one or a plurality of kinds of rare gas elements of He, Ar, Kr, and Ne. The dilution ratio is 1:2 to 1:1000, pressure is approximately 0.1 to 133 Pa, and a power source frequency is 1 to 120 MHz, preferably, 13 to 60 MHz. Temperature for heating the substrate is preferably less than or equal to 300° C., and an SAS can also be formed at 100 to 200° C. It is preferable that the concentration of impurities of atmospheric components such as oxygen, nitrogen, and carbon as impurity elements entering the film in deposition be less than or equal to 1×1020 cm−3. In particular, an oxygen concentration is preferably less than or equal to 5×1019 cm−3, and more preferably, less than or equal to 1×1019 cm−3. Further, when a rare gas element such as helium, argon, krypton, or neon is contained to further promote the lattice distortion, stability can be enhanced, and a favorable SAS can be obtained. Further, as the semiconductor layer, an SAS layer formed by using a hydrogen-based gas may be stacked over an SAS layer formed by using a fluorine-based gas.

As an example of a typical amorphous semiconductor, hydrogenated amorphous silicon can be given while polysilicon or the like can be given as an example of a typical crystalline semiconductor. Polysilicon (polycrystalline silicon) includes so-called high-temperature polysilicon formed using polysilicon which is formed at processing temperatures of greater than or equal to 800° C. as a main material, so-called low-temperature polysilicon formed using polysilicon which is formed at processing temperatures of less than or equal to 600° C. as a main material, polysilicon crystallized by being doped with an element which promotes crystallization or the like, and the like. Of course, as described above, a semi-amorphous semiconductor or a semiconductor which includes a crystalline phase in a portion of the film can also be used.

When a crystalline semiconductor such as a polycrystalline semiconductor or a semi-amorphous semiconductor is used for the semiconductor layer, the semiconductor layer may be formed by various methods such as a laser crystallization method, a thermal crystallization method, and a thermal crystallization method using an element such as nickel which promotes crystallization. Further, a microcrystalline semiconductor that is an SAS may be crystallized by laser irradiation to enhance crystallinity. In the case where silicon is used and an element which promotes crystallization is not added, before the amorphous silicon layer is irradiated with a laser beam, the amorphous silicon layer is heated at 500° C. for one hour in a nitrogen atmosphere to discharge hydrogen so that a hydrogen concentration in the amorphous silicon layer becomes less than or equal to 1×1020 atoms/cm3. This is because, if the amorphous silicon layer contains much hydrogen, the amorphous silicon layer may be broken by laser beam irradiation.

A method for introducing a metal element into the amorphous semiconductor layer is not particularly limited as long as it is a method for introducing the metal element to a surface or inside of the amorphous semiconductor layer. For example, a sputtering method, a CVD method, a plasma treatment method (including a plasma CVD method), an adsorption method, or a method for applying a solution of metal salt can be used. Among them, a method using a solution is simple and advantageous in that the concentration of the metal element can be easily controlled. At this time, it is desirable to form an oxide film on the surface of the amorphous semiconductor layer by UV light irradiation in an oxygen atmosphere, a thermal oxidation method, treatment with ozone water containing hydroxyl radical or a hydrogen peroxide solution, or the like to improve wettability of the surface of the amorphous semiconductor layer so that an aqueous solution can be diffused on the entire surface of the amorphous semiconductor layer.

In order to crystallize the amorphous semiconductor layer, heat treatment may be combined with crystallization by laser beam irradiation, or one of heat treatment and laser beam irradiation may be carried out multiple times.

Moreover, the crystalline semiconductor layer may be directly formed over the substrate by a plasma method. Furthermore, the crystalline semiconductor layer may be selectively formed over the substrate by a linear plasma method.

The semiconductor layer 507 can be formed of an organic semiconductor material. As the organic semiconductor material, a low-molecular material, a high-molecular material, or the like can be used. In addition, a material such as a conductive high-molecular material can also be used. For example, a π-electron conjugated high-molecular material of which skeletal structure includes a conjugated double bond can be used, and specifically, polythiophene, polyfluorene, poly(3-alkylthiophene), a polythiophene derivative, or a soluble high-molecular material can be used. In addition, as the organic semiconductor material, there is a material which can form a semiconductor layer by forming a soluble precursor of the material and then performing a process thereon. As the organic semiconductor material, polythienylenevinylene, poly(2,5-thienylenevinylene), polyacetylene, a polyacetylene derivative, polyallylenevinylene, and the like can be used.

The precursor is changed into the organic semiconductor not only by heat treatment but also by addition of a reaction catalyst such as a hydrogen chloride gas. Moreover, as a typical solvent for dissolving the soluble organic semiconductor material, toluene, xylene, chlorobenzene, dichlorobenzene, anisole, chloroform, dichloromethane, γbutyllactone, butylcellosolve, cyclohexane, N-methyl-2-pyrrolidone (NMP), cyclohexanone, 2-butanon, dioxane, dimethylformamide (DMF), tetrahydrofuran (THF), or the like can be used.

In this embodiment mode, amorphous semiconductor layers are formed for the semiconductor layer 507 and the semiconductor layer 509 having one conductivity type. As the semiconductor layer 509 having one conductivity type, an n-type semiconductor layer, which contains phosphorus (P) that is an impurity element imparting n-type conductivity, is formed. The semiconductor layer 509 having one conductivity type functions as a source region and a drain region, and favorable ohmic contact between the semiconductor layer 507 and the conductive layer functioning as a source electrode or a drain electrode can be obtained because of the semiconductor layer 509. The semiconductor layer 509 having one conductivity type may be formed according to need, and an n-type semiconductor layer containing an impurity element imparting n-type conductivity (P, As) or a p-type semiconductor layer containing an impurity element imparting p-type conductivity (B) can be formed.

Next, a light absorption layer 562 and an insulating layer 564 are stacked over the semiconductor layer 509. Then, the side where the semiconductor layer 509 and the like are provided, of the substrate 500 is irradiated with a laser beam 572 through a photomask 566. The laser beam 572 is transmitted through a light-transmitting region 568 of the photomask 566 and blocked in a light-blocking region 570 (refer to FIG. 7A).

The light absorption layer 562 and the insulating layer 564 may be formed similarly to the above-described light absorption layer 550 and insulating layer 552.

The photomask 566 includes the light-transmitting region 568 which transmits the laser beam 572 and the light-blocking region 570 which blocks the laser beam 572, and the light-transmitting region 568 and the light-blocking region 570 form a desired pattern. The semiconductor layer 507 and the semiconductor layer 509 having one conductivity type are processed correspondingly to a pattern formed in the photomask 566, specifically, a pattern of the light-blocking region 570, and the semiconductor layers are partially left. For the photomask 566, a substrate obtained by forming a pattern using a light-blocking material on a surface of a light-transmitting substrate, may be used. Of course, similarly to the photomask 554, the light-blocking region 570 included in the photomask 566 is formed of a material favorable in light-blocking property and resistant to energy of the laser beam 572.

For the laser beam 572, a laser beam having such energy that can be absorbed by the light absorption layer 562 is appropriately selected, similarly to the above-described laser beam 560. Energy of the laser beam 572 preferably has such a level that can cause a gas in the light absorption layer 562 to be discharged or the light absorption layer 562 to be evaporated.

The laser beam 572 transmitted through the photomask 566 is transmitted through the insulating layer 564 and absorbed by the light absorption layer 562. The light absorption layer 562 is subjected to laser ablation in an irradiated region with the laser beam 572, and a part of the light absorption layer 562 as well as a part of the insulating layer 564 stacked thereover in the irradiated region is removed. That is, by energy of the laser beam 572 absorbed by the light absorption layer 562, the irradiated region of the light absorption layer 562 is subjected to laser ablation, and the part of the light absorption layer 562 and the part of the insulating layer 564 in the irradiated region are removed. Thus, a light absorption layer 563 and an insulating layer 565 are left (refer to FIG. 7B). After irradiation with the laser beam 572, a gas such as N2 may be jetted, or washing with a liquid may be performed. Thus, dusts, residues, and the like due to ablation can be reduced.

Next, the semiconductor layer 509 having one conductivity type and the semiconductor layer 507 are partially etched and removed using the light absorption layer 563 and the insulating layer 565 as masks, so that a semiconductor layer 505 having one conductivity type and the semiconductor layer 508 are formed. The semiconductor layer 505 having one conductivity type and the semiconductor layer 508 may be formed by anisotropic etching or isotropic etching using a dry etching method or a wet etching method appropriately.

In this embodiment mode, the semiconductor layer 505 and the semiconductor layer 508 are formed by anisotropic etching. The semiconductor layer 505 and the semiconductor layer 508 each have a perpendicular side surface. For anisotropic etching, dry etching may be performed using a chlorine-based gas typified by Cl2, BCl3, SiCl4, CCl4, or the like; a fluorine-based gas typified by CF4, CHF3, SF6, NF3, or the like; O2; or the like.

After forming the semiconductor layer 505 and the semiconductor layer 508 each having a desired shape, the light absorption layer 563 and the insulating layer 565 used as the masks are removed (refer to FIG. 7C).

The light absorption layer 563 and the insulating layer 565 may be removed by a method for removing the layers utilizing a dry etching method or a wet etching method, or a method for removing the layers utilizing laser ablation through laser beam irradiation. In the case of utilizing laser ablation, dusts, residues, and the like due to ablation can be reduced by jetting a gas such as N2 or washing with a liquid.

Without using the method described in Embodiment Mode 1 or the like, the semiconductor layer 505 or the semiconductor layer 508 may be formed by various printing methods (a method by which a desired pattern is formed, such as screen (mimeograph) printing, offset (planographic) printing, relief printing, or gravure (intaglio) printing), a nanoimprinting method, a droplet-discharging method, a dispenser method, a selective coating method, or the like. When using any of these methods, the semiconductor layer can be selectively formed in a desired place.

The semiconductor layer 505 or the semiconductor layer 508 may also be formed by a lithography technique that uses a photoresist.

The semiconductor layer 508 forms a channel of a completed transistor. Further, the semiconductor layer 505 forms a source region and a drain region of the completed transistor.

Then, a conductive layer 511 is formed over the semiconductor layer 505 (refer to FIG. 8A). Part of the conductive layer 511 functions as a source electrode or a drain electrode of the completed transistor.

For the conductive layer 511, an element such as silver (Ag), gold (Au), copper (Cu), tungsten (W), aluminum (Al), molybdenum (Mo), tantalum (Ta), or titanium (Ti); an alloy material or a compound material containing the element as its main component; or the like can be used. Further, light-transmitting indium tin oxide (ITO), indium tin oxide containing silicon oxide, organic indium, organic tin, zinc oxide, titanium nitride, or the like may be combined. Further, the conductive layer 511 may have either a single layer structure or a stacked layer structure.

The conductive layer 511 can be formed by a sputtering method, a physical vapor deposition (PVD) method, a chemical vapor deposition (CVD) method such as a low pressure CVD (LPCVD) method or a plasma CVD method, or the like.

Next, a light absorption layer 574 and an insulating layer 576 are stacked over the conductive layer 511. Then, the insulating layer 576 side of the substrate 500 is irradiated with a laser beam 584 through a photomask 578. The laser beam 584 is transmitted through a light-transmitting region 580 of the photomask 578 and blocked in a light-blocking region 582 (refer to FIG. 8A).

The light absorption layer 574 and the insulating layer 576 may be formed similarly to the above-described light absorption layers 550 and 562 and the insulating layers 552 and 564.

The photomask 578 includes the light-transmitting region 580 which transmits the laser beam 584 and the light-blocking region 582 which blocks the laser beam 584, and the light-transmitting region 580 and the light-blocking region 582 form a desired pattern. In more detail, the conductive layer 511 is processed correspondingly to a pattern of the light-blocking region 582 and part of the layer is left. For the photomask 578, a substrate obtained by forming a pattern using a light-blocking material on a surface of a light-transmitting substrate, may be used. Of course, the light-blocking region 582 for forming the photomask 578 is formed of a material favorable in light-blocking property and resistant to energy of the laser beam 584, similarly to the photomasks 554 and 566.

For the laser beam 584, a laser beam having such energy that can be absorbed by the light absorption layer 574 is appropriately selected, similarly to the above-described laser beams 560 and 572. Energy of the laser beam 584 preferably has such a level that can cause a gas in the light absorption layer 574 to be discharged or the light absorption layer 574 to be evaporated.

The laser beam 584 transmitted through the photomask 578 is transmitted through the insulating layer 576 and absorbed by the light absorption layer 574. The light absorption layer 574 is subjected to laser ablation, and a part of the light absorption layer 574 as well as a part of the insulating layer 576 stacked thereover in the irradiated region is removed. That is, by energy of the laser beam 584 absorbed by the light absorption layer 574, the irradiated region of the light absorption layer 574 is subjected to laser ablation, and the part of the light absorption layer 574 and the part of the insulating layer 576 in the irradiated region are removed. Thus, light absorption layers 575 a and 575 b, and insulating layers 577 a and 577 b are left (refer to FIG. 8B). After irradiation with the laser beam 584, a gas such as N2 may be jetted, or washing with a liquid may be performed. Thus, dusts, residues, and the like due to ablation can be reduced.

Next, part of the conductive layer 511 is etched and removed using the light absorption layers 575 a and 575 b and the insulating layers 577 a and 577 b as masks (refer to FIG. 8C). The semiconductor layer 511 may be formed by anisotropic etching or isotropic etching using a dry etching method or a wet etching method appropriately.

In this embodiment mode, the conductive layers 512 a and 512 b each having a perpendicular side surface are formed by anisotropic etching. For anisotropic etching, dry etching may be performed using an etching gas such as a chlorine-based gas typified by Cl2, BCl3, SiCl4, CCl4, or the like; a fluorine-based gas typified by CF4, CHF3, SF6, NF3, or the like; O2; or the like.

After the conductive layers 512 a and 512 b each having a desired shape are formed, the light absorption layers 575 a and 575 b and the insulating layers 577 a and 577 b used as the masks are removed (refer to FIG. 9A).

The light absorption layers 575 a and 575 b and the insulating layers 577 a and 577 b may be removed by a method for removing the layers utilizing a dry etching method or a wet etching method, or a method for removing the layers utilizing laser ablation through laser beam irradiation. In the case of utilizing laser ablation, dusts, residues, and the like due to laser ablation can be reduced by jetting a gas such as N2 or air or washing with a liquid.

Without using the method of forming a mask by utilizing laser ablation caused by laser beam irradiation as described in Embodiment Mode 1 or the like, the conductive layers 512 a and 512 b may be formed by various printing methods (a method by which a desired pattern is formed, such as screen (mimeograph) printing, offset (planographic) printing, relief printing, or gravure (intaglio) printing), a nanoimprinting method, a droplet-discharging method, a dispenser method, a selective coating method, or the like. When using any of these methods, the conductive layer can be selectively formed in a desired place.

The conductive layers 512 a and 512 b may also be formed by a lithography technique that uses a photoresist.

Each of the conductive layers 512 a and 512 b functions as a source region or a drain region of the completed transistor.

Further, in laser ablation by irradiation with the laser beam 584, it is also possible to remove only the insulating layer 576 over the light absorption layer 574 by appropriately selecting conditions such as a material of the light absorption layer 574 and energy of the laser beam 584. In this case, after the light absorption layer 574 and the conductive layer 511 are etched by using the insulating layers 577 a and 577 b after ablation as masks, the insulating layers 577 a and 577 b used as masks may be removed. Similarly, when ablation is performed by irradiation with the laser beam 560 or 572, it is possible to remove only the insulating layer 552 or 564 over the light absorption layer 550 or 562 by appropriately selecting conditions such as a material of the light absorption layer 550 or 562 and energy of the laser beam 560 or 572. In this case, the insulating layer after ablation is used as a mask, and the light absorption layer and the layer to be processed (electrode layer or semiconductor layer) below the insulating layer functioning as the mask are etched, whereby a desired pattern may be formed. In addition, unless any problem arises, the light absorption layer or the insulating layer can also be left.

Next, using the conductive layers 512 a and 512 b as masks, part of the semiconductor layer 505 having one conductivity type is etched and removed, so that part of the semiconductor layer 508 is exposed (refer to FIG. 9B). Etching of the semiconductor layer 505 having one conductivity type may be performed by appropriately using a dry etching method or a wet etching method. In the case of employing a dry etching method, in some cases, a portion where the semiconductor layer 508 is exposed is also slightly etched, thereby reducing the thickness thereof and the exposed portion of the semiconductor layer 508 is depressed compared to other portions of the semiconductor layer 508.

Through the above-described process, a transistor 520, that is an inverted staggered transistor (also called a bottom gate transistor), can be manufactured (refer to FIG. 9B).

Although a pattern is formed utilizing ablation by laser beam irradiation in various processes in this embodiment mode, the present invention is not limited thereto and a lithography technique using a photoresist may also be used. Of course, other techniques by which a pattern can be selectively formed may be used. The present invention has a feature that a method in which a mask is formed utilizing ablation by laser beam irradiation and a desired pattern is obtained by etching using the mask is used in at least one manufacturing process.

By employing the present invention, a transistor can be manufactured with the reduced number of lithography processes using a photoresist. Accordingly, a lithography process can be simplified, and the throughput can be improved.

In addition, by employing the present invention, contamination due to an impurity included in a photoresist can be prevented and deterioration in characteristics of a transistor can be prevented. Accordingly, a highly reliable semiconductor device can be obtained.

Further, with the use of a linear laser beam or a planar laser beam having a large area such as a rectangular laser beam or a circular laser beam, a plurality of regions can be irradiated with a laser beam in a short time. Accordingly, by applying the present invention to a large substrate, a lot of patterns can be formed in a short time, and a semiconductor device can be manufactured with high productivity.

This embodiment mode can be appropriately combined with Embodiment Modes 1 to 5.

Embodiment Mode 7

In this embodiment mode, a method for manufacturing an inverted staggered transistor, which is different from that of Embodiment Mode 6, will be described with reference to FIGS. 21A to 21C and 22A to 22D. It is to be noted that the same structures as in Embodiment Mode 6 are denoted by the same reference numerals, and explanation thereof will be partially omitted or simplified.

Over a substrate 500, a base insulating layer 502 and a conductive layer 504 are formed as shown in Embodiment Mode 6 (refer to FIG. 6C). The conductive layer 504 functions as a gate electrode.

Over the conductive layer 504, a gate insulating layer 1506, a semiconductor layer 1507, a semiconductor layer 1509 having one conductivity type, a light absorption layer 1511, and an insulating layer 1558 are sequentially stacked (refer to FIG. 21A).

The gate insulating layer 1506 may be formed similarly to the gate insulating layer 506 shown in Embodiment Mode 6. For example, the gate insulating layer 1506 may be formed by a CVD method, a sputtering method, or the like using an insulating material such as silicon oxide, silicon nitride, silicon oxynitride, or silicon nitride oxide with a single layer structure or a stacked layer structure.

The semiconductor layer 1507 and the semiconductor layer 1509 having one conductivity type may be formed similarly to the semiconductor layer 507 and the semiconductor layer 509 having one conductivity type shown in Embodiment Mode 6. For example, the semiconductor layer 1507 and the semiconductor layer 1509 having one conductivity type may be formed by a sputtering method or a CVD method using a semiconductor material such as silicon or silicon-germanium with a single layer structure or a stacked layer structure. In addition, the semiconductor layer 1507 may be an amorphous semiconductor or a crystalline semiconductor. The crystalline semiconductor can be formed by crystallizing the amorphous semiconductor by a laser crystallization method, a thermal crystallization method, a thermal crystallization method using an element which promotes crystallization such as nickel, or the like.

The semiconductor layer 1509 having one conductivity type may be formed as needed. By providing the semiconductor layer 1509 having one conductivity type, ohmic contact between the semiconductor layer 1507 forming a channel and a conductive layer functioning as a source electrode or a drain electrode can be favorable.

The light absorption layer 1511 is formed using a conductive material which can absorb a laser beam 1572. For example, the light absorption layer 1511 is formed using a conductive material, a semiconductor material, or an insulating material. Specifically, the light absorption layer 1511 is formed by an evaporation method, a sputtering method, a CVD method, or the like using a conductive material such as an element, e.g. chromium (Cr), molybdenum (Mo), nickel (Ni), titanium (Ti), cobalt (Co), copper (Cu), or aluminum (Al), or an alloy material or a compound (such as a nitrogen compound, an oxygen compound, a carbon compound, or a halogen compound) containing the element as its main component. In addition, as the light absorption layer 1511, a semiconductor material such as silicon, germanium, silicon-germanium, molybdenum oxide, tin oxide, bismuth oxide, vanadium oxide, nickel oxide, zinc oxide, gallium arsenide, gallium nitride, indium oxide, indium phosphide, indium nitride, cadmium sulfide, cadmium telluride, or strontium titanate; an organic resin material such as polyimide, acrylic, polyamide, polyimide amide, resist, or benzocyclobutene; an insulating material such as siloxane or polysilazane can be used. Further, zinc sulfide, silicon nitride, mercury sulfide, aluminum chloride, or the like can also be used. When the light absorption layer 1511 is formed using an insulating material, a coating method may be used. Furthermore, the light absorption layer 1511 may have either a single layer structure or a stacked layer structure. In this embodiment mode, part of the light absorption layer 1511 is used as a source electrode or a drain electrode of a completed transistor.

The insulating layer 1558 is formed using a material which can transmit the laser beam 1572. For example, a light-transmitting inorganic insulating material such as silicon oxide, silicon nitride, silicon oxynitride, or silicon nitride oxide, or an organic insulating material such as polyimide, acrylic, polyamide, polyimide amide, benzocyclobutene, or an epoxy resin can be used. In addition, the insulating layer 1558 may have either a single layer structure or a stacked layer structure. The insulating layer 1558 can be formed by various methods such as a sputtering method, a CVD method, and a spin coating method.

Then, the insulating layer 1558 side of the substrate 500 is irradiated with the laser beam 1572 through a photomask 1566. The laser beam 1572 is transmitted through a light-transmitting region 1568 of the photomask 1566 and blocked in a light-blocking region 1570 (refer to FIG. 21A).

The photomask 1566 includes the light-transmitting region 1568 which transmits the laser beam 1572 and the light-blocking region 1570 which blocks the laser beam 1572, and the light-transmitting region 1568 and the light-blocking region 1570 form a desired pattern. For example, the photomask 1566 is formed of an object obtained by forming a pattern using a light-blocking material on a surface of a light-transmitting substrate. It is to be noted that the light-blocking region 1570 included in the photomask 1566 is formed using a material favorable in light-blocking property and resistant to energy of the laser beam 1572.

As the laser beam 1572, a laser beam which has such energy that can be absorbed by the light absorption layer 1511 is appropriately selected. Typically, a laser beam of an ultraviolet region, a visible region, or an infrared region is appropriately selected for irradiation. Specific laser oscillators are based on those in Embodiment Mode 6.

A cross-sectional shape of the laser beam 1572 may be a circular shape, an elliptic shape, a rectangular shape, or a linear shape (in a strict sense, a narrow rectangular shape) as appropriate, and the laser beam 1572 is preferably shaped to have such a cross-sectional shape by an optical system.

In addition, energy of the laser beam 1572 preferably has such a level that can cause a gas in the light absorption layer 1511 to be discharged or the light absorption layer 1511 to be evaporated.

The laser beam 1572 which is transmitted through the photomask 1566 is transmitted through the insulating layer 1558 and absorbed by the light absorption layer 1511. The light absorption layer 1511 is subjected to laser ablation in an irradiated region with the laser beam 1572, and a part of the light absorption layer 1511 and a part of the insulating layer 1558 stacked thereover in the irradiated region are removed. In other words, due to the energy of the laser beam 1572 absorbed by the light absorption layer 1511, the part of the light absorption layer 1511 and the part of the insulating layer 1558 stacked thereover in the irradiated region with the laser beam 1572 are subjected to laser ablation and removed. Then, a light absorption layer 1513 and an insulating layer 1559 are left (refer to FIG. 21B). It is to be noted that jetting of a gas such as N2 or air or washing with a liquid may be performed after irradiation with the laser beam 1572.

With the light absorption layer 1513 and the insulating layer 1559 as masks, parts of the semiconductor layer 1509 having one conductivity type and the semiconductor layer 1507 are removed by etching, and a semiconductor layer 1510 having one conductivity type and a semiconductor layer 1508 are formed (refer to FIG. 21C). The semiconductor layer 1510 having one conductivity type and the semiconductor layer 1508 may be subjected to anisotropic etching or isotropic etching by appropriately employing a dry etching method or a wet etching method.

In this embodiment mode, anisotropic etching is performed, so that the semiconductor layer 1508 and the semiconductor layer 1510 having one conductivity type with a perpendicular side surface are formed. Anisotropic etching may be performed by dry etching using a chlorine based gas typified by Cl2, BCl3, SiCl4, or CCl4, a fluorine based gas typified by CF4, CHF3, SF6, or NF3, O2, or the like.

Depending on conditions such as energy of the laser beam 1572 and a material forming the light absorption layer 1511, the light absorption layer 1511 in the irradiated region with the laser beam 1572 may be partially or entirely left after laser ablation. In such a case, the light absorption layer 1511, the semiconductor layer 1509, and the semiconductor layer 1507 which are in a lower layer of the insulating layer 1559 may be etched with the insulating layer 1559 as a mask. Alternatively, the light absorption layer 1511 may be etched with the insulating layer 1559 as a mask, and then, the semiconductor layer 1509 and the like in the lower layer may be etched with the insulating layer 1559 and a left light absorption layer as masks.

Then, the insulating layer 1559 side of the substrate 500 is irradiated with a laser beam 1576 through a photomask 1574. The laser beam 1576 is transmitted through a light-transmitting region 1578 of the photomask 1574 and blocked in a light-blocking region 1580 (refer to FIG. 22A).

In the photomask 1574, the light-transmitting region 1578 and the light-blocking region 1580 form a desired pattern. The photomask 1574 may be formed of a substrate obtained by forming a pattern using a light-blocking material on a surface of a light-transmitting substrate. It is to be noted that the light-blocking region 1580 included in the photomask 1574 is formed using a material favorable in light-blocking property and resistant to energy of the laser beam 1576, similarly to the photomask 1566.

As the laser beam 1576, similarly to the laser beam 1572, a laser beam which has such energy that can be absorbed by the light absorption layer 1513 (light absorption layer 1511) may be appropriately selected. In addition, the energy of the laser beam 1576 preferably has such a level that can cause a gas in the light absorption layer 1513 to be discharged or the light absorption layer 1513 to be evaporated.

The laser beam 1576 which is transmitted through the photomask 1574 is transmitted through the insulating layer 1559 and absorbed by the light absorption layer 1513. The light absorption layer 1513 is subjected to laser ablation in an irradiated region with the laser beam 1576, and a part of the light absorption layer 1513 and a part of the insulating layer 1559 stacked thereover in the irradiated region are removed. In other words, due to the energy of the laser beam 1576 absorbed by the light absorption layer 1513, the part of the light absorption layer 1513 and the part of the insulating layer 1559 stacked thereover in the irradiated region with the laser beam 1576 are subjected to laser ablation and removed. Then, light absorption layers 1512 a and 1512 b, and insulating layers 1560 a and 1560 b are left (refer to FIG. 22B). The light absorption layers 1512 a and 1512 b are separated. Similarly, the insulating layers 1560 a and 1560 b are separated. Jetting of a gas such as N2 or air or washing with a liquid may be performed after irradiation with the laser beam 1576. Accordingly, dusts, residues, and the like due to ablation can be reduced.

Next, the insulating layers 1560 a and 1560 b over the light absorption layers 1512 a and 1512 b are removed (refer to FIG. 22C). The insulating layers 1560 a and 1560 b may be removed by a method for removing the layers by etching utilizing a dry etching method or a wet etching method, or a method for removing the layers by laser ablation through laser beam irradiation. When laser ablation is utilized, dusts, residues, and the like due to ablation can be more reduced by jetting a gas such as N2 or air or by performing washing with a liquid.

Next, with the light absorption layers 1512 a and 1512 b as masks, the semiconductor layer 1510 having one conductivity type is etched so that part of the semiconductor layer 1508 is exposed, and semiconductor layers 1514 a and 1514 b having one conductivity type are formed (refer to FIG. 22D). Etching may be performed by anisotropic etching or isotropic etching utilizing a dry etching method or a wet etching method.

In this embodiment mode, anisotropic etching is performed, so that the light absorption layers 1512 a and 1512 b, and the semiconductor layers 1514 a and 1514 b having a perpendicular side surface are formed. For example, anisotropic etching may be performed by dry etching using an etching gas such as a chlorine based gas typified by Cl2, BCl3, SiCl4, or CCl4, a fluorine based gas typified by CF4, CHF3, SF6, or NF3, O2, or the like. When dry etching is performed, the exposed portion of the semiconductor layer 1508 is etched to some extent, the thickness is reduced, and the exposed portion becomes depressed compared to other portions of the semiconductor layer 1508.

Next, an interlayer insulating layer 1516 is formed over the light absorption layers 1512 a and 1512 b (refer to FIG. 23A).

The insulating layer 1516 is formed by a sputtering method, a CVD method, or the like using an inorganic insulating material such as silicon oxide, silicon nitride, silicon oxynitride, or silicon nitride oxide. Alternatively, the insulating layer 1516 may be formed using an organic insulating material such as polyimide, acrylic, polyamide, polyimide amide, resist, or benzocyclobutene. It is to be noted that the insulating layer 1516 may also be stacked without removing the insulating layers 1560 a and 1560 b.

Then, the insulating layer 1516 side of the substrate 500 is irradiated with a laser beam 1584 through a photomask 1582. The laser beam 1584 is transmitted through a light-transmitting region 1586 of the photomask 1582 and blocked in a light-blocking region 1588 (refer to FIG. 23A).

In the photomask 1582, the light-transmitting region 1586 and the light-blocking region 1588 form a desired pattern. For example, the photomask 1582 is formed of a substrate obtained by forming a pattern using a light-blocking material on a surface of a light-transmitting substrate. It is to be noted that the light-blocking region 1588 included in the photomask 1582 is formed using a material favorable in light-blocking property and resistant to energy of the laser beam 1584, similarly to the photomask 1566.

As the laser beam 1584, similarly to the laser beam 1572, a laser beam which has such energy that can be absorbed by the light absorption layers 1512 a and 1512 b (light absorption layer 1513) may be appropriately selected. In addition, energy of the laser beam 1584 preferably has such a level that can cause a gas in the light absorption layers 1512 a and 1512 b to be discharged or the light absorption layers 1512 a and 1512 b to be evaporated.

The laser beam 1584 which is transmitted through the photomask 1582 is transmitted through the insulating layer 1516 and absorbed by the light absorption layers 1512 a and 1512 b. The light absorption layers 1512 a and 1512 b are subjected to laser ablation in an irradiated region with the laser beam 1584, and parts of the insulating layer 1516 in the irradiated region is removed, whereby openings 1517 a and 1517 b are formed (refer to FIG. 23B). At this time, in addition to the insulating layer 1516, the light absorption layers 1512 a and 1512 b in the irradiated region may be partially or entirely removed. In this embodiment mode, only the parts of the insulating layer 1516 is removed by laser ablation.

After irradiation with the laser beam 1584, jetting of a gas such as N2 or air, or washing with a liquid may be performed. Accordingly, dusts, residues, and the like due to ablation can be reduced.

Next, conductive layers 1518 a and 1518 b are formed over the insulating layer 1516 and in the openings 1517 a and 1517 b formed in the insulating layer 1516 (refer to FIG. 23C). The conductive layers 1518 a and 1518 b are connected to the light absorption layers 1512 a and 1512 b, respectively.

The conductive layers 1518 a and 1518 b may be formed using a conductive material such as an element, e.g. silver (Ag), gold (Au), aluminum (Al), titanium (Ti), molybdenum (Mo), tungsten (W), chromium (Cr), or copper (Cu), or an alloy material or a compound containing the element as its main component. In addition, indium tin oxide (ITO), indium tin oxide containing silicon oxide (ITSO), organic indium, organic tin, zinc oxide, titanium nitride, or the like may also be combined.

Through the above processes, an inverted staggered transistor can be manufactured.

Although a pattern is formed utilizing ablation by laser beam irradiation in various processes in this embodiment mode, the present invention is not limited thereto, and a lithography technique using a photoresist material may also be used. Of course, other techniques by which a pattern can be selectively formed may be used. The present invention has a feature that a method in which a mask is formed utilizing ablation by laser beam irradiation and a desired pattern is obtained by etching using the mask is used in at least one manufacturing process.

By employing the present invention, a transistor can be manufactured with the reduced number of lithography processes using a photoresist. Therefore, a lithography process can be simplified, and the throughput can be improved.

Further, by employing the present invention, contamination due to impurities contained in a photoresist can be prevented, and deterioration in transistor characteristics can be prevented. As a result, a highly reliable semiconductor device can be manufactured.

In addition, with the use of a linear laser beam or a planar laser beam having a large area such as a rectangular laser beam or a circular laser beam, a plurality of regions can be irradiated with a laser beam in a short time. Therefore, by applying the present invention to a large substrate, a lot of patterns can be formed in a short time, whereby a semiconductor device can be manufactured with high productivity.

This embodiment mode can be appropriately combined with Embodiment Modes 1 to 5.

Embodiment Mode 8

A structure of a display panel according to the present invention will be described in this embodiment mode.

FIG. 17A is a top view showing a structure of a display panel according to the present invention. A pixel portion 2701 in which pixels 2702 are arranged in a matrix, a scanning line input terminal 2703, and a signal line input terminal 2704 are formed over a substrate 2700 having an insulating surface. The number of pixels may be determined in accordance with various standards. In the case of XGA full-color display using RGB, the number of pixels may be 1024×768×3 (RGB). In the case of UXGA full-color display using RGB, the number of pixels may be 1600×1200×3 (RGB), and in the case of full-spec, high-definition, and full-color display using RGB, the number of pixels may be 1920×1080×3 (RGB).

The pixels 2702 are arranged in a matrix by intersections of scanning lines extended from the scanning line input terminal 2703 and signal lines extended from the signal line input terminal 2704. Each pixel 2702 in the pixel portion 2701 is provided with a switching element and a pixel electrode connected to the switching element. A typical example of the switching element is a transistor. A gate electrode side of the transistor is connected to the scanning line, and a source or drain electrode side of the transistor is connected to the signal line, which enables each pixel to be independently controlled by a signal inputted from an external portion.

FIG. 17A shows a structure of a display device in which a signal to be inputted to the scanning line and the signal line is controlled by an external driver circuit. Alternatively, a driver IC 2751 may be mounted on the substrate 2700 by a COG (Chip On Glass) method as shown in FIG. 18A. As another mounting mode, a TAB (Tape Automated Bonding) method may be used as shown in FIG. 18B. The driver IC may be formed using a single crystalline semiconductor substrate or may be formed using a transistor over a glass substrate. In each of FIGS. 18A and 18B, the driver IC 2751 is connected to an FPC (Flexible Printed Circuit) 2750.

When a transistor provided in a pixel is formed of a polycrystalline (microcrystalline) semiconductor with high crystallinity, a scanning line driver circuit 3702 can be formed over a substrate 3700 as shown in FIG. 17B. In FIG. 17B, reference numeral 3701 denotes a pixel portion, and a signal line driver circuit is controlled by an external driver circuit, similarly to FIG. 17A. When the transistor provided in a pixel is formed of a polycrystalline (microcrystalline) semiconductor, a single crystalline semiconductor, or the like having high mobility, a pixel portion 4701, a scanning line driver circuit 4702, and a signal line driver circuit 4704 can all be formed over a glass substrate 4700 as shown in FIG. 17C. In this embodiment mode, the present invention utilizing laser ablation for forming a desired pattern as shown in Embodiment Modes 1 to 7 can be applied to the transistor provided in the pixel and the like.

By employing the present invention, a transistor can be manufactured with the reduced number of lithography processes using a photoresist. Therefore, a lithography process can be simplified, and the throughput in manufacturing a display panel can be improved.

Further, since processes using photoresists can be reduced, contamination due to impurities contained in the photoresist can be prevented, whereby a highly reliable display panel can be manufactured.

Embodiment Mode 9

In this embodiment mode, one mode of a method for manufacturing a display device, which includes an inverted staggered transistor manufactured by employing the present invention, will be described with reference to FIGS. 11A to 11C, and 12A to 12C. In particular, a method for manufacturing a display device including a light-emitting element will be described. It is to be noted that the same structures as in the above embodiment modes are denoted by the same reference numerals, and explanation thereof will be partially omitted or simplified.

First, the transistor 520 shown in Embodiment Mode 5 is formed over a substrate 5000 with a base insulating layer 5002 interposed. Next, an insulating layer 5010 is formed so as to cover the transistor 520 (refer to FIG. 11A).

As the substrate 5000, a glass substrate made of barium borosilicate glass, alumino borosilicate glass, or the like; a quartz substrate; a sapphire substrate; a ceramic substrate; or a plastic substrate which can withstand the process temperature of the manufacturing process of this embodiment mode is used. The surface of the substrate 5000 may be polished by a CMP method or the like so as to be planarized.

The base insulating layer 5002 is formed by various methods such as a CVD method, a sputtering method, and a spin coating method using an insulating material such as silicon oxide, silicon nitride, silicon oxynitride, or silicon nitride oxide with a single layer structure or a stacked layer structure. The base insulating layer 5002 does not need to be formed; however, it has an effect of blocking contamination substances from the substrate 5000.

The insulating layer 5010 can be formed by a sputtering method, a PVD (Physical Vapor Deposition) method, a CVD (Chemical Vapor Deposition) method such as a low pressure CVD (LPCVD) method or a plasma CVD method, a spin coating method, or the like.

The insulating layer 5010 can also be formed using a material such as silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, aluminum nitride, aluminum oxynitride, diamond-like carbon (DLC), nitrogen-containing carbon, polysilazane, or other substances containing an inorganic insulating material. A material containing siloxane may also be used. Further, an organic insulating material such as polyimide, acrylic, polyamide, polyimide amide, resist, or benzocyclobutene can also be used. In addition, an oxazole resin can be used, and for example, photo-curable type polybenzoxazole or the like can be used.

Next, an opening 5038 which reaches the conductive layer 512 b is formed in the insulating layer 5010 (refer to FIG. 11C). Hereinafter, an example of a method for forming the opening 5038 will be described.

As shown in FIG. 11B, the insulating layer 5010 side is irradiated with a laser beam 5036 through a photomask 5030. The photomask 5030 has a light-transmitting region 5032 which transmits the laser beam 5036 and a light-blocking region 5034 which blocks the laser beam 5036, and the light-transmitting region 5032 and the light-blocking region 5034 form a desired opening pattern. For example, the photomask 5030 is formed of a substrate obtained by forming a desired opening pattern using a light-blocking material on a surface of a light-transmitting substrate. It is to be noted that a material forming the light-blocking region 5034 needs to be favorable in light-blocking property and resistant to energy of the laser beam 5036.

In this case, the conductive layers 512 b and 512 a are formed using a material which can absorb the laser beam 5036, and the insulating layer 5010 is formed using a material which can transmit the laser beam 5036. The conductive layers 512 b and 512 a are specifically formed using a conductive material that can be used for the light absorption layer shown in Embodiment Modes 1 to 7. In addition, the insulating layer 5010 is specifically formed using a material that can be used for the insulating layer provided over the light absorption layer, shown in Embodiment Modes 1 to 7.

As the laser beam 5036, similarly to the laser beam shown in Embodiment Modes 1 to 7, a laser beam which has such energy that can be absorbed by the conductive layer 512 b corresponding to the light absorption layer in the above embodiment modes may be appropriately selected. In addition, the energy of the laser beam 5036 preferably has such a level that can cause a gas in the conductive layer 512 b to be discharged or the conductive layer 512 b to be evaporated.

In FIG. 11B, the laser beam 5036 is transmitted through the light-transmitting region 5032 of the photomask 5030 and reaches the surface of the insulating layer 5010. Further, the laser beam 5036 is transmitted through the insulating layer 5010 and absorbed by the conductive layer 512 b. The conductive layer 512 b is subjected to laser ablation in the irradiated region with the laser beam 5036, a part of the insulating layer 5010 in the irradiated region is removed, and the opening 5038 is formed (refer to FIG. 11C). The opening 5038 is formed based on the opening pattern formed in the photomask 5030. At this time, in addition to the insulating layer 5010, the conductive layer 512 b in the irradiated region is partially or entirely removed by laser ablation or left. Further, by ablation, the upper layer portion of the conductive layer 512 b in the irradiated region with the laser beam 5036 may be removed, and the thickness of the exposed portion of the conductive layer 512 b (the conductive layer 512 b exposed in the opening 5038) may be thin, compared to other portions. The opening 5038 may be formed so as to reach at least the conductive layer 512 b or go through the conductive layer 512 b. In this embodiment mode, the opening 5038 with a structure in which only the part of the insulating layer 5010 is removed is formed.

In addition, the insulating layer 5010 can be formed by a droplet-discharging method, a printing method (a method for forming a pattern, such as screen printing or offset printing), a dipping method, a dispenser method, or the like. With the use of such a method, the opening 5038 can be formed at the same time as formation of the insulating layer 5010.

Next, a light-emitting element 5020 electrically connected to the transistor 520 is formed. As the light-emitting element 5020, an element which emits light of red (R), green (G), or blue (B) may be formed. Alternatively, an element which emits light of white (W) may be formed as the light-emitting element 5020 and combined with a color filter to obtain light of R, G, or B. Hereinafter, a method for forming the light-emitting element 5020 will be described.

First, a first electrode layer 5012 functioning as a pixel electrode is formed in the opening 5038 where the conductive layer 512 b is exposed. The conductive layer 512 b and the first electrode layer 5012 are electrically connected (refer to FIG. 12A).

The first electrode layer 5012 can be manufactured utilizing laser ablation by laser beam irradiation through the photomask shown in Embodiment Modes 1 to 4. For example, a conductive layer, a light absorption layer, and an insulating layer are sequentially stacked over the insulating layer 5010.

A conductive layer to be the first electrode layer 5012 can be formed by a sputtering method, a PVD (Physical Vapor Deposition) method, a CVD (Chemical Vapor Deposition) method such as a low pressure CVD (LPCVD) method or a plasma CVD method, or the like. The conductive layer can be formed using a conductive material such as indium tin oxide (ITO), indium tin oxide containing silicon oxide (ITSO), or zinc oxide (ZnO). For example, the conductive layer can be formed of indium tin oxide containing silicon oxide by a sputtering method using a target in which ITO is mixed with silicon oxide of 2 wt % to 10 wt %. Besides, the conductive layer may be formed of a conductive material obtained by doping gallium (Ga) to ZnO, or indium zinc oxide (IZO) that is an oxide conductive material formed by using a target in which ITO is mixed with zinc oxide (ZnO) of 2 wt % to 20 wt %. Further, the conductive layer is electrically connected to the conductive layer 512 b.

Then, the insulating layer side is irradiated with a laser beam through a photomask where a desired pattern is formed using a light-transmitting region and a light-blocking region. A part of the insulating layer (or a part of the insulating layer and a part of the light absorption layer) in an irradiated region is removed by laser ablation due to energy of the laser beam absorbed by the light absorption layer. Next, the left insulating layer is used as a mask, and the conductive layer is etched, whereby the first electrode layer 5012 is formed. The conductive layer may be etched using a dry etching method or a wet etching method, appropriately.

The light absorption layer may be removed similarly to the insulating layer by laser ablation or left in the irradiated region with the laser beam. In addition, only the upper layer portion of the light absorption layer may be removed in the irradiated region with the laser beam. The insulating layer and the light absorption layer used as masks in etching are removed after formation of the first electrode layer 5012. The insulating layer and the light absorption layer are removed by etching such as a dry etching method or a wet etching method or laser ablation through laser beam irradiation.

In addition, the first electrode layer 5012 can be selectively formed in a desired place by a droplet-discharging method, a printing method (a method for forming a pattern, such as screen printing or offset printing), a dipping method, a dispenser method, or the like.

The first electrode layer 5012 may be cleaned or polished by a CMP method or with the use of a polyvinyl alcohol based porous material, so that the surface thereof is planarized. In addition, after polishing using a CMP method, ultraviolet ray irradiation, oxygen plasma treatment, or the like may be performed on the surface of the first electrode layer 5012.

Next, a partition layer 5014 is formed so as to have an opening over the first electrode layer 5012 (refer to FIG. 12B). The partition layer 5014 can be formed using an inorganic insulating material such as silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, aluminum nitride, or aluminum oxynitride; an acrylic acid, a methacrylic acid, or a derivative thereof; a heat-resistant high-molecular material such as polyimide, aromatic polyamide, or polybenzimidazole; an insulating material of inorganic siloxane which includes a Si—O—Si bond among compounds which are formed using a siloxane-based material as a starting material and which include silicon, oxygen, and hydrogen; or an insulating material of organic siloxane of which hydrogen bonded to silicon is substituted by an organic group such as methyl or phenyl. A photosensitive or nonphotosensitive material such as acrylic or polyimide may also be used.

The partition layer 5014 can be selectively formed using a droplet-discharging method, a printing method, a disperser method, or the like. Alternatively, the partition layer may be formed over the entire surface using an insulating material, a resist mask or the like may be formed using a lithography process, and the partition layer may be etched to form the partition layer 5014 having a desired shape. Besides, the partition layer 5014 having a desired shape can also be formed by the steps of forming the partition layer over the entire surface using a photosensitive material and exposing the partition layer formed of a photosensitive material to light to develop it. It is preferable that the partition layer 5014 have a shape of which a radius of curvature continuously changes. By such a shape of the partition layer, coverage by a layer 5016 and a second electrode layer 5018 formed thereover is improved.

After the partition layer 5014 is formed by discharging a composition by a droplet-discharging method, its surface may be planarized by pressing with pressure to enhance a level of planarity. As a pressing method, concavity and convexity of the surface may be reduced by scanning the surface by a roller-shaped object, or the surface may be pressed perpendicularly by a flat plate-shaped object. Alternatively, concavity and convexity of the surface may be removed with an air knife after the surface is softened or melted with a solvent or the like. A CMP method may also be used for polishing the surface. This process can be employed for planarizing the surface when the surface becomes uneven by a droplet-discharging method. When a level of planarity is enhanced by this process, irregular display of the display device can be prevented, and thus, a high definition image can be displayed.

Next, the layer 5016 and the second electrode layer 5018 are stacked over the first electrode layer 5012 and the partition layer 5014. Then, the light-emitting element 5020 having a structure in which the layer 5016 is interposed between the first electrode layer 5012 and the second electrode layer 5018 is obtained (refer to FIG. 12C). The layer 5016 includes at least a layer containing a light-emitting material by which a desired light-emission wavelength can be obtained (hereinafter referred to as a light-emitting layer). Specifically, the layer 5016 includes a layer containing an organic compound, a layer containing an inorganic compound, or a layer containing both organic and inorganic compounds.

Through the above processes, a display device including the light-emitting element 5020 can be obtained.

Although a pattern is formed utilizing ablation by laser beam irradiation in various processes in this embodiment mode, the present invention is not limited thereto, and a lithography technique using a photoresist may also be used. Of course, other techniques by which a pattern can be selectively formed may be used. This embodiment mode has a feature that a method in which a pattern is formed utilizing ablation by laser beam irradiation is used in at least one manufacturing process.

By employing the present invention, a transistor and a display device provided with the transistor can be manufactured with the reduced number of lithography processes using a photoresist. Therefore, a lithography process can be simplified, and the throughput can be improved.

Further, by employing the present invention, contamination due to impurities contained in a photoresist can be prevented, whereby a highly reliable display device can be manufactured.

In addition, with the use of a linear laser beam or a planar laser beam having a large area such as a rectangular laser beam or a circular laser beam, a plurality of regions can be irradiated with a laser beam in a short time. Therefore, by applying the present invention to a large substrate, a lot of patterns can be formed in a short time, whereby a display device can be manufactured with high productivity.

This embodiment mode can be appropriately combined with Embodiment Modes 1 to 8.

Embodiment Mode 10

In this embodiment mode, an example of a display device according to the present invention will be described with reference to FIGS. 19A and 19B.

FIG. 19A shows a top schematic view of a display device shown in this embodiment mode. In addition, FIG. 19B shows a cross-sectional view of FIG. 19A along a line Q-R.

A display device 900 shown in FIGS. 19A and 19B includes, over a substrate 901, a pixel portion 902 and a driver circuit portion 904. A sealing substrate 908 is provided over the substrate 901 with a sealant 910 interposed therebetween. Moreover, a terminal portion 906 is provided over the substrate 901. Signals and power source potentials for controlling operations of plural elements included in the pixel portion 902 are inputted from an external portion through the terminal portion 906.

The pixel portion 902 is provided with a light-emitting element 930, a driving transistor 924, a switching transistor 922, and a capacitor element 920. In the light-emitting element 930, at least a layer including a light-emitting layer is interposed between a pair of electrode layers. The light-emitting element 930 is electrically connected to the driving transistor 924.

Edge portions of an electrode layer in a lower layer of the light-emitting element 930 (the electrode layer electrically connected to the driving transistor 924) are covered with a partition layer 918. The partition layer 918 is formed of an inorganic insulating material such as silicon oxide or silicon nitride; an organic insulating material such as acrylic, polyimide, or resist; a siloxane material; or the like. The partition layer 918 can separate light-emitting elements provided adjacent to each other. When the partition layer 918 has an edge portion with a rounded shape of which a radius of curvature continuously changes as shown in this embodiment mode, coverage by a film stacked thereover is improved, which is preferable.

The driver circuit portion 904 is provided with a plurality of transistors 926, which form a driver circuit for controlling the operation of the pixel portion 902. The driver circuit portion 904 is provided with, for example, a shift register, a decoder, a buffer, a sampling circuit, a latch, and the like.

The substrate 901 and the sealing substrate 908 are attached to each other with the sealant 910 interposed therebetween so as to seal the pixel portion 902 and the driver circuit portion 904. The sealing substrate 908 is provided with a color filter 942 and a light-blocking layer 944. The present invention is not particularly limited thereto, and the color filter 942 or the light-blocking layer 944 may also be omitted.

This embodiment mode and the above embodiment modes are greatly different in that a gate electrode layer of the transistor is provided below or over the semiconductor layer. Other structures are based on those in Embodiment Mode 9.

Next, an example of a specific manufacturing method will be described.

As a base insulating layer, a base insulating layer 903 a is formed using silicon nitride oxide with a thickness of 10 nm to 200 nm (preferably 50 nm to 150 nm) over a substrate 901, and a base insulating layer 903 b is formed thereover using silicon oxynitride with a thickness of 50 nm to 200 nm (preferably 100 nm to 150 nm), by a sputtering method, a PVD (Physical Vapor Deposition) method, a CVD (Chemical Vapor Deposition) method such as a low-pressure CVD (LPCVD) method or a plasma CVD method, or the like. Alternatively, an acrylic acid, a methacrylic acid, or a derivative thereof, a heat-resistant high molecular material such as polyimide, aromatic polyamide, or polybenzimidazole; or a siloxane resin may be used. Alternatively, a resin material such as a vinyl resin like polyvinyl alcohol or polyvinylbutyral, an epoxy resin, a phenol resin, a novolac resin, an acrylic resin, a melamine resin, or a urethane resin may be used. Further, an organic material such as benzocyclobutene, parylene, fluorinated arylene ether, or polyimide, a composition material containing a water-soluble homopolymer and a water-soluble copolymer, or the like may be used. Moreover, an oxazole resin can be used, and for example, photo-curing polybenzoxazole or the like can be used.

A droplet-discharging method, a printing method (a method for forming a pattern such as screen printing or offset printing), a coating method such as a spin coating method, a dipping method, a dispenser method, or the like can also be used. In this embodiment mode, the base insulating layers 903 a and 903 b are formed by a plasma CVD method. As the substrate 901, a glass substrate, a quartz substrate, a silicon substrate, a metal substrate, or a stainless steel substrate provided with an insulating layer on the surface may be used. In addition, a plastic substrate having heat resistance sufficient to withstand the process temperature of this embodiment mode may be used, or a flexible film-like substrate may be used. As the plastic substrate, a substrate made of PET (polyethylene terephthalate), PEN (polyethylenenaphthalate), or PES (polyethersulfone) can be used, and as the flexible substrate, a substrate made of a synthetic resin such as acrylic can be used.

The base insulating layer can be formed using silicon oxide, silicon nitride, silicon oxynitride, silicon nitride oxide, or the like and may have either a single layer structure or a stacked layer structure such as a two-layer or three-layer structure.

Next, a semiconductor layer is formed over the base insulating layer. The semiconductor layer may be formed with a thickness of 25 nm to 200 nm (preferably, 30 nm to 150 nm) by any of various methods (such as a sputtering method, an LPCVD method, or a plasma CVD method). In this embodiment mode, it is preferable to use a crystalline semiconductor layer which is obtained by crystallizing an amorphous semiconductor layer with a laser beam.

The semiconductor layer obtained in this manner may be doped with a slight amount of an impurity element (boron or phosphorus) to control a threshold voltage of a transistor. This doping with an impurity element may be performed to the amorphous semiconductor layer before the crystallization step. When the doping with an impurity element is performed to the amorphous semiconductor layer, activation of the impurity element can be performed by heat treatment which will be performed later for crystallization. In addition, defects and the like caused by doping can be improved.

Next, the crystalline semiconductor layer is patterned into a desired shape to form a semiconductor layer.

In this embodiment mode, laser ablation by laser beam irradiation shown in the above embodiment modes is utilized to pattern the semiconductor layer. In this case, a mask having a desired shape formed of a light absorption layer and an insulating layer may be formed, and etching may be performed using the mask. A material, a method, and the like may be appropriately selected.

Alternatively, the semiconductor layer may also be formed by a lithography technique using a photoresist material. A resist mask for forming a desired shape may be formed and etching may be performed using the resist mask. Alternatively, various printing methods (a method for forming a desired pattern, such as screen (mimeograph) printing, offset (planograph) printing, relief printing, or gravure (intaglio) printing), a nanoimprinting method, a droplet-discharging method, a dispenser method, a selective-coating method, or the like may also be used.

The etching may be performed by either plasma etching (dry etching) or wet etching; however, plasma etching is suitable for treating a large substrate. As an etching gas, a fluorine-based gas such as CF4, CHF3, or NF3 or a chlorine-based gas such as Cl2 or BCl3 is used, to which an inert gas such as He or Ar may be appropriately added. Alternatively, electric discharge machining can be performed locally when the etching is performed using atmospheric pressure discharge, and in such a case, a mask layer does not need to be formed over the entire surface of the substrate. At this time, a lower electrode layer forming a capacitor element completed later is also formed. The lower electrode layer is formed in the same layer as the semiconductor layer forming the transistor.

A gate insulating layer is formed to cover the semiconductor layer. The gate insulating layer is formed using an insulating layer containing silicon with a thickness of 10 nm to 150 nm by a plasma CVD method, a sputtering method, or the like. The gate insulating layer may be formed using an inorganic insulating material such as silicon nitride, silicon oxide, silicon oxynitride, or silicon nitride oxide with a single layer structure or a stacked layer structure. The gate insulating layer may be formed to have a three-layer structure of a silicon nitride layer, a silicon oxide layer, and a silicon nitride layer. Alternatively, a single layer of a silicon oxynitride layer or a stacked layer structure including two layers selected from a silicon nitride layer, a silicon oxide layer, and a silicon nitride layer may be used.

Next, a gate electrode layer is formed over the gate insulating layer. The gate electrode layer can be formed by the steps of forming a conductive layer by a sputtering method, an evaporation method, a CVD method, or the like and pattering the conductive layer into a desired shape. The gate electrode layer may be formed using an element such as tantalum (Ta), tungsten (W), titanium (Ti), molybdenum (Mo), aluminum (Al), copper, (Cu), chromium (Cr), or neodymium (Nd), or an alloy material or a compound material containing the above element as its main component. Alternatively, the gate electrode layer may be formed using a semiconductor layer typified by polycrystalline silicon doped with an impurity element such as phosphorus, or an AgPdCu alloy. The gate electrode layer may have a single layer structure or a stacked layer structure.

The gate electrode layer can be obtained by pattering the conductive layer into a desired shape. Ablation by laser beam irradiation shown in the above embodiment modes is utilized to pattern the conductive layer. In this case, a mask having a desired shape formed of a light absorption layer and an insulating layer may be formed, and etching may be performed using the mask. A material, a method, and the like may be appropriately selected. At this time, an upper electrode layer of a capacitor element completed later is also formed. The upper electrode layer is formed using the same material as that of the gate electrode layer.

The gate electrode layer is formed to have a tapered side surface in this embodiment mode. The gate electrode layer can be formed into a tapered shape by using a wet etching method for an etching step. Alternatively, a wet etching method may be sequentially performed after a dry etching method. It is to be noted that the present invention is not particularly limited thereto, and the gate electrode layer having a perpendicular side surface may be formed by a dry etching method. Further, the gate electrode layer may have a two-layer structure in which the layers have different taper angles. When the gate electrode layer has a tapered side surface, the coverage thereof by a film to be stacked thereover can be improved.

Alternatively, the gate electrode layer may also be formed by a lithography technique using a photoresist material. In a lithography technique, a resist mask may be formed and etching may be performed. Alternatively, various printing methods (a method for forming a desired pattern, such as screen (mimeograph) printing, offset (planograph) printing, relief printing, or gravure (intaglio) printing), a nanoimprinting method, a droplet-discharging method, a dispenser method, a selective-coating method, or the like may also be used.

Through the etching step for forming the gate electrode layer, the gate insulating layer may be etched to some extent and the thickness thereof may be reduced (so-called film reduction).

An impurity element is added to the semiconductor layer to form a pair of impurity regions. The impurity region formed in the semiconductor layer functions as a source region or a drain region. As the impurity element to be added, an impurity element which imparts n-type conductivity or an impurity element which imparts p-type conductivity may be appropriately selected. As the impurity element which imparts n-type conductivity, phosphorus (P), arsenic (As), or the like can be used. As the impurity element which imparts p-type conductivity, boron (B), aluminum (Al), gallium (Ga), or the like can be used. At this time, a channel formation region is formed between a pair of impurity regions.

It is to be noted that, in the semiconductor layer, an impurity region called an LDD (Lightly Doped Drain) region may be formed between an impurity region functioning as a source region or a drain region and a channel formation region. The LDD region is an impurity region with a low concentration of impurities than a source region or a drain region. The LDD region may overlap with the gate electrode layer or may not overlap with the gate electrode layer.

Heat treatment, intense light irradiation, or laser beam irradiation may be performed to activate the impurity element. At the same time as the activation, plasma damage to the gate insulating layer and the interface between the gate insulating layer and the semiconductor layer can be repaired.

Then, a first interlayer insulating layer is formed to cover the gate electrode layer and the gate insulating layer. In this embodiment mode, the first interlayer insulating layer has a stacked layer structure of insulating layers 913 and 914. The insulating layers 913 and 914 can be formed using a silicon nitride layer, a silicon nitride oxide layer, a silicon oxynitride layer, a silicon oxide layer, or the like by a sputtering method or a plasma CVD method, or another insulating layer containing silicon may be used as a single layer structure or a stacked layer structure of three or more layers.

In addition, heat treatment is performed in a nitrogen atmosphere at 300° C. to 550° C. for 1 to 12 hours to hydrogenate the semiconductor layer. Preferably, it is performed at 400° C. to 500° C. This step is a step of terminating dangling bonds of the semiconductor layer with hydrogen which is contained in the insulating layer 913 that is the interlayer insulating layer. In this embodiment mode, heat treatment is performed at 410° C.

The insulating layers 913 and 914 can be formed using a material such as aluminum nitride, aluminum oxynitride, aluminum nitride oxide having a higher content of nitrogen than that of oxygen, aluminum oxide, diamond-like carbon (DLC), nitrogen-containing carbon, polysilazane, or other substances including an inorganic insulating material. Alternatively, a material containing siloxane may be used. An organic insulating material may also be used, and polyimide, acrylic, polyamide, polyimide amide, resist, or benzocyclobutene can be used. Moreover, an oxazole resin can be used, and for example, photo-curing polybenzoxazole or the like can be used.

Next, an opening is formed in the insulating layers 913 and 914 and the gate insulating layer so as to reach the semiconductor layer.

The opening is formed by a lithography technique using a photoresist material. A resist mask having a desired opening pattern may be formed, and etching may be performed using the mask.

Alternatively, the opening may be formed utilizing laser ablation by laser beam irradiation. For example, the source region and the drain region of the semiconductor layer are irradiated with a laser beam from the side of the insulating layers 913 and 914 through a photomask. By the energy of the laser beam absorbed by the source region and the drain region, parts of the insulating layers 913 and 914 and a part of the gate insulating layer over irradiated regions of the source region and the drain region are removed, whereby the opening can be formed.

In the photomask, a light-transmitting region and a light-blocking region form a desired opening pattern. A material forming the light-blocking region is favorable in light-blocking property and resistant to energy of the laser beam. The laser beam has such energy that can be absorbed by the source region or the drain region of the semiconductor layer and preferably has such an energy level that can cause a gas in the source region or the drain region to be discharged or the source region or the drain region to be evaporated. By appropriately selecting energy of the laser beam, it is also possible to remove only the insulating layers 913 and 914, and the gate insulating layer. A region where the laser beam is transmitted through the photomask is to be an irradiated region, and the insulating layer and the like are removed to form the opening there.

A source electrode layer or a drain electrode layer is formed in the opening that reaches the source region or the drain region of the semiconductor layer, and the source region or the drain region of the semiconductor layer can be electrically connected to the source electrode layer or the drain electrode layer.

The source electrode layer or the drain electrode layer can be formed by the steps of forming a conductive layer by a PVD method, a CVD method, an evaporation method, or the like and then patterning the conductive layer into a desired shape. The source electrode layer or the drain electrode layer is formed using an element such as Ag, Au, Cu, Ni, Pt, Pd, Ir, Rh, W, Al, Ta, Mo, Cd, Zn, Fe, Ti, Si, Ge, Zr, or Ba, or an alloy material or a metal nitride containing the element as its main component. In addition, the source electrode layer or the drain electrode layer may have a single layer structure or a stacked layer structure.

The source electrode layer or the drain electrode layer can be obtained by pattering a conductive layer into a desired shape. The conductive layer can be patterned utilizing ablation by laser beam irradiation shown in the above embodiment modes.

For example, a light absorption layer and an insulating layer are stacked over the conductive layer and irradiated with a laser beam through a photomask. By utilizing ablation by energy of a laser beam absorbed by the light absorption layer, a mask formed of the insulating layer and the light absorption layer is formed. Then, the conductive layer is etched using the mask, whereby the source electrode layer or the drain electrode layer is formed.

In the photomask, a light-transmitting region and a light-blocking region form a desired pattern. A material forming the light-blocking region is favorable in light-blocking property and resistant to energy of the laser beam. The laser beam has such energy that can be absorbed by the light absorption layer and preferably has such an energy level that can cause a gas in the light absorption layer to be discharged or the light absorption layer to be evaporated. A region where the laser beam is transmitted through the photomask is to be an irradiated region, parts of the insulating layer and the light absorption layer are removed, and the insulating layer and the light absorption layer are left based on the pattern formed in the photomask. Then, with the left insulating layer and light absorption layer as etching masks, the conductive layer is etched by a dry etching method or a wet etching method to obtain the source electrode layer or the drain electrode layer. It is to be noted that details of the insulating layer, the light absorption layer, the laser beam, the photomask, and the like are based on those in the above embodiment modes.

Alternatively, the source electrode layer or the drain electrode layer may be formed by the steps of forming a resist mask by a lithography technique using a photoresist material and etching the conductive layer.

Alternatively, the source electrode layer or the drain electrode layer may also be formed by various printing methods (a method for forming a desired pattern, such as screen (mimeograph) printing, offset (planograph) printing, relief printing, or gravure (intaglio) printing), a nanoimprinting method, a droplet-discharging method, a dispenser method, a selective-coating method, or the like. A reflow method or a damascene method may also be used. With such a method, the conductive layer can be selectively formed in a desired place. It is to be noted that a terminal electrode layer 950 of the terminal portion 906 is also formed in forming the source electrode layer or the drain electrode layer.

Through the above processes, an active matrix substrate including the transistors 922 and 924 in the pixel portion 902 and plural transistors 926 in the driver circuit portion 904 can be manufactured.

The present invention is not particularly limited thereto, and a transistor may have a single-gate structure in which one channel formation region is formed, a double-gate structure in which two channel formation regions are formed, or a triple-gate structure in which three channel formation regions are formed.

Next, an insulating layer 916 is formed as a second interlayer insulating layer. The insulating layer 916 can be formed of a material such as silicon oxide, silicon nitride, silicon oxynitride, silicon nitride oxide, aluminum nitride, aluminum oxide containing nitrogen (also referred to as aluminum oxynitride), aluminum nitride containing oxygen (also referred to as aluminum nitride oxide), aluminum oxide, diamond-like carbon (DLC), nitrogen-containing carbon, PSG (phosphosilicate glass), BPSG (borophosphosilicate glass), alumina, or other substances including an inorganic insulating material. Alternatively, a siloxane resin may be used. Furthermore, an organic insulating material may be used; an organic material may be either photosensitive or non-photosensitive; and polyimide, acrylic, polyamide, polyimide amide, resist, benzocyclobutene, polysilazane, or a low-dielectric constant (Low-k) material can be used. Moreover, an oxazole resin can be used, and for example, photo-curing polybenzoxazole or the like can be used. Since an interlayer insulating layer provided for planarization needs to have high heat resistance, a high insulating property, and a high level of planarity, the insulating layer 916 is preferably formed by a coating method typified by a spin coating method.

The insulating layer 916 can also be formed by a dipping method, spray coating, a doctor knife, a roll coater, a curtain coater, a knife coater, a CVD method, an evaporation method, or the like. The insulating layer 916 may also be formed by a droplet-discharging method. In the case of using a droplet-discharging method, a material liquid can be saved. Alternatively, a method like a droplet-discharging method by which a pattern can be transferred or drawn, such as a printing method (a method for forming a pattern such as screen printing or offset printing), a dispenser method, or the like can be used.

An opening which reaches the source electrode layer or the drain electrode layer of the transistor 924 is formed in the insulating layer 916 of the pixel portion 902. The opening may be formed similarly to the opening for electrically connecting the source electrode layer or the drain electrode layer and the source region or the drain region of the semiconductor layer. In the case of utilizing ablation by laser beam irradiation, the source electrode layer or the drain electrode layer is irradiated with a laser beam, and the insulating layer 916 in an upper layer thereof is removed by energy of the laser beam absorbed by the source electrode layer or the drain electrode layer, whereby the opening can be formed. A photomask provided with a desired opening pattern is used for laser beam irradiation. When ablation by laser beam irradiation is utilized, a low-melting point metal which can be relatively easily evaporated (chromium in this embodiment mode) is preferably used for the source electrode layer or the drain electrode layer.

A light-emitting element 930 is formed over the insulating layer 916 in the pixel portion 902. The light-emitting element 930 is electrically connected to the transistor 924.

First, a first electrode layer 932 is formed in the opening provided in the insulating layer 916 where the source electrode layer or the drain electrode layer of the transistor 924 is exposed.

Next, a partition layer 918 is formed so as to have an opening over the first electrode layer 932 and cover the edge portions of the first electrode layer 932. The partition layer 918 can be formed using silicon oxide, silicon nitride, silicon oxynitride, silicon nitride oxide, or the like and may have a single layer structure or a stacked layer structure of two or three layers. The partition layer 918 can alternatively be formed using a material such as aluminum nitride, aluminum oxynitride having a higher content of oxygen than that of nitrogen, aluminum nitride oxide having a higher content of nitrogen than that of oxygen, aluminum oxide, diamond-like carbon (DLC), nitrogen-containing carbon, polysilazane, or other substances including an inorganic insulating material. Alternatively, a material containing siloxane may be used. Furthermore, an organic insulating material may be used; an organic material may be either photosensitive or non-photosensitive; and polyimide, acrylic, polyamide, polyimide amide, resist, benzocyclobutene, or polysilazane can be used. Moreover, an oxazole resin can be used, and for example, photo-curing polybenzoxazole or the like can be used.

The partition layer 918 can be formed by a droplet-discharging method by which a pattern can be selectively formed, a printing method by which a pattern can be transferred or drawn (a method for forming a pattern, such as screen printing or offset printing), a dispenser method, a coating method such as a spin coating method, a dipping method, or the like. Alternatively, the partition layer is formed over the entire surface using a photosensitive material, and the partition layer formed of a photosensitive material is exposed to light and developed, whereby the partition layer 918 can be patterned into a desired shape. Further, the partition layer may be formed over the entire surface by a sputtering method, a PVD (Physical Vapor Deposition) method, a CVD (Chemical Vapor Deposition) method such as a low-pressure CVD (LPCVD) method or a plasma CVD method; a mask of a resist or the like is formed using a lithography technique; and the partition layer may be etched into a desired shape.

The etching into a desired shape may be performed by either a dry etching method or a wet etching method; however, plasma etching (one kind of a dry etching method) is suitable for treating a large substrate. As an etching gas, a fluorine-based gas such as CF4, CHF3, or NF3 or a chlorine-based gas such as Cl2 or BCl3 is used, to which an inert gas such as He or Ar may be appropriately added. Alternatively, electric discharge machining can be performed locally when the etching process is performed using atmospheric pressure discharge, and in such a case, a mask layer does not need to be formed over the entire surface of the substrate.

The partition layer 918 preferably has a shape of which a radius of curvature continuously changes. By such a shape of the partition layer, coverage by a layer stacked thereover is improved.

Next, a layer 934 and a second electrode layer 936 are stacked over the first electrode layer 932 and the partition layer 918, and the light-emitting element 930 having a structure in which the layer 934 is interposed between the first electrode layer 932 and the second electrode layer 936 is obtained. The layer 934 includes at least a layer containing a light-emitting material by which a desired light-emission wavelength can be obtained.

One of the first electrode layer 932 and the second electrode layer 936 functions as an anode and the other functions as a cathode. The first electrode layer 932 and the second electrode layer 936 can be formed using indium tin oxide (ITO), indium tin oxide containing silicon oxide, indium zinc oxide (IZO) that is formed by using a target in which ITO is mixed with zinc oxide of 2 wt % to 20 wt %, gold (Au), platinum (Pt), nickel (Ni), tungsten (W), chromium (Cr), molybdenum (Mo), iron (Fe), cobalt (Co), copper (Cu), palladium (Pd), or the like. In addition, aluminum, an alloy of magnesium and silver, an alloy of aluminum and lithium, or the like can be used.

In order to extract light emitted in the layer 934 to an external portion, one or both of the first electrode layer 932 and the second electrode layer 936 are preferably formed using indium tin oxide, or alternatively, silver, aluminum, or the like that is formed to have a thickness of several nm to several tens of nm so as to transmit visible light.

The first electrode layer 932 can be obtained by the steps of forming the material over the entire surface and pattering the material into a desired shape. The first electrode layer 932 may be patterned utilizing ablation by laser beam irradiation shown in the above embodiment modes.

For example, a conductive layer to be the first electrode layer is formed over the entire surface, and a light absorption layer and an insulating layer are stacked over the conductive layer and irradiated with a laser beam through a photomask. By utilizing ablation by energy of the laser beam absorbed by the light absorption layer, a mask is formed of the insulating layer and the light absorption layer. Then, the conductive layer is etched using the mask, whereby the first electrode layer 932 is obtained.

In the photomask, a light-transmitting region and a light-blocking region form a desired pattern. A material forming the light-blocking region is favorable in light-blocking property and resistant to energy of the laser beam. The laser beam has such energy that can be absorbed by the light absorption layer and preferably has such an energy level that can cause a gas in the light absorption layer to be discharged or the light absorption layer to be evaporated. A region where the laser beam is transmitted through the photomask is to be an irradiated region, parts of the insulating layer and the light absorption layer are removed, and the insulating layer and the light absorption layer are left based on the pattern formed in the photomask. Then, with the left insulating layer and light absorption layer as etching masks, the conductive layer is etched by a dry etching method or a wet etching method to obtain the first electrode layer 932. It is to be noted that details of the insulating layer, the light absorption layer, the laser beam, the photomask, and the like are based on those in the above embodiment modes.

Alternatively, the first electrode layer 932 may also be formed by the steps of forming a resist mask by a lithography technique using a photoresist material and etching the conductive layer. Further alternatively, the first electrode layer 932 may be formed by various printing methods (a method for forming a desired pattern, such as screen (mimeograph) printing, offset (planograph) printing, relief printing, or gravure (intaglio) printing), a nanoimprinting method, a droplet-discharging method, a dispenser method, a selective-coating method, or the like. A reflow method or a damascene method may also be used. With such a method, the conductive layer can be selectively formed in a desired place.

The first electrode layer 932 may be cleaned or polished by a CMP method or with the use of a polyvinyl alcohol based porous material, so that the surface thereof is planarized. In addition, after polishing using a CMP method, ultraviolet ray irradiation, oxygen plasma treatment, or the like may be performed on the surface of the first electrode layer 932.

After the first electrode layer 932 is formed, heat treatment may be performed. Through this heat treatment, moisture included in the first electrode layer 932 is released. Therefore, degasification or the like is not caused in the first electrode layer 932. Even when a light-emitting material which is easily deteriorated by moisture is formed over the first electrode layer 932, the light-emitting material is not deteriorated. Accordingly, a highly reliable display device can be manufactured.

The second electrode layer 936 can be formed by an evaporation method, a sputtering method, or the like. In addition, an insulating layer may be provided as a passivation layer (protective layer) over the second electrode layer 936. It is effective to provide a passivation layer to cover the second electrode layer 936 in this manner The passivation layer can be formed using a single layer structure or a stacked layer structure of an insulating layer including silicon nitride, silicon oxide, silicon oxynitride, silicon nitride oxide, aluminum nitride, aluminum oxynitride, aluminum nitride oxide having a higher content of nitrogen than that of oxygen, aluminum oxide, diamond-like carbon (DLC), or nitrogen-containing carbon. Alternatively, the passivation layer may be formed using a siloxane resin.

In this case, a film providing good coverage is preferably used as the passivation layer. A carbon film, especially, a DLC film is effective. The DLC film can be formed at a temperature in the range of room temperature to 100° C.; therefore, the DLC film can be easily formed over the layer 934 having low heat resistance. The DLC film can be formed by a plasma CVD method (typically, an RF plasma CVD method, a microwave CVD method, an electron cyclotron resonance (ECR) CVD method, a thermal filament CVD method, or the like), a combustion flame method, a sputtering method, an ion beam evaporation method, a laser evaporation method, or the like. A hydrogen gas and a hydrocarbon-based gas (for example, CH4, C2H2, C6H6, or the like) are used as a reaction gas for forming a DLC film. The reaction gas is ionized by glow discharge, and the ions are accelerated to collide with a negatively self-biased cathode; accordingly, a DLC film is formed. A nitrogen-containing carbon film may be formed using a C2H4 gas and an N2 gas as a reaction gas. The DLC film has a high blocking effect on oxygen and can suppress oxidation of the layer 934. Accordingly, the layer 934 can be prevented from being oxidized during a sealing step later.

The layer 934 formed over the first electrode layer 932 includes at least a light-emitting layer containing a light-emitting material. The light-emitting layer includes a layer containing an organic compound, a layer containing an inorganic compound, or a layer containing both organic and inorganic compounds. The light-emitting element 930 in which the layer 934 is provided between the first electrode layer 932 and the second electrode layer 936 can be obtained.

The substrate 901 provided with the light-emitting element 930 and the sealing substrate 908 are fixed to each other with the sealant 910 to seal the light-emitting element 930. As the sealant 910, it is typically preferable to use a visible light curable resin, an ultraviolet curable resin, or a thermosetting resin. For example, a bisphenol-A liquid resin, a bisphenol-A solid resin, a bromine-containing epoxy resin, a bisphenol-F resin, a bisphenol-AD resin, a phenol resin, a cresol resin, a novolac resin, a cycloaliphatic epoxy resin, an Epi-Bis type (Epichlorohydrin-Bisphenol) epoxy resin, a glycidyl ester resin, a glycidyl amine resin, a heterocyclic epoxy resin, or a modified epoxy resin can be used. It is to be noted that a region 948 surrounded by the sealant may be filled with a filler, or may be filled and sealed with nitrogen by sealing the region in a nitrogen atmosphere. In a structure in which light is taken out through the filler, the filler needs to have a light-transmitting property. Typically, a visible light curable, ultraviolet curable, or thermosetting epoxy resin may be used. Through the above processes, a display device having a display function using a light-emitting element is completed. Alternatively, the filler can be dripped in a liquid state to fill inside the display device. When a substance having a hygroscopic property such as a drying agent is used as the filler, a higher water-absorbing effect can be obtained, and deterioration of the light-emitting element 930 can be prevented.

In order to prevent element deterioration due to moisture, a drying agent may be provided so as to surround the pixel portion 902. For example, the drying agent may be provided in a depressed portion formed in the sealing substrate, so that it does not interfere with reduction in thickness. Further, since the drying agent is formed in a region corresponding to a gate wiring layer so that a large water-absorbing area is provided, a high water-absorbing effect can be obtained. In addition, since the drying agent is formed over the gate wiring layer which does not contribute to light-emission, reduction in light-extraction efficiency can be prevented.

This embodiment mode describes the case where the light-emitting element is sealed with a glass substrate. Sealing treatment is treatment for protecting the light-emitting element from moisture. Therefore, any of the following methods can be used: a method in which a light-emitting element is mechanically sealed with a cover material, a method in which a light-emitting element is sealed with a thermosetting resin or an ultraviolet curable resin, and a method in which a light-emitting element is sealed with a thin film of metal oxide, metal nitride, or the like having high barrier capability. As the cover material, glass, ceramics, plastic, or a metal can be used. However, when light is emitted to the cover material side, the cover material needs to have a light-transmitting property. The cover material is attached to the substrate over which the above-mentioned light-emitting element is formed, with a sealant such as a thermosetting resin or an ultraviolet curable resin, and a sealed space is formed by curing the resin with heat treatment or ultraviolet ray irradiation treatment. It is also effective to provide a moisture-absorbing material typified by barium oxide in the sealed space. The moisture-absorbing material may be provided on the sealant or over the partition layer or a peripheral portion so as not to block light emitted from the light-emitting element. Further, a space between the cover material and the substrate over which the light-emitting element is formed can also be filled with a thermosetting resin or an ultraviolet curable resin. In this case, it is effective to add a moisture-absorbing material typified by barium oxide in the thermosetting resin or the ultraviolet curable resin.

Further, the source electrode layer or the drain electrode layer and the first electrode layer 932 may not be directly in contact to be electrically connected and may be connected through a wiring layer.

In this embodiment mode, an FPC 954 is connected to the terminal electrode layer 950 through an anisotropic conductive layer 952 in the terminal portion 906 so as to have electrical connection to an external portion.

Moreover, as shown in FIG. 19A, the display device manufactured in this embodiment mode includes the driver circuit portion 904 over the same substrate as the pixel portion 902. It is to be noted that the present invention is not limited thereto and an IC chip may be mounted as a peripheral driver circuit by a COG method or a TAB method as described above.

In the display device of the present invention, a driving method for image display is not particularly limited, and for example, a dot sequential driving method, a line sequential driving method, an area sequential driving method, or the like may be used. Typically, the line sequential driving method is used, and a time division gray scale driving method or an area gray scale driving method may be appropriately used. Further, a video signal inputted to the source line of the display device may be either an analog signal or a digital signal. The driver circuit and the like may be appropriately designed in accordance with the video signal.

Although a pattern is formed utilizing ablation by laser beam irradiation in various processes in this embodiment mode, the present invention is not limited thereto, and a lithography technique using a photoresist may also be used. Of course, other techniques by which a pattern can be selectively formed may be used. This embodiment mode has a feature that a method in which a pattern is formed utilizing ablation by laser beam irradiation is used in at least one manufacturing process.

By employing the present invention, a layer such as a wiring included in the display device can be formed into a desired shape. Further, the number of lithography processes using a photoresist can be reduced, and the display device can be manufactured through a simplified process. Therefore, the throughput can be improved.

Further, by employing the present invention, contamination due to impurities contained in a photoresist can be prevented, whereby a highly reliable display device can be manufactured.

In addition, with the use of a linear laser beam or a planar laser beam having a large area such as a rectangular laser beam or a circular laser beam, a plurality of regions can be irradiated with a laser beam in a short time. Therefore, by applying the present invention to a large substrate, a lot of patterns can be formed in a short time, whereby a display device can be manufactured with high productivity.

This embodiment mode can be appropriately combined with Embodiment Modes 1 to 9.

Embodiment Mode 11

Various element structures can be applied to a light-emitting element that has a display function of a display device. The light-emitting element is generally distinguished by whether a light-emitting material is an organic compound or an inorganic compound. The former is referred to as an organic EL element, and the latter is referred to as an inorganic EL element. Here, examples of a light-emitting element that can be applied to the present invention will be described with reference to FIGS. 13, 14A to 14C, and 15A to 15C.

FIG. 13 shows an organic EL element. In the light-emitting element shown in FIG. 13, a layer 860 is interposed between a first electrode layer 870 and a second electrode layer 850. Either the first electrode layer 870 or the second electrode layer 850 is an anode, and the other is a cathode. It is to be noted that the anode indicates an electrode for injecting holes to a light-emitting layer, and the cathode indicates an electrode for injecting electrons to the light-emitting layer. In this embodiment mode, the first electrode layer 870 is an anode and the second electrode layer 850 is a cathode. Further, the layer 860 has a structure in which a hole-injecting layer 862, a hole-transporting layer 864, a light-emitting layer 866, an electron-transporting layer 868, and an electron-injecting layer 869 are sequentially stacked.

The first electrode layer 870 and the second electrode layer 850 can be formed using gold (Au), platinum (Pt), nickel (Ni), tungsten (W), chromium (Cr), molybdenum (Mo), iron (Fe), cobalt (Co), copper (Cu), palladium (Pd), or the like as well as indium tin oxide (ITO), indium tin oxide containing silicon oxide, indium zinc oxide formed by using a target in which ITO is mixed with zinc oxide of 2 wt % to 20 wt %. Moreover, in addition to aluminum, an alloy of magnesium and silver, an alloy of aluminum and lithium, or the like can also be used for forming the first electrode layer 870. A method for forming the first electrode layer 870 is the same as that of the above first electrode layer 5012. A method for forming the second electrode layer 850 is not particularly limited, and for example, a sputtering method, an evaporation method, or the like can be used for forming the second electrode layer 850.

It is to be noted that, in order to extract emitted light to an external portion, it is preferable to form either the first electrode layer 870 or the second electrode layer 850, or both of them by using indium tin oxide or the like or by depositing silver, aluminum, or the like to have a thickness of several nm to several tens of nm, so that visible light can be transmitted.

The hole-injecting layer 862 is a layer having a function for supporting injection of holes from the first electrode layer 870 to the hole-transporting layer 864. When the hole-injecting layer 862 is provided, an ionization potential difference between the first electrode layer 870 and the hole-transporting layer 864 is relieved; thus, holes are easily injected. The hole-injecting layer 862 is preferably formed using a substance, ionization potential of which is lower than that of a substance forming the hole-transporting layer 864 and higher than that of a substance forming the first electrode layer 870. The hole-injecting layer 862 is also preferably formed using a substance, energy band of which is bent by being provided as a thin film having a thickness of 1 nm to 2 nm between the hole-transporting layer 864 and the first electrode layer 870. As a specific example of a substance that can be used for forming the hole-injecting layer 862, a phthalocyanine-based compound such as phthalocyanine (abbreviation: H2Pc) or copper phthalocyanine (CuPc), a high molecular material such as poly(ethylenedioxythiophene)/poly(styrenesulfonic acid) solution (PEDOT/PSS), and the like can be given. Thus, a substance is selected from hole-transporting substances, so that ionization potential in the hole-injecting layer 862 is relatively lower than that in the hole-transporting layer 864, whereby the hole-injecting layer 862 can be formed. In the case of providing the hole-injecting layer 862, it is preferable to form the first electrode layer 870 using a substance with a high work function such as indium tin oxide. It is to be noted that the present invention is not particularly limited, and the hole-injecting layer 862 is not necessarily provided.

The hole-transporting layer 864 is a layer having a function for transporting holes that are injected from the first electrode layer 870 to the light-emitting layer 866. The hole-transporting layer 864 is provided as described above, whereby a distance between the first electrode layer 870 and the light-emitting layer 866 can be increased. As a result, quenching of light emission caused by a metal included in the first electrode layer 870 and the like can be prevented. The hole-transporting layer 864 is preferably formed using a hole-transporting substance, particularly using a substance that has a hole mobility of 1×10−6 cm2/Vs or more. It is to be noted that the hole-transporting substance is a substance whose hole mobility is higher than electron mobility and whose value of a ratio of hole mobility with respect to electron mobility (=hole mobility/electron mobility) is preferably larger than 100. As a specific example of a substance that can be used for the hole-transporting layer 864, the following can be given: 4,4′-bis[N-(1-napthyl)-N-phenylamino]biphenyl (abbreviation: NPB), 4,4′-bis[N-(3-methylphenyl)-N-phenylamino]biphenyl (abbreviation: TPD), 4,4′,4″-tris(N,N-diphenylamino)triphenylamine (abbreviation: TDATA), 4,4′,4″-tris[N-(3-methylphenyl)-N-phenylamino]triphenylamine (abbreviation: MTDATA), 4,4′-bis{N-[4-(N,N-di-m-tolylamino)phenyl]-N-phenylamino}biphenyl (abbreviation: DNTPD), 1,3,5-tris[N,N-di(m-tolyl)amino]benzene (abbreviation: m-MTDAB), 4,4′,4″-tris(N-carbazolyl)triphenylamine (abbreviation: TCTA), phthalocyanine (abbreviation: H2Pc), copper phthalocyanine (abbreviation: CuPc), vanadyl phthalocyanine (abbreviation: VOPc), 4,4′-bis[N-(4-biphenylyl)-N-phenylamino]biphenyl (abbreviation: BBPB), or the like. It is to be noted that the hole-transporting layer 864 may have a single layer structure or a stacked layer structure.

The light-emitting layer 866 is a layer having a light-emitting function, which contains a light-emitting material formed of an organic compound. Alternatively, the light-emitting layer 866 may contain an inorganic compound. The organic compound contained in the light-emitting layer 866 is not particularly limited as long as it is an organic compound with a light-emitting property. Various low molecular organic compounds and high molecular organic compounds can be used. Further, either a fluorescent light-emitting material or a phosphorescent light-emitting material may be used for the organic compound with a light-emitting property. The light-emitting layer 866 may be a layer containing only an organic compound with a light-emitting property or may be a layer that has a structure in which an organic compound with a light-emitting property is dispersed in a host material having a larger energy gap than the organic compound. In the case where the light-emitting layer 866 is a layer in which a plurality of compounds are mixed like a layer containing a light-emitting material formed of the organic compound and the host material, the light-emitting layer 866 can be formed by a co-evaporation method. Here, a co-evaporation method is an evaporation method in which materials are vaporized from a plurality of evaporation sources that are provided in one treatment chamber, and the vaporized materials are mixed in a vapor phase state and then deposited on the object to be processed.

The electron-transporting layer 868 is a layer having a function for transporting electrons that are injected from the second electrode layer 850 to the light emitting layer 866. The electron-transporting layer 868 is provided as described-above, whereby a distance between the second electrode layer 850 and the light-emitting layer 866 can be increased. As a result, quenching of light emission caused by a metal included in the second electrode layer 850 and the like can be prevented. The electron-transporting layer 868 is preferably formed using an electron-transporting substance, particularly using a substance that has an electron mobility of 1×10−6 cm2/Vs or more. It is to be noted that the electron-transporting substance is a substance whose electron mobility is higher than hole mobility and whose value of a ratio of electron mobility with respect to hole mobility (=electron mobility/hole mobility) is larger than 100. As a specific example of a substance that can be used for forming the electron-transporting layer 868, the following can be given: 2-(4-biphenylyl)-5-(4-tert-butylphenyl)-1,3,4-oxadiazole (abbreviation: PBD), 1,3-bis[5-(p-tert-butylphenyl)-1,3,4-oxadiazol-2-yl]benzene (abbreviation: OXD-7), 3-(4-tert-butylphenyl)-4-phenyl-5-(4-biphenylyl)-1,2,4-triazole (abbreviation: TAZ), 3-(4-tert-butylphenyl)-4-(4-ethylphenyl)-5-(4-biphenylyl)-1,2,4-triazole (abbreviation: p-EtTAZ), bathophenanthroline (abbreviation: BPhen), bathocuproin (abbreviation: BCP), 4,4-bis(5-methylbenzoxazol-2-yl)stilbene (abbreviation: BzOs), or the like as well as a metal complex such as tris(8-quinolinolato)aluminum (abbreviation: Alq3), tris(4-methyl-8-quinolinolato)aluminum (abbreviation: Almq3), bis(10-hydroxybenzo[h]-quinolinato)beryllium (abbreviation: BeBq2), bis(2-methyl-8-quinolinolato)-4-phenylphenolato-aluminum (abbreviation: BAlq), bis[2-(2-hydroxyphenyl)benzoxazolato]zinc (abbreviation: Zn(BOX)2), or bis[2-(2-hydroxyphenyl)benzothiazolato]zinc (abbreviation: Zn(BTZ)2). The electron-transporting layer 868 may have a single layer structure or a stacked layer structure.

The electron-injecting layer 869 is a layer having a function for supporting injection of electrons form the second electrode layer 850 to the electron-transporting layer 868. The electron-injecting layer 869 can be formed using a substance having relatively higher electron affinity than that of a substance used for forming the electron-transporting layer 868, which is selected from substances that can be used for forming the electron-transporting layer 868, such as BPhen, BCP, p-EtTAZ, TAZ, and BzOs. When the electron-injecting layer 869 is formed in such a manner, a difference of electron affinity between the second electrode layer 850 and the electron-transporting layer 868 is relieved, and electrons are easily injected. In addition, the electron-injecting layer 869 may contain an inorganic substance such as an alkali metal like lithium (Li), cesium (Cs), or the like; an oxide of an alkali metal like lithium oxide, potassium oxide, sodium oxide, or the like; an oxide of an alkaline earth metal like calcium oxide, magnesium oxide, or the like; a fluoride of an alkali metal like lithium fluoride, cesium fluoride, or the like; a fluoride of an alkaline earth metal like calcium fluoride or the like; or an alkaline earth metal like magnesium (Mg), calcium (Ca), or the like. In addition, the electron-injecting layer 869 may have a structure containing the organic compound such as BPhen, BCP, p-EtTAZ, TAZ, or BzOs or may have a structure containing an inorganic compound such as a fluoride of an alkali metal such as LiF or a fluoride of an alkaline earth metal such as CaF2. By providing the electron-injecting layer 869 as a thin film having a thickness of 1 nm to 2 nm by using an inorganic compound such as a fluoride of an alkali metal such as LiF or a fluoride of an alkaline earth metal such as CaF2, an energy band of the electron-injecting layer 869 is bent, or a tunnel current flows through the electron-injecting layer 869; accordingly, electrons are easily injected from the second electrode layer 850 to the electron-transporting layer 868.

It is to be noted that a hole-generating layer may be provided instead of the hole-injecting layer 862, or an electron-generating layer may be provided instead of the electron-injecting layer 869.

Here, the hole-generating layer is a layer for generating holes. The hole-generating layer can be formed by mixing at least one substance selected from hole-transporting substances and a substance showing an electron accepting property with respect to the hole-transporting substance. As the hole-transporting substance, a similar substance to the substance that can be used for forming the hole-transporting layer 864 can be used. As the substance showing an electron accepting property, metal oxide such as molybdenum oxide, vanadium oxide, ruthenium oxide, or rhenium oxide is preferably used.

The electron-generating layer is a layer for generating electrons. The electron-generating layer can be formed by mixing at least one substance selected from electron-transporting substances and a substance showing an electron donating property with respect to the electron-transporting substance. Here, as the electron-transporting substance, a similar substance to the substance that can be used for forming the electron-transporting layer 868 can be used. As the substance showing an electron donating property, a substance selected from an alkali metal or an alkaline earth metal, specifically lithium (Li), calcium (Ca), sodium (Na), potassium (K), magnesium (Mg), or the like can be used.

The hole-injecting layer 862, the hole-transporting layer 864, the light-emitting layer 866, the electron-transporting layer 868, and the electron-injecting layer 869 may be each formed by an evaporation method, a droplet-discharging method, a coating method, or the like. The first electrode layer 870 or the second electrode layer 850 may be formed by a sputtering method, an evaporation method, or the like.

In this embodiment mode, it is acceptable as long as the layer 860 includes at least the light-emitting layer 866, and the layers having other functions (the hole-injecting layer 862, the hole-transporting layer 864, the electron-transporting layer 868, the electron-injecting layer 869, and the like) may be provided as appropriate.

Further, the first electrode layer 870 may be a cathode, and the second electrode layer 850 may be an anode. In that case, the layer 860 has a structure in which an electron-injecting layer, an electron-transporting layer, a light-emitting layer, a hole-transporting layer, and a hole-injecting layer are sequentially stacked from the first electrode layer 870 side.

Next, an inorganic EL element will be described with reference to FIGS. 14A to 14C and FIGS. 15A to 15C. The inorganic EL element is classified into a dispersion-type inorganic EL element and a thin-film-type inorganic EL element, depending on its element structure. The former and the latter are different in that the former has a light-emitting layer in which particles of a light-emitting material are dispersed in a binder, whereas the latter has a light-emitting layer formed of a thin film of a light-emitting material. However, the former and the latter share a common feature that they need electrons accelerated by a high electric field. It is to be noted that, as a mechanism of light emission that is obtained, there are donor-acceptor recombination-type light emission that utilizes a donor level and an acceptor level, and localized-type light emission that utilizes inner-shell electron transition of a metal ion. In general, a dispersion-type inorganic EL element exhibits donor-acceptor recombination-type light emission and a thin-film-type inorganic EL element exhibits localized-type light emission.

A light-emitting material that can be used in the present invention includes a base material and an impurity element. The impurity element serves as a luminescent center. By varying the impurity element that is contained, light emission of various colors can be obtained. Various methods such as a solid-phase method and a liquid-phase method (a coprecipitation method) can be used for forming the light-emitting material. In addition, an evaporative decomposition method, a double decomposition method, a method by heat decomposition reaction of a precursor, a reversed micelle method, a method in which such a method and high temperature baking are combined, a liquid-phase method such as a freeze-drying method, or the like can be used.

A solid-phase method is a method in which a base material and an impurity element or a compound containing an impurity element are weighed, they are mixed in a mortar, and the mixture is heated and baked in an electronic furnace to be reacted, so that the impurity element is contained in the base material. The baking temperature is preferably 700° C. to 1500° C. This is because the solid reaction does not progress when the temperature is too low, whereas the base material is decomposed when the temperature is too high. It is to be noted that, although the baking may be carried out in a powder state, it is preferable that the baking be carried out in a pellet state. Although the solid-phase method needs baking at a relatively high temperature, the solid-phase method is simple; therefore, high productivity is obtained and the solid-phase method is suitable for mass production.

A liquid-phase method (a coprecipitation method) is a method in which a base material or a compound containing a base material and an impurity element or a compound containing an impurity element are reacted in a solution, dried, and then baked. Particles of a light-emitting material are distributed uniformly, and the reaction can progress even when the grain size is small and the baking temperature is low.

As a base material used for a light-emitting material, a sulfide, an oxide, or a nitride can be used. For the sulfide, for example, zinc sulfide, cadmium sulfide, calcium sulfide, yttrium sulfide, gallium sulfide, strontium sulfide, barium sulfide, or the like can be used. For the oxide, for example, zinc oxide, yttrium oxide, or the like can be used. For the nitride, for example, aluminum nitride, gallium nitride, indium nitride, or the like can be used. Furthermore, as the base material used for the light-emitting material, zinc selenide, zinc telluride, or the like can also be used. Alternatively, a ternary mixed crystal such as calcium gallium sulfide (CaGa2S4), strontium gallium sulfide (SrGa2S4), or barium gallium sulfide (BaGa2S4) may also be used.

For an impurity element of the localized-type light emission, manganese (Mn), copper (Cu), samarium (Sm), terbium (Th), erbium (ET), thulium (Tm), europium (Eu), cerium (Ce), praseodymium (Pr), or the like can be used. It is to be noted that a halogen element such as fluorine (F) or chlorine (Cl) may be added, which can serve as charge compensation.

On the other hand, for an impurity element of the donor-acceptor recombination-type light emission, a light-emitting material containing a first impurity element which forms a donor level and a second impurity element which forms an acceptor level can be used. As the first impurity element, for example, fluorine (F), chlorine (Cl), aluminum (Al), or the like can be used. As the second impurity element, for example, copper (Cu), silver (Ag), or the like can be used.

In the case where the light-emitting material of the donor-acceptor recombination-type light emission is synthesized by a solid-phase method, each of a base material, a first impurity element or a compound containing a first impurity element, and a second impurity element or a compound containing a second impurity element is weighed and mixed in a mortar, and then heated and baked in an electronic furnace. The above-described base material can be used for the base material. As the first impurity element or the compound containing the first impurity element, for example, fluorine (F), chlorine (Cl), aluminum sulfide, or the like can be used. As the second impurity element or the compound containing the second impurity element, for example, copper (Cu), silver (Ag), copper sulfide, silver sulfide, or the like can be used. The baking temperature is preferably 700° C. to 1500° C. This is because the solid reaction does not progress when the temperature is too low, whereas the base material is decomposed when the temperature is too high. It is to be noted that, although the baking may be carried out in a powder state, it is preferable that the baking be carried out in a pellet state.

As an impurity element in the case of utilizing solid-phase reaction, a compound including a first impurity element and a second impurity element may be used. In this case, the impurity element is easily diffused and solid-phase reaction easily progresses; thus, a uniform light-emitting material can be obtained. Moreover, since an unnecessary impurity element does not enter, a light-emitting material with high purity can be obtained. As the compound including the first impurity element and the second impurity element, for example, copper chloride, silver chloride, or the like can be used.

It is to be noted that these impurity elements may be contained at concentrations of 0.01 atom % to 10 atom %, preferably, 0.05 atom % to 5 atom % with respect to the base material.

In the case of the thin-film-type inorganic EL element, a light-emitting layer, which contains the above-described light-emitting material, can be formed by a vacuum evaporation method such as a resistance heating evaporation method or an electron beam evaporation (EB evaporation) method; a physical vapor deposition method (PVD) such as a sputtering method; a chemical vapor deposition method (CVD) such as a metal organic CVD method or a low-pressure hydride transport CVD method; an atomic layer epitaxy method (ALE); or the like.

Examples of a thin-film-type inorganic EL element that can be used as a light-emitting element are shown in FIGS. 14A to 14C. In FIGS. 14A to 14C, each light-emitting element includes a first electrode layer 50, a layer 51, and a second electrode layer 53. The layer 51 includes at least a light-emitting layer 52.

In the light-emitting element shown in FIG. 14A, the layer 51 including only the light-emitting layer 52 is interposed between the first electrode layer 50 and the second electrode layer 53. The light-emitting elements shown in FIGS. 14B and 14C have a structure in which an insulating layer is provided between the light-emitting layer 52, and the first electrode layer 50 and the second electrode layer 53 in the light-emitting element of FIG. 14A. The light-emitting element shown in FIG. 14B has a structure in which an insulating layer 54 is provided between the first electrode layer 50 and the light-emitting layer 52. The light-emitting element shown in FIG. 14C has a structure in which an insulating layer 54 a is provided between the first electrode layer 50 and the light-emitting layer 52 and an insulating layer 54 b is provided between the second electrode layer 53 and the light-emitting layer 52. As described above, an insulating layer may be provided between the light-emitting layer and one of a pair of the electrode layers that sandwiches the light-emitting layer. Alternatively, an insulating layer may be provided between a light-emitting layer and one of a pair of electrode layers that sandwich the light-emitting layer and another insulating layer may be provided between the light-emitting layer and the other one of the pair of electrode layers. The insulating layer may have a single layer structure or a stacked layer structure.

In FIG. 14B, the insulating layer 54 is provided to be in contact with the first electrode layer 50; however, the order of the insulating layer and the light-emitting layer may be reversed so that the insulating layer 54 is provided to be in contact with the second electrode layer 53.

Next, a dispersion-type inorganic EL element will be described. In the case of the dispersion-type inorganic EL element, particulate light-emitting materials are dispersed in a binder, so that a film-shaped light-emitting layer is formed. When particles having a desired size cannot be sufficiently obtained by a formation method of a light-emitting material, the light-emitting materials may be processed into particles by crushing in a mortar or the like. The binder is a substance for fixing the particulate light-emitting materials in a dispersion state and holding the light-emitting materials in a form of a light-emitting layer. The light-emitting materials are uniformly dispersed in the light-emitting layer by the binder and are fixed.

In the case of the dispersion-type inorganic EL element, as a formation method of a light-emitting layer, a droplet-discharging method capable of selectively forming a light-emitting layer; a printing method (such as screen printing or offset printing); or a coating method such as a spin coating method; a dipping method; a dispenser method; or the like can be used. Although there is no particular limitation on the thickness of the light-emitting layer, the thickness thereof is preferably in the range of 10 nm to 1000 nm. The ratio of the light-emitting material in the light-emitting layer containing the light-emitting material to the binder may be greater than or equal to 50 wt % and less than or equal to 80 wt %.

Examples of a dispersion-type inorganic EL element that can be used as a light-emitting element are shown in FIGS. 15A to 15C. In FIGS. 15A to 15C, each light-emitting element includes a first electrode layer 60, a layer 65, and a second electrode layer 63. The layer 65 includes at least a light-emitting layer.

The light-emitting element shown in FIG. 15A has a stacked layer structure of the first electrode layer 60, the light-emitting layer 62, and the second electrode layer 63. In the light-emitting layer 62, light-emitting materials 61 held by a binder are included.

As a binder that can be used in this embodiment mode, an insulating material can be used. Specifically, an organic insulating material or an inorganic insulating material can be used, and a mixture material of an organic insulating material and an inorganic insulating material may be used. As an organic insulating material, polymer that has relatively high dielectric constant like a cyanoethyl cellulose-based resin; or a resin such as polyethylene, polypropylene, a polystyrene-based resin, a silicone resin, an epoxy resin, or vinylidene fluoride can be used. Alternatively, a heat-resistant high molecular material such as aromatic polyamide or polybenzoimidazole, or a siloxane resin may be used. It is to be noted that the siloxane resin corresponds to a resin having Si—O—Si bonds. Siloxane has a skeleton structure formed from a bond of silicon (Si) and oxygen (O) and has an organic group containing at least hydrogen (for example, an alkyl group or aromatic hydrocarbon) as a substituent. Alternatively, as the substituent, a fluoro group may be used. Further alternatively, as the substituent, an organic group containing at least hydrogen, and a fluoro group may be used. A vinyl resin such as polyvinyl alcohol or polyvinyl butyral, or another resin material such as a phenol resin, a novolac resin, an acrylic resin, a melamine resin, a urethane resin, or an oxazole resin (polybenzoxazole) may also be used. A dielectric constant can also be controlled by mixing these resins with microparticles having a high dielectric constant such as barium titanate (BaTiO3) or strontium titanate (SrTiO3) as appropriate.

As the inorganic material contained in the binder, the following can be used: materials such as silicon oxide, silicon nitride, silicon containing oxygen and nitrogen, aluminum nitride, aluminum containing oxygen and nitrogen, aluminum oxide, titanium oxide, BaTiO3, SrTiO3, lead titanate, potassium niobate, lead niobate, tantalum oxide, barium tantalate, lithium tantalate, yttrium oxide, zirconium oxide, and other substances containing an inorganic material. When an inorganic material having a high dielectric constant is mixed with an organic material (by addition or the like), a dielectric constant of a light-emitting layer including a light-emitting material and a binder can be further controlled and increased. A mixed layer of an inorganic insulating material and an organic insulating material is used for a binder, and the high dielectric constant is obtained, whereby further higher electric charge can be induced by the light-emitting material.

In the manufacturing process, the light-emitting materials are dispersed in a solution containing a binder. As a solvent of the solution containing a binder that can be used in this embodiment, it is acceptable as long as a solvent dissolves a binder material and can make a solution with the viscosity which is appropriate for a method of forming a light-emitting layer (various wet processes) and for a desired thickness. An organic solvent or the like can be used, and for example, when a siloxane resin is used as the binder, propylene glycolmonomethyl ether, propylene glycolmonomethyl ether acetate (also referred to as PGMEA), 3-methoxy-3-methyl-1-butanol (also referred to as MMB), or the like can be used.

The light-emitting elements shown in FIGS. 15B and 15C have a structure in which an insulating layer is provided between the light-emitting layer 62, and the first electrode layer 60 and the second electrode layer 63 in the light-emitting element in FIG. 15A. The light-emitting element shown in FIG. 15B has a structure in which an insulating layer 64 is provided between the first electrode layer 60 and the light-emitting layer 62. The light-emitting element shown in FIG. 15C has a structure in which an insulating layer 64 a is provided between the first electrode layer 60 and the light-emitting layer 62 and an insulating layer 64 b is provided between the second electrode layer 63 and the light-emitting layer 62. As described above, the insulating layer may be provided between the light-emitting layer and one of a pair of electrode layers that sandwiches the light-emitting layer. Alternatively, an insulating layer may be provided between the light-emitting layer and one of a pair of electrode layers that sandwiches the light-emitting layer and another insulating layer may be provided between the light-emitting layer and the other one of the pair of electrode layers. The insulating layer may have a single layer structure or a stacked layer structure.

In FIG. 15B, the insulating layer 64 is provided to be in contact with the first electrode layer 60; however, the order of the insulating layer and the light-emitting layer may be reversed so that the insulating layer 64 is provided to be in contact with the second electrode layer 63.

Insulating layers such as the insulating layer 54 in FIGS. 14A to 14C and the insulating layer 64 in FIGS. 15A to 15C are not particularly limited; however, it is preferable that the insulating layer have high withstand voltage, be a dense film, and furthermore have a high dielectric constant. For example, the insulating layer can be formed using silicon oxide, yttrium oxide, titanium oxide, aluminum oxide, hafnium oxide, tantalum oxide, barium titanate, strontium titanate, lead titanate, silicon nitride, zirconium oxide, or the like; a mixed layer thereof; or a stacked layer containing two or more kinds of these. These insulating layers can be formed by a sputtering method, an evaporating method, a CVD method, or the like. Alternatively, the insulating layer may be formed in such a manner that particles of these insulating materials are dispersed in a binder. A binder material may be formed of a material that is similar to a binder contained in a light-emitting layer and may be formed by a similar method. Although there is no particular limitation on a thickness of the insulating layer, the thickness thereof is preferably in the range of 10 nm to 1000 nm.

The inorganic EL elements shown in FIGS. 14A to 14C and FIGS. 15A to 15C can obtain light emission by applying a voltage between a pair of electrode layers that sandwich the light-emitting layer; however, the light-emitting element can also operate by either DC driving or AC driving.

The light-emitting elements shown in this embodiment mode (FIG. 13, FIGS. 14A to 14C, and FIGS. 15A to 15C) can be provided as a display element of a display device shown in the above embodiment modes.

For example, in the case where the organic EL element shown in FIG. 13 is applied to the display device shown in FIGS. 12A to 12C, the first electrode layer 5012 or the second electrode layer 5018 corresponds to the first electrode layer 870 or the second electrode layer 850. The layer 5016 corresponds to the layer 860. In the case of the display device shown in FIGS. 19A and 19B, similarly, the first electrode layer 932 or the second electrode layer 936 corresponds to the first electrode layer 870 or the second electrode layer 850. The layer 934 corresponds to the layer 860.

Further, the same thing can be said to the case where the inorganic EL elements shown in FIGS. 14A to 14C and FIGS. 15A to 15C are applied to the display device shown in FIGS. 12A to 12C. The first electrode layer 5012 or the second electrode layer 5018 corresponds to the first electrode layer 50 or the second electrode layer 53 in FIGS. 14A to 14C, or the first electrode layer 60 or the second electrode layer 63 in FIGS. 15A to 15C. The layer 5016 corresponds to the layer 51 or the layer 65. In the case of the display device shown in FIGS. 19A and 19B, similarly, the first electrode layer 932 or the second electrode layer 936 corresponds to the first electrode layer 50 or the second electrode layer 53 in FIGS. 14A to 14C, or the first electrode layer 60 or the second electrode layer 63 in FIGS. 15A to 15C. The layer 934 corresponds to the layer 51 or the layer 65.

A layer of an electrode or the like used for forming an element can be formed into a desired shape according to the present invention. Further, the number of lithography processes using a photoresist can be reduced and the lithography process can be simplified, and the throughput can be improved.

This embodiment mode can be appropriately combined with Embodiment Modes 1 to 10.

Embodiment Mode 12

In this embodiment mode, a liquid crystal display device will be described.

FIG. 26A is a top view of a liquid crystal display device, and FIG. 26B is a cross-sectional view of FIG. 26A taken along a line G-H.

As shown in FIG. 26A, a pixel region 606, a driver circuit region 608 a that is a scanning line driver circuit, and a driver circuit region 608 b that is a scanning line driver region are sealed between a substrate 600 and a sealing substrate 695 with a sealant 692. A driver circuit region 607 that is a signal line driver circuit formed using an IC driver is provided over the substrate 600. In the pixel region 606, a transistor 622 and a capacitor 623 are provided, and in the driver circuit region 608 b, a driver circuit including a transistor 620 and a transistor 621 is provided. A substrate similar to that in the above embodiment mode can be used as the substrate 600. Although there is concern that a substrate made of a synthetic resin generally has lower allowable temperature limit than other substrates, the substrate made of a synthetic resin can be employed when replacement by a high heat-resistant substrate is performed after a manufacturing process.

In the pixel region 606, the transistor 622 functioning as a switching element is provided over the substrate 600 with a base insulating layer 604 a and a base insulating layer 604 b interposed therebetween. In this embodiment mode, the transistor 622 is a multi-gate thin film transistor, which includes a semiconductor layer including impurity regions that serve as a source region and a drain region, a gate insulating layer, a gate electrode layer having a stacked structure of two layers, and a source electrode layer and a drain electrode layer. The source electrode layer or drain electrode layer is in contact with and is electrically connected to the impurity region of the semiconductor layer and a pixel electrode layer 630.

The source electrode layer or drain electrode layer has a stacked layer structure. Source electrode or drain electrode layers 644 a and 644 b are electrically connected to the pixel electrode layer 630 in an opening formed in an insulating layer 615. The opening in the insulating layer 615 can be formed utilizing ablation by laser beam irradiation shown in the above embodiment modes. In this embodiment mode, a low-melting point metal which can be relatively easily evaporated (chromium in this embodiment mode) is used for the source electrode layer or drain electrode layer 644 b, and a high-melting point metal which cannot be easily evaporated compared to the source electrode layer or drain electrode layer 644 b (tungsten in this embodiment mode) is used for the source electrode layer or drain electrode layer 644 a. The source electrode layer or drain electrode layer 644 b is irradiated with a laser beam through a photomask from the insulating layer 615 side, and an irradiated region of the source electrode layer or drain electrode layer 644 b and a part of the insulating layer 615 over the irradiated region are removed by the irradiation energy, so that an opening reaching the source electrode layer or drain electrode layer 644 b can be formed. Moreover, the source electrode layer or drain electrode layer 644 b is removed by etching with the use of the insulating layer 615 as a mask, so that an opening reaching the source electrode layer or drain electrode layer 644 a is formed. In forming the opening by etching, a wet etching method, a dry etching method, or both of the methods may be used, and the method may be performed plural times.

The pixel electrode layer 630 is formed in the opening where the source electrode or drain electrode layers 644 a and 644 b are exposed, so that the source electrode or drain electrode layers 644 a and 644 b can be electrically connected to the pixel electrode layer 630. It is to be noted that the pixel electrode layer 630 may be formed without forming an opening in the source electrode layer or drain electrode layer 644 b.

A thin film transistor can be manufactured by various methods. For example, a crystalline semiconductor layer is employed as an active layer. A gate electrode layer is provided over the crystalline semiconductor layer with a gate insulating layer interposed therebetween. An impurity element can be added to the active layer using the gate electrode layer. By addition of an impurity element using the gate electrode layer in this manner, a mask does not need to be formed for addition of an impurity element. The gate electrode layer can have a single layer structure or a stacked layer structure. The impurity region can be formed into a high-concentration impurity region and a low-concentration impurity region by controlling the concentration thereof. A thin film transistor having a low-concentration impurity region in this manner has a structure referred to as an LDD (Lightly Doped Drain) structure. The low-concentration impurity region can be formed to be overlapped with the gate electrode, and such a thin film transistor has a structure referred to as a GOLD (Gate Overlapped LDD) structure. The thin film transistor is formed to have n-type polarity by using phosphorus (P) or the like for the impurity region. In the case of p-type polarity, boron (B) or the like may be added. After that, an insulating layer 611 and an insulating layer 612 are formed to cover the gate electrode layer and the like. Dangling bonds of the crystalline semiconductor layer can be terminated by hydrogen mixed in the insulating layer 611 (and the insulating layer 612).

In order to further improve planarity, the insulating layer 615 may be formed as an interlayer insulating layer. The insulating layer 615 can be formed using an organic insulating material or an inorganic insulating material to have a single layer structure or a stacked layer structure. For example, the insulating layer 615 can be formed of a material such as silicon oxide, silicon nitride, silicon oxynitride, silicon nitride oxide, aluminum nitride, aluminum oxynitride, aluminum nitride oxide having a higher content of nitrogen than that of oxygen, aluminum oxide, diamond-like carbon (DLC), polysilazane, nitrogen-containing carbon (CN), phosphosilicate glass (PSG), borophosphosilicate glass (BPSG), alumina, or substances including an inorganic insulating material. Alternatively, an organic insulating material may be used; an organic material may be either photosensitive or non-photosensitive; and polyimide, acrylic, polyamide, polyimide amide, resist, benzocyclobutene, a siloxane resin, or the like can be used. It is to be noted that the siloxane resin corresponds to a resin having Si—O—Si bonds. Siloxane has a skeleton structure formed from a bond of silicon (Si) and oxygen (O). As a substituent, an organic group containing at least hydrogen (for example, an alkyl group or aromatic hydrocarbon) is used. A fluoro group may be used as the substituent. Alternatively, an organic group containing at least hydrogen and a fluoro group may be used as the substituent

By using a crystalline semiconductor layer, the pixel region and the driver circuit region can be formed over the same substrate. In that case, the transistor in the pixel region 606 and the transistor in the driver circuit region 608 b are formed at the same time. The transistor used in the driver circuit region 608 b constitutes part of a CMOS circuit. Although the thin film transistor included in the CMOS circuit has a GOLD structure, it may have an LDD structure like the transistor 622.

Without limitation to this embodiment mode, the thin film transistor in the pixel region 606 may have a single-gate structure in which a single channel formation region is formed, a double-gate structure in which two channel formation regions are formed, or a triple-gate structure in which three channel formation regions are formed. In addition, the thin film transistor of a peripheral driver circuit region may also have a single-gate structure, a double-gate structure, or a triple-gate structure.

It is to be noted that without limitation to the formation method of a thin film transistor described in this embodiment mode, the present invention can be used in a top-gate structure (such as a staggered structure), a bottom-gate structure (such as an inverted staggered structure), a dual-gate structure including two gate electrode layers provided above and below a channel region each with a gate insulating film interposed therebetween, or another structure.

Next, an insulating layer 631 called an alignment film is formed by a printing method or a droplet-discharging method to cover the pixel electrode layer 630. It is to be noted that the insulating layer 631 can be selectively formed by using a screen printing method or an offset printing method. After that, rubbing treatment is performed. The rubbing treatment is not necessarily performed when the mode of liquid crystal is, for example, a VA mode. An insulating layer 633 serving as an alignment film is similar to the insulating layer 631. Then, the sealant 692 is formed by a droplet-discharging method in a peripheral region of the pixel region.

After that, the sealing substrate 695 provided with the insulating layer 633 serving as an alignment film, a conductive layer 634 serving as a counter electrode, a colored layer 635 serving as a color filter, a polarizer 641 (also referred to as a polarizing plate), and a polarizer 642 is attached to the substrate 600 that is a TFT substrate with a spacer 637 interposed therebetween, and a liquid crystal layer 632 is provided in a gap therebetween. Since the liquid crystal display device of this embodiment mode is of transmissive type, a polarizer (polarizing plate) 643 is provided on a side of the substrate 600 opposite to the side having elements. The polarizer can be provided over the substrate using an adhesive layer. The sealant may be mixed with a filler, and further, the sealing substrate 695 may be provided with a shielding film (black matrix), or the like. It is to be noted that the color filter or the like may be formed of materials exhibiting red (R), green (G), and blue (B) when the liquid crystal display device performs full color display. When performing monochrome display, the colored layer may be omitted or formed of a material exhibiting at least one color.

It is to be noted that the color filter is not provided in some cases where light-emitting diodes (LEDs) of RGB or the like are arranged as a backlight and a successive additive color mixing method (field sequential method) in which color display is performed by time division is employed. The black matrix is preferably provided so as to be overlapped with a transistor and a CMOS circuit for the sake of reducing reflection of external light by wirings of the transistor and the CMOS circuit. It is to be noted that the black matrix may be provided so as to be overlapped with a capacitor. This is because reflection by a metal film forming the capacitor can be prevented.

The liquid crystal layer can be formed by a dispenser method (dripping method), or an injecting method by which liquid crystal is injected using a capillary phenomenon after attaching the substrate 600 including an element to the sealing substrate 695. A dripping method is preferably employed when using a large substrate to which an injecting method is not easily applied.

Although the spacer may be provided in such a way that particles each having a size of several μm are dispersed, the spacer in this embodiment mode is formed by a method in which a resin film is formed over an entire surface of the substrate and then etched. A material of the spacer is applied by a spinner and then subjected to light exposure and development to form a predetermined pattern. Moreover, the material is heated at 150° C. to 200° C. in a clean oven or the like so as to be hardened. The thus manufactured spacer can have various shapes depending on the conditions of the light exposure and development. It is preferable that the spacer have a columnar shape with a flat top so that mechanical strength of the liquid crystal display device can be secured when the counter substrate is attached. The shape can be conical, pyramidal, or the like, and there is no particular limitation on the shape.

Then, terminal electrode layers 678 a and 678 b electrically connected to the pixel region are provided with an FPC 694 that is a wiring board for connection with an anisotropic conductive layer 696 interposed therebetween. The FPC 694 functions to transmit external signals or potential. Through the above steps, a liquid crystal display device having a display function can be manufactured.

A wiring and a gate electrode layer which are included in the transistor, the pixel electrode layer 630, and the conductive layer 634 that is a counter electrode layer can be formed using a material such as indium tin oxide (ITO), indium zinc oxide (IZO) formed using a target in which indium oxide is mixed with zinc oxide (ZnO), a conductive material in which indium oxide is mixed with silicon oxide (SiO2), organic indium, organic tin, indium oxide containing tungsten oxide, indium zinc oxide containing tungsten oxide, indium oxide containing titanium oxide, or indium tin oxide containing titanium oxide; a metal such as tungsten (W), molybdenum (Mo), zirconium (Zr), hafnium (Hf), vanadium (V), niobium (Nb), tantalum (Ta), chromium (Cr), cobalt (Co), nickel (Ni), titanium (Ti), platinum (Pt), aluminum (Al), copper (Cu) or silver (Ag); an alloy containing the above metal as its main component; or metal nitride thereof.

A retardation film may be stacked between the polarizing plate and the liquid crystal layer.

Although a TN liquid crystal panel is described in this embodiment mode, the above process can be similarly applied to a liquid crystal panel of another type. For example, this embodiment mode can be applied to a liquid crystal panel of a transverse electrical field type in which liquid crystal is orientated by applying an electric field parallel to a glass substrate. Further, this embodiment mode can be applied to a liquid crystal panel of a VA (Vertical Alignment) type.

FIGS. 39 and 24 show a pixel structure of a VA-type liquid crystal panel. FIG. 39 is a plan view, and FIG. 24 is a cross-sectional view of a structure taken along a line I-J in FIG. 39. Hereinafter, the pixel structure will be described explained with reference to both drawings.

In this pixel structure, a plurality of pixel electrodes are included in one pixel, and TFTs are connected to the pixel electrodes. Each of the TFTs is driven by a different gate signal. In other words, a multi-domain pixel has a structure in which signals applied to the pixel electrodes are individually controlled.

A pixel electrode layer 1624 is connected to a TFT 1628 with a wiring layer 1618 through an opening (contact hole) 1623. A pixel electrode layer 1626 is connected to a TFT 1629 with a wiring layer 1619 through an opening (contact hole) 1627. A gate wiring layer 1602 of the TFT 1628 and a gate electrode layer 1603 of the TFT 1629 are separated so that different gate signals can be given. On the other hand, a wiring layer 1616 serving as a data line is used in common for the TFT 1628 and the TFT 1629.

The pixel electrode layer 1624 and the pixel electrode layer 1626 may be formed utilizing ablation by laser beam irradiation through a photomask as shown in the above embodiment modes. A mask formed of an insulating layer (or an insulating layer and a light absorption layer) is formed by laser ablation, and a layer to be processed in a lower layer is processed by etching using the mask, so that a desired pixel electrode layer can be obtained. By implementation of the present invention in such a manner, the number of lithography processes can be reduced; therefore, the process can be simplified, and the throughput can be improved. Further, contamination due to an impurity such as a photoresist or the like can be prevented.

A shape of the pixel electrode layer 1624 and a shape of the pixel electrode layer 1626 are different from each other, and those pixel electrode layers are separated by a slit 1625. The pixel electrode layer 1626 is formed so as to surround the external side of the pixel electrode layer 1624 that is spread in a V-shaped manner Timing of voltage application is made to vary between the pixel electrode layer 1624 and the pixel electrode layer 1626 by the TFT 1628 and the TFT 1629, whereby orientation of liquid crystal is controlled. A counter substrate 1601 is provided with a light-blocking layer 1632, a colored layer 1636, and a counter electrode layer 1640. Furthermore, a planarization layer 1637 is formed between the colored layer 1636 and the counter electrode layer 1640, whereby orientation disorder of liquid crystal is prevented. FIG. 25 shows a structure of the counter substrate side. Although the counter electrode layer 1640 is used in common between different pixels, a slit 1641 is formed. This slit 1641 and the slit 1625 on the side of the pixel electrode layers 1624 and 1626 are arranged to be meshed alternately, whereby an oblique electric field is efficiently generated, and orientation of liquid crystal can be controlled. Thus, directions in which liquid crystal is orientated can be varied depending on places, and a viewing angle is widened.

This embodiment mode can be appropriately combined with Embodiment Modes 1 to 7.

By employing the present invention, the number of lithography processes can be reduced, and the manufacturing process can be simplified; therefore, the throughput can be improved. As a result, a display device can be manufactured with high productivity.

In addition, resist coating, a development step, and the like can be omitted; therefore, there is no need for rotating a substrate, and then a large substrate is easily treated. Furthermore, with the use of linear laser beam or a planer laser beam having a large area such as a rectangular laser beam or a circular laser beam, a plurality of regions can be irradiated with a laser beam in a short time. As a result, a lot of patterns can be formed in a short time over a large substrate, and a display device can be manufactured with high productivity.

Embodiment Mode 13

In this embodiment mode, a liquid crystal display device using a liquid crystal display element as a display element will be described.

In a display device shown in FIG. 27, the following components are provided over a substrate 250: a transistor 220 that is an inverted staggered transistor, a pixel electrode layer 251, an insulating layer 252, an insulating layer 253, a liquid crystal layer 254, a spacer 281, an insulating layer 235, a counter electrode layer 256, a color filter 258, a black matrix 257, a counter substrate 210, a polarizing plate (polarizer) 231, a polarizing plate (polarizer) 233 in a pixel region; and a sealant 282, a terminal electrode layer 287, an anisotropic conductive layer 288, and an FPC 286 in a sealing region.

A gate electrode layer, a semiconductor layer, a source electrode layer, and a drain electrode layer of the transistor 220 that is an inverted staggered transistor, and the pixel electrode layer 251 formed in this embodiment mode may be formed, as shown in Embodiment Mode 1 or the like, by the steps of: forming a mask utilizing ablation by laser beam irradiation and performing etching using the mask. With the use of the present invention in such a manner, the number of lithography processes using a photoresist can be reduced, and the lithography process can be simplified, and thus, the throughput can be improved.

In this embodiment mode, an amorphous semiconductor layer is used as a semiconductor layer for forming a channel. A semiconductor layer having one conductivity type provided between a source electrode layer or drain electrode layer and the semiconductor layer for forming a channel may be formed as needed. In this embodiment mode, a semiconductor layer for forming a channel and an amorphous n-type semiconductor layer as a semiconductor layer having one conductivity type are stacked. Moreover, an NMOS structure of an n-channel thin film transistor where an n-type semiconductor layer is formed as a semiconductor layer for forming a channel, a PMOS structure of a p-channel thin film transistor where a p-type semiconductor layer is formed, or a CMOS structure of an n-channel thin film transistor and a p-channel thin film transistor can be manufactured.

In order to impart a conductivity type, an element for imparting a conductivity type is added by doping, and an impurity region is formed in the semiconductor layer, whereby an n-channel transistor or a p-channel transistor can be formed. Instead of forming an n-type semiconductor layer, plasma treatment with a PH3 gas may be performed, so that a conductivity type is imparted to the semiconductor layer.

In this embodiment mode, the transistor 220 is an n-channel inverted staggered thin-film transistor. A channel protection-type inverted staggered thin-film transistor can be used, where a protective layer is provided over a channel region of a semiconductor layer.

Next, a structure of a backlight unit 352 will be explained. The backlight unit 352 includes a cold cathode tube, a hot cathode tube, a light-emitting diode, an inorganic EL element, or an organic EL element as a light source 361 that emits light (fluorescence); a lamp reflector 362 for effectively leading light (fluorescence) to a light conducting plate 365; the light conducting plate 365 by which light (fluorescence) is totally reflected and led to the entire surface of the display panel; a diffusing plate 366 for reducing variations in brightness; and a reflector plate 364 for reusing light leaked under the light conducting plate 365.

A control circuit for controlling the luminance of the light source 361 is connected to the backlight unit 352. The luminance of the light source 361 can be controlled by a signal supplied from the control circuit.

The source electrode layer or drain electrode layer of the transistor 220 is electrically connected to the pixel electrode layer 251 in an opening that is formed in the insulating layer 252. The opening formed in the insulating layer 252 may be formed utilizing ablation by laser beam irradiation as shown in the above embodiment modes or may be formed using a lithography technique. In this embodiment mode, a low-melting point metal which can be relatively easily evaporated (chromium in this embodiment mode) is used for the source electrode layer or drain electrode layer. The source electrode layer or drain electrode layer is irradiated with a laser beam through a photomask from the insulating layer 252 side, whereby an irradiated region of the source electrode layer or drain electrode layer and a part of the insulating layer 252 over the irradiated region are removed by irradiation energy, and an opening reaching the semiconductor layer having one conductivity type can be formed.

The pixel electrode layer 251 is formed in the opening where the source electrode layer or drain electrode layer and the semiconductor layer having one conductivity are exposed, and thus, the pixel electrode layer 251 can be electrically connected to the semiconductor layer having one conductivity type and the source electrode layer or drain electrode layer.

By employing the present invention, the number of lithography processes can be reduced, and the manufacturing process can be simplified; therefore, the throughput can be improved. As a result, a display device can be manufactured with high productivity.

In addition, resist coating, a development step, or the like can be omitted; therefore, there is no need for rotating a substrate, and then a large substrate is easily treated. Furthermore, with the use of a linear laser beam or a planar laser beam having a large area such as a rectangular laser beam or a circular laser beam, a plurality of regions can be irradiated with a laser beam in a short time. As a result, a lot of patterns can be formed over a large substrate in a short time, and a display device can be manufactured with high productivity.

This embodiment mode can be appropriately combined with Embodiment Modes 1 to 7.

Embodiment Mode 14

In this embodiment mode, an example of a display device different from that of the above embodiment mode will be described.

FIG. 29 shows an active-matrix electronic paper to which the present invention is applied. Although the active-matrix electronic paper is shown in FIG. 29, the present invention can also be applied to a passive-matrix electronic paper.

As the electronic paper, a twisting ball display system can be used. A twisting ball display system is a method in which display is performed by arranging spherical particles each of which is colored separately in black and white between a first electrode layer and a second electrode layer, and generating a potential difference between the first electrode layer and the second electrode layer so as to control the directions of the spherical particles.

A transistor 5801 is an inverted coplanar thin film transistor, which includes a gate electrode layer 5802, a gate insulating layer 5804, wiring layers 5805 a and 5805 b, and a semiconductor layer 5806. The wiring layers 5805 a and 5805 b serve as a source electrode layer or drain electrode layer. In addition, the wiring layer 5805 b is electrically connected to a first electrode layer 5807 through an opening formed in an insulating layer 5908. Between the first electrode layer 5807 and a second electrode layer 5808, spherical particles 5809, each of which includes a black region 5900 a and a white region 5900 b, and a cavity 5904 which is filled with liquid around the black region 5900 a and the white region 5900 b, are provided. A space around the spherical particle 5809 is filled with a filler 5905 such as a resin.

In this embodiment mode, the gate electrode layer 5802, the semiconductor layer 5806, the wiring layers 5805 a and 5805 b, ant the like included in the transistor 5801 can be formed as follows. As shown in the above embodiment modes, a light absorption layer and an insulating layer are stacked over a layer to be processed that is to be an object layer; a mask is formed utilizing laser ablation by laser beam irradiation through a photomask; and the layer to be processed is etched using the mask.

The wiring layer 5805 b is electrically connected to the first electrode layer 5807 in the opening formed in the insulating layer 5908. The opening in the insulating layer 5908 can be formed utilizing laser ablation by laser beam irradiation as shown in the above embodiment modes. In this embodiment mode, a low-melting point metal which can be relatively easily evaporated (chromium in this embodiment mode) is used for the wiring layer 5805 b. The wiring layer 5805 b is selectively irradiated with a laser beam from the insulating layer 5908 side, and a part of the insulating layer 5908 over an irradiated region of the wiring layer 5805 b is removed by the irradiation energy, so that an opening reaching the wiring layer 5805 b can be formed. Further, with the insulating layer 5908 as a mask, the wiring layer 5805 b is removed by etching, so that an opening reaching the gate insulating layer 5804 is formed. In forming the opening by etching, a wet etching method, a dry etching method, or both of the methods may be used, and the method may be performed plural times.

The first electrode layer 5807 is formed in the opening where the wiring layer 5805 b is exposed, and thus, the wiring layer 5805 b and the first electrode layer 5807 can be electrically connected. It is to be noted that the present invention is not particularly limited, and after the opening reaching the wiring layer 5805 b is formed in the insulating layer 5908 utilizing laser ablation, the first electrode layer 5807 may be formed without etching the wiring layer 5805 b. Alternatively, by utilizing laser ablation, an upper portion or an entire portion of the irradiated region of the wiring layer 5805 b as well as the part of the insulating layer 5908 may be removed to form an opening.

By utilizing laser ablation, an opening can be formed in the insulating layer by laser beam irradiation without performing a complicated lithography process.

Instead of the twisting ball, an electrophoretic element can also be used. A microcapsule having a diameter of approximately 10 μm to 20 μm, in which a transparent liquid, and positively charged white microparticles and negatively charged black microparticles are encapsulated, is used. In the microcapsule that is provided between the first electrode layer and the second electrode layer, when an electric field is applied by the first electrode layer and the second electrode layer, the white microparticles and the black microparticles migrate to opposite sides to each other, so that white or black can be displayed. A display element using this principle is an electrophoretic display element, and is called electronic paper in general. The electrophoretic display element has higher reflectivity than a liquid crystal display element, and thus, an auxiliary light is unnecessary, less power is consumed, and a display portion can be recognized in a dusky place. Even when power is not supplied to the display portion, an image which has been displayed once can be maintained. Thus, it is possible that a displayed image can be stored, even if a display device having a display function is distanced from a source of an electric wave.

Any structure is acceptable for the transistor as long as the transistor can serve as a switching element. The semiconductor layer may be formed using various semiconductors such as an amorphous semiconductor, a crystalline semiconductor, a polycrystalline semiconductor, and a microcrystalline semiconductor, or an organic transistor may be formed using an organic compound.

Although this embodiment mode specifically shows the case where a structure of a display device is an active-matrix type, the present invention can be naturally applied to a passive-matrix display device. Also, in a passive-matrix display device, a wiring layer, an electrode layer, and the like can be formed into a desired shape by using a mask that is formed utilizing laser ablation by laser beam irradiation through a photomask, and by performing an etching process.

By employing the present invention, the number of lithography processes can be reduced, and the manufacturing process can be simplified; therefore, the throughput can be improved. As a result, a display device can be manufactured with high productivity.

In addition, resist coating, a development step, and the like can be omitted; therefore, there is no need for rotating a substrate, and then a large substrate is easily treated. Furthermore, with the use of a linear laser beam or a planer laser beam having a large-area such as a rectangular laser beam or a circular laser beam, a plurality of regions can be irradiated with a laser beam in a short time. As a result, a lot of patterns can be formed over a large substrate in a short time, and a display device can be manufactured with high productivity.

This embodiment mode can be appropriately combined with Embodiment Modes 1 to 7.

Embodiment Mode 15

Next, a mode in which a driver circuit for driving is mounted on a display panel manufactured in accordance with Embodiment Modes 8 to 13 will be described.

First, a display device employing a COG method will be described with reference to FIG. 18A. A pixel portion 2701 for displaying information of characters, images, or the like is provided over a substrate 2700. A substrate provided with a plurality of driver circuits is divided into rectangles, and a driver circuit 2751 after division (also referred to as a driver IC) is mounted on the substrate 2700. FIG. 18A shows a mode of mounting a plurality of driver ICs 2751 and FPCs 2750 mounted on the end of the driver ICs 2751. Alternatively, the size obtained after division may be made almost equal to the length of a side of the pixel portion on a signal line side, and a tape may be mounted on the end of the single driver IC.

Alternatively, a TAB method may be employed. In that case, a plurality of tapes may be attached and driver ICs may be mounted on the tapes as shown in FIG. 18B. Similarly to the case of a COG method, a single driver IC may be mounted on a single tape. In this case, a metal piece or the like for fixing the driver IC may be attached together in terms of intensity.

A plurality of driver ICs to be mounted on a display panel are preferably formed over a rectangular substrate having a size of 300 mm to 1000 mm, or a side longer than 1000 mm for the sake of improvement in productivity.

In other words, a plurality of circuit patterns each including a driver circuit portion and an input-output terminal as a unit may be formed over the substrate and may be lastly divided to be used. In consideration of the side length of the pixel portion or the pixel pitch, the driver IC may be formed to be a rectangle having a long side of 15 mm to 80 mm and a short side of 1 mm to 6 mm. Alternatively, the driver IC may be formed to have the same side length as that of the pixel portion, or a length obtained by adding a side length of the pixel portion to a side length of each driver circuit.

An advantage of the external dimension of the driver IC over an IC chip is the length of the long side. When the driver IC having a long side length of 15 mm to 80 mm is used, the number of the driver ICs necessary for being mounted in accordance with the pixel portion is less than that in the case of using an IC chip. Therefore, yield in manufacturing can be improved. When a driver IC is formed over a glass substrate, productivity is not decreased because there is no limitation on the shape of a substrate used as a base. This is a great advantage compared to the case of taking IC chips out of a circular silicon wafer.

When a scanning line driver circuit 3702 is formed in an integrated manner over a substrate as shown in FIG. 17B, a driver IC provided with a signal line driver circuit is mounted on a region outside a pixel portion 3701. The driver IC is a signal line driver circuit. In order to form a pixel region corresponding to RGB full color, 3072 signal lines are required for an XGA class and 4800 signal lines are required for a UXGA class. The signal lines formed in such a number are divided into several blocks at the end of the pixel portion 3701, and lead lines are formed. The signal lines are gathered corresponding to the pitch of output terminals of the driver ICs.

The driver IC is preferably formed of a crystalline semiconductor formed over a substrate. The crystalline semiconductor is preferably formed by being irradiated with a continuous wave laser beam. Therefore, a continuous wave solid-state or gas laser is used for an oscillator for generating the laser beam. There are almost no crystal defects when a continuous wave laser is used, and as a result, a transistor can be manufactured by using a polycrystalline semiconductor layer having a large grain size. In addition, high-speed driving is possible because mobility or response speed is high, and it is possible to further improve an operating frequency of an element, compared to the conventional element. Therefore, high reliability can be obtained because variation in characteristics is little. It is to be noted that the channel-length direction of the transistor and a scanning direction of a laser beam may be arranged in the same direction to further improve the operating frequency. This is because the highest mobility can be obtained when a channel length direction of a transistor and a scanning direction of a laser beam over a substrate are almost parallel to each other (preferably, greater than or equal to −30° and less than or equal to 30°) in a step of laser crystallization with a continuous wave laser. It is to be noted that the channel length direction corresponds to a current flowing direction, in other words, a direction in which electric charge moves in a channel formation region. The thus manufactured transistor has an active layer including a polycrystalline semiconductor layer in which a crystal grain is extended in the channel direction, and this means that a crystal grain boundary is formed almost along the channel direction.

In order to perform laser crystallization, it is preferable to significantly narrow down the laser beam, and the shape of the laser beam (beam spot) preferably has the same width as that of a short side of the driver ICs, approximately greater than or equal to 1 mm and less than or equal to 3 mm. In addition, in order to secure an enough and effective energy density for an object to be irradiated, a region irradiated with the laser beam preferably has a linear shape. The term “linear” used herein refers to not a line in a strict sense but a rectangle or an oblong with a large aspect ratio. For example, the linear shape refers to a shape with an aspect ratio of 2 or more (preferably greater than or equal to 10 and less than or equal to 10000). Thus, by making a width of the laser beam shape (beam spot) the same length as a short side of the driver ICs, a method for manufacturing a display device, of which productivity is improved, can be provided.

As shown in FIGS. 18A and 18B, driver ICs may be mounted as both the scanning line driver circuit and the signal line driver circuit. In this case, it is preferable to use the driver ICs having different specifications for the scanning line driver circuit and the signal line driver circuit.

In the pixel region, the signal line and the scanning line intersect to form a matrix, and transistors are arranged corresponding to each intersection. One feature of this embodiment mode is that a TFT having an amorphous semiconductor or a semi-amorphous semiconductor as a channel portion is used as the transistor arranged in the pixel region. The amorphous semiconductor is formed by a method such as a plasma CVD method or a sputtering method. The semi-amorphous semiconductor can be formed by a plasma CVD method at a temperature of greater than or equal to 300° C. A film thickness necessary to form the transistor is formed in a short time even in the case of using, for example, a non-alkaline glass substrate having an external size of 550 mm×650 mm. The feature of such a manufacturing technique is effective for manufacturing a large-sized display device. In addition, a semi-amorphous TFT can obtain field effect mobility of 2 cm2/V·sec to 10 cm2/V·sec by forming a channel formation region using a SAS. Thus, a display panel in which system-on-panel is realized can be manufactured. Further, the transistor arranged in the pixel region can be manufactured by the present invention. Accordingly, the manufacturing process is simplified, and a display panel can be manufactured with high productivity.

The scanning line driver circuit can also be formed in an integrated manner over the substrate by using a TFT having a semiconductor layer formed of a SAS. In the case of using a TFT having a semiconductor layer formed of a SAS, the driver ICs may be mounted as both the scanning line driver circuit and the signal line driver circuit.

In that case, it is preferable to use the driver ICs having different specifications for the scanning line driver circuit and the signal line driver circuit. For example, a transistor included in the scanning line driver IC is required to withstand a voltage of approximately 30 V; however, a drive frequency thereof is 100 kHz or less, and high-speed operation is not required, comparatively. Therefore, it is preferable to set a channel length (L) of the transistor included in the scanning line driver sufficiently long. On the other hand, a transistor of the signal line driver IC is required to withstand a voltage of only approximately 12 V; however, a drive frequency thereof is around 65 MHz at 3 V, and high-speed operation is required. Therefore, it is preferable to set a channel length or the like of the transistor included in a driver on a micron rule.

A method for mounting the driver IC is not particularly limited, and a COG method, a wire bonding method, or a TAB method can be employed.

When the thicknesses of the driver IC and the counter substrate are set equal to each other, a distance therebetween is almost constant, which contributes to thinning of a display device as a whole. When both substrates are formed of the same material, thermal stress is not generated and characteristics of a circuit formed of a TFT are not damaged even when a temperature change is caused in the display device. Furthermore, the number of the driver ICs to be mounted on one pixel region can be reduced by mounting longer driver ICs than IC chips as driver circuits as described in this embodiment mode.

In this manner, a driver circuit can be incorporated into a display panel.

Embodiment Mode 16

As for a display panel (EL display panel or liquid crystal display panel) manufactured in accordance with Embodiment Modes 8 to 13, an example will be shown, in which a semiconductor layer is formed of an amorphous semiconductor or a SAS, and a scanning line driver circuit is formed over a substrate.

FIG. 31 is a block diagram of a scanning line driver circuit that includes an n-channel TFT using a SAS in which a field-effect mobility of 1 cm2/V·sec to 15 cm2/V·sec can be obtained.

In FIG. 31, a block denoted by reference numeral 8500 corresponds to a pulse-output circuit that outputs a sampling pulse for one stage, and a shift register includes n pieces of pulse-output circuits. Reference numeral 8501 denotes a buffer circuit, and a pixel 8502 is connected to the end thereof.

FIG. 32 shows a specific structure of the pulse-output circuit 8500, which includes n-channel TFTs 8601 to 8613. At this point, a size of the TFTs may be determined in consideration of operation characteristics of the n-channel TFTs using a SAS. For example, when the channel length is 8 μm, the channel width can be set in the range of 10 μm to 80 μm.

Furthermore, a specific structure of the buffer circuit 8501 is shown in FIG. 33. Similarly, the buffer circuit includes n-channel TFTs 8620 to 8635. At this point, a size of the TFTs may be determined in consideration of operation characteristics of the n-channel TFTs using a SAS. For example, when the channel length is 10 μm, the channel width is to be set in the range of 10 μm to 1800 μm.

In order to realize such a circuit, it is necessary to connect the TFTs with one another by a wiring.

In such a manner, a driver circuit can be incorporated into a display panel.

Embodiment Mode 17

This embodiment mode will be described with reference to FIG. 37. FIG. 37 shows an example in which an EL display module is formed using a TFT substrate 2800 manufactured in accordance with the present invention. In FIG. 37, a pixel portion including pixels is formed over the TFT substrate 2800.

In FIG. 37, a protective circuit portion 2801 comprising a TFT that has a structure similar to a TFT formed in each pixel of the pixels is provided between a driver circuit and the pixel, outside the pixel portion. Or, the protective circuit portion 2801 operates in a manner similar to a diode by connecting either a source electrode layer or a drain electrode layer to a gate electrode layer of a TFT similar to the TFT formed in the pixel. A driver IC formed of a single crystalline semiconductor, a stick driver IC formed of a polycrystalline semiconductor layer over a glass substrate, a driver circuit formed of a SAS, or the like is applied to a driver circuit 2809.

The TFT substrate 2800 is fixed to a sealing substrate 2820 with spacers 2806 a and 2806 b formed by a droplet-discharging method interposed therebetween. The spacers are preferably provided to keep a distance between two substrates constant even when the substrate is thin or an area of the pixel portion is enlarged. A space between the TFT substrate 2800 and the sealing substrate 2820 over light-emitting elements 2804 and 2805 connected to TFTs 2802 and 2803 respectively may be filled with a resin material having a light-transmitting property at least to light of a visible region and may be solidified, or may be filled with anhydrous nitrogen or an inert gas.

FIG. 37 shows the case where the light-emitting elements 2804 and 2805 have a top-emission structure, in which light is emitted in the direction of arrows shown in the drawing. Multicolor display can be performed by making the pixels emit light of different colors of red, green, and blue. At this time, color purity of the light emitted to an external portion can be improved by forming colored layers 2807 a, 2807 b, and 2807 c corresponding to respective colors on the sealing substrate 2820 side. Moreover, pixels that emit white light may be used and may be combined with the colored layers 2807 a to 2807 c.

The driver circuit 2809 that is an external circuit is connected by a wiring board 2810 to a scanning line or signal line connection terminal that is provided at one end of an external circuit substrate 2811. In addition, a heat pipe 2813 that is a high-efficiency heat conduction device having a pipe-like shape and a heat sink 2812, each of which is used for conducting heat to the outside of the device, may be provided in contact with or adjacent to the TFT substrate 2800 to enhance a heat dissipation effect.

It is to be noted that FIG. 37 shows the top-emission EL display module; however, a bottom emission structure may be employed by changing the structure of the light-emitting element or the position of the external circuit board. Naturally, a dual emission structure in which light is emitted from both the top and bottom surfaces may be used. In the case of the top emission structure, the insulating layer serving as a partition may be colored and used as a black matrix. This partition can be formed by a droplet-discharging method and it may be formed by mixing a black resin of a pigment material, carbon black, or the like into a resin material such as polyimide. A stack thereof may alternatively be used.

In addition, in the EL display module, reflected light of light that is incident from an external portion may be blocked by using a retardation film or a polarizing plate. In a top-emission display device, an insulating layer serving as a partition may be colored and used as a black matrix. This partition can be formed by a droplet-discharging method. Carbon black or the like may be mixed into a black resin of a pigment material or a resin material such as polyimide, and a stack thereof may also be used. By a droplet-discharging method, different materials may be discharged to the same region plural times to form the partition. A quarter-wave plate or a half-wave plate may be used as the retardation film and may be designed to be able to control light. As the structure, a TFT element substrate, the light-emitting element, the sealing substrate (sealant), the retardation film (quarter-wave plate or a half-wave plate), and the polarizing plate are sequentially stacked, through which light emitted from the light-emitting element is transmitted and emitted to an external portion from the polarizing plate side. The retardation film or polarizing plate may be provided on a side where light is emitted or may be provided on both sides in the case of a dual emission display device in which light is emitted from the both surfaces. In addition, an anti-reflection film may be provided on the outer side of the polarizing plate. Accordingly, a higher-definition and accurate image can be displayed.

A resin film may be attached to the side of the TFT substrate 2800 where the pixel portion is formed, with the use of a sealant or an adhesive resin, to form a sealing structure. Although glass sealing using a glass substrate is used in this embodiment mode, various sealing methods such as resin sealing using a resin, plastic sealing using plastics, and film sealing using a film can be used. A gas barrier film that prevents water vapor from penetrating the resin film is preferably provided over the surface of the resin film. By employing a film sealing structure, further reduction in thickness and weight can be achieved.

In a display device provided with a TFT substrate or the like manufactured by the present invention, part of the process is simplified, and the throughput in the manufacture is improved. Accordingly, a display module can be manufactured with high productivity.

This embodiment mode can be appropriately combined with Embodiment Modes 1 to 11, 15, and 16.

Embodiment Mode 18

This embodiment mode will be described with reference to FIGS. 28A and 28B. FIGS. 28A and 28B show an example of forming a liquid crystal display module by using a TFT substrate 2600 manufactured by the present invention.

FIG. 28A shows an example of a liquid crystal display module, in which the TFT substrate 2600 and a counter substrate 2601 are fixed to each other with a sealant 2602, and a pixel portion 2603 and a liquid crystal layer 2604 are provided therebetween to form a display region. A colored layer 2605 is necessary to perform color display. In the case of the RGB system, respective colored layers corresponding to colors of red, green, and blue are provided for respective pixels. The outer sides of the TFT substrate 2600 and the counter substrate 2601 are provided with polarizing plates 2606 and 2607, and a diffusing plate 2613. A light source includes a cold cathode tube 2610 and a reflector plate 2611. A circuit board 2612 is connected to the TFT substrate 2600 by a flexible wiring board 2609. External circuits such as a control circuit and a power supply circuit are incorporated in the circuit board 2612. The polarizing plate and the liquid crystal layer may be stacked with a retardation film interposed therebetween.

The liquid crystal display module can employ a TN (Twisted Nematic) mode, an IPS (In-Plane-Switching) mode, an FFS (Fringe Field Switching) mode, an MVA (Multi-domain Vertical Alignment) mode, a PVA (Patterned Vertical Alignment) mode, an ASM (Axially Symmetric aligned Micro-cell) mode, an OCB (Optical Compensated Birefringence) mode, an FLC (Ferroelectric Liquid Crystal) mode, an AFLC (Anti Ferroelectric Liquid Crystal) mode, or the like.

FIG. 28B shows an example of applying an OCB mode to the liquid crystal display module of FIG. 28A, so that this liquid crystal display module is an FS-LCD (Field Sequential-LCD). The FS-LCD performs red, green, and blue light emissions in one frame period. Color display can be performed by composing an image by a time division method. Also, emission of each color is performed using a light-emitting diode, a cold cathode tube, or the like; hence, a color filter is not needed. There is no necessity for arranging color filters of three primary colors and limiting a display region of each color. Display of all three colors can be performed in any region. On the other hand, light emission of three colors is performed in one frame period; therefore, high speed response of liquid crystal is needed. When an FLC mode using an FS system and the OCB mode are applied to the display device of the present invention, a display device or a liquid crystal television device having higher performance and high image quality can be completed.

A liquid crystal layer of the OCB mode has a so-called π cell structure. In the π cell structure, liquid crystal molecules are orientated such that pretilt angles of the molecules are symmetrical with respect to the center plane between the active matrix substrate and the counter substrate. The orientation in the π cell structure is a splay orientation when a voltage is not applied between the substrates, and shifts into a bend orientation when the voltage is applied. White display is performed in this bend orientation. Further voltage application makes the liquid crystal molecules in the bend orientation oriented perpendicularly to the substrates, which does not allow light to pass therethrough. It is to be noted that a response speed approximately ten times as high as that of a conventional TN mode can be achieved by using the OCB mode.

Further, as a mode corresponding to the FS system, an HV(Half V)-FLC, an SS(Surface Stabilized)-FLC, or the like using a ferroelectric liquid crystal (FLC) that can operate at high speed can also be used. A nematic liquid crystal that has relatively low viscosity can be used for the OCB mode. A smectic liquid crystal that has a ferroelectric phase can be used for the HV-FLC or the SS-FLC.

An optical response speed of the liquid crystal display module is increased by narrowing a cell gap of the liquid crystal display module. Alternatively, the optical response speed can be increased by lowering the viscosity of the liquid crystal material. The above method of increasing the optical response speed is more effective when a pixel pitch of a pixel region of a TN-mode liquid crystal display module is less than or equal to 30 μm. The optical response speed can be further increased by an overdrive method in which an applied voltage is increased (or decreased) only for a moment.

The liquid crystal display module of FIG. 28B is a transmissive liquid crystal display module, in which a red light source 2910 a, a green light source 2910 b, and a blue light source 2910 c are provided as light sources. A control portion 2912 is provided in the liquid crystal display module to separately control the red light source 2910 a, the green light source 2910 b, and the blue light source 2910 c to be turned on or off. The light emission of each color is controlled by the control portion 2912, and light enters the liquid crystal to compose an image using the time division, thereby performing color display.

The liquid crystal display module described above uses a TFT substrate or the like manufactured by the present invention. Accordingly, part of the process can be simplified, and the throughput is improved; therefore, the liquid crystal display module can be manufactured with high productivity. Further, the number of lithography processes using a photoresist can be reduced, and a highly reliable liquid crystal display module can be manufactured.

This embodiment mode can be appropriately combined with Embodiment Modes 1 to 7, 12, and 13.

Embodiment Mode 19

With the display device formed by the present invention, a television device (also referred to as simply a television, or a television receiver) can be completed. FIG. 30 is a block diagram showing main components of the television device.

FIG. 17A is a top view showing a structure of a display panel according to the present invention. A pixel portion 2701 in which pixels 2702 are arranged in matrix, a scanning line input terminal 2703, and a signal line input terminal 2704 are formed over a substrate 2700 having an insulating surface. The number of pixels may be determined in accordance with various standards. In the case of XGA full-color display using RGB, the number of pixels may be 1024×768×3 (RGB). In the case of UXGA full-color display using RGB, the number of pixels may be 1600×1200×3 (RGB), and in the case of full-spec high-definition, and full-color display using RGB, the number of pixels may be 1920×1080×3 (RGB).

The pixels 2702 are formed in matrix by intersections of scanning lines extended from the scanning line input terminal 2703 and signal lines extended from the signal line input terminal 2704. Each pixel 2702 in the pixel portion 2701 is provided with a switching element and a pixel electrode layer connected thereto. A typical example of the switching element is a TFT. A gate electrode layer of the TFT is connected to the scanning line, and a source or a drain of the TFT is connected to the signal line, which enables each pixel to be independently controlled by a signal inputted from an external portion.

FIG. 17A shows a structure of a display panel in which a signal to be inputted to the scanning line and the signal line is controlled by an external driver circuit. Alternatively, a driver IC 2751 may be mounted on the substrate 2700 by a COG (Chip On Glass) method as shown in FIG. 18A. As another mounting mode, a TAB (Tape Automated Bonding) method may be used as shown in FIG. 18B. The driver IC may be formed over a single crystalline semiconductor substrate or may be formed using a TFT over a glass substrate. In each of FIGS. 18A and 18B, the driver IC 2751 is connected to an FPC (Flexible Printed Circuit) 2750.

When a TFT provided in a pixel is formed of a crystalline semiconductor, a scanning line driver circuit 3702 can be formed over a substrate 3700 as shown in FIG. 17B. In FIG. 17B, a pixel portion 3701 is controlled by an external driver circuit connected to a signal line input terminal 3704, similarly to FIG. 17A. When the TFT provided in a pixel is formed of a polycrystalline (microcrystalline) semiconductor, a single crystalline semiconductor, or the like having high mobility, a pixel portion 4701, a scanning line driver circuit 4702, and a signal line driver circuit 4704 can all be formed over a glass substrate 4700 as shown in FIG. 17C.

As for the display panel, there are the following cases in FIG. 30: a case in which only a pixel portion 9011 is formed as shown in FIG. 17A and a scanning line driver circuit 9013 and a signal line driver circuit 9012 are mounted by a TAB method as shown in FIG. 18B; a case in which the pixel portion 9011 is formed, and the scanning line driver circuit 9013 and the signal line driver circuit 9012 are mounted by a COG method as shown in FIG. 18A; a case in which a TFT is formed as shown in FIG. 17B, the pixel portion 9011 and the scanning line driver circuit 9013 are formed over a substrate, and the signal line driver circuit 9012 is separately mounted as a driver IC; a case in which the pixel portion 9011, the signal line driver circuit 9012, and the scanning line driver circuit 9013 are formed over a substrate as shown in FIG. 17C; and the like. However, the display panel may have any structures.

In FIG. 30, as another external circuit, a video signal amplifier circuit 9015 that amplifies a video signal among signals received by a tuner 9014, a video signal processing circuit 9016 that converts the signals outputted from the video signal amplifier circuit 9015 into chrominance signals corresponding to respective colors of red, green, and blue, a control circuit 9017 that converts the video signal into an input specification of the driver IC, and the like are provided on an input side of the video signal. The control circuit 9017 outputs signals to both a scanning line side and a signal line side. In the case of digital driving, a signal dividing circuit 9018 may be provided on the signal line side and an input digital signal may be divided into m pieces and supplied.

An audio signal among signals received by the tuner 9014 is sent to an audio signal amplifier circuit 9019 and is supplied to a speaker 9113 through an audio signal processing circuit 9110. A control circuit 9111 receives control information of a receiving station (reception frequency) or sound volume from an input portion 9112 and transmits signals to the tuner 9014 and the audio signal processing circuit 9110.

A television device can be completed by incorporating the display module into a chassis as shown in FIGS. 34A and 34B. When a liquid crystal display module is used as a module, a liquid crystal television device can be manufactured. When an EL display module is used, an EL television device can be manufactured. Alternatively, a plasma television, electronic paper, or the like can be manufactured. In FIG. 34A, a main screen 2403 is formed by using the display module, and a speaker portion 2409, an operation switch, and the like are provided as its accessory equipment. Thus, a television device can be completed in accordance with the present invention.

In FIG. 34A, a display panel 2402 is incorporated into a chassis 2401, and general TV broadcast can be received by a receiver 2405. When the display device is connected to a communication network by wired or wireless connections via a modem 2404, one-way (from a sender to a receiver) or two-way (between a sender and a receiver or between receivers) information communication can be performed. The television device can be operated by using a switch built in the chassis 2401 or a remote control unit 2406 that is separately formed. A display portion 2407 for displaying output information may also be provided in the remote control device 2406.

Further, the television device may include a sub screen 2408 formed using a second display panel so as to display channels, volume, or the like, in addition to the main screen 2403. In this structure, both the main screen 2403 and the sub screen 2408 can be formed using the liquid crystal display panel of the present invention. Alternatively, the main screen 2403 may be formed using an EL display panel having a wide viewing angle, and the sub screen 2408 may be formed using a liquid crystal display panel capable of displaying images with less power consumption. In order to reduce the power consumption preferentially, the main screen 2403 may be formed using a liquid crystal display panel, and the sub screen may be formed using an EL display panel, which can be switched on and off. In accordance with the present invention, a highly reliable display device can be formed even when a large substrate is used and a large number of TFTs or electronic components are used.

FIG. 34B shows a television device having a large-sized display portion, for example, a 20-inch to 80-inch display portion. The television device includes a chassis 2410, a display portion 2411, a remote control device 2412 that is an operation portion, a speaker portion 2413, and the like. The present invention is applied to manufacture of the display portion 2411. Since the television device in FIG. 34B is a wall-hanging type, it does not require a large installation space.

Of course, the present invention is not limited to the television device, and can be applied to various use applications as a large-sized display medium such as an information display board at a train station, an airport, or the like, or an advertisement display board on the street, as well as a monitor of a personal computer.

A TFT or the like of a display device can be manufactured by the present invention. As a result, the display device can be manufactured through a simplified process; therefore, it is possible to manufacture the display device with high productivity.

This embodiment mode can be appropriately combined with Embodiment Modes 1 to 18.

Embodiment Mode 20

Examples of electronic devices in accordance with the present invention are as follows: television devices (also referred to as simply a television, or a television receiver), cameras such as digital cameras and digital video cameras, cellular telephone devices (simply also referred to as a cellular phone or a cell-phone), portable information terminals such as PDA, portable game machines, computer monitors, computers, sound reproducing devices such as a car audio system, image reproducing devices including a recording medium, such as a home-use game machine, and the like. Specific examples of them are described with reference to FIGS. 35A to 35E.

A portable information terminal device shown in FIG. 35A includes a main body 9201, a display portion 9202, and the like. A display device of the present invention can be applied to the display portion 9202. As a result, a portable information terminal device can be manufactured through a simplified process, whereby it can be manufactured with high productivity.

A digital video camera shown in FIG. 35B includes a display portion 9701, a display portion 9702, and the like. A display device of the present invention can be applied to the display portion 9701. As a result, a digital video camera can be manufactured through a simplified process, whereby it can be manufactured with high productivity.

A cellular phone shown in FIG. 35C includes a main body 9101, a display portion 9102, and the like. A display device of the present invention can be applied to the display portion 9102. As a result, a cellular phone can be manufactured through a simplified process, whereby it can be manufactured with high productivity.

A portable television device shown in FIG. 35D includes a main body 9301, a display portion 9302, and the like. A display device of the present invention can be applied to the display portion 9302. As a result, a portable television device can be manufactured through a simplified process, whereby it can be manufactured with high productivity. The display device of the present invention can be applied to a wide range of television devices ranging from a small-sized television device mounted on a portable terminal such as a cellular phone, a medium-sized television device which can be carried, to a large-sized (for example, 40-inch or larger) television device.

A portable computer shown in FIG. 35E includes a main body 9401, a display portion 9402, and the like. A display device of the present invention can be applied to the display portion 9402. As a result, a portable computer can be manufactured through a simplified process, whereby it can be manufactured with high productivity.

As described above, with the display device of the present invention, electronic devices can be provided with high productivity.

This embodiment mode can be appropriately combined with Embodiment Modes 1 to 19.

This application is based on Japanese Patent Application serial no. 2006-229729 filed in Japan Patent Office on Aug. 25, 2006, the entire contents of which are hereby incorporated by reference.

Claims (29)

What is claimed is:
1. A manufacturing method of a semiconductor device, comprising:
forming a layer to be processed;
forming a light absorption layer over the layer to be processed;
forming an insulating layer over the light absorption layer;
irradiating the light absorption layer and the insulating layer with a laser beam through a photomask, so that at least an irradiated region of the light absorption layer and the insulating layer is removed;
etching the layer to be processed using a left part of the light absorption layer and a left part of the insulating layer as a mask; and
removing the left part of the light absorption layer and the left part of the insulating layer after etching the layer to be processed,
wherein the left part of the light absorption layer and the left part of the insulating layer exist on the layer to be processed after the step of the etching,
wherein the mask is formed by the step of the irradiating, and
wherein the light absorption layer comprises a conductive material.
2. The manufacturing method of a semiconductor device according to claim 1, wherein the layer to be processed comprises a conductive material or a semiconductor material.
3. The manufacturing method of a semiconductor device according to claim 1, wherein the light absorption layer comprises a material which absorbs the laser beam.
4. The manufacturing method of a semiconductor device according to claim 1, wherein the light absorption layer comprises at least one of elements of chromium (Cr), molybdenum (Mo), nickel (Ni), titanium (Ti), cobalt (Co), copper (Cu), and aluminum (Al).
5. The manufacturing method of a semiconductor device according to claim 1, wherein the insulating layer comprises a material which transmits the laser beam.
6. The manufacturing method of a semiconductor device according to claim 1, wherein a mask including a region which transmits the laser beam and a region which blocks the laser beam is used as the photomask.
7. The manufacturing method of a semiconductor device according to claim 1, wherein a boiling point or a sublimation point of the light absorption layer is lower than a melting point of the layer to be processed.
8. The manufacturing method of a semiconductor device according to claim 1, wherein an inert gas is added to the light absorption layer.
9. The manufacturing method of a semiconductor device according to claim 1, wherein the left part of the light absorption layer and the left part of the insulating layer are removed by laser ablation.
10. A manufacturing method of a semiconductor device, comprising:
forming a layer to be processed;
forming a light absorption layer over the layer to be processed;
forming an insulating layer over the light absorption layer;
irradiating the light absorption layer and the insulating layer with a laser beam through a photomask, so that at least an irradiated region of the light absorption layer and the insulating layer is removed;
etching the layer to be processed using a left part of the light absorption layer and a left part of the insulating layer as a mask, so that the layer having a tapered shape is formed; and
removing the left part of the light absorption layer and the left part of the insulating layer after etching the layer to be processed,
wherein the left part of the light absorption layer and the left part of the insulating layer exist on the layer to be processed after the step of the etching,
wherein the mask is formed by the step of the irradiating, and
wherein the light absorption layer comprises a conductive material.
11. The manufacturing method of a semiconductor device according to claim 10, wherein a wet etching method or a combination of a dry etching method and a wet etching method is used for etching the layer to be processed.
12. The manufacturing method of a semiconductor device according to claim 10, wherein the layer to be processed comprises a conductive material or a semiconductor material.
13. The manufacturing method of a semiconductor device according to claim 10, wherein the light absorption layer comprises a material which absorbs the laser beam.
14. The manufacturing method of a semiconductor device according to claim 10, wherein the light absorption layer comprises at least one of elements of chromium (Cr), molybdenum (Mo), nickel (Ni), titanium (Ti), cobalt (Co), copper (Cu), and aluminum (Al).
15. The manufacturing method of a semiconductor device according to claim 10, wherein the insulating layer comprises a material which transmits the laser beam.
16. The manufacturing method of a semiconductor device according to claim 10, wherein a mask including a region which transmits the laser beam and a region which blocks the laser beam is used as the photomask.
17. The manufacturing method of a semiconductor device according to claim 10, wherein a boiling point or a sublimation point of the light absorption layer is lower than a melting point of the layer to be processed.
18. The manufacturing method of a semiconductor device according to claim 10, wherein an inert gas is added to the light absorption layer.
19. The manufacturing method of a semiconductor device according to claim 10, wherein the left part of the light absorption layer and the left part of the insulating layer are removed by laser ablation.
20. A manufacturing method of a semiconductor device comprising:
forming a layer to be processed;
forming a light absorption layer over the layer to be processed;
forming an insulating layer over the light absorption layer;
irradiating the light absorption layer and the insulating layer with a laser beam through a photomask, so that at least an irradiated region of the light absorption layer and the insulating layer is removed;
etching the layer to be processed using a left part of the light absorption layer and a left part of the insulating layer as a mask, so that the layer having a perpendicular shape is formed; and
removing the left part of the light absorption layer and the left part of the insulating layer after etching the layer to be processed,
wherein the left part of the light absorption layer and the left part of the insulating layer exist on the layer to be processed after the step of the etching,
wherein the mask is formed by the step of the irradiating, and
wherein the light absorption layer comprises a conductive material.
21. The manufacturing method of a semiconductor device according to claim 20, wherein a dry etching method is used for etching the layer to be processed.
22. The manufacturing method of a semiconductor device according to claim 20, wherein the layer to be processed comprises a conductive material or a semiconductor material.
23. The manufacturing method of a semiconductor device according to claim 20, wherein the light absorption layer comprises a material which absorbs the laser beam.
24. The manufacturing method of a semiconductor device according to claim 20, wherein the light absorption layer comprises at least one of elements of chromium (Cr), molybdenum (Mo), nickel (Ni), titanium (Ti), cobalt (Co), copper (Cu), and aluminum (Al).
25. The manufacturing method of a semiconductor device according to claim 20, wherein the insulating layer comprises a material which transmits the laser beam.
26. The manufacturing method of a semiconductor device according to claim 20, wherein a mask including a region which transmits the laser beam and a region which blocks the laser beam is used as the photomask.
27. The manufacturing method of a semiconductor device according to claim 20, wherein a boiling point or a sublimation point of the light absorption layer is lower than a melting point of the layer to be processed.
28. The manufacturing method of a semiconductor device according to claim 20, wherein an inert gas is added to the light absorption layer.
29. The manufacturing method of a semiconductor device according to claim 20, wherein the left part of the light absorption layer and the left part of the insulating layer are removed by laser ablation.
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