KR20040022152A - 전자 부품의 수지 밀봉 성형 방법 및 상기 방법에이용되는 수지 밀봉 성형 장치 - Google Patents
전자 부품의 수지 밀봉 성형 방법 및 상기 방법에이용되는 수지 밀봉 성형 장치 Download PDFInfo
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- KR20040022152A KR20040022152A KR1020030058173A KR20030058173A KR20040022152A KR 20040022152 A KR20040022152 A KR 20040022152A KR 1020030058173 A KR1020030058173 A KR 1020030058173A KR 20030058173 A KR20030058173 A KR 20030058173A KR 20040022152 A KR20040022152 A KR 20040022152A
- Authority
- KR
- South Korea
- Prior art keywords
- mold
- resin
- release film
- intermediate plate
- substrate
- Prior art date
Links
- 239000011347 resin Substances 0.000 title claims abstract description 112
- 229920005989 resin Polymers 0.000 title claims abstract description 112
- 238000000465 moulding Methods 0.000 title claims abstract description 65
- 238000000034 method Methods 0.000 title claims description 33
- 238000005538 encapsulation Methods 0.000 title description 18
- 238000007789 sealing Methods 0.000 claims description 54
- 230000007246 mechanism Effects 0.000 claims description 24
- 239000000758 substrate Substances 0.000 abstract description 40
- 239000004065 semiconductor Substances 0.000 abstract description 25
- 238000007666 vacuum forming Methods 0.000 abstract 1
- 230000000903 blocking effect Effects 0.000 description 7
- 238000007493 shaping process Methods 0.000 description 7
- 239000002184 metal Substances 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 230000002093 peripheral effect Effects 0.000 description 4
- 239000000565 sealant Substances 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000007599 discharging Methods 0.000 description 2
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
- B29C33/68—Release sheets
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
- H01L21/566—Release layers for moulds, e.g. release layers, layers against residue during moulding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
Description
Claims (5)
- 한쪽의 주형면(main mold surface)(15a, 200a)을 갖는 제1의 형(mold)(1, 200)을 준비하는 단계와,상기 한쪽의 주형면(15a, 200a)에 대향하는 다른쪽의 주형면(15b, 200b)을 갖는 제2의 형(2, 100)을 준비하는 단계와,상기 한쪽의 주형면(15a, 200a)과 상기 다른쪽의 주형면과의 사이(15b, 200b)에 있어서 형 측면(12, 120)을 형성하는 제3의 형(3, 300)을 준비하는 단계와,상기 제1의 형(1, 200)에 전자 부품(11, 110)을 끼워넣는 단계와,상기 제2의 형(2, 100)과 상기 제3의 형(3, 300)을 이용하여 이형 필름(release film)(4, 400)을 끼워 넣고, 상기 이형 필름(4, 400)에 소정의 장력을 걸어서, 상기 이형 필름(4, 400)을 상기 다른쪽의 주형면(15b, 200b)에 밀착시키는 단계와,상기 제1의 형(1, 200), 상기 제2의 형(2, 100) 및 상기 제3의 형(3, 300)의 클램핑에 의해, 상기 한쪽의 주형면(15a, 200a), 상기 다른쪽의 주형면(15b, 200b) 및 상기 형 측면(12, 120)을 이용하여, 상기 전자 부품(11, 110)이 내포된 밀폐 공간(21, 210)을 형성하는 단계와,상기 밀폐 공간(21, 210) 내로 용융된 수지(20, 220)를 충전하는 단계와,상기 용융된 수지(20, 220)를 경화시킴으로써, 상기 전자 부품(11, 110)을수지 밀봉 성형하는 단계를 구비하고 있는 것을 특징으로 하는 전자 부품의 수지 밀봉 성형 방법.
- 제1항에 있어서,상기 클램핑 단계는,상기 제1의 형(1, 200)과 상기 제2의 형(2, 100)을 클램핑 하는 단계와,상기 제1의 형(1, 200)과 상기 제3의 형(3, 300)을 클램핑 하는 단계를 가지며,상기 이형 필름(4, 400)을 상기 다른쪽의 주형면(15b, 200b)의 표면에 밀착시키는 단계는 상기 제1의 형(1, 200)과 상기 제3의 형(3, 300)을 클램핑 하는 단계 이전에 행하여지는 것을 특징으로 하는 전자 부품의 수지 밀봉 성형 방법.
- 제1항에 있어서,상기 이형 필름(4, 400)에 소정의 장력을 걸어서, 상기 이형 필름(4, 400)을 상기 다른쪽의 주형면(15b, 200b)에 밀착시키는 단계에서는 탄성 기구(16, 103, 17, 104)의 탄성력에 의해, 상기 이형 필름(4, 400)을 상기 제3의 형(3, 300)에 가압하는 것을 특징으로 하는 전자 부품의 수지 밀봉 성형 방법.
- 제1항에 있어서,상기 수지 밀봉 성형 단계는 상기 밀폐 공간(21, 210)을 진공으로 한 상태에서 실행되는 것을 특징으로 하는 전자 부품의 수지 밀봉 성형 방법.
- 제1항에 기재된 전자 부품의 수지 밀봉 성형 방법의 각 상기 단계를 실행하기 위한 수단을 구비한 것을 특징으로 하는 전자 부품의 수지 밀봉 성형 장치.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002260894A JP4268389B2 (ja) | 2002-09-06 | 2002-09-06 | 電子部品の樹脂封止成形方法及び装置 |
JPJP-P-2002-00260894 | 2002-09-06 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20040022152A true KR20040022152A (ko) | 2004-03-11 |
KR100546191B1 KR100546191B1 (ko) | 2006-01-24 |
Family
ID=31712334
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020030058173A KR100546191B1 (ko) | 2002-09-06 | 2003-08-22 | 전자 부품의 수지 밀봉 성형 방법 및 상기 방법에이용되는 수지 밀봉 성형 장치 |
Country Status (6)
Country | Link |
---|---|
US (1) | US6977188B2 (ko) |
EP (2) | EP1396323B1 (ko) |
JP (1) | JP4268389B2 (ko) |
KR (1) | KR100546191B1 (ko) |
DE (2) | DE60317864D1 (ko) |
TW (1) | TWI235703B (ko) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101430797B1 (ko) * | 2008-08-08 | 2014-08-18 | 토와 가부시기가이샤 | 전자부품의 압축성형방법 및 금형장치 |
KR20200026036A (ko) * | 2018-08-31 | 2020-03-10 | 토와 가부시기가이샤 | 수지 성형 장치, 이형 필름의 박리 방법 및 수지 성형품의 제조 방법 |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
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JP5166870B2 (ja) | 2005-05-30 | 2013-03-21 | スパンション エルエルシー | 半導体装置の製造装置及び半導体装置の製造方法 |
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US7985357B2 (en) | 2005-07-12 | 2011-07-26 | Towa Corporation | Method of resin-sealing and molding an optical device |
JP2007109831A (ja) * | 2005-10-13 | 2007-04-26 | Towa Corp | 電子部品の樹脂封止成形方法 |
EP1949459A4 (en) * | 2005-10-24 | 2014-04-30 | 3M Innovative Properties Co | METHOD FOR MANUFACTURING A LIGHT EMITTING DEVICE COMPRISING A MOLDED ENCAPSULANT |
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JP5036372B2 (ja) * | 2007-04-02 | 2012-09-26 | Towa株式会社 | 光電子部品および光電子部品の製造方法 |
US7915089B2 (en) * | 2007-04-10 | 2011-03-29 | Infineon Technologies Ag | Encapsulation method |
KR101132136B1 (ko) * | 2007-08-03 | 2012-04-03 | 스미도모쥬기가이고교 가부시키가이샤 | 피성형품의 낙하 방지 기구 |
JP2009124012A (ja) * | 2007-11-16 | 2009-06-04 | Towa Corp | 電子部品の圧縮成形方法及び金型 |
JP4553944B2 (ja) * | 2008-01-10 | 2010-09-29 | アピックヤマダ株式会社 | 樹脂モールド方法および樹脂モールド装置 |
KR100980299B1 (ko) | 2008-02-27 | 2010-09-06 | 세크론 주식회사 | 전자 부품 몰딩 장치 |
US7875967B2 (en) * | 2008-03-10 | 2011-01-25 | Stats Chippac Ltd. | Integrated circuit with step molded inner stacking module package in package system |
US20100120199A1 (en) * | 2008-11-07 | 2010-05-13 | Bok Sim Lim | Stacked package-on-package semiconductor device and methods of fabricating thereof |
WO2010146860A1 (ja) * | 2009-06-17 | 2010-12-23 | パナソニック株式会社 | 樹脂モールド型電子部品の製造方法 |
KR101101669B1 (ko) | 2009-12-01 | 2011-12-30 | 삼성전기주식회사 | 전자부품 제조장치 및 전자부품 제조방법 |
US8771577B2 (en) * | 2010-02-16 | 2014-07-08 | Koninklijke Philips N.V. | Light emitting device with molded wavelength converting layer |
WO2011105639A1 (ko) * | 2010-02-25 | 2011-09-01 | 한미반도체 주식회사 | 압축 성형 장치 및 방법 |
WO2011105640A1 (ko) * | 2010-02-25 | 2011-09-01 | 한미반도체 주식회사 | 압축 성형장치 및 압축 성형방법 |
JP5576197B2 (ja) * | 2010-07-08 | 2014-08-20 | Towa株式会社 | 電子部品の圧縮成形方法及び成形装置 |
KR101052324B1 (ko) * | 2011-03-23 | 2011-07-27 | 신한다이아몬드공업 주식회사 | 봉지재 성형 방법 |
JP5403012B2 (ja) * | 2011-08-11 | 2014-01-29 | 第一精工株式会社 | 樹脂封止装置 |
DE102011081083A1 (de) * | 2011-08-17 | 2013-02-21 | Osram Ag | Presswerkzeug und verfahren zum pressen eines silikonelements |
US8921994B2 (en) | 2012-09-14 | 2014-12-30 | Freescale Semiconductor, Inc. | Thermally enhanced package with lid heat spreader |
US9159643B2 (en) * | 2012-09-14 | 2015-10-13 | Freescale Semiconductor, Inc. | Matrix lid heatspreader for flip chip package |
JP5786918B2 (ja) * | 2013-10-23 | 2015-09-30 | 第一精工株式会社 | 樹脂封止金型およびこれを用いた樹脂封止装置、樹脂封止方法 |
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CN1110846C (zh) | 1996-07-12 | 2003-06-04 | 富士通株式会社 | 半导体装置的制造方法 |
JP3282988B2 (ja) * | 1997-05-01 | 2002-05-20 | アピックヤマダ株式会社 | 樹脂モールド方法及び樹脂モールド装置 |
JP3490606B2 (ja) | 1998-03-20 | 2004-01-26 | 富士通株式会社 | 半導体装置製造用金型 |
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- 2003-08-15 US US10/641,606 patent/US6977188B2/en not_active Expired - Fee Related
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- 2003-08-18 DE DE60317864T patent/DE60317864D1/de not_active Expired - Lifetime
- 2003-08-18 DE DE60321977T patent/DE60321977D1/de not_active Expired - Fee Related
- 2003-08-18 EP EP03018539A patent/EP1396323B1/en not_active Expired - Fee Related
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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KR101430797B1 (ko) * | 2008-08-08 | 2014-08-18 | 토와 가부시기가이샤 | 전자부품의 압축성형방법 및 금형장치 |
KR20200026036A (ko) * | 2018-08-31 | 2020-03-10 | 토와 가부시기가이샤 | 수지 성형 장치, 이형 필름의 박리 방법 및 수지 성형품의 제조 방법 |
Also Published As
Publication number | Publication date |
---|---|
EP1396323B1 (en) | 2007-12-05 |
DE60317864D1 (de) | 2008-01-17 |
EP1396323A1 (en) | 2004-03-10 |
US6977188B2 (en) | 2005-12-20 |
KR100546191B1 (ko) | 2006-01-24 |
EP1803539B1 (en) | 2008-07-02 |
DE60321977D1 (de) | 2008-08-14 |
TW200406293A (en) | 2004-05-01 |
US20040048416A1 (en) | 2004-03-11 |
JP2004098364A (ja) | 2004-04-02 |
JP4268389B2 (ja) | 2009-05-27 |
TWI235703B (en) | 2005-07-11 |
EP1803539A1 (en) | 2007-07-04 |
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