DE60321977D1 - Kunststoffformverfahren zur Verkapselung von elektronischem Bauteil und dafür verwendete Verkapselungs-Kunststoffformeinrichtung - Google Patents

Kunststoffformverfahren zur Verkapselung von elektronischem Bauteil und dafür verwendete Verkapselungs-Kunststoffformeinrichtung

Info

Publication number
DE60321977D1
DE60321977D1 DE60321977T DE60321977T DE60321977D1 DE 60321977 D1 DE60321977 D1 DE 60321977D1 DE 60321977 T DE60321977 T DE 60321977T DE 60321977 T DE60321977 T DE 60321977T DE 60321977 D1 DE60321977 D1 DE 60321977D1
Authority
DE
Germany
Prior art keywords
plastic molding
encapsulating
electronic component
device used
used therefor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60321977T
Other languages
English (en)
Inventor
Shinji Takase
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Towa Corp
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Application granted granted Critical
Publication of DE60321977D1 publication Critical patent/DE60321977D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/68—Release sheets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H01L21/566—Release layers for moulds, e.g. release layers, layers against residue during moulding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
DE60321977T 2002-09-06 2003-08-18 Kunststoffformverfahren zur Verkapselung von elektronischem Bauteil und dafür verwendete Verkapselungs-Kunststoffformeinrichtung Expired - Fee Related DE60321977D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002260894A JP4268389B2 (ja) 2002-09-06 2002-09-06 電子部品の樹脂封止成形方法及び装置

Publications (1)

Publication Number Publication Date
DE60321977D1 true DE60321977D1 (de) 2008-08-14

Family

ID=31712334

Family Applications (2)

Application Number Title Priority Date Filing Date
DE60317864T Expired - Lifetime DE60317864D1 (de) 2002-09-06 2003-08-18 Kunststoffformverfahren zum Einschliessen eines elektronischen Bauteils in Harz und dazu verwendbare Vorrichtung
DE60321977T Expired - Fee Related DE60321977D1 (de) 2002-09-06 2003-08-18 Kunststoffformverfahren zur Verkapselung von elektronischem Bauteil und dafür verwendete Verkapselungs-Kunststoffformeinrichtung

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE60317864T Expired - Lifetime DE60317864D1 (de) 2002-09-06 2003-08-18 Kunststoffformverfahren zum Einschliessen eines elektronischen Bauteils in Harz und dazu verwendbare Vorrichtung

Country Status (6)

Country Link
US (1) US6977188B2 (de)
EP (2) EP1803539B1 (de)
JP (1) JP4268389B2 (de)
KR (1) KR100546191B1 (de)
DE (2) DE60317864D1 (de)
TW (1) TWI235703B (de)

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JP4094515B2 (ja) * 2003-09-26 2008-06-04 株式会社ルネサステクノロジ 半導体装置の製造方法
JP2005150350A (ja) * 2003-11-14 2005-06-09 Renesas Technology Corp 半導体装置の製造方法
JP4373237B2 (ja) * 2004-02-13 2009-11-25 Ｔｏｗａ株式会社 半導体チップの樹脂封止成形方法および樹脂封止成形用金型
JP5004410B2 (ja) 2004-04-26 2012-08-22 Ｔｏｗａ株式会社 光素子の樹脂封止成形方法および樹脂封止成形装置
JP5128047B2 (ja) 2004-10-07 2013-01-23 Ｔｏｗａ株式会社 光デバイス及び光デバイスの生産方法
JP4508839B2 (ja) * 2004-11-12 2010-07-21 パナソニック株式会社 樹脂封止金型および樹脂封止装置
US7344902B2 (en) * 2004-11-15 2008-03-18 Philips Lumileds Lighting Company, Llc Overmolded lens over LED die
US7452737B2 (en) * 2004-11-15 2008-11-18 Philips Lumileds Lighting Company, Llc Molded lens over LED die
US7858408B2 (en) * 2004-11-15 2010-12-28 Koninklijke Philips Electronics N.V. LED with phosphor tile and overmolded phosphor in lens
WO2006129343A1 (ja) 2005-05-30 2006-12-07 Spansion Llc 半導体装置の製造装置及び半導体装置の製造方法
JP4587881B2 (ja) * 2005-06-10 2010-11-24 サンユレック株式会社 樹脂封止装置
US7985357B2 (en) * 2005-07-12 2011-07-26 Towa Corporation Method of resin-sealing and molding an optical device
JP2007109831A (ja) * 2005-10-13 2007-04-26 Towa Corp 電子部品の樹脂封止成形方法
US7595515B2 (en) * 2005-10-24 2009-09-29 3M Innovative Properties Company Method of making light emitting device having a molded encapsulant
CN101297411B (zh) * 2005-10-24 2010-05-19 3M创新有限公司 发光器件的制造方法及发光器件
JP4741383B2 (ja) * 2006-02-17 2011-08-03 富士通セミコンダクター株式会社 電子部品の樹脂封止方法
US8092735B2 (en) 2006-08-17 2012-01-10 3M Innovative Properties Company Method of making a light emitting device having a molded encapsulant
JP4858966B2 (ja) * 2006-11-02 2012-01-18 Ｔｏｗａ株式会社 電子部品の圧縮成形方法及び成形装置
EP2111651A4 (de) * 2007-02-13 2011-08-17 3M Innovative Properties Co Led mit linsen und verfahren zu ihrer herstellung
JP5036372B2 (ja) * 2007-04-02 2012-09-26 Ｔｏｗａ株式会社 光電子部品および光電子部品の製造方法
US7915089B2 (en) * 2007-04-10 2011-03-29 Infineon Technologies Ag Encapsulation method
KR101132136B1 (ko) * 2007-08-03 2012-04-03 스미도모쥬기가이고교 가부시키가이샤 피성형품의 낙하 방지 기구
JP2009124012A (ja) * 2007-11-16 2009-06-04 Towa Corp 電子部品の圧縮成形方法及び金型
JP4553944B2 (ja) * 2008-01-10 2010-09-29 アピックヤマダ株式会社 樹脂モールド方法および樹脂モールド装置
KR100980299B1 (ko) 2008-02-27 2010-09-06 세크론 주식회사 전자 부품 몰딩 장치
US7875967B2 (en) * 2008-03-10 2011-01-25 Stats Chippac Ltd. Integrated circuit with step molded inner stacking module package in package system
JP5153509B2 (ja) * 2008-08-08 2013-02-27 Ｔｏｗａ株式会社 電子部品の圧縮成形方法及び金型装置
US20100120199A1 (en) * 2008-11-07 2010-05-13 Bok Sim Lim Stacked package-on-package semiconductor device and methods of fabricating thereof
WO2010146860A1 (ja) * 2009-06-17 2010-12-23 パナソニック株式会社 樹脂モールド型電子部品の製造方法
KR101101669B1 (ko) 2009-12-01 2011-12-30 삼성전기주식회사 전자부품 제조장치 및 전자부품 제조방법
US8771577B2 (en) * 2010-02-16 2014-07-08 Koninklijke Philips N.V. Light emitting device with molded wavelength converting layer
WO2011105640A1 (ko) * 2010-02-25 2011-09-01 한미반도체 주식회사 압축 성형장치 및 압축 성형방법
WO2011105639A1 (ko) * 2010-02-25 2011-09-01 한미반도체 주식회사 압축 성형 장치 및 방법
JP5576197B2 (ja) * 2010-07-08 2014-08-20 Ｔｏｗａ株式会社 電子部品の圧縮成形方法及び成形装置
KR101052324B1 (ko) 2011-03-23 2011-07-27 신한다이아몬드공업 주식회사 봉지재 성형 방법
JP5403012B2 (ja) * 2011-08-11 2014-01-29 第一精工株式会社 樹脂封止装置
DE102011081083A1 (de) * 2011-08-17 2013-02-21 Osram Ag Presswerkzeug und verfahren zum pressen eines silikonelements
US9159643B2 (en) 2012-09-14 2015-10-13 Freescale Semiconductor, Inc. Matrix lid heatspreader for flip chip package
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JP5786918B2 (ja) * 2013-10-23 2015-09-30 第一精工株式会社 樹脂封止金型およびこれを用いた樹脂封止装置、樹脂封止方法
JP6057880B2 (ja) * 2013-11-28 2017-01-11 Ｔｏｗａ株式会社 圧縮成形装置の樹脂材料供給方法及び供給装置
JP6143665B2 (ja) * 2013-12-26 2017-06-07 Ｔｏｗａ株式会社 半導体封止方法及び半導体封止装置
KR102335853B1 (ko) * 2014-01-14 2021-12-07 아피쿠 야마다 가부시키가이샤 수지 몰드 금형 및 수지 몰드 방법
JP6270571B2 (ja) * 2014-03-19 2018-01-31 Ｔｏｗａ株式会社 シート樹脂の供給方法と半導体封止方法及び半導体封止装置
NL2013978B1 (en) * 2014-12-15 2016-10-11 Besi Netherlands Bv Device and method for controlled moulding and degating of a carrier with electronic components and moulded product.
JP6304517B1 (ja) * 2017-02-14 2018-04-04 第一精工株式会社 樹脂封止方法及び樹脂封止装置
CN108448012A (zh) * 2018-03-01 2018-08-24 佛山市国星光电股份有限公司 全彩led显示模组及其封装方法和显示屏
JP6994445B2 (ja) * 2018-08-31 2022-01-14 Ｔｏｗａ株式会社 樹脂成形装置、離型フィルムの剥離方法、樹脂成形品の製造方法
JP7018377B2 (ja) * 2018-11-26 2022-02-10 Ｔｏｗａ株式会社 成形型、樹脂成形装置、樹脂成形品の製造方法
JP7134926B2 (ja) * 2019-07-10 2022-09-12 Ｔｏｗａ株式会社 樹脂成形装置、及び樹脂成形品の製造方法
CN112873810A (zh) * 2019-11-29 2021-06-01 复盛应用科技股份有限公司 高尔夫球杆头盖片制造方法及模具
TWI740322B (zh) * 2019-12-25 2021-09-21 明安國際企業股份有限公司 具有碳纖維板之高爾夫球桿頭及其製造方法

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JP3282988B2 (ja) * 1997-05-01 2002-05-20 アピックヤマダ株式会社 樹脂モールド方法及び樹脂モールド装置
JP3490606B2 (ja) 1998-03-20 2004-01-26 富士通株式会社 半導体装置製造用金型

Also Published As

Publication number Publication date
TWI235703B (en) 2005-07-11
EP1803539B1 (de) 2008-07-02
JP4268389B2 (ja) 2009-05-27
TW200406293A (en) 2004-05-01
KR100546191B1 (ko) 2006-01-24
EP1396323B1 (de) 2007-12-05
JP2004098364A (ja) 2004-04-02
EP1396323A1 (de) 2004-03-10
US20040048416A1 (en) 2004-03-11
DE60317864D1 (de) 2008-01-17
EP1803539A1 (de) 2007-07-04
KR20040022152A (ko) 2004-03-11
US6977188B2 (en) 2005-12-20

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