DE60234473D1 - Leiterplattenrecyclingverfahren und vorrichtung dafür - Google Patents

Leiterplattenrecyclingverfahren und vorrichtung dafür

Info

Publication number
DE60234473D1
DE60234473D1 DE60234473T DE60234473T DE60234473D1 DE 60234473 D1 DE60234473 D1 DE 60234473D1 DE 60234473 T DE60234473 T DE 60234473T DE 60234473 T DE60234473 T DE 60234473T DE 60234473 D1 DE60234473 D1 DE 60234473D1
Authority
DE
Germany
Prior art keywords
device therefor
recycling method
pcb recycling
pcb
therefor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60234473T
Other languages
English (en)
Inventor
Rikiya Kamimura
Katsumi Nakamura
Kouji Kondo
Atsusi Sakaida
Toshihisa Taniguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2001385117A external-priority patent/JP4123769B2/ja
Priority claimed from JP2001389688A external-priority patent/JP4123773B2/ja
Application filed by Denso Corp filed Critical Denso Corp
Application granted granted Critical
Publication of DE60234473D1 publication Critical patent/DE60234473D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B09—DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
    • B09B—DISPOSAL OF SOLID WASTE NOT OTHERWISE PROVIDED FOR
    • B09B3/00—Destroying solid waste or transforming solid waste into something useful or harmless
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B09—DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
    • B09B—DISPOSAL OF SOLID WASTE NOT OTHERWISE PROVIDED FOR
    • B09B5/00—Operations not covered by a single other subclass or by a single other group in this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
    • B29B17/00—Recovery of plastics or other constituents of waste material containing plastics
    • B29B17/02—Separating plastics from other materials
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B7/00—Working up raw materials other than ores, e.g. scrap, to produce non-ferrous metals and compounds thereof; Methods of a general interest or applied to the winning of more than two metals
    • C22B7/001—Dry processes
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
    • C22B7/00—Working up raw materials other than ores, e.g. scrap, to produce non-ferrous metals and compounds thereof; Methods of a general interest or applied to the winning of more than two metals
    • C22B7/005—Separation by a physical processing technique only, e.g. by mechanical breaking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
    • B29B17/00—Recovery of plastics or other constituents of waste material containing plastics
    • B29B17/02—Separating plastics from other materials
    • B29B2017/0213—Specific separating techniques
    • B29B2017/0255—Specific separating techniques using different melting or softening temperatures of the materials to be separated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
    • B29B17/00—Recovery of plastics or other constituents of waste material containing plastics
    • B29B17/04—Disintegrating plastics, e.g. by milling
    • B29B2017/0424—Specific disintegrating techniques; devices therefor
    • B29B2017/0456—Pressing tools with calibrated openings, e.g. in sizing plates, for disintegrating solid materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
    • B29B17/00—Recovery of plastics or other constituents of waste material containing plastics
    • B29B17/04—Disintegrating plastics, e.g. by milling
    • B29B2017/0424—Specific disintegrating techniques; devices therefor
    • B29B2017/0464—Solid state shear extrusion pulverisation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3425—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/178—Demolishing, e.g. recycling, reverse engineering, destroying for security purposes; Using biodegradable materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4632—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating thermoplastic or uncured resin sheets comprising printed circuits without added adhesive materials between the sheets
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00—Technologies related to metal processing
    • Y02P10/20—Recycling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W30/00—Technologies for solid waste management
    • Y02W30/50—Reuse, recycling or recovery technologies
    • Y02W30/62—Plastics recycling; Rubber recycling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49751—Scrap recovering or utilizing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49751—Scrap recovering or utilizing
    • Y10T29/49755—Separating one material from another
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49751—Scrap recovering or utilizing
    • Y10T29/49755—Separating one material from another
    • Y10T29/49757—Separating one material from another by burning or heating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53274—Means to disassemble electrical device

Landscapes

  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Geology (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Separation, Recovery Or Treatment Of Waste Materials Containing Plastics (AREA)
  • Processing Of Solid Wastes (AREA)
DE60234473T 2001-12-18 2002-12-16 Leiterplattenrecyclingverfahren und vorrichtung dafür Expired - Lifetime DE60234473D1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001385117A JP4123769B2 (ja) 2001-12-18 2001-12-18 プリント基板のリサイクル方法
JP2001389688A JP4123773B2 (ja) 2001-12-21 2001-12-21 樹脂と金属の分離装置
PCT/JP2002/013152 WO2003051545A1 (fr) 2001-12-18 2002-12-16 Procede de recyclage de cartes de circuit imprime, et appareil y relatif

Publications (1)

Publication Number Publication Date
DE60234473D1 true DE60234473D1 (de) 2009-12-31

Family

ID=26625124

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60234473T Expired - Lifetime DE60234473D1 (de) 2001-12-18 2002-12-16 Leiterplattenrecyclingverfahren und vorrichtung dafür

Country Status (8)

Country Link
US (2) US7107661B2 (de)
EP (1) EP1484119B1 (de)
KR (1) KR100526071B1 (de)
CN (1) CN1214872C (de)
DE (1) DE60234473D1 (de)
MX (1) MXPA03007267A (de)
TW (1) TW551012B (de)
WO (1) WO2003051545A1 (de)

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US20040181923A1 (en) * 2003-03-17 2004-09-23 Dills James Carl Process for reusing and recycling circuit boards
US7187075B1 (en) * 2004-07-29 2007-03-06 National Semiconductor Corporation Stress relieving film for semiconductor packages
US7674994B1 (en) * 2004-10-21 2010-03-09 Valerio Thomas A Method and apparatus for sorting metal
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US7867404B2 (en) * 2005-11-15 2011-01-11 Joel Allen Deutsch Method for converting electrical components
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CN100592939C (zh) * 2006-01-20 2010-03-03 巫协森 回收废弃印刷电路板的方法
AU2008205361B2 (en) * 2007-01-05 2012-06-14 Thomas A. Valerio System and method for sorting dissimilar materials
KR100889315B1 (ko) * 2007-11-16 2009-03-18 한국지질자원연구원 유기용액을 이용한 폐인쇄회로기판으로부터 금속을회수하는 방법
WO2009152290A1 (en) 2008-06-11 2009-12-17 Valerio Thomas A Method and system for recovering metal from processed recycled materials
AU2009274103A1 (en) * 2008-07-21 2010-01-28 Mtd America Ltd (Llc) Method and system for removing polychlorinated biphenyls from plastics
MY152962A (en) * 2008-08-20 2014-12-15 Fuel Ltd P Disposal of electrical and electronic equipment
US8627960B2 (en) 2009-04-28 2014-01-14 Mtd America Ltd (Llc) Apparatus and method for separating materials using air
AU2010276224A1 (en) * 2009-07-21 2012-02-23 Thomas A. Velerio Method and system for separating and recovering like-type materials from an electronic waste system
AU2010278693A1 (en) 2009-07-31 2012-03-01 Thomas A. Valerio Method and system for separating and recovering wire and other metal from processed recycled materials
US8757523B2 (en) * 2009-07-31 2014-06-24 Thomas Valerio Method and system for separating and recovering wire and other metal from processed recycled materials
CN101954678B (zh) * 2010-10-28 2012-07-25 中南大学 一种废弃印刷电路板分选前的预处理工艺
CN102172600B (zh) * 2011-03-14 2013-04-17 广东工业大学 一种利用废旧电路板类废弃物真空热解油综合回收方法
CN102304280B (zh) * 2011-06-16 2012-12-26 肖超锋 利用电路板粉合成的无醛零碳环保板材及其制造工艺
CN104885576B (zh) * 2012-12-31 2017-12-05 阿莫绿色技术有限公司 柔性印刷电路基板及其制造方法
CN105339147B (zh) * 2013-06-24 2017-05-10 株式会社大贵 分离装置和分离方法
CN104342553A (zh) * 2013-07-24 2015-02-11 北大方正集团有限公司 一种处理印刷电路板的方法及装置
CN104044257A (zh) * 2014-05-12 2014-09-17 张家港市贝尔机械有限公司 免换网自动过滤单螺杆双阶挤出机
WO2016022755A2 (en) 2014-08-06 2016-02-11 Greene Lyon Group, Inc. Rotational removal of electronic chips and other components from printed wire boards using liquid heat media
KR101481372B1 (ko) 2014-09-23 2015-01-14 박종헌 전자 폐기물 재활용 시스템
US9997425B2 (en) * 2015-07-14 2018-06-12 University Of Windsor Layered benzocyclobutene interconnected circuit and method of manufacturing same
CN105397936A (zh) * 2015-12-03 2016-03-16 福建工程学院 一种用正戊烷处理废线路板的方法
TWI584931B (zh) * 2016-04-08 2017-06-01 Elastic pad method for the use of recycled waste resin
CN107377575A (zh) * 2016-05-17 2017-11-24 陕西安信显像管循环处理应用有限公司 废电路板处理系统及其处理方法
CN106082246B (zh) * 2016-06-03 2018-08-21 福建工程学院 一种用废弃线路板制备高纯多孔二氧化硅的方法
CN108097699A (zh) * 2017-12-13 2018-06-01 长沙汇聚环境技术有限公司 一种废镀锡铜米与废弃电路板的协同回收方法及装置
CN111001642A (zh) * 2019-10-17 2020-04-14 佛山市南海保达建筑机械设备有限公司 一种玻璃纤维废板的处理方法
IT202100026870A1 (it) * 2021-10-19 2023-04-19 Greenvincible S R L Impianto e procedimento per il recupero di materie prime da circuiti stampati

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Also Published As

Publication number Publication date
EP1484119A1 (de) 2004-12-08
US7107661B2 (en) 2006-09-19
EP1484119B1 (de) 2009-11-18
KR100526071B1 (ko) 2005-11-08
US7296340B2 (en) 2007-11-20
CN1214872C (zh) 2005-08-17
KR20030074642A (ko) 2003-09-19
WO2003051545A1 (fr) 2003-06-26
CN1482950A (zh) 2004-03-17
MXPA03007267A (es) 2004-06-30
EP1484119A4 (de) 2005-09-28
US20040111854A1 (en) 2004-06-17
US20050246879A1 (en) 2005-11-10
TW200301672A (en) 2003-07-01
TW551012B (en) 2003-09-01

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