DE602004002529T8 - Flexibler Träger und elektronische Vorrichtung - Google Patents

Flexibler Träger und elektronische Vorrichtung Download PDF

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Publication number
DE602004002529T8
DE602004002529T8 DE602004002529T DE602004002529T DE602004002529T8 DE 602004002529 T8 DE602004002529 T8 DE 602004002529T8 DE 602004002529 T DE602004002529 T DE 602004002529T DE 602004002529 T DE602004002529 T DE 602004002529T DE 602004002529 T8 DE602004002529 T8 DE 602004002529T8
Authority
DE
Germany
Prior art keywords
electronic device
flexible vehicle
flexible
vehicle
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602004002529T
Other languages
English (en)
Other versions
DE602004002529D1 (de
DE602004002529T2 (de
Inventor
Nobuyuki Hirakata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Publication of DE602004002529D1 publication Critical patent/DE602004002529D1/de
Publication of DE602004002529T2 publication Critical patent/DE602004002529T2/de
Application granted granted Critical
Publication of DE602004002529T8 publication Critical patent/DE602004002529T8/de
Active legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0277Bendability or stretchability details
    • H05K1/028Bending or folding regions of flexible printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09654Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0969Apertured conductors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09654Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09727Varying width along a single conductor; Conductors or pads having different widths

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Casings For Electric Apparatus (AREA)
  • Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)
DE602004002529T 2003-07-24 2004-07-22 Flexibler Träger und elektronische Vorrichtung Active DE602004002529T8 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003279396 2003-07-24
JP2003279396 2003-07-24

Publications (3)

Publication Number Publication Date
DE602004002529D1 DE602004002529D1 (de) 2006-11-09
DE602004002529T2 DE602004002529T2 (de) 2007-06-21
DE602004002529T8 true DE602004002529T8 (de) 2008-02-07

Family

ID=33487719

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004002529T Active DE602004002529T8 (de) 2003-07-24 2004-07-22 Flexibler Träger und elektronische Vorrichtung

Country Status (4)

Country Link
US (1) US7531752B2 (de)
EP (1) EP1501340B1 (de)
CN (1) CN100433948C (de)
DE (1) DE602004002529T8 (de)

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US7439449B1 (en) * 2002-02-14 2008-10-21 Finisar Corporation Flexible circuit for establishing electrical connectivity with optical subassembly
US7526207B2 (en) * 2002-10-18 2009-04-28 Finisar Corporation Flexible circuit design for improved laser bias connections to optical subassemblies
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KR100713445B1 (ko) * 2005-09-24 2007-04-30 삼성전자주식회사 다수개의 보드로 구성된 휴대 단말기의 보드간 연결 구조
TWI303955B (en) * 2005-12-28 2008-12-01 High Tech Comp Corp Dual-axis circuit board
JP4781943B2 (ja) * 2006-08-29 2011-09-28 日本メクトロン株式会社 フレキシブル配線板
JP4919755B2 (ja) * 2006-10-02 2012-04-18 日東電工株式会社 配線回路基板および電子機器
US7856690B2 (en) * 2006-11-22 2010-12-28 3M Innovative Properties Company Brushing assembly
JP4886603B2 (ja) * 2007-05-31 2012-02-29 日東電工株式会社 プリント配線基板
KR100956238B1 (ko) * 2007-12-18 2010-05-04 삼성전기주식회사 굴곡성 인쇄회로기판 및 그 제조방법
US20090213565A1 (en) * 2008-02-27 2009-08-27 International Business Machines Corporation Emc shielding for printed circuits using flexible printed circuit materials
US8238087B2 (en) 2010-01-06 2012-08-07 Apple Inc. Display module
WO2010001812A1 (ja) * 2008-06-30 2010-01-07 新日鐵化学株式会社 可撓性回路基板及びその製造方法並びに可撓性回路基板の屈曲部構造
US7995334B2 (en) * 2010-01-06 2011-08-09 Apple Inc. Printed circuit board
JP5284308B2 (ja) * 2010-04-19 2013-09-11 日本メクトロン株式会社 フレキシブル回路基板及びその製造方法
JP5584086B2 (ja) * 2010-10-14 2014-09-03 パナソニック株式会社 電子機器
JP5269157B2 (ja) * 2011-07-22 2013-08-21 キヤノン株式会社 撮像装置
US20130335929A1 (en) * 2012-06-19 2013-12-19 Motorola Mobility, Inc. Electronic device and method with flexible display
DE102012221002A1 (de) 2012-11-16 2014-05-22 Jumatech Gmbh Abwinkelbare und/oder abgewinkelte Leiterplattenstruktur mit zumindest zwei Leiterplattenabschnitten und Verfahren zu deren Herstellung
US9781825B2 (en) * 2013-02-18 2017-10-03 Dell Products L.P. Flex circuit, an information handling system, and a method of manufacturing a flexible circuit
TWI790673B (zh) * 2013-03-07 2023-01-21 日商半導體能源研究所股份有限公司 電子裝置
KR101416159B1 (ko) * 2013-09-06 2014-07-14 주식회사 기가레인 접촉 패드를 구비하는 인쇄회로기판
WO2015060387A1 (ja) * 2013-10-23 2015-04-30 京セラ株式会社 配線基板および電子装置
KR102114319B1 (ko) * 2014-01-22 2020-05-25 삼성디스플레이 주식회사 디스플레이 장치
KR102223125B1 (ko) 2014-03-27 2021-03-05 삼성디스플레이 주식회사 데이터 구동부 및 이를 구비한 표시 장치
JP6191991B2 (ja) * 2014-03-31 2017-09-06 パナソニックIpマネジメント株式会社 伸縮性フレキシブル基板およびその製造方法
KR102340738B1 (ko) * 2014-09-02 2021-12-17 삼성디스플레이 주식회사 곡면 표시장치
CN107006117B (zh) * 2014-09-23 2019-10-01 皇家飞利浦有限公司 具有受控的机械阻力的扁平线缆应变消除
CN105472876A (zh) * 2015-12-29 2016-04-06 广东欧珀移动通信有限公司 移动终端、柔性电路板及其制造方法
US10109939B2 (en) * 2016-03-16 2018-10-23 Rosemount Aerospace Inc. Flex circuit connector configuration
CN107204342B (zh) * 2016-03-16 2019-08-23 昆山工研院新型平板显示技术中心有限公司 柔性电子器件及其制造方法
TWI595607B (zh) * 2016-06-30 2017-08-11 欣興電子股份有限公司 封裝載板及封裝載板的製造方法
US10004139B2 (en) * 2016-08-16 2018-06-19 Chicony Electronics Co., Ltd. Flexible printed circuit board of light guide module and cut-out structure thereof
FI20175786A1 (en) * 2017-09-01 2019-03-02 Teknologian Tutkimuskeskus Vtt Oy Electric membrane
JP2021182567A (ja) * 2018-08-09 2021-11-25 ソニーセミコンダクタソリューションズ株式会社 半導体集積回路および電子機器
US11863695B2 (en) * 2021-09-23 2024-01-02 Motorola Mobility Llc Hinged electronic device with flexible substrate having dynamic regions defining one or more apertures
CN113903257A (zh) * 2021-09-27 2022-01-07 业成科技(成都)有限公司 可拉伸电子模组及其应用的电子装置

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JPH02244788A (ja) 1989-03-17 1990-09-28 Hitachi Ltd 回路基板
JP3066802B1 (ja) 1998-12-10 2000-07-17 日本航空電子工業株式会社 ヒンジコネクタ
DK1200387T3 (da) * 1999-07-29 2004-07-19 Ciba Sc Holding Ag Fremgangsmåde til den cis-selektive katalytiske hydrogenering af cyclohexylidenaminer
JP3505640B2 (ja) 1999-11-25 2004-03-08 日本航空電子工業株式会社 フレキシブルな伝送線路一体型コネクタ
US6990355B2 (en) * 2000-06-30 2006-01-24 Sanyo Electric Co., Ltd. Flexible printed circuit board and foldable cell phone terminal
JP2002158458A (ja) 2000-11-22 2002-05-31 Sony Corp 電子機器
JP2002171033A (ja) 2000-12-04 2002-06-14 Matsushita Electric Ind Co Ltd フレキシブルプリント基板
JP3924126B2 (ja) * 2001-01-16 2007-06-06 アルプス電気株式会社 プリント配線基板、及びその製造方法
JP2002368440A (ja) * 2001-06-06 2002-12-20 Toshiba Corp 折り畳み型電子機器とそのフレキシブル基板
JP4109864B2 (ja) 2001-12-26 2008-07-02 東芝松下ディスプレイテクノロジー株式会社 マトリクスアレイ基板及びその製造方法
JP5062953B2 (ja) * 2004-12-09 2012-10-31 富士通株式会社 アンテナ装置及び無線通信装置

Also Published As

Publication number Publication date
US7531752B2 (en) 2009-05-12
EP1501340A3 (de) 2005-11-09
DE602004002529D1 (de) 2006-11-09
US20050018409A1 (en) 2005-01-27
CN100433948C (zh) 2008-11-12
EP1501340A2 (de) 2005-01-26
DE602004002529T2 (de) 2007-06-21
EP1501340B1 (de) 2006-09-27
CN1578586A (zh) 2005-02-09

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