CN1578586A - 柔性衬底和电子设备 - Google Patents
柔性衬底和电子设备 Download PDFInfo
- Publication number
- CN1578586A CN1578586A CN200410071018.7A CN200410071018A CN1578586A CN 1578586 A CN1578586 A CN 1578586A CN 200410071018 A CN200410071018 A CN 200410071018A CN 1578586 A CN1578586 A CN 1578586A
- Authority
- CN
- China
- Prior art keywords
- flexible substrate
- wiring conductor
- substrate
- slit
- sweep
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 393
- 239000004020 conductor Substances 0.000 claims abstract description 124
- 230000008878 coupling Effects 0.000 claims description 27
- 238000010168 coupling process Methods 0.000 claims description 27
- 238000005859 coupling reaction Methods 0.000 claims description 27
- 238000005452 bending Methods 0.000 claims description 18
- 239000012141 concentrate Substances 0.000 description 8
- 208000037656 Respiratory Sounds Diseases 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000009825 accumulation Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000010339 dilation Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 210000003127 knee Anatomy 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000035772 mutation Effects 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/0969—Apertured conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Casings For Electric Apparatus (AREA)
- Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)
Abstract
Description
Claims (20)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP279396/2003 | 2003-07-24 | ||
JP2003279396 | 2003-07-24 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1578586A true CN1578586A (zh) | 2005-02-09 |
CN100433948C CN100433948C (zh) | 2008-11-12 |
Family
ID=33487719
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004100710187A Expired - Fee Related CN100433948C (zh) | 2003-07-24 | 2004-07-26 | 柔性衬底和电子设备 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7531752B2 (zh) |
EP (1) | EP1501340B1 (zh) |
CN (1) | CN100433948C (zh) |
DE (1) | DE602004002529T8 (zh) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101160017B (zh) * | 2006-10-02 | 2012-03-28 | 日东电工株式会社 | 布线电路基板以及电子设备 |
CN102891955A (zh) * | 2011-07-22 | 2013-01-23 | 佳能株式会社 | 摄像设备 |
CN105359632A (zh) * | 2013-10-23 | 2016-02-24 | 京瓷株式会社 | 布线基板以及电子装置 |
CN105472876A (zh) * | 2015-12-29 | 2016-04-06 | 广东欧珀移动通信有限公司 | 移动终端、柔性电路板及其制造方法 |
CN107006117A (zh) * | 2014-09-23 | 2017-08-01 | 皇家飞利浦有限公司 | 具有受控的机械阻力的扁平线缆应变消除 |
WO2017157215A1 (zh) * | 2016-03-16 | 2017-09-21 | 昆山工研院新型平板显示技术中心有限公司 | 柔性电子器件及其制造方法 |
CN112534568A (zh) * | 2018-08-09 | 2021-03-19 | 索尼半导体解决方案公司 | 半导体集成电路和电子仪器 |
TWI789934B (zh) * | 2021-09-27 | 2023-01-11 | 大陸商業成科技(成都)有限公司 | 可拉伸電子模組及其應用之電子裝置 |
WO2024179196A1 (zh) * | 2023-02-28 | 2024-09-06 | 湖南省华芯医疗器械有限公司 | 一种电路结构、前端组件及内窥镜 |
Families Citing this family (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7439449B1 (en) * | 2002-02-14 | 2008-10-21 | Finisar Corporation | Flexible circuit for establishing electrical connectivity with optical subassembly |
US7526207B2 (en) * | 2002-10-18 | 2009-04-28 | Finisar Corporation | Flexible circuit design for improved laser bias connections to optical subassemblies |
JP4095082B2 (ja) * | 2005-08-31 | 2008-06-04 | Tdk株式会社 | 磁気ヘッドアッセンブリのフレキシブル配線板 |
KR100713445B1 (ko) * | 2005-09-24 | 2007-04-30 | 삼성전자주식회사 | 다수개의 보드로 구성된 휴대 단말기의 보드간 연결 구조 |
TWI303955B (en) * | 2005-12-28 | 2008-12-01 | High Tech Comp Corp | Dual-axis circuit board |
JP4781943B2 (ja) * | 2006-08-29 | 2011-09-28 | 日本メクトロン株式会社 | フレキシブル配線板 |
US7856690B2 (en) * | 2006-11-22 | 2010-12-28 | 3M Innovative Properties Company | Brushing assembly |
JP4886603B2 (ja) * | 2007-05-31 | 2012-02-29 | 日東電工株式会社 | プリント配線基板 |
KR100956238B1 (ko) * | 2007-12-18 | 2010-05-04 | 삼성전기주식회사 | 굴곡성 인쇄회로기판 및 그 제조방법 |
US20090213565A1 (en) * | 2008-02-27 | 2009-08-27 | International Business Machines Corporation | Emc shielding for printed circuits using flexible printed circuit materials |
US8238087B2 (en) | 2010-01-06 | 2012-08-07 | Apple Inc. | Display module |
EP2306794B1 (en) * | 2008-06-30 | 2015-08-05 | Nippon Steel & Sumikin Chemical Co., Ltd. | Method for producing flexible circuit board |
US7995334B2 (en) * | 2010-01-06 | 2011-08-09 | Apple Inc. | Printed circuit board |
JP5284308B2 (ja) * | 2010-04-19 | 2013-09-11 | 日本メクトロン株式会社 | フレキシブル回路基板及びその製造方法 |
JP5584086B2 (ja) * | 2010-10-14 | 2014-09-03 | パナソニック株式会社 | 電子機器 |
US20130335929A1 (en) * | 2012-06-19 | 2013-12-19 | Motorola Mobility, Inc. | Electronic device and method with flexible display |
DE102012221002B4 (de) | 2012-11-16 | 2024-08-22 | Jumatech Gmbh | Abwinkelbare und/oder abgewinkelte Leiterplattenstruktur mit zumindest zwei Leiterplattenabschnitten und Verfahren zu deren Herstellung |
US9781825B2 (en) * | 2013-02-18 | 2017-10-03 | Dell Products L.P. | Flex circuit, an information handling system, and a method of manufacturing a flexible circuit |
CN108807708B (zh) | 2013-03-07 | 2021-08-03 | 株式会社半导体能源研究所 | 手表型便携式信息终端 |
KR101416159B1 (ko) * | 2013-09-06 | 2014-07-14 | 주식회사 기가레인 | 접촉 패드를 구비하는 인쇄회로기판 |
KR102114319B1 (ko) * | 2014-01-22 | 2020-05-25 | 삼성디스플레이 주식회사 | 디스플레이 장치 |
KR102223125B1 (ko) * | 2014-03-27 | 2021-03-05 | 삼성디스플레이 주식회사 | 데이터 구동부 및 이를 구비한 표시 장치 |
JP6191991B2 (ja) * | 2014-03-31 | 2017-09-06 | パナソニックIpマネジメント株式会社 | 伸縮性フレキシブル基板およびその製造方法 |
KR102340738B1 (ko) * | 2014-09-02 | 2021-12-17 | 삼성디스플레이 주식회사 | 곡면 표시장치 |
US10109939B2 (en) * | 2016-03-16 | 2018-10-23 | Rosemount Aerospace Inc. | Flex circuit connector configuration |
TWI595607B (zh) * | 2016-06-30 | 2017-08-11 | 欣興電子股份有限公司 | 封裝載板及封裝載板的製造方法 |
US10004139B2 (en) * | 2016-08-16 | 2018-06-19 | Chicony Electronics Co., Ltd. | Flexible printed circuit board of light guide module and cut-out structure thereof |
FI20175786A1 (en) * | 2017-09-01 | 2019-03-02 | Teknologian Tutkimuskeskus Vtt Oy | Electric membrane |
US11863695B2 (en) * | 2021-09-23 | 2024-01-02 | Motorola Mobility Llc | Hinged electronic device with flexible substrate having dynamic regions defining one or more apertures |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5663077A (en) | 1979-10-29 | 1981-05-29 | Toyo Boseki | Fabric |
US4394707A (en) * | 1981-02-26 | 1983-07-19 | Bell Telephone Laboratories, Incorporated | Electrical circuit package |
JPH02244788A (ja) | 1989-03-17 | 1990-09-28 | Hitachi Ltd | 回路基板 |
JP3066802B1 (ja) | 1998-12-10 | 2000-07-17 | 日本航空電子工業株式会社 | ヒンジコネクタ |
PT1200387E (pt) * | 1999-07-29 | 2004-09-30 | Ciba Sc Holding Ag | Processo para a hidrogenacao catalitica cis-selectiva de ciclo-hexilidenaminas |
JP3505640B2 (ja) | 1999-11-25 | 2004-03-08 | 日本航空電子工業株式会社 | フレキシブルな伝送線路一体型コネクタ |
US6990355B2 (en) * | 2000-06-30 | 2006-01-24 | Sanyo Electric Co., Ltd. | Flexible printed circuit board and foldable cell phone terminal |
JP2002158458A (ja) | 2000-11-22 | 2002-05-31 | Sony Corp | 電子機器 |
JP2002171033A (ja) | 2000-12-04 | 2002-06-14 | Matsushita Electric Ind Co Ltd | フレキシブルプリント基板 |
JP3924126B2 (ja) * | 2001-01-16 | 2007-06-06 | アルプス電気株式会社 | プリント配線基板、及びその製造方法 |
JP2002368440A (ja) | 2001-06-06 | 2002-12-20 | Toshiba Corp | 折り畳み型電子機器とそのフレキシブル基板 |
JP4109864B2 (ja) | 2001-12-26 | 2008-07-02 | 東芝松下ディスプレイテクノロジー株式会社 | マトリクスアレイ基板及びその製造方法 |
JP5062953B2 (ja) * | 2004-12-09 | 2012-10-31 | 富士通株式会社 | アンテナ装置及び無線通信装置 |
-
2004
- 2004-07-16 US US10/892,321 patent/US7531752B2/en not_active Expired - Fee Related
- 2004-07-22 DE DE602004002529T patent/DE602004002529T8/de active Active
- 2004-07-22 EP EP04090289A patent/EP1501340B1/en not_active Expired - Lifetime
- 2004-07-26 CN CNB2004100710187A patent/CN100433948C/zh not_active Expired - Fee Related
Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101160017B (zh) * | 2006-10-02 | 2012-03-28 | 日东电工株式会社 | 布线电路基板以及电子设备 |
CN102891955A (zh) * | 2011-07-22 | 2013-01-23 | 佳能株式会社 | 摄像设备 |
CN102891955B (zh) * | 2011-07-22 | 2015-05-20 | 佳能株式会社 | 摄像设备 |
CN105359632B (zh) * | 2013-10-23 | 2018-02-06 | 京瓷株式会社 | 布线基板以及电子装置 |
CN105359632A (zh) * | 2013-10-23 | 2016-02-24 | 京瓷株式会社 | 布线基板以及电子装置 |
CN107006117A (zh) * | 2014-09-23 | 2017-08-01 | 皇家飞利浦有限公司 | 具有受控的机械阻力的扁平线缆应变消除 |
CN107006117B (zh) * | 2014-09-23 | 2019-10-01 | 皇家飞利浦有限公司 | 具有受控的机械阻力的扁平线缆应变消除 |
CN105472876A (zh) * | 2015-12-29 | 2016-04-06 | 广东欧珀移动通信有限公司 | 移动终端、柔性电路板及其制造方法 |
CN107204342A (zh) * | 2016-03-16 | 2017-09-26 | 昆山工研院新型平板显示技术中心有限公司 | 柔性电子器件及其制造方法 |
TWI649014B (zh) * | 2016-03-16 | 2019-01-21 | 昆山工研院新型平板顯示技術中心有限公司 | 軟性電子設備及其製造方法 |
CN107204342B (zh) * | 2016-03-16 | 2019-08-23 | 昆山工研院新型平板显示技术中心有限公司 | 柔性电子器件及其制造方法 |
WO2017157215A1 (zh) * | 2016-03-16 | 2017-09-21 | 昆山工研院新型平板显示技术中心有限公司 | 柔性电子器件及其制造方法 |
US11119536B2 (en) | 2016-03-16 | 2021-09-14 | Kunshan New Flat Panel Display Technology Center Co., Ltd. | Flexible electronic device and manufacturing method therefor |
CN112534568A (zh) * | 2018-08-09 | 2021-03-19 | 索尼半导体解决方案公司 | 半导体集成电路和电子仪器 |
TWI789934B (zh) * | 2021-09-27 | 2023-01-11 | 大陸商業成科技(成都)有限公司 | 可拉伸電子模組及其應用之電子裝置 |
WO2024179196A1 (zh) * | 2023-02-28 | 2024-09-06 | 湖南省华芯医疗器械有限公司 | 一种电路结构、前端组件及内窥镜 |
Also Published As
Publication number | Publication date |
---|---|
EP1501340B1 (en) | 2006-09-27 |
EP1501340A3 (en) | 2005-11-09 |
DE602004002529T8 (de) | 2008-02-07 |
DE602004002529D1 (de) | 2006-11-09 |
US20050018409A1 (en) | 2005-01-27 |
DE602004002529T2 (de) | 2007-06-21 |
CN100433948C (zh) | 2008-11-12 |
EP1501340A2 (en) | 2005-01-26 |
US7531752B2 (en) | 2009-05-12 |
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ASS | Succession or assignment of patent right |
Owner name: LENOVO INNOVATION CO., LTD. (HONGKONG) Free format text: FORMER OWNER: NEC CORP. Effective date: 20141201 |
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Free format text: CORRECT: ADDRESS; TO: HONG KONG, CHINA |
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Effective date of registration: 20141201 Address after: Hongkong, China Patentee after: LENOVO INNOVATIONS Co.,Ltd.(HONG KONG) Address before: Tokyo, Japan Patentee before: NEC Corp. |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20081112 Termination date: 20170726 |
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CF01 | Termination of patent right due to non-payment of annual fee |