CN107204342A - 柔性电子器件及其制造方法 - Google Patents

柔性电子器件及其制造方法 Download PDF

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CN107204342A
CN107204342A CN201610150011.7A CN201610150011A CN107204342A CN 107204342 A CN107204342 A CN 107204342A CN 201610150011 A CN201610150011 A CN 201610150011A CN 107204342 A CN107204342 A CN 107204342A
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flexible
base board
electronic device
conductor structure
flexible base
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CN107204342B (zh
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单奇
胡坤
林立
蔡世星
刘胜芳
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Kunshan New Flat Panel Display Technology Center Co Ltd
Kunshan Govisionox Optoelectronics Co Ltd
Kunshan Guoxian Photoelectric Co Ltd
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Kunshan New Flat Panel Display Technology Center Co Ltd
Kunshan Guoxian Photoelectric Co Ltd
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Application filed by Kunshan New Flat Panel Display Technology Center Co Ltd, Kunshan Guoxian Photoelectric Co Ltd filed Critical Kunshan New Flat Panel Display Technology Center Co Ltd
Priority to JP2018526687A priority patent/JP6858774B2/ja
Priority to US15/778,481 priority patent/US11119536B2/en
Priority to KR1020187017222A priority patent/KR102078546B1/ko
Priority to EP17765757.4A priority patent/EP3367438A4/en
Priority to PCT/CN2017/076100 priority patent/WO2017157215A1/zh
Priority to TW106108718A priority patent/TWI649014B/zh
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Abstract

本发明提供了一种柔性电子器件及其制造方法，其中，所述柔性电子器件包括：一柔性基板以及形成于所述柔性基板上的器件层；所述器件层包括相互连接的半导体结构和导线结构，所述导线结构的延伸方向与所述半导体结构的沟道方向一致；所述第一导线结构的延伸方向与所述柔性基板的拉伸方向形成小于90°的夹角。在本发明提供的柔性电子器件及其制造方法中，通过调整半导体结构的沟道方向和第一导线结构的延伸方向，使得所述半导体结构和第一导线结构受应力影响最小，从而保证所述柔性电子器件的电性能以及抗揉性能。

Description

柔性电子器件及其制造方法
技术领域
本发明涉及柔性电子技术领域，特别涉及一种柔性电子器件及其制造方法。
背景技术
柔性电子(Flexible Electronics)技术是一种建立在柔性基板之上的电子技术，由于其独特的柔性和延展性，在信息、能源、医疗、国防等领域具有广泛的应用前景。采用柔性电子技术制作的柔性电子器件具有轻薄、能够弯曲或卷曲成任意形状的特性，例如柔性印刷电路板、柔性芯片和柔性显示器等。
现有的柔性电子器件通常包括一柔性基板以及制作于所述柔性基板之上的器件层，所述器件层包括半导体结构和导线结构，所述半导体结构起到开关作用，所述导线结构用以与其他的器件电性连接。其中，部分导线结构为了与所述半导体结构配套，其延伸方向与所述半导体结构的沟道方向平行。
请参考图1，其为现有技术的柔性电子器件的结构示意图。如图1所示，现有的柔性电子器件100包括柔性基板110以及形成于所述柔性基板110上的器件层，所述器件层包括半导体结构120以及与所述半导体结构120配套的导线结构130，所述导线结构130的延伸方向与所述半导体结构120的沟道方向(虚线双向箭头所示)平行。
当所述柔性电子器件100处于弯曲状态时，所述柔性基板110和器件层都会受到应力影响。请参考图2，其为现有技术的柔性电子器件在受到应力时的结构示意图。如图2所示，所述柔性电子器件100所受应力方向与所述半导体结构120的沟道方向平行时，所述半导体结构120会受到沿沟道方向的拉力以及垂直于所述拉力方向的收缩力，所述半导体结构120在这两种力的作用下发生形变，导致流经所述半导体结构120的电流出现变化，同时，由于所述导线结构130的延伸方向与应力方向相同，经过拉伸后，所述导线结构130会变细变长，非常容易断裂。
由上述可知，现有的柔性电子产品10受到应力作用时半导体结构120和导线结构130的结构会发生变化，导致器件层100的电性能和抗揉性能变差。
发明内容
本发明的目的在于提供一种柔性电子器件及其制造方法，以解决现有的柔性电子器件受应力影响导致电子器件的电性能和抗揉性能下降的问题。
为解决上述技术问题，本发明提供一种柔性电子器件，所述柔性电子器件包括：一柔性基板以及形成于所述柔性基板上的器件层；
所述器件层包括相互连接的半导体结构和第一导线结构，所述第一导线结构的延伸方向与所述半导体结构的沟道方向一致；
所述第一导线结构的延伸方向与所述柔性基板的拉伸方向形成小于90°的夹角。
可选的，在所述的柔性电子器件中，所述第一导线结构的延伸方向与所述柔性基板的拉伸方向所形成的夹角范围在40°～70°之间。
可选的，在所述的柔性电子器件中，所述器件层还包括第二导线结构，所述第二导线结构设置于所述柔性基板的边缘，且所述第二导线结构的延伸方向与所述柔性基板的边缘线平行。
可选的，在所述的柔性电子器件中，所述第二导线结构上设置有多个通孔，所述通孔的形状为平行四边形，所述平行四边形的对角线与所述柔性基板的拉伸方向一致。
可选的，在所述的柔性电子器件中，所述柔性电子器件为柔性平板显示器件，所述柔性平板显示器件具有多个像素单元，所述像素单元的边界线图形为平行四边形，所述平行四边形的对角线与所述柔性基板的拉伸方向一致。
可选的，在所述的柔性电子器件中，所述平行四边形的四条边与其对角线所形成的夹角范围在40°～70°之间。
可选的，在所述的柔性电子器件中，所述柔性电子器件为柔性液晶显示器。
可选的，在所述的柔性电子器件中，所述柔性电子器件为柔性有机发光显示器。
相应的，本发明还提供一种柔性电子器件的制造方法，所述柔性电子器件的制造方法包括：
提供一柔性基板；以及
在所述柔性基板上分别形成半导体结构和导线结构，所述半导体结构的沟道方向与所述导线结构的延伸方向一致，并与所述柔性基板的拉伸方向形成小于90°的夹角。
相应的，本发明还提供一种柔性电子器件的制造方法，所述柔性电子器件的制造方法包括：
提供一柔性基板；以及
在所述柔性基板上分别形成多个像素单元、第一导线结构和第二导线结构；其中，所述像素单元具有半导体结构，所述半导体结构的沟道方向与所述第一导线结构的延伸方向一致，并与所述柔性基板的拉伸方向形成小于90°的夹角；
所述第二导线结构设置于所述柔性基板的边缘，所述第二导线结构的延伸方向与所述柔性基板的边缘线平行，所述第二导线结构上形成有多个通孔，所述通孔的形状为平行四边形，所述平行四边形的对角线与所述柔性基板的拉伸方向一致。
在本发明实施例提供的柔性电子器件及其制造方法中，通过调整半导体结构的沟道方向和第一导线结构的延伸方向，使得所述半导体结构和第一导线结构受应力影响最小，从而保证所述柔性电子器件的电性能以及抗揉性能。
附图说明
图1是现有技术的柔性电子器件的结构示意图；
图2是现有技术的柔性电子器件在受到应力时的结构示意图；
图3是本发明实施例一的柔性电子器件的结构示意图；
图4是本发明实施例的柔性电子器件在受到应力时的结构示意图。
图5是本发明实施例二的柔性电子器件的结构示意图；
图6是本发明实施例二的第二导线结构的结构示意图。
具体实施方式
以下结合附图和具体实施例对本发明提出的柔性电子器件及其制造方法作进一步详细说明。根据下面说明和权利要求书，本发明的优点和特征将更清楚。需说明的是，附图均采用非常简化的形式且均使用非精准的比例，仅用以方便、明晰地辅助说明本发明实施例的目的。
【实施例一】
请参考图3，其为本发明实施例的柔性电子器件的结构示意图。如图3所示，所述柔性电子器件200包括：一柔性基板210以及形成于所述柔性基板210上的器件层；所述器件层包括相互连接的半导体结构220和第一导线结构230，所述第一导线结构230的延伸方向与所述半导体结构220的沟道方向一致；所述第一导线结构230的延伸方向与所述柔性基板210的拉伸方向形成小于90°的夹角。本发明实施例中的半导体结构为薄膜晶体管结构，具体包括栅极、漏极(图中未示出)、沟道。
具体的，在所述柔性电子器件200中，器件层包括相互连接的半导体结构220和第一导线结构230，所述半导体结构220起到开关作用，所述导线结构230与所述半导体结构220配套，用以与其他的器件实现电性连接。如图3所示，所述半导体结构220的沟道方向(虚线双向箭头所示)与所述第一导线结构230的延伸方向相互平行。
同时，所述第一导线结构230的延伸方向与所述柔性基板210的边缘线既不平行也不垂直，即所述第一导线结构210的延伸方向与所述柔性基板210的拉伸方向形成90°以下的夹角。
优选的，所述第一导线结构230的延伸方向与所述柔性基板210的拉伸方向所形成的夹角范围在40°到70°之间，例如，所述第一导线结构230的延伸方向与所述柔性基板210的拉伸方向形成45°夹角、50°夹角、55°夹角、60°夹角或65°夹角。
请参考图4，其为本发明实施例的柔性电子器件在受到应力时的结构示意图。如图4所示，所述柔性电子器件200受力弯曲时，由于所述半导体结构220的沟道方向(虚线双向箭头所示)和第一导线结构230的延伸方向与所述柔性基板210的受力方向(空心箭头所示)不一致，即所述第一导线结构230的延伸方向与所述柔性基板210的存在一夹角θ。因此，在一定角度上所述半导体结构220和第一导线结构230仅发生转动而不发生形变。不发生形变意味着此时所述半导体结构220和第一导线结构230所受的应力最小，所述柔性电子器件200的电性能以及抗揉性能最佳。
现有的柔性电子器件100中，其半导体结构的沟道方向和导线结构的延伸方向均与其柔性基板的受力方向一致(即形成0°夹角)。而本实施例中，所述半导体结构220的沟道方向和第一导线结构230的延伸方向与所述柔性基板210的受力方向不一致，形成一定的夹角。
采用相同的应力对现有的柔性电子器件100和本实施例提供的柔性电子器件200分别进行拉伸实验，实验证明与现有的柔性电子器件100相比，本实施例提供的柔性电子器件200所受的最大应力比较小，而且最大应力的分布区域非常小。
由此可见，本实施例提供的柔性电子器件200中半导体结构220和第一导线结构230所受应力较小，应力作用基本上不会对所述柔性电子器件200的电性能和抗揉性能造成影响。因此，与现有的柔性电子器件100相比，所述柔性电子器件200具有更佳的电性能以及抗揉性能。
相应的，本实施例还提供了一种柔性电子器件的制造方法。请继续参考图3，所述柔性电子器件的制造方法包括：
步骤一：提供一柔性基板210；
步骤二：在所述柔性基板210上分别形成半导体结构220和第一导线结构230，所述半导体结构220的沟道方向与所述第一导线结构230的延伸方向一致，并与所述柔性基板210的拉伸方向形成小于90°的夹角。
具体的，首先，提供一柔性基板210，所述柔性基板210通常为透明塑料基板。
接着，在所述柔性基板210上分别形成半导体结构220和第一导线结构230。所述半导体结构220和第一导线结构230均采用图形化工艺形成，图形化工艺制作的半导体薄膜图形中长边方向(即沟道方向)和导线薄膜图形的延伸方向相互平行，且与所述柔性基板210的拉伸方向(空心箭头所示)形成60°夹角。
至此，形成所述柔性电子器件200，所述柔性电子器件200的器件层包括半导体结构220和第一导线结构230，所述半导体结构220的沟道方向和第一导线结构230的延伸方向一致，且与所述柔性基板210的拉伸方向呈小于90°的夹角。
【实施例二】
请参考图5，其为本发明实施例二的柔性电子器件的结构示意图。如图5所示，所述柔性电子器件300包括：一柔性基板310以及形成于所述柔性基板310上的器件层330；所述器件层330包括相互连接的半导体结构(图中未示出)和第一导线结构(图中未示出)，所述第一导线结构的延伸方向与所述半导体结构的沟道方向一致；所述第一导线结构的延伸方向与所述柔性基板310的拉伸方向形成小于90°的夹角。
具体的，在所述柔性电子器件300中，器件层330包括多个像素单元30和第一导线结构，所述多个像素单元30呈阵列排列，每个像素单元30均具有起到开关作用的半导体结构(图中未示出)，所述第一导线结构与所述半导体结构配套，用以与其他的器件实现电性连接。所述第一导线结构的延伸方向与所述半导体结构的沟道方向一致。
所述第一导线结构的延伸方向与所述柔性基板310的边缘线既不平行也不垂直，即所述第一导线结构的延伸方向与所述柔性基板310的拉伸方向既不垂直也不平行，而是具有小于90°的夹角。由此，在所述柔性基板310被拉伸时，所述第一导线结构和半导体结构受到应力较小，一定角度上所述半导体结构和第一导线结构仅发生转动而不发生形变。
本实施例中，所述像素单元30的边界线图形为平行四边形，所述平行四边形的一条对角线与所述柔性基板310的拉伸方向(虚线双向箭头所示)一致。
优选的，所述平行四边形的四条边与其对角线所形成的夹角范围在40°～70°之间。本实施例中，所述平行四边形的四条边与其对角线所形成的夹角均为60°夹角。
所述器件层330还包括第二导线结构(图中未示出)，所述第二导线结构设置于所述柔性基板310的边缘，且所述第二导线结构的延伸方向与所述柔性基板310的边缘线平行。
请结合参考图5和图6，所述第二导线结构上设置有多个通孔40，所述多个通孔40沿着所述第二导线结构的延伸方向均匀排布，所述通孔40的形状为平行四边形，所述平行四边形的对角线与所述柔性基板310的拉伸方向(虚线双向箭头所示)一致。
由于所述第二导线结构的延伸方向必须与所述柔性基板310的拉伸方向平行或垂直，在所述第二导线结构的延伸方向设置平行四边形通孔，能够有效防止外部施加的应力集中到导线上，提高所述第二导线结构的抗揉性能。
优选的，所述平行四边形的四条边与其对角线所形成的夹角范围在40°～70°之间。本实施例中，所述平行四边形的四条边与其对角线所形成的夹角均为60°夹角。
本实施例中，所述柔性电子器件300为柔性平板显示器件。本领域技术人员应该知道，本发明对于所述柔性平板显示器件的类型没有特别的限制，可以是柔性液晶显示器(LCD)，也可以是柔性有机发光显示器(OLED)或其他类型的柔性平板显示器件。
相应的，本实施例还提供了一种柔性电子器件的制造方法。请继续参考图3，所述柔性电子器件的制造方法包括：
步骤一：提供一柔性基板310；
步骤二：在所述柔性基板310上分别形成多个像素单元30和第一导线结构，所述像素单元30具有半导体结构，所述半导体结构的沟道方向与所述第一导线结构的延伸方向一致，并与所述柔性基板310的拉伸方向形成小于90°的夹角。
具体的，首先，提供一柔性基板310，所述柔性基板310通常为透明塑料基板。
接着，在所述柔性基板310上分别形成多个呈阵列排列的像素单元30和第一导线结构，所述像素单元30具有半导体结构。所述半导体结构和第一导线结构230均采用图形化工艺形成，图形化工艺制作的半导体薄膜图形中长边方向(即沟道方向)和导线薄膜图形的延伸方向相互平行，且与所述柔性基板310的拉伸方向形成60°夹角。
在所述柔性基板310上形成器件层的过程中，还包括采用图形化工艺形成在所述柔性基板310上形成第二导线结构，所述第二导线结构设置于所述柔性基板的边缘，所述第二导线结构的延伸方向与所述柔性基板的边缘线平行，所述第二导线结构上具有多个通孔，所述通孔的形状为平行四边形，所述平行四边形的对角线与所述柔性基板的拉伸方向一致。
至此，形成所述柔性电子器件300，所述柔性电子器件300的器件层包括半导体结构、第一导线结构和第二导线结构，所述半导体结构的沟道方向和第一导线结构的延伸方向一致，且与所述柔性基板310的拉伸方向呈小于90°的夹角，所述第二导线结构的延伸方向与所述柔性基板310的拉伸方向平行或垂直，所述第二导线结构上设置有降低应力影响的平行四边形通孔。
综上，在本发明实施例提供的柔性电子器件及其制造方法中，通过调整半导体结构的沟道方向和第一导线结构的延伸方向，使得所述半导体结构和第一导线结构受应力影响最小，从而保证所述柔性电子器件的电性能以及抗揉性能。
上述描述仅是对本发明较佳实施例的描述，并非对本发明范围的任何限定，本发明领域的普通技术人员根据上述揭示内容做的任何变更、修饰，均属于权利要求书的保护范围。

Claims (10)

1.一种柔性电子器件，其特征在于，包括：一柔性基板以及形成于所述柔性基板上的器件层；
所述器件层包括相互连接的半导体结构和第一导线结构，所述第一导线结构的延伸方向与所述半导体结构的沟道方向一致；
所述第一导线结构的延伸方向与所述柔性基板的拉伸方向形成小于90°的夹角。
2.如权利要求1所述的柔性电子器件，其特征在于，所述第一导线结构的延伸方向与所述柔性基板的拉伸方向所形成的夹角范围在40°～70°之间。
3.如权利要求1所述的柔性电子器件，其特征在于，所述器件层还包括第二导线结构，所述第二导线结构设置于所述柔性基板的边缘，且所述第二导线结构的延伸方向与所述柔性基板的边缘线平行。
4.如权利要求3所述的柔性电子器件，其特征在于，所述第二导线结构上设置有多个通孔，所述通孔的形状为平行四边形，所述平行四边形的对角线与所述柔性基板的拉伸方向一致。
5.如权利要求1所述的柔性电子器件，其特征在于，所述柔性电子器件为柔性平板显示器件，所述柔性平板显示器件具有多个像素单元，所述像素单元的边界线图形为平行四边形，所述平行四边形的对角线与所述柔性基板的拉伸方向一致。
6.如权利要求4或5所述的柔性电子器件，其特征在于，所述平行四边形的四条边与其对角线所形成的夹角范围在40°～70°之间。
7.如权利要求5所述的柔性电子器件，其特征在于，所述柔性电子器件为柔性液晶显示器。
8.如权利要求5所述的柔性电子器件，其特征在于，所述柔性电子器件为柔性有机发光显示器。
9.一种柔性电子器件的制造方法，其特征在于，包括：
提供一柔性基板；以及
在所述柔性基板上分别形成半导体结构和第一导线结构，所述半导体结构的沟道方向与所述第一导线结构的延伸方向一致，并与所述柔性基板的拉伸方向形成小于90°的夹角。
10.一种柔性电子器件的制造方法，其特征在于，包括：
提供一柔性基板；以及
在所述柔性基板上分别形成多个像素单元、第一导线结构和第二导线结构；其中，所述像素单元具有半导体结构，所述半导体结构的沟道方向与所述第一导线结构的延伸方向一致，并与所述柔性基板的拉伸方向形成小于90°的夹角；
所述第二导线结构设置于所述柔性基板的边缘，所述第二导线结构的延伸方向与所述柔性基板的边缘线平行，所述第二导线结构上形成有多个通孔，所述通孔的形状为平行四边形，所述平行四边形的对角线与所述柔性基板的拉伸方向一致。
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