WO2015007054A1 - 柔性显示器件的制备方法及装置 - Google Patents

柔性显示器件的制备方法及装置 Download PDF

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Publication number
WO2015007054A1
WO2015007054A1 PCT/CN2013/089610 CN2013089610W WO2015007054A1 WO 2015007054 A1 WO2015007054 A1 WO 2015007054A1 CN 2013089610 W CN2013089610 W CN 2013089610W WO 2015007054 A1 WO2015007054 A1 WO 2015007054A1
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WO
WIPO (PCT)
Prior art keywords
conductive
substrate
hard substrate
flexible display
layer
Prior art date
Application number
PCT/CN2013/089610
Other languages
English (en)
French (fr)
Inventor
程鸿飞
张玉欣
Original Assignee
京东方科技集团股份有限公司
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Filing date
Publication date
Application filed by 京东方科技集团股份有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US14/353,722 priority Critical patent/US9873241B2/en
Publication of WO2015007054A1 publication Critical patent/WO2015007054A1/zh

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133305—Flexible substrates, e.g. plastics, organic film
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    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
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    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
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    • B32B43/006—Delaminating
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C—CHEMISTRY; METALLURGY
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    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
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    • C—CHEMISTRY; METALLURGY
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Definitions

  • Embodiments of the present invention relate to a method and apparatus for fabricating a flexible display device. Background technique
  • Flexible displays have many advantages, such as impact resistance, strong shock resistance, light weight, small size, and more convenient carrying.
  • the main flexible display materials can be roughly classified into three types: electronic paper (or flexible electrophoretic display), flexible organic light emitting diode (OLED), and flexible liquid crystal.
  • the application method is more than the attaching and removing method, and the flexible substrate is pasted on the conductive hard substrate through the adhesive layer, and the flexible substrate is prepared from the conductive hard substrate after the flexible display is prepared. Stripped off to get a flexible display.
  • this stripping method often generates static electricity during operation and cannot be guided away through the conductive hard substrate in time. Static electricity may cause damage to the flexible display, resulting in a decrease in yield.
  • An embodiment of the present invention provides a method for fabricating a flexible display device, comprising: a first flexible substrate on which a flexible display device is attached on a conductive adhesive layer, wherein the conductive adhesive layer is disposed on a conductive hard substrate Preparing other portions of the flexible display device on the first flexible substrate; aging the conductive bonding layer; and peeling off the conductive hard substrate and the flexible substrate to obtain a flexible display device.
  • the conductive bonding layer is a binder that is doped with conductive particles or a conductive polymer.
  • the conductive bonding layer further includes a silane binder, a polyimide binder or an acrylate binder, and conductive particles or a conductive polymer.
  • the conductive particles include gold, silver, copper, aluminum, iron, iron, nickel conductive particles;
  • the conductive polymer includes polyacetylene, polythiophene, polypyrrole, polyaniline, polyphenylene, polyphenylene Ethylene or polydiacetylene.
  • the conductive hard substrate is a metal substrate, or the conductive hard substrate A conductive layer and a rigid substrate having no conductive properties are included.
  • the conductive layer is an indium tin oxide ITO layer
  • the hard substrate having no conductivity is a glass substrate.
  • the step of aging the adhesive layer comprises: aging the back side of the conductive hard substrate with a laser beam or aging the adhesive layer by heating.
  • Another embodiment of the present invention provides a preparation apparatus of a flexible display device, comprising: a conductive bonding layer for attaching a flexible substrate of a flexible display device; and a conductive hard substrate supporting the conductive bonding layer.
  • the conductive bonding layer is a binder that is doped with conductive particles or a conductive polymer.
  • the conductive bonding layer comprises a silane binder, a polyimide binder or an acrylate binder, and conductive particles or a conductive polymer.
  • the conductive particles include gold, silver, copper, aluminum, iron, iron, nickel conductive particles;
  • the conductive polymer includes polyacetylene, polythiophene, polypyrrole, polyaniline, polyphenylene, polyphenylene Ethylene or polydiacetylene.
  • the conductive hard substrate is a metal substrate, or the conductive hard substrate includes a conductive layer and a rigid substrate having no conductive properties.
  • the conductive layer is an indium tin oxide ITO layer
  • the hard substrate having no conductivity is a glass substrate.
  • FIG. 1 is a schematic structural view of a device for preparing a flexible display according to an embodiment of the present invention
  • FIG. 2 is a schematic structural view of another portion of a flexible display device prepared on a first flexible substrate
  • FIG. 3 is a schematic diagram of a flexible display provided by an embodiment of the present invention
  • FIG. 4 is a schematic structural diagram of a device for preparing a flexible display according to an embodiment of the present invention
  • FIG. 5 is a schematic structural diagram of a device for preparing a flexible display according to an embodiment of the present invention.
  • the embodiment of the invention provides a method and a device for preparing a flexible display device, which are used for guiding the static electricity generated in the preparation process of the flexible display device through the conductive hard substrate in time, preventing the static electricity from damaging the flexible display, and preparing the flexible display device.
  • the yield is increasing.
  • the embodiment of the invention provides a method for preparing a flexible display device, and the method for preparing the flexible display device comprises:
  • the step S3 includes: scanning the back surface of the conductive hard substrate with a laser beam or aging the conductive bonding layer by heating.
  • the conductive bonding layer comprises a binder and conductive particles or a conductive polymer incorporated in the binder.
  • the binder may include a silane binder, a polyimide binder or an acrylate binder, and the conductive particles may be gold, silver, copper, aluminum, rhodium, iron, nickel conductive particles, the conductive polymerization
  • the materials include polyacetylene, polythiophene, polypyrrole, polyaniline, polyphenylene, polyphenylene vinyl or polydiacetylene.
  • the conductive hard substrate is, for example, a metal substrate, or the conductive hard substrate includes, for example, a conductive layer and a hard substrate having no conductive property, wherein the conductive layer is an indium tin oxide ITO layer, and the The hard substrate having the conductive property is a glass substrate, so that the static electricity generated in the process of peeling off the flexible substrate and the conductive adhesive layer can be guided away from the conductive hard substrate in time by using the conductive adhesive layer, thereby making the flexible display The yield of device preparation is increased.
  • the other portions of the flexible display device fabricated on the flexible substrate described in step S2 include:
  • the thin film transistor TFT may be a top gate structure, and the thin film transistor TFT is sequentially prepared from bottom to top: an active layer, a gate insulating layer, a gate electrode, an interlayer insulating layer, a drain and a source; and the thin film;
  • the transistor TFT may also be a bottom gate structure, and the thin film transistor TFT is sequentially prepared from bottom to top: a gate, a gate insulating layer, an active layer, a drain and a source;
  • the second flexible substrate is a flexible substrate attached to the conductive adhesive layer in the embodiment of the invention.
  • the conductive hard substrate is a metal substrate, or the conductive hard substrate comprises a conductive layer and a hard substrate having no conductive property, wherein the conductive layer comprises indium tin oxide ITO, and the conductive property is not
  • the hard substrate includes a glass substrate on which a conductive bonding layer for connecting the flexible substrate and the conductive hard substrate is coated, and a laser beam is applied to the back surface of the conductive hard substrate.
  • the conductive bonding layer is aged by scanning or heating, so that the flexible substrate can be peeled off from the conductive hard substrate to obtain a flexible display device.
  • the embodiment of the present invention further provides a flexible display device manufacturing apparatus.
  • the flexible display device manufacturing apparatus includes: a conductive bonding layer 32 for attaching the flexible substrate 31 of the flexible display device, and , a conductive hard substrate 33 disposed under the conductive bonding layer.
  • the plate 33 is peeled off to obtain a flexible display device, and is also used to prepare other portions of the flexible display device on the flexible substrate 31.
  • FIG. 2 it can be seen that other portions of the flexible display device are on the first flexible substrate.
  • the 31 includes, in order, a thin film transistor TFT 103, a first passivation layer 105, an anode 106, a pixel defining layer 107, an RGB organic light emitting layer (EL) 108, a cathode 109, an adhesive 110, and a second flexible substrate 111.
  • the thin film transistor TFT 103 includes, in order from bottom to top, an active layer 112, a gate insulating layer 102, a gate electrode 114, an interlayer insulating layer 104, a drain electrode 113 and a source electrode 115.
  • the conductive bonding layer 32 is used for connecting the flexible substrate 31 and the conductive hard substrate 33, and guiding the static electricity generated by the flexible substrate 31 and the conductive rigid substrate 33 during the stripping process to the conductive hard.
  • the substrate 33 is further guided away by the conductive hard substrate 33 to increase the yield of the flexible display device.
  • the conductive bonding layer 32 includes, for example, a silane binder, a polyimide paste.
  • the binder of the binder or the acrylate binder is based on the conductive particles 34 or the conductive polymer 35 dispersed in the binder.
  • conductive particles 34 which may be gold, silver, copper, aluminum, iron, nickel, nickel conductive particles, and thus, for connecting the flexible substrate 31 and the conductive hard substrate 33.
  • the adhesive layer has electrical conductivity, and the conductive adhesive layer can guide the static electricity generated during the peeling process of the flexible substrate 31 and the conductive hard substrate 33 through the conductive hard substrate in time, thereby increasing the yield of the flexible display device.
  • a conductive polymer 35 which comprises polyacetylene, polythiophene, polypyrrole, polyaniline, polyphenylene, polyphenylene vinyl or polydiacetylene, such that
  • the adhesive layer for connecting the flexible substrate 31 and the conductive hard substrate 33 has electrical conductivity, and the conductive adhesive layer 32 can pass the static electricity generated during the peeling process of the flexible substrate 31 and the conductive hard substrate 33 through the conductive hard.
  • the substrate is guided away to make the uniformity of the peeling better, and the yield of the flexible display device is increased.
  • the conductive hard substrate 33 is used to coat the conductive bonding layer 32 for connecting the flexible substrate 31 and the conductive hard substrate 33 thereon, and at the same time, the back surface of the conductive hard substrate 33 is scanned by a laser beam or
  • the conductive adhesive layer 32 is aged by heating, so that the flexible substrate 31 is peeled off from the conductive hard substrate 33 to obtain a flexible display device; the conductive hard substrate 33 is a metal substrate, or see FIG.
  • the conductive hard substrate 33 includes a conductive layer 36 and a hard substrate 37 having no conductive property, wherein the conductive layer 36 is an ITO layer, and the hard substrate 37 having no conductive property is a glass substrate.
  • the ITO is electrically conductive.
  • the embodiments of the present invention provide a method and a device for preparing a flexible display device, which are used to directly guide static electricity generated during the preparation process of the flexible display device through the conductive bonding layer and the conductive hard substrate. Preventing static electricity from affecting the peeling effect increases the yield of the flexible display device.

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Abstract

一种柔性显示器件的制备方法。该方法包括：在导电粘结层（32）上贴附柔性显示器件的第一柔性基板（31），其中，导电粘结层（32）设置在导电硬质基板（33）上；在第一柔性基板（31）上制备柔性显示器件的其他部分；将导电粘结层（32）老化；以及将导电硬质基板（33）和第一柔性基板（31）剥离，得到柔性显示器件。

Description

性显示器件的制备方法及装置 技术领域
本发明的实施例涉及柔性显示器件的制备方法及装置。 背景技术
柔性显示器具有诸多优点， 例如耐沖击， 抗震能力强， 重量轻、体积小， 携带更加方便等特点。
目前主要的柔性显示材料大致可分为三种： 电子纸（或柔性电泳显示）、 柔性有机发光二极管 （ Organic Light Emitting Diode, OLED )和柔性液晶等。
现有技术中在制备柔性显示器时应用比较多的是贴覆取下法， 将柔性基 板通过粘结层贴覆在导电硬质基板上， 制备完柔性显示器之后再使柔性基板 从导电硬质基板上剥离下来， 得到柔性显示器。 但是， 这种剥离方法在操作 过程中常常会产生静电无法及时通过导电硬质基板导走， 静电会对柔性显示 器造成破坏， 导致良率下降。 发明内容
本发明的一实施例提供一种柔性显示器件制备方法， 包括： 在导电粘结 层上贴附柔性显示器件的第一柔性基板， 其中， 所述的导电粘结层设置在导 电硬质基板上； 在第一柔性基板上制备柔性显示器件的其他部分； 将导电粘 结层老化； 以及将导电硬质基板和柔性基板剥离， 得到柔性显示器件。
在一个示例中 , 所述的导电粘结层为掺有导电粒子或导电聚合物的粘结 胶。
在一个示例中， 所述的导电粘结层还包括硅烷粘结剂、 聚酰亚胺粘结剂 或丙烯酸酯粘结剂， 以及导电粒子或导电聚合物。
在一个示例中， 所述导电粒子包括金、 银、 铜、 铝、 辞、 铁、 镍导电粒 子； 所述导电聚合物包括聚乙炔、 聚噻吩、 聚吡咯、 聚苯胺、 聚苯撑、 聚苯 撑乙烯或聚双炔。
在一个示例中， 所述导电硬质基板为金属基板， 或者所述导电硬质基板 包括导电层和不具有导电性质的硬质基板。
在一个示例中， 所述的导电层为氧化铟锡 ITO层， 所述的不具有导电性 质的硬质基板为玻璃基板。
在一个示例中， 将粘性层老化的步骤包括： 采用激光束对导电硬质基板 的背面进行扫描或者采用加热的方式， 将粘性层老化。
本发明的另一实施例提供一种柔性显示器件的制备装置， 包括： 用于贴 附柔性显示器件的柔性基板的导电粘结层； 以及， 支撑所述导电粘结层的导 电硬质基板。
在一个示例中， 所述的导电粘结层为掺有导电粒子或导电聚合物的粘结 胶。
在一个示例中， 所述的导电粘结层包括硅烷粘结剂、 聚酰亚胺粘结剂或 丙烯酸酯粘结剂， 以及导电粒子或导电聚合物。
在一个示例中， 所述导电粒子包括金、 银、 铜、 铝、 辞、 铁、 镍导电粒 子； 所述导电聚合物包括聚乙炔、 聚噻吩、 聚吡咯、 聚苯胺、 聚苯撑、 聚苯 撑乙烯或聚双炔。
在一个示例中， 所述导电硬质基板为金属基板， 或者所述导电硬质基板 包括导电层和不具有导电性质的硬质基板。
在一个示例中， 所述的导电层为氧化铟锡 ITO层， 所述的不具有导电性 质的硬质基板为玻璃基板。 附图说明
为了更清楚地说明本发明实施例的技术方案， 下面将对实施例的附图作 筒单地介绍，显而易见地，下面描述中的附图仅仅涉及本发明的一些实施例， 而非对本发明的限制。
图 1为本发明实施例提供的柔性显示器的制备装置的结构示意图； 图 2为在第一柔性基板上制备的柔性显示器件的其他部分结构示意图； 图 3为本发明实施例提供的柔性显示器的制备装置的结构示意图； 图 4为本发明实施例提供的柔性显示器的制备装置的结构示意图； 图 5为本发明实施例提供的柔性显示器的制备装置的结构示意图。 具体实施方式
本发明实施例提供了一种柔性显示器件的制备方法及装置， 用以实现将 柔性显示器件制备过程中产生的静电及时通过导电硬质基板导走， 防止静电 破坏柔性显示器， 使柔性显示器件制备的良率增加。
为使本发明实施例的目的、 技术方案和优点更加清楚， 下面将结合本发 明实施例中的附图， 对本发明实施例中的技术方案进行清楚、 完整地描述， 显然， 所描述的实施例仅仅是本发明一部分实施例， 而不是全部的实施例。 基于本发明中的实施例， 本领域普通技术人员在没有做出创造性劳动前提下 所获得的所有其他实施例， 都属于本发明保护的范围。
本发明实施例提供了一种柔性显示器件制备方法， 所述柔性显示器件的 制备方法包括：
51、 在导电粘结层上贴附柔性显示器件的第一柔性基板， 其中， 所述的 导电粘结层设置在导电硬质基板上；
52、 在第一柔性基板上制备柔性显示器件的其他部分；
S3、 将粘性层老化；
S4、 将导电硬质基板和第一柔性基板剥离， 得到柔性显示器件。
其中， 步骤 S3 包括： 采用激光束对导电硬质基板的背面进行扫描或者 采用加热的方式， 将导电粘结层老化。
上述制备方法中 , 所述的导电粘结层包括粘结剂和参在粘结胶中的导电 粒子或导电聚合物。 粘结剂可包括硅烷粘结剂、 聚酰亚胺粘结剂或丙烯酸酯 粘结剂， 所述导电粒子可以是金、 银、 铜、 铝、 辞、 铁、 镍导电粒子， 所述 导电聚合物包括聚乙炔、 聚噻吩、 聚吡咯、 聚苯胺、 聚苯撑、 聚苯撑乙烯或 聚双炔。 所述导电硬质基板例如为金属基板， 或者所述导电硬质基板例如包 括导电层和不具有导电性质的硬质基板，其中，所述的导电层为氧化铟锡 ITO 层， 所述的不具有导电性质的硬质基板为玻璃基板， 这样， 通过使用所述的 导电粘结层可以及时地将柔性基板与导电粘结层剥离过程中产生的静电通过 导电硬质基板导走， 使柔性显示器件制备的良率增加。
在一个示例中， 步骤 S2所述的在柔性基板上制备柔性显示器件的其他 部分， 包括：
Sll、 在第一柔性基板上从下至上分别制备薄膜晶体管 TFT, 第一钝化 层； 其中， 所述薄膜晶体管 TFT可以是顶栅结构， 薄膜晶体管 TFT从下至 上依次制备： 有源层， 栅极绝缘层， 栅极， 层间绝缘层， 漏极和源极;所述薄 膜晶体管 TFT也可以是底栅结构， 薄膜晶体管 TFT从下至上依次制备： 栅 极， 栅极绝缘层， 有源层， 漏极和源极；
S12、 通过在第一钝化层之上开设过孔， 制备阳极；
513、 在第一钝化层之上分别制备阳极， 像素界定层、 RGB有机发光层 ( EL )和阴极；
514、 贴附第二柔性基板。
上述制备方法中， 所述的第二柔性基板即为本发明实施例中贴附在导电 粘结层上的柔性基板。
上述方法仅是举例说明， 针对不同结构的柔性显示器件， 可以有不同的 制备方法。
所述导电硬质基板为金属基板， 或者所述导电硬质基板包括导电层和不 具有导电性质的硬质基板， 其中， 所述的导电层包括氧化铟锡 ITO, 所述的 不具有导电性质的硬质基板包括玻璃基板， 所述导电硬质基板用于在其之上 涂覆用于连接柔性基板与导电硬质基板的导电粘结层， 同时， 对导电硬质基 板的背面采用激光束进行扫描或者采用加热的方式， 将导电粘结层老化， 这 样便可使柔性基板从导电硬质基板上剥离下来， 得到柔性显示器件。
本发明实施例还提供了一种柔性显示器件制备装置， 参见图 1 , 可以看 出所述柔性显示器件制备装置包括： 用于贴附柔性显示器件的柔性基板 31 的导电粘结层 32, 以及， 设置在导电粘结层下的导电硬质基板 33。 板 33上剥离下来， 得到柔性显示器件， 还用于在所述的柔性基板 31上制备 柔性显示器件的其他部分， 参见图 2, 可以看出所述柔性显示器件的其他部 分在第一柔性基板 31上依次包括： 薄膜晶体管 TFT 103, 第一钝化层 105, 阳极 106,像素界定层 107, RGB有机发光层 (EL) 108, 阴极 109,粘结胶 110 和第二柔性基板 111。 其中， 薄膜晶体管 TFT 103从下至上依次包括： 有源 层 112, 栅极绝缘层 102, 栅极 114, 层间绝缘层 104, 漏极 113和源极 115。
所述的导电粘结层 32用于连接柔性基板 31与导电硬质基板 33,并将柔 性基板 31与导电硬质基板 33在剥离过程中产生的静电及时地引导至导电硬 质基板 33进而通过导电硬质基板 33导走,使柔性显示器件制备的良率增加， 参见图 3和图 4, 所述的导电粘结层 32包括诸如硅烷粘结剂、 聚酰亚胺粘结 剂或丙烯酸酯粘结剂的粘接剂基于散布于所述粘接剂中的导电粒子 34或导 电聚合物 35。 图 3中导电粘结层掺有导电粒子 34, 所述导电粒子可以是金、 银、 铜、 铝、 辞、 铁、 镍导电粒子， 这样， 用于连接柔性基板 31与导电硬质 基板 33的粘结层具有导电性， 所述的导电粘结层可将在柔性基板 31和导电 硬质基板 33剥离过程中产生的静电及时通过导电硬质基板导走,使柔性显示 器件制备的良率增加， 图 4中导电粘结层 32掺有导电聚合物 35, 所述导电 聚合物 35包括聚乙炔、 聚噻吩、 聚吡咯、 聚苯胺、 聚苯撑、 聚苯撑乙烯或聚 双炔，这样，用于连接柔性基板 31与导电硬质基板 33的粘结层具有导电性， 所述的导电粘结层 32可将在柔性基板 31和导电硬质基板 33剥离过程中产生 的静电及时通过导电硬质基板导走， 使剥离的均一性更好， 并且使柔性显示 器件制备的良率增加。
所述导电硬质基板 33用于在其之上涂覆用于连接柔性基板 31与导电硬 质基板 33的导电粘结层 32, 同时， 对导电硬质基板 33的背面采用激光束进 行扫描或者采用加热的方式， 将导电粘性层 32 老化， 这样便可使柔性基板 31从导电硬质基板 33上剥离下来， 得到柔性显示器件； 所述导电硬质基板 33为金属基板， 或者参见图 5, 所述导电硬质基 33包括导电层 36和不具有 导电性质的硬质基板 37, 其中， 所述的导电层 36为 ITO层， 所述的不具有 导电性质的硬质基板 37为玻璃基板， 所述的 ITO具有导电性。
综上所述， 本发明实施例提供了一种柔性显示器件的制备方法及制备装 置， 用以实现将柔性显示器件制备过程中产生的静电通过导电粘结层和导电 硬质基板直接导走， 防止静电影响剥离效果， 使柔性显示器件制备的良率增 加。
虽然上文中已经用一般性说明及具体实施方式， 对本发明作了详尽的描 述， 但在本发明基础上， 可以对之作一些修改或改进， 这对本领域技术人员 而言是显而易见的。 因此， 在不偏离本发明精神的基础上所做的这些修改或 改进， 均属于本发明要求保护的范围。

Claims

权利要求书
1、 一种柔性显示器件制备方法， 包括：
在导电粘结层上贴附柔性显示器件的第一柔性基板， 其中， 所述的导电 粘结层设置在导电硬质基板上；
在第一柔性基板上制备柔性显示器件的其他部分；
将导电粘结层老化；
将导电硬质基板和柔性基板剥离， 得到柔性显示器件。
2、如权利要求 1所述的方法， 其中， 所述的导电粘结层为掺有导电粒子 或导电聚合物的粘结胶。
3、如权利要求 1或 2所述的方法， 其中， 所述的导电粘结层还包括硅烷 粘结剂、 聚酰亚胺粘结剂或丙烯酸酯粘结剂， 以及导电粒子或导电聚合物。
4、如权利要求 2或 3所述的方法，其中，所述导电粒子包括金、银、铜、 铝、 辞、 铁、 镍导电粒子； 所述导电聚合物包括聚乙炔、 聚噻吩、 聚吡咯、 聚苯胺、 聚苯撑、 聚苯撑乙烯或聚双炔。
5、如权利要求 1至 4中任一项所述的方法， 其中， 所述导电硬质基板为 金属基板,或者所述导电硬质基板包括导电层和不具有导电性质的硬质基板。
6、 如权利要求 5所述的方法， 其中， 所述的导电层为氧化铟锡 ITO层， 所述的不具有导电性质的硬质基板为玻璃基板。
7、如权利要求 1至 6中任一项所述的方法， 其中， 将粘性层老化的步骤 包括： 采用激光束对导电硬质基板的背面进行扫描或者采用加热的方式， 将 粘性层老化。
8、 一种柔性显示器件的制备装置， 包括：
用于贴附柔性显示器件的柔性基板的导电粘结层；
以及， 支撑所述导电粘结层的导电硬质基板。
9、如权利要求 8所述的装置， 其中， 所述的导电粘结层为掺有导电粒子 或导电聚合物的粘结胶。
10、 如权利要求 8或 9所述的装置， 其中， 所述的导电粘结层包括硅烷 粘结剂、 聚酰亚胺粘结剂或丙烯酸酯粘结剂， 以及导电粒子或导电聚合物。
11、 如权利要求 9或 10所述的装置， 其中， 所述导电粒子包括金、 银、 铜、 铝、 辞、 铁、 镍导电粒子； 所述导电聚合物包括聚乙炔、 聚噻吩、 聚吡 咯、 聚苯胺、 聚苯撑、 聚苯撑乙烯或聚双炔。
12、如权利要求 8至 11中任一项所述的装置， 其中， 所述导电硬质基板 为金属基板， 或者所述导电硬质基板包括导电层和不具有导电性质的硬质基 板。
13、 如权利要求 12所述的装置， 其中， 所述的导电层为氧化铟锡 ITO 层， 所述的不具有导电性质的硬质基板为玻璃基板。
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
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TWI821811B (zh) * 2020-12-30 2023-11-11 南韓商樂金顯示科技股份有限公司 柔性顯示裝置

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103413775B (zh) * 2013-07-19 2016-04-06 京东方科技集团股份有限公司 一种柔性显示器件的制备方法及装置
CN103681486B (zh) * 2013-12-06 2018-07-17 京东方科技集团股份有限公司 一种柔性显示基板的制造方法
US9977262B2 (en) * 2014-03-12 2018-05-22 Honeywell International, Inc. Electrochromic lenses and methods of fabricating the same
CN104022062B (zh) * 2014-06-12 2016-08-17 京东方科技集团股份有限公司 一种柔性显示面板的制备方法
CN104716081B (zh) 2015-03-26 2017-09-15 京东方科技集团股份有限公司 柔性装置及其制作方法
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CN105552225B (zh) * 2016-01-20 2020-04-17 京东方科技集团股份有限公司 用于制造柔性基板的方法、柔性基板和显示装置
CN105527740B (zh) * 2016-01-28 2018-09-28 武汉华星光电技术有限公司 玻璃基板及其制造方法和液晶面板
KR20180018972A (ko) * 2016-08-12 2018-02-22 삼성디스플레이 주식회사 유기 발광 표시 장치
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KR102323245B1 (ko) * 2017-03-15 2021-11-08 삼성디스플레이 주식회사 표시 장치의 제조 방법 및 이를 이용하는 박막 증착 장치
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CN110093141A (zh) * 2019-05-06 2019-08-06 深圳市华星光电技术有限公司 用于柔性基板剥离的组合材料及其制备方法、柔性面板的制作方法
CN110828513B (zh) * 2019-10-23 2022-05-27 武汉华星光电半导体显示技术有限公司 Oled显示面板及其制造方法以及oled显示装置
CN110910763B (zh) * 2019-11-07 2022-01-04 深圳市华星光电半导体显示技术有限公司 一种柔性显示器件的制备方法
CN113224238B (zh) * 2021-04-30 2022-05-27 武汉华星光电半导体显示技术有限公司 柔性显示面板及其制备方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001146578A (ja) * 1999-11-22 2001-05-29 Dainippon Ink & Chem Inc 導電性シリコーン系粘着剤組成物及び導電性粘着テープ
CN101443429A (zh) * 2006-03-23 2009-05-27 Lg化学株式会社 用于传送柔性基板的压敏粘合剂组合物
CN101901814A (zh) * 2009-05-26 2010-12-01 精工爱普生株式会社 薄膜装置、具备薄膜装置的挠性电路基板、及薄膜装置的制造方法
CN103413775A (zh) * 2013-07-19 2013-11-27 京东方科技集团股份有限公司 一种柔性显示器件的制备方法及装置
CN203377205U (zh) * 2013-07-19 2014-01-01 京东方科技集团股份有限公司 一种柔性显示器件的制备装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100428010C (zh) * 2005-05-13 2008-10-22 乐金显示有限公司 柔性显示器的制造方法
US7349147B2 (en) * 2006-06-23 2008-03-25 Xerox Corporation Electrophoretic display medium containing solvent resistant emulsion aggregation particles
KR101279257B1 (ko) * 2006-06-29 2013-06-26 엘지디스플레이 주식회사 가요성 표시장치용 기판

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001146578A (ja) * 1999-11-22 2001-05-29 Dainippon Ink & Chem Inc 導電性シリコーン系粘着剤組成物及び導電性粘着テープ
CN101443429A (zh) * 2006-03-23 2009-05-27 Lg化学株式会社 用于传送柔性基板的压敏粘合剂组合物
CN101901814A (zh) * 2009-05-26 2010-12-01 精工爱普生株式会社 薄膜装置、具备薄膜装置的挠性电路基板、及薄膜装置的制造方法
CN103413775A (zh) * 2013-07-19 2013-11-27 京东方科技集团股份有限公司 一种柔性显示器件的制备方法及装置
CN203377205U (zh) * 2013-07-19 2014-01-01 京东方科技集团股份有限公司 一种柔性显示器件的制备装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106505152A (zh) * 2016-10-31 2017-03-15 武汉华星光电技术有限公司 柔性oled面板制作方法及柔性oled面板
TWI821811B (zh) * 2020-12-30 2023-11-11 南韓商樂金顯示科技股份有限公司 柔性顯示裝置
US11839102B2 (en) 2020-12-30 2023-12-05 Lg Display Co., Ltd. Flexible display device

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