CN103413775B - 一种柔性显示器件的制备方法及装置 - Google Patents

一种柔性显示器件的制备方法及装置 Download PDF

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Publication number
CN103413775B
CN103413775B CN201310306194.3A CN201310306194A CN103413775B CN 103413775 B CN103413775 B CN 103413775B CN 201310306194 A CN201310306194 A CN 201310306194A CN 103413775 B CN103413775 B CN 103413775B
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hard substrate
display device
flexible display
conduction
adhesion layer
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Expired - Fee Related
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CN201310306194.3A
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CN103413775A (zh
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程鸿飞
张玉欣
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BOE Technology Group Co Ltd
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BOE Technology Group Co Ltd
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Priority to CN201310306194.3A priority Critical patent/CN103413775B/zh
Publication of CN103413775A publication Critical patent/CN103413775A/zh
Priority to PCT/CN2013/089610 priority patent/WO2015007054A1/zh
Priority to US14/353,722 priority patent/US9873241B2/en
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    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
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Abstract

本发明实施例提供了一种柔性显示器件的制备方法及装置,用以实现将柔性显示器件制备过程中产生的静电及时通过导电硬质基板导走,防止静电破坏柔性显示器,使柔性显示器件制备的良率增加。本发明提供的一种柔性显示器件制备方法包括:在导电粘结层上贴附柔性显示器件的柔性基板,其中,所述的导电粘结层设置在导电硬质基板上,然后在柔性基板上制备柔性显示器件的其他部分,将粘性层老化,最后将硬质基板和柔性基板剥离,得到柔性显示器件。

Description

一种柔性显示器件的制备方法及装置
技术领域
本发明涉及显示器技术领域,尤其涉及一种柔性显示器件的制备方法及装置。
背景技术
柔性显示器具有诸多优点,例如耐冲击,抗震能力强,重量轻、体积小,携带更加方便等特点。
目前主要的柔性显示材料大致可分为三种:电子纸(或柔性电泳显示)、柔性有机发光二极管(OrganicLightEmittingDiode,OLED)和柔性液晶等。
现有技术中在制备柔性显示器时应用比较多的是贴覆取下法,将柔性基板通过粘结层贴覆在导电硬质基板上,制备完柔性显示器之后再使柔性基板从导电硬质基板上剥离下来,得到柔性显示器。但是,这种剥离方法在操作过程中常常会产生静电无法及时通过导电硬质基板导走,静电会对柔性显示器造成破坏,导致良率下降。
发明内容
本发明实施例提供了一种柔性显示器件的制备方法及装置,用以实现将柔性显示器件制备过程中产生的静电及时通过导电硬质基板导走,防止静电破坏柔性显示器,使柔性显示器件制备的良率增加。
本发明实施例提供了一种柔性显示器件制备方法,该方法包括:
在导电粘结层上贴附柔性显示器件的柔性基板,其中,所述的导电粘结层设置在导电硬质基板上;
在柔性基板上制备柔性显示器件的其他部分;
将粘性层老化;
将导电硬质基板和柔性基板剥离,得到柔性显示器件。
从上述制备方法可以看出,导电粘结层用于连接柔性基板与导电硬质基板,通过使用导电粘结层将柔性基板与导电粘结层剥离过程中产生的静电通过导电硬质基板及时地导走,使柔性显示器件制备的良率增加。
较佳地,所述的导电粘结层为掺有导电粒子或导电聚合物的粘结胶,这样,用于连接柔性基板与导电硬质基板的粘结层具有导电性,所述的导电粘结层可将在柔性基板与导电粘结层剥离过程中产生的静电及时通过导电硬质基板导走,使柔性显示器件制备的良率增加。
较佳地,所述的导电粘结层还包括硅烷粘结剂、聚酰亚胺粘结剂或丙烯酸酯粘结剂,以及导电粒子或导电聚合物,这样,用于连接柔性基板与导电硬质基板的粘结层具有导电性,所述的导电粘结层可将在柔性基板与导电粘结层剥离过程中产生的静电及时通过导电硬质基板导走,使柔性显示器件制备的良率增加。
较佳地,所述导电粒子包括金、银、铜、铝、锌、铁、镍导电粒子,所述导电聚合物包括聚乙炔、聚噻吩、聚吡咯、聚苯胺、聚苯撑、聚苯撑乙烯或聚双炔,这样,用于连接柔性基板与导电硬质基板的粘结层具有导电性,所述的导电粘结层可将在柔性基板与导电粘结层剥离过程中产生的静电及时通过导电硬质基板导走,使柔性显示器件制备的良率增加。
较佳地,所述导电硬质基板为金属基板,或者所述导电硬质基板包括导电层和不具有导电性质的硬质基板,这样便可以在导电硬质基板之上涂覆用于连接柔性基板与导电硬质基板的导电粘结层,同时,对导电硬质基板的背面采用激光束扫描或者采用加热的方式,将导电粘结层老化,这样便可使柔性基板从导电硬质基板上剥离下来,得到柔性显示器件。
较佳地,所述的导电层为氧化铟锡ITO层,所述的不具有导电性质的硬质基板为玻璃基板,这样便可以在导电硬质基板之上涂覆用于连接柔性基板与导电硬质基板的导电粘结层,同时,对导电硬质基板的背面采用激光束扫描或者采用加热的方式,将导电粘结层老化,这样便可使柔性基板从导电硬质基板上剥离下来,得到柔性显示器件。
较佳地,将粘性层老化,包括:采用激光束对导电硬质基板的背面进行扫描或者采用加热的方式,将粘性层老化,这样便可使柔性基板从导电硬质基板上剥离下来,得到柔性显示器件。
本发明实施例还提供了一种柔性显示器件制备装置,该装置包括:
用于贴附柔性显示器件的柔性基板的导电粘结层;
以及,设置在导电粘结层下的导电硬质基板。
本发明通过设置用于连接柔性基板与导电硬质基板的导电粘结层,可以及时地将柔性基板与导电粘结层剥离过程中产生的静电通过导电硬质基板及时地导走,使柔性显示器件制备的良率增加。
较佳地,所述的导电粘结层为掺有导电粒子或导电聚合物的粘结胶,这样,用于连接柔性基板与导电硬质基板的粘结层具有导电性,所述的导电粘结层可将柔性基板与导电粘结层剥离过程中产生的静电通过导电硬质基板及时地导走,使柔性显示器件制备的良率增加。
较佳地,所述的导电粘结层包括硅烷粘结剂、聚酰亚胺粘结剂或丙烯酸酯粘结剂,以及导电粒子或导电聚合物,这样,用于连接柔性基板与导电硬质基板的粘结层具有导电性,所述的导电粘结层可将柔性基板与导电粘结层剥离过程中产生的静电通过导电硬质基板及时地导走,使剥离的均一性更好。
较佳地,所述导电粒子包括金、银、铜、铝、锌、铁、镍导电粒子,所述导电聚合物包括聚乙炔、聚噻吩、聚吡咯、聚苯胺、聚苯撑、聚苯撑乙烯或聚双炔,这样,用于连接柔性基板与导电硬质基板的粘结层具有导电性,所述的导电粘结层可将在导电硬质基板和柔性基板剥离过程中产生的静电及时通过导电硬质基板导走,使柔性显示器件制备的良率增加。
较佳地,所述导电硬质基板为金属基板,或者所述导电硬质基板包括导电层和不具有导电性质的硬质基板,这样便可以在导电硬质基板之上涂覆用于连接柔性基板与导电硬质基板的导电粘结层,同时,对导电硬质基板的背面采用激光束扫描或者采用加热的方式,将导电粘结层老化,这样便可使柔性基板从导电硬质基板上剥离下来,得到柔性显示器件。
较佳地,所述的导电层为氧化铟锡ITO层,所述的不具有导电性质的硬质基板为玻璃基板,这样便可以在导电硬质基板之上涂覆用于连接柔性基板与导电硬质基板的导电粘结层,同时,对导电硬质基板的背面采用激光束扫描或者采用加热的方式,将导电粘结层老化,这样便可使柔性基板从导电硬质基板上剥离下来,得到柔性显示器件。
附图说明
图1为本发明实施例提供的柔性显示器件制备方法流程示意图;
图2为柔性基板上制备柔性显示器件的其他部分的制备方法示意图;
图3为本发明实施例提供的柔性显示器件装置结构示意图;
图4为柔性基板上制备的柔性显示器件的其他部分结构示意图;
图5为本发明实施例提供的柔性显示器件装置结构示意图;
图6为本发明实施例提供的柔性显示器件装置结构示意图;
图7为本发明实施例提供的柔性显示器件装置结构示意图。
具体实施方式
本发明实施例提供了一种柔性显示器件的制备方法及装置,用以实现将柔性显示器件制备过程中产生的静电及时通过导电硬质基板导走,防止静电破坏柔性显示器,使柔性显示器件制备的良率增加。
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。
本发明实施例提供了一种柔性显示器件制备方法,参见图1,所述柔性显示器件的制备方法包括:
S1、在导电粘结层上贴附柔性显示器件的柔性基板,其中,所述的导电粘结层设置在导电硬质基板上;
S2、在柔性基板上制备柔性显示器件的其他部分;
S3、将粘性层老化;
S4、将导电硬质基板和柔性基板剥离,得到柔性显示器件;
其中,步骤S3包括:采用激光束对导电硬质基板的背面进行扫描或者采用加热的方式,将导电粘结层老化。
上述制备方法中,所述的导电粘结层为掺有导电粒子或导电聚合物的粘结胶,还包括硅烷粘结剂、聚酰亚胺粘结剂或丙烯酸酯粘结剂,以及导电粒子或导电聚合物,其中,所述导电粒子可以是金、银、铜、铝、锌、铁、镍导电粒子,所述导电聚合物包括聚乙炔、聚噻吩、聚吡咯、聚苯胺、聚苯撑、聚苯撑乙烯或聚双炔,所述导电硬质基板为金属基板,或者所述导电硬质基板包括导电层和不具有导电性质的硬质基板,其中,所述的导电层为氧化铟锡ITO层,所述的不具有导电性质的硬质基板为玻璃基板,这样,通过使用所述的导电粘结层可以及时地将柔性基板与导电粘结层剥离过程中产生的静电通过导电硬质基板导走,使柔性显示器件制备的良率增加。
较佳地,参见图2,步骤S2所述的在柔性基板上制备柔性显示器件的其他部分,包括:
S11、在第二柔性基板上从下至上分别制备薄膜晶体管TFT,第一钝化层;其中,所述薄膜晶体管TFT可以是顶栅结构,薄膜晶体管TFT从下至上依次制备:有源层,栅极绝缘层,栅极,层间绝缘层,漏极和源极;所述薄膜晶体管TFT也可以是底栅结构,薄膜晶体管TFT从下至上依次制备:栅极,栅极绝缘层,有源层,漏极和源极;
S12、通过在第一钝化层之上开设过孔,制备阳极;
S13、在第一钝化层之上分别制备阳极,像素界定层、RGB有机发光层(EL)和阴极
S14、贴附第一柔性基板;
上述制备方法中,所述的第二柔性基板即为本发明实施例中贴附在导电粘结层上的柔性基板。
上述结合图2所述的方法仅是举例说明,针对不同结构的柔性显示器件,可以有不同的制备方法。
所述导电硬质基板为金属基板,或者所述导电硬质基板包括导电层和不具有导电性质的硬质基板,其中,所述的导电层包括氧化铟锡ITO,所述的不具有导电性质的硬质基板包括玻璃基板,所述导电硬质基板用于在其之上涂覆用于连接柔性基板与导电硬质基板的导电粘结层,同时,对导电硬质基板的背面采用激光束进行扫描或者采用加热的方式,将导电粘结层老化,这样便可使柔性基板从导电硬质基板上剥离下来,得到柔性显示器件。
本发明实施例还提供了一种柔性显示器件制备装置,参见图3,可以看出所述柔性显示器件制备装置包括:用于贴附柔性显示器件的柔性基板31的导电粘结层32,以及,设置在导电粘结层下的导电硬质基板33。
其中,所述的柔性基板31用于在将导电粘结层老化后,使柔性基板从导电硬质基板上剥离下来,得到柔性显示器件,还用于在所述的柔性基板31上制备柔性显示器件的其他部分,参见图4,可以看出所述柔性显示器件的其他部分从下至上依次包括:第二柔性基板101,薄膜晶体管TFT103,第一钝化层105,阳极106,像素界定层107,RGB有机发光层(EL)108,阴极109,粘结胶110和第一柔性基板111。其中,薄膜晶体管TFT103从下至上依次包括:有源层112,栅极绝缘层102,栅极114,层间绝缘层104,漏极113和源极115,其中,所述的第二柔性基板101就是柔性基板31。
所述的导电粘结层32用于连接柔性基板31与导电硬质基板33,并将柔性基板31与导电硬质基板33在剥离过程中产生的静电及时地通过导电硬质基板33导走,使柔性显示器件制备的良率增加,参见图5和图6,图5中导电粘结层掺有导电粒子34,所述导电粒子可以是金、银、铜、铝、锌、铁、镍导电粒子,这样,用于连接柔性基板31与导电硬质基板33的粘结层具有导电性,所述的导电粘结层可将在柔性基板31和导电硬质基板33剥离过程中产生的静电及时通过导电硬质基板导走,使柔性显示器件制备的良率增加,图6中导电粘结层32掺有导电聚合物35,所述导电聚合物35包括聚乙炔、聚噻吩、聚吡咯、聚苯胺、聚苯撑、聚苯撑乙烯或聚双炔,这样,用于连接柔性基板31与导电硬质基板33的粘结层具有导电性,所述的导电粘结层32可将在柔性基板31和导电硬质基板33剥离过程中产生的静电及时通过导电硬质基板导走,使柔性显示器件制备的良率增加;所述的导电粘结层32还包括硅烷粘结剂、聚酰亚胺粘结剂或丙烯酸酯粘结剂,以及导电粒子34或导电聚合物35。
所述导电硬质基板33用于在其之上涂覆用于连接柔性基板31与导电硬质基板33的导电粘结层32,同时,对导电硬质基板33的背面采用激光束进行扫描或者采用加热的方式,将导电粘性层32老化,这样便可使柔性基板31从导电硬质基板33上剥离下来,得到柔性显示器件;所述导电硬质基板33为金属基板,或者参见图7,所述导电硬质基33包括导电层36和不具有导电性质的硬质基板37,其中,所述的导电层36为ITO层,所述的不具有导电性质的硬质基板37为玻璃基板,所述的ITO具有导电性。
综上所述,本发明提供了一种柔性显示器件制备方法及装置,用以实现将柔性显示器件制备过程中产生的静电通过导电粘结层和导电硬质基板直接导走,防止静电影响剥离效果,使柔性显示器件制备的良率增加。。
显然,本领域的技术人员可以对本发明进行各种改动和变型而不脱离本发明的精神和范围。这样,倘若本发明的这些修改和变型属于本发明权利要求及其等同技术的范围之内,则本发明也意图包含这些改动和变型在内。

Claims (13)

1.一种柔性显示器件制备方法,其特征在于,该方法包括:
在导电粘结层上贴附柔性显示器件的柔性基板,其中,所述的导电粘结层设置在导电硬质基板上;
在柔性基板上制备柔性显示器件的其他部分;
将导电粘结层老化;
将导电硬质基板和柔性基板剥离,得到柔性显示器件。
2.如权利要求1所述的方法,其特征在于,所述的导电粘结层为掺有导电粒子或导电聚合物的粘结胶。
3.如权利要求1所述的方法,其特征在于,所述的导电粘结层还包括硅烷粘结剂、聚酰亚胺粘结剂或丙烯酸酯粘结剂,以及导电粒子或导电聚合物。
4.如权利要求2或3所述的方法,其特征在于,所述导电粒子包括金、银、铜、铝、锌、铁、镍导电粒子;所述导电聚合物包括聚乙炔、聚噻吩、聚吡咯、聚苯胺、聚苯撑、聚苯撑乙烯或聚双炔。
5.如权利要求1所述的方法,其特征在于,所述导电硬质基板为金属基板,或者所述导电硬质基板包括导电层和不具有导电性质的硬质基板。
6.如权利要求5所述的方法,其特征在于,所述的导电层为氧化铟锡ITO层,所述的不具有导电性质的硬质基板为玻璃基板。
7.如权利要求1所述的方法,其特征在于,将粘性层老化,包括:采用激光束对导电硬质基板的背面进行扫描或者采用加热的方式,将粘性层老化。
8.一种柔性显示器件制备装置,其特征在于,该装置包括:
用于贴附柔性显示器件的柔性基板的导电粘结层;
以及,设置在导电粘结层下的导电硬质基板。
9.如权利要求8所述的装置,其特征在于,所述的导电粘结层为掺有导电粒子或导电聚合物的粘结胶。
10.如权利要求8所述的装置,其特征在于,所述的导电粘结层包括硅烷粘结剂、聚酰亚胺粘结剂或丙烯酸酯粘结剂,以及导电粒子或导电聚合物。
11.如权利要求9或10所述的装置,其特征在于,所述导电粒子包括金、银、铜、铝、锌、铁、镍导电粒子;所述导电聚合物包括聚乙炔、聚噻吩、聚吡咯、聚苯胺、聚苯撑、聚苯撑乙烯或聚双炔。
12.如权利要求8所述的装置,其特征在于,所述导电硬质基板为金属基板,或者所述导电硬质基板包括导电层和不具有导电性质的硬质基板。
13.如权利要求12所述的装置,其特征在于,所述的导电层为氧化铟锡ITO层,所述的不具有导电性质的硬质基板为玻璃基板。
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Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103413775B (zh) 2013-07-19 2016-04-06 京东方科技集团股份有限公司 一种柔性显示器件的制备方法及装置
CN103681486B (zh) * 2013-12-06 2018-07-17 京东方科技集团股份有限公司 一种柔性显示基板的制造方法
US9977262B2 (en) * 2014-03-12 2018-05-22 Honeywell International, Inc. Electrochromic lenses and methods of fabricating the same
CN104022062B (zh) * 2014-06-12 2016-08-17 京东方科技集团股份有限公司 一种柔性显示面板的制备方法
CN104716081B (zh) 2015-03-26 2017-09-15 京东方科技集团股份有限公司 柔性装置及其制作方法
CN105552088A (zh) * 2016-01-04 2016-05-04 京东方科技集团股份有限公司 基板结构及其柔性基板的贴附方法、剥离方法
CN105552225B (zh) * 2016-01-20 2020-04-17 京东方科技集团股份有限公司 用于制造柔性基板的方法、柔性基板和显示装置
CN105527740B (zh) * 2016-01-28 2018-09-28 武汉华星光电技术有限公司 玻璃基板及其制造方法和液晶面板
KR102710447B1 (ko) * 2016-08-12 2024-09-27 삼성디스플레이 주식회사 유기 발광 표시 장치
CN106505152B (zh) * 2016-10-31 2019-07-12 武汉华星光电技术有限公司 柔性oled面板制作方法及柔性oled面板
CN108231675B (zh) * 2016-12-22 2020-08-07 南京瀚宇彩欣科技有限责任公司 可挠式显示面板的制造方法
CN106486598B (zh) * 2016-12-29 2019-03-19 上海天马微电子有限公司 柔性显示面板、柔性显示装置及其制备方法
KR102323245B1 (ko) * 2017-03-15 2021-11-08 삼성디스플레이 주식회사 표시 장치의 제조 방법 및 이를 이용하는 박막 증착 장치
CN107154423B (zh) * 2017-05-16 2020-06-16 京东方科技集团股份有限公司 阵列基板及其制作方法、显示装置
CN107068919A (zh) * 2017-05-31 2017-08-18 京东方科技集团股份有限公司 制造柔性面板的方法
CN109037134A (zh) * 2017-06-08 2018-12-18 瀚宇彩晶股份有限公司 可挠式面板以及可挠式面板的制造方法
CN107978687B (zh) * 2017-11-22 2020-06-05 武汉华星光电半导体显示技术有限公司 柔性oled显示面板的制备方法
US10515569B2 (en) * 2017-12-29 2019-12-24 Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Preparation method of flexible display and flexible display
CN109192762B (zh) * 2018-09-06 2021-01-15 京东方科技集团股份有限公司 显示基板及其制造方法、显示装置
CN109597258A (zh) * 2018-11-19 2019-04-09 南京华日触控显示科技有限公司 一种邦定去邦定工艺制作的膜结构胆甾相液晶显示屏
CN111244307B (zh) * 2018-11-29 2021-10-22 Tcl科技集团股份有限公司 一种量子点发光二极管及其制备方法
CN110093141A (zh) * 2019-05-06 2019-08-06 深圳市华星光电技术有限公司 用于柔性基板剥离的组合材料及其制备方法、柔性面板的制作方法
CN110828513B (zh) * 2019-10-23 2022-05-27 武汉华星光电半导体显示技术有限公司 Oled显示面板及其制造方法以及oled显示装置
CN110910763B (zh) * 2019-11-07 2022-01-04 深圳市华星光电半导体显示技术有限公司 一种柔性显示器件的制备方法
KR20220096122A (ko) * 2020-12-30 2022-07-07 엘지디스플레이 주식회사 플렉서블 표시 장치
CN113224238B (zh) * 2021-04-30 2022-05-27 武汉华星光电半导体显示技术有限公司 柔性显示面板及其制备方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1862329A (zh) * 2005-05-13 2006-11-15 Lg.菲利浦Lcd株式会社 柔性显示器的制造方法
CN101443429A (zh) * 2006-03-23 2009-05-27 Lg化学株式会社 用于传送柔性基板的压敏粘合剂组合物
CN101901814A (zh) * 2009-05-26 2010-12-01 精工爱普生株式会社 薄膜装置、具备薄膜装置的挠性电路基板、及薄膜装置的制造方法
CN203377205U (zh) * 2013-07-19 2014-01-01 京东方科技集团股份有限公司 一种柔性显示器件的制备装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001146578A (ja) * 1999-11-22 2001-05-29 Dainippon Ink & Chem Inc 導電性シリコーン系粘着剤組成物及び導電性粘着テープ
US7349147B2 (en) * 2006-06-23 2008-03-25 Xerox Corporation Electrophoretic display medium containing solvent resistant emulsion aggregation particles
KR101279257B1 (ko) * 2006-06-29 2013-06-26 엘지디스플레이 주식회사 가요성 표시장치용 기판
CN103413775B (zh) * 2013-07-19 2016-04-06 京东方科技集团股份有限公司 一种柔性显示器件的制备方法及装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1862329A (zh) * 2005-05-13 2006-11-15 Lg.菲利浦Lcd株式会社 柔性显示器的制造方法
CN101443429A (zh) * 2006-03-23 2009-05-27 Lg化学株式会社 用于传送柔性基板的压敏粘合剂组合物
CN101901814A (zh) * 2009-05-26 2010-12-01 精工爱普生株式会社 薄膜装置、具备薄膜装置的挠性电路基板、及薄膜装置的制造方法
CN203377205U (zh) * 2013-07-19 2014-01-01 京东方科技集团股份有限公司 一种柔性显示器件的制备装置

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