CN103413775A - 一种柔性显示器件的制备方法及装置 - Google Patents

一种柔性显示器件的制备方法及装置 Download PDF

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CN103413775A
CN103413775A CN2013103061943A CN201310306194A CN103413775A CN 103413775 A CN103413775 A CN 103413775A CN 2013103061943 A CN2013103061943 A CN 2013103061943A CN 201310306194 A CN201310306194 A CN 201310306194A CN 103413775 A CN103413775 A CN 103413775A
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conduction
hard substrate
display device
flexible display
tack coat
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CN103413775B (zh
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程鸿飞
张玉欣
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BOE Technology Group Co Ltd
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BOE Technology Group Co Ltd
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Priority to CN201310306194.3A priority Critical patent/CN103413775B/zh
Publication of CN103413775A publication Critical patent/CN103413775A/zh
Priority to PCT/CN2013/089610 priority patent/WO2015007054A1/zh
Priority to US14/353,722 priority patent/US9873241B2/en
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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133305—Flexible substrates, e.g. plastics, organic film
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
    • B32B43/006—Delaminating
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    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
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    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
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    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/02—Noble metals
    • B32B2311/04—Gold
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/02—Noble metals
    • B32B2311/08—Silver
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/12—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/20—Zinc
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/22—Nickel or cobalt
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/24—Aluminium
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/30—Iron, e.g. steel
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2325/00—Polymers of vinyl-aromatic compounds, e.g. polystyrene
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2333/00—Polymers of unsaturated acids or derivatives thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2355/00—Specific polymers obtained by polymerisation reactions only involving carbon-to-carbon unsaturated bonds, not provided for in a single one of index codes B32B2323/00 - B32B2333/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2379/00—Other polymers having nitrogen, with or without oxygen or carbon only, in the main chain
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2379/00—Other polymers having nitrogen, with or without oxygen or carbon only, in the main chain
    • B32B2379/08—Polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2383/00—Polysiloxanes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2386/00—Specific polymers obtained by polycondensation or polyaddition not provided for in a single one of index codes B32B2363/00 - B32B2383/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/202—LCD, i.e. liquid crystal displays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/206—Organic displays, e.g. OLED
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    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/13613—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit the semiconductor element being formed on a first substrate and thereafter transferred to the final cell substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/6835—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used as a support during build up manufacturing of active devices
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H01L2221/68386—Separation by peeling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
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    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/331—Nanoparticles used in non-emissive layers, e.g. in packaging layer
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    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
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    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/831—Aging
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2804—Next to metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/2857—Adhesive compositions including metal or compound thereof or natural rubber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract

本发明实施例提供了一种柔性显示器件的制备方法及装置，用以实现将柔性显示器件制备过程中产生的静电及时通过导电硬质基板导走，防止静电破坏柔性显示器，使柔性显示器件制备的良率增加。本发明提供的一种柔性显示器件制备方法包括：在导电粘结层上贴附柔性显示器件的柔性基板，其中，所述的导电粘结层设置在导电硬质基板上，然后在柔性基板上制备柔性显示器件的其他部分，将粘性层老化，最后将硬质基板和柔性基板剥离，得到柔性显示器件。

Description

一种柔性显示器件的制备方法及装置
技术领域
本发明涉及显示器技术领域，尤其涉及一种柔性显示器件的制备方法及装置。
背景技术
柔性显示器具有诸多优点，例如耐冲击，抗震能力强，重量轻、体积小，携带更加方便等特点。
目前主要的柔性显示材料大致可分为三种：电子纸（或柔性电泳显示）、柔性有机发光二极管（Organic Light Emitting Diode,OLED）和柔性液晶等。
现有技术中在制备柔性显示器时应用比较多的是贴覆取下法，将柔性基板通过粘结层贴覆在导电硬质基板上，制备完柔性显示器之后再使柔性基板从导电硬质基板上剥离下来，得到柔性显示器。但是，这种剥离方法在操作过程中常常会产生静电无法及时通过导电硬质基板导走，静电会对柔性显示器造成破坏，导致良率下降。
发明内容
本发明实施例提供了一种柔性显示器件的制备方法及装置，用以实现将柔性显示器件制备过程中产生的静电及时通过导电硬质基板导走，防止静电破坏柔性显示器，使柔性显示器件制备的良率增加。
本发明实施例提供了一种柔性显示器件制备方法，该方法包括：
在导电粘结层上贴附柔性显示器件的柔性基板，其中，所述的导电粘结层设置在导电硬质基板上；
在柔性基板上制备柔性显示器件的其他部分；
将粘性层老化；
将导电硬质基板和柔性基板剥离，得到柔性显示器件。
从上述制备方法可以看出，导电粘结层用于连接柔性基板与导电硬质基板，通过使用导电粘结层将柔性基板与导电粘结层剥离过程中产生的静电通过导电硬质基板及时地导走，使柔性显示器件制备的良率增加。
较佳地，所述的导电粘结层为掺有导电粒子或导电聚合物的粘结胶，这样，用于连接柔性基板与导电硬质基板的粘结层具有导电性，所述的导电粘结层可将在柔性基板与导电粘结层剥离过程中产生的静电及时通过导电硬质基板导走，使柔性显示器件制备的良率增加。
较佳地，所述的导电粘结层还包括硅烷粘结剂、聚酰亚胺粘结剂或丙烯酸酯粘结剂，以及导电粒子或导电聚合物，这样，用于连接柔性基板与导电硬质基板的粘结层具有导电性，所述的导电粘结层可将在柔性基板与导电粘结层剥离过程中产生的静电及时通过导电硬质基板导走，使柔性显示器件制备的良率增加。
较佳地，所述导电粒子包括金、银、铜、铝、锌、铁、镍导电粒子，所述导电聚合物包括聚乙炔、聚噻吩、聚吡咯、聚苯胺、聚苯撑、聚苯撑乙烯或聚双炔，这样，用于连接柔性基板与导电硬质基板的粘结层具有导电性，所述的导电粘结层可将在柔性基板与导电粘结层剥离过程中产生的静电及时通过导电硬质基板导走，使柔性显示器件制备的良率增加。
较佳地，所述导电硬质基板为金属基板，或者所述导电硬质基板包括导电层和不具有导电性质的硬质基板，这样便可以在导电硬质基板之上涂覆用于连接柔性基板与导电硬质基板的导电粘结层，同时，对导电硬质基板的背面采用激光束扫描或者采用加热的方式，将导电粘结层老化，这样便可使柔性基板从导电硬质基板上剥离下来，得到柔性显示器件。
较佳地，所述的导电层为氧化铟锡ITO层，所述的不具有导电性质的硬质基板为玻璃基板，这样便可以在导电硬质基板之上涂覆用于连接柔性基板与导电硬质基板的导电粘结层，同时，对导电硬质基板的背面采用激光束扫描或者采用加热的方式，将导电粘结层老化，这样便可使柔性基板从导电硬质基板上剥离下来，得到柔性显示器件。
较佳地，将粘性层老化，包括：采用激光束对导电硬质基板的背面进行扫描或者采用加热的方式，将粘性层老化，这样便可使柔性基板从导电硬质基板上剥离下来，得到柔性显示器件。
本发明实施例还提供了一种柔性显示器件制备装置，该装置包括：
用于贴附柔性显示器件的柔性基板的导电粘结层；
以及，设置在导电粘结层下的导电硬质基板。
本发明通过设置用于连接柔性基板与导电硬质基板的导电粘结层，可以及时地将柔性基板与导电粘结层剥离过程中产生的静电通过导电硬质基板及时地导走，使柔性显示器件制备的良率增加。
较佳地，所述的导电粘结层为掺有导电粒子或导电聚合物的粘结胶，这样，用于连接柔性基板与导电硬质基板的粘结层具有导电性，所述的导电粘结层可将柔性基板与导电粘结层剥离过程中产生的静电通过导电硬质基板及时地导走，使柔性显示器件制备的良率增加。
较佳地，所述的导电粘结层包括硅烷粘结剂、聚酰亚胺粘结剂或丙烯酸酯粘结剂，以及导电粒子或导电聚合物，这样，用于连接柔性基板与导电硬质基板的粘结层具有导电性，所述的导电粘结层可将柔性基板与导电粘结层剥离过程中产生的静电通过导电硬质基板及时地导走，使剥离的均一性更好。
较佳地，所述导电粒子包括金、银、铜、铝、锌、铁、镍导电粒子，所述导电聚合物包括聚乙炔、聚噻吩、聚吡咯、聚苯胺、聚苯撑、聚苯撑乙烯或聚双炔，这样，用于连接柔性基板与导电硬质基板的粘结层具有导电性，所述的导电粘结层可将在导电硬质基板和柔性基板剥离过程中产生的静电及时通过导电硬质基板导走，使柔性显示器件制备的良率增加。
较佳地，所述导电硬质基板为金属基板，或者所述导电硬质基板包括导电层和不具有导电性质的硬质基板，这样便可以在导电硬质基板之上涂覆用于连接柔性基板与导电硬质基板的导电粘结层，同时，对导电硬质基板的背面采用激光束扫描或者采用加热的方式，将导电粘结层老化，这样便可使柔性基板从导电硬质基板上剥离下来，得到柔性显示器件。
较佳地，所述的导电层为氧化铟锡ITO层，所述的不具有导电性质的硬质基板为玻璃基板，这样便可以在导电硬质基板之上涂覆用于连接柔性基板与导电硬质基板的导电粘结层，同时，对导电硬质基板的背面采用激光束扫描或者采用加热的方式，将导电粘结层老化，这样便可使柔性基板从导电硬质基板上剥离下来，得到柔性显示器件。
附图说明
图1为本发明实施例提供的柔性显示器件制备方法流程示意图；
图2为柔性基板上制备柔性显示器件的其他部分的制备方法示意图；
图3为本发明实施例提供的柔性显示器件装置结构示意图；
图4为柔性基板上制备的柔性显示器件的其他部分结构示意图；
图5为本发明实施例提供的柔性显示器件装置结构示意图；
图6为本发明实施例提供的柔性显示器件装置结构示意图；
图7为本发明实施例提供的柔性显示器件装置结构示意图。
具体实施方式
本发明实施例提供了一种柔性显示器件的制备方法及装置，用以实现将柔性显示器件制备过程中产生的静电及时通过导电硬质基板导走，防止静电破坏柔性显示器，使柔性显示器件制备的良率增加。
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
本发明实施例提供了一种柔性显示器件制备方法，参见图1，所述柔性显示器件的制备方法包括：
S1、在导电粘结层上贴附柔性显示器件的柔性基板，其中，所述的导电粘结层设置在导电硬质基板上；
S2、在柔性基板上制备柔性显示器件的其他部分；
S3、将粘性层老化；
S4、将导电硬质基板和柔性基板剥离，得到柔性显示器件；
其中，步骤S3包括：采用激光束对导电硬质基板的背面进行扫描或者采用加热的方式，将导电粘结层老化。
上述制备方法中，所述的导电粘结层为掺有导电粒子或导电聚合物的粘结胶，还包括硅烷粘结剂、聚酰亚胺粘结剂或丙烯酸酯粘结剂，以及导电粒子或导电聚合物，其中，所述导电粒子可以是金、银、铜、铝、锌、铁、镍导电粒子，所述导电聚合物包括聚乙炔、聚噻吩、聚吡咯、聚苯胺、聚苯撑、聚苯撑乙烯或聚双炔，所述导电硬质基板为金属基板，或者所述导电硬质基板包括导电层和不具有导电性质的硬质基板，其中，所述的导电层为氧化铟锡ITO层，所述的不具有导电性质的硬质基板为玻璃基板，这样，通过使用所述的导电粘结层可以及时地将柔性基板与导电粘结层剥离过程中产生的静电通过导电硬质基板导走，使柔性显示器件制备的良率增加。
较佳地，参见图2，步骤S2所述的在柔性基板上制备柔性显示器件的其他部分，包括：
S11、在第二柔性基板上从下至上分别制备薄膜晶体管TFT，第一钝化层；其中，所述薄膜晶体管TFT可以是顶栅结构，薄膜晶体管TFT从下至上依次制备：有源层，栅极绝缘层，栅极，层间绝缘层，漏极和源极;所述薄膜晶体管TFT也可以是底栅结构，薄膜晶体管TFT从下至上依次制备：栅极，栅极绝缘层，有源层，漏极和源极；
S12、通过在第一钝化层之上开设过孔，制备阳极；
S13、在第一钝化层之上分别制备阳极，像素界定层、RGB有机发光层（EL）和阴极
S14、贴附第一柔性基板；
上述制备方法中，所述的第二柔性基板即为本发明实施例中贴附在导电粘结层上的柔性基板。
上述结合图2所述的方法仅是举例说明，针对不同结构的柔性显示器件，可以有不同的制备方法。
所述导电硬质基板为金属基板，或者所述导电硬质基板包括导电层和不具有导电性质的硬质基板，其中，所述的导电层包括氧化铟锡ITO，所述的不具有导电性质的硬质基板包括玻璃基板，所述导电硬质基板用于在其之上涂覆用于连接柔性基板与导电硬质基板的导电粘结层，同时，对导电硬质基板的背面采用激光束进行扫描或者采用加热的方式，将导电粘结层老化，这样便可使柔性基板从导电硬质基板上剥离下来，得到柔性显示器件。
本发明实施例还提供了一种柔性显示器件制备装置，参见图3，可以看出所述柔性显示器件制备装置包括：用于贴附柔性显示器件的柔性基板31的导电粘结层32，以及，设置在导电粘结层下的导电硬质基板33。
其中，所述的柔性基板31用于在将导电粘结层老化后，使柔性基板从导电硬质基板上剥离下来，得到柔性显示器件，还用于在所述的柔性基板31上制备柔性显示器件的其他部分，参见图4，可以看出所述柔性显示器件的其他部分从下至上依次包括：第二柔性基板101，薄膜晶体管TFT103，第一钝化层105，阳极106，像素界定层107，RGB有机发光层(EL)108,阴极109，粘结胶110和第一柔性基板111。其中，薄膜晶体管TFT103从下至上依次包括：有源层112，栅极绝缘层102，栅极114，层间绝缘层104，漏极113和源极115，其中，所述的第二柔性基板101就是柔性基板31。
所述的导电粘结层32用于连接柔性基板31与导电硬质基板33，并将柔性基板31与导电硬质基板33在剥离过程中产生的静电及时地通过导电硬质基板33导走，使柔性显示器件制备的良率增加，参见图5和图6，图5中导电粘结层掺有导电粒子34，所述导电粒子可以是金、银、铜、铝、锌、铁、镍导电粒子，这样，用于连接柔性基板31与导电硬质基板33的粘结层具有导电性，所述的导电粘结层可将在柔性基板31和导电硬质基板33剥离过程中产生的静电及时通过导电硬质基板导走，使柔性显示器件制备的良率增加，图6中导电粘结层32掺有导电聚合物35，所述导电聚合物35包括聚乙炔、聚噻吩、聚吡咯、聚苯胺、聚苯撑、聚苯撑乙烯或聚双炔，这样，用于连接柔性基板31与导电硬质基板33的粘结层具有导电性，所述的导电粘结层32可将在柔性基板31和导电硬质基板33剥离过程中产生的静电及时通过导电硬质基板导走，使柔性显示器件制备的良率增加；所述的导电粘结层32还包括硅烷粘结剂、聚酰亚胺粘结剂或丙烯酸酯粘结剂，以及导电粒子34或导电聚合物35。
所述导电硬质基板33用于在其之上涂覆用于连接柔性基板31与导电硬质基板33的导电粘结层32，同时，对导电硬质基板33的背面采用激光束进行扫描或者采用加热的方式，将导电粘性层32老化，这样便可使柔性基板31从导电硬质基板33上剥离下来，得到柔性显示器件；所述导电硬质基板33为金属基板，或者参见图7，所述导电硬质基33包括导电层36和不具有导电性质的硬质基板37，其中，所述的导电层36为ITO层，所述的不具有导电性质的硬质基板37为玻璃基板，所述的ITO具有导电性。
综上所述，本发明提供了一种柔性显示器件制备方法及装置，用以实现将柔性显示器件制备过程中产生的静电通过导电粘结层和导电硬质基板直接导走，防止静电影响剥离效果，使柔性显示器件制备的良率增加。。
显然，本领域的技术人员可以对本发明进行各种改动和变型而不脱离本发明的精神和范围。这样，倘若本发明的这些修改和变型属于本发明权利要求及其等同技术的范围之内，则本发明也意图包含这些改动和变型在内。

Claims (13)

1.一种柔性显示器件制备方法，其特征在于，该方法包括：
在导电粘结层上贴附柔性显示器件的柔性基板，其中，所述的导电粘结层设置在导电硬质基板上；
在柔性基板上制备柔性显示器件的其他部分；
将导电粘结层老化；
将导电硬质基板和柔性基板剥离，得到柔性显示器件。
2.如权利要求1所述的方法，其特征在于，所述的导电粘结层为掺有导电粒子或导电聚合物的粘结胶。
3.如权利要求1所述的方法，其特征在于，所述的导电粘结层还包括硅烷粘结剂、聚酰亚胺粘结剂或丙烯酸酯粘结剂，以及导电粒子或导电聚合物。
4.如权利要求2或3所述的方法，其特征在于，所述导电粒子包括金、银、铜、铝、锌、铁、镍导电粒子；所述导电聚合物包括聚乙炔、聚噻吩、聚吡咯、聚苯胺、聚苯撑、聚苯撑乙烯或聚双炔。
5.如权利要求1所述的方法，其特征在于，所述导电硬质基板为金属基板，或者所述导电硬质基板包括导电层和不具有导电性质的硬质基板。
6.如权利要求5所述的方法，其特征在于，所述的导电层为氧化铟锡ITO层，所述的不具有导电性质的硬质基板为玻璃基板。
7.如权利要求1所述的方法，其特征在于，将粘性层老化，包括：采用激光束对导电硬质基板的背面进行扫描或者采用加热的方式，将粘性层老化。
8.一种柔性显示器件制备装置，其特征在于，该装置包括：
用于贴附柔性显示器件的柔性基板的导电粘结层；
以及，设置在导电粘结层下的导电硬质基板。
9.如权利要求8所述的装置，其特征在于，所述的导电粘结层为掺有导电粒子或导电聚合物的粘结胶。
10.如权利要求8所述的装置，其特征在于，所述的导电粘结层包括硅烷粘结剂、聚酰亚胺粘结剂或丙烯酸酯粘结剂，以及导电粒子或导电聚合物。
11.如权利要求9或10所述的装置，其特征在于，所述导电粒子包括金、银、铜、铝、锌、铁、镍导电粒子；所述导电聚合物包括聚乙炔、聚噻吩、聚吡咯、聚苯胺、聚苯撑、聚苯撑乙烯或聚双炔。
12.如权利要求8所述的装置，其特征在于，所述导电硬质基板为金属基板，或者所述导电硬质基板包括导电层和不具有导电性质的硬质基板。
13.如权利要求12所述的装置，其特征在于，所述的导电层为氧化铟锡ITO层，所述的不具有导电性质的硬质基板为玻璃基板。
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