WO2020224093A1 - 用于柔性基板剥离的组合材料及其制备方法、柔性面板的制作方法 - Google Patents

用于柔性基板剥离的组合材料及其制备方法、柔性面板的制作方法 Download PDF

Info

Publication number
WO2020224093A1
WO2020224093A1 PCT/CN2019/102091 CN2019102091W WO2020224093A1 WO 2020224093 A1 WO2020224093 A1 WO 2020224093A1 CN 2019102091 W CN2019102091 W CN 2019102091W WO 2020224093 A1 WO2020224093 A1 WO 2020224093A1
Authority
WO
WIPO (PCT)
Prior art keywords
flexible substrate
peeling
composite material
flexible
binder
Prior art date
Application number
PCT/CN2019/102091
Other languages
English (en)
French (fr)
Inventor
吴豪旭
Original Assignee
深圳市华星光电技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市华星光电技术有限公司 filed Critical 深圳市华星光电技术有限公司
Publication of WO2020224093A1 publication Critical patent/WO2020224093A1/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H01L2221/68386—Separation by peeling

Definitions

  • the present invention relates to the field of display technology, in particular to a composite material used for peeling off a flexible substrate, a preparation method thereof, and a preparation method of a flexible panel.
  • Flexible display Flexible Display
  • the flexible display also known as the rollable display, is a bendable and deformable display device made of flexible materials to make a visible flexible panel.
  • flexible displays have many advantages: impact resistance, stronger shock resistance; lighter weight, smaller size, and more convenient to carry; using a tape-and-reel process similar to the newspaper printing process, so the cost is lower, etc.
  • the flexible substrate is an important part of the entire flexible display, and its performance has an important influence on the quality and life of the flexible display.
  • materials that can be used as flexible substrates include ultra-thin glass, metal foil or polymer film.
  • the polymer film may be polyethylene terephthalate, polyethylene naphthalate, polycarbonate, cyclic polyolefin, polyethersulfone, polyimide (PI), and the like.
  • polyimide substrates have attracted much attention due to their excellent high-temperature resistance, good mechanical properties, and excellent chemical resistance.
  • Displays such as Liquid Crystal Display (LCD) and Organic Light Emitting Diode (OLED) can all realize flexible display.
  • LCD Liquid Crystal Display
  • OLED Organic Light Emitting Diode
  • the laser lift-off technology has less damage to the flexible substrate and is therefore widely used.
  • the laser lift-off technology is to set the flexible substrate on the glass substrate (that is, the glass substrate is used as the carrier substrate), and then prepare the display device on the flexible substrate. After the preparation, the contact interface between the glass substrate and the flexible substrate is irradiated with a laser, thereby The flexible substrate is separated by the glass substrate.
  • the contact interface between the glass substrate and the flexible substrate is irradiated with a laser
  • the energy is absorbed by the flexible substrate, which causes the flexible substrate to ablate and release gas. Therefore, the flexible substrate will expand locally and form wrinkles after cooling, resulting in product failure.
  • the purpose of the present invention is to provide a composite material for peeling a flexible substrate, which can make the operation of peeling the flexible substrate from the carrier substrate simple and easy, and the cost is low.
  • the purpose of the present invention is also to provide a method for preparing a composite material for peeling a flexible substrate, the prepared composite material can make the operation of peeling the flexible substrate from the carrier substrate simple and easy, and the cost is low.
  • the purpose of the present invention is to provide a method for manufacturing a flexible panel, which uses the above-mentioned combined materials to form a temporary adhesive film layer, which can make the operation of peeling the flexible substrate from the carrier substrate simple and easy, and the cost is low.
  • the present invention provides a composite material for the peeling of flexible substrates, which includes a uniformly mixed binder, inorganic nanoparticles, polyvinyl alcohol, deionized water and a dispersant;
  • the binder is a phenolic resin modified silicone polymer
  • the composite material for peeling off a flexible substrate loses its viscosity due to decomposition of the adhesive as the temperature rises.
  • the inorganic nanoparticles are silicon oxide nanoparticles, silicon nitride nanoparticles or a combination of both.
  • the dispersant is polyethylene glycol.
  • the mass percentages of the binder, inorganic nanoparticles, polyvinyl alcohol, deionized water and dispersant are 1-3%, 50-70%, 0.3%, respectively. -1%, 25-45%, 0.5-1.5%.
  • the present invention also provides a method for preparing the composite material for peeling off the flexible substrate as described above, including the following steps:
  • Step a crushing inorganic nanoparticles
  • Step b dissolving polyvinyl alcohol in deionized water to obtain a polyvinyl alcohol solution
  • Step c placing the polyvinyl alcohol solution and the crushed inorganic nanoparticles in a stirring ball mill, adding deionized water and a dispersant, and performing stirring ball milling treatment to obtain a granulation precursor slurry;
  • Step d the granulation precursor slurry is atomized, dried and granulated in a spray drying granulation tower to obtain nano powder particles;
  • Step e Dissolve the phenolic resin modified silicone polymer in deionized water to obtain a binder solution, place the obtained binder solution and nano powder particles in a centrifugal closed container, and add a dispersant to fully Mixing to obtain a composite material for peeling the flexible substrate.
  • the inorganic nanoparticles are placed in a planetary ball mill for crushing treatment, and the crushing medium is corundum beads
  • the rotation speed of the stirring ball mill is 200-300 r/min, and the treatment time is 1-2 h during the stirring ball milling process.
  • the temperature in the spray-drying granulation tower during the atomization drying granulation treatment is 200-250°C.
  • the present invention also provides a method for manufacturing a flexible panel, including the following steps:
  • Step S1 Provide a carrier substrate and the composite material for flexible substrate peeling as described above, coat the composite material for flexible substrate peeling on the carrier substrate to obtain a bonding coating, and then use vacuum drying and The deionized water in the bonding coating is removed by heating, and the bonding coating is cured into a film to obtain a bonding film layer;
  • Step S2 coating and forming a flexible substrate on the adhesive film layer, and forming a display function layer on the flexible substrate;
  • Step S3 heat and bake the adhesive film layer, so that the adhesive in the adhesive film layer is thermally decomposed, so that the adhesive film layer loses its viscosity, and the flexible substrate is separated from the carrier substrate.
  • the temperature at which the adhesive film layer is heated and baked is 380-420°C, and the time for the heat and baked treatment is 1.5-2.5 h.
  • the present invention provides a composite material for the peeling of flexible substrates, which includes a binder, inorganic nanoparticles, polyvinyl alcohol, deionized water and a dispersant.
  • the binder is a modified phenolic resin.
  • This combination material is a kind of temporary adhesive material. As the temperature rises, the adhesive will decompose and lose its viscosity. Therefore, the adhesive can be used in the manufacturing process of flexible panels.
  • the micro-adhesion between the agent and the inorganic nano-particles realizes that the composite material is coated to form a film at a low temperature and maintains a strong adhesion to the carrier substrate to facilitate the subsequent manufacturing process of the flexible substrate and the display functional layer, and it is heated at high temperature Processing, the adhesive film layer formed by the combined material loses its bonding effect due to the decomposition of the adhesive, and the carrier substrate can be separated from the flexible substrate, making the operation of peeling the flexible substrate from the carrier substrate simple and easy OK, and the cost is low.
  • the prepared composite material can make the operation of peeling the flexible substrate from the carrier substrate simple and easy, and the cost is low.
  • the manufacturing method of the flexible panel of the present invention uses the above-mentioned combined materials to form a temporary adhesive film layer on a carrier substrate, and then sequentially form a flexible substrate and a display function layer on the adhesive film layer, and finally by bonding the The film layer is heated and baked, so that the adhesive in the adhesive film layer is thermally decomposed and the adhesive film layer loses its viscosity.
  • the operation of peeling the flexible substrate from the carrier substrate is simple and easy, and the cost is low .
  • Fig. 1 is a schematic flow diagram of a method for manufacturing a flexible panel of the present invention
  • step S1 is a schematic diagram of step S1 of the manufacturing method of the flexible panel of the present invention.
  • step S2 is a schematic diagram of step S2 of the manufacturing method of the flexible panel of the present invention.
  • step S3 is a schematic diagram of step S3 of the manufacturing method of the flexible panel of the present invention.
  • the present invention first provides a composite material for peeling off a flexible substrate, including a mixed binder, inorganic nanoparticles, polyvinyl alcohol (PVE), deionized water and a dispersant.
  • a composite material for peeling off a flexible substrate including a mixed binder, inorganic nanoparticles, polyvinyl alcohol (PVE), deionized water and a dispersant.
  • PVE polyvinyl alcohol
  • the binder is a phenolic resin modified silicone polymer; the inorganic nanoparticles, polyvinyl alcohol, and part of the dispersant are collectively subjected to atomization, drying and granulation treatment to form nano powder particles and are composed of the nano powder The particles are mixed in the composite material for peeling the flexible substrate.
  • the composite material used for the peeling of flexible substrates is a temporary adhesive material. As the temperature rises, the adhesive will decompose and lose its viscosity, that is, it has adhesiveness at low temperatures (below 350°C) , And at high temperatures (around 400°C), the adhesive will decompose and lose its viscosity.
  • the inorganic nanoparticles are silicon oxide nanoparticles, silicon nitride nanoparticles or a combination of both.
  • the dispersant is polyethylene glycol (PEG).
  • the mass percentages of the binder, inorganic nanoparticles, polyvinyl alcohol, deionized water and dispersant are respectively 1-3%, 50-70 %, 0.3-1%, 25-45%, 0.5-1.5%.
  • the composite material for flexible substrate peeling of the present invention belongs to a temporary adhesive material. As the temperature rises, the adhesive in the composite material will decompose and lose its viscosity. Therefore, it can be used in the manufacturing process of the flexible panel. Using the micro-adhesion between the binder and the inorganic nanoparticles, the composite material is coated to form a film at low temperature and maintains a strong adhesion with the carrier substrate to facilitate the subsequent manufacturing process of the flexible substrate and the display functional layer, and at high temperature After heat treatment, the adhesive film formed by the combined material loses its bonding effect due to the decomposition of the adhesive, and the carrier substrate can be separated from the flexible substrate, making the flexible substrate peel off from the carrier substrate. The operation is simple and easy, and the cost is low.
  • the present invention also provides a method for preparing the composite material for peeling off the flexible substrate as described above, including the following steps:
  • Step a Place the inorganic nanoparticles in a planetary ball mill for crushing treatment, and the crushing medium is corundum (high hardness alumina) beads.
  • Step b Stir and dissolve polyvinyl alcohol in deionized water at 60°C ⁇ 5°C, stir and dissolve until the solution is clear and transparent, and obtain a polyvinyl alcohol solution, and the time is about 2 hours.
  • Step c According to the preparation method of the spray granulation precursor, the obtained polyvinyl alcohol solution and the crushed inorganic nanoparticles are placed in a stirring ball mill, and an appropriate amount of deionized water is added to adjust the solid-liquid ratio and appropriate dispersion To ensure the uniform composition of the granulation precursor slurry, then carry out agitating ball milling treatment with a rotation speed of 200-300r/min and a treatment time of 1-2h to obtain the granulation precursor slurry.
  • Step d The granulation precursor slurry is atomized, dried and granulated in a small precision spray drying granulation tower, and the temperature in the spray drying granulation tower is 200-250°C to obtain nanometer-level nano powder Body particles.
  • Step e Dissolve the phenolic resin modified silicone polymer in deionized water to obtain a binder solution, and place the obtained binder solution, atomized, dried, and granulated nano powder particles and dispersant in a centrifuge Fully mix in a closed container to obtain a composite material with greater viscosity, strong adhesion, and uniform composition for flexible substrate peeling.
  • the prepared composite material can make the operation of peeling the flexible substrate from the carrier substrate simple and easy, and the cost is low.
  • the present invention also provides a method for manufacturing a flexible panel, which includes the following steps:
  • Step S1 as shown in FIG. 2, provide a carrier substrate 50 and the composite material for flexible substrate peeling as described above, and coat the composite material for flexible substrate peeling on the carrier substrate 50 to obtain a bond
  • the coating is then vacuum dried (Vacuum Dry, VCD) and heated at 200 °C ⁇ 20 °C to completely remove the deionized water in the bonding coating, so that the water vapor is fully evaporated and lost, so that the bonding coating
  • the layer is cured to form a film, and an adhesive film layer 65 that still has a certain adhesiveness is obtained.
  • Step S2 as shown in FIG. 3, coating and forming a flexible substrate 10 on the adhesive film layer 65, and forming a display function layer 20 on the flexible substrate 10.
  • Step S3 As shown in Fig. 4, a single-side heating method is adopted to heat and bake the adhesive film layer 65 at 400°C ⁇ 20°C from the side of the carrier substrate 50 where the adhesive film layer 65 is provided for 2h ⁇ For 0.5 h, the adhesive in the adhesive film layer 65 is fully decomposed by heat, so that the adhesive film layer 65 loses its viscosity, and the flexible substrate 10 and the carrier substrate 50 are separated.
  • the manufacturing method of the flexible panel of the present invention first uses the above-mentioned composite material for flexible substrate peeling to form a temporary adhesive film layer 65 on the carrier substrate 50, and then sequentially forms the flexible substrate 10 on the adhesive film layer 65 And the display function layer 20, and finally by heating and baking the adhesive film layer 65, the adhesive in the adhesive film layer 65 is thermally decomposed so that the adhesive film layer 65 loses its viscosity, and the inorganic nanoparticles The micro-bonding effect between the particles and the inorganic nanoparticles and the carrier substrate 50 is lost, and the flexible substrate 10 is separated from the carrier substrate 50, so that the operation of peeling the flexible substrate 10 from the carrier substrate 50 is simple and easy, and The cost is lower.
  • the present invention provides a composite material for flexible substrate peeling, including a binder, inorganic nanoparticles, polyvinyl alcohol, deionized water, and a dispersant.
  • the binder is modified by phenolic resin.
  • Organosilicon polymer the combined material is a kind of temporary adhesive material, which will decompose and lose its viscosity as the temperature rises, so that the adhesive can be used in the manufacturing process of the flexible panel
  • the micro-adhesion between the inorganic nano-particles realizes that the composite material is coated into a film at low temperature and maintains a strong adhesion with the carrier substrate to facilitate the subsequent manufacturing process of the flexible substrate and the display function layer, and is heated at high temperature
  • the inside of the adhesive film layer formed by the combined material loses the adhesive effect due to the decomposition of the adhesive, and the carrier substrate can be separated from the flexible substrate, making the operation of peeling the flexible substrate from the carrier substrate simple and easy , And the cost is low.
  • the prepared composite material can make the operation of peeling the flexible substrate from the carrier substrate simple and easy, and the cost is low.
  • the manufacturing method of the flexible panel of the present invention uses the above-mentioned combined materials to form a temporary adhesive film layer on a carrier substrate, and then sequentially form a flexible substrate and a display function layer on the adhesive film layer, and finally by bonding the The film layer is heated and baked, so that the adhesive in the adhesive film layer is thermally decomposed and the adhesive film layer loses its viscosity.
  • the operation of peeling the flexible substrate from the carrier substrate is simple and easy, and the cost is low .

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Gas-Filled Discharge Tubes (AREA)

Abstract

本发明提供一种用于柔性基板剥离的组合材料及其制备方法、柔性面板的制作方法。本发明的用于柔性基板剥离的组合材料包括粘结剂、无机纳米粒子、聚乙烯醇、去离子水及分散剂，其属于一种临时性的粘结材料，随着温度升高会因其中的粘结剂发生分解而失去粘性，从而在柔性面板的制程中，可利用粘结剂与无机纳米粒子间的微粘结作用，实现该组合材料低温下涂覆成膜并保持与载体基板间较强黏附力以方便后续柔性基板及显示功能层的制程，而在高温下经加热处理，由该组合材料所形成的粘结膜层内部因粘结剂发生分解而失去粘结效果，载体基板则可与柔性基板之间发生分离，使得柔性基板从载体基板上剥离的操作简单易行，且成本较低。

Description

用于柔性基板剥离的组合材料及其制备方法、柔性面板的制作方法 技术领域
本发明涉及显示技术领域，尤其涉及一种用于柔性基板剥离的组合材料及其制备方法、柔性面板的制作方法。
 背景技术
柔性显示（Flexible Display）技术在近十年有了飞速地发展，由此带动柔性显示器从屏幕的尺寸到显示的质量都取得了很大进步。柔性显示器又称为可卷曲显示器，是用柔性材料制成可视柔性面板而构成的可弯曲变形的显示装置。与普通的刚性显示器相比，柔性显示器具有诸多优点：耐冲击，抗震能力更强；重量轻、体积小，携带更加方便；采用类似于报纸印刷工艺的卷带式工艺，成本更加低廉等，因此在便携类电子产品领域具有巨大的潜在市场。
柔性基板是整个柔性显示器的重要组成部分，其性能对于柔性显示器的品质与寿命均具有重要的影响。目前，可作为柔性基板的材料包括超薄玻璃、金属箔或聚合物薄膜。聚合物薄膜可以为聚对苯二甲酸乙二醇酯、聚萘二甲酸乙二醇酯、聚碳酸酯、环状聚烯烃、聚醚砜以及聚酰亚胺（polyimide，PI）等。其中，聚酰亚胺基板以其优良的耐高温特性、良好的力学性能以及优良的耐化学稳定性而备受关注。
液晶显示器（Liquid Crystal Display，LCD）、有机发光二极管（Organic Light Emitting Diode，OLED）等显示器均可以实现柔性显示。在柔性器件的制备过程中，如何将柔性基板与载体基板分离是柔性显示技术领域中制备柔性器件的关键技术。现有技术中采用机械剥离或激光剥离技术，激光剥离技术对柔性基板的损伤较小，因此被广泛应用。激光剥离技术是将柔性基板设置于玻璃基板（即以玻璃基板作为载体基板)上，再在柔性基板上制备显示器件，制备完后，再用激光照射玻璃基板和柔性基板的接触界面，从而将柔性基板由玻璃基板分离。但是，以激光照射玻璃基板和柔性基板的接触界面时，能量被柔性基板吸收，使得柔性基板发生烧蚀并放出气体，因此柔性基板的局部会发生膨胀，冷却后形成褶皱，造成产品不良。
 技术问题
本发明的目的在于提供一种用于柔性基板剥离的组合材料，可使得柔性基板从载体基板上剥离的操作简单易行，且成本较低。
本发明的目的还在于提供一种用于柔性基板剥离的组合材料的制备方法，所制备的组合材料可使得柔性基板从载体基板上剥离的操作简单易行，且成本较低。
本发明的目的在于提供一种柔性面板的制作方法，采用上述的组合材料形成临时性的粘结膜层，可使得柔性基板从载体基板上剥离的操作简单易行，且成本较低。
 技术解决方案
为实现上述目的，本发明提供一种用于柔性基板剥离的组合材料，包括混合均匀的粘结剂、无机纳米粒子、聚乙烯醇、去离子水及分散剂；
所述粘结剂为酚醛树脂改性有机硅聚合物；
该用于柔性基板剥离的组合材料随着温度升高因所述粘结剂发生分解而失去粘性。
所述无机纳米粒子为氧化硅纳米粒子、氮化硅纳米粒子或两者的组合。
所述分散剂为聚乙二醇。
所述的用于柔性基板剥离的组合材料中，所述粘结剂、无机纳米粒子、聚乙烯醇、去离子水及分散剂的质量百分比含量分别为1-3%、50-70%、0.3-1%、25-45%、0.5-1.5%。
本发明还提供一种如上所述的用于柔性基板剥离的组合材料的制备方法，包括如下步骤：
步骤a、将无机纳米粒子进行破碎处理；
步骤b、将聚乙烯醇溶解于去离子水中，得到聚乙烯醇溶液；
步骤c、将聚乙烯醇溶液、破碎处理后的无机纳米粒子置于搅拌球磨机中，并添加去离子水、分散剂，进行搅拌球磨处理，得到造粒前驱体浆料；
步骤d、将该造粒前驱体浆料在喷雾干燥造粒塔中进行雾化干燥造粒处理，得到纳米粉体颗粒；
步骤e、将酚醛树脂改性有机硅聚合物溶解于去离子水中，得到粘结剂溶液，将得到的粘结剂溶液、纳米粉体颗粒置于离心密闭容器中，并添加分散剂，进行充分混合，得到用于柔性基板剥离的组合材料。
所述步骤a中，将无机纳米粒子放置在行星球磨机中进行破碎处理，破碎介质为刚玉珠子
所述步骤c中，在进行搅拌球磨处理时搅拌球磨机的转速为200-300r/min，处理时间为1-2h。
所述步骤e中，在进行雾化干燥造粒处理时喷雾干燥造粒塔中的温度为200-250℃。
本发明还提供一种柔性面板的制作方法，包括如下步骤：
步骤S1、提供载体基板及如上所述的用于柔性基板剥离的组合材料，在所述载体基板上涂布所述用于柔性基板剥离的组合材料，得到粘结涂层，然后采用真空干燥和加热的方式去除所述粘结涂层中的去离子水，使所述粘结涂层固化成膜，得到粘结膜层；
步骤S2、在所述粘结膜层上涂布形成柔性基板，在所述柔性基板上形成显示功能层；
步骤S3、对所述粘结膜层进行加热烘烤处理，使该粘结膜层中的粘结剂受热分解，使得该粘结膜层失去粘性，从而所述柔性基板与载体基板发生分离。
所述步骤S3中，对所述粘结膜层进行加热烘烤处理的温度为380-420℃，加热烘烤处理的时间为1.5-2.5h。
 有益效果
本发明的有益效果：本发明提供的一种用于柔性基板剥离的组合材料，包括粘结剂、无机纳米粒子、聚乙烯醇、去离子水及分散剂，所述粘结剂为酚醛树脂改性有机硅聚合物，该组合材料属于一种临时性的粘结材料，其随着温度升高会因所述粘结剂发生分解而失去粘性，从而在柔性面板的制程中，可利用粘结剂与无机纳米粒子间的微粘结作用，实现该组合材料低温下涂覆成膜并保持与载体基板间较强黏附力以方便后续柔性基板及显示功能层的制程，而在高温下经加热处理，由该组合材料所形成的粘结膜层内部因粘结剂发生分解而失去粘结效果，载体基板则可与柔性基板之间发生分离，使得柔性基板从载体基板上剥离的操作简单易行，且成本较低。本发明的用于柔性基板剥离的组合材料的制备方法，所制备的组合材料可使得柔性基板从载体基板上剥离的操作简单易行，且成本较低。本发明的柔性面板的制作方法，采用上述的组合材料在载体基板上形成临时性的粘结膜层，然后在粘结膜层上依次形成柔性基板及显示功能层，最后通过对所述粘结膜层进行加热烘烤处理，使该粘结膜层中的粘结剂受热分解而使得该粘结膜层失去粘性，从使得柔性基板从载体基板上剥离的操作简单易行，且成本较低。
为了能更进一步了解本发明的特征以及技术内容，请参阅以下有关本发明的详细说明与附图，然而附图仅提供参考与说明用，并非用来对本发明加以限制。
 附图说明
下面结合附图，通过对本发明的具体实施方式详细描述，将使本发明的技术方案及其它有益效果显而易见。
附图中，
图1为本发明柔性面板的制作方法的流程示意图；
图2为本发明柔性面板的制作方法的步骤S1的示意图；
图3为本发明柔性面板的制作方法的步骤S2的示意图；
图4为本发明柔性面板的制作方法的步骤S3的示意图。
 本发明的实施方式
为更进一步阐述本发明所采取的技术手段及其效果，以下结合本发明的优选实施例及其附图进行详细描述。
本发明首先提供一种用于柔性基板剥离的组合材料，包括混合的粘结剂、无机纳米粒子、聚乙烯醇（PVE）、去离子水及分散剂。
其中，所述粘结剂为酚醛树脂改性有机硅聚合物；所述无机纳米粒子、聚乙烯醇及部分分散剂共同经过雾化干燥造粒处理而形成纳米粉体颗粒并由该纳米粉体颗粒混合于该用于柔性基板剥离的组合材料中。
该用于柔性基板剥离的组合材料属于一种临时性的粘结材料，随着温度升高会因所述粘结剂发生分解而失去粘性，即在低温下（350℃以下）具有粘结性，而在高温下（400℃左右）会因所述粘结剂发生分解而失去粘性。
具体地，所述无机纳米粒子为氧化硅纳米粒子、氮化硅纳米粒子或两者的组合。
具体地，所述分散剂为聚乙二醇（PEG）。
具体地，所述的用于柔性基板剥离的组合材料中，所述粘结剂、无机纳米粒子、聚乙烯醇、去离子水及分散剂的质量百分比含量分别为1-3%、50-70%、0.3-1%、25-45%、0.5-1.5%。
本发明的用于柔性基板剥离的组合材料，其属于一种临时性的粘结材料，随着温度升高会因其中的粘结剂发生分解而失去粘性，从而在柔性面板的制程中，可利用粘结剂与无机纳米粒子间的微粘结作用，实现该组合材料低温下涂覆成膜并保持与载体基板间较强黏附力以方便后续柔性基板及显示功能层的制程，而在高温下经加热处理，由该组合材料所形成的粘结膜层内部因粘结剂发生分解而失去粘结效果，载体基板则可与柔性基板之间发生分离，使得柔性基板从载体基板上剥离的操作简单易行，且成本较低。
本发明还提供一种如上所述的用于柔性基板剥离的组合材料的制备方法，包括如下步骤：
步骤a、将无机纳米粒子放置于行星球磨机中进行破碎处理，破碎介质为刚玉（高硬度氧化铝）珠子。
步骤b、在60℃±5℃下将聚乙烯醇搅拌溶解于去离子水中，搅拌溶解直至溶液清澈透明，得到聚乙烯醇溶液，时间约为2h。
步骤c、根据喷雾造粒前驱体的制备方法，将得到聚乙烯醇溶液及破碎处理后的无机纳米粒子置于搅拌球磨机中，并添加适量的去离子水以调节固液比例，以及适量的分散剂以保证造粒前驱体浆料成分均一，然后进行搅拌球磨处理，转速为200-300r/min，处理时间为1-2h，得到造粒前驱体浆料。
步骤d、将该造粒前驱体浆料在在精密小型的喷雾干燥造粒塔中进行雾化干燥造粒处理，喷雾干燥造粒塔中的温度为200-250℃，得到纳米级别的纳米粉体颗粒。
步骤e、将酚醛树脂改性有机硅聚合物溶解于去离子水中，得到粘结剂溶液，将得到的粘结剂溶液、雾化干燥造粒处理后的纳米粉体颗粒、分散剂置于离心密闭容器中充分混合，得到黏度较大、具有强粘结性、成分均一的用于柔性基板剥离的组合材料。
本发明的用于柔性基板剥离的组合材料的制备方法，所制备的组合材料可使得柔性基板从载体基板上剥离的操作简单易行，且成本较低。
请参阅图1，基于上述的用于柔性基板剥离的组合材料，本发明还提供一种柔性面板的制作方法，包括如下步骤：
步骤S1、如图2所示，提供载体基板50及如上所述的用于柔性基板剥离的组合材料，在所述载体基板50上涂布所述用于柔性基板剥离的组合材料，得到粘结涂层，然后采用真空干燥（Vacuum Dry，VCD）和200℃±20℃下加热的方式完全去除所述粘结涂层中的去离子水，使水气充分蒸发散失，使所述粘结涂层固化成膜，得到仍具有一定粘结性的粘结膜层65。
步骤S2、如图3所示，在所述粘结膜层65上涂布形成柔性基板10，在所述柔性基板10上形成显示功能层20。
步骤S3、如图4所示，采用单侧加热方式，从载体基板50设有粘结膜层65的一侧于400℃±20℃下对该粘结膜层65进行加热烘烤处理2h±0.5h，使该粘结膜层65中的粘结剂充分受热分解，使得该粘结膜层65失去粘性，从而所述柔性基板10与载体基板50发生分离。
本发明的柔性面板的制作方法，首先采用上述的用于柔性基板剥离的组合材料在载体基板50上形成临时性的粘结膜层65，然后在该粘结膜层65上依次形成柔性基板10及显示功能层20，最后通过对所述粘结膜层65进行加热烘烤处理，使该粘结膜层65中的粘结剂受热分解而使得该粘结膜层65失去粘性，无机纳米粒子之间以及无机纳米粒子与载体基板50之间失去颗粒间微粘结效果，所述柔性基板10与载体基板50发生分离，从使得柔性基板10从载体基板50上剥离的操作简单易行，且成本较低。
综上所述，本发明提供的一种用于柔性基板剥离的组合材料，包括粘结剂、无机纳米粒子、聚乙烯醇、去离子水及分散剂，所述粘结剂为酚醛树脂改性有机硅聚合物，该组合材料属于一种临时性的粘结材料，其随着温度升高会因所述粘结剂发生分解而失去粘性，从而在柔性面板的制程中，可利用粘结剂与无机纳米粒子间的微粘结作用，实现该组合材料低温下涂覆成膜并保持与载体基板间较强黏附力以方便后续柔性基板及显示功能层的制程，而在高温下经加热处理，由该组合材料所形成的粘结膜层内部因粘结剂发生分解而失去粘结效果，载体基板则可与柔性基板之间发生分离，使得柔性基板从载体基板上剥离的操作简单易行，且成本较低。本发明的用于柔性基板剥离的组合材料的制备方法，所制备的组合材料可使得柔性基板从载体基板上剥离的操作简单易行，且成本较低。本发明的柔性面板的制作方法，采用上述的组合材料在载体基板上形成临时性的粘结膜层，然后在粘结膜层上依次形成柔性基板及显示功能层，最后通过对所述粘结膜层进行加热烘烤处理，使该粘结膜层中的粘结剂受热分解而使得该粘结膜层失去粘性，从使得柔性基板从载体基板上剥离的操作简单易行，且成本较低。
以上所述，对于本领域的普通技术人员来说，可以根据本发明的技术方案和技术构思作出其他各种相应的改变和变形，而所有这些改变和变形都应属于本发明权利要求的保护范围。

Claims (13)

  1. 一种用于柔性基板剥离的组合材料，包括粘结剂、无机纳米粒子、聚乙烯醇、去离子水及分散剂；
    所述粘结剂为酚醛树脂改性有机硅聚合物；
    该用于柔性基板剥离的组合材料随着温度升高因所述粘结剂发生分解而失去粘性。
  2. 如权利要求1所述的用于柔性基板剥离的组合材料，其中，所述无机纳米粒子为氧化硅纳米粒子、氮化硅纳米粒子或两者的组合。
  3. 如权利要求1所述的用于柔性基板剥离的组合材料，其中，所述分散剂为聚乙二醇。
  4. 如权利要求1所述的用于柔性基板剥离的组合材料，其中，所述粘结剂、无机纳米粒子、聚乙烯醇、去离子水及分散剂的质量百分比含量分别为1-3%、50-70%、0.3-1%、25-45%、0.5-1.5%。
  5. 一种用于柔性基板剥离的组合材料的制备方法，所述用于柔性基板剥离的组合材料包括粘结剂、无机纳米粒子、聚乙烯醇、去离子水及分散剂，所述粘结剂为酚醛树脂改性有机硅聚合物，该用于柔性基板剥离的组合材料随着温度升高因所述粘结剂发生分解而失去粘性；所述用于柔性基板剥离的组合材料的制备方法包括如下步骤：
    步骤a、将无机纳米粒子进行破碎处理；
    步骤b、将聚乙烯醇溶解于去离子水中，得到聚乙烯醇溶液；
    步骤c、将聚乙烯醇溶液、破碎处理后的无机纳米粒子置于搅拌球磨机中，并添加去离子水、分散剂，进行搅拌球磨处理，得到造粒前驱体浆料；
    步骤d、将该造粒前驱体浆料在喷雾干燥造粒塔中进行雾化干燥造粒处理，得到纳米粉体颗粒；
    步骤e、将酚醛树脂改性有机硅聚合物溶解于去离子水中，得到粘结剂溶液，将得到的粘结剂溶液、纳米粉体颗粒置于离心密闭容器中，并添加分散剂，进行充分混合，得到用于柔性基板剥离的组合材料。
  6. 如权利要求5所述的用于柔性基板剥离的组合材料的制备方法，其中，所述步骤a中，将无机纳米粒子放置在行星球磨机中进行破碎处理，破碎介质为刚玉珠子。
  7. 如权利要求5所述的用于柔性基板剥离的组合材料的制备方法，其中，所述步骤c中，在进行搅拌球磨处理时搅拌球磨机的转速为200-300r/min，处理时间为1-2h。
  8. 如权利要求5所述的用于柔性基板剥离的组合材料的制备方法，其中，所述步骤e中，在进行雾化干燥造粒处理时喷雾干燥造粒塔中的温度为200-250℃。
  9. 一种柔性面板的制作方法，包括如下步骤：
    步骤S1、提供载体基板及用于柔性基板剥离的组合材料，所述用于柔性基板剥离的组合材料包括粘结剂、无机纳米粒子、聚乙烯醇、去离子水及分散剂，所述粘结剂为酚醛树脂改性有机硅聚合物，该用于柔性基板剥离的组合材料随着温度升高因所述粘结剂发生分解而失去粘性；在所述载体基板上涂布所述用于柔性基板剥离的组合材料，得到粘结涂层，然后采用真空干燥和加热的方式去除所述粘结涂层中的去离子水，使所述粘结涂层固化成膜，得到粘结膜层；
    步骤S2、在所述粘结膜层上涂布形成柔性基板，在所述柔性基板上形成显示功能层；
    步骤S3、对所述粘结膜层进行加热烘烤处理，使该粘结膜层中的粘结剂受热分解，使得该粘结膜层失去粘性，从而所述柔性基板与载体基板发生分离。
  10. 如权利要求9所述的柔性面板的制作方法，其中，所述步骤S3中，对所述粘结膜层进行加热烘烤处理的温度为380-420℃，加热烘烤处理的时间为1.5-2.5h。
  11. 如权利要求9所述的柔性面板的制作方法，其中，所述无机纳米粒子为氧化硅纳米粒子、氮化硅纳米粒子或两者的组合。
  12. 如权利要求9所述的柔性面板的制作方法，其中，所述分散剂为聚乙二醇。
  13. 如权利要求9所述的柔性面板的制作方法，其中，所述用于柔性基板剥离的组合材料中所述粘结剂、无机纳米粒子、聚乙烯醇、去离子水及分散剂的质量百分比含量分别为1-3%、50-70%、0.3-1%、25-45%、0.5-1.5%。
PCT/CN2019/102091 2019-05-06 2019-08-22 用于柔性基板剥离的组合材料及其制备方法、柔性面板的制作方法 WO2020224093A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201910372889.9 2019-05-06
CN201910372889.9A CN110093141A (zh) 2019-05-06 2019-05-06 用于柔性基板剥离的组合材料及其制备方法、柔性面板的制作方法

Publications (1)

Publication Number Publication Date
WO2020224093A1 true WO2020224093A1 (zh) 2020-11-12

Family

ID=67446981

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2019/102091 WO2020224093A1 (zh) 2019-05-06 2019-08-22 用于柔性基板剥离的组合材料及其制备方法、柔性面板的制作方法

Country Status (2)

Country Link
CN (1) CN110093141A (zh)
WO (1) WO2020224093A1 (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110093141A (zh) * 2019-05-06 2019-08-06 深圳市华星光电技术有限公司 用于柔性基板剥离的组合材料及其制备方法、柔性面板的制作方法
CN110580855B (zh) * 2019-09-17 2022-08-30 合肥鑫晟光电科技有限公司 覆晶薄膜、覆晶薄膜基板及其制作方法、显示装置
CN110739337B (zh) * 2019-10-24 2022-06-17 云谷（固安）科技有限公司 柔性基板、显示面板及显示面板的制备方法
CN111574379A (zh) * 2020-05-13 2020-08-25 深圳市华星光电半导体显示技术有限公司 一种水凝胶及制备方法、柔性面板及制备方法
CN112261792B (zh) * 2020-11-03 2022-02-08 生益电子股份有限公司 一种改善钻孔毛刺的pcb制作方法及pcb
CN112365805B (zh) * 2020-12-09 2022-07-26 合肥维信诺科技有限公司 盖板和显示模组的制作方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102358827A (zh) * 2011-09-15 2012-02-22 大连佳瑞隆科技有限公司 新型粘合剂
CN103413775A (zh) * 2013-07-19 2013-11-27 京东方科技集团股份有限公司 一种柔性显示器件的制备方法及装置
CN105419720A (zh) * 2015-12-11 2016-03-23 北京航空航天大学 一种纳米粒子改性粘结剂、制备方法及使用方法
WO2018039897A1 (en) * 2016-08-30 2018-03-08 Henkel IP & Holding GmbH Light stable adhesive compositions with high refractive index and assemblies, articles, light emitting elements thereof
CN109517520A (zh) * 2018-11-23 2019-03-26 航天特种材料及工艺技术研究所 一种气凝胶涂料、气凝胶涂层及由气凝胶涂料制备气凝胶涂层的方法
CN110093141A (zh) * 2019-05-06 2019-08-06 深圳市华星光电技术有限公司 用于柔性基板剥离的组合材料及其制备方法、柔性面板的制作方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108059942A (zh) * 2017-12-27 2018-05-22 成都新柯力化工科技有限公司 一种用于电器设备的复合绝缘粘结剂及其制备方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102358827A (zh) * 2011-09-15 2012-02-22 大连佳瑞隆科技有限公司 新型粘合剂
CN103413775A (zh) * 2013-07-19 2013-11-27 京东方科技集团股份有限公司 一种柔性显示器件的制备方法及装置
CN105419720A (zh) * 2015-12-11 2016-03-23 北京航空航天大学 一种纳米粒子改性粘结剂、制备方法及使用方法
WO2018039897A1 (en) * 2016-08-30 2018-03-08 Henkel IP & Holding GmbH Light stable adhesive compositions with high refractive index and assemblies, articles, light emitting elements thereof
CN109517520A (zh) * 2018-11-23 2019-03-26 航天特种材料及工艺技术研究所 一种气凝胶涂料、气凝胶涂层及由气凝胶涂料制备气凝胶涂层的方法
CN110093141A (zh) * 2019-05-06 2019-08-06 深圳市华星光电技术有限公司 用于柔性基板剥离的组合材料及其制备方法、柔性面板的制作方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
BA, DE-MA ET AL.: "The progress and current situation of heat-resisting organic adhesives", CHINA SURFACE ENGINEERING, vol. 2, pages 1 - 5, XP055751399 *

Also Published As

Publication number Publication date
CN110093141A (zh) 2019-08-06

Similar Documents

Publication Publication Date Title
WO2020224093A1 (zh) 用于柔性基板剥离的组合材料及其制备方法、柔性面板的制作方法
WO2016176895A1 (zh) 石墨烯基树脂球及其导电框胶的制备方法
WO2022027769A1 (zh) 偶氮苯衍生物及其制备方法以及偶氮苯基光控可逆粘合剂及其使用方法
CN111286054B (zh) 一种聚4-甲基戊烯与SiO2微球复合薄膜及其制备方法
CN108410016A (zh) 一种改性钛酸钡纳米颗粒及其制备方法和一种改性聚合物复合薄膜及其制备方法
US20120237692A1 (en) Effective coating method for plate type nano materials on large area substrate
JP2019192598A (ja) 硫化物固体電解質の製造方法
WO2005022559A1 (ja) 転写用導電性フィルム、それを用いた透明導電膜の形成方法及び透明導電膜
WO2020258490A1 (zh) 一种钙钛矿膜及其制备方法
WO2021218958A1 (zh) 导电浆料、制备方法及导电薄膜制备方法
CN107768298B (zh) 一种用于柔性tft制备的复合基板及柔性面板的制备方法
CN105925978B (zh) 一种铝基复合材料基板及其制备方法
TWI684297B (zh) 半導體膜之製造方法、及染料敏化太陽電池
CN108975316A (zh) 一种石墨烯薄膜的制备方法
KR20090000355A (ko) 분무열분해를 이용한 알루미늄 도핑된 산화아연 스퍼터링타겟의 제조방법
JP2004123454A (ja) シリカ粒子およびその製造方法
WO2016107146A1 (zh) 一种用于薄晶圆加工的临时键合胶及其制备方法
CN109437585B (zh) 一种防滑玻璃的制作方法
CN113526496A (zh) 一种层数可控、可被溶解的单层石墨烯制备方法
WO2021004024A1 (zh) 显示面板及其制造方法
CN106328829B (zh) 一种amoled显示器中柔性基板的制作方法
TWI722373B (zh) 光可偵測熱解感壓膠及其應用
JP2013209484A (ja) 粘着剤組成物、フィルム状粘着剤及び被着体の剥離方法
CN107201074B (zh) 激光活化剂及其制备方法、含激光活化剂的浆料及其制备方法和挠性电路板的制备方法
JP2005125169A (ja) 表面処理方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19928215

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 19928215

Country of ref document: EP

Kind code of ref document: A1