WO2017118217A1 - 基板结构及其柔性基板的贴附方法、剥离方法 - Google Patents

基板结构及其柔性基板的贴附方法、剥离方法 Download PDF

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WO2017118217A1
WO2017118217A1 PCT/CN2016/105511 CN2016105511W WO2017118217A1 WO 2017118217 A1 WO2017118217 A1 WO 2017118217A1 CN 2016105511 W CN2016105511 W CN 2016105511W WO 2017118217 A1 WO2017118217 A1 WO 2017118217A1
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layer
substrate
electroadhesive
adhesive
carrier substrate
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PCT/CN2016/105511
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English (en)
French (fr)
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邢建国
王贺陶
晏斌
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京东方科技集团股份有限公司
北京京东方显示技术有限公司
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Priority to US15/539,854 priority Critical patent/US10500816B2/en
Publication of WO2017118217A1 publication Critical patent/WO2017118217A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
    • H01L21/76251—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/7806—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices involving the separation of the active layers from a substrate
    • H01L21/7813—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices involving the separation of the active layers from a substrate leaving a reusable substrate, e.g. epitaxial lift off
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B2037/148—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers whereby layers material is selected in order to facilitate recycling of the laminate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/204—Di-electric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates

Definitions

  • Embodiments of the present disclosure relate to a substrate structure and a method of attaching and peeling the same.
  • the flexible display device uses a flexible, flexible substrate made of a soft material, which is deformable and bendable, and has the advantages of being light and thin, and easy to carry.
  • the flexible substrate is usually fixed on a rigid carrier substrate, but the attaching process of the flexible substrate is complicated, and it is difficult to peel off the fabricated flexible substrate, which severely limits the development of the flexible display device.
  • an adhesive substrate such as a double-sided tape
  • the raw material of the flexible substrate is directly coated on the carrier substrate, and after forming, the flexible substrate is formed, and the flexible substrate is peeled off from the carrier substrate after the device is fabricated on the flexible substrate.
  • the above methods respectively have the following defects: First, the flexible substrate is attached to the carrier substrate with an adhesive, and the device is peeled off after completion, and it is difficult to remove the prepared flexible substrate from the carrier substrate or have residual glue; The raw material of the substrate is coated on the carrier substrate, and the device is peeled off after the fabrication is completed. This method makes it difficult to fix the flexible substrate on the carrier substrate, and the method of coating the raw material and the stripping method are costly.
  • At least one embodiment of the present disclosure provides a substrate structure including: a carrier substrate and a flexible substrate disposed on the carrier substrate, further comprising one or more side-by-side arrangements sandwiched between the carrier substrate and the flexible substrate The adhesive layer; wherein the adhesive layer has an electro-adhesive layer whose adhesive strength changes under the action of an electric field, the electro-adhesive layer being disposed on a surface of the adhesive layer in contact with the flexible substrate.
  • the bonding layer further includes a substrate and a binder; A substrate is interposed between the electroadhesive layer and the adhesive, and the adhesive is disposed on a surface of the adhesive layer that is in contact with the carrier substrate.
  • the binder is an electroadhesive layer.
  • the electroadhesive layer is switched from a liquid state to a solid state under an electric field; the viscous strength of the electroadhesive layer in a solid state is greater than that of the electroadhesive layer in a liquid state Viscosity strength.
  • the electroadhesive layer includes solid particles and an insulating liquid; wherein the solid particles have a dielectric constant greater than a dielectric constant of the insulating liquid.
  • the material of the solid particles includes at least one of a silica gel, an aluminosilicate, a composite metal oxide, a composite metal hydroxide, and a polymer semiconductor material.
  • the insulating liquid is silicone oil, cooking oil or mineral oil.
  • the substrate is made of polyvinyl chloride, acryl, glass or polyester.
  • At least one embodiment of the present disclosure also provides a method of attaching a flexible substrate and a carrier substrate of the above substrate structure, comprising: attaching an adhesive layer on a carrier substrate; the bonding layer being included in an adhesive strength at an electric field An electro-adhesive layer that changes under action; attaching a flexible substrate to the electro-adhesive layer; and applying an electric field to the adhesive layer to fix the flexible substrate on the carrier substrate through the adhesive layer .
  • attaching the bonding layer to the carrier substrate includes attaching the bonding layer to the carrier substrate through an adhesive in the bonding layer.
  • the binder is the electroadhesive layer.
  • an electric field is applied to the electroadhesive layer, the electroadhesive layer is converted from a liquid state to a solid state; wherein the electroviscous layer has a viscous strength in a solid state greater than the electricity The viscous strength of the adhesive layer in the liquid state.
  • At least one embodiment of the present disclosure also provides a method of peeling a flexible substrate in the above substrate structure from a carrier substrate, comprising: stopping application of the flexible substrate to the bonding layer after being fixed to the carrier substrate by an adhesive layer An electric field; the bonding layer includes an electroadhesive layer whose viscous strength changes under the action of an electric field; after the application of the electric field is stopped, the flexible substrate is removed from the electroadhesive layer in the bonding layer Stripped.
  • the stripping method further includes peeling the carrier substrate from the adhesive in the bonding layer.
  • the binder is the electroadhesive layer.
  • the method includes: stopping application of an electric field to the bonding layer, the electro-adhesive layer being converted from a solid state to a liquid state; wherein the electro-viscous layer in the solid state The viscous strength in the solid state is greater than the viscous strength of the electroadhesive layer in the liquid state.
  • At least one embodiment of the present disclosure also provides a substrate structure including: a carrier substrate, a flexible substrate disposed on the carrier substrate, and further comprising: one or more sandwiched between the carrier substrate and the flexible substrate
  • the adhesive layer is disposed side by side; wherein the adhesive layer has an electroadhesive layer disposed on a surface of the adhesive layer in contact with the flexible substrate, and the adhesive strength thereof is changed by an electric field.
  • the electro-adhesive layer whose adhesive strength can be changed under the action of an electric field is disposed on the flexible substrate side in the substrate structure, in the manufacturing process of the flexible substrate, only the electric Applying an electric field to the adhesive layer, the flexible substrate can be attached to the carrier substrate, and the application of an electric field to the electro-adhesive layer can be stopped, and the flexible substrate can be peeled off from the carrier substrate, and the carrier substrate and the adhesive layer can be Can be recycled.
  • FIG. 1 is a schematic structural view of a substrate structure according to an embodiment of the present disclosure
  • FIG. 2 is a schematic structural view of a substrate structure according to another embodiment of the present disclosure.
  • FIG. 3 is a schematic structural view of a substrate structure according to still another embodiment of the present disclosure.
  • FIG. 4 is a flow chart of a method of attaching a flexible substrate according to an embodiment of the present disclosure
  • FIG. 5 is a flow chart of a peeling method of a flexible substrate according to an embodiment of the present disclosure.
  • At least one embodiment of the present disclosure provides a substrate structure, as shown in FIGS. 1 to 3, including: a carrier substrate 1, a flexible substrate 2 disposed on the carrier substrate 1, and further comprising: a carrier substrate 1 and a flexible One or more adhesive layers 3 disposed side by side between the substrates 2; the adhesive layer 3 includes an electroadhesive layer 31 disposed on the adhesive layer 3 in contact with the flexible substrate 2 On the surface, its viscous strength changes under the action of an electric field.
  • the flexible substrate can be attached to the carrier substrate by applying an electric field to the electro-adhesive layer, and the application of the electric field to the electro-adhesive layer can be stopped, and the flexible substrate can be removed from the carrier.
  • the substrate is peeled off, and the carrier substrate and the bonding layer can be recycled.
  • the carrier substrate is a rigid glass substrate.
  • the electroadhesive layer may be switched from a liquid state to a solid state under the action of an electric field; the viscous strength of the electroadhesive layer in a solid state is greater than the electroviscous layer in a liquid state
  • the viscous strength that is, the electroadhesive layer, can be converted from a suspension having a low viscosity to an adherent solid having a high viscosity by an electric field.
  • the process in which the electroadhesive layer can be switched from a liquid state to a solid state under the action of an electric field is a reversible process, and after the application of the electric field is stopped, the electro-viscous layer is converted from a solid state to a liquid state, and the viscosity strength thereof is a low viscosity. .
  • the greater the applied electric field strength the greater the viscous strength of the electroadhesive layer after it is converted to a solid state.
  • the electric field strength is 0, and the electro-viscous layer is in a liquid state; after the electric field is applied, the electro-viscous layer is converted from a liquid state to a solid state by an electric field, and the electric field applied is larger, the electro-viscous layer The greater the viscous strength when converted to a solid state.
  • An electric field of different strength may be applied to the electroadhesive layer, and the electroadhesive layer is adjusted to be solid Stickiness in the state.
  • the carrier substrate 1 and the flexible substrate 2 have only one layer of electro-adhesive layer 31, and since the electro-adhesive layer 31 has good fluidity in a liquid state, it is easy to apply to The back side or boundary area of the carrier substrate.
  • the bonding layer may be provided in a three-layer structure.
  • the adhesive layer 3 further includes a substrate 32 and an adhesive 33; the adhesive 33 is disposed on the side of the adhesive layer 3 in contact with the carrier substrate 1; and the electro-adhesive layer 31 is disposed on the adhesive layer.
  • the substrate 32 is sandwiched between the electroadhesive layer 31 and the adhesive 33.
  • the adhesive 33 may be a double-sided adhesive, and the adhesive layer and the carrier substrate may be recycled as a whole; the adhesive 33 may also be an electro-adhesive layer. As shown in FIGS. 2 and 3, when the adhesive 33 is selected as an electroadhesive layer whose adhesive strength can be changed under the action of an electric field, the carrier substrate can be separately recycled because the electroviscous liquid is easily removed.
  • the electroadhesive layer is a very viscous suspension under normal conditions (ie, without application of an electric field), and is composed of solid particles uniformly dispersed in an insulating liquid; The dielectric constant of the solid particles is greater than the dielectric constant of the insulating liquid.
  • the material of the solid particles may be selected as an inorganic material, a polymer material, and a composite material; the composite material may be composited from different inorganic materials, composited from different polymer materials, or inorganic materials and polymer materials.
  • the composite is made up.
  • the material of the solid fine particles includes at least one of a silica gel, an aluminosilicate, a composite metal oxide, a composite metal hydroxide, and a polymer semiconductor material.
  • the selection of the solid particulate material may be determined according to actual conditions, which is not limited in the present disclosure.
  • the insulating liquid may be selected as a material having a high boiling point, stability, and corrosion resistance, and the insulating liquid may be selected from at least one of silicone oil, edible oil, and mineral oil.
  • the selection of the insulating liquid material may be determined according to actual conditions, which is not limited in the present disclosure.
  • the material of the substrate may be set to polyvinyl chloride (PVC), acrylic (also known as polymethyl methacrylate, PMMA), glass or polyester-based materials.
  • PVC polyvinyl chloride
  • acrylic also known as polymethyl methacrylate, PMMA
  • polyester-based materials This substrate can reduce costs while avoiding contamination of the substrate.
  • At least one embodiment of the present disclosure also provides a flexibility
  • a method of attaching a substrate to the carrier substrate, the principle of which solves the problem is similar to the structure of the substrate.
  • the implementation of the method can be referred to the implementation of the substrate structure, and the repeated description is omitted.
  • a method of attaching the flexible substrate to the carrier substrate includes: attaching the adhesive layer to a carrier substrate; the bonding layer includes An electroadhesive layer having an adhesive strength that changes under an electric field; attaching the flexible substrate to the electroadhesive layer; and applying an electric field to the bonding layer to fix the flexible substrate through the bonding layer On the carrier substrate.
  • the flexible substrate is attached to an electroadhesive layer whose adhesive strength can be changed under the action of an electric field, and an electric field of different strength is applied to adjust the adhesive strength of the electroadhesive layer, and the flexible substrate and the carrier can be The substrate is fixed together, and the attachment method is simple and convenient.
  • attaching the bonding layer to the carrier substrate can be accomplished by attaching the bonding layer to the carrier substrate through an adhesive in the bonding layer.
  • the adhesive layer may be separately prepared, and an adhesive is separately disposed on opposite surfaces of the substrate, and the adhesive layer is configured as a three-layer structure, and the substrate is disposed on a surface in contact with the flexible substrate.
  • the binder is an electroadhesive layer and the binder on the surface of the substrate in contact with the carrier substrate can be a variety of forms of binder. In this way, the bonding layer can be directly attached to the carrier substrate without the step of coating the electro-adhesive layer on the carrier substrate, which simplifies the manufacturing process and reduces the cost.
  • the adhesive disposed on the surface of the substrate in contact with the carrier substrate may also be provided as an electroadhesive layer. Since the electroviscous liquid is easily removed, the carrier substrate can be recycled separately.
  • an electric field is applied to the electro-adhesive layer, the electro-adhesive layer is converted from a liquid state to a solid state; wherein the electro-viscous layer has a viscosity strength in a solid state greater than the electro-viscosity The viscous strength of the layer in the liquid state.
  • the electro-viscous liquid layer is changed from a suspension having a low viscosity to a slim solid having a high viscosity, and the flexible substrate and the glass substrate are fixed together.
  • At least one embodiment of the present disclosure further provides a method for peeling the flexible substrate from the substrate structure. Since the principle of solving the problem is similar to the substrate structure, the implementation of the method may be See the implementation of the substrate structure, and the repeated description will not be repeated.
  • the method of peeling the flexible substrate from the substrate structure includes: after the flexible substrate is fixed on the carrier substrate by the adhesive layer, Stopping applying an electric field to the bonding layer; the bonding layer includes the electro-viscous layer whose viscous strength changes under the action of an electric field; after the electro-adhesive layer is converted into a liquid state, the flexible substrate is removed from the Peeling on the electroadhesive layer in the bonding layer.
  • the high viscosity of the electroadhesive layer becomes a low viscosity, and peeling off the flexible substrate can be performed.
  • the method is simple and convenient, and can not damage the flexible substrate when it is peeled off, and the adhesive layer and the carrier substrate can be recycled, and the electro-adhesive layer is easily removed without causing pollution.
  • the peeling method of the flexible substrate from the substrate structure may further include: peeling the carrier substrate from the adhesive in the adhesive layer.
  • the viscosity of the electroadhesive layer is lowered after the application of the electric field is stopped, so as to perform peeling off of the carrier substrate, and
  • the carrier substrate can be recycled separately.
  • the electro-viscous layer is converted from a solid state to a liquid state after stopping application of an electric field to the bonding layer; wherein the electroviscous layer has a viscosity strength greater than that in a solid state The viscous strength of the electroadhesive layer in a liquid state. After the application of the electric field is stopped, the electroadhesive layer is changed from a viscous solid having a high viscosity to a suspension having a low viscosity to facilitate peeling of the flexible substrate.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

一种基板结构，以及贴附柔性基板和剥离柔性基板的方法。基板结构包括载体基板(1)以及设置在载体基板(1)上的柔性基板(2)，还包括：夹在载体基板(1)和柔性基板(2)之间的一个或多个并排设置的粘结层(3)；粘结层(3)包括粘性强度在电场的作用下改变的电粘性层(31)；电粘性层(31)设置在粘结层(3)与柔性基板(2)接触的表面上。

Description

基板结构及其柔性基板的贴附方法、剥离方法 技术领域
本公开的实施例涉及一种基板结构及其柔性基板的贴附方法和剥离方法。
背景技术
近年来，作为下一代显示技术，柔性显示技术得到飞快的发展。柔性显示器件使用一种由柔软材料制成的可卷曲的柔性基板，可变形可弯曲，且具有轻薄，携带方便等优点。
目前，通常将柔性基板固定到刚性的载体基板上制作，但柔性基板的贴附工艺较为复杂，且不易将制作完成的柔性基板剥离，这严重限制了柔性显示器件的发展。目前把柔性基板固定到载体基板的方法很多，大致可以分成两类：其一，用粘合剂，如双面胶，将柔性基板贴附到载体基板上，器件制作完成后剥离；其二，直接将柔性基板的原材料涂覆在载体基板上，经过定型后形成柔性基板，在柔性基板上制作完成器件之后将柔性基板从载体基板上剥离。上述方法分别存在如下缺陷：一、用粘合剂将柔性基板贴附到载体基板上，器件完成后剥离，不易将制备完成的柔性基板从载体基板取下或者有胶残留；二、直接将柔性基板的原材料涂覆在载体基板上，器件制作完成后剥离，该方法使柔性基板固定在载体基板上较为困难，且涂覆原材料的方法和剥离方法成本较高。
发明内容
本公开的至少一个实施例提供了一种基板结构，包括：载体基板以及设置在所述载体基板上的柔性基板，还包括夹在所述载体基板和柔性基板之间的一个或多个并排设置的粘结层；其中，所述粘结层具有粘性强度在电场的作用下改变的电粘性层，所述电粘性层设置在所述粘结层与柔性基板接触的表面上。
在根据本公开的一个实施例中，所述粘结层还包括基材和粘结剂；所述 基材夹设在所述电粘性层和所述粘结剂之间，所述粘结剂设置在所述粘接层与所述载体基板接触的表面上。
在根据本公开的一个实施例中，所述粘结剂为电粘性层。
在根据本公开的一个实施例中，所述电粘性层在电场作用下从液体状态转换至固体状态；所述电粘性层在固体状态下的粘性强度大于所述电粘性层在液体状态下的粘性强度。
在根据本公开的一个实施例中，电场强度越大，所述电粘性层的粘性强度越大。
在根据本公开的一个实施例中，所述电粘性层包括固体微粒和绝缘液体；其中，所述固体微粒的介电常数大于所述绝缘液体的介电常数。
在根据本公开的一个实施例中，所述固体微粒的材料包括硅胶、硅铝酸盐、复合金属氧化物、复合金属氢氧化物、高分子半导体材料中的至少之一。
在根据本公开的一个实施例中，所述绝缘液体为硅油、食油或矿物油。
在根据本公开的一个实施例中，所述基材由聚氯乙烯、亚克力、玻璃或聚酯类制成。
本公开的至少一个实施例还提供了一种贴附上述基板结构的柔性基板和载体基板的方法，包括：将粘结层贴附在载体基板上；所述粘结层包括在粘性强度在电场作用下改变的电粘性层；将柔性基板贴附在所述电粘性层上；以及对所述粘结层施加电场，以使所述柔性基板通过所述粘结层固定在所述载体基板上。
在根据本公开的一个实施例中，将粘结层贴附在载体基板上，包括：将粘结层通过所述粘结层中的粘结剂贴附在载体基板上。
在根据本公开的一个实施例中，所述粘结剂为所述电粘性层。
在根据本公开的一个实施例中，对所述电粘性层施加电场，所述电粘性层由液体状态转换为固体状态；其中，所述电粘性层在固体状态下的粘性强度大于所述电粘性层在液体状态下的粘性强度。
本公开的至少一个实施例还提供了一种将上述基板结构中的柔性基板从载体基板剥离的方法，包括：在柔性基板通过粘结层固定在载体基板后，停止向所述粘结层施加电场；所述粘结层包括在电场的作用下粘性强度变化的电粘性层；停止施加电场后，将所述柔性基板从所述粘结层中的电粘性层上 剥离。
在根据本公开的一个实施例中，所述剥离方法还包括：将所述载体基板从所述粘结层中的粘结剂上剥离。
在根据本公开的一个实施例中，所述粘结剂为所述电粘性层。
在根据本公开的一个实施例中，所述方法包括：停止向所述粘结层施加电场，所述电粘性层由固体状态向液体状态转化；其中，所述固体状态的所述电粘性层在固体状态下的粘性强度大于所述电粘性层在液体状态下的粘性强度。
本公开的至少一个实施例还提供了一种基板结构，包括：载体基板，设置在所述载体基板上的柔性基板，还包括：夹在所述载体基板和柔性基板之间的一个或多个并排设置的粘结层；其中，所述粘结层具有电粘性层，所述电粘性层设置在所述粘结层与柔性基板接触的表面上，其粘性强度在电场的作用下改变。
在本公开的实施例中，由于该基板结构中在柔性基板一侧设置了在电场的作用下粘性强度可以改变的电粘性层，这样，在柔性基板的制作过程中，只需对所述电粘性层施加电场，就可以将柔性基板贴附在所述载体基板上，停止对所述电粘性层施加电场，就可以将所述柔性基板从所述载体基板剥离，且载体基板和粘结层可以回收利用。
附图说明
为了更清楚地说明本公开实施例的技术方案，下面将对实施例的附图作简单地介绍，显而易见地，下面描述中的附图仅仅涉及本公开的一些实施例，而非对本公开的限制。
图1为根据本公开的一个实施例的基板结构的结构示意图；
图2为根据本公开的另一个实施例的基板结构的结构示意图；
图3为根据本公开的又一个实施例的基板结构的结构示意图；
图4为根据本公开的一个实施例的柔性基板的贴附方法流程图；以及
图5为根据本公开的一个实施例的柔性基板的剥离方法流程图。
具体实施方式
为使本公开实施例的目的、技术方案和优点更加清楚，下面将结合本公开实施例的附图，对本公开实施例的技术方案进行清楚、完整地描述。显然，所描述的实施例是本公开的一部分实施例，而不是全部的实施例。基于所描述的本公开的实施例，本领域普通技术人员在无需创造性劳动的前提下所获得的所有其他实施例，都属于本公开保护的范围。
附图中各膜层的厚度和形状不反映基板结构的真实比例，目的只是示意说明本公开的内容。
本公开的至少一个实施例提供了一种基板结构，如图1至图3所示，包括：载体基板1，设置在载体基板1上的柔性基板2，还包括：夹在载体基板1和柔性基板2之间的一个或多个并排设置的粘结层3；所述粘结层3包括电粘性层31，所述电粘性层31设置在所述粘结层3与所述柔性基板2接触的表面上，其粘性强度在电场作用下改变。
在根据本公开的一个实施例的上述基板结构中，由于在所述粘性层与所述柔性基板接触的表面上设置了粘性强度在电场作用下可以改变的电粘性层，这样，在柔性基板的制作过程中，只需对所述电粘性层施加电场，就可以将柔性基板贴附在所述载体基板上，停止对所述电粘性层施加电场，就可以将所述柔性基板从所述载体基板剥离，且载体基板和粘结层可以回收利用。
在根据本公开的一个实施例中，所述载体基板为刚性玻璃基板。
在本公开的一个实施例中，所述电粘性层在电场的作用下可以从液体状态转换至固体状态；所述电粘性层在固体状态下的粘性强度大于所述电粘性层在液体状态下的粘性强度，即电粘性层可以在电场的作用下从具有低粘度的悬浮液转换成具有高粘度的粘体固体。
所述电粘性层在电场的作用下可以从液体状态转换至固体状态的过程是一个可逆过程，在停止施加电场之后，所述电粘性层从固体状态转换为液体状态，其粘性强度为低粘度。
在本公开的一个实施例中，当施加的电场强度越大时，在所述电粘性层转换成固体状态后，其粘性强度越大。当未施加电场时，即电场强度为0，电粘性层为液体状态；在施加电场后，所述电粘性层在电场作用下由液体状态转换为固体状态，施加的电场越大，电粘性层转换为固体状态时的粘性强度越大。可对所述电粘性层施加不同强度的电场，调节所述电粘性层在固体 状态下的粘性。
如图1所示，在本公开的一个实施例中，载体基板1和柔性基板2只具有一层电粘性层31，由于该电粘性层31在液体状态时流动性较好，容易涂覆到载体基板背面或边界区域。
在本公开的一个实施例中，粘结层可以设置为三层结构。如图2和图3所示，粘结层3还包括基材32和粘结剂33；粘结剂33设置在粘结层3与载体基板1接触的侧面上；电粘性层31设置在粘结层3与所述柔性基板2接触的侧面上，基材32夹在电粘性层31和粘结剂33之间。这样，该粘结层可以单独制作，然后直接贴附在载体基板上，无需在载体基板上进行涂覆电粘性层的步骤，简化了制作工艺，降低了成本。
进一步地，在本公开的一个实施例中，粘结剂33可以为双面胶，此时粘结层与载体基板可以作为一个整体进行回收利用；该粘结剂33也可以为电粘性层，如图2和图3所示，当粘结剂33选择为粘性强度在电场作用下可以改变的电粘性层时，由于电粘性液体容易清除，载体基板可以单独回收利用。
在本公开的一个实施例中，电粘性层在通常条件下(即，不被施加电场的情况下)是一种粘性极低的悬浮液，由固体微粒均匀分散在绝缘液体中组成；其中，固体微粒的介电常数大于绝缘液体的介电常数。
进一步地，固体微粒的材料可以选择为无机材料、高分子材料和复合材料；该复合材料可以由不同的无机材料复合而成、由不同的高分子材料复合而成、或者无机材料和高分子材料的复合而成等。该固体微粒的材料包括硅胶、硅铝酸盐、复合金属氧化物、复合金属氢氧化物、高分子半导体材料中的至少一个。对于固体微粒材料的选择可以根据实际情况而定，本公开对此不做限定。
绝缘液体可以选择为具有较高的沸点，稳定性、抗腐蚀性好的材料，此时绝缘液体可以选择为硅油、食油和矿物油中的至少之一。对于绝缘液体材料的选择可以根据实际情况而定，本公开对此不做限定。
在本公开的一个实施例中，基材的材料可以设置为聚氯乙烯(Polyvinyl chloride，PVC)、亚克力(又称聚甲基丙烯酸甲酯，PMMA)、玻璃或聚酯类材料。这种基材可以降低成本，同时避免对基板的污染。
基于同一发明构思，本公开的至少一个实施例还提供了一种将所述柔性 基板贴附至所述载体基板的方法，该方法解决问题的原理与上述基板结构相似，该方法的实施可以参见基板结构的实施，重复之处不再赘述。
在本公开的一个实施例中，如图4所示，将所述柔性基板贴附至所述载体基板的方法包括：将所述粘结层贴附在载体基板上；所述粘结层包括粘性强度在电场作用下改变的电粘性层；将所述柔性基板贴附在所述电粘性层上；以及对所述粘结层施加电场，以通过所述粘结层将所述柔性基板固定在载体基板上。
在上述贴附方法中，所述柔性基板贴附在粘性强度在电场的作用下可以改变的电粘性层上，施加不同强度的电场，可以调节电粘性层的粘性强度，可以将柔性基板和载体基板固定到一起，此贴附方法简单便利。
在本公开的一个实施例中，将粘结层贴附在载体基板上，可以采用如下方式实现：将粘结层通过粘结层中的粘结剂贴附在载体基板上。
需要说明的是，该粘结层可以单独制作，在基材相对的两个表面上分别设置粘结剂，将该粘结层构造为三层结构，基材与柔性基板接触的表面上设置的粘结剂为电粘性层，基材与载体基板接触的表面上的粘结剂可以为多种形式的粘结剂。这样，该粘结层可以直接贴附在载体基板上，无需在载体基板上进行涂覆电粘性层的步骤，简化了制作工艺，降低了成本。
进一步地，在本公开的一个实施例中，设置在基材与载体基板接触的表面上的粘结剂也可以设置为电粘性层。由于电粘性液体容易清除，载体基板可以单独回收利用。
在本公开的一个实施例中，对所述电粘性层施加电场，所述电粘性层由液体状态转化为固体状态；其中，所述电粘性层在固体状态下的粘性强度大于所述电粘性层在液体状态下的粘性强度。此时，在电场作用下，电粘性液体层由具有低粘度的悬浮液变为具有高粘度的粘体固体，将柔性基板和玻璃基板固定到一起。
基于同一发明构思，本公开的至少一个实施例还提供了一种将所述柔性基板从上述基板结构中剥离的方法，由于该方法解决问题的原理与上述基板结构相似，因此该方法的实施可以参见基板结构的实施，重复之处不再赘述。
在本公开的一个实施例中，如图5所示，将所述柔性基板从所述基板结构中剥离的方法包括：在通过所述粘结层将所述柔性基板固定在载体基板后， 停止对所述粘结层施加电场；所述粘结层包括粘性强度在电场的作用下改变的所述电粘性层；在所述电粘性层转换为液体状态后，将所述柔性基板从所述粘结层中的所述电粘性层上剥离。
在上述将所述柔性基板从所述基板结构中的剥离方法中，在停止施加电场后，所述电粘性层的高粘度变为低粘度，则可以进行对所述柔性基板的剥离，采用此方法简单便利，可以在剥离所述柔性基板的时候不对其造成损坏，同时所述粘结层和所述载体基板可以回收利用，且电粘性层容易清除，不造成污染等优点。
在本公开的一个实施例中，所述将所述柔性基板从所述基板结构中的剥离方法还可以包括：将载体基板从粘结层中的粘结剂上剥离。
在本公开的一个实施例中，当与所述载体基板接触的所述粘结剂为电粘性层时，在停止施加电场后，电粘性层的粘度降低，以便进行对载体基板的剥离，且载体基板可以单独回收利用。
在本公开的一个实施例中，在停止向将所述粘结层施加电场后，所述电粘性层由固体状态向液体状态转化；其中，所述电粘性层在固体状态下的粘性强度大于所述电粘性层在液体状态下的粘性强度。停止施加电场后，所述电粘性层由具有高粘度的粘性固体变为具有低粘度的悬浮液，便于对柔性基板的剥离。
以上所述仅是本公开的示范性实施方式，而非用于限制本公开的保护范围，本公开的保护范围由所附的权利要求确定。
本申请要求于2016年1月4日递交的中国专利申请第201610005547.X号的优先权，在此全文引用上述中国专利申请公开的内容以作为本申请的一部分。

Claims (18)

  1. 一种基板结构，包括：载体基板以及设置在所述载体基板上的柔性基板，所述基板结构还包括夹在所述载体基板和柔性基板之间的一个或多个并排设置的粘结层，其中，所述粘结层具有粘性强度在电场的作用下改变的电粘性层，所述电粘性层设置在所述粘结层与柔性基板接触的表面上。
  2. 如权利要求1所述的基板结构，其中，所述粘结层还包括基材和粘结剂，所述基材夹设在所述电粘性层和所述粘结剂之间，所述粘结剂设置在所述粘结层与所述载体基板接触的表面上。
  3. 如权利要求2所述的基板结构，其中，所述粘结剂为电粘性层。
  4. 如权利要求1至3中任何一项所述的基板结构，其中，所述电粘性层在电场的作用下由液体状态转换至固体状态；
    所述电粘性层在固体状态下的粘性强度大于所述电粘性层在液体状态下的粘性强度。
  5. 如权利要求1至4任一所述的基板结构，其中，所述电粘性层转换成固体状态后的粘性强度与施加在所述电粘性层上的电场强度成正比。
  6. 如权利要求1至5任一所述的基板结构，其中，所述电粘性层包括固体微粒和绝缘液体，所述固体微粒的介电常数大于所述绝缘液体的介电常数。
  7. 如权利要求6所述的基板结构，其中，所述固体微粒包括硅胶、硅铝酸盐、复合金属氧化物、复合金属氢氧化物、高分子半导体材料中的至少一种。
  8. 如权利要求6或7所述的基板结构，其中，所述绝缘液体为硅油、食油和矿物油中的至少之一。
  9. 如权利要求2所述的基板结构，其中，所述基材由聚氯乙烯、亚克力、玻璃或聚酯类材料制成。
  10. 一种基板结构，包括：载体基板，设置在所述载体基板上的柔性基板，所述基板结构还包括夹在所述载体基板和柔性基板之间的一个或多个并排设置的粘结层，所述粘结层包括粘性强度在电场的作用下改变的电粘性层；
    所述粘结层与所述载体基板接触的一侧具有所述电粘性层。
  11. 一种贴附如权利要求1-9中任一项所述基板结构的柔性基板的方法， 所述方法包括：
    将所述粘结层贴附在所述载体基板上；所述粘结层包括粘性强度在电场的作用下改变的电粘性层，所述电粘性层背离所述载体基板；
    将柔性基板贴附在所述电粘性层上；以及
    对所述粘结层施加电场，以使所述柔性基板通过所述粘结层固定在所述载体基板上。
  12. 如权利要求11所述的贴附方法，其中，将所述粘结层贴附在所述载体基板上包括：
    通过所述粘结层中的粘结剂将粘结层贴附在载体基板上。
  13. 如权利要求12所述的贴附方法，其中，所述粘结剂为电粘性层。
  14. 如权利要求11所述的贴附方法，其中，对所述电粘性层施加电场，所述电粘性层由液体状态向固体状态转换；其中，所述电粘性层在固体状态下的粘性强度大于所述电粘性层在液体状态下的粘性强度。
  15. 一种将权利要求1-9任一项所述柔性基板从所述基板结构剥离的方法，包括：
    在通过所述粘结层将所述柔性基板固定在载体基板后，停止对所述粘结层施加电场；以及
    待所述电粘性层转换为液体状态后，将所述柔性基板从所述粘结层中的电粘性层上剥离。
  16. 如权利要求15所述的剥离方法，其还包括：
    将所述粘结层中的粘结剂从所述载体基板上剥离。
  17. 如权利要求16所述的剥离方法，其中，所述粘结剂为电粘性层。
  18. 如权利要求15所述的剥离方法，其中，停止向所述粘结层施加电场后，所述电粘性层由固体状态向液体状态转化；其中，所述电粘性层在固体状态下的粘性强度大于所述电粘性层在液体状态下的粘性强度。
PCT/CN2016/105511 2016-01-04 2016-11-11 基板结构及其柔性基板的贴附方法、剥离方法 WO2017118217A1 (zh)

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CN106876247B (zh) * 2017-02-15 2020-02-07 纳晶科技股份有限公司 柔性器件的制备方法
CN106910429B (zh) * 2017-03-08 2019-05-14 京东方科技集团股份有限公司 一种柔性模组及其制作方法
CN107068919A (zh) * 2017-05-31 2017-08-18 京东方科技集团股份有限公司 制造柔性面板的方法
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