WO2017121152A1 - 显示基板及其柔性基板的贴附方法、剥离方法 - Google Patents

显示基板及其柔性基板的贴附方法、剥离方法 Download PDF

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Publication number
WO2017121152A1
WO2017121152A1 PCT/CN2016/101766 CN2016101766W WO2017121152A1 WO 2017121152 A1 WO2017121152 A1 WO 2017121152A1 CN 2016101766 W CN2016101766 W CN 2016101766W WO 2017121152 A1 WO2017121152 A1 WO 2017121152A1
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Prior art keywords
substrate
adhesive layer
magnetic
layer
magnetic field
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PCT/CN2016/101766
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English (en)
French (fr)
Inventor
邢建国
赛加坐
喻娟
王凤
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京东方科技集团股份有限公司
北京京东方显示技术有限公司
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Priority to US15/521,753 priority Critical patent/US20180029347A1/en
Publication of WO2017121152A1 publication Critical patent/WO2017121152A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1284—Application of adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/10—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material
    • B32B3/14—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material characterised by a face layer formed of separate pieces of material which are juxtaposed side-by-side
    • B32B3/16—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material characterised by a face layer formed of separate pieces of material which are juxtaposed side-by-side secured to a flexible backing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
    • B32B43/006—Delaminating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
    • H01L21/76251—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/7806—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices involving the separation of the active layers from a substrate
    • H01L21/7813—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices involving the separation of the active layers from a substrate leaving a reusable substrate, e.g. epitaxial lift off
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1218—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or structure of the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1259—Multistep manufacturing methods
    • H01L27/1262—Multistep manufacturing methods with a particular formation, treatment or coating of the substrate
    • H01L27/1266—Multistep manufacturing methods with a particular formation, treatment or coating of the substrate the substrate on which the devices are formed not being the final device substrate, e.g. using a temporary substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/208—Magnetic, paramagnetic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2327/00—Polyvinylhalogenides
    • B32B2327/06—PVC, i.e. polyvinylchloride
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2367/00—Polyesters, e.g. PET, i.e. polyethylene terephthalate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133305—Flexible substrates, e.g. plastics, organic film
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates

Definitions

  • Embodiments of the present invention relate to the field of substrate manufacturing technology, and in particular, to a method of attaching a display substrate and a flexible substrate thereof, and a method of peeling off.
  • the flexible display device uses a flexible substrate that can be crimped, which is made of a soft material. It is characterized by being deformable, bendable, and light and thin, and easy to carry.
  • the above method has the following disadvantages: First, the flexible substrate is attached to the carrier substrate with an adhesive, and the device is peeled off after the fabrication is completed, and the prepared flexible substrate is not easily removed from the carrier substrate or has residual glue; Second, the raw material of the flexible substrate is directly coated on the carrier substrate, and the device is peeled off after the fabrication is completed. This method makes it difficult to fix the flexible substrate on the carrier substrate, and the method and the method for coating the raw materials used are relatively high.
  • Embodiments of the present invention provide a method for attaching a display substrate and a flexible substrate thereof, and stripping
  • the magnetic substrate can be attached and peeled off during the manufacturing process by the magnetic adhesive layer, and the carrier substrate and the adhesive layer can be recycled.
  • a display substrate including:
  • the bonding layer comprises a magnetically viscous layer capable of changing the viscous strength under the action of a magnetic field
  • the side of the bonding layer that is in contact with the flexible substrate has the magnetic adhesive layer.
  • the bonding layer comprises a plurality of bonding blocks spaced apart from each other.
  • the bonding layer further comprises a substrate and a binder
  • the adhesive layer has a binder on a side in contact with the carrier substrate;
  • the substrate is disposed between the magnetic adhesive layer and the binder.
  • the adhesive is a magnetic adhesive layer.
  • the magnetic adhesive layer is switched between a liquid state and a plasty state under the action of a magnetic field
  • the viscous strength of the magnetic viscous layer in the plastomer state is greater than the viscous strength of the magnetic viscous layer in the liquid state.
  • the greater the magnetic field strength the greater the adhesive strength of the magnetic adhesive layer.
  • the magnetic adhesive layer comprises ferromagnetic easily magnetizable particles, a dispersing agent and a stabilizer.
  • the ferromagnetic easily magnetizable particles are iron powder.
  • the dispersing agent is mineral oil, silicone oil or synthetic oil.
  • the stabilizer is nano-scale HS1 type SiO 2 .
  • the material of the substrate is a polyvinyl chloride, acryl, glass or polyester material.
  • a method for attaching a flexible substrate of the above display substrate including:
  • a magnetic field is applied around the bonding layer to secure the flexible substrate to the carrier substrate through the bonding layer.
  • attaching the adhesive layer to the carrier substrate comprises:
  • the bonding layer is attached to the carrier substrate through an adhesive in the bonding layer.
  • the adhesive is a magnetic adhesive layer.
  • a magnetic field is applied around the magnetic adhesive layer, and the magnetic adhesive layer is converted from a liquid state to a plastomer state, the plastomer
  • the viscous strength of the magnetic adhesive layer in the state is greater than the viscous strength of the magnetic adhesive layer in the liquid state.
  • a method for peeling off a flexible substrate of the above display substrate comprising:
  • the bonding layer includes a magnetic adhesive layer capable of changing the adhesive strength under the action of a magnetic field
  • the flexible substrate is peeled off from the magnetically viscous layer in the bonding layer.
  • the method further includes:
  • the carrier substrate is peeled off from the adhesive in the bonding layer.
  • the binder is a magnetic adhesive layer.
  • the magnetic adhesive layer is transformed from a plasty state to a liquid state, and the plasticity
  • the viscous strength of the magnetically viscous layer in the bulk state is greater than the viscous strength of the magnetically viscous layer in the liquid state.
  • a display substrate including:
  • the bonding layer comprises a magnetically viscous layer capable of changing the viscous strength under the action of a magnetic field
  • the side of the bonding layer that is in contact with the carrier substrate has the magnetically viscous layer.
  • the magnetic adhesive layer capable of changing the adhesive strength under the action of the magnetic field is disposed on the flexible substrate side of the display substrate, the magnetic adhesive layer can be realized only by the magnetic field.
  • the substrate is attached and peeled off during the manufacturing process, and the carrier substrate and the adhesive layer can be recycled.
  • FIG. 1 is a schematic structural view of a display substrate according to an embodiment of the present invention.
  • FIG. 2 is a schematic structural view of a display substrate according to another embodiment of the present invention.
  • FIG. 3 is a schematic structural view of a display substrate according to still another embodiment of the present invention.
  • FIG. 4 is a flow chart of a method of attaching a flexible substrate according to an embodiment of the present invention.
  • FIG. 5 is a flow chart of a method of peeling a flexible substrate in accordance with an embodiment of the present invention.
  • each film layer in the drawings do not reflect the true proportion of the display substrate, and the purpose is only to illustrate the embodiment of the invention.
  • An embodiment of the present invention provides a display substrate, as shown in FIG. 1 to FIG. 3, including:
  • a carrier substrate 1 which may be a rigid glass substrate
  • An adhesive layer 3 disposed between the carrier substrate 1 and the flexible substrate 2;
  • the bonding layer 3 includes a magnetic adhesive layer 31 capable of changing the adhesive strength under the action of a magnetic field;
  • the side of the adhesive layer 3 in contact with the flexible substrate 2 has a magnetic adhesive layer 31.
  • a magnetic adhesive layer capable of being transformed by a magnetic field under the action of a magnetic field is disposed on the side of the flexible substrate, so that only magnetic field is required under the action of the magnetic field.
  • the adhesive layer can realize the attachment and peeling of the flexible substrate during the manufacturing process, and the carrier substrate and the adhesive layer can be recycled.
  • the magnetic adhesive layer can be switched between a liquid state and a plasty state under the action of a magnetic field.
  • Plastic state The adhesive strength of the adhesive layer is greater than the adhesive strength of the magnetic adhesive layer in a liquid state, that is, the magnetic adhesive layer can be converted between a suspension having a low viscosity and a viscous plastomer having a high viscosity by a magnetic field.
  • the viscous strength of the magnetic adhesive layer when the magnetic field strength is larger, the viscous strength of the magnetic adhesive layer is larger.
  • the magnetic field strength is 0 when no magnetic field is applied, the magnetic adhesive layer is in a liquid state; after the magnetic field is applied, as the magnetic field strength increases, when the magnetic field strength reaches a certain value, the magnetic adhesive layer changes from a liquid state to a plastomer state, and the viscosity is sticky. The intensity gradually increases.
  • the magnetic adhesive layer can achieve different adjustments of the viscous strength of the magnetic viscous liquid layer depending on the strength of the magnetic field.
  • the carrier substrate 1 and the flexible substrate 2 have only one magnetic adhesive layer 31. Since the magnetic adhesive layer 31 has good fluidity in a liquid state, it is easy to apply to the back surface or the boundary region of the carrier substrate, and contamination is likely to occur after attaching the flexible substrate. Therefore, in order to avoid contamination of the flexible substrate, the adhesive layer may be provided in a three-layer structure. 2 (the bonding layer 3 comprises three layers arranged in a stack) and FIG. 3 (the bonding layer 3 comprises a plurality of mutually spaced bonding blocks, each bonding block comprising three layers arranged in a stack) The bonding layer 3 may further include a substrate 32 and an adhesive 33.
  • the side of the adhesive layer 3 in contact with the carrier substrate 1 has an adhesive 33 which is disposed between the magnetic adhesive layer 31 and the adhesive 33.
  • the bonding layer can be separately fabricated and then directly attached to the carrier substrate without the step of coating the magnetic adhesive layer on the carrier substrate, thereby simplifying the manufacturing process and reducing the cost.
  • the adhesive may be a double-sided tape, in which case the adhesive layer and the carrier substrate may be recycled as a unit.
  • the binder may also be a magnetically viscous layer. As shown in FIGS. 2 and 3, when the binder 33 is selected as a magnetically viscous layer whose viscous strength can be converted under the action of a magnetic field, the carrier substrate can be separately recycled since the magnetic viscous liquid is easily removed.
  • the magnetic adhesive layer is mainly composed of a magnetorheological fluid.
  • Magnetorheological Fluid is an intelligence The material exhibits a low viscosity Newtonian fluid property under zero magnetic field conditions, and exhibits a high viscosity, low fluidity plastomer (Bingham body) property under the action of a strong magnetic field.
  • the magnetorheological fluid is a suspension of a mixture of a small magnetic soft magnetic particle having a high magnetic permeability and a low hysteresis and a non-magnetic magnetic liquid.
  • the magnetorheological fluid currently in common use is a three-phase suspension.
  • magnetorheological fluid formulation used in the embodiments of the present invention is as follows:
  • Dispersed phase particles reduced hydroxy iron powder DT-50, micron;
  • Stabilizer Nano-sized HS1 type SiO 2 , spherical.
  • composition of the magnetorheological fluid can be determined according to the actual situation, and is not limited herein.
  • the material of the substrate may be polyvinyl chloride (PVC), acrylic (also known as polymethyl methacrylate, PMMA), glass or poly. Ester materials.
  • PVC polyvinyl chloride
  • acrylic also known as polymethyl methacrylate, PMMA
  • PMMA polymethyl methacrylate
  • This substrate can reduce costs while avoiding contamination of the substrate.
  • an embodiment of the present invention further provides a method for attaching a flexible substrate in the above display substrate. Since the principle of solving the problem is similar to the foregoing display substrate, the implementation of the method can be referred to the implementation of the display substrate. , the repetition will not be repeated.
  • the method for attaching the flexible substrate of the display substrate provided by the embodiment of the present invention, as shown in FIG. 4, includes the following steps:
  • the flexible substrate is attached to the magnetic adhesive layer which can be transformed under the action of the magnetic field
  • the magnetic substrate is Under the action of the field, the viscosity of the magnetic adhesive layer is adjusted, and the viscosity is changed from low viscosity to high viscosity, and the flexible substrate and the carrier substrate can be fixed together, so that the attachment method is simple and convenient.
  • the attaching the adhesive layer to the carrier substrate in step S401 can be implemented as follows:
  • the bonding layer is attached to the carrier substrate through an adhesive in the bonding layer.
  • the adhesive layer may be separately fabricated and provided as a three-layer structure having an adhesive on both sides and a substrate sandwiched between the adhesives.
  • the adhesive on one side in contact with the flexible substrate is provided as a magnetic adhesive layer, and the adhesive on the side in contact with the carrier substrate can be selected in various ways. In this way, the bonding layer can be directly attached to the carrier substrate without the step of coating the magnetic adhesive layer on the carrier substrate, which simplifies the manufacturing process and reduces the cost.
  • the adhesive on the side in contact with the carrier substrate may also be provided as a magnetic adhesive layer. Since the magnetic viscous liquid is easily removed, the carrier substrate can be recycled separately.
  • a magnetic field is applied around the magnetic adhesive layer, and the magnetic adhesive layer can be converted from a liquid state to a plasty state, wherein the viscous state is a magnetic adhesive layer.
  • the viscous strength is greater than the viscous strength of the magnetic adhesive layer in the liquid state.
  • the magnetic viscous liquid layer is changed from a suspension having a low viscosity to a viscous plastomer having a high viscosity by a magnetic field to fix the flexible substrate and the glass substrate together.
  • an embodiment of the present invention further provides a method for peeling off a flexible substrate in the above display substrate. Since the principle of solving the problem is similar to the foregoing display substrate, the implementation of the method can be referred to the implementation of the display substrate. The repetitions are not repeated here.
  • the method for peeling off the flexible substrate provided by the embodiment of the present invention, as shown in FIG. 5, includes the following steps:
  • the magnetic field around the bonding layer is removed, and the bonding layer includes a magnetic adhesive layer capable of changing the adhesive strength under the action of the magnetic field;
  • the flexible substrate After removing the magnetic field, the flexible substrate is peeled off from the magnetic adhesive layer in the adhesive layer.
  • the peeling method of the above flexible substrate provided by the embodiment of the present invention, since the magnetic field is removed After the high viscosity of the magnetic adhesive layer becomes a low viscosity, the peeling of the flexible substrate can be performed, so that the method is simple and convenient, and the flexible substrate can be peeled off without being damaged, and the adhesive layer and the carrier substrate can be recycled. And the magnetic adhesive layer is easy to remove and does not cause pollution.
  • the method further includes: peeling the carrier substrate from the adhesive in the adhesive layer.
  • the adhesive contacting the carrier substrate is selected as a magnetic adhesive layer
  • the viscosity of the magnetic adhesive layer becomes low after the magnetic field is removed. The separation of the carrier substrate is facilitated, and the carrier substrate can be recycled separately.
  • the magnetic adhesive layer is transformed from a plasty state to a liquid state, wherein the viscous state is a magnetic adhesive layer.
  • the viscous strength is greater than the viscous strength of the magnetic adhesive layer in the liquid state.
  • the magnetic viscous liquid layer is changed from a viscous plastomer having a high viscosity to a suspension having a low viscosity to facilitate peeling of the flexible substrate.
  • the embodiment of the invention further provides a display substrate, comprising:
  • An adhesive layer disposed between the carrier substrate and the flexible substrate
  • the bonding layer comprises a magnetic adhesive layer capable of changing the adhesive strength under the action of a magnetic field
  • the side of the bonding layer in contact with the carrier substrate has a magnetically viscous layer.
  • the magnetic adhesive layer capable of changing the adhesive strength under the action of a magnetic field is disposed on one side of the carrier substrate, the magnetic adhesive layer can be passed through the magnetic field. Peeling of the carrier substrate is achieved, and the carrier substrate can be recycled separately.
  • a method for attaching a display substrate and a flexible substrate thereof, and a method for peeling off, a magnetic adhesive layer capable of being transformed under the action of a magnetic field is disposed on the flexible substrate side of the display substrate, so that only Under the action of a magnetic field, through the magnetic viscosity layer
  • the attachment and peeling of the flexible substrate during the manufacturing process can be realized, and the carrier substrate and the adhesive layer can be recycled.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
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Abstract

提供一种显示基板及其柔性基板的贴附方法、剥离方法。该显示基板包括：载体基板（1），设置在载体基板（1）上的柔性基板（2），以及设置在载体基板（1）和柔性基板（2）之间的粘结层（3）。粘结层（3）包括在磁场的作用下粘性强度能够转变的磁粘性层（31），且粘结层（3）与柔性基板（2）接触的一侧具有磁粘性层（31）。由于该显示基板中在柔性基板一侧设置了在磁场的作用下粘性强度可以进行转变的磁粘性层，这样只需在磁场的作用下，通过磁粘性层即可实现柔性基板在制作过程中的贴附及剥离，且载体基板和粘结层可以回收利用。

Description

显示基板及其柔性基板的贴附方法、剥离方法
本申请要求于2016年1月15日递交的中国专利申请第201610027120.X号的优先权，在此全文引用上述中国专利申请公开的内容以作为本申请的一部分。
技术领域
本发明的实施例涉及基板制造技术领域，尤其涉及显示基板及其柔性基板的贴附方法、剥离方法。
背景技术
近年来，柔性显示作为下一代显示技术的重点得到飞快的发展。柔性显示器件使用一种可卷曲的柔性基板，该柔性基板由柔软的材料制成。其特点为可变形、可弯曲，且具有轻薄、携带方便等优点。
目前，柔性基板加工困难，严重限制了其应用发展。一般将柔性基板固定到刚性的载体基板上制作，但柔性基板的贴附工艺较为复杂，且不易将制作完成的柔性基板剥离。目前把柔性基板固定到载体基板的方法很多，大致可以分成两类：其一，用粘合剂，诸如双面胶，将柔性基板贴附到载体基板上，器件制作完成后进行剥离；其二，直接将柔性基板的原材料涂覆在载体基板上，经过定型后形成柔性基板，待器件制作完成后再进行剥离。但是，上述方法存在如下缺陷：第一，用粘合剂将柔性基板贴附到载体基板上，器件制作完成后进行剥离，不易将制备完成的柔性基板从载体基板取下或者有胶残留；第二，直接将柔性基板的原材料涂覆在载体基板上，器件制作完成后进行剥离，该方法使柔性基板固定在载体基板上较为困难，且所用的涂覆原材料的方法和剥离方法成本较高。
发明内容
本发明的实施例提供了一种显示基板及其柔性基板的贴附方法、剥离 方法，只需在磁场的作用下，通过磁粘性层即可实现柔性基板在制作过程中的贴附及剥离，且载体基板和粘结层可以回收利用。
根据本发明的一个实施例，提供了一种显示基板，包括：
载体基板；
设置在所述载体基板上的柔性基板；以及
设置在所述载体基板和柔性基板之间的粘结层；
所述粘结层包括在磁场的作用下粘性强度能够转变的磁粘性层；
所述粘结层与所述柔性基板接触的一侧具有所述磁粘性层。
在一种可能的实现方式中，在本发明实施例提供的上述显示基板中，所述粘结层包括多个相互间隔开的粘结块。
在一种可能的实现方式中，在本发明实施例提供的上述显示基板中，所述粘结层还包括基材和粘结剂；
所述粘结层与所述载体基板接触的一侧具有所述粘结剂；
所述基材设置在所述磁粘性层和所述粘结剂之间。
在一种可能的实现方式中，在本发明实施例提供的上述显示基板中，所述粘结剂为磁粘性层。
在一种可能的实现方式中，在本发明实施例提供的上述显示基板中，所述磁粘性层在磁场的作用下在液体状态和塑性体状态之间转换；
所述塑性体状态的磁粘性层的粘性强度大于所述液体状态的磁粘性层的粘性强度。
在一种可能的实现方式中，在本发明实施例提供的上述显示基板中，磁场强度越大，所述磁粘性层的粘性强度越大。
在一种可能的实现方式中，在本发明实施例提供的上述显示基板中，所述磁粘性层包括铁磁性易磁化颗粒、分散剂和稳定剂。
在一种可能的实现方式中，在本发明实施例提供的上述显示基板中，所述所述铁磁性易磁化颗粒是铁粉。
在一种可能的实现方式中，在本发明实施例提供的上述显示基板中，所述分散剂是矿物油、硅油或合成油。
在一种可能的实现方式中，在本发明实施例提供的上述显示基板中，所述稳定剂是纳米级HS1型SiO2。
在一种可能的实现方式中，在本发明实施例提供的上述显示基板中，所述基材的材料为聚氯乙烯、亚克力、玻璃或聚酯类材料。
根据本发明的一个实施例，还提供了一种上述显示基板的柔性基板的贴附方法，包括：
将粘结层贴附在载体基板上，所述粘结层包括在磁场的作用下粘性强度能够转变的磁粘性层；
将柔性基板贴附在所述磁粘性层上；以及
在所述粘结层周围施加磁场，以使所述柔性基板通过所述粘结层固定在所述载体基板上。
在一种可能的实现方式中，在本发明实施例提供的上述贴附方法中，将粘结层贴附在载体基板上包括：
将粘结层通过所述粘结层中的粘结剂贴附在载体基板上。
在一种可能的实现方式中，在本发明实施例提供的上述贴附方法中，所述粘结剂为磁粘性层。
在一种可能的实现方式中，在本发明实施例提供的上述贴附方法中，在所述磁粘性层周围施加磁场，所述磁粘性层由液体状态向塑性体状态转换，所述塑性体状态的磁粘性层的粘性强度大于液体状态的磁粘性层的粘性强度。
根据本发明的一个实施例，还提供了一种上述显示基板的柔性基板的剥离方法，包括：
在柔性基板通过粘结层固定在载体基板后，将所述粘结层周围的磁场去掉，所述粘结层包括在磁场的作用下粘性强度能够转变的磁粘性层；以及
去掉磁场后，将所述柔性基板从所述粘结层中的磁粘性层上剥离。
在一种可能的实现方式中，在本发明实施例提供的上述剥离方法中，还包括：
将所述载体基板从所述粘结层中的粘结剂上剥离。
在一种可能的实现方式中，在本发明实施例提供的上述剥离方法中，所述粘结剂为磁粘性层。
在一种可能的实现方式中，在本发明实施例提供的上述剥离方法中，将所述粘结层周围的磁场去掉后，所述磁粘性层由塑性体状态向液体状态转化，所述塑性体状态的磁粘性层的粘性强度大于液体状态的磁粘性层的粘性强度。
根据本发明的一个实施例，还提供了一种显示基板，包括：
载体基板；
设置在所述载体基板上的柔性基板；以及
设置在所述载体基板和柔性基板之间的粘结层；
所述粘结层包括在磁场的作用下粘性强度能够转变的磁粘性层；
所述粘结层与所述载体基板接触的一侧具有所述磁粘性层。
根据本发明的实施例，由于该显示基板中在柔性基板一侧设置了在磁场的作用下粘性强度能够转变的磁粘性层，这样只需在磁场的作用下，通过磁粘性层即可实现柔性基板在制作过程中的贴附及剥离，且载体基板和粘结层可以回收利用。
附图说明
为了更清楚地说明本发明的实施例的技术方案，下面将对实施例的附图作简单地介绍。明显地，以下附图中的结构示意图不一定按比例绘制，而是以简化形式呈现各特征。而且，下面描述中的附图仅仅涉及本发明的一些实施例，而并非对本发明进行限制。
图1为根据本发明的一个实施例的显示基板的结构示意图；
图2为根据本发明的另一实施例的显示基板的结构示意图；
图3为根据本发明的又一实施例的显示基板的结构示意图；
图4为根据本发明的一个实施例的柔性基板的贴附方法的流程图；以及
图5为根据本发明的一个实施例的柔性基板的剥离方法的流程图。
具体实施方式
为使本发明实施例的目的、技术方案和优点更加清楚，下面将结合本发明实施例的附图，对本发明实施例的技术方案进行清楚、完整地描述。显然，所描述的实施例仅是本发明的一部分实施例，而不是全部的实施例。基于所描述的本发明的实施例，本领域普通技术人员在无需创造性劳动的前提下所获得的所有其他实施例，都属于本发明保护的范围。
在本发明的描述中，需要说明的是，术语“上”、“下”、“顶”、“底”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。
下面结合附图，对本发明实施例提供的显示基板及其柔性基板的贴附方法、剥离方法的具体实施方式进行详细地说明。
其中，附图中各膜层的厚度和形状不反映显示基板的真实比例，目的只是示意说明本发明的实施例。
本发明实施例提供了一种显示基板，如图1至图3所示，包括：
载体基板1，其可以是刚性玻璃基板；
设置在载体基板1上的柔性基板2；以及
设置在载体基板1和柔性基板2之间的粘结层3；
粘结层3包括在磁场的作用下粘性强度能够转变的磁粘性层31；
粘结层3与柔性基板2接触的一侧具有磁粘性层31。
在本发明实施例提供的上述显示基板中，由于该显示基板中在柔性基板一侧设置了在磁场的作用下粘性强度可以能够转变的磁粘性层，这样只需在磁场的作用下，通过磁粘性层即可实现柔性基板在制作过程中的贴附及剥离，且载体基板和粘结层可以回收利用。
在具体实施时，在本发明实施例提供的上述显示基板中，磁粘性层在磁场的作用下可以在液体状态和塑性体状态之间转换。塑性体状态的磁 粘性层的粘性强度大于液体状态的磁粘性层的粘性强度，即磁粘性层在磁场的作用下可以在具有低粘度的悬浮液和具有高粘度的粘性塑性体之间进行转换。
在具体实施时，在本发明实施例提供的上述显示基板中，当磁场强度越大时，磁粘性层的粘性强度越大。当未施加磁场即磁场强度为0时，磁粘性层为液体状态；在施加磁场后，随着磁场强度的不断增大，达到一定值时，磁粘性层由液体状态变为塑性体状态，粘性强度逐渐增强。这样，磁粘性层可根据磁场强度的不同，实现磁粘性液体层不同的粘性强度的调节。
在具体实施时，在本发明实施例提供的上述显示基板中，如图1所示，载体基板1和柔性基板2只具有一层磁粘性层31。由于该磁粘性层31在液体状态时流动性较好，容易涂覆到载体基板背面或边界区域，贴附柔性基板后容易产生污染。因此，为了避免柔性基板受到污染，粘结层可以设置为三层结构。如图2(粘结层3包括层叠设置的三个层)和图3(粘结层3包括多个相互间隔开的粘结块，每个粘结块包括层叠设置的三个层)所示，粘结层3还可以包括基材32和粘结剂33。粘结层3与载体基板1接触的一侧具有粘结剂33，基材32设置在磁粘性层31和粘结剂33之间。这样，该粘结层可以单独制作，然后直接贴附在载体基板上，无需在载体基板上进行涂覆磁粘性层的步骤，从而简化了制作工艺且降低了成本。
进一步地，在具体实施时，在本发明实施例提供的上述显示基板中，粘结剂的种类有多种。例如，粘结剂可以是双面胶，此时粘结层与载体基板可以作为一个整体进行回收利用。该粘结剂也可以是磁粘性层。如图2和图3所示，当粘结剂33选择为在磁场的作用下粘性强度可以进行转变的磁粘性层时，由于磁粘性液体容易清除，载体基板可以单独回收利用。
在具体实施时，在本发明实施例提供的上述显示基板中，磁粘性层主要由磁流变液组成。磁流变液(Magnetorheological Fluid)是一种智能 材料，在零磁场条件下呈现出低粘度的牛顿流体特性；而在强磁场作用下，则呈现出高粘度、低流动性的塑性体(Bingham体)特性。磁流变液是由高磁导率、低磁滞性的微小软磁性颗粒和非导磁性液体混合而成的悬浮体。目前普遍采用的磁流变液是三相组成的悬浮液。一般由弥散相(例如，铁磁性易磁化颗粒)、分散相(例如，矿物油、硅油、合成油)和改善磁流变液性能的稳定剂三种物质构成。例如，本发明实施例使用的磁流变液配方如下：
弥散相粒子：还原羟基铁粉DT-50，微米级；
分散相：甲级硅油201#；以及
稳定剂：纳米级HS1型SiO2，球状。
对于磁流变液组成成分的选择可以根据实际情况而定，在此不做限定。
在具体实施时，在本发明实施例提供的上述显示基板中，基材的材料可以采用聚氯乙烯(Polyvinyl chloride，PVC)、亚克力(又称聚甲基丙烯酸甲酯，PMMA)、玻璃或聚酯类材料。这种基材可以降低成本，同时避免对基板的污染。
基于同一发明构思，本发明实施例还提供了一种上述显示基板中的柔性基板的贴附方法，由于该方法解决问题的原理与前述显示基板相似，因此该方法的实施可以参见显示基板的实施，重复之处不再赘述。
在具体实施时，本发明实施例提供的显示基板的柔性基板的贴附方法，如图4所示，包括以下步骤：
S401、将粘结层贴附在载体基板上，所述粘结层包括在磁场的作用下粘性强度能够转变的磁粘性层；
S402、将柔性基板贴附在磁粘性层上；以及
S403、在粘结层周围施加磁场，以使柔性基板通过粘结层固定在载体基板上。
在本发明实施例提供的上述柔性基板的贴附方法中，由于柔性基板贴附在粘性强度在磁场的作用下可以进行转变的磁粘性层上，这样在磁 场的作用下，对磁粘性层的粘性强度进行调节，由低粘度变为高粘度，可以将柔性基板和载体基板固定到一起，使得此贴附方法简单便利。
在具体实施时，在本发明实施例提供的上述柔性基板的贴附方法中，步骤S401将粘结层贴附在载体基板上可以采用如下方式实现：
将粘结层通过粘结层中的粘结剂贴附在载体基板上。
需要说明的是，该粘结层可以单独制作，设置为在两侧分别具有粘结剂且在粘结剂之间夹有基材的三层结构。与柔性基板接触的一侧的粘结剂设置为磁粘性层，与载体基板接触的一侧的粘结剂可以有多种选择。这样，该粘结层可以直接贴附在载体基板上，无需在载体基板上进行涂覆磁粘性层的步骤，简化了制作工艺且降低了成本。
进一步地，在具体实施时，在本发明实施例提供的上述柔性基板的贴附方法中，与载体基板接触的一侧的粘结剂也可以设置为磁粘性层。由于磁粘性液体容易清除，载体基板可以单独回收利用。
在具体实施时，在本发明实施例提供的上述柔性基板的贴附方法中，在磁粘性层周围施加磁场，磁粘性层可以由液体状态向塑性体状态转换，其中塑性体状态的磁粘性层的粘性强度大于液体状态的磁粘性层的粘性强度。此时磁粘性液体层在磁场的作用下，由具有低粘度的悬浮液变为具有高粘度的粘性塑性体，将柔性基板和玻璃基板固定到一起。
基于同一发明构思，本发明实施例还提供了一种上述显示基板中的柔性基板的剥离方法，由于该方法解决问题的原理与前述显示基板相似，因此该方法的实施可以参见显示基板的实施，重复之处不再赘述。
在具体实施时，本发明实施例提供的柔性基板的剥离方法，如图5所示，包括以下步骤：
S501、在柔性基板通过粘结层固定在载体基板后，将粘结层周围的磁场去掉，所述粘结层包括在磁场的作用下粘性强度能够转变的磁粘性层；以及
S502、去掉磁场后，将柔性基板从粘结层中的磁粘性层上剥离。
在本发明实施例提供的上述柔性基板的剥离方法中，由于去掉磁场 后，磁粘性层的高粘度变为低粘度，则可以进行对柔性基板的剥离，使得此方法简单便利，可以在剥离柔性基板的时候不对其造成损坏，同时粘结层和载体基板可以回收利用，且磁粘性层容易清除，不会造成污染。
在具体实施时，在本发明实施例提供的上述柔性基板的剥离方法中，还可以包括：将载体基板从粘结层中的粘结剂上剥离。
进一步地，在具体实施时，在本发明实施例提供的上述柔性基板的剥离方法中，当与载体基板接触的粘结剂选择为磁粘性层时，去掉磁场后，磁粘性层的粘度变低，便于进行对载体基板的剥离，且载体基板可以单独回收利用。
在具体实施时，在本发明实施例提供的上述柔性基板的剥离方法中，将粘结层周围的磁场去掉后，磁粘性层由塑性体状态向液体状态转化，其中塑性体状态的磁粘性层的粘性强度大于液体状态的磁粘性层的粘性强度。此时在磁场去掉后，磁粘性液体层由具有高粘度的粘性塑性体变为具有低粘度的悬浮液，便于对柔性基板进行剥离。
本发明实施例还提供了一种显示基板，包括：
载体基板；
设置在载体基板上的柔性基板；以及
设置在载体基板和柔性基板之间的粘结层；
粘结层包括在磁场的作用下粘性强度能够转变的磁粘性层；
粘结层与载体基板接触的一侧具有磁粘性层。
在本发明实施例提供的上述显示基板中，由于在载体基板一侧设置了在磁场的作用下粘性强度可以进行转变的磁粘性层，这样只需在磁场的作用下，通过磁粘性层即可实现载体基板的剥离，且载体基板可以单独回收利用。
根据本发明实施例的显示基板及其柔性基板的贴附方法、剥离方法，由于该显示基板中在柔性基板一侧设置了在磁场的作用下粘性强度可以进行转变的磁粘性层，这样只需在磁场的作用下，通过磁粘性层即 可实现柔性基板在制作过程中的贴附及剥离，且载体基板和粘结层可以回收利用。
以上所述仅是本发明的示范性实施方式，而非用于限制本发明的保护范围，本发明的保护范围由所附的权利要求确定。

Claims (20)

  1. 一种显示基板，包括：
    载体基板；
    设置在所述载体基板上的柔性基板；以及
    设置在所述载体基板和柔性基板之间的粘结层；
    所述粘结层包括在磁场的作用下粘性强度能够转变的磁粘性层；
    所述粘结层与所述柔性基板接触的一侧具有所述磁粘性层。
  2. 如权利要求1所述的显示基板，其中，所述粘结层包括多个相互间隔开的粘结块。
  3. 如权利要求1或2所述的显示基板，其中，所述粘结层还包括基材和粘结剂；
    所述粘结层与所述载体基板接触的一侧具有所述粘结剂；
    所述基材设置在所述磁粘性层和所述粘结剂之间。
  4. 如权利要求3所述的显示基板，其中，所述粘结剂为磁粘性层。
  5. 如权利要求1-4中任一项所述的显示基板，其中，所述磁粘性层在磁场的作用下在液体状态和塑性体状态之间转换；
    所述塑性体状态的磁粘性层的粘性强度大于所述液体状态的磁粘性层的粘性强度。
  6. 如权利要求1-5中任一项所述的显示基板，其中，磁场强度越大，所述磁粘性层的粘性强度越大。
  7. 如权利要求1-6中任一项所述的显示基板，其中，所述磁粘性层包括铁磁性易磁化颗粒、分散剂和稳定剂。
  8. 如权利要求7所述的显示基板，其中，所述铁磁性易磁化颗粒是铁粉。
  9. 如权利要求7或8所述的显示基板，其中，所述分散剂是矿物油、硅油或合成油。
  10. 如权利要求7-9中任一项所述的显示基板，其中，所述稳定剂是SiO2。
  11. 如权利要求3-10中任一项所述的显示基板，其中，所述基材的材 料为聚氯乙烯、亚克力、玻璃或聚酯类材料。
  12. 一种显示基板，包括：
    载体基板；
    设置在所述载体基板上的柔性基板；以及
    设置在所述载体基板和柔性基板之间的粘结层；
    所述粘结层包括在磁场的作用下粘性强度能够转变的磁粘性层；
    所述粘结层与所述载体基板接触的一侧具有所述磁粘性层。
  13. 一种如权利要求1-11中任一项所述的显示基板的柔性基板的贴附方法，包括：
    将粘结层贴附在载体基板上，所述粘结层包括在磁场的作用下粘性强度能够转变的磁粘性层；
    将柔性基板贴附在所述磁粘性层上；以及
    在所述粘结层周围施加磁场，以使所述柔性基板通过所述粘结层固定在所述载体基板上。
  14. 如权利要求13所述的贴附方法，其中，将粘结层贴附在载体基板上包括：
    将粘结层通过所述粘结层中的粘结剂贴附在载体基板上。
  15. 如权利要求14所述的贴附方法，其中，所述粘结剂为磁粘性层。
  16. 如权利要求13-15中任一项所述的贴附方法，其中，在所述磁粘性层周围施加磁场，所述磁粘性层由液体状态向塑性体状态转换，所述塑性体状态的磁粘性层的粘性强度大于液体状态的磁粘性层的粘性强度。
  17. 一种如权利要求1-11中任一项所述的显示基板的柔性基板的剥离方法，包括：
    在柔性基板通过粘结层固定在载体基板后，将所述粘结层周围的磁场去掉，所述粘结层包括在磁场的作用下粘性强度能够转变的磁粘性层；以及
    去掉磁场后，将所述柔性基板从所述粘结层中的磁粘性层上剥离。
  18. 如权利要求17所述的剥离方法，还包括：
    将所述载体基板从所述粘结层中的粘结剂上剥离。
  19. 如权利要求18所述的剥离方法，其中，所述粘结剂为磁粘性层。
  20. 如权利要求17-19中任一项所述的剥离方法，其中，将所述粘结层周围的磁场去掉后，所述磁粘性层由塑性体状态向液体状态转化，所述塑性体状态的磁粘性层的粘性强度大于液体状态的磁粘性层的粘性强度。
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