WO2017121152A1 - 显示基板及其柔性基板的贴附方法、剥离方法 - Google Patents
显示基板及其柔性基板的贴附方法、剥离方法 Download PDFInfo
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- WO2017121152A1 WO2017121152A1 PCT/CN2016/101766 CN2016101766W WO2017121152A1 WO 2017121152 A1 WO2017121152 A1 WO 2017121152A1 CN 2016101766 W CN2016101766 W CN 2016101766W WO 2017121152 A1 WO2017121152 A1 WO 2017121152A1
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- substrate
- adhesive layer
- magnetic
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- magnetic field
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- 239000000758 substrate Substances 0.000 title claims abstract description 239
- 238000000034 method Methods 0.000 title claims abstract description 54
- 230000005291 magnetic effect Effects 0.000 claims abstract description 153
- 239000012790 adhesive layer Substances 0.000 claims abstract description 105
- 239000010410 layer Substances 0.000 claims abstract description 84
- 239000000853 adhesive Substances 0.000 claims abstract description 38
- 230000001070 adhesive effect Effects 0.000 claims abstract description 38
- 239000007788 liquid Substances 0.000 claims description 27
- 229920000034 Plastomer Polymers 0.000 claims description 13
- 239000011230 binding agent Substances 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 7
- 239000002245 particle Substances 0.000 claims description 6
- 239000003381 stabilizer Substances 0.000 claims description 6
- 230000005294 ferromagnetic effect Effects 0.000 claims description 5
- 239000011521 glass Substances 0.000 claims description 5
- 239000002270 dispersing agent Substances 0.000 claims description 4
- 229920002545 silicone oil Polymers 0.000 claims description 4
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 3
- 239000002480 mineral oil Substances 0.000 claims description 3
- 235000010446 mineral oil Nutrition 0.000 claims description 3
- 239000003921 oil Substances 0.000 claims description 3
- 239000004800 polyvinyl chloride Substances 0.000 claims description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 2
- 229920000728 polyester Polymers 0.000 claims description 2
- 229920000915 polyvinyl chloride Polymers 0.000 claims description 2
- 230000001131 transforming effect Effects 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 11
- 230000000694 effects Effects 0.000 abstract 2
- 239000012530 fluid Substances 0.000 description 8
- 239000000725 suspension Substances 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000011109 contamination Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
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- 238000009472 formulation Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- WKPSFPXMYGFAQW-UHFFFAOYSA-N iron;hydrate Chemical compound O.[Fe] WKPSFPXMYGFAQW-UHFFFAOYSA-N 0.000 description 1
- 239000006249 magnetic particle Substances 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
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Images
Classifications
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- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
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- H01L21/7806—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices involving the separation of the active layers from a substrate
- H01L21/7813—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices involving the separation of the active layers from a substrate leaving a reusable substrate, e.g. epitaxial lift off
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- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1218—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or structure of the substrate
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- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
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- H01L27/1262—Multistep manufacturing methods with a particular formation, treatment or coating of the substrate
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
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- H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
Definitions
- Embodiments of the present invention relate to the field of substrate manufacturing technology, and in particular, to a method of attaching a display substrate and a flexible substrate thereof, and a method of peeling off.
- the flexible display device uses a flexible substrate that can be crimped, which is made of a soft material. It is characterized by being deformable, bendable, and light and thin, and easy to carry.
- the above method has the following disadvantages: First, the flexible substrate is attached to the carrier substrate with an adhesive, and the device is peeled off after the fabrication is completed, and the prepared flexible substrate is not easily removed from the carrier substrate or has residual glue; Second, the raw material of the flexible substrate is directly coated on the carrier substrate, and the device is peeled off after the fabrication is completed. This method makes it difficult to fix the flexible substrate on the carrier substrate, and the method and the method for coating the raw materials used are relatively high.
- Embodiments of the present invention provide a method for attaching a display substrate and a flexible substrate thereof, and stripping
- the magnetic substrate can be attached and peeled off during the manufacturing process by the magnetic adhesive layer, and the carrier substrate and the adhesive layer can be recycled.
- a display substrate including:
- the bonding layer comprises a magnetically viscous layer capable of changing the viscous strength under the action of a magnetic field
- the side of the bonding layer that is in contact with the flexible substrate has the magnetic adhesive layer.
- the bonding layer comprises a plurality of bonding blocks spaced apart from each other.
- the bonding layer further comprises a substrate and a binder
- the adhesive layer has a binder on a side in contact with the carrier substrate;
- the substrate is disposed between the magnetic adhesive layer and the binder.
- the adhesive is a magnetic adhesive layer.
- the magnetic adhesive layer is switched between a liquid state and a plasty state under the action of a magnetic field
- the viscous strength of the magnetic viscous layer in the plastomer state is greater than the viscous strength of the magnetic viscous layer in the liquid state.
- the greater the magnetic field strength the greater the adhesive strength of the magnetic adhesive layer.
- the magnetic adhesive layer comprises ferromagnetic easily magnetizable particles, a dispersing agent and a stabilizer.
- the ferromagnetic easily magnetizable particles are iron powder.
- the dispersing agent is mineral oil, silicone oil or synthetic oil.
- the stabilizer is nano-scale HS1 type SiO 2 .
- the material of the substrate is a polyvinyl chloride, acryl, glass or polyester material.
- a method for attaching a flexible substrate of the above display substrate including:
- a magnetic field is applied around the bonding layer to secure the flexible substrate to the carrier substrate through the bonding layer.
- attaching the adhesive layer to the carrier substrate comprises:
- the bonding layer is attached to the carrier substrate through an adhesive in the bonding layer.
- the adhesive is a magnetic adhesive layer.
- a magnetic field is applied around the magnetic adhesive layer, and the magnetic adhesive layer is converted from a liquid state to a plastomer state, the plastomer
- the viscous strength of the magnetic adhesive layer in the state is greater than the viscous strength of the magnetic adhesive layer in the liquid state.
- a method for peeling off a flexible substrate of the above display substrate comprising:
- the bonding layer includes a magnetic adhesive layer capable of changing the adhesive strength under the action of a magnetic field
- the flexible substrate is peeled off from the magnetically viscous layer in the bonding layer.
- the method further includes:
- the carrier substrate is peeled off from the adhesive in the bonding layer.
- the binder is a magnetic adhesive layer.
- the magnetic adhesive layer is transformed from a plasty state to a liquid state, and the plasticity
- the viscous strength of the magnetically viscous layer in the bulk state is greater than the viscous strength of the magnetically viscous layer in the liquid state.
- a display substrate including:
- the bonding layer comprises a magnetically viscous layer capable of changing the viscous strength under the action of a magnetic field
- the side of the bonding layer that is in contact with the carrier substrate has the magnetically viscous layer.
- the magnetic adhesive layer capable of changing the adhesive strength under the action of the magnetic field is disposed on the flexible substrate side of the display substrate, the magnetic adhesive layer can be realized only by the magnetic field.
- the substrate is attached and peeled off during the manufacturing process, and the carrier substrate and the adhesive layer can be recycled.
- FIG. 1 is a schematic structural view of a display substrate according to an embodiment of the present invention.
- FIG. 2 is a schematic structural view of a display substrate according to another embodiment of the present invention.
- FIG. 3 is a schematic structural view of a display substrate according to still another embodiment of the present invention.
- FIG. 4 is a flow chart of a method of attaching a flexible substrate according to an embodiment of the present invention.
- FIG. 5 is a flow chart of a method of peeling a flexible substrate in accordance with an embodiment of the present invention.
- each film layer in the drawings do not reflect the true proportion of the display substrate, and the purpose is only to illustrate the embodiment of the invention.
- An embodiment of the present invention provides a display substrate, as shown in FIG. 1 to FIG. 3, including:
- a carrier substrate 1 which may be a rigid glass substrate
- An adhesive layer 3 disposed between the carrier substrate 1 and the flexible substrate 2;
- the bonding layer 3 includes a magnetic adhesive layer 31 capable of changing the adhesive strength under the action of a magnetic field;
- the side of the adhesive layer 3 in contact with the flexible substrate 2 has a magnetic adhesive layer 31.
- a magnetic adhesive layer capable of being transformed by a magnetic field under the action of a magnetic field is disposed on the side of the flexible substrate, so that only magnetic field is required under the action of the magnetic field.
- the adhesive layer can realize the attachment and peeling of the flexible substrate during the manufacturing process, and the carrier substrate and the adhesive layer can be recycled.
- the magnetic adhesive layer can be switched between a liquid state and a plasty state under the action of a magnetic field.
- Plastic state The adhesive strength of the adhesive layer is greater than the adhesive strength of the magnetic adhesive layer in a liquid state, that is, the magnetic adhesive layer can be converted between a suspension having a low viscosity and a viscous plastomer having a high viscosity by a magnetic field.
- the viscous strength of the magnetic adhesive layer when the magnetic field strength is larger, the viscous strength of the magnetic adhesive layer is larger.
- the magnetic field strength is 0 when no magnetic field is applied, the magnetic adhesive layer is in a liquid state; after the magnetic field is applied, as the magnetic field strength increases, when the magnetic field strength reaches a certain value, the magnetic adhesive layer changes from a liquid state to a plastomer state, and the viscosity is sticky. The intensity gradually increases.
- the magnetic adhesive layer can achieve different adjustments of the viscous strength of the magnetic viscous liquid layer depending on the strength of the magnetic field.
- the carrier substrate 1 and the flexible substrate 2 have only one magnetic adhesive layer 31. Since the magnetic adhesive layer 31 has good fluidity in a liquid state, it is easy to apply to the back surface or the boundary region of the carrier substrate, and contamination is likely to occur after attaching the flexible substrate. Therefore, in order to avoid contamination of the flexible substrate, the adhesive layer may be provided in a three-layer structure. 2 (the bonding layer 3 comprises three layers arranged in a stack) and FIG. 3 (the bonding layer 3 comprises a plurality of mutually spaced bonding blocks, each bonding block comprising three layers arranged in a stack) The bonding layer 3 may further include a substrate 32 and an adhesive 33.
- the side of the adhesive layer 3 in contact with the carrier substrate 1 has an adhesive 33 which is disposed between the magnetic adhesive layer 31 and the adhesive 33.
- the bonding layer can be separately fabricated and then directly attached to the carrier substrate without the step of coating the magnetic adhesive layer on the carrier substrate, thereby simplifying the manufacturing process and reducing the cost.
- the adhesive may be a double-sided tape, in which case the adhesive layer and the carrier substrate may be recycled as a unit.
- the binder may also be a magnetically viscous layer. As shown in FIGS. 2 and 3, when the binder 33 is selected as a magnetically viscous layer whose viscous strength can be converted under the action of a magnetic field, the carrier substrate can be separately recycled since the magnetic viscous liquid is easily removed.
- the magnetic adhesive layer is mainly composed of a magnetorheological fluid.
- Magnetorheological Fluid is an intelligence The material exhibits a low viscosity Newtonian fluid property under zero magnetic field conditions, and exhibits a high viscosity, low fluidity plastomer (Bingham body) property under the action of a strong magnetic field.
- the magnetorheological fluid is a suspension of a mixture of a small magnetic soft magnetic particle having a high magnetic permeability and a low hysteresis and a non-magnetic magnetic liquid.
- the magnetorheological fluid currently in common use is a three-phase suspension.
- magnetorheological fluid formulation used in the embodiments of the present invention is as follows:
- Dispersed phase particles reduced hydroxy iron powder DT-50, micron;
- Stabilizer Nano-sized HS1 type SiO 2 , spherical.
- composition of the magnetorheological fluid can be determined according to the actual situation, and is not limited herein.
- the material of the substrate may be polyvinyl chloride (PVC), acrylic (also known as polymethyl methacrylate, PMMA), glass or poly. Ester materials.
- PVC polyvinyl chloride
- acrylic also known as polymethyl methacrylate, PMMA
- PMMA polymethyl methacrylate
- This substrate can reduce costs while avoiding contamination of the substrate.
- an embodiment of the present invention further provides a method for attaching a flexible substrate in the above display substrate. Since the principle of solving the problem is similar to the foregoing display substrate, the implementation of the method can be referred to the implementation of the display substrate. , the repetition will not be repeated.
- the method for attaching the flexible substrate of the display substrate provided by the embodiment of the present invention, as shown in FIG. 4, includes the following steps:
- the flexible substrate is attached to the magnetic adhesive layer which can be transformed under the action of the magnetic field
- the magnetic substrate is Under the action of the field, the viscosity of the magnetic adhesive layer is adjusted, and the viscosity is changed from low viscosity to high viscosity, and the flexible substrate and the carrier substrate can be fixed together, so that the attachment method is simple and convenient.
- the attaching the adhesive layer to the carrier substrate in step S401 can be implemented as follows:
- the bonding layer is attached to the carrier substrate through an adhesive in the bonding layer.
- the adhesive layer may be separately fabricated and provided as a three-layer structure having an adhesive on both sides and a substrate sandwiched between the adhesives.
- the adhesive on one side in contact with the flexible substrate is provided as a magnetic adhesive layer, and the adhesive on the side in contact with the carrier substrate can be selected in various ways. In this way, the bonding layer can be directly attached to the carrier substrate without the step of coating the magnetic adhesive layer on the carrier substrate, which simplifies the manufacturing process and reduces the cost.
- the adhesive on the side in contact with the carrier substrate may also be provided as a magnetic adhesive layer. Since the magnetic viscous liquid is easily removed, the carrier substrate can be recycled separately.
- a magnetic field is applied around the magnetic adhesive layer, and the magnetic adhesive layer can be converted from a liquid state to a plasty state, wherein the viscous state is a magnetic adhesive layer.
- the viscous strength is greater than the viscous strength of the magnetic adhesive layer in the liquid state.
- the magnetic viscous liquid layer is changed from a suspension having a low viscosity to a viscous plastomer having a high viscosity by a magnetic field to fix the flexible substrate and the glass substrate together.
- an embodiment of the present invention further provides a method for peeling off a flexible substrate in the above display substrate. Since the principle of solving the problem is similar to the foregoing display substrate, the implementation of the method can be referred to the implementation of the display substrate. The repetitions are not repeated here.
- the method for peeling off the flexible substrate provided by the embodiment of the present invention, as shown in FIG. 5, includes the following steps:
- the magnetic field around the bonding layer is removed, and the bonding layer includes a magnetic adhesive layer capable of changing the adhesive strength under the action of the magnetic field;
- the flexible substrate After removing the magnetic field, the flexible substrate is peeled off from the magnetic adhesive layer in the adhesive layer.
- the peeling method of the above flexible substrate provided by the embodiment of the present invention, since the magnetic field is removed After the high viscosity of the magnetic adhesive layer becomes a low viscosity, the peeling of the flexible substrate can be performed, so that the method is simple and convenient, and the flexible substrate can be peeled off without being damaged, and the adhesive layer and the carrier substrate can be recycled. And the magnetic adhesive layer is easy to remove and does not cause pollution.
- the method further includes: peeling the carrier substrate from the adhesive in the adhesive layer.
- the adhesive contacting the carrier substrate is selected as a magnetic adhesive layer
- the viscosity of the magnetic adhesive layer becomes low after the magnetic field is removed. The separation of the carrier substrate is facilitated, and the carrier substrate can be recycled separately.
- the magnetic adhesive layer is transformed from a plasty state to a liquid state, wherein the viscous state is a magnetic adhesive layer.
- the viscous strength is greater than the viscous strength of the magnetic adhesive layer in the liquid state.
- the magnetic viscous liquid layer is changed from a viscous plastomer having a high viscosity to a suspension having a low viscosity to facilitate peeling of the flexible substrate.
- the embodiment of the invention further provides a display substrate, comprising:
- An adhesive layer disposed between the carrier substrate and the flexible substrate
- the bonding layer comprises a magnetic adhesive layer capable of changing the adhesive strength under the action of a magnetic field
- the side of the bonding layer in contact with the carrier substrate has a magnetically viscous layer.
- the magnetic adhesive layer capable of changing the adhesive strength under the action of a magnetic field is disposed on one side of the carrier substrate, the magnetic adhesive layer can be passed through the magnetic field. Peeling of the carrier substrate is achieved, and the carrier substrate can be recycled separately.
- a method for attaching a display substrate and a flexible substrate thereof, and a method for peeling off, a magnetic adhesive layer capable of being transformed under the action of a magnetic field is disposed on the flexible substrate side of the display substrate, so that only Under the action of a magnetic field, through the magnetic viscosity layer
- the attachment and peeling of the flexible substrate during the manufacturing process can be realized, and the carrier substrate and the adhesive layer can be recycled.
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- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Laminated Bodies (AREA)
- Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
Claims (20)
- 一种显示基板,包括:载体基板;设置在所述载体基板上的柔性基板;以及设置在所述载体基板和柔性基板之间的粘结层;所述粘结层包括在磁场的作用下粘性强度能够转变的磁粘性层;所述粘结层与所述柔性基板接触的一侧具有所述磁粘性层。
- 如权利要求1所述的显示基板,其中,所述粘结层包括多个相互间隔开的粘结块。
- 如权利要求1或2所述的显示基板,其中,所述粘结层还包括基材和粘结剂;所述粘结层与所述载体基板接触的一侧具有所述粘结剂;所述基材设置在所述磁粘性层和所述粘结剂之间。
- 如权利要求3所述的显示基板,其中,所述粘结剂为磁粘性层。
- 如权利要求1-4中任一项所述的显示基板,其中,所述磁粘性层在磁场的作用下在液体状态和塑性体状态之间转换;所述塑性体状态的磁粘性层的粘性强度大于所述液体状态的磁粘性层的粘性强度。
- 如权利要求1-5中任一项所述的显示基板,其中,磁场强度越大,所述磁粘性层的粘性强度越大。
- 如权利要求1-6中任一项所述的显示基板,其中,所述磁粘性层包括铁磁性易磁化颗粒、分散剂和稳定剂。
- 如权利要求7所述的显示基板,其中,所述铁磁性易磁化颗粒是铁粉。
- 如权利要求7或8所述的显示基板,其中,所述分散剂是矿物油、硅油或合成油。
- 如权利要求7-9中任一项所述的显示基板,其中,所述稳定剂是SiO2。
- 如权利要求3-10中任一项所述的显示基板,其中,所述基材的材 料为聚氯乙烯、亚克力、玻璃或聚酯类材料。
- 一种显示基板,包括:载体基板;设置在所述载体基板上的柔性基板;以及设置在所述载体基板和柔性基板之间的粘结层;所述粘结层包括在磁场的作用下粘性强度能够转变的磁粘性层;所述粘结层与所述载体基板接触的一侧具有所述磁粘性层。
- 一种如权利要求1-11中任一项所述的显示基板的柔性基板的贴附方法,包括:将粘结层贴附在载体基板上,所述粘结层包括在磁场的作用下粘性强度能够转变的磁粘性层;将柔性基板贴附在所述磁粘性层上;以及在所述粘结层周围施加磁场,以使所述柔性基板通过所述粘结层固定在所述载体基板上。
- 如权利要求13所述的贴附方法,其中,将粘结层贴附在载体基板上包括:将粘结层通过所述粘结层中的粘结剂贴附在载体基板上。
- 如权利要求14所述的贴附方法,其中,所述粘结剂为磁粘性层。
- 如权利要求13-15中任一项所述的贴附方法,其中,在所述磁粘性层周围施加磁场,所述磁粘性层由液体状态向塑性体状态转换,所述塑性体状态的磁粘性层的粘性强度大于液体状态的磁粘性层的粘性强度。
- 一种如权利要求1-11中任一项所述的显示基板的柔性基板的剥离方法,包括:在柔性基板通过粘结层固定在载体基板后,将所述粘结层周围的磁场去掉,所述粘结层包括在磁场的作用下粘性强度能够转变的磁粘性层;以及去掉磁场后,将所述柔性基板从所述粘结层中的磁粘性层上剥离。
- 如权利要求17所述的剥离方法,还包括:将所述载体基板从所述粘结层中的粘结剂上剥离。
- 如权利要求18所述的剥离方法,其中,所述粘结剂为磁粘性层。
- 如权利要求17-19中任一项所述的剥离方法,其中,将所述粘结层周围的磁场去掉后,所述磁粘性层由塑性体状态向液体状态转化,所述塑性体状态的磁粘性层的粘性强度大于液体状态的磁粘性层的粘性强度。
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US15/521,753 US20180029347A1 (en) | 2016-01-15 | 2016-10-11 | Display Substrate And Methods For Attaching And Peeling Flexible Substrate Thereof |
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CN201610027120.XA CN105552089B (zh) | 2016-01-15 | 2016-01-15 | 基板结构及其柔性基板的贴附方法、剥离方法 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111048461A (zh) * | 2018-10-12 | 2020-04-21 | 瀚宇彩晶股份有限公司 | 电子装置的离型前结构及电子装置的制造方法 |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105552089B (zh) * | 2016-01-15 | 2018-09-07 | 京东方科技集团股份有限公司 | 基板结构及其柔性基板的贴附方法、剥离方法 |
CN105870327A (zh) * | 2016-06-17 | 2016-08-17 | 深圳市华星光电技术有限公司 | 柔性oled的制作方法及柔性oled |
CN106206610B (zh) * | 2016-08-18 | 2019-03-15 | 昆山国显光电有限公司 | 可分离的衬底结构及其制备方法、显示装置的制造方法 |
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CN107731885A (zh) * | 2017-11-20 | 2018-02-23 | 武汉华星光电半导体显示技术有限公司 | 柔性显示面板及制作方法 |
CN108878342B (zh) * | 2018-06-27 | 2022-04-19 | 歌尔股份有限公司 | 晶圆加工方法 |
CN109493737A (zh) * | 2018-12-14 | 2019-03-19 | 云谷(固安)科技有限公司 | 柔性模组、柔性显示面板和柔性显示装置 |
CN109904352B (zh) | 2019-02-20 | 2021-11-09 | 京东方科技集团股份有限公司 | 承载基板及制作方法、柔性基板及制作方法、显示装置 |
CN110444663A (zh) * | 2019-08-06 | 2019-11-12 | 昆山维信诺科技有限公司 | 基板结构、吸附及剥离方法、显示面板及显示装置 |
CN113135436B (zh) * | 2020-01-20 | 2023-02-17 | 上海广矩自动化设备有限公司 | 一种粘性片剥离方法 |
CN112670248B (zh) * | 2020-12-24 | 2022-10-04 | 武汉华星光电半导体显示技术有限公司 | 柔性显示面板及其制备方法 |
CN113012580B (zh) * | 2021-03-09 | 2022-11-01 | 深圳市华星光电半导体显示技术有限公司 | 一种牺牲层、显示面板制程方法及显示面板 |
CN114284452B (zh) * | 2021-12-17 | 2023-11-28 | 深圳市华星光电半导体显示技术有限公司 | 一种显示装置 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003173872A (ja) * | 2001-12-06 | 2003-06-20 | Sony Corp | アライメント方法、パターン形成方法及びアライメント装置、並びに有機エレクトロルミネッセンス表示装置及びその製造方法 |
TW200617128A (en) * | 2004-06-09 | 2006-06-01 | Entegris Inc | Magneto-active adhesive systems |
US20130095592A1 (en) * | 2010-07-16 | 2013-04-18 | Panasonic Corporation | Method for fabricating organic el device |
KR20150094113A (ko) * | 2014-02-10 | 2015-08-19 | 앰코 테크놀로지 코리아 주식회사 | 자성을 이용한 반도체 디바이스 탈착 방법 |
CN104993070A (zh) * | 2015-07-02 | 2015-10-21 | 深圳市华星光电技术有限公司 | 一种制作柔性oled显示器件的方法 |
CN105023884A (zh) * | 2014-04-18 | 2015-11-04 | 爱思开海力士有限公司 | 半导体封装及其制造方法 |
CN105552089A (zh) * | 2016-01-15 | 2016-05-04 | 京东方科技集团股份有限公司 | 基板结构及其柔性基板的贴附方法、剥离方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5667715A (en) * | 1996-04-08 | 1997-09-16 | General Motors Corporation | Magnetorheological fluids |
US6054008A (en) * | 1998-01-22 | 2000-04-25 | International Business Machines Corporation | Process for adhesively attaching a temporary lid to a microelectronic package |
DE19846902A1 (de) * | 1998-10-12 | 2000-05-04 | Beiersdorf Ag | Elektronenstrahlvernetzung und UV-Vernetzung von Masseschichten sowie Produkte, die mit diesen Masseschichten hergestellt werden |
US20050274454A1 (en) * | 2004-06-09 | 2005-12-15 | Extrand Charles W | Magneto-active adhesive systems |
US7956453B1 (en) * | 2008-01-16 | 2011-06-07 | Amkor Technology, Inc. | Semiconductor package with patterning layer and method of making same |
US8628636B2 (en) * | 2012-01-13 | 2014-01-14 | Advance Materials Corporation | Method of manufacturing a package substrate |
-
2016
- 2016-01-15 CN CN201610027120.XA patent/CN105552089B/zh active Active
- 2016-10-11 US US15/521,753 patent/US20180029347A1/en not_active Abandoned
- 2016-10-11 WO PCT/CN2016/101766 patent/WO2017121152A1/zh active Application Filing
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003173872A (ja) * | 2001-12-06 | 2003-06-20 | Sony Corp | アライメント方法、パターン形成方法及びアライメント装置、並びに有機エレクトロルミネッセンス表示装置及びその製造方法 |
TW200617128A (en) * | 2004-06-09 | 2006-06-01 | Entegris Inc | Magneto-active adhesive systems |
US20130095592A1 (en) * | 2010-07-16 | 2013-04-18 | Panasonic Corporation | Method for fabricating organic el device |
KR20150094113A (ko) * | 2014-02-10 | 2015-08-19 | 앰코 테크놀로지 코리아 주식회사 | 자성을 이용한 반도체 디바이스 탈착 방법 |
CN105023884A (zh) * | 2014-04-18 | 2015-11-04 | 爱思开海力士有限公司 | 半导体封装及其制造方法 |
CN104993070A (zh) * | 2015-07-02 | 2015-10-21 | 深圳市华星光电技术有限公司 | 一种制作柔性oled显示器件的方法 |
CN105552089A (zh) * | 2016-01-15 | 2016-05-04 | 京东方科技集团股份有限公司 | 基板结构及其柔性基板的贴附方法、剥离方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111048461A (zh) * | 2018-10-12 | 2020-04-21 | 瀚宇彩晶股份有限公司 | 电子装置的离型前结构及电子装置的制造方法 |
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