TW200610648A - Electro-active adhesive systems - Google Patents

Electro-active adhesive systems

Info

Publication number
TW200610648A
TW200610648A TW094119058A TW94119058A TW200610648A TW 200610648 A TW200610648 A TW 200610648A TW 094119058 A TW094119058 A TW 094119058A TW 94119058 A TW94119058 A TW 94119058A TW 200610648 A TW200610648 A TW 200610648A
Authority
TW
Taiwan
Prior art keywords
electro
active
active adhesive
adhesive
adherends
Prior art date
Application number
TW094119058A
Other languages
Chinese (zh)
Inventor
Charles W Extrand
Original Assignee
Entegris Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Entegris Inc filed Critical Entegris Inc
Publication of TW200610648A publication Critical patent/TW200610648A/en

Links

Landscapes

  • Adhesives Or Adhesive Processes (AREA)

Abstract

A method of adhesive bonding by electric field. The method includes providing at least two adherends to be bonded, providing an electro-active adhesive between the at least two adherends, wherein the electro-active adhesive includes a multiplicity of electro-active particles and an adhesive binder, and applying an electric field to change the adhesion of the electro-active adhesive system to at least one of the adherends. Various carriers for microelectronic devices including electro-active adhesive contact surfaces are also included within the scope of the invention.
TW094119058A 2004-06-09 2005-06-09 Electro-active adhesive systems TW200610648A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US57842204P 2004-06-09 2004-06-09

Publications (1)

Publication Number Publication Date
TW200610648A true TW200610648A (en) 2006-04-01

Family

ID=57807593

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094119058A TW200610648A (en) 2004-06-09 2005-06-09 Electro-active adhesive systems

Country Status (1)

Country Link
TW (1) TW200610648A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017118217A1 (en) * 2016-01-04 2017-07-13 京东方科技集团股份有限公司 Substrate structure and attachment method and stripping method for flexible substrate thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017118217A1 (en) * 2016-01-04 2017-07-13 京东方科技集团股份有限公司 Substrate structure and attachment method and stripping method for flexible substrate thereof
US10500816B2 (en) 2016-01-04 2019-12-10 Boe Technology Group Co., Ltd. Substrate structure, method for attaching flexible substrate and method for peeling off flexible substrate

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