CN104091891A - 柔性基板及其制造方法、显示装置 - Google Patents

柔性基板及其制造方法、显示装置 Download PDF

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CN104091891A
CN104091891A CN201410242864.4A CN201410242864A CN104091891A CN 104091891 A CN104091891 A CN 104091891A CN 201410242864 A CN201410242864 A CN 201410242864A CN 104091891 A CN104091891 A CN 104091891A
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李文波
刘广辉
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BOE Technology Group Co Ltd
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Priority to PCT/CN2014/093175 priority patent/WO2015184756A1/zh
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Abstract

本发明涉及一种柔性基板及其制造方法、显示装置，所述柔性基板包括显示面板区域和柔性印刷电路板区域，其中：所述显示面板区域包括：柔性衬底；栅极，形成在所述柔性衬底上；栅极绝缘层，形成在所述栅极上；有源层，形成在所述栅极绝缘层上；源极和漏极，形成在所述有源层上；钝化层，形成在所述源极和所述漏极上；像素电极，通过所述钝化层上的开口与所述漏极电连接；所述柔性印刷电路板区域包括：导线结构，形成在所述柔性衬底上，且所述导线结构由制备所述栅极、所述源极和漏极和所述像素电极的材料中的至少一种组合构成。

Description

柔性基板及其制造方法、显示装置
技术领域
本发明涉及显示技术领域，具体涉及一种柔性基板及其制造方法、显示装置。 
背景技术
集成化是显示技术将来的一个重要发展趋势，可有效推动显示器件往更高精细度、更轻薄、更省电的方向发展。随着薄膜晶体管(TFT)器件电子迁移率的提升和工艺线宽的细化，扫描驱动电路、数据驱动电路以及定时器(Tcon)、存储器、CPU等往基板上的集成都成为可能。 
驱动集成电路在显示屏上的存在形式主要有TAB(Tape Aotomated Bonding，即卷带自动键合)、COB(Chip On Board，即板上芯片封装)、COG(Chip On Glass，即玻璃上芯片封装)、COF(Chip On Film，即膜上芯片封装)、CIA(Chip in Array，即阵列基板内芯片封装)等，其中TAB是将封装形式为TCP(Tape Carrier Package，即带载封装)的集成电路用各向异性导电胶分别固定在LCD(液晶显示器)和PCB(印刷电路板)上；而COB是将芯片直接键合在PCB上；COG是将芯片直接键合在玻璃上，这种安装方式可大大减小整个LCD模块的体积，且易于大批量生产，适用于诸如手机、PDA等便携式电子产品的消费类电子产品用LCD；COF是将芯片直接安装在柔性PCB上，这种连接方式的集成度较高，外围元件可以与集成电路一起安装在柔性PCB上；CIA是将芯片电路直接做在阵列基板上，较为成功的应用是将栅极集成电路直接集成在显示屏上，而对于数据集成电路直接做在玻璃上，工艺难度大，目前量产的手机产品上一般采用COG的方式进行。以上这些工艺都需要 集成电路或柔性印刷电路板(FPC)的引脚对位以及键合(bonding)工艺，因此存在对位误差、接触不良等问题，影响产品的良率。 
柔性印刷电路板(FPC)具有可曲可绕、体积小、重量轻的优点，在电子产品起到导通和桥梁的作用，使电子产品性能更好，体积更小。随着大众对柔性显示的高度关注，集成化生产是显示面板生产的发展趋势，需要在同一衬底上同时制备阵列基板和外围柔性印刷电路以降低生产成本。 
发明内容
本发明所要解决的技术问题是同一衬底上集成阵列基板和柔性印刷电路的问题。 
为此目的，本发明提出了一种柔性基板，包括显示面板区域和柔性印刷电路板区域，其中：所述显示面板区域包括：柔性衬底；栅极，形成在所述柔性衬底上；栅极绝缘层，形成在所述栅极上；有源层，形成在所述栅极绝缘层上；源极和漏极，形成在所述有源层上；钝化层，形成在所述源极和所述漏极上；像素电极，通过所述钝化层上的开口与所述漏极电连接；所述柔性印刷电路板区域包括：导线结构，形成在所述柔性衬底上，且所述导线结构由制备所述栅极、所述源极和漏极和所述像素电极的材料中的至少一种组合构成。 
本发明还提出了一种柔性基板的制造方法，包括：在柔性衬底上形成栅极金属层，并对所述栅极金属层进行构图以在显示面板区域形成栅极；在所述栅极上依次形成栅极绝缘层和有源层，并对所述栅极绝缘层和所述有源层进行构图；在所述有源层上形成源极和漏极；在所述源极和漏极上形成钝化层，并在所述钝化层上形成开口以暴露出所述漏极的至少一部分；在所述钝化层上形成像素电极；其中，在所述形成栅极、所述形成源极和漏极和所述形成像素电极中的至少一个步骤的同时在柔性印刷电路板区域内形成导线结构。 
本发明进一步提出了一种柔性显示装置，其包括上述柔性基板。 
通过采用本发明所公开的柔性基板及其制造方法、显示装置，能在同一衬底上同时制备显示面板和周边FPC，且无需FPC与显示面板的对位和键合等工艺，显著简化了生产工艺，降低了制造成本。 
附图说明
通过参考附图会更加清楚的理解本发明的特征和优点，附图是示意性的而不应理解为对本发明进行任何限制，在附图中： 
图1示出了根据本发明实施例的柔性印刷电路板的结构示意图； 
图2示出了根据本发明实施例的柔性基板的示意图； 
图3A至3D示出了根据本发明实施例的柔性基板制造工艺的示意图； 
图4示出了根据本发明另一实施例的柔性基板的示意图； 
图5A至5D示出了根据本发明的实施例的柔性基板工艺的示意图； 
图6A和6B示出了根据本发明的实施例的柔性基板的示意图。 
具体实施方式
下面将结合附图对本发明的实施例进行详细描述。 
图1示出了根据本发明实施例的柔性印刷电路板(FPC)的结构示意图。FPC经曝光、显影、刻蚀后可在柔性基板上形成导电通路。FPC包括依次叠加的柔性衬底11、导电层12、胶层13和覆盖基材14构成，柔性衬底11和覆盖基材14可采用相同材料制成，例如可以是PI(聚酰胺)膜或PET(聚酯)膜。PI价格较高但耐燃性较佳，PET价格较低但不耐热，因此若有焊接需求时大部分均选用PI材质。 
图2示出了根据本发明实施例的柔性基板的示意图。如图2所示，显示面板的阵列基板与FPC基板共用同一衬底21，衬底21的材料包括但不限于柔性PI或PET材料。在衬底21的显示面板区域内形成有薄膜晶体管(TFT)结构，其中栅极22形成在衬底21上，栅极绝缘层23形成在栅极22上并覆盖栅极22，有源层24形成在栅极绝缘层23上，源极 25和漏极26形成在有源层24上，钝化层27覆盖源极25和漏极26，像素电极28通过钝化层27上的开口与漏极26电连接。在衬底21的FPC区域内，导线结构形成在栅极绝缘层23上的开口内，并且导线结构的第一导电层31由制备TFT的栅极材料制成，第二导电层32由制备TFT的源极/漏极材料制成，制备TFT的钝化层27作为导线结构的绝缘保护层，对于FPC上的电路引脚等区域，则去除掉钝化层以暴露出导线结构。图2只是示例，本发明的导线结构并不限于此，其可由制备TFT的栅极材料、源极/漏极材料、像素电极或上述任意组合构成，导线结构的材料包括但不限于Mo、Fe、Ag、Cu、Al、碳纳米管、石墨烯等，但优选电阻率较低的材料，如金属Cu、碳纳米管、石墨烯等。 
图3A至3D示出了根据本发明实施例的柔性基板制造工艺的示意图，仍然以TFT的栅极金属层和源/漏极金属层的叠层作为FPC的导线结构为例进行说明。 
如图3A所示，采用溅射等方法在柔性衬底21上形成栅极金属层，并通过光刻刻蚀工艺，在显示面板区域形成栅极22，同时在FPC区域形成第一导电层31，其中第一导电层31的分布布局根据集成电路的需求而定。 
如图3B所示，采用CVD、溅射等方法在柔性衬底21上形成栅极绝缘层23、有源层24，并去除FPC区域内的有源层24和部分栅极绝缘层23，以暴露出第一导电层31。 
如图3C所示，采用溅射等方法形成源漏金属层，并通过光刻刻蚀工艺，在显示面板区域形成源极25和漏极26，在FPC区域内形成第二导电层32，并与第一导电层31形成叠加效果，以增加导线厚度，降低电阻。 
如图3D所示，采用CVD等方法形成钝化层27，并在显示面板区域的钝化层27上形成过孔以暴露出漏极26，并采用溅射、刻蚀等工艺制备像素电极28。对于FPC区域也可选择性地进行过孔刻蚀，以便于 后期焊接芯片导线。 
图4示出了根据本发明另一实施例的柔性基板的示意图。如图4所示，FPC区域内的导线结构由与栅极同步形成的第一导电层31、与源/漏极同步形成的第二导电层32和与像素电极同步形成的第三导电层33构成，第三导电层33暴露在外部以便于后期焊接芯片导线，同时由于第三导电层33与像素电极同步形成，采用诸如ITO等材料制成，有助于导线氧化。 
图5A至5D示出了根据本发明的实施例的柔性基板工艺的示意图。 
如图5A所示，首先，将柔性衬底52用粘合剂材料贴合在承载板51上。柔性衬底52可以采用PI或PET等材料，承载板51可以采用玻璃等硬质材料。 
如图5B所示，采用上文说明的柔性基板制造工艺，同步完成TFT工艺制程和FPC工艺制程，即形成了TFT结构和导线结构53。 
如图5C所示，将上基板54贴合在下方的柔性基板上，完成对盒及封装工艺。 
如图5D所示，从承载板上剥离得到柔性背板。 
图6A和6B示出了根据本发明的实施例的柔性基板的示意图。如图6A所示，柔性基板61上具有显示面板区域61和FPC区域62。由于基板是柔性的，可以将FPC区域62置于显示面板区域61后面，如图6B所示，从而有利于制备窄边框的显示装置。根据本发明的柔性显示装置包括但不限于电子纸显示、OLED显示、聚合物分散液晶膜显示等。 
通过采用本发明的柔性基板及其制造方法，能在同一衬底上同时制备显示面板及周边FPC，且无需FPC与显示面板的对位和键合等工艺，显著简化了生产工艺，降低了制造成本，所制造的显示装置具备轻便、耐冲击、便于携带等优点。 
虽然结合附图描述了本发明的实施方式，但是本领域技术人员可 以在不脱离本发明的精神和范围的情况下作出各种修改和变型，这样的修改和变型均落入由所附权利要求所限定的范围之内。 

Claims (10)

1.一种柔性基板，包括显示面板区域和柔性印刷电路板区域，其中：
所述显示面板区域包括：
柔性衬底；
栅极，形成在所述柔性衬底上；
栅极绝缘层，形成在所述栅极上；
有源层，形成在所述栅极绝缘层上；
源极和漏极，形成在所述有源层上；
钝化层，形成在所述源极和所述漏极上；
像素电极，通过所述钝化层上的开口与所述漏极电连接；
所述柔性印刷电路板区域包括：
导线结构，形成在所述柔性衬底上，且所述导线结构由制备所述栅极、所述源极和漏极和所述像素电极的材料中的至少一种组合构成。
2.根据权利要求1所述的柔性基板，其中所述导线结构包括由制备所述栅极的材料构成的第一导电层和由制备所述源极和漏极的材料构成的第二导电层。
3.根据权利要求2所述的柔性基板，其中所述导线结构还包括由制备所述像素电极的材料构成的第三导电层。
4.根据权利要求1所述的柔性基板，其中所述导线结构的材料包括Mo、Fe、Ag、Cu、Al、碳纳米管、或石墨烯。
5.根据权利要求1所述的柔性基板，其中所述柔性衬底包括PI或PET材料。
6.根据权利要求1至5中任一项所述的柔性基板，其中所述柔性印刷电路板区域弯折于所述显示面板区域后面。
7.一种柔性基板的制造方法，包括：
在柔性衬底上形成栅极金属层，并对所述栅极金属层进行构图以在显示面板区域形成栅极；
在所述栅极上依次形成栅极绝缘层和有源层，并对所述栅极绝缘层和所述有源层进行构图；
在所述有源层上形成源极和漏极；
在所述源极和漏极上形成钝化层，并在所述钝化层上形成开口以暴露出所述漏极的至少一部分；
在所述钝化层上形成像素电极；
其中，在所述形成栅极、所述形成源极和漏极和所述形成像素电极中的至少一个步骤的同时在柔性印刷电路板区域内形成导线结构。
8.根据权利要求7所述的方法，其中，在所述形成栅极的同时在所述柔性印刷电路板区域内形成所述导线结构的第一导电层，并且在所述形成源极和漏极的同时形成所述导线结构的第二导电层。
9.根据权利要求8所述的方法，还包括在所述形成像素电极的同时形成所述导线结构的第三导电层。
10.一种柔性显示装置，其包括根据权利要求1至6中任一项所述的柔性基板。
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