CN1822366A - 半导体器件 - Google Patents
半导体器件 Download PDFInfo
- Publication number
- CN1822366A CN1822366A CNA2006100074814A CN200610007481A CN1822366A CN 1822366 A CN1822366 A CN 1822366A CN A2006100074814 A CNA2006100074814 A CN A2006100074814A CN 200610007481 A CN200610007481 A CN 200610007481A CN 1822366 A CN1822366 A CN 1822366A
- Authority
- CN
- China
- Prior art keywords
- semiconductor device
- internal circuit
- area
- chip
- holding wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 142
- 230000015556 catabolic process Effects 0.000 claims description 5
- 238000003825 pressing Methods 0.000 claims description 2
- 230000001681 protective effect Effects 0.000 abstract 3
- 239000010410 layer Substances 0.000 description 45
- 239000000758 substrate Substances 0.000 description 20
- 238000000926 separation method Methods 0.000 description 16
- 230000015654 memory Effects 0.000 description 14
- 238000000034 method Methods 0.000 description 14
- 239000011229 interlayer Substances 0.000 description 11
- 239000004973 liquid crystal related substance Substances 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 6
- 239000010936 titanium Substances 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 5
- 230000006870 function Effects 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- 229910052719 titanium Inorganic materials 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 238000002955 isolation Methods 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 230000012447 hatching Effects 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 230000005236 sound signal Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000011010 flushing procedure Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- MAKDTFFYCIMFQP-UHFFFAOYSA-N titanium tungsten Chemical compound [Ti].[W] MAKDTFFYCIMFQP-UHFFFAOYSA-N 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 210000002469 basement membrane Anatomy 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K11/00—Multiple-way valves, e.g. mixing valves; Pipe fittings incorporating such valves
- F16K11/02—Multiple-way valves, e.g. mixing valves; Pipe fittings incorporating such valves with all movable sealing faces moving as one unit
- F16K11/06—Multiple-way valves, e.g. mixing valves; Pipe fittings incorporating such valves with all movable sealing faces moving as one unit comprising only sliding valves, i.e. sliding closure elements
- F16K11/065—Multiple-way valves, e.g. mixing valves; Pipe fittings incorporating such valves with all movable sealing faces moving as one unit comprising only sliding valves, i.e. sliding closure elements with linearly sliding closure members
- F16K11/07—Multiple-way valves, e.g. mixing valves; Pipe fittings incorporating such valves with all movable sealing faces moving as one unit comprising only sliding valves, i.e. sliding closure elements with linearly sliding closure members with cylindrical slides
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B13/00—Oxygen; Ozone; Oxides or hydroxides in general
- C01B13/02—Preparation of oxygen
- C01B13/0229—Purification or separation processes
- C01B13/0248—Physical processing only
- C01B13/0259—Physical processing only by adsorption on solids
- C01B13/0262—Physical processing only by adsorption on solids characterised by the adsorbent
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B21/00—Nitrogen; Compounds thereof
- C01B21/04—Purification or separation of nitrogen
- C01B21/0405—Purification or separation processes
- C01B21/0433—Physical processing only
- C01B21/045—Physical processing only by adsorption in solids
- C01B21/0455—Physical processing only by adsorption in solids characterised by the adsorbent
- C01B21/0466—Zeolites
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K31/00—Actuating devices; Operating means; Releasing devices
- F16K31/02—Actuating devices; Operating means; Releasing devices electric; magnetic
- F16K31/04—Actuating devices; Operating means; Releasing devices electric; magnetic using a motor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/0401—Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01022—Titanium [Ti]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/049—Nitrides composed of metals from groups of the periodic table
- H01L2924/0494—4th Group
- H01L2924/04941—TiN
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12036—PN diode
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Analytical Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Inorganic Chemistry (AREA)
- General Life Sciences & Earth Sciences (AREA)
- Geology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Semiconductor Integrated Circuits (AREA)
- Liquid Crystal (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
Abstract
Description
Claims (11)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP037129/2005 | 2005-02-15 | ||
JP2005037129A JP4846244B2 (ja) | 2005-02-15 | 2005-02-15 | 半導体装置 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201010142391A Division CN101807573A (zh) | 2005-02-15 | 2006-02-14 | 半导体器件 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1822366A true CN1822366A (zh) | 2006-08-23 |
CN1822366B CN1822366B (zh) | 2010-05-12 |
Family
ID=36814810
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201010142391A Pending CN101807573A (zh) | 2005-02-15 | 2006-02-14 | 半导体器件 |
CN2006100074814A Expired - Fee Related CN1822366B (zh) | 2005-02-15 | 2006-02-14 | 半导体器件 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201010142391A Pending CN101807573A (zh) | 2005-02-15 | 2006-02-14 | 半导体器件 |
Country Status (5)
Country | Link |
---|---|
US (2) | US7629652B2 (zh) |
JP (1) | JP4846244B2 (zh) |
KR (1) | KR20060092093A (zh) |
CN (2) | CN101807573A (zh) |
TW (1) | TWI430431B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104715082A (zh) * | 2013-12-12 | 2015-06-17 | 北京华大九天软件有限公司 | 一种平板显示器设计中通过重复的特征形状实现窄边框布线轮廓的翼状布线方法 |
CN109377874A (zh) * | 2018-12-21 | 2019-02-22 | 上海中航光电子有限公司 | 显示面板和显示装置 |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4846244B2 (ja) * | 2005-02-15 | 2011-12-28 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP4010336B2 (ja) | 2005-06-30 | 2007-11-21 | セイコーエプソン株式会社 | 集積回路装置及び電子機器 |
US7755587B2 (en) | 2005-06-30 | 2010-07-13 | Seiko Epson Corporation | Integrated circuit device and electronic instrument |
JP4661400B2 (ja) | 2005-06-30 | 2011-03-30 | セイコーエプソン株式会社 | 集積回路装置及び電子機器 |
JP4151688B2 (ja) * | 2005-06-30 | 2008-09-17 | セイコーエプソン株式会社 | 集積回路装置及び電子機器 |
KR100828792B1 (ko) | 2005-06-30 | 2008-05-09 | 세이코 엡슨 가부시키가이샤 | 집적 회로 장치 및 전자 기기 |
JP4010334B2 (ja) * | 2005-06-30 | 2007-11-21 | セイコーエプソン株式会社 | 集積回路装置及び電子機器 |
JP4552776B2 (ja) * | 2005-06-30 | 2010-09-29 | セイコーエプソン株式会社 | 集積回路装置及び電子機器 |
JP4186970B2 (ja) | 2005-06-30 | 2008-11-26 | セイコーエプソン株式会社 | 集積回路装置及び電子機器 |
JP4830371B2 (ja) | 2005-06-30 | 2011-12-07 | セイコーエプソン株式会社 | 集積回路装置及び電子機器 |
JP4010335B2 (ja) | 2005-06-30 | 2007-11-21 | セイコーエプソン株式会社 | 集積回路装置及び電子機器 |
JP4951902B2 (ja) * | 2005-06-30 | 2012-06-13 | セイコーエプソン株式会社 | 集積回路装置及び電子機器 |
JP4665677B2 (ja) | 2005-09-09 | 2011-04-06 | セイコーエプソン株式会社 | 集積回路装置及び電子機器 |
JP4586739B2 (ja) * | 2006-02-10 | 2010-11-24 | セイコーエプソン株式会社 | 半導体集積回路及び電子機器 |
JP5123510B2 (ja) * | 2006-09-28 | 2013-01-23 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP4882700B2 (ja) * | 2006-11-22 | 2012-02-22 | セイコーエプソン株式会社 | 集積回路装置及び電子機器 |
JP5147234B2 (ja) | 2006-12-28 | 2013-02-20 | パナソニック株式会社 | 半導体集積回路装置 |
JP5234717B2 (ja) * | 2007-03-20 | 2013-07-10 | ローム株式会社 | 半導体集積回路装置 |
JP5097096B2 (ja) * | 2007-12-28 | 2012-12-12 | パナソニック株式会社 | 半導体集積回路 |
JP5301231B2 (ja) * | 2008-09-30 | 2013-09-25 | 株式会社テラミクロス | 半導体装置 |
JP5395407B2 (ja) * | 2008-11-12 | 2014-01-22 | ルネサスエレクトロニクス株式会社 | 表示装置駆動用半導体集積回路装置および表示装置駆動用半導体集積回路装置の製造方法 |
JP2010224084A (ja) * | 2009-03-23 | 2010-10-07 | Hitachi Displays Ltd | 液晶表示装置 |
JP5503208B2 (ja) * | 2009-07-24 | 2014-05-28 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP5315186B2 (ja) | 2009-09-18 | 2013-10-16 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
JP5746494B2 (ja) * | 2010-11-24 | 2015-07-08 | ルネサスエレクトロニクス株式会社 | 半導体装置、液晶ディスプレイパネル及び携帯情報端末 |
EP3534399A1 (en) * | 2011-05-24 | 2019-09-04 | Sony Corporation | Semiconductor device |
KR102272214B1 (ko) * | 2015-01-14 | 2021-07-02 | 삼성디스플레이 주식회사 | 표시 장치 |
JP6664897B2 (ja) * | 2015-07-22 | 2020-03-13 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
CN108511411B (zh) | 2017-02-28 | 2021-09-10 | 株式会社村田制作所 | 半导体装置 |
JP2018142688A (ja) * | 2017-02-28 | 2018-09-13 | 株式会社村田製作所 | 半導体装置 |
US11227862B2 (en) | 2017-02-28 | 2022-01-18 | Murata Manufacturing Co., Ltd. | Semiconductor device |
JP7451362B2 (ja) | 2020-09-11 | 2024-03-18 | キオクシア株式会社 | 半導体装置及び配線構造 |
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JPH07153844A (ja) * | 1993-12-01 | 1995-06-16 | Nec Corp | 半導体集積回路装置 |
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WO1997000462A1 (fr) * | 1995-06-16 | 1997-01-03 | Hitachi, Ltd. | Afficheur a cristaux liquides convenant a un cadre etroit |
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JP3948822B2 (ja) * | 1998-04-21 | 2007-07-25 | ローム株式会社 | 半導体集積回路 |
JP3693843B2 (ja) * | 1999-02-25 | 2005-09-14 | 株式会社日立製作所 | 液晶表示装置 |
US6825504B2 (en) * | 1999-05-03 | 2004-11-30 | Hitachi, Ltd. | Semiconductor integrated circuit device and method of manufacturing the same |
JP4017060B2 (ja) * | 2000-09-06 | 2007-12-05 | 株式会社ルネサステクノロジ | 半導体装置 |
JP4298179B2 (ja) | 2001-02-13 | 2009-07-15 | セイコーインスツル株式会社 | 半導体装置 |
JP4907797B2 (ja) * | 2001-08-21 | 2012-04-04 | ルネサスエレクトロニクス株式会社 | 半導体集積回路および液晶表示装置 |
JP2004006691A (ja) * | 2002-03-29 | 2004-01-08 | Sanyo Electric Co Ltd | 半導体集積回路装置 |
TW200305272A (en) * | 2002-03-29 | 2003-10-16 | Sanyo Electric Co | Semiconductor integrated circuit device |
JP4445189B2 (ja) * | 2002-08-29 | 2010-04-07 | 株式会社ルネサステクノロジ | 半導体装置およびその製造方法 |
JP2004296998A (ja) * | 2003-03-28 | 2004-10-21 | Matsushita Electric Ind Co Ltd | 半導体装置 |
JP4428504B2 (ja) * | 2003-04-23 | 2010-03-10 | 株式会社ルネサステクノロジ | 半導体集積回路装置 |
JP5008840B2 (ja) * | 2004-07-02 | 2012-08-22 | ローム株式会社 | 半導体装置 |
JP4846244B2 (ja) * | 2005-02-15 | 2011-12-28 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
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2005
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2006
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- 2006-02-14 KR KR1020060014124A patent/KR20060092093A/ko not_active Application Discontinuation
- 2006-02-14 CN CN201010142391A patent/CN101807573A/zh active Pending
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- 2006-02-14 US US11/353,156 patent/US7629652B2/en active Active
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104715082A (zh) * | 2013-12-12 | 2015-06-17 | 北京华大九天软件有限公司 | 一种平板显示器设计中通过重复的特征形状实现窄边框布线轮廓的翼状布线方法 |
CN109377874A (zh) * | 2018-12-21 | 2019-02-22 | 上海中航光电子有限公司 | 显示面板和显示装置 |
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US20060180864A1 (en) | 2006-08-17 |
US7629652B2 (en) | 2009-12-08 |
KR20060092093A (ko) | 2006-08-22 |
US8294214B2 (en) | 2012-10-23 |
JP2006228770A (ja) | 2006-08-31 |
CN1822366B (zh) | 2010-05-12 |
TW200723498A (en) | 2007-06-16 |
CN101807573A (zh) | 2010-08-18 |
US20100059882A1 (en) | 2010-03-11 |
TWI430431B (zh) | 2014-03-11 |
JP4846244B2 (ja) | 2011-12-28 |
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