WO2010001812A1 - 可撓性回路基板及びその製造方法並びに可撓性回路基板の屈曲部構造 - Google Patents
可撓性回路基板及びその製造方法並びに可撓性回路基板の屈曲部構造 Download PDFInfo
- Publication number
- WO2010001812A1 WO2010001812A1 PCT/JP2009/061644 JP2009061644W WO2010001812A1 WO 2010001812 A1 WO2010001812 A1 WO 2010001812A1 JP 2009061644 W JP2009061644 W JP 2009061644W WO 2010001812 A1 WO2010001812 A1 WO 2010001812A1
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- WO
- WIPO (PCT)
- Prior art keywords
- circuit board
- flexible circuit
- wiring
- metal foil
- bent portion
- Prior art date
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Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21B—ROLLING OF METAL
- B21B1/00—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations
- B21B1/40—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations for rolling foils which present special problems, e.g. because of thinness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21B—ROLLING OF METAL
- B21B3/00—Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences ; Rolling of aluminium, copper, zinc or other non-ferrous metals
- B21B2003/005—Copper or its alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
Definitions
- the present invention relates to a flexible circuit board that is used with a bent portion in any one of them, a method for manufacturing the same, and a bent portion structure of the flexible circuit board.
- the present invention relates to a flexible circuit board excellent in flexibility, a manufacturing method thereof, and a bent portion structure of the flexible circuit board.
- a flexible circuit board (flexible printed circuit board) having a resin layer and a wiring made of metal foil can be used by being bent, a movable part in a hard disk, a hinge part of a mobile phone, Widely used in various electronic and electrical devices such as sliding slides, printer heads, optical pickups, and notebook PCs.
- the flexible circuit board can be folded and stored in a limited space or used in various movements of electronic devices. Corresponding flexibility is required. Therefore, it is necessary to improve the mechanical characteristics such as the strength of the flexible circuit board so that it can cope with the bending with a smaller radius of curvature at the bent portion and the operation in which the bending is frequently repeated. It has become.
- the flexible circuit board (see Patent Document 1) wired so as to be inclined with respect to the rotation axis, or in the rotation direction of the hinge portion.
- a method has been proposed in which a spiral portion formed by spiraling one or more turns is formed and the change in the diameter of the spiral portion due to the opening / closing operation is reduced to reduce damage by increasing the number of turns (see Patent Document 2). .
- any of these methods restricts the design of the flexible circuit board.
- the strength (I) of the (200) plane determined by X-ray diffraction (X-ray diffraction in the thickness direction of the copper foil) of the rolled copper foil was determined by X-ray diffraction of fine powder copper (200 ) It has been reported that when I / I 0 > 20 with respect to the surface strength (I 0 ), the flexibility is excellent (see Patent Documents 3 and 4). That is, the flexibility of the copper foil improves as the cube orientation, which is the recrystallized texture of copper, develops. Therefore, a flexible circuit board in which the degree of development of the cube texture is defined by the parameter (I / I 0 ) A copper foil suitable as a wiring material is known.
- the rolled copper foil has a crystal structure in which the proportion of crystal grains oriented in the orientation in which the main slip surface can be active with respect to bending deformation is 80% or more in area ratio as observed from the rolled surface.
- the bending strength is excellent (see paragraph 0013 of Patent Document 5).
- it is preferable that the cross section of the bent wiring is oriented in ⁇ 100 ⁇ . Can be interpreted.
- the present invention is not limited in the design of the flexible circuit board, and has sufficient strength to withstand repeated bending and bending with a small radius of curvature.
- An excellent flexible circuit board is provided.
- the present inventors have surprisingly improved the bending strength when bent at a predetermined angle with respect to the crystal axis of the metal foil having a cubic crystal structure,
- new findings such as excellent flexibility were obtained.
- the object of the present invention is to provide durability and excellent flexibility in harsh conditions such as hinge portions or slide sliding portions of mobile phones and small electronic devices, particularly in repeated bending portions having a small curvature radius. It is to provide a flexible circuit board.
- Another object of the present invention is to manufacture a flexible circuit board capable of obtaining a flexible circuit board having excellent bending durability and flexibility without being restricted by the design of the flexible circuit board. It is to provide a method.
- Another object of the present invention is to provide durability and resistance to harsh conditions such as hinge portions or slide sliding portions of mobile phones, small electronic devices, etc., particularly in repeated bending portions having a small curvature radius.
- An object of the present invention is to provide an excellent flexible circuit board bent portion structure.
- a flexible circuit board including a resin layer and a wiring formed from a metal foil, and having a bent portion at least at one place of the wiring,
- the metal foil is made of a metal having a cubic crystal structure, and the cross section of the wiring when cut in the thickness direction from the ridgeline at the bent portion is from (100) to (110) with [001] as the crystal zone axis.
- the cross section of the wiring when cut in the thickness direction from the ridgeline at the bent portion is connected by a point representing (20 10) and a point representing (110) in the stereo triangle of (100) standard projection drawing
- the metal foil is a copper foil, and the strength (I) of (200) plane determined by X-ray diffraction in the thickness direction of the copper foil is (200) plane determined by X-ray diffraction of fine powder copper
- the metal foil is made of a metal having a face-centered cubic structure, and the basic crystal axis ⁇ 100> of the unit cell of the face-centered cubic structure is set to two orthogonal axes in the thickness direction of the metal foil and one direction in the foil surface.
- the preferential orientation region having an azimuth difference of 10 ° or less has a main orientation so as to occupy 50% or more in area ratio, and the wiring section cut from the ridgeline of the bent portion in the thickness direction of the metal foil.
- the flexible circuit board according to (1) or (2), wherein the normal has an angle of 2.9 to 87.1 ° with the ⁇ 100> main direction in the foil plane.
- the cross section of the wiring when it is made of a metal having a crystal structure of the system and is cut in the thickness direction from the ridgeline at the bent portion is (100) to (110) in the rotation direction with the crystallographic axis as [001]
- the cross section of the wiring when cut in the thickness direction from the ridgeline at the bent part is connected by a point representing (20 10) and a point representing (110) in the stereo triangle of (100) standard projection drawing
- a method for producing a flexible circuit board comprising a resin layer and a wiring formed from a metal foil, and having a bent portion in at least one position of the wiring,
- the metal foil is made of a metal having a cubic crystal structure, and the ridge line at the bent portion has an angle of 2.9 to 87.1 ° with one of the basic crystal axes ⁇ 100> in the plane of the metal foil.
- the metal foil is a copper foil, and the strength (I) of (200) plane determined by X-ray diffraction in the thickness direction of the copper foil is (200) plane determined by X-ray diffraction of fine powder copper
- (13) for a rolled metal foil having a face-centered cubic structure the basic crystal axis ⁇ 100> of the unit cell of the face-centered cubic structure is relative to two orthogonal axes in the thickness direction of the metal foil and one direction in the foil surface.
- Method for manufacturing a circuit board 15.
- the flexible circuit board when the flexible circuit board is bent, since the shearing of the bent portion in the main strain direction becomes easy, there is an effect that the breakage hardly occurs. In addition, metal fatigue is less likely to occur due to repeated strain. Furthermore, metal fatigue is less likely to occur with respect to stress. Therefore, it is possible to provide a flexible circuit board having excellent flexibility with sufficient strength to withstand repeated bending and bending with a small radius of curvature without any restrictions on the design of the flexible circuit board. it can. As a result, highly durable electronic devices such as thin mobile phones, thin displays, hard disks, printers, and DVD devices can be realized.
- FIG. 1 is a diagram illustrating a relationship between a crystal zone axis in a cubic crystal structure and a plane obtained by rotating around the crystal zone axis.
- FIG. 2 is a stereo triangle of (100) standard projection.
- FIG. 3 is an explanatory cross-sectional view showing a state in which the flexible circuit board is bent.
- FIG. 4 is an explanatory plan view showing the relationship between the wiring in the flexible circuit board and the crystal axis of the metal foil, (a) and (b) show the flexible circuit board according to the present invention, and (c) ) And (d) show a prior art flexible circuit board.
- FIG. 5 is a perspective explanatory view of a single-sided copper-clad laminate.
- FIG. 5 is a perspective explanatory view of a single-sided copper-clad laminate.
- FIG. 6 is an explanatory plan view showing a state in which a test flexible circuit board is obtained from a single-sided copper-clad laminate in the embodiment of the present invention.
- FIG. 7 shows an orientation mapping image of the metal foil according to the embodiment of the present invention by the EBSP method.
- FIG. 8 is an explanatory diagram of an MIT flex test apparatus.
- FIG. 9A is an explanatory view of an IPC bending test apparatus
- FIG. 9B is an X-X ′ sectional view of a test flexible circuit board used in the IPC bending test.
- the wiring provided in the flexible circuit board of the present invention is formed of a metal foil made of a metal having a cubic crystal structure.
- a metal having a cubic crystal structure for example, in the case of a face-centered cubic crystal, copper, aluminum, nickel, silver, rhodium, palladium, platinum, gold and the like are known, and in the case of a body-centered cubic crystal, Iron, chromium, molybdenum, tungsten, and the like are known, and any of these may be used, but copper, aluminum, and nickel are preferable because of their availability as a metal foil. Copper foils that are mainly used as are most common.
- the metal foil may be a rolled foil or an electrolytic foil, but is preferably a rolled foil.
- the thickness is 5 to 100 ⁇ m, preferably 5 to 20 ⁇ m. More preferably, it is a rolled copper foil of 5 to 12 ⁇ m.
- the rolled copper foil may contain an alloy element, but is preferably a complete solid solution.
- the metal foil that forms a circuit in the flexible circuit board of the present invention is made of a metal having a cubic crystal structure, and the cross section P of the wiring when cut in the thickness direction from the ridgeline at the bent portion, It is necessary that the main orientation be formed on any plane included in the range of (20 1 0) to (1 20 0) with [001] as the zone axis.
- the relationship between the zone axis and the plane orientation is shown in FIG. (20 1 0) and (1 20 0) have a relationship with [001] as a common axis, that is, a zone axis, from (100) to (110) with [001] as the axis [from (100) (010)] in the plane of rotation.
- the metal of the metal foil in the present invention is cubic.
- the crystal axes of the unit cell are [100], [010], and [001].
- ⁇ 100> preferred orientation in the thickness direction of the metal foil (the direction perpendicular to the surface of the metal foil).
- this axis is expressed as [001], that is, the foil plane orientation is (001), but it is equivalent even if these axes are interchanged due to the symmetry of the cubic crystal, and these are of course included in the present invention.
- the metal foil in the present invention is not necessarily a single crystal, but at least at the bent portion, it is necessary to preferentially orientate three-dimensionally to form a texture.
- the crystal orientation at the center of the preferential orientation is called the main orientation of the texture.
- the statistical data of X-ray diffraction intensity and local three-dimensional orientation data obtained by electron diffraction is used. An index based on objective data using.
- the range of the preferential orientation degree of the metal foil in the present invention is as described below.
- the three-dimensional crystal orientation of the metal foil is defined with respect to the sample coordinate system of the metal foil constituting the circuit. It is specified in the following range. That is, at least in the bent portion, the cubic metal has one of the basic crystal axes of the metal unit cell, for example, the [001] axis, with respect to the thickness direction of the metal foil (the direction perpendicular to the surface of the metal foil).
- a preferential orientation such that a region within 10 ° in orientation difference occupies 50% or more, preferably 75% or more, and more preferably 98% or more by area ratio, and the surface of the metal foil (main surface or foil) In the foil plane in the horizontal direction with respect to the surface), the area where the other basic crystal axis is the main orientation and the difference in orientation is within 10 ° from the main orientation is 50% or more, preferably 85% or more. More preferably, the preferred orientation should be 99% or more.
- the main orientation in the foil plane is in the main strain direction of the bent portion, that is, in the normal direction of the cross section of the wiring cut from the ridge line in the bent portion in the thickness direction (with respect to the perpendicular to the wiring cross section P), It is necessary to have an angle of 2.9 ° to 87.1 ° [(20 1 0) to (1 20 0)], preferably 5.7 ° to 84.3 ° [(10 1 0) ⁇ (1 10 0)], more preferably 11.4 ° to 78.6 ° [(510) to (150)], and more preferably 26.6 ° to 63.4 ° [(210) to It is desirable that the angle is (120)], most preferably 30 ° or 60 ° [(40 23 0) or (23 40 0)].
- the inside of [] represents the surface orientation of the cross section P corresponding to each angle.
- the circuit when the circuit is bent, shearing in the principal stress direction of the bent portion is facilitated, the elongation at break is increased, breakage is less likely to occur, and against repeated strain or stress, Metal fatigue is less likely to occur, and a flexible circuit board with high flexibility is obtained.
- the metal foil has a face-centered cubic structure
- the main surface of the metal foil is preferentially oriented with (001) as the main orientation
- the cross section P of the wiring when cut in the thickness direction from 1 to 2 is preferentially oriented with a main orientation in a specific orientation between (20 1 0) and (1 20 0), preferably from (10 1 0) (1 10 0) having a main orientation in a specific orientation and preferentially orientation, more preferably having a main orientation in a specific orientation between (510) and (110), and more preferably ( 210) to (110) are preferably preferentially oriented with a main orientation in a specific orientation, and most preferably preferentially oriented with a central orientation in the vicinity of (40 (23 0).
- the main direction of the cross section P of the wiring when cutting in the thickness direction from the ridgeline at the bent portion of the wire can be described as a specific direction between (1 20 0) and (110), preferably from (120) ( 110) can be described as having a preferred orientation with a main orientation in a particular orientation, and most preferably with a major orientation in the vicinity of (23 40 0). .
- the cross section P of the wiring when it is cut in the thickness direction from the ridgeline at the bent portion is, for example, as shown in FIG. 3, when the flexible circuit board is bent in a U shape, a ridgeline L is formed on the outside thereof.
- the ridge line L is an apex formed when the cross section of the flexible circuit board is viewed along the bending direction (thick arrow in FIG. 3) in a state where the flexible circuit board is bent. It is a connected line.
- the case where the ridgeline L moves a flexible circuit board, such as sliding bending mentioned later, for example is also included.
- 3 shows a state in which the resin layer 1 is on the outside and the wiring 2 is bent inward (the side on which a circle having a radius of curvature is inscribed is inward), but the wiring 2 is bent outward. Of course, it may be.
- the metal foil when subjected to a forced displacement with a certain curvature, is mainly subjected to tensile or compressive stress.
- Which part of the flexible circuit board that is bent is subjected to tension or compression depends on the configuration of the metal foil and the resin, but is bent from the neutral axis (or neutral surface) of tension and compression.
- the outermost part which is the outermost part, is severe due to the destruction of the metal, and the tensile stress in the normal direction of the cross section of the wiring when cut in the thickness direction from the ridgeline at the bent part becomes the main stress. That is, the main stress direction of the wiring in the bent portion is the direction indicated by the arrow 21 in FIG. 3, and is typically the normal direction to the wiring cross section P cut from the ridge line of the bent portion in the thickness direction of the metal foil. And the direction perpendicular to the [001] axis oriented in the thickness direction of the metal foil.
- the normal line 21 to the wiring cross section P cut from the ridgeline of the bent portion in the thickness direction of the metal foil has an angle of 2.9 to 45 ° with the basic crystal axis ⁇ 100> in the metal foil plane.
- the basic crystal axis ⁇ 100> in the metal foil plane is relative to the normal line 21 with respect to the wiring cross section P cut from the ridgeline of the bent portion in the thickness direction of the metal foil. It can be described that the wiring is formed to have an angle of 2.9 to 87.1 °.
- the wiring is formed so that the basic crystal axis ⁇ 100> in the metal foil plane has an angle of 2.9 to 87.1 ° with respect to the ridgeline of the metal foil.
- the stress strain characteristic when the metal foil is simply pulled in the main stress direction indicated by the arrow 21 in FIG. 3 is an important characteristic.
- the metal foil having a cubic crystal structure is bent so that a ridge line perpendicular to the [100] axis is formed.
- the cross section of the wiring cut in the thickness direction of the flexible circuit board from the ridge line at the bent portion becomes the (100) plane.
- the cross-section P of FIG. 1 is in the range from (20 1 0) to (1 20 0) in the rotational direction from (100) to (010) with [001] as the zone axis.
- the cross section P of the wiring forms a main orientation on any surface included in the range of (10 1 0) to (1 10 0). It is preferable that any of the planes included in the range of (510) to (150) has a main orientation, and any of the ranges included in the range of (210) to (120) It is more preferable that the main orientation is formed on the surface, and most preferably, the main orientation is (40 23 0) or (23 40 0). In FIG.
- the cross section P of the wiring when it is cut in the thickness direction from the ridgeline at the bent portion is preferentially oriented with a main orientation in a specific orientation between (20 1 0) and (1 20 0).
- the fatigue characteristics with respect to repeated bending are excellent when the tensile stress is applied in the normal direction of the cross section P, that is, in the principal stress direction, for example, in the case of a metal having a face-centered cubic structure. This is because, among the two ⁇ 111 ⁇ , the main slip surface having the largest Schmid factor is four, so that the shear slip is good and local work hardening is difficult to occur.
- the longitudinal direction of the metal foil corresponds to the rolling direction, and as shown in FIGS.
- the most desirable orientation is 30 ° with respect to the main strain direction of the bent portion, that is, the normal direction of the cross section of the wiring when cutting from the ridge line in the bent portion in the thickness direction. Although it is 60 °, this is because the stress direction matches the stable orientation of tension.
- the thickness direction of the metal foil does not necessarily have to be the [001] main direction, and the cross-section P of the wiring when cut from the ridgeline in the bent portion in the thickness direction is [001]. It is only necessary to have a preferential orientation with a main orientation in a specific orientation between (20 1 0) and (1 20 0), with the crystallographic axis as.
- the metal foil does not necessarily need to be a single crystal, but in order to obtain the effects as described above, it is desirable that a texture is formed that is preferentially oriented three-dimensionally and the degree of integration is higher.
- the metal foil is a copper foil
- the intensity (I) from (002) perpendicular to the above-mentioned zone axis determined by X-ray diffraction here, according to a general notation method in X-ray diffraction, (200) plane
- the wiring having a predetermined pattern is formed from a copper foil having I / I 0 ⁇ 25 with respect to the strength (I 0 ) of the (200) plane obtained by X-ray diffraction of fine powder copper.
- I / I 0 is in the range of 33 to 150, more preferably in the range of 50 to 150.
- the parameter I / I 0 represents the degree of orientation of the zone axes of (100) and (110), that is, the common axis [001], and is an objective index indicating the degree of development of the cube texture. is there.
- the metal foil is a rolled copper foil, it is strongly processed at a rolling rate of a certain level or higher, and then recrystallized by applying heat, so that the rolled foil surface is rolled into the (001) main orientation and foil plane. A recrystallized cube orientation with the direction as the (100) principal orientation develops.
- the bending fatigue life of the copper foil is improved as the cubic orientation, which is the recrystallized texture of copper, develops.
- the bending fatigue life of the wiring cannot be sufficiently improved.
- the I / I 0 is 33 or more, the bending fatigue life is remarkably improved.
- I / I 0 exceeds 150, as will be described later, for example, when annealing is performed to obtain a recrystallized texture, the thermal history becomes too large, resulting in a resin layer other than wiring. In addition, the interface state between the wiring and the resin layer may be adversely affected.
- the X-ray diffraction in the thickness direction of the copper foil confirms the orientation on the surface of the copper foil (rolled surface in the case of a rolled copper foil), and the strength (I) of the (200) plane is X-ray.
- the integrated intensity value of the (200) plane obtained by diffraction is shown.
- the intensity (I 0) shows a fine powder of copper (manufactured by Kanto Chemical Co., Inc. copper powder reagent I grade, 325 mesh) in an intensity integral value of the (200) plane.
- a recrystallized texture of the copper foil may be obtained, and there is no particular limitation on this means.
- the annealing immediately before the final cold rolling is performed under the condition that the average grain size of the recrystallized grains obtained by this annealing is 5 to 20 ⁇ m, and the degree of rolling in the next final cold rolling is 90% or more.
- a rolled copper foil with I / I 0 ⁇ 25 can be obtained.
- the copper foil is subjected to heating conditions such that a temperature of 300 to 360 ° C. is loaded for an accumulated time of 5 minutes or more.
- a recrystallized texture of copper foil may be obtained.
- the texture in order to define the texture with a three-dimensional degree of integration, it can be specified using the area ratio of the preferentially oriented region that falls within 10 ° with respect to the main orientation of the texture. That is, as to what crystal orientation the predetermined surface of the metal foil has, X-ray diffraction method such as EBSP (Electron Back Scattering Pattern) method, ECP (Electron Channeling Pattern) method or X-ray method such as Micro Laue method It can be confirmed by a line diffraction method or the like.
- EBSP Electro Back Scattering Pattern
- ECP Electro Channeling Pattern
- Micro Laue method X-ray method
- the EBSP method analyzes a crystal from a diffraction image called a pseudo Kikuchi line that is diffracted from each crystal plane generated when a focused electron beam is irradiated on the surface of a sample to be measured.
- This is a method of measuring the crystal orientation distribution of the measurement object from the position information of the above, and it is possible to analyze the crystal orientation of the texture in the microscopic region as compared with the X-ray diffraction method.
- An orientation mapping image can be obtained by highlighting the distribution of regions (crystal grains) having substantially the same plane orientation. It is also possible to define the orientation including the orientation plane having an orientation within a predetermined angle with respect to a specific plane orientation, and to extract the existence ratio of each plane orientation by the area ratio.
- the cross-section P of the wiring when the foil surface of the metal foil is preferentially oriented with (001) as the main orientation and cut from the ridgeline at the bent portion in the thickness direction is from (20 1 0) to (1 20 0).
- (001) as the main orientation and cut from the ridgeline at the bent portion in the thickness direction
- (20 1 0) has a main orientation in a specific orientation, when the reverse pole is displayed on the stereo triangle of the (100) standard projection diagram shown in FIG. It can also be said that the cross-sectional orientation of the wiring at that time is any surface on the line segment connected by the point representing (20 1 0) and the point representing (110).
- the wiring is formed from a 3 (2) axis-oriented material in which the thickness direction of the metal foil is the [001] axis, and is cut from the ridgeline at the bent portion in the thickness direction. It can also be said that the cross-sectional normal of the wiring has an angle in the range of 2.9 ° to 87.1 ° with the [100] axis in the foil plane.
- the type of resin forming the resin layer is not particularly limited, and examples thereof include those used in ordinary flexible circuit boards, such as polyimide, polyamide, Examples thereof include polyester, liquid crystal polymer, polyphenylene sulfide, polyether ether ketone, and the like. Of these, polyimide and liquid crystal polymer are preferred because they exhibit good flexibility when used as a circuit board and are excellent in heat resistance.
- the thickness of the resin layer can be appropriately set in accordance with the use, shape, etc. of the flexible circuit board, but is preferably in the range of 5 to 75 ⁇ m from the viewpoint of flexibility, and in the range of 9 to 50 ⁇ m. Is more preferable, and the range of 10 to 30 ⁇ m is most preferable. If the thickness of the resin layer is less than 5 ⁇ m, the insulation reliability may decrease. On the other hand, if it exceeds 75 ⁇ m, the thickness of the entire circuit board may be too thick when mounted on a small device, etc. A decline in sex is also possible.
- the metal foil may be thermally laminated by applying or interposing a thermoplastic polyimide to the polyimide film (so-called laminating). Law).
- a thermoplastic polyimide film used in the laminating method include “Kapton” (Toray DuPont Co., Ltd.), “Apical” (Kanebuchi Chemical Industry Co., Ltd.), “Upilex” (Ube Industries Co., Ltd.), and the like.
- a thermoplastic polyimide resin exhibiting thermoplasticity is preferably interposed.
- a polyimide precursor solution also referred to as a polyamic acid solution
- a polyamic acid solution may be applied to the metal foil, and then dried and cured to obtain a laminate (so-called “so-called”). Cast method).
- the resin layer may be formed by laminating a plurality of resins.
- two or more kinds of polyimides having different linear expansion coefficients may be laminated, and in that case, heat resistance and flexibility are ensured.
- the linear expansion coefficient of the resin layer is preferably in the range of 10 to 30 ppm / ° C.
- the linear expansion coefficient of the entire resin layer may be in this range.
- a low linear expansion polyimide layer having a linear expansion coefficient of 25 ppm / ° C. or less, preferably 5 to 20 ppm / ° C., and a linear expansion coefficient of 26 ppm / ° C. or more, preferably 30 to It is a resin layer comprising a high linear expansion polyimide layer at 80 ppm / ° C., and can be adjusted to 10 to 30 ppm / ° C.
- the low linear expansion polyimide layer is the main resin layer of the resin layer, and the high linear expansion polyimide layer is preferably provided so as to be in contact with the metal foil.
- the linear expansion coefficient was determined by using a polyimide whose imidization reaction was sufficiently completed as a sample, raising the temperature to 250 ° C. using a thermomechanical analyzer (TMA), cooling at a rate of 10 ° C./min, and 240 to 100 ° C. It can obtain
- TMA thermomechanical analyzer
- the flexible circuit board according to the present invention includes a resin layer and a wiring formed from a metal foil, and is used with a bent portion in one of them.
- it is widely used in various electronic and electrical devices such as movable parts in hard disks, hinges and slides of mobile phones, printer heads, optical pickups, movable parts of notebook PCs, etc., and the circuit board itself Is bent, twisted, or deformed according to the operation of the mounted device, and a bent portion is formed in either of them.
- the flexible circuit board of the present invention since the flexible circuit board of the present invention has a bent portion structure with excellent bending durability, it is frequently bent with repeated operations such as sliding bending, bending bending, hinge bending, and sliding bending.
- the radius of curvature is 0.38 to 2.0 mm in bending behavior, 1.25 to 2.0 mm in sliding bending, and 3. 0 to 5.0 mm, suitable for severe use conditions such as 0.3 to 2.0 mm for slide bending, and for slide applications where bending performance is severe with a narrow gap of 0.3 to 1 mm Especially effective.
- One of the methods for producing a flexible circuit board in the present invention is that a rolled metal foil and a resin layer exhibit a cubic texture in which the [001] axis is finally oriented in the normal direction of the foil surface (perpendicular to the surface of the metal foil) And the metal foil surface, the principal stress direction of the design bending, that is, the normal direction of the cross section of the wiring when cutting from the ridge line at the bent portion in the thickness direction is manufactured. Wiring may be performed so that the ridgeline of the bent portion is formed at an angle of 2.9 ° to 87.1 ° with respect to the [100] main orientation.
- the metal foil does not necessarily have to exhibit a cubic texture from the beginning, and may be formed by a heat treatment, for example, a manufacturing process of a flexible circuit board, specifically, formation of a resin layer.
- a cubic texture may be formed by heat treatment in the process. That is, by heat treatment, one of the basic crystal axes ⁇ 100> of the unit cell is given priority in the thickness direction of the metal foil so that the area within 10 ° from the ⁇ 100> axis occupies an area ratio of 50% or more. In addition to the orientation, another one of the basic crystal axes ⁇ 100> is preferentially oriented in the horizontal direction with respect to the surface of the metal foil so that the area within 10 ° from the ⁇ 100> axis occupies an area ratio of 50% or more.
- the recrystallized texture of the rolled copper foil usually has a rolling plane orientation of ⁇ 100 ⁇ and a rolling direction of ⁇ 100>. Accordingly, since the (001) main orientation is formed as the rolling plane orientation, the ridge line at the bent portion has an angle of 2.9 to 87.1 ° with one of the basic crystal axes ⁇ 001> in the plane of the metal foil. In other words, wiring may be performed so that the ridgeline of the bent portion is formed at an angle of 2.9 ° to 87.1 ° in the rolling direction.
- a ridge line L is formed on the outer side (the side opposite to the side where an inscribed circle having a radius of curvature is formed).
- ⁇ is less than 2.9 °, a clear effect on flexibility is not confirmed.
- the bending durability of the bent portion structure is further improved.
- [100] and [010] are equivalent, and therefore, the angle ⁇ formed by the orthogonal axis in the foil plane of [100] and the ridge line as shown in FIGS. 4 (a) and 4 (b).
- the range coincides with the angle range formed by [100] and the cross-section P normal, and the angle range formed by [100] and the ridge line.
- the width, shape, pattern, etc. of the wiring are not particularly limited, and may be appropriately designed according to the use of the flexible circuit board, the electronic device to be mounted, etc.
- Wiring, that is, wiring with the minimum necessary minimum distance is possible.
- FIGS. 4 (a) and 4 (b) are examples of a flexible circuit board used for a hinge portion of a mobile phone and the like, which has a resin layer 1, a wiring 2 formed from a metal foil, and a connector terminal 3. It is.
- FIG. 4A and 4B show the position of the ridge line L in the bent portion near the center, and this ridge line L is (with respect to the [100] axis direction of the metal foil forming the wiring 2 ( 90 + ⁇ ) °.
- FIG. 4A is an example in which the wiring is formed obliquely in the vicinity of the ridge line L in the middle of the connector terminals 3 at both ends.
- FIG. Wiring is also possible.
- the slide sliding bend in which the ridge line L in the bent portion moves as in a slide type mobile phone may be the direction of the thick arrow).
- the flexible circuit board according to the present invention includes wiring made of metal foil on at least one side of the resin layer, but may be provided with metal foil on both sides of the resin layer as necessary. At this time, it is desirable that the cross section of the wiring when any metal foil is cut in the thickness direction from the ridge line at the bent portion is a predetermined surface in the present invention.
- Example 1 The polyamic acid solution a prepared above is applied to copper foil A and dried (after curing, a 2 ⁇ m-thick thermoplastic polyimide film is formed), and then polyamic acid b is applied and dried (after curing, a film thickness of 12 ⁇ m) The low thermal expansion coefficient polyimide is applied, and the polyamic acid a is further applied and dried (after the curing, a 2 ⁇ m-thick thermoplastic polyimide film is formed), and the temperature of 300 to 360 ° C. is 5 minutes or more in total time. A polyimide layer having a three-layer structure was formed through heating conditions that were loaded.
- strength (I) was calculated
- a pole figure measuring device RINT-2000 type manufactured by Rigaku Corporation
- an Mo-K ⁇ target is used
- the tube voltage is 60 kV
- the tube current is 200 mA.
- the intensity ratio was determined from the magnification with respect to the pure copper powder solidified diffraction intensity.
- the crystal orientation of the rolled surface 2a of the copper foil by EBSP was measured using FE-SEM (S-4100) manufactured by Hitachi, Ltd.
- the measurement area was an area of about 150 ⁇ m ⁇ 75 ⁇ m, and the measurement acceleration voltage was 20 kV and the measurement step interval was 0.5 ⁇ m.
- OIM Analysis 5.2 and EBSP analysis software OIM4.6 manufactured by TSL were used.
- the surface of the obtained copper clad laminate was ion-polished with a polisher (SM09010: JEOL), and the crystal orientation of the copper foil rolled surface 2a was confirmed. As a result, a strong orientation toward the (001) plane was confirmed in the reverse pole figure. It was done.
- FIG. 7A is an inverse pole mapping image of the foil surface orientation of the rolled surface 2a obtained at this time.
- FIG. 7C shows a mapping color contour.
- FIG. 7B is a reverse pole mapping image of the MD orientation of the copper foil.
- the copper [100] is mainly formed along the rolling direction (MD direction) of the copper foil 2. It can be said that it has an axis.
- MD direction rolling direction
- the MD main azimuth plane is expressed as (100)
- the MD main azimuth is expressed as [100].
- the wiring direction H (H direction) of the linear wiring 2 of 150 ⁇ m has an angle of 45 ° with respect to the MD direction ([100] axis), and a wiring pattern is formed with a space width (s) of 250 ⁇ m. did. And a test having a length of 15 cm in the longitudinal direction along the wiring direction H of the circuit board and a width of 1.5 cm in the direction perpendicular to the wiring direction H according to JIS 6471 so as to serve as a sample for a bending resistance test described later. A flexible circuit board 5 was obtained.
- MIT flex test was performed according to JIS C5016 using the test flexible circuit board 5 obtained above.
- the equipment is manufactured by Toyo Seiki Seisakusho (STROGRAPH-R1), one end of the test flexible circuit board 5 in the longitudinal direction is fixed to the holding jig of the bending test apparatus, and the other end is fixed with a weight.
- the wire 2 on the circuit board 5 is cut off from conduction while being rotated to 135 ⁇ 5 degrees alternately left and right at a vibration speed of 150 times / min. was determined as the number of flexing.
- the test was performed so that the ridge line L formed in the bent portion was orthogonal to the wiring direction H of the wiring 2 of the test flexible circuit board 5. It was confirmed that the wiring 2 was broken in the vicinity of the ridge line L of the bent portion at the 2200th time.
- Table 1 The results are shown in Table 1.
- the wiring 2 is formed so that the wiring direction H is inclined by 45 ° with respect to the [100] axis of copper, and the ridge line in this bending test It can be said that the cross section of the wiring 2 when cut from L in the thickness direction of the circuit board 5 is the (110) plane. That is, in this example, the rolling surface 2a is the (001) surface and the side surface 2b is the (010) surface, so that the crystal structure of this copper foil is the MD direction of the copper foil surface ([100] In addition, as shown in Table 2, the angular relationship between the (100) plane and the (h 2 k 2 l 2 ) plane is known as shown in Table 2. Therefore, it can be said that the cross section cut in the thickness direction of the circuit board 5 from the ridge line L in this embodiment is the (110) plane.
- Table 2 are Phys. Rev. 26, 390 (1925).
- Example 2 to 5 A polyimide layer was formed on the copper foil A in the same manner as in Example 1 to obtain a single-sided copper-clad laminate 4. And about the obtained single-sided copper clad laminated board 4, each test flexible was carried out similarly to Example 1 except having made the angle of the wiring direction H with respect to MD direction ([100] axis
- Example 6 to 8 The single-sided copper-clad laminates 4 according to Examples 6 to 8 are the same as in Example 1 except that the heating time for forming the polyimide layer on the surface-treated surface of the copper foil A is 2 minutes. Got. For each single-sided copper-clad laminate 4 obtained was 43 was determined the I / I 0 in the same manner as in Example 1. The obtained single-sided copper clad laminate 4 was analyzed for the crystal orientation of the rolled surface 2a orientation (MD orientation) and side surface 2b orientation (TD orientation) of the copper foil by the EBSP method in the same manner as in Example 1. Since the ⁇ 100 ⁇ plane was dominant in each case, the single-sided copper clad laminate 4 according to Examples 6 to 8 had a copper [100] axis in the rolling direction (MD direction) of the copper foil 2. It was confirmed to have.
- MD orientation crystal orientation
- TD orientation side surface 2b orientation
- Example 1 And about the single-sided copper clad laminated board 4 obtained above, it is for each test similarly to Example 1 except having made the angle of the wiring direction H with respect to MD direction ([100] axis
- a flexible circuit board 5 was prepared. Using the obtained circuit board 5, the MIT bending test was performed in the same manner as in Example 1. The results are shown in Table 1.
- Examples 9 to 11 were carried out in the same manner as in Example 1 except that copper foil B was used and that the heating integration time under the heating conditions for forming the polyimide layer on the surface-treated surface of copper foil B was 2 minutes. Such a single-sided copper-clad laminate 4 was obtained. For each single-sided copper-clad laminate 4 obtained, it was 33 was determined the I / I 0 in the same manner as in Example 1. Further, when the crystal orientations of the rolled surface 2a and side surface 2b of the copper foil were analyzed by the EBSP method for these single-sided copper clad laminates 4 in the same manner as in Example 1, the (100) plane was dominant. From this, it was confirmed that the single-sided copper clad laminates 4 according to Examples 9 to 11 had a [100] axis of copper in the rolling direction (MD direction) of the copper foil 2.
- Example 1 And about the single-sided copper clad laminated board 4 obtained above, it is for each test similarly to Example 1 except having made the angle of the wiring direction H with respect to MD direction ([100] axis
- a flexible circuit board 5 was prepared. Using the obtained circuit board 5, the MIT bending test was performed in the same manner as in Example 1. The results are shown in Table 1.
- Example 4 A single-sided copper-clad laminate 4 was obtained in the same manner as in Example 1 except that the heating time when the polyimide layer was formed on the surface-treated surface of the copper foil A was set to 2 minutes. For each single-sided copper-clad laminate 4 obtained was 43 was determined the I / I 0 in the same manner as in Example 1. Further, when the crystal orientation of the rolled surface 2a orientation (MD orientation) and the side surface 2b orientation (TD orientation) of the copper foil was analyzed in the same manner as in Example 1, the (100) plane was dominant in both cases. The single-sided copper clad laminate 4 was confirmed to have a [100] axis of copper in the rolling direction (MD direction) of the copper foil 2.
- Example 4 And about the obtained single-sided copper clad laminated board 4, each test was carried out similarly to Example 1, except that the angle of the wiring direction H with respect to the MD direction ([100] axis) was 0 ° as shown in Table 1. A flexible circuit board 5 was prepared and an MIT flex test was performed. The results are shown in Table 1.
- Example 5 Each single-sided copper-clad laminate in the same manner as in Example 1 except that the copper foil B was used and the heating integrated time in the heating condition when forming the polyimide layer on the surface-treated surface of the copper foil B was 2 minutes. 4 was obtained. For each single-sided copper-clad laminate 4 obtained, it was 33 was determined the I / I 0 in the same manner as in Example 1. Further, when the crystal orientations of the rolling surface 2a orientation (MD orientation) and the side surface 2b orientation (TD orientation) were analyzed in the same manner as in Example 1, the (100) surface was dominant, and these single-sided copper-clad The laminate 4 was confirmed to have a [100] axis of copper in the rolling direction (MD direction) of the copper foil 2.
- Example 4 And about the obtained single-sided copper clad laminated board 4, each test was carried out similarly to Example 1, except that the angle of the wiring direction H with respect to the MD direction ([100] axis) was 0 ° as shown in Table 1. A flexible circuit board 5 was prepared and an MIT flex test was performed. The results are shown in Table 1.
- Example 6 Each single-sided copper clad laminate 4 was obtained in the same manner as in Example 1 except that the copper foil C was used. For each resulting one-sided copper-clad laminate 4 was 10 was determined the I / I 0 in the same manner as in Example 1. And about the obtained single-sided copper clad laminated board 4, each flexible circuit board for a test was carried out similarly to Example 1 except having made the angle of the wiring direction H with respect to MD direction into 0 degree as shown in Table 1. 5 was prepared and an MIT flex test was performed. The results are shown in Table 1.
- Example 7 Each single-sided copper clad laminate 4 was obtained in the same manner as in Example 1 except that the copper foil D was used. For each single-sided copper-clad laminate 4 obtained was 7 was determined the I / I 0 in the same manner as in Example 1. And about the obtained single-sided copper clad laminated board 4, each test was carried out similarly to Example 1, except that the angle of the wiring direction H with respect to the MD direction ([100] axis) was 0 ° as shown in Table 1. A flexible circuit board 5 was prepared and an MIT flex test was performed. The results are shown in Table 1.
- Example 12 The polyamic acid solution a prepared in the same manner as in Synthesis Example 1 was applied to a rolled copper foil E having a purity of 99.9 mass% and a thickness of 12 ⁇ m and dried (after curing, a 2 ⁇ m-thick thermoplastic polyimide was formed) ), And the polyamic acid b is applied thereon and dried (after curing, a low thermal expansion coefficient polyimide film having a thickness of 12 ⁇ m is formed). Further, the polyamic acid a is applied thereon and dried (the film thickness after curing). 2 ⁇ m thermoplastic polyimide was formed), and a polyimide layer was formed through heating conditions such that a temperature of 180 to 240 ° C. was added for 10 minutes over an integrated time.
- a polyimide layer (resin) having a thickness of 250 ⁇ m along the rolling direction (MD direction) of the copper foil and a rectangular size of 150 mm width in a direction orthogonal to the rolling direction (TD direction) and having a thickness of 12 ⁇ m.
- Layer) 1 and a single-sided copper-clad laminate 4 having a copper foil 2 having a thickness of 12 ⁇ m were obtained.
- a predetermined mask is placed on the copper foil side of the single-sided copper-clad laminate 4 obtained above, etching is performed using an iron chloride / copper chloride solution, and a straight line having a line width of 150 ⁇ m and a space width of 250 ⁇ m is based on the IPC standard.
- a low-speed IPC test circuit 2 having a wire shape was formed.
- the maximum heating temperature during the formation of the polyimide layer is set to four levels of 180 ° C. (condition A), 200 ° C. (condition B), 220 ° C. (condition C), and 240 ° C. (condition D).
- the wiring direction (H direction) of the linear wiring 2 is 0 °, 2 °, 2.9 °, 5.7 °, 9.5 °, 11.4 ° with respect to the rolling direction (MD direction).
- Wiring patterns were formed so as to have angles of 22 levels of 87.1 °, 88 °, and 90 °, respectively.
- a cover material 7 (Arisawa Seisakusho CVK-0515KA: thickness 12.5 ⁇ m) was laminated on each circuit side surface using an epoxy adhesive.
- the thickness of the adhesive layer 6 made of an adhesive was 15 ⁇ m in a portion without a copper foil circuit, and 6 ⁇ m in a portion where a copper foil circuit was present.
- a single-sided copper-clad laminate produced under the heat treatment conditions A to D is 0 °, 2.9 °, 30 °, 63.4 ° with respect to the rolling direction.
- a total of 20 samples without wiring patterns cut out at five angles of 78.6 ° were prepared.
- the same simulated heat treatment as the circuit formation etching was applied, and the cover material was laminated under the same conditions.
- these effects on the copper foil structure are minor, and it has been found later that the copper foil structure is determined by the heat treatment conditions A to D during polyimide formation.
- the number of points where the unit cell axis ⁇ 001> is within 10 ° is counted in the thickness direction and the rolling direction of the copper foil, and the ratio to the total number of points is calculated.
- the average value was obtained.
- the results are shown in Table 3.
- the variation between samples under the same heating condition is 1% or less, and it can be said that the same heat treatment condition has the integration degree shown in Table 3 over the entire surface of the copper foil. It was found that the higher the maximum heat treatment temperature and the greater the thermal history, the more recrystallization progressed and the higher the degree of integration of the cubic recrystallization texture.
- the IPC test is a test simulating slide bending, which is one of the bending forms used in mobile phones and the like, as shown in the schematic diagram of FIG.
- the IPC test is a test in which a bent portion is provided with a determined gap length 8 as shown in FIG. 9, one side is fixed by the fixing portion 9, and the slide operating portion 10 on the opposite side is repeatedly reciprocated as shown in the drawing. . Therefore, the substrate is repeatedly bent in a region corresponding to the stroke amount of the reciprocating portion.
- the test was conducted by repeatedly sliding the polyimide layer (resin layer) 1 with the cap length being 1 mm, that is, the bending radius being 0.5 mm and the stroke being 38 mm.
- the circuit breakage life was defined as the number of strokes at which the electrical resistance of the circuit reached twice the initial value.
- the test was conducted on a total of 88 levels in which a wiring pattern having a 22 level angle was formed under the above four heat treatment conditions A to D. At each test level, four test pieces were measured, and the average number of strokes at which the circuit was broken was obtained.
- the copper foil after the circuit breaking life when the cross section of the copper foil cut in the thickness direction so as to be orthogonal to the sliding direction is observed with a scanning electron microscope, there is a difference in degree, but the resin layer side and the cover material side It was observed that cracks occurred on the surfaces of the copper foils, and that many cracks were introduced on the surface of the copper foil on the resin layer side, which is outside the bent portion.
- Table 4 shows the average value of circuit break life at each level.
- the surface index is also shown only in the case of the low index direction of the cross section P of the wiring when the circuit is cut in the length direction (wiring direction), that is, the ridgeline at the bent portion in the thickness direction. .
- the fatigue life in the IPC test is the angle between the circuit length direction (wiring direction) and the rolling direction, that is, the angle between [100] and the normal direction of the wiring cross section when cutting in the thickness direction from the ridgeline at the bent portion. It turned out to depend greatly on. This orientation dependency is manifested under conditions B, C, and D, and the higher the degree of cube orientation integration, the greater the fatigue life against repeated bending and the greater the orientation dependency.
- the ⁇ 001> main direction is such that the area where the copper [001] is within an orientation difference of 10 ° occupies an area ratio of 50% or more in the evaluation by the EBSP method with respect to the thickness direction of the metal foil.
- the orientation is preferentially oriented in the thickness direction of the metal foil, and the region within 10 ° of the orientation difference from the [100] axis of copper occupies an area ratio of 50% or more as evaluated by the EBSP method. It was confirmed that the main azimuth was expressed when preferentially oriented in the metal foil plane.
- the condition C in which the thickness ratio and the rolling direction show an area ratio of 75% or more and 85% or more, respectively, and the accumulation degree of the cube orientation is high, the fatigue life is large and the effect of orientation dependency is also obtained.
- the condition D where the area ratio is 98% or more and 99% or more in the thickness direction and the rolling direction, respectively, and the accumulation degree of the cube orientation is extremely high, the fatigue life is further increased, and the effect of orientation dependency is obtained. I found it big.
- the normal direction of the wiring cross section when cutting in the thickness direction from the ridge line at the bent portion is from the ⁇ 100> main direction of the copper foil.
- the misalignment has a higher fatigue life of the circuit against bending.
- the effect was observed with respect to the main strain direction of the bent portion, that is, with respect to the normal direction of the cross section of the wiring when cut from the ridge line in the bent portion in the thickness direction. It was a case having an angle of from 0 ° to 87.1 °.
- the cross section P of the wiring when cut in the thickness direction from the ridgeline at the bent portion passes from (20 1 0) to (110) with [001] as the zone axis, and (1 20 0 ).
- the effect is large at an angle of 11.4 ° to 78.6 ° with respect to the main strain direction of the bent portion, that is, with respect to the normal direction of the cross section of the wiring when cut from the ridge line in the bent portion in the thickness direction. It was a case.
- the cross section P of the wiring when it is cut in the thickness direction from the ridgeline at the bent portion ranges from (510) to (110) to (150) with [001] as the zone axis.
- the bending characteristic has an angle of 26.6 ° to 63.4 ° with respect to the main strain direction of the bent portion, that is, with respect to the normal direction of the cross section of the wiring cut from the ridge line in the bent portion in the thickness direction
- the best results were obtained at 30 ° and 60 °.
- the cross section P is in the range from (210) to (110) to (120) with [001] as the zone axis, and the most excellent is (40 23 0) and ( 23 40 0) Near.
- the cross-sectional orientation of the wiring when the thickness is cut from the ridgeline at the bent portion, which is a normal usage form of rolled copper foil, is taken as (100)
- the Schmid factors of the eight slip surfaces are equivalent when bent. , 8 slip systems work simultaneously, and dislocations accumulate easily.
- the eight slip surfaces are composed of four main slip systems and four secondary slip systems. Therefore, at the initial stage of deformation, only four main slip systems work, dislocation accumulation hardly occurs, and fatigue characteristics are considered to be improved.
- the most desirable orientation is 30 ° or 60 ° with respect to the main strain direction of the bent portion, that is, the normal direction of the cross section of the wiring when cutting from the ridge line in the bent portion in the thickness direction. This is because it matches the stable orientation of
- the metal foil in the wiring needs to exhibit a cubic texture, but the cross section of the wiring cut in the thickness direction from the ridgeline in the bent portion shows [001] It suffices if the main azimuth is formed on any surface included in the range of (21 1 0) to (1 20 0) in the rotation direction from (100) to (110) as an axis. Even if the metal foil is rotated 90 ° in the plane of the foil, this is equivalent due to symmetry. Furthermore, since the above mechanism is established not only for copper but also for other face-centered cubic metals having the same sliding surface and sliding direction, a metal foil or surface such as aluminum, nickel, silver, rhodium, palladium, molybdenum, tungsten, etc. It is obvious that the same effect appears in the alloy foil having a centered cubic structure.
- the flexible circuit board according to the present invention can be widely used in various electronic and electrical devices.
- the circuit board itself is bent, twisted, or deformed according to the operation of the mounted device. , Suitable for use with a bent portion in either.
- the flexible circuit board of the present invention since the flexible circuit board of the present invention has a bent portion structure with excellent bending durability, it is frequently bent with repeated operations such as sliding bending, bending bending, hinge bending, and sliding bending.
- it is suitable for the case where a bent portion is required in which the radius of curvature is required to be extremely small in order to cope with downsizing of the equipment to be mounted. Therefore, the flexible circuit board of the present invention can be suitably used for various electronic devices including a thin mobile phone, a thin display, a hard disk, a printer, and a DVD device that require durability.
- Resin layer 2 Wiring (metal foil) 2a: Rolled surface 2b: Side surface 3: Connector terminal 4: Single-sided copper clad laminate 5: Test flexible circuit board 6: Adhesive layer 7: Cover material 8: Gap length 9: Fixing part 10: Slide operating part 21: Method of section P Line direction L: Ridge line P: Cross section of wiring when cut in the thickness direction from the ridge line at the bent portion
Abstract
Description
(1)樹脂層と金属箔から形成された配線とを備え、配線の少なくとも一箇所に屈曲部を有して使用される可撓性回路基板であって、
金属箔が立方晶系の結晶構造を有する金属からなり、かつ、屈曲部における稜線から厚み方向に切った際の配線の断面が、[001]を晶帯軸として(100)から(110)への回転方向における(20 1 0)から(1 20 0)の範囲に含まれたいずれかの面に主方位をなすことを特徴とする可撓性回路基板。
(2)屈曲部での稜線から厚み方向に切った際の配線の断面が、(100)標準投影図のステレオ三角形において(20 1 0)を表す点と(110)を表す点とで結ばれた線分上にあるいずれかの面である(1)に記載の可撓性回路基板。
(3)金属箔が銅箔であり、かつ、銅箔の厚み方向のX線回折で求めた(200)面の強度(I)が、微粉末銅のX線回折で求めた(200)面の強度(I0)に対してI/I0≧25である(1)又は(2)に記載の可撓性回路基板。
(4)金属箔が面心立方構造を有する金属からなり、面心立方構造の単位格子の基本結晶軸<100>が金属箔の厚さ方向と箔面内の一方向の2つの直交軸に対して、方位差10°以内にある優先配向領域が、面積率で50%以上を占めるように主方位を有していると共に、屈曲部の稜線から金属箔の厚み方向に切った配線断面に対する法線が、箔面内の<100>主方位と2.9~87.1°の角度を有する(1)又は(2)に記載の可撓性回路基板。
(5)金属箔が、厚さ5~100μmの圧延銅箔である(1)~(4)のいずれかに記載の可撓性回路基板。
(6)摺動屈曲、折り曲げ屈曲、ヒンジ屈曲及びスライド屈曲からなる群から選ばれたいずれかの繰り返し動作を伴う屈曲部が形成される(1)~(5)のいずれかに記載の可撓性回路基板。
(7)屈曲部における稜線に対して直交する方向に沿って配線が形成されている(1)~(6)のいずれかに記載の可撓性回路基板。
(8)樹脂層がポリイミドからなる(1)~(7)のいずれかに記載の可撓性回路基板。
(9)樹脂層と金属箔から形成された配線とを備え、配線の少なくとも一箇所に屈曲部を有して使用される可撓性回路基板の屈曲部構造であって、金属箔が立方晶系の結晶構造を有する金属からなり、かつ、屈曲部における稜線から厚み方向に切った際の配線の断面が、[001]を晶帯軸として(100)から(110)への回転方向における(20 1 0)から(1 20 0)の範囲に含まれたいずれかの面に主方位をなすことを特徴とする可撓性回路基板の屈曲部構造。
(10)屈曲部での稜線から厚み方向に切った際の配線の断面が、(100)標準投影図のステレオ三角形において(20 1 0)を表す点と(110)を表す点とで結ばれた線分上にあるいずれかの面である(9)に記載の可撓性回路基板の屈曲部構造。
(11)樹脂層と金属箔から形成された配線とを備え、配線の少なくとも一箇所に屈曲部を有して使用される可撓性回路基板の製造方法であって、
金属箔が立方晶系の結晶構造を有する金属からなり、屈曲部における稜線が、金属箔の面内の基本結晶軸<100>のひとつと2.9~87.1°の角度を有するように配線を形成することを特徴とする可撓性回路基板の製造方法。
(12)金属箔が銅箔であり、かつ、銅箔の厚み方向のX線回折で求めた(200)面の強度(I)が、微粉末銅のX線回折で求めた(200)面の強度(I0)に対してI/I0≧25である(11)に記載の可撓性回路基板の製造方法。
(13)面心立方構造を有する圧延金属箔を、面心立方構造の単位格子の基本結晶軸<100>が金属箔の厚さ方向と箔面内の一方向の2つの直交軸に対して、方位差10°以内にある優先配向領域が、面積率で50%以上を占めるように、熱処理によって立方体集合組織を呈せしめる(12)に記載の可撓性回路基板の製造方法。
(14)摺動屈曲、折り曲げ屈曲、ヒンジ屈曲及びスライド屈曲からなる群から選ばれたいずれかの繰り返し動作を伴う屈曲部が形成される(11)~(13)のいずれかに記載の可撓性回路基板の製造方法。
(15)屈曲部における稜線に対して直交する方向に沿って配線を形成する(11)~(14)のいずれかに記載の可撓性回路基板の製造方法。
(16)(1)~(8)のいずれかに記載の可撓性回路基板を搭載した電子機器。
日鉱金属株式会社製圧延銅箔(商品名BHYA-72F-HA)、厚さ12μm。
[銅箔B]
福田金属株式会社製圧延銅箔(商品名ROFD-T4X)、厚さ12μm。
[銅箔C]
日鉱金属株式会社製圧延銅箔(商品名BHY-22B-T)、厚さ18μm。
[銅箔D]
古河サーキットフォイル株式会社製電解銅箔(商品名U-WZ)、厚さ9μm。
(合成例1)
熱電対及び攪拌機を備えると共に窒素導入が可能な反応容器に、N,N-ジメチルアセトアミドを入れた。この反応容器に2,2-ビス[4-(4-アミノフェノキシ)フェニル]プロパン(BAPP)を容器中で撹拌しながら溶解させた。次に、ピロメリット酸二無水物(PMDA)を加えた。モノマーの投入総量が15wt%となるように投入した。その後、3時間撹拌を続け、ポリアミド酸aの樹脂溶液を得た。このポリアミド酸aの樹脂溶液の溶液粘度は3,000cpsであった。
熱電対及び攪拌機を備えると共に窒素導入が可能な反応容器に、N,N-ジメチルアセトアミドを入れた。この反応容器に2,2'-ジメチル-4,4'-ジアミノビフェニル(m-TB)を投入した。次に3,3',4,4'-ビフェニルテトラカルボン酸二無水物(BPDA)及びピロメリット酸二無水物(PMDA)を加えた。モノマーの投入総量が15wt%で、各酸無水物のモル比率(BPDA:PMDA)が20:80となるように投入した。その後、3時間撹拌を続け、ポリアミド酸bの樹脂溶液を得た。このポリアミド酸bの樹脂溶液の溶液粘度は20,000cpsであった。
銅箔Aに上記で準備したポリアミド酸溶液aを塗布し、乾燥させ(硬化後は膜厚2μmの熱可塑性ポリイミドを形成)、そのうえにポリアミド酸bを塗布し、乾燥させ(硬化後は膜厚12μmの低熱熱膨張性ポリイミドを形成)、更にその上にポリアミド酸aを塗布し乾燥させ(硬化後は膜厚2μmの熱可塑性ポリイミドを形成)、300~360℃の温度が積算時間で5分以上負荷されるような加熱条件を経て3層構造からなるポリイミド層を形成した。次いで、銅箔Aの圧延方向(MD方向)に沿って長さ250mm、圧延方向に対して直交する方向(TD方向)に幅150mmの長方形サイズとなるように切り出し、図5に示すように、厚さ16μmのポリイミド層(樹脂層)1と厚さ12μmの銅箔2とを有した片面銅張積層板4を得た。
銅箔Aに対し、実施例1と同様にしてポリイミド層を形成し、片面銅張積層板4を得た。そして、得られた片面銅張積層板4について、MD方向([100]軸)に対する配線方向Hの角度を表1に示すようにした以外は実施例1と同様にして、各試験用可撓性回路基板5を準備した。得られた回路基板5を用いて実施例1と同様にしてMIT屈曲試験を行った。結果を表1に示す。
銅箔Aの表面処理面にポリイミド層を形成する際の加熱条件において、加熱積算時間を2分にした以外は実施例1と同様にして、実施例6~8に係る片面銅張積層板4を得た。得られた各片面銅張積層板4について、実施例1と同様にしてI/I0を求めたところ43であった。また、得られた片面銅張積層板4について、実施例1と同様にして、EBSP法により銅箔の圧延面2a方位(MD方位)及び側面2b方位(TD方位)の結晶方位を解析したところ、いずれも{100}面が支配的であったことから、これら実施例6~8に係る片面銅張積層板4は、銅箔2の圧延方向(MD方向)は銅の[100]軸を有することが確認された。
銅箔Bを用い、かつ、銅箔Bの表面処理面にポリイミド層を形成する際の加熱条件における加熱積算時間を2分にした以外は実施例1と同様にして、実施例9~11に係る片面銅張積層板4を得た。得られた各片面銅張積層板4について、実施例1と同様にしてI/I0を求めたところ33であった。また、これら片面銅張積層板4について、実施例1と同様にして、EBSP法により銅箔の圧延面2a及び側面2bの結晶方位を解析したところ、いずれも(100)面が支配的であったことから、実施例9~11に係る片面銅張積層板4は、銅箔2の圧延方向(MD方向)は銅の[100]軸を有することが確認された。
実施例1と同様にして得た片面銅張積層板4について、MD方向([100]軸)に対する配線方向Hの角度を表1に示すようにした以外は実施例1と同様にして、各試験用可撓性回路基板5を準備した。得られた回路基板5を用いて実施例1と同様にしてMIT屈曲試験を行った。結果を表1に示す。
銅箔Aの表面処理面にポリイミド層を形成する際の加熱条件において、加熱積算時間を2分にした以外は実施例1と同様にして片面銅張積層板4を得た。得られた各片面銅張積層板4について、実施例1と同様にしてI/I0を求めたところ43であった。また、実施例1と同様にして銅箔の圧延面2a方位(MD方位)及び側面2b方位(TD方位)の結晶方位を解析したところ、いずれも(100)面が支配的であり、これらの片面銅張積層板4は、銅箔2の圧延方向(MD方向)は銅の[100]軸を有することが確認された。そして、得られた片面銅張積層板4について、MD方向([100]軸)に対する配線方向Hの角度を表1に示すように0°にした以外は実施例1と同様にして、各試験用可撓性回路基板5を準備し、MIT屈曲試験を行った。結果を表1に示す。
銅箔Bを用い、かつ、銅箔Bの表面処理面にポリイミド層を形成する際の加熱条件における加熱積算時間を2分にした以外は実施例1と同様にして、各片面銅張積層板4を得た。得られた各片面銅張積層板4について、実施例1と同様にしてI/I0を求めたところ33であった。また、実施例1と同様にして圧延面2a方位(MD方位)及び側面2b方位(TD方位)の結晶方位を解析したところ、いずれも(100)面が支配的であり、これらの片面銅張積層板4は、銅箔2の圧延方向(MD方向)は銅の[100]軸を有することが確認された。そして、得られた片面銅張積層板4について、MD方向([100]軸)に対する配線方向Hの角度を表1に示すように0°にした以外は実施例1と同様にして、各試験用可撓性回路基板5を準備し、MIT屈曲試験を行った。結果を表1に示す。
銅箔Cを用いた以外は実施例1と同様にして各片面銅張積層板4を得た。得られた各片面銅張積層板4について、実施例1と同様にしてI/I0を求めたところ10であった。そして、得られた片面銅張積層板4について、MD方向に対する配線方向Hの角度を表1に示すように0°にした以外は実施例1と同様にして、各試験用可撓性回路基板5を準備し、MIT屈曲試験を行った。結果を表1に示す。
銅箔Dを用いた以外は実施例1と同様にして各片面銅張積層板4を得た。得られた各片面銅張積層板4について、実施例1と同様にしてI/I0を求めたところ7であった。そして、得られた片面銅張積層板4について、MD方向([100]軸)に対する配線方向Hの角度を表1に示すように0°にした以外は実施例1と同様にして、各試験用可撓性回路基板5を準備し、MIT屈曲試験を行った。結果を表1に示す。
純度99.9mass%であり、厚さ12μmの圧延銅箔Eに、合成例1と同じ方法で準備したポリアミド酸溶液aを塗布して乾燥させ(硬化後は膜厚2μmの熱可塑性ポリイミドを形成)、その上にポリアミド酸bを塗布して乾燥させ(硬化後は膜厚12μmの低熱熱膨張性ポリイミドを形成)、更にその上にポリアミド酸aを塗布して乾燥させ(硬化後は膜厚2μmの熱可塑性ポリイミドを形成)、180~240℃の温度が積算時間で10分付加されるような加熱条件を経てポリイミド層を形成した。
2:配線(金属箔)
2a:圧延面
2b:側面
3:コネクタ端子
4:片面銅張積層板
5:試験用可撓性回路基板
6:接着層
7:カバー材
8:ギャップ長
9:固定部
10:スライド稼動部
21:断面Pの法線方向
L:稜線
P:屈曲部における稜線から厚み方向に切った際の配線の断面
Claims (16)
- 樹脂層と金属箔から形成された配線とを備え、配線の少なくとも一箇所に屈曲部を有して使用される可撓性回路基板であって、
金属箔が立方晶系の結晶構造を有する金属からなり、かつ、屈曲部における稜線から厚み方向に切った際の配線の断面が、[001]を晶帯軸として(100)から(110)への回転方向における(20 1 0)から(1 20 0)の範囲に含まれたいずれかの面に主方位をなすことを特徴とする可撓性回路基板。 - 屈曲部での稜線から厚み方向に切った際の配線の断面が、(100)標準投影図のステレオ三角形において(20 1 0)を表す点と(110)を表す点とで結ばれた線分上にあるいずれかの面である請求項1に記載の可撓性回路基板。
- 金属箔が銅箔であり、かつ、銅箔の厚み方向のX線回折で求めた(200)面の強度(I)が、微粉末銅のX線回折で求めた(200)面の強度(I0)に対してI/I0≧25である請求項1又は2に記載の可撓性回路基板。
- 金属箔が面心立方構造を有する金属からなり、面心立方構造の単位格子の基本結晶軸<100>が金属箔の厚さ方向と箔面内の一方向の2つの直交軸に対して、方位差10°以内にある優先配向領域が、面積率で50%以上を占めるように主方位を有していると共に、屈曲部の稜線から金属箔の厚み方向に切った配線断面に対する法線が、箔面内の<100>主方位と2.9~87.1°の角度を有する請求項1又は2に記載の可撓性回路基板。
- 金属箔が、厚さ5~100μmの圧延銅箔である請求項1~4のいずれかに記載の可撓性回路基板。
- 摺動屈曲、折り曲げ屈曲、ヒンジ屈曲及びスライド屈曲からなる群から選ばれたいずれかの繰り返し動作を伴う屈曲部が形成される請求項1~5のいずれかに記載の可撓性回路基板。
- 屈曲部における稜線に対して直交する方向に沿って配線が形成されている請求項1~6のいずれかに記載の可撓性回路基板。
- 樹脂層がポリイミドからなる請求項1~7のいずれかに記載の可撓性回路基板。
- 樹脂層と金属箔から形成された配線とを備え、配線の少なくとも一箇所に屈曲部を有して使用される可撓性回路基板の屈曲部構造であって、金属箔が立方晶系の結晶構造を有する金属からなり、かつ、屈曲部における稜線から厚み方向に切った際の配線の断面が、[001]を晶帯軸として(100)から(110)への回転方向における(20 1 0)から(1 20 0)の範囲に含まれたいずれかの面に主方位をなすことを特徴とする可撓性回路基板の屈曲部構造。
- 屈曲部での稜線から厚み方向に切った際の配線の断面が、(100)標準投影図のステレオ三角形において(20 1 0)を表す点と(110)を表す点とで結ばれた線分上にあるいずれかの面である請求項9に記載の可撓性回路基板の屈曲部構造。
- 樹脂層と金属箔から形成された配線とを備え、配線の少なくとも一箇所に屈曲部を有して使用される可撓性回路基板の製造方法であって、
金属箔が立方晶系の結晶構造を有する金属からなり、屈曲部における稜線が、金属箔の面内の基本結晶軸<100>のひとつと2.9~87.1°の角度を有するように配線を形成することを特徴とする可撓性回路基板の製造方法。 - 金属箔が銅箔であり、かつ、銅箔の厚み方向のX線回折で求めた(200)面の強度(I)が、微粉末銅のX線回折で求めた(200)面の強度(I0)に対してI/I0≧25である請求項11に記載の可撓性回路基板の製造方法。
- 面心立方構造を有する圧延金属箔を、面心立方構造の単位格子の基本結晶軸<100>が金属箔の厚さ方向と箔面内の一方向の2つの直交軸に対して、方位差10°以内にある優先配向領域が、面積率で50%以上を占めるように、熱処理によって立方体集合組織を呈せしめる請求項12に記載の可撓性回路基板の製造方法。
- 摺動屈曲、折り曲げ屈曲、ヒンジ屈曲及びスライド屈曲からなる群から選ばれたいずれかの繰り返し動作を伴う屈曲部が形成される請求項11~13のいずれかに記載の可撓性回路基板の製造方法。
- 屈曲部における稜線に対して直交する方向に沿って配線を形成する請求項11~14のいずれかに記載の可撓性回路基板の製造方法。
- 請求項1~8のいずれかに記載の可撓性回路基板を搭載した電子機器。
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US13/001,946 US9060432B2 (en) | 2008-06-30 | 2009-06-25 | Flexible circuit board and method for producing same and bend structure of flexible circuit board |
CN2009801250016A CN102077698B (zh) | 2008-06-30 | 2009-06-25 | 挠性电路基板及其制造方法以及挠性电路基板的弯曲部结构 |
EP09773390.1A EP2306794B1 (en) | 2008-06-30 | 2009-06-25 | Method for producing flexible circuit board |
US14/282,922 US20140254114A1 (en) | 2008-06-30 | 2014-05-20 | Flexible circuit board and method for producing same and bend structure of flexible circuit board |
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US14/282,922 Division US20140254114A1 (en) | 2008-06-30 | 2014-05-20 | Flexible circuit board and method for producing same and bend structure of flexible circuit board |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011078259A1 (ja) * | 2009-12-25 | 2011-06-30 | 新日鐵化学株式会社 | 可撓性回路基板及び可撓性回路基板の屈曲部構造 |
JP2013014838A (ja) * | 2011-06-08 | 2013-01-24 | Nippon Steel & Sumikin Chemical Co Ltd | 銅箔、銅張積層板、可撓性回路基板、及び銅張積層板の製造方法 |
WO2013069800A1 (ja) * | 2011-11-11 | 2013-05-16 | 古河電気工業株式会社 | 圧延銅箔 |
CN114746269A (zh) * | 2019-12-03 | 2022-07-12 | 肖特玻璃科技(苏州)有限公司 | 危险裂片减少的可折叠覆盖制品 |
WO2024014169A1 (ja) * | 2022-07-14 | 2024-01-18 | Jx金属株式会社 | 銅箔並びにそれを用いた銅張積層板及びフレキシブルプリント配線板 |
Families Citing this family (43)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5355478B2 (ja) * | 2010-04-07 | 2013-11-27 | 株式会社フジクラ | フレキシブルプリント基板及びその製造方法 |
US10178816B2 (en) * | 2011-05-13 | 2019-01-08 | Jx Nippon Mining & Metals Corporation | Copper foil composite, copper foil used for the same, formed product and method of producing the same |
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WO2012177978A1 (en) | 2011-06-24 | 2012-12-27 | Source Technologies, Llc | Apparatus and method for determining and adjusting printhead pressure |
US9481186B2 (en) | 2011-07-14 | 2016-11-01 | Datamax-O'neil Corporation | Automatically adjusting printing parameters using media identification |
US8842142B2 (en) | 2011-08-05 | 2014-09-23 | Datamax-O'neil Corporation | Print station system |
WO2013023227A1 (en) | 2011-08-05 | 2013-02-14 | Source Technologies, Llc | Printing system |
JP5694094B2 (ja) * | 2011-09-01 | 2015-04-01 | Jx日鉱日石金属株式会社 | フレキシブルプリント配線板用銅箔、銅張積層板、フレキシブルプリント配線板及び電子機器 |
JP5597176B2 (ja) | 2011-10-11 | 2014-10-01 | 株式会社フジクラ | プリント配線板の製造方法 |
CA2852928A1 (en) * | 2011-10-20 | 2013-04-25 | Source Technologies, Llc | Top of form sensor |
EP2782763B1 (en) | 2011-11-22 | 2018-02-14 | Datamax-O'Neil Corporation | Synchronized media hanger/guide |
US9024988B2 (en) | 2011-12-22 | 2015-05-05 | Datamax-O'neil Corporation | Media detection apparatus and method |
WO2013105266A1 (ja) | 2012-01-13 | 2013-07-18 | Jx日鉱日石金属株式会社 | 銅箔複合体、並びに成形体及びその製造方法 |
US9981450B2 (en) | 2012-01-13 | 2018-05-29 | Jx Nippon Mining & Metals Corporation | Copper foil composite, formed product and method of producing the same |
JP5246526B1 (ja) * | 2012-02-17 | 2013-07-24 | 日立電線株式会社 | 圧延銅箔 |
JP5126434B1 (ja) * | 2012-02-17 | 2013-01-23 | 日立電線株式会社 | 圧延銅箔 |
US9601557B2 (en) | 2012-11-16 | 2017-03-21 | Apple Inc. | Flexible display |
US9061527B2 (en) | 2012-12-07 | 2015-06-23 | Datamax-O'neil Corporation | Thermal printer with single latch, adjustable media storage and centering assemblies and print assembly |
KR20140123852A (ko) | 2013-04-15 | 2014-10-23 | 삼성디스플레이 주식회사 | 칩 온 필름 및 이를 포함하는 표시 장치 |
JP6393126B2 (ja) * | 2013-10-04 | 2018-09-19 | Jx金属株式会社 | 表面処理圧延銅箔、積層板、プリント配線板、電子機器及びプリント配線板の製造方法 |
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US9676216B2 (en) | 2014-03-27 | 2017-06-13 | Datamax-O'neil Corporation | Systems and methods for automatic printer configuration |
JP6306410B2 (ja) * | 2014-04-17 | 2018-04-04 | 日本メクトロン株式会社 | フレキシブルプリント基板の製造方法、基板製造用治具および基板製造装置 |
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US9600112B2 (en) * | 2014-10-10 | 2017-03-21 | Apple Inc. | Signal trace patterns for flexible substrates |
JP6358340B2 (ja) * | 2014-12-12 | 2018-07-18 | 新日鐵住金株式会社 | 配向銅板、銅張積層板、可撓性回路基板、及び電子機器 |
KR101586765B1 (ko) * | 2015-02-27 | 2016-01-25 | 주식회사 다우인큐브 | 반도체 공정 기반 3차원 가상 형상 모델링 방법 |
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US9786790B2 (en) | 2015-12-10 | 2017-10-10 | Industrial Technology Research Institute | Flexible device |
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US11647678B2 (en) * | 2016-08-23 | 2023-05-09 | Analog Devices International Unlimited Company | Compact integrated device packages |
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JP6649930B2 (ja) * | 2017-11-16 | 2020-02-19 | 矢崎総業株式会社 | 電子回路基板及び電子部品ユニット |
US11707341B2 (en) | 2020-03-02 | 2023-07-25 | Biosense Webster (Israel) Ltd. | Jig for assembling a position sensor |
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CN114692557B (zh) * | 2022-06-01 | 2022-08-16 | 深圳市鄱阳科技有限公司 | 一种柔性电路板制造性能监测分析方法及系统 |
CN116563091B (zh) * | 2022-12-27 | 2024-02-13 | 上海勘测设计研究院有限公司 | 地形数据生成方法、装置、介质及电子设备 |
CN116175943B (zh) * | 2023-04-25 | 2023-08-01 | 中电科风华信息装备股份有限公司 | 汽车b柱fpc自动折弯装置 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH039383B2 (ja) | 1987-12-08 | 1991-02-08 | Rinnai Kk | |
JP2001058203A (ja) | 1999-08-19 | 2001-03-06 | Nippon Mining & Metals Co Ltd | 屈曲性に優れた圧延銅箔 |
JP2002171033A (ja) | 2000-12-04 | 2002-06-14 | Matsushita Electric Ind Co Ltd | フレキシブルプリント基板 |
JP2002300247A (ja) | 2001-03-29 | 2002-10-11 | Sanyo Electric Co Ltd | 折畳式携帯電話装置 |
JP2003193211A (ja) * | 2001-12-27 | 2003-07-09 | Nippon Mining & Metals Co Ltd | 銅張積層板用圧延銅箔 |
JP2005005413A (ja) * | 2003-06-11 | 2005-01-06 | Ibiden Co Ltd | フレキシブル−リジッド配線基板 |
JP2007107036A (ja) | 2005-10-12 | 2007-04-26 | Nikko Kinzoku Kk | 屈曲用圧延銅合金箔 |
JP2008038170A (ja) * | 2006-08-03 | 2008-02-21 | Sumitomo Kinzoku Kozan Shindo Kk | 圧延銅箔 |
JP2008106313A (ja) * | 2006-10-26 | 2008-05-08 | Hitachi Cable Ltd | 圧延銅箔およびその製造方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2782790B2 (ja) | 1989-06-07 | 1998-08-06 | 富士ゼロックス株式会社 | 画像読取装置 |
JPH07312469A (ja) * | 1994-05-16 | 1995-11-28 | Nippon Mektron Ltd | 多層フレキシブル回路基板の屈曲部構造 |
JP3009383B2 (ja) | 1998-03-31 | 2000-02-14 | 日鉱金属株式会社 | 圧延銅箔およびその製造方法 |
JP3856582B2 (ja) * | 1998-11-17 | 2006-12-13 | 日鉱金属株式会社 | フレキシブルプリント回路基板用圧延銅箔およびその製造方法 |
JP3898077B2 (ja) * | 2001-11-13 | 2007-03-28 | 株式会社フジクラ | フレキシブルプリント配線板の製造方法 |
US7531752B2 (en) * | 2003-07-24 | 2009-05-12 | Nec Corporation | Flexible substrate and electronic device |
TWI303955B (en) * | 2005-12-28 | 2008-12-01 | High Tech Comp Corp | Dual-axis circuit board |
WO2008050584A1 (fr) * | 2006-10-24 | 2008-05-02 | Nippon Mining & Metals Co., Ltd. | Feuille de cuivre enroulee presentant une excellente resistance a la flexion |
US7789977B2 (en) * | 2006-10-26 | 2010-09-07 | Hitachi Cable, Ltd. | Rolled copper foil and manufacturing method thereof |
-
2009
- 2009-06-25 WO PCT/JP2009/061644 patent/WO2010001812A1/ja active Application Filing
- 2009-06-25 EP EP09773390.1A patent/EP2306794B1/en not_active Not-in-force
- 2009-06-25 US US13/001,946 patent/US9060432B2/en not_active Expired - Fee Related
- 2009-06-25 CN CN2009801250016A patent/CN102077698B/zh not_active Expired - Fee Related
- 2009-06-25 EP EP14157869.0A patent/EP2747527A1/en not_active Withdrawn
- 2009-06-25 KR KR1020117001735A patent/KR101580822B1/ko active IP Right Grant
- 2009-06-30 TW TW98122077A patent/TWI471067B/zh not_active IP Right Cessation
-
2014
- 2014-05-20 US US14/282,922 patent/US20140254114A1/en not_active Abandoned
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH039383B2 (ja) | 1987-12-08 | 1991-02-08 | Rinnai Kk | |
JP2001058203A (ja) | 1999-08-19 | 2001-03-06 | Nippon Mining & Metals Co Ltd | 屈曲性に優れた圧延銅箔 |
JP2002171033A (ja) | 2000-12-04 | 2002-06-14 | Matsushita Electric Ind Co Ltd | フレキシブルプリント基板 |
JP2002300247A (ja) | 2001-03-29 | 2002-10-11 | Sanyo Electric Co Ltd | 折畳式携帯電話装置 |
JP2003193211A (ja) * | 2001-12-27 | 2003-07-09 | Nippon Mining & Metals Co Ltd | 銅張積層板用圧延銅箔 |
JP2005005413A (ja) * | 2003-06-11 | 2005-01-06 | Ibiden Co Ltd | フレキシブル−リジッド配線基板 |
JP2007107036A (ja) | 2005-10-12 | 2007-04-26 | Nikko Kinzoku Kk | 屈曲用圧延銅合金箔 |
JP2008038170A (ja) * | 2006-08-03 | 2008-02-21 | Sumitomo Kinzoku Kozan Shindo Kk | 圧延銅箔 |
JP2008106313A (ja) * | 2006-10-26 | 2008-05-08 | Hitachi Cable Ltd | 圧延銅箔およびその製造方法 |
Non-Patent Citations (2)
Title |
---|
PHYS. REV., vol. 26, 1925, pages 390 |
See also references of EP2306794A4 * |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011078259A1 (ja) * | 2009-12-25 | 2011-06-30 | 新日鐵化学株式会社 | 可撓性回路基板及び可撓性回路基板の屈曲部構造 |
CN102782174A (zh) * | 2009-12-25 | 2012-11-14 | 新日铁化学株式会社 | 柔性电路板及柔性电路板的弯曲部结构 |
JP2013014838A (ja) * | 2011-06-08 | 2013-01-24 | Nippon Steel & Sumikin Chemical Co Ltd | 銅箔、銅張積層板、可撓性回路基板、及び銅張積層板の製造方法 |
WO2013069800A1 (ja) * | 2011-11-11 | 2013-05-16 | 古河電気工業株式会社 | 圧延銅箔 |
JP5342712B1 (ja) * | 2011-11-11 | 2013-11-13 | 古河電気工業株式会社 | 圧延銅箔 |
CN103917683A (zh) * | 2011-11-11 | 2014-07-09 | 古河电气工业株式会社 | 压延铜箔 |
US9457389B2 (en) | 2011-11-11 | 2016-10-04 | Furukawa Electric Co., Ltd. | Rolled copper foil |
CN114746269A (zh) * | 2019-12-03 | 2022-07-12 | 肖特玻璃科技(苏州)有限公司 | 危险裂片减少的可折叠覆盖制品 |
WO2024014169A1 (ja) * | 2022-07-14 | 2024-01-18 | Jx金属株式会社 | 銅箔並びにそれを用いた銅張積層板及びフレキシブルプリント配線板 |
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US20140254114A1 (en) | 2014-09-11 |
EP2306794A1 (en) | 2011-04-06 |
KR101580822B1 (ko) | 2015-12-30 |
EP2306794A4 (en) | 2011-12-07 |
US20110132643A1 (en) | 2011-06-09 |
CN102077698B (zh) | 2013-03-27 |
TWI471067B (zh) | 2015-01-21 |
EP2747527A1 (en) | 2014-06-25 |
CN102077698A (zh) | 2011-05-25 |
KR20110039283A (ko) | 2011-04-15 |
TW201021634A (en) | 2010-06-01 |
EP2306794B1 (en) | 2015-08-05 |
US9060432B2 (en) | 2015-06-16 |
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