KR20030063194A - 반도체 제조 장치 - Google Patents
반도체 제조 장치 Download PDFInfo
- Publication number
- KR20030063194A KR20030063194A KR10-2003-0003353A KR20030003353A KR20030063194A KR 20030063194 A KR20030063194 A KR 20030063194A KR 20030003353 A KR20030003353 A KR 20030003353A KR 20030063194 A KR20030063194 A KR 20030063194A
- Authority
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- South Korea
- Prior art keywords
- holder
- wafer
- manufacturing apparatus
- semiconductor manufacturing
- boat
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
- H01L21/67309—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterized by the substrate support
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4582—Rigid and flat substrates, e.g. plates or discs
- C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S206/00—Special receptacle or package
- Y10S206/832—Semiconductor wafer boat
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (9)
- 반도체 제조 장치에 있어서,기판 처리실 및하나 이상의 실질적으로 링형상의 홀더-상기 각 홀더는 기판이 홀더 위에 탑재될 때 상기 기판의 주위를 지지하기 위한 적어도 하나의 주요부와, 상기 주요부의 단부를 서로 연결하기 위한 적어도 하나의 오목부를 포함함-를 포함하되,상기 오목부는 상기 홀더의 상기 주요부와 높이차를 가지고 상기 기판은 상기 홀더 위에 탑재되는 동안에 상기 기판 처리실 내에서 처리되는반도체 제조 장치.
- 제 1 항에 있어서,상기 반도체 제조 장치는 상기 홀더가 수직적으로 적층된 다수의 지주를 갖는 보트를 더 포함하는반도체 제조 장치.
- 제 2 항에 있어서,상기 홀더 및 상기 지주는 SiC로 이루어지는반도체 제조 장치.
- 제 2 항에 있어서,상기 홀더는 상기 지주 내에 형성된 홈 내에 삽입됨으로써 상기 보트 위에 적층되는반도체 제조 장치.
- 제 1 항에 있어서,상기 기판은 이송되는 동안 아래로부터 상기 기판의 하부를 지지하는 트위저 판을 이용하여 각 홀더 위에 탑재되고, 상기 높이차는 상기 기판이 상기 홀더 위에 탑재된 후에 상기 트위저 판이 각각의 홀더로부터 빠지도록 하는반도체 제조 장치.
- 제 1 항에 있어서,각 홀더는 두 개의 단부를 갖는 하나의 연속적인 주요부와 그 사이에 위치한 하나의 오목부를 포함하는반도체 제조 장치.
- 제 2 항에 있어서,각 홀더는 두 개의 주요부와 두 개의 오목부로 제공되되, 상기 주요부와 상기 오목부는 교대로 위치하는반도체 제조 장치.
- 제 6 항에 있어서,각 홀더는 상기 홀더의 중심점을 지나는 평면에 대하여 평면 대칭하는반도체 제조 장치.
- 제 7 항에 있어서,각 홀더는 상기 홀더의 중심점을 지나는 평면에 대하여 평면 대칭하는반도체 제조 장치.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2002008923 | 2002-01-17 | ||
JPJP-P-2002-00008923 | 2002-01-17 |
Publications (2)
Publication Number | Publication Date |
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KR20030063194A true KR20030063194A (ko) | 2003-07-28 |
KR100530407B1 KR100530407B1 (ko) | 2005-11-22 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR10-2003-0003353A KR100530407B1 (ko) | 2002-01-17 | 2003-01-17 | 반도체 제조 장치 |
Country Status (3)
Country | Link |
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US (1) | US7077913B2 (ko) |
JP (1) | JP2009170933A (ko) |
KR (1) | KR100530407B1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20180130854A (ko) * | 2017-05-30 | 2018-12-10 | 에이에스엠 아이피 홀딩 비.브이. | 기판 지지 장치 및 이를 포함하는 기판 처리 장치 |
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-
2003
- 2003-01-16 US US10/345,190 patent/US7077913B2/en not_active Expired - Lifetime
- 2003-01-17 KR KR10-2003-0003353A patent/KR100530407B1/ko active IP Right Grant
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KR20180130854A (ko) * | 2017-05-30 | 2018-12-10 | 에이에스엠 아이피 홀딩 비.브이. | 기판 지지 장치 및 이를 포함하는 기판 처리 장치 |
Also Published As
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US20030150386A1 (en) | 2003-08-14 |
KR100530407B1 (ko) | 2005-11-22 |
JP2009170933A (ja) | 2009-07-30 |
US7077913B2 (en) | 2006-07-18 |
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