KR20010090378A - 반도체패키지 - Google Patents
반도체패키지 Download PDFInfo
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- KR20010090378A KR20010090378A KR1020000015304A KR20000015304A KR20010090378A KR 20010090378 A KR20010090378 A KR 20010090378A KR 1020000015304 A KR1020000015304 A KR 1020000015304A KR 20000015304 A KR20000015304 A KR 20000015304A KR 20010090378 A KR20010090378 A KR 20010090378A
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- semiconductor chip
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- conductive
- chip
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Abstract
Description
Claims (9)
- 하면에 다수의 입출력패드가 형성된 반도체칩과;상기 반도체칩의 하면에 위치되며, 하면을 향하여 적어도 한 개이상의 돌기부가 형성된 다수의 리드와;상기 반도체칩의 입출력패드와 리드를 상호 전기적으로 접속하는 다수의 도전성 접속수단과;상기 반도체칩, 도전성 접속수단 및 내부리드를 봉지재로 봉지하되, 상기 내부리드의 돌기부 하면은 외부로 노출되도록 형성된 패키지몸체를 포함하여 이루어진 반도체패키지.
- 제1항에 있어서, 상기 반도체칩의 하면 중앙부와 다수의 리드 사이에는 칩탑재판이 더 위치되어 있고, 상기 칩탑재판의 상면과 상기 반도체칩은 열도전성 접착제에 의해 서로 접착된 것을 특징으로 하는 반도체패키지.
- 제1항에 있어서, 상기 반도체칩은 상면이 패키지몸체 외측으로 노출된 것을 특징으로 하는 반도체패키지.
- 제2항에 있어서, 상기 반도체칩은 하면 중앙부에 다수의 입출력패드가 구비되어 있고, 상기 입출력패드는 도전성 접속수단에 의해 상기 칩탑재판에 접속된 것을 특징으로 하는 반도체패키지.
- 제1항 또는 제4항중 어느 한 항에 있어서, 상기 도전성 접속수단은 골드볼, 솔더볼 또는 이방성 전도필름중 선택된 어느 하나인 것을 특징으로 하는 반도체패키지.
- 제1항 또는 제4항중 어느 한 항에 있어서, 상기 도전성 접속수단으로서 골드볼 또는 솔더볼이 이용되었을 경우, 상기 접속수단과 접속되는 칩탑재판 또는 리드의 상면에는 상기 접속되는 영역의 외주연이 일정두께의 절연층으로 코팅된 것을 특징으로 하는 반도체패키지.
- 제1항에 있어서, 상기 리드는 돌기부가 열과 행으로 어레이되어 형성된 것을 특징으로 하는 반도체패키지.
- 제1항, 제2항 또는 제4항중 어느 한 항에 있어서, 상기 리드는 돌기부 하면에 도전성볼이 융착된 것을 특징으로 하는 반도체패키지.
- 제2항 또는 제4항중 어느 한 항에 있어서, 상기 칩탑재판의 하면에는 도전성 페이스트 또는 다수의 도전성볼이 더 형성된 것을 특징으로 하는 반도체패키지.
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KR1020000015304A KR100583494B1 (ko) | 2000-03-25 | 2000-03-25 | 반도체패키지 |
US09/816,852 US6858919B2 (en) | 2000-03-25 | 2001-03-23 | Semiconductor package |
SG200101839A SG91352A1 (en) | 2000-03-25 | 2001-03-23 | Semiconductor package |
US10/944,241 US6953988B2 (en) | 2000-03-25 | 2004-09-17 | Semiconductor package |
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KR1020000015304A KR100583494B1 (ko) | 2000-03-25 | 2000-03-25 | 반도체패키지 |
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US (2) | US6858919B2 (ko) |
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2000
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2001
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- 2001-03-23 SG SG200101839A patent/SG91352A1/en unknown
-
2004
- 2004-09-17 US US10/944,241 patent/US6953988B2/en not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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KR20140054049A (ko) * | 2011-08-16 | 2014-05-08 | 어드밴스드 아날로직 테크놀로지스 인코퍼레이티드 | 실리콘-온-절연체를 포함하는 반도체 패키지 |
Also Published As
Publication number | Publication date |
---|---|
KR100583494B1 (ko) | 2006-05-24 |
US6953988B2 (en) | 2005-10-11 |
SG91352A1 (en) | 2002-09-17 |
US20050062148A1 (en) | 2005-03-24 |
US20020020907A1 (en) | 2002-02-21 |
US6858919B2 (en) | 2005-02-22 |
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