KR102793969B1 - 배선 회로 기판, 그 제조 방법 및 배선 회로 시트 - Google Patents

배선 회로 기판, 그 제조 방법 및 배선 회로 시트 Download PDF

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KR102793969B1
KR102793969B1 KR1020207034009A KR20207034009A KR102793969B1 KR 102793969 B1 KR102793969 B1 KR 102793969B1 KR 1020207034009 A KR1020207034009 A KR 1020207034009A KR 20207034009 A KR20207034009 A KR 20207034009A KR 102793969 B1 KR102793969 B1 KR 102793969B1
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South Korea
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layer
wiring
thickness direction
film
insulating layer
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Korean (ko)
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KR20210016526A (ko
Inventor
마사키 이토
나오키 시바타
야스나리 오야부
겐야 다키모토
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닛토덴코 가부시키가이샤
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0317—Thin film conductor layer; Thin film passive component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/072—Electroless plating, e.g. finish plating or initial plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Structure Of Printed Boards (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Manufacturing Of Printed Wiring (AREA)
KR1020207034009A 2018-05-31 2019-05-10 배선 회로 기판, 그 제조 방법 및 배선 회로 시트 Active KR102793969B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018104707A JP7066528B2 (ja) 2018-05-31 2018-05-31 配線回路基板、その製造方法および配線回路シート
JPJP-P-2018-104707 2018-05-31
PCT/JP2019/018714 WO2019230335A1 (ja) 2018-05-31 2019-05-10 配線回路基板、その製造方法および配線回路シート

Publications (2)

Publication Number Publication Date
KR20210016526A KR20210016526A (ko) 2021-02-16
KR102793969B1 true KR102793969B1 (ko) 2025-04-09

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Country Status (6)

Country Link
US (1) US11284503B2 (enExample)
JP (1) JP7066528B2 (enExample)
KR (1) KR102793969B1 (enExample)
CN (1) CN112205087A (enExample)
TW (1) TWI822782B (enExample)
WO (1) WO2019230335A1 (enExample)

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JP7211930B2 (ja) * 2019-12-17 2023-01-24 日東電工株式会社 配線回路基板の製造方法
TWI838562B (zh) * 2020-07-17 2024-04-11 梁晉睿 複合材料製造方法及其應用
JP7515339B2 (ja) 2020-08-07 2024-07-12 日東電工株式会社 配線回路基板の製造方法、および配線回路基板
JP7289602B2 (ja) * 2020-11-13 2023-06-12 日東電工株式会社 配線回路基板、および配線回路基板の製造方法
JP7651335B2 (ja) 2021-03-23 2025-03-26 日東電工株式会社 配線回路基板の製造方法
JP7714369B2 (ja) * 2021-04-26 2025-07-29 日東電工株式会社 集合体シート、および、集合体シートの製造方法
JP7715531B2 (ja) * 2021-04-26 2025-07-30 日東電工株式会社 集合体シート、および、集合体シートの製造方法
TWI786710B (zh) * 2021-07-07 2022-12-11 艾姆勒科技股份有限公司 散熱器結構
US20230080659A1 (en) * 2021-09-15 2023-03-16 Amulaire Thermal Technology, Inc. Radiator structure
JP7448828B2 (ja) * 2021-09-30 2024-03-13 日亜化学工業株式会社 配線基板、発光装置及びそれらの製造方法
JP2023066606A (ja) 2021-10-29 2023-05-16 日東電工株式会社 配線回路基板およびその製造方法
JP2023071122A (ja) * 2021-11-10 2023-05-22 日東電工株式会社 配線回路基板
US12464642B2 (en) 2022-06-15 2025-11-04 Nitto Denko Corporation Wiring circuit board and method of producing the wiring circuit board
KR20240062530A (ko) * 2022-11-02 2024-05-09 엘지이노텍 주식회사 열전모듈
CN119545653A (zh) * 2024-10-17 2025-02-28 盐城维信电子有限公司 可传输力信号的薄型多层线路板及其制作方法

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Also Published As

Publication number Publication date
US11284503B2 (en) 2022-03-22
JP7066528B2 (ja) 2022-05-13
WO2019230335A1 (ja) 2019-12-05
TWI822782B (zh) 2023-11-21
TW202005494A (zh) 2020-01-16
CN112205087A (zh) 2021-01-08
US20210212196A1 (en) 2021-07-08
KR20210016526A (ko) 2021-02-16
JP2019212659A (ja) 2019-12-12

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