CN112205087A - 布线电路基板及其制造方法和布线电路片材 - Google Patents

布线电路基板及其制造方法和布线电路片材 Download PDF

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Publication number
CN112205087A
CN112205087A CN201980036285.5A CN201980036285A CN112205087A CN 112205087 A CN112205087 A CN 112205087A CN 201980036285 A CN201980036285 A CN 201980036285A CN 112205087 A CN112205087 A CN 112205087A
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CN
China
Prior art keywords
layer
film
thickness direction
circuit board
wired circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201980036285.5A
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English (en)
Chinese (zh)
Inventor
伊藤正树
柴田直树
大薮恭也
滝本显也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of CN112205087A publication Critical patent/CN112205087A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0317—Thin film conductor layer; Thin film passive component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/072—Electroless plating, e.g. finish plating or initial plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Structure Of Printed Boards (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Manufacturing Of Printed Wiring (AREA)
CN201980036285.5A 2018-05-31 2019-05-10 布线电路基板及其制造方法和布线电路片材 Pending CN112205087A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018104707A JP7066528B2 (ja) 2018-05-31 2018-05-31 配線回路基板、その製造方法および配線回路シート
JP2018-104707 2018-05-31
PCT/JP2019/018714 WO2019230335A1 (ja) 2018-05-31 2019-05-10 配線回路基板、その製造方法および配線回路シート

Publications (1)

Publication Number Publication Date
CN112205087A true CN112205087A (zh) 2021-01-08

Family

ID=68696655

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201980036285.5A Pending CN112205087A (zh) 2018-05-31 2019-05-10 布线电路基板及其制造方法和布线电路片材

Country Status (6)

Country Link
US (1) US11284503B2 (enExample)
JP (1) JP7066528B2 (enExample)
KR (1) KR102793969B1 (enExample)
CN (1) CN112205087A (enExample)
TW (1) TWI822782B (enExample)
WO (1) WO2019230335A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119545653A (zh) * 2024-10-17 2025-02-28 盐城维信电子有限公司 可传输力信号的薄型多层线路板及其制作方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7211930B2 (ja) * 2019-12-17 2023-01-24 日東電工株式会社 配線回路基板の製造方法
TWI838562B (zh) * 2020-07-17 2024-04-11 梁晉睿 複合材料製造方法及其應用
JP7515339B2 (ja) 2020-08-07 2024-07-12 日東電工株式会社 配線回路基板の製造方法、および配線回路基板
JP7289602B2 (ja) * 2020-11-13 2023-06-12 日東電工株式会社 配線回路基板、および配線回路基板の製造方法
JP7651335B2 (ja) 2021-03-23 2025-03-26 日東電工株式会社 配線回路基板の製造方法
JP7714369B2 (ja) * 2021-04-26 2025-07-29 日東電工株式会社 集合体シート、および、集合体シートの製造方法
JP7715531B2 (ja) * 2021-04-26 2025-07-30 日東電工株式会社 集合体シート、および、集合体シートの製造方法
TWI786710B (zh) * 2021-07-07 2022-12-11 艾姆勒科技股份有限公司 散熱器結構
US20230080659A1 (en) * 2021-09-15 2023-03-16 Amulaire Thermal Technology, Inc. Radiator structure
JP7448828B2 (ja) * 2021-09-30 2024-03-13 日亜化学工業株式会社 配線基板、発光装置及びそれらの製造方法
JP2023066606A (ja) 2021-10-29 2023-05-16 日東電工株式会社 配線回路基板およびその製造方法
JP2023071122A (ja) * 2021-11-10 2023-05-22 日東電工株式会社 配線回路基板
US12464642B2 (en) 2022-06-15 2025-11-04 Nitto Denko Corporation Wiring circuit board and method of producing the wiring circuit board
KR20240062530A (ko) * 2022-11-02 2024-05-09 엘지이노텍 주식회사 열전모듈

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Publication number Priority date Publication date Assignee Title
JPH06125155A (ja) * 1992-10-12 1994-05-06 Denki Kagaku Kogyo Kk 金属ベース回路基板
JPH08125295A (ja) * 1994-10-20 1996-05-17 Mitsui Toatsu Chem Inc 金属ベース回路基板
JP2007035868A (ja) * 2005-07-26 2007-02-08 Nitto Denko Corp 配線回路基板の製造方法
JP2014191845A (ja) * 2013-03-27 2014-10-06 Dainippon Printing Co Ltd サスペンション用基板

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JP3950060B2 (ja) * 2003-01-09 2007-07-25 イビデン株式会社 配線板およびその製造方法
WO2004066697A1 (ja) * 2003-01-20 2004-08-05 Fujikura Ltd. 多層配線板およびその製造方法
WO2004073370A1 (ja) * 2003-02-13 2004-08-26 Fujikura Ltd. 多層基板およびその製造方法
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JP5587116B2 (ja) * 2009-09-30 2014-09-10 京セラ株式会社 配線基板及び実装構造体
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JP6788268B2 (ja) * 2016-02-22 2020-11-25 株式会社ダイワ工業 配線基板又は配線基板材料の製造方法
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Publication number Priority date Publication date Assignee Title
JPH06125155A (ja) * 1992-10-12 1994-05-06 Denki Kagaku Kogyo Kk 金属ベース回路基板
JPH08125295A (ja) * 1994-10-20 1996-05-17 Mitsui Toatsu Chem Inc 金属ベース回路基板
JP2007035868A (ja) * 2005-07-26 2007-02-08 Nitto Denko Corp 配線回路基板の製造方法
JP2014191845A (ja) * 2013-03-27 2014-10-06 Dainippon Printing Co Ltd サスペンション用基板

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119545653A (zh) * 2024-10-17 2025-02-28 盐城维信电子有限公司 可传输力信号的薄型多层线路板及其制作方法

Also Published As

Publication number Publication date
US11284503B2 (en) 2022-03-22
JP7066528B2 (ja) 2022-05-13
WO2019230335A1 (ja) 2019-12-05
TWI822782B (zh) 2023-11-21
TW202005494A (zh) 2020-01-16
US20210212196A1 (en) 2021-07-08
KR20210016526A (ko) 2021-02-16
JP2019212659A (ja) 2019-12-12
KR102793969B1 (ko) 2025-04-09

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