JP7066528B2 - 配線回路基板、その製造方法および配線回路シート - Google Patents

配線回路基板、その製造方法および配線回路シート Download PDF

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Publication number
JP7066528B2
JP7066528B2 JP2018104707A JP2018104707A JP7066528B2 JP 7066528 B2 JP7066528 B2 JP 7066528B2 JP 2018104707 A JP2018104707 A JP 2018104707A JP 2018104707 A JP2018104707 A JP 2018104707A JP 7066528 B2 JP7066528 B2 JP 7066528B2
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Japan
Prior art keywords
layer
wiring
support
film
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2018104707A
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English (en)
Japanese (ja)
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JP2019212659A5 (enExample
JP2019212659A (ja
Inventor
正樹 伊藤
直樹 柴田
恭也 大薮
顕也 滝本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
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Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2018104707A priority Critical patent/JP7066528B2/ja
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to US17/057,912 priority patent/US11284503B2/en
Priority to PCT/JP2019/018714 priority patent/WO2019230335A1/ja
Priority to CN201980036285.5A priority patent/CN112205087A/zh
Priority to KR1020207034009A priority patent/KR102793969B1/ko
Priority to TW108117074A priority patent/TWI822782B/zh
Publication of JP2019212659A publication Critical patent/JP2019212659A/ja
Publication of JP2019212659A5 publication Critical patent/JP2019212659A5/ja
Priority to JP2022034485A priority patent/JP7315741B2/ja
Application granted granted Critical
Publication of JP7066528B2 publication Critical patent/JP7066528B2/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0317—Thin film conductor layer; Thin film passive component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/072—Electroless plating, e.g. finish plating or initial plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Structure Of Printed Boards (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2018104707A 2018-05-31 2018-05-31 配線回路基板、その製造方法および配線回路シート Active JP7066528B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2018104707A JP7066528B2 (ja) 2018-05-31 2018-05-31 配線回路基板、その製造方法および配線回路シート
PCT/JP2019/018714 WO2019230335A1 (ja) 2018-05-31 2019-05-10 配線回路基板、その製造方法および配線回路シート
CN201980036285.5A CN112205087A (zh) 2018-05-31 2019-05-10 布线电路基板及其制造方法和布线电路片材
KR1020207034009A KR102793969B1 (ko) 2018-05-31 2019-05-10 배선 회로 기판, 그 제조 방법 및 배선 회로 시트
US17/057,912 US11284503B2 (en) 2018-05-31 2019-05-10 Wiring circuit board, producing method thereof, and wiring circuit sheet
TW108117074A TWI822782B (zh) 2018-05-31 2019-05-17 配線電路基板、其製造方法及配線電路片材
JP2022034485A JP7315741B2 (ja) 2018-05-31 2022-03-07 配線回路基板の製造方法および配線回路シート

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018104707A JP7066528B2 (ja) 2018-05-31 2018-05-31 配線回路基板、その製造方法および配線回路シート

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2022034485A Division JP7315741B2 (ja) 2018-05-31 2022-03-07 配線回路基板の製造方法および配線回路シート

Publications (3)

Publication Number Publication Date
JP2019212659A JP2019212659A (ja) 2019-12-12
JP2019212659A5 JP2019212659A5 (enExample) 2021-11-25
JP7066528B2 true JP7066528B2 (ja) 2022-05-13

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Country Status (6)

Country Link
US (1) US11284503B2 (enExample)
JP (1) JP7066528B2 (enExample)
KR (1) KR102793969B1 (enExample)
CN (1) CN112205087A (enExample)
TW (1) TWI822782B (enExample)
WO (1) WO2019230335A1 (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7211930B2 (ja) * 2019-12-17 2023-01-24 日東電工株式会社 配線回路基板の製造方法
TWI838562B (zh) * 2020-07-17 2024-04-11 梁晉睿 複合材料製造方法及其應用
JP7515339B2 (ja) 2020-08-07 2024-07-12 日東電工株式会社 配線回路基板の製造方法、および配線回路基板
JP7289602B2 (ja) * 2020-11-13 2023-06-12 日東電工株式会社 配線回路基板、および配線回路基板の製造方法
JP7651335B2 (ja) 2021-03-23 2025-03-26 日東電工株式会社 配線回路基板の製造方法
JP7714369B2 (ja) * 2021-04-26 2025-07-29 日東電工株式会社 集合体シート、および、集合体シートの製造方法
JP7715531B2 (ja) * 2021-04-26 2025-07-30 日東電工株式会社 集合体シート、および、集合体シートの製造方法
TWI786710B (zh) * 2021-07-07 2022-12-11 艾姆勒科技股份有限公司 散熱器結構
US20230080659A1 (en) * 2021-09-15 2023-03-16 Amulaire Thermal Technology, Inc. Radiator structure
JP7448828B2 (ja) * 2021-09-30 2024-03-13 日亜化学工業株式会社 配線基板、発光装置及びそれらの製造方法
JP2023066606A (ja) 2021-10-29 2023-05-16 日東電工株式会社 配線回路基板およびその製造方法
JP2023071122A (ja) * 2021-11-10 2023-05-22 日東電工株式会社 配線回路基板
US12464642B2 (en) 2022-06-15 2025-11-04 Nitto Denko Corporation Wiring circuit board and method of producing the wiring circuit board
KR20240062530A (ko) * 2022-11-02 2024-05-09 엘지이노텍 주식회사 열전모듈
CN119545653A (zh) * 2024-10-17 2025-02-28 盐城维信电子有限公司 可传输力信号的薄型多层线路板及其制作方法

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JP2003152335A (ja) 2001-11-15 2003-05-23 Ngk Spark Plug Co Ltd 配線基板の製造方法及び配線基板
JP2004214583A (ja) 2003-01-09 2004-07-29 Ibiden Co Ltd 配線板およびその製造方法
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JP2004214583A (ja) 2003-01-09 2004-07-29 Ibiden Co Ltd 配線板およびその製造方法
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JP2014191845A (ja) 2013-03-27 2014-10-06 Dainippon Printing Co Ltd サスペンション用基板

Also Published As

Publication number Publication date
US11284503B2 (en) 2022-03-22
WO2019230335A1 (ja) 2019-12-05
TWI822782B (zh) 2023-11-21
TW202005494A (zh) 2020-01-16
CN112205087A (zh) 2021-01-08
US20210212196A1 (en) 2021-07-08
KR20210016526A (ko) 2021-02-16
JP2019212659A (ja) 2019-12-12
KR102793969B1 (ko) 2025-04-09

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