TWI822782B - 配線電路基板、其製造方法及配線電路片材 - Google Patents

配線電路基板、其製造方法及配線電路片材 Download PDF

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Publication number
TWI822782B
TWI822782B TW108117074A TW108117074A TWI822782B TW I822782 B TWI822782 B TW I822782B TW 108117074 A TW108117074 A TW 108117074A TW 108117074 A TW108117074 A TW 108117074A TW I822782 B TWI822782 B TW I822782B
Authority
TW
Taiwan
Prior art keywords
layer
film
supporting
mentioned
thickness direction
Prior art date
Application number
TW108117074A
Other languages
English (en)
Chinese (zh)
Other versions
TW202005494A (zh
Inventor
伊藤正樹
柴田直樹
大薮恭也
滝本顕也
Original Assignee
日商日東電工股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日東電工股份有限公司 filed Critical 日商日東電工股份有限公司
Publication of TW202005494A publication Critical patent/TW202005494A/zh
Application granted granted Critical
Publication of TWI822782B publication Critical patent/TWI822782B/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0317—Thin film conductor layer; Thin film passive component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/072—Electroless plating, e.g. finish plating or initial plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Structure Of Printed Boards (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW108117074A 2018-05-31 2019-05-17 配線電路基板、其製造方法及配線電路片材 TWI822782B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018104707A JP7066528B2 (ja) 2018-05-31 2018-05-31 配線回路基板、その製造方法および配線回路シート
JP2018-104707 2018-05-31

Publications (2)

Publication Number Publication Date
TW202005494A TW202005494A (zh) 2020-01-16
TWI822782B true TWI822782B (zh) 2023-11-21

Family

ID=68696655

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108117074A TWI822782B (zh) 2018-05-31 2019-05-17 配線電路基板、其製造方法及配線電路片材

Country Status (6)

Country Link
US (1) US11284503B2 (enExample)
JP (1) JP7066528B2 (enExample)
KR (1) KR102793969B1 (enExample)
CN (1) CN112205087A (enExample)
TW (1) TWI822782B (enExample)
WO (1) WO2019230335A1 (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7211930B2 (ja) * 2019-12-17 2023-01-24 日東電工株式会社 配線回路基板の製造方法
TWI838562B (zh) * 2020-07-17 2024-04-11 梁晉睿 複合材料製造方法及其應用
JP7515339B2 (ja) 2020-08-07 2024-07-12 日東電工株式会社 配線回路基板の製造方法、および配線回路基板
JP7289602B2 (ja) * 2020-11-13 2023-06-12 日東電工株式会社 配線回路基板、および配線回路基板の製造方法
JP7651335B2 (ja) 2021-03-23 2025-03-26 日東電工株式会社 配線回路基板の製造方法
JP7714369B2 (ja) * 2021-04-26 2025-07-29 日東電工株式会社 集合体シート、および、集合体シートの製造方法
JP7715531B2 (ja) * 2021-04-26 2025-07-30 日東電工株式会社 集合体シート、および、集合体シートの製造方法
TWI786710B (zh) * 2021-07-07 2022-12-11 艾姆勒科技股份有限公司 散熱器結構
US20230080659A1 (en) * 2021-09-15 2023-03-16 Amulaire Thermal Technology, Inc. Radiator structure
JP7448828B2 (ja) * 2021-09-30 2024-03-13 日亜化学工業株式会社 配線基板、発光装置及びそれらの製造方法
JP2023066606A (ja) 2021-10-29 2023-05-16 日東電工株式会社 配線回路基板およびその製造方法
JP2023071122A (ja) * 2021-11-10 2023-05-22 日東電工株式会社 配線回路基板
US12464642B2 (en) 2022-06-15 2025-11-04 Nitto Denko Corporation Wiring circuit board and method of producing the wiring circuit board
KR20240062530A (ko) * 2022-11-02 2024-05-09 엘지이노텍 주식회사 열전모듈
CN119545653A (zh) * 2024-10-17 2025-02-28 盐城维信电子有限公司 可传输力信号的薄型多层线路板及其制作方法

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Publication number Priority date Publication date Assignee Title
JPH06125155A (ja) * 1992-10-12 1994-05-06 Denki Kagaku Kogyo Kk 金属ベース回路基板
JPH08125295A (ja) * 1994-10-20 1996-05-17 Mitsui Toatsu Chem Inc 金属ベース回路基板
JP2007035868A (ja) * 2005-07-26 2007-02-08 Nitto Denko Corp 配線回路基板の製造方法
JP2014191845A (ja) * 2013-03-27 2014-10-06 Dainippon Printing Co Ltd サスペンション用基板
TW201803427A (zh) * 2016-02-22 2018-01-16 大和股份有限公司 配線基板或配線基板材料之製造方法

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JPS55140255A (en) 1979-04-18 1980-11-01 Nec Corp Heat sink structure
JP3827559B2 (ja) * 2001-11-15 2006-09-27 日本特殊陶業株式会社 配線基板の製造方法及び配線基板
JP3950060B2 (ja) * 2003-01-09 2007-07-25 イビデン株式会社 配線板およびその製造方法
WO2004066697A1 (ja) * 2003-01-20 2004-08-05 Fujikura Ltd. 多層配線板およびその製造方法
WO2004073370A1 (ja) * 2003-02-13 2004-08-26 Fujikura Ltd. 多層基板およびその製造方法
KR100688858B1 (ko) * 2004-12-30 2007-03-02 삼성전기주식회사 스파이럴 3차원 인덕터를 내장한 인쇄회로기판 및 그 제조방법
JP5587116B2 (ja) * 2009-09-30 2014-09-10 京セラ株式会社 配線基板及び実装構造体
US8513535B2 (en) * 2009-10-30 2013-08-20 Kyocera Corporation Circuit board and structure using the same
JP2011151367A (ja) * 2009-12-25 2011-08-04 Sony Corp 回路基板積層モジュール及び電子機器
US9113569B2 (en) * 2011-03-25 2015-08-18 Ibiden Co., Ltd. Wiring board and method for manufacturing same
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JP2014032978A (ja) * 2012-07-31 2014-02-20 Ibiden Co Ltd インダクタ部品、インダクタ部品の製造方法及び配線板
JP6170790B2 (ja) * 2013-09-13 2017-07-26 新光電気工業株式会社 配線基板及びその製造方法
US20150116950A1 (en) * 2013-10-29 2015-04-30 Samsung Electro-Mechanics Co., Ltd. Coil component, manufacturing method thereof, coil component-embedded substrate, and voltage adjustment module having the same
CN105683266B (zh) * 2013-11-01 2020-04-03 株式会社可乐丽 热塑性液晶聚合物薄膜的制造方法、以及电路基板及其制造方法
KR101642643B1 (ko) * 2015-01-27 2016-07-29 삼성전기주식회사 코일 부품 및 이의 제조 방법
KR101717970B1 (ko) * 2015-04-28 2017-03-21 민동훈 다층 구조의 보이스 코일판 및 이를 포함하는 평판형 스피커
WO2019188287A1 (ja) * 2018-03-28 2019-10-03 株式会社村田製作所 樹脂多層基板、アクチュエータ、および樹脂多層基板の製造方法

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Publication number Priority date Publication date Assignee Title
JPH06125155A (ja) * 1992-10-12 1994-05-06 Denki Kagaku Kogyo Kk 金属ベース回路基板
JPH08125295A (ja) * 1994-10-20 1996-05-17 Mitsui Toatsu Chem Inc 金属ベース回路基板
JP2007035868A (ja) * 2005-07-26 2007-02-08 Nitto Denko Corp 配線回路基板の製造方法
JP2014191845A (ja) * 2013-03-27 2014-10-06 Dainippon Printing Co Ltd サスペンション用基板
TW201803427A (zh) * 2016-02-22 2018-01-16 大和股份有限公司 配線基板或配線基板材料之製造方法

Also Published As

Publication number Publication date
US11284503B2 (en) 2022-03-22
JP7066528B2 (ja) 2022-05-13
WO2019230335A1 (ja) 2019-12-05
TW202005494A (zh) 2020-01-16
CN112205087A (zh) 2021-01-08
US20210212196A1 (en) 2021-07-08
KR20210016526A (ko) 2021-02-16
JP2019212659A (ja) 2019-12-12
KR102793969B1 (ko) 2025-04-09

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