KR102366999B1 - 가공 장치 - Google Patents

가공 장치 Download PDF

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Publication number
KR102366999B1
KR102366999B1 KR1020150118652A KR20150118652A KR102366999B1 KR 102366999 B1 KR102366999 B1 KR 102366999B1 KR 1020150118652 A KR1020150118652 A KR 1020150118652A KR 20150118652 A KR20150118652 A KR 20150118652A KR 102366999 B1 KR102366999 B1 KR 102366999B1
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KR
South Korea
Prior art keywords
vibration
frame
base
processing
workpiece
Prior art date
Application number
KR1020150118652A
Other languages
English (en)
Korean (ko)
Other versions
KR20160024795A (ko
Inventor
도모히토 마츠다
료헤이 네가
미츠루 이쿠시마
Original Assignee
가부시기가이샤 디스코
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시기가이샤 디스코 filed Critical 가부시기가이샤 디스코
Publication of KR20160024795A publication Critical patent/KR20160024795A/ko
Application granted granted Critical
Publication of KR102366999B1 publication Critical patent/KR102366999B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
    • B23Q11/0032—Arrangements for preventing or isolating vibrations in parts of the machine
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q2703/00—Work clamping
    • B23Q2703/12—Accessories for attaching

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Auxiliary Devices For Machine Tools (AREA)
  • Machine Tool Units (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
KR1020150118652A 2014-08-25 2015-08-24 가공 장치 KR102366999B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014170052A JP2016043453A (ja) 2014-08-25 2014-08-25 加工装置
JPJP-P-2014-170052 2014-08-25

Publications (2)

Publication Number Publication Date
KR20160024795A KR20160024795A (ko) 2016-03-07
KR102366999B1 true KR102366999B1 (ko) 2022-02-24

Family

ID=55415684

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150118652A KR102366999B1 (ko) 2014-08-25 2015-08-24 가공 장치

Country Status (4)

Country Link
JP (1) JP2016043453A (zh)
KR (1) KR102366999B1 (zh)
CN (1) CN105382561B (zh)
TW (1) TWI647068B (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6484601B2 (ja) * 2016-11-24 2019-03-13 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 処理装置及び半導体装置の製造方法
US20230063899A1 (en) * 2020-02-06 2023-03-02 Nissin Manufacturing Co., Ltd. Cutting Machining Apparatus
KR20230002804A (ko) * 2020-05-18 2023-01-05 무라다기카이가부시끼가이샤 공작 기계 시스템

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002370130A (ja) * 2001-06-18 2002-12-24 Murata Mach Ltd 工作機械
JP2003218078A (ja) 2002-01-18 2003-07-31 Nippei Toyama Corp ウェーハの加工装置
JP2003260575A (ja) * 2002-03-08 2003-09-16 Komatsu Ltd 加工装置
JP4154816B2 (ja) 1999-11-02 2008-09-24 ソニー株式会社 検査装置
JP2013220506A (ja) 2012-04-17 2013-10-28 Disco Corp 加工装置

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02104196U (zh) * 1989-02-07 1990-08-20
JPH02211917A (ja) * 1989-02-14 1990-08-23 Amada Co Ltd パンチプレスを有する複合加工機
JPH0549198U (ja) * 1991-12-13 1993-06-29 株式会社アマダ 板材加工機
JP2568579Y2 (ja) * 1992-01-14 1998-04-15 カシオ計算機株式会社 振動機器の取付構造
JPH08243880A (ja) * 1994-12-07 1996-09-24 Us Amada Ltd 刻印装置を備えた工作機械
US6530563B1 (en) * 2001-07-10 2003-03-11 Enidine, Incorporated Multi-axis shock and vibration isolation system
TWM247879U (en) * 2003-12-23 2004-10-21 Asustek Comp Inc Notebook computer and dynamic vibration relaxation structure thereof
JP4795040B2 (ja) * 2006-02-06 2011-10-19 株式会社タケウチ プリント基板用穴あけ加工機
JP2008291926A (ja) * 2007-05-25 2008-12-04 Nabeya Iron & Tool Works Ltd 揺動ダンパ配設構造
CN104111587B (zh) * 2007-07-18 2017-01-11 株式会社尼康 测量方法、载台装置、及曝光装置
JP5139034B2 (ja) * 2007-10-31 2013-02-06 株式会社三共製作所 材料送り装置
JP5335448B2 (ja) * 2009-01-19 2013-11-06 株式会社ディスコ 加工装置
CN102348532A (zh) * 2009-03-27 2012-02-08 村田机械株式会社 双轴机床
JP5389540B2 (ja) * 2009-06-12 2014-01-15 株式会社ディスコ 切削装置
WO2012127942A1 (ja) * 2011-03-24 2012-09-27 村田機械株式会社 工作機械システム
CN202085023U (zh) * 2011-05-27 2011-12-21 珠海格力电器股份有限公司 减振橡胶垫
CN202085258U (zh) * 2011-06-09 2011-12-21 俞钟晓 液晶电视机靠墙柱缓冲套
JP5867239B2 (ja) * 2011-09-21 2016-02-24 豊田合成株式会社 ステアリングホイールの制振構造
JP5890365B2 (ja) * 2013-02-14 2016-03-22 高松機械工業株式会社 工作機械
CN103557369A (zh) * 2013-07-26 2014-02-05 中国船舶重工集团公司第七一九研究所 一种硫化橡胶的船用电缆整体隔振支架

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4154816B2 (ja) 1999-11-02 2008-09-24 ソニー株式会社 検査装置
JP2002370130A (ja) * 2001-06-18 2002-12-24 Murata Mach Ltd 工作機械
JP2003218078A (ja) 2002-01-18 2003-07-31 Nippei Toyama Corp ウェーハの加工装置
JP2003260575A (ja) * 2002-03-08 2003-09-16 Komatsu Ltd 加工装置
JP2013220506A (ja) 2012-04-17 2013-10-28 Disco Corp 加工装置

Also Published As

Publication number Publication date
CN105382561A (zh) 2016-03-09
CN105382561B (zh) 2020-01-31
TW201615346A (zh) 2016-05-01
TWI647068B (zh) 2019-01-11
JP2016043453A (ja) 2016-04-04
KR20160024795A (ko) 2016-03-07

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