JP7466995B2 - 切削装置 - Google Patents
切削装置 Download PDFInfo
- Publication number
- JP7466995B2 JP7466995B2 JP2020085968A JP2020085968A JP7466995B2 JP 7466995 B2 JP7466995 B2 JP 7466995B2 JP 2020085968 A JP2020085968 A JP 2020085968A JP 2020085968 A JP2020085968 A JP 2020085968A JP 7466995 B2 JP7466995 B2 JP 7466995B2
- Authority
- JP
- Japan
- Prior art keywords
- cutting
- axis direction
- axis
- workpiece
- cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000005520 cutting process Methods 0.000 title claims description 126
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 40
- 239000003595 mist Substances 0.000 claims description 27
- 230000001629 suppression Effects 0.000 claims description 20
- 230000007246 mechanism Effects 0.000 description 17
- 238000003754 machining Methods 0.000 description 9
- 239000004065 semiconductor Substances 0.000 description 4
- 239000012530 fluid Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 230000007723 transport mechanism Effects 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 239000006061 abrasive grain Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000002173 cutting fluid Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- -1 for example Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
- B24B27/0608—Grinders for cutting-off using a saw movable on slideways
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q1/00—Members which are comprised in the general build-up of a form of machine, particularly relatively large fixed members
- B23Q1/25—Movable or adjustable work or tool supports
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/02—Frames; Beds; Carriages
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B45/00—Means for securing grinding wheels on rotary arbors
- B24B45/006—Quick mount and release means for disc-like wheels, e.g. on power tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/20—Drives or gearings; Equipment therefor relating to feed movement
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/06—Dust extraction equipment on grinding or polishing machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/12—Devices for exhausting mist of oil or coolant; Devices for collecting or recovering materials resulting from grinding or polishing, e.g. of precious metals, precious stones, diamonds or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
- B28D7/02—Accessories specially adapted for use with machines or devices of the preceding groups for removing or laying dust, e.g. by spraying liquids; for cooling work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
- B28D7/04—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
Description
4 :基台
6 :第1移動機構(X軸送り手段)
8 :X軸ガイドレール
10 :X軸移動プレート
12 :ねじ軸
14 :X軸パルスモーター
16 :θテーブル
18 :チャックテーブルベース
20 :チャックテーブル(保持手段)
22 :枠体
24 :ポーラス板
24a :上面
26 :クランプ
28 :テーブルカバー
30 :ウォーターケース
32 :支持構造
34 :第2移動機構(Y軸送り手段、Z軸送り手段)
36 :Y軸ガイドレール
38 :Y軸移動プレート
40 :ねじ軸
42 :Y軸パルスモーター
44 :Z軸ガイドレール
46 :Z軸移動プレート
48 :ねじ軸
50 :Z軸パルスモーター
52 :切削ユニット(切削手段)
54 :カメラ
56 :制御ユニット
62 :スピンドルハウジング
64 :スピンドル
66 :マウンター
68 :切削ブレード
70 :ブレードカバー
72 :第1カバー
72a :前部
72b :後部
72c :中間部
72d :隙間
72e :ねじ孔
72f :ねじ孔
74 :第2カバー
74a :貫通孔
76 :ねじ
78 :第3カバー
78a :貫通孔
80 :ねじ
82 :ノズル
84 :霧抑制部
86 :枠体
88 :湾曲板
88a :前端部
88b :後端部
152 :切削ユニット
184 :霧抑制部
186 :枠体
188 :湾曲板
188a :前端部
188b :後端部
11 :被加工物
13 :テープ(ダイシングテープ)
15 :フレーム
21 :切削水
23 :液滴
Claims (2)
- 被加工物を保持する保持手段と、
該保持手段に保持された被加工物を切削する切削ブレードが装着される回転可能なスピンドルを備えた切削手段と、
該保持手段と該切削手段とを相対的にX軸方向に加工送りするX軸送り手段と、
該保持手段と該切削手段とを相対的に該X軸方向に直交するY軸方向に割り出し送りするY軸送り手段と、を含み、
該切削手段は、
該切削ブレードを覆うブレードカバーと、
該ブレードカバーに設けられ該切削ブレードに切削水を供給するノズルと、
高さ方向に所定の間隔を持って配置された複数の湾曲板を有する霧抑制部と、を更に備える切削装置。 - 該複数とは5枚~10枚であり、該所定の間隔とは3mm~5mmである請求項1に記載の切削装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020085968A JP7466995B2 (ja) | 2020-05-15 | 2020-05-15 | 切削装置 |
KR1020210048873A KR20210141340A (ko) | 2020-05-15 | 2021-04-15 | 절삭 장치 |
TW110117001A TW202145335A (zh) | 2020-05-15 | 2021-05-11 | 切割裝置 |
CN202110520743.1A CN113664689A (zh) | 2020-05-15 | 2021-05-13 | 切削装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020085968A JP7466995B2 (ja) | 2020-05-15 | 2020-05-15 | 切削装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2021178394A JP2021178394A (ja) | 2021-11-18 |
JP7466995B2 true JP7466995B2 (ja) | 2024-04-15 |
Family
ID=78510223
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020085968A Active JP7466995B2 (ja) | 2020-05-15 | 2020-05-15 | 切削装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7466995B2 (ja) |
KR (1) | KR20210141340A (ja) |
CN (1) | CN113664689A (ja) |
TW (1) | TW202145335A (ja) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006289509A (ja) | 2005-04-05 | 2006-10-26 | Disco Abrasive Syst Ltd | 切削装置 |
-
2020
- 2020-05-15 JP JP2020085968A patent/JP7466995B2/ja active Active
-
2021
- 2021-04-15 KR KR1020210048873A patent/KR20210141340A/ko active Search and Examination
- 2021-05-11 TW TW110117001A patent/TW202145335A/zh unknown
- 2021-05-13 CN CN202110520743.1A patent/CN113664689A/zh active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006289509A (ja) | 2005-04-05 | 2006-10-26 | Disco Abrasive Syst Ltd | 切削装置 |
Also Published As
Publication number | Publication date |
---|---|
JP2021178394A (ja) | 2021-11-18 |
CN113664689A (zh) | 2021-11-19 |
KR20210141340A (ko) | 2021-11-23 |
TW202145335A (zh) | 2021-12-01 |
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