KR102296378B1 - 반도체 장치 및 전자 장치 - Google Patents

반도체 장치 및 전자 장치 Download PDF

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KR102296378B1
KR102296378B1 KR1020207019471A KR20207019471A KR102296378B1 KR 102296378 B1 KR102296378 B1 KR 102296378B1 KR 1020207019471 A KR1020207019471 A KR 1020207019471A KR 20207019471 A KR20207019471 A KR 20207019471A KR 102296378 B1 KR102296378 B1 KR 102296378B1
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light emitting
substrate
emitting device
layer
light
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Korean (ko)
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KR20200085371A (ko
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요시하루 히라카타
순페이 야마자키
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가부시키가이샤 한도오따이 에네루기 켄큐쇼
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    • H01L51/56—
    • H01L51/0097—
    • H01L51/5203—
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
    • H04M1/0268—Details of the structure or mounting of specific components for a display module assembly including a flexible display panel
    • H04M1/0269—Details of the structure or mounting of specific components for a display module assembly including a flexible display panel mounted in a fixed curved configuration, e.g. display curved around the edges of the telephone housing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/841—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30—Devices specially adapted for multicolour light emission
    • H10K59/32—Stacked devices having two or more layers, each emitting at different wavelengths
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Signal Processing (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Theoretical Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Planar Illumination Modules (AREA)
KR1020207019471A 2012-08-10 2013-07-31 반도체 장치 및 전자 장치 Active KR102296378B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020217027118A KR102481056B1 (ko) 2012-08-10 2013-07-31 반도체 장치 및 전자 장치

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2012178810 2012-08-10
JPJP-P-2012-178810 2012-08-10
PCT/JP2013/071295 WO2014024900A1 (en) 2012-08-10 2013-07-31 Method for manufacturing light-emitting device
KR1020157005235A KR102133158B1 (ko) 2012-08-10 2013-07-31 발광 장치의 제작 방법

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020157005235A Division KR102133158B1 (ko) 2012-08-10 2013-07-31 발광 장치의 제작 방법

Related Child Applications (1)

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KR1020217027118A Division KR102481056B1 (ko) 2012-08-10 2013-07-31 반도체 장치 및 전자 장치

Publications (2)

Publication Number Publication Date
KR20200085371A KR20200085371A (ko) 2020-07-14
KR102296378B1 true KR102296378B1 (ko) 2021-09-02

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KR1020207019471A Active KR102296378B1 (ko) 2012-08-10 2013-07-31 반도체 장치 및 전자 장치
KR1020247029214A Active KR102891143B1 (ko) 2012-08-10 2013-07-31 표시 장치 및 정보 단말 기기
KR1020227044431A Active KR102703850B1 (ko) 2012-08-10 2013-07-31 발광 장치
KR1020157005235A Active KR102133158B1 (ko) 2012-08-10 2013-07-31 발광 장치의 제작 방법
KR1020217027118A Active KR102481056B1 (ko) 2012-08-10 2013-07-31 반도체 장치 및 전자 장치

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KR1020247029214A Active KR102891143B1 (ko) 2012-08-10 2013-07-31 표시 장치 및 정보 단말 기기
KR1020227044431A Active KR102703850B1 (ko) 2012-08-10 2013-07-31 발광 장치
KR1020157005235A Active KR102133158B1 (ko) 2012-08-10 2013-07-31 발광 장치의 제작 방법
KR1020217027118A Active KR102481056B1 (ko) 2012-08-10 2013-07-31 반도체 장치 및 전자 장치

Country Status (5)

Country Link
US (5) US9508961B2 (enExample)
JP (7) JP2014056815A (enExample)
KR (5) KR102296378B1 (enExample)
TW (7) TWI688138B (enExample)
WO (1) WO2014024900A1 (enExample)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102296378B1 (ko) * 2012-08-10 2021-09-02 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 전자 장치
KR101404628B1 (ko) * 2013-05-29 2014-06-11 김선종 휘어짐이 가능한 전자기기
KR102315659B1 (ko) 2013-11-27 2021-10-20 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치
US9229481B2 (en) 2013-12-20 2016-01-05 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US9711994B2 (en) * 2014-01-31 2017-07-18 Semiconductor Energy Laboratory Co., Ltd. Electronic device and its operation system
TWI524229B (zh) * 2014-03-04 2016-03-01 綠點高新科技股份有限公司 具有二維觸控結構的殼體及其製造方法
US10050015B2 (en) 2014-03-27 2018-08-14 Intel Corporation Multi-device flexible electronics system on a chip (SOC) process integration
KR102208992B1 (ko) * 2014-05-12 2021-01-28 삼성디스플레이 주식회사 표시 장치 및 그 제조 방법
KR20160000298A (ko) * 2014-06-24 2016-01-04 삼성전자주식회사 디스플레이 장치
KR102034002B1 (ko) * 2014-08-26 2019-10-21 한국전자통신연구원 디스플레이 장치 및 그 제조 방법
CN104794993B (zh) * 2015-03-02 2018-09-04 京东方科技集团股份有限公司 一种显示装置及其制造方法
KR102294833B1 (ko) * 2015-05-08 2021-08-27 삼성디스플레이 주식회사 커브드 표시 장치
DE102015012278A1 (de) 2015-09-24 2017-03-30 Audi Ag Dreidimensionale organische Leuchtdiodenvorrichtung
KR102480086B1 (ko) 2016-01-11 2022-12-23 삼성디스플레이 주식회사 디스플레이 장치 및 그 제조방법
US9837682B1 (en) * 2016-08-29 2017-12-05 Microsoft Technology Licensing, Llc Variable layer thickness in curved battery cell
KR102717868B1 (ko) 2016-09-13 2024-10-15 삼성디스플레이 주식회사 표시 장치
KR20180032742A (ko) * 2016-09-22 2018-04-02 삼성디스플레이 주식회사 플렉시블 디스플레이 패널 및 플렉시블 디스플레이 패널 벤딩 방법
WO2018138861A1 (ja) * 2017-01-27 2018-08-02 シャープ株式会社 表示装置
US11411194B2 (en) 2017-05-15 2022-08-09 Pioneer Corporation Light-emitting device
GB201714297D0 (en) * 2017-09-06 2017-10-18 Flexenable Ltd Curved display devices
KR102404974B1 (ko) * 2017-09-12 2022-06-03 삼성디스플레이 주식회사 표시 장치
USD833996S1 (en) * 2017-09-20 2018-11-20 Dongguan Jianye Material Technology Co., Ltd. Cellphone
KR102536672B1 (ko) * 2017-11-06 2023-05-25 삼성디스플레이 주식회사 표시 장치용 구조체 및 이를 포함하는 표시 장치
KR102452529B1 (ko) * 2017-12-12 2022-10-11 삼성디스플레이 주식회사 플렉서블 기판 및 이를 포함하는 표시 장치
CN108133668B (zh) * 2017-12-29 2021-05-11 广东长盈精密技术有限公司 一种基板的制备方法、基板及终端
CN108400240B (zh) * 2018-02-07 2020-03-10 武汉华星光电半导体显示技术有限公司 曲面显示器件的制作方法、曲面显示器件及显示装置
US10916734B2 (en) 2018-02-07 2021-02-09 Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. Method of manufacturing curved display, curved display and display
KR102494515B1 (ko) * 2018-07-09 2023-02-01 삼성전자주식회사 글래스 플레이트를 포함하는 전자 장치
KR102713989B1 (ko) * 2018-11-19 2024-10-07 삼성디스플레이 주식회사 표시 장치 및 그 제조 방법
JP2020101642A (ja) * 2018-12-20 2020-07-02 シャープ株式会社 表示装置および電子機器
CN113631858B (zh) * 2019-04-01 2023-09-22 株式会社小糸制作所 车辆用灯具
KR20200124796A (ko) 2019-04-24 2020-11-04 삼성디스플레이 주식회사 표시 장치 제조 방법, 표시 장치용 보호 필름, 및 이를 제조하는 벤딩 패널 제조장치
CN111129086B (zh) * 2019-12-13 2024-06-18 武汉华星光电技术有限公司 柔性显示面板及其制作方法
CN111355830A (zh) * 2020-02-24 2020-06-30 广州三星通信技术研究有限公司 电子装置以及外壳结构物
US12035556B2 (en) * 2020-03-20 2024-07-09 Chengdu Boe Optoelectronics Technology Co., Ltd. Display device and method for manufacturing the same
US11858244B2 (en) 2020-09-15 2024-01-02 Chengdu Boe Optoelectronics Technology Co., Ltd. Laminating device, laminating method thereof, flexible display module and display device
USD1003825S1 (en) * 2021-07-23 2023-11-07 Shenzhen R-TAX technology CO., LTD. Power bank

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011003537A (ja) * 2009-05-21 2011-01-06 Semiconductor Energy Lab Co Ltd 発光装置の作製方法

Family Cites Families (116)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2742290B2 (ja) * 1989-03-24 1998-04-22 株式会社リコー 液晶表示素子
JPH06194680A (ja) * 1992-12-24 1994-07-15 Casio Comput Co Ltd 液晶フィルム基板
JPH07254488A (ja) 1994-03-16 1995-10-03 Eritsukusu:Kk エレクトロルミネッセントランプ
JPH1065357A (ja) * 1996-08-22 1998-03-06 Casio Comput Co Ltd 電子機器
US6688528B2 (en) * 1997-07-15 2004-02-10 Silverbrook Research Pty Ltd Compact display assembly
JPH11109880A (ja) 1997-10-02 1999-04-23 Japan Aviation Electron Ind Ltd 表示装置
JP2000311781A (ja) 1999-04-28 2000-11-07 Hokuriku Electric Ind Co Ltd 有機ｅｌ素子とその製造方法
JP2001100641A (ja) * 1999-09-29 2001-04-13 Sanyo Electric Co Ltd 表示装置
JP2002006769A (ja) * 2000-06-22 2002-01-11 Morio Taniguchi 有機エレクトロルミネッセンス発光表示装置
US6956324B2 (en) * 2000-08-04 2005-10-18 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method therefor
US7030551B2 (en) 2000-08-10 2006-04-18 Semiconductor Energy Laboratory Co., Ltd. Area sensor and display apparatus provided with an area sensor
JP2002247164A (ja) 2001-02-14 2002-08-30 Matsushita Electric Ind Co Ltd 表示装置
JP3758512B2 (ja) * 2001-03-02 2006-03-22 セイコーエプソン株式会社 電子機器
JP3747791B2 (ja) 2001-03-05 2006-02-22 セイコーエプソン株式会社 パネル駆動制御装置、腕時計型情報機器、携帯機器及びパネル駆動制御方法
JP2002350572A (ja) * 2001-05-28 2002-12-04 Seiko Instruments Inc 電子時計
TW558861B (en) * 2001-06-15 2003-10-21 Semiconductor Energy Lab Laser irradiation stage, laser irradiation optical system, laser irradiation apparatus, laser irradiation method, and method of manufacturing semiconductor device
TW546857B (en) 2001-07-03 2003-08-11 Semiconductor Energy Lab Light-emitting device, method of manufacturing a light-emitting device, and electronic equipment
JP2003109773A (ja) * 2001-07-27 2003-04-11 Semiconductor Energy Lab Co Ltd 発光装置、半導体装置およびそれらの作製方法
JP5057619B2 (ja) 2001-08-01 2012-10-24 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP2003264084A (ja) 2002-03-11 2003-09-19 Harison Toshiba Lighting Corp 発光装置
WO2003037041A1 (en) 2001-10-25 2003-05-01 Harison Toshiba Lighting Corp. Light emitting apparatus
US7042024B2 (en) 2001-11-09 2006-05-09 Semiconductor Energy Laboratory Co., Ltd. Light emitting apparatus and method for manufacturing the same
TWI264121B (en) 2001-11-30 2006-10-11 Semiconductor Energy Lab A display device, a method of manufacturing a semiconductor device, and a method of manufacturing a display device
AU2002360518A1 (en) * 2001-12-12 2003-06-23 Universal Display Corporation Intelligent multi-media display communication system
US7050835B2 (en) 2001-12-12 2006-05-23 Universal Display Corporation Intelligent multi-media display communication system
US6953735B2 (en) * 2001-12-28 2005-10-11 Semiconductor Energy Laboratory Co., Ltd. Method for fabricating a semiconductor device by transferring a layer to a support with curvature
JP4567941B2 (ja) 2001-12-28 2010-10-27 株式会社半導体エネルギー研究所 半導体装置の作製方法及び表示装置の作製方法
JP2004070657A (ja) * 2002-08-06 2004-03-04 Olympus Corp 携帯情報端末の筐体構造
JP2004077382A (ja) * 2002-08-21 2004-03-11 Seiko Instruments Inc 電子時計
JP2004140267A (ja) 2002-10-18 2004-05-13 Semiconductor Energy Lab Co Ltd 半導体装置およびその作製方法
JP4693411B2 (ja) 2002-10-30 2011-06-01 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP4748986B2 (ja) * 2002-11-01 2011-08-17 株式会社半導体エネルギー研究所 半導体装置の作製方法
US20040099926A1 (en) 2002-11-22 2004-05-27 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, display device, and light-emitting device, and methods of manufacturing the same
JP2006507528A (ja) 2002-11-22 2006-03-02 コーニンクレッカ　フィリップス　エレクトロニクス　エヌ　ヴィ 曲面ディスプレイの製造方法
KR101032337B1 (ko) 2002-12-13 2011-05-09 가부시키가이샤 한도오따이 에네루기 켄큐쇼 발광장치 및 그의 제조방법
JP2005123012A (ja) 2003-10-16 2005-05-12 Pioneer Electronic Corp 有機エレクトロルミネセンス表示パネルとその製造方法
US7902747B2 (en) 2003-10-21 2011-03-08 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device having a thin insulating film made of nitrogen and silicon and an electrode made of conductive transparent oxide and silicon dioxide
JP4007308B2 (ja) * 2003-10-28 2007-11-14 セイコーエプソン株式会社 電気光学装置、電子機器、および電気光学装置の製造方法
TWI277042B (en) * 2003-10-28 2007-03-21 Seiko Epson Corp Electro-optical device, electronic equipment, and method of manufacturing electro-optical device
US7746293B2 (en) 2004-03-09 2010-06-29 Senzo Kobayashi Information display apparatus
JP2006039471A (ja) 2004-07-30 2006-02-09 Dragon:Kk 遊技機用表示装置
JP4610975B2 (ja) 2004-09-08 2011-01-12 オリンパス株式会社 表示装置
US8772783B2 (en) * 2004-10-14 2014-07-08 Semiconductor Energy Laboratory Co., Ltd. Display device
TWI411349B (zh) * 2004-11-19 2013-10-01 半導體能源研究所股份有限公司 顯示裝置及電子裝置
US7916263B2 (en) * 2004-12-02 2011-03-29 Semiconductor Energy Laboratory Co., Ltd. Display device
JP4807947B2 (ja) 2004-12-09 2011-11-02 アルパイン株式会社 表示装置
US7566633B2 (en) 2005-02-25 2009-07-28 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
US7368307B2 (en) * 2005-06-07 2008-05-06 Eastman Kodak Company Method of manufacturing an OLED device with a curved light emitting surface
TWI321241B (en) * 2005-09-14 2010-03-01 Ind Tech Res Inst Flexible pixel array substrate and method of fabricating the same
JPWO2007032515A1 (ja) 2005-09-15 2009-03-19 パイオニア株式会社 有機エレクトロルミネセンス表示パネルおよび防湿基板
JP2006091894A (ja) * 2005-09-26 2006-04-06 Seiko Epson Corp パネル駆動制御装置、腕時計型情報機器、携帯機器及びパネル駆動制御方法
US8900970B2 (en) * 2006-04-28 2014-12-02 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing a semiconductor device using a flexible substrate
JP4285504B2 (ja) * 2006-05-24 2009-06-24 ソニー株式会社 タッチパネルを有する表示装置
JP2007326259A (ja) * 2006-06-07 2007-12-20 Yoshida Industry Co Ltd ディスプレイの製造方法及びディスプレイ
KR101186608B1 (ko) 2006-07-14 2012-09-27 엘지전자 주식회사 이동 통신 단말기
EP1895545B1 (en) * 2006-08-31 2014-04-23 Semiconductor Energy Laboratory Co., Ltd. Liquid crystal display device
JP2008083645A (ja) * 2006-09-29 2008-04-10 Seiko Epson Corp 表示装置
JP2008159306A (ja) * 2006-12-21 2008-07-10 Nec Corp コンプレッション型コネクタ
JP2008159309A (ja) * 2006-12-21 2008-07-10 Sony Corp 発光装置およびその製造方法、ならびに表示装置
JP4148299B1 (ja) * 2007-02-13 2008-09-10 ソニー株式会社 光学包装体およびその製造方法、照明装置、ならびに表示装置
WO2008126250A1 (ja) * 2007-03-30 2008-10-23 Pioneer Corporation 発光装置
JP5542296B2 (ja) * 2007-05-17 2014-07-09 株式会社半導体エネルギー研究所 液晶表示装置、表示モジュール及び電子機器
JPWO2008149768A1 (ja) * 2007-06-05 2010-08-26 コニカミノルタホールディングス株式会社 有機エレクトロルミネッセンス発光素子および製造方法
JP5094250B2 (ja) * 2007-07-10 2012-12-12 株式会社ジャパンディスプレイイースト 表示装置
JP5094310B2 (ja) * 2007-09-28 2012-12-12 京セラ株式会社 スライド式携帯電子機器
EP2071441A1 (en) * 2007-12-03 2009-06-17 Semiconductor Energy Laboratory Co., Ltd. Mobile phone
JP2009170173A (ja) * 2008-01-11 2009-07-30 Denso Corp Ｅｌ素子及びその製造方法
WO2009118678A1 (en) * 2008-03-26 2009-10-01 Philips Intellectual Property & Standards Gmbh Light emitting diode device
US7933123B2 (en) * 2008-04-11 2011-04-26 Apple Inc. Portable electronic device with two-piece housing
WO2010005064A1 (en) 2008-07-10 2010-01-14 Semiconductor Energy Laboratory Co., Ltd. Light emitting device and electronic device
KR102112799B1 (ko) 2008-07-10 2020-05-19 가부시키가이샤 한도오따이 에네루기 켄큐쇼 발광장치 및 전자기기
JP2010044156A (ja) 2008-08-11 2010-02-25 Kazuya Ohashi バックライト装置、表示装置及び水生動植物鑑賞装置
JP5216716B2 (ja) 2008-08-20 2013-06-19 株式会社半導体エネルギー研究所 発光装置及びその作製方法
US8494021B2 (en) 2008-08-29 2013-07-23 Semiconductor Energy Laboratory Co., Ltd. Organic laser device
JP2011003522A (ja) 2008-10-16 2011-01-06 Semiconductor Energy Lab Co Ltd フレキシブル発光装置、電子機器及びフレキシブル発光装置の作製方法
JP5323445B2 (ja) 2008-10-21 2013-10-23 富士フイルム株式会社 超音波診断装置
JP2010153813A (ja) 2008-11-18 2010-07-08 Semiconductor Energy Lab Co Ltd 発光装置及びその作製方法、並びに、携帯電話機
KR101702329B1 (ko) 2008-12-17 2017-02-03 가부시키가이샤 한도오따이 에네루기 켄큐쇼 발광 장치 및 전자 기기
CN101800292A (zh) * 2009-02-11 2010-08-11 旭丽电子(广州)有限公司 形成发光外壳的方法及其相关发光模块
JP5219874B2 (ja) * 2009-02-12 2013-06-26 キヤノン株式会社 電子機器
US20100253902A1 (en) * 2009-04-07 2010-10-07 Semiconductor Energy Laboratory Co., Ltd. Liquid crystal display device and manufacturing method thereof
JP5265000B2 (ja) * 2009-04-30 2013-08-14 三菱電機株式会社 表示装置
KR101155907B1 (ko) 2009-06-04 2012-06-20 삼성모바일디스플레이주식회사 유기 발광 표시 장치 및 그 제조 방법
US8766269B2 (en) 2009-07-02 2014-07-01 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device, lighting device, and electronic device
US8576209B2 (en) 2009-07-07 2013-11-05 Semiconductor Energy Laboratory Co., Ltd. Display device
JP4543120B1 (ja) * 2009-07-13 2010-09-15 株式会社東芝 電子機器
CN104992984B (zh) * 2009-07-31 2019-08-16 株式会社半导体能源研究所 半导体装置、显示模块及电子装置
US8593061B2 (en) 2009-08-25 2013-11-26 Seiko Epson Corporation Electro-optical device and electronic apparatus
JP5444940B2 (ja) * 2009-08-25 2014-03-19 セイコーエプソン株式会社 電気光学装置、および電子機器
JP5282706B2 (ja) * 2009-09-08 2013-09-04 カシオ計算機株式会社 電子機器
KR102009813B1 (ko) 2009-09-16 2019-08-12 가부시키가이샤 한도오따이 에네루기 켄큐쇼 발광 장치 및 이의 제조 방법
KR101137389B1 (ko) * 2009-12-15 2012-04-20 삼성모바일디스플레이주식회사 플렉서블 디스플레이용 기판, 이를 제조하는 방법, 및 이 기판제조방법을 이용한 유기 발광 디스플레이 장치의 제조 방법
EP2343629A3 (en) * 2010-01-08 2015-01-21 Integrated Digital Technologies, Inc. Stylus and touch input system
EP2346108A1 (en) * 2010-01-15 2011-07-20 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Foil shaped electro-optical product, semi-finished product and method and apparatus for manufacturing the same
US9000442B2 (en) 2010-01-20 2015-04-07 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device, flexible light-emitting device, electronic device, and method for manufacturing light-emitting device and flexible-light emitting device
KR101113289B1 (ko) * 2010-03-04 2012-02-24 주식회사 토비스 곡면 디스플레이 패널 제조 방법, 이를 이용한 곡면 디스플레이 패널, 및 이를 이용한 다중 영상 표시 장치
US9119293B2 (en) * 2010-03-18 2015-08-25 Nokia Technologies Oy Housing for a portable electronic device
JP5516048B2 (ja) * 2010-05-12 2014-06-11 大日本印刷株式会社 デバイス装置及びディスプレイ装置
KR101845480B1 (ko) 2010-06-25 2018-04-04 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치의 제작 방법
CN106057144B (zh) * 2010-07-02 2019-03-12 株式会社半导体能源研究所 液晶显示装置及驱动液晶显示装置的方法
KR101147988B1 (ko) * 2010-07-13 2012-05-24 포항공과대학교 산학협력단 물리적 박리 방법을 이용한 플렉서블 전자소자의 제조방법, 플렉서블 전자소자 및 플렉서블 기판
US8669702B2 (en) 2010-11-19 2014-03-11 Semiconductor Energy Laboratory Co., Ltd. Lighting device
EP2456175B1 (en) * 2010-11-19 2014-01-15 BlackBerry Limited Portable electronic device including flexible display
US8772795B2 (en) 2011-02-14 2014-07-08 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device and lighting device
US8854326B2 (en) * 2011-03-10 2014-10-07 Wintek Corporation Touch panel and touch-sensitive display device
US9781783B2 (en) 2011-04-15 2017-10-03 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device, display device, light-emitting system, and display system
KR101320384B1 (ko) 2011-06-30 2013-10-23 삼성디스플레이 주식회사 가요성 표시 패널 및 상기 가요성 표시 패널을 포함하는 표시 장치
US10061356B2 (en) * 2011-06-30 2018-08-28 Samsung Display Co., Ltd. Flexible display panel and display apparatus including the flexible display panel
US9093397B2 (en) * 2011-07-06 2015-07-28 Panasonic Corporation Flexible device manufacturing method and flexible device
KR200471325Y1 (ko) * 2011-07-13 2014-02-19 모토로라 모빌리티 엘엘씨 강화된 공차 누적기를 구비하는 모바일 전자 장치
JP2013025015A (ja) * 2011-07-20 2013-02-04 Mitsubishi Electric Corp 液晶パネル及び液晶パネルの製造方法
WO2013021560A1 (ja) * 2011-08-05 2013-02-14 パナソニック株式会社 フレキシブルデバイスの製造方法
US8929085B2 (en) * 2011-09-30 2015-01-06 Apple Inc. Flexible electronic devices
JP5907722B2 (ja) 2011-12-23 2016-04-26 株式会社半導体エネルギー研究所 発光装置の作製方法
KR102296378B1 (ko) * 2012-08-10 2021-09-02 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 전자 장치
CN104584109B (zh) * 2012-09-03 2017-12-22 株式会社半导体能源研究所 显示装置及电子装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011003537A (ja) * 2009-05-21 2011-01-06 Semiconductor Energy Lab Co Ltd 発光装置の作製方法

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