KR101874728B1 - 폴리아마이드 이미드 용액, 다공질 폴리아마이드 이미드 필름, 및 그의 제조 방법 - Google Patents
폴리아마이드 이미드 용액, 다공질 폴리아마이드 이미드 필름, 및 그의 제조 방법 Download PDFInfo
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- KR101874728B1 KR101874728B1 KR1020167017884A KR20167017884A KR101874728B1 KR 101874728 B1 KR101874728 B1 KR 101874728B1 KR 1020167017884 A KR1020167017884 A KR 1020167017884A KR 20167017884 A KR20167017884 A KR 20167017884A KR 101874728 B1 KR101874728 B1 KR 101874728B1
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/14—Polyamide-imides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/02—Making solutions, dispersions, lattices or gels by other methods than by solution, emulsion or suspension polymerisation techniques
- C08J3/09—Making solutions, dispersions, lattices or gels by other methods than by solution, emulsion or suspension polymerisation techniques in organic liquids
- C08J3/091—Making solutions, dispersions, lattices or gels by other methods than by solution, emulsion or suspension polymerisation techniques in organic liquids characterised by the chemical constitution of the organic liquid
- C08J3/095—Oxygen containing compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/02—Making solutions, dispersions, lattices or gels by other methods than by solution, emulsion or suspension polymerisation techniques
- C08J3/09—Making solutions, dispersions, lattices or gels by other methods than by solution, emulsion or suspension polymerisation techniques in organic liquids
- C08J3/091—Making solutions, dispersions, lattices or gels by other methods than by solution, emulsion or suspension polymerisation techniques in organic liquids characterised by the chemical constitution of the organic liquid
- C08J3/096—Nitrogen containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
- C08J9/24—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof by surface fusion and bonding of particles to form voids, e.g. sintering
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
- C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2367/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
- C08J2367/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2479/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2461/00 - C08J2477/00
- C08J2479/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2479/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
- Cell Separators (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2014-006004 | 2014-01-16 | ||
| JP2014006004 | 2014-01-16 | ||
| PCT/JP2015/050962 WO2015108114A1 (ja) | 2014-01-16 | 2015-01-15 | ポリアミドイミド溶液、多孔質ポリアミドイミドフィルム、およびその製造方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020187017652A Division KR102127586B1 (ko) | 2014-01-16 | 2015-01-15 | 폴리아마이드 이미드 용액, 다공질 폴리아마이드 이미드 필름, 및 그의 제조 방법 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20160107167A KR20160107167A (ko) | 2016-09-13 |
| KR101874728B1 true KR101874728B1 (ko) | 2018-07-04 |
Family
ID=53542999
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020167017884A Active KR101874728B1 (ko) | 2014-01-16 | 2015-01-15 | 폴리아마이드 이미드 용액, 다공질 폴리아마이드 이미드 필름, 및 그의 제조 방법 |
| KR1020187017652A Active KR102127586B1 (ko) | 2014-01-16 | 2015-01-15 | 폴리아마이드 이미드 용액, 다공질 폴리아마이드 이미드 필름, 및 그의 제조 방법 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020187017652A Active KR102127586B1 (ko) | 2014-01-16 | 2015-01-15 | 폴리아마이드 이미드 용액, 다공질 폴리아마이드 이미드 필름, 및 그의 제조 방법 |
Country Status (4)
| Country | Link |
|---|---|
| JP (4) | JP6175517B2 (enExample) |
| KR (2) | KR101874728B1 (enExample) |
| CN (2) | CN109971174A (enExample) |
| WO (1) | WO2015108114A1 (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6577182B2 (ja) * | 2014-12-02 | 2019-09-18 | ユニチカ株式会社 | イミド系高分子溶液、多孔質イミド系高分子フィルム、およびその製造方法 |
| JP6962548B2 (ja) * | 2016-08-22 | 2021-11-05 | ユニチカ株式会社 | 蓄電素子電極用ポリアミドイミド溶液、蓄電素子電極の製造方法および蓄電素子電極 |
| JP7116461B2 (ja) * | 2016-12-09 | 2022-08-10 | ユニチカ株式会社 | バインダ溶液および塗液ならびに蓄電素子電極の製造方法 |
| JP7233071B2 (ja) * | 2018-04-24 | 2023-03-06 | ユニチカ株式会社 | ポリアミドイミド組成物およびその使用 |
| KR102326790B1 (ko) * | 2018-11-29 | 2021-11-15 | 주식회사 엘지화학 | 폴리아미드 공중합체 및 이를 포함하는 폴리아미드 필름 |
| JP6974368B2 (ja) * | 2019-01-11 | 2021-12-01 | エセックス古河マグネットワイヤジャパン株式会社 | 絶縁塗料、及びこれを用いた絶縁電線の製造方法 |
| JP7436023B2 (ja) * | 2019-05-28 | 2024-02-21 | ユニチカ株式会社 | ポリアミドイミド溶液および多孔質ポリアミドイミドフィルムの製造方法 |
| CN111514766B (zh) * | 2020-02-21 | 2022-04-26 | 山西格瑞思科技有限公司 | 带羧酸基团的聚酰胺-聚酰亚胺煤层气脱氮浓缩分离膜 |
| JP7742713B2 (ja) * | 2021-04-19 | 2025-09-22 | 日東電工株式会社 | 多孔質ポリイミドフィルム |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007154029A (ja) * | 2005-12-05 | 2007-06-21 | Toyobo Co Ltd | ポリアミドイミド樹脂 |
| JP2007269575A (ja) * | 2006-03-31 | 2007-10-18 | Tomoegawa Paper Co Ltd | 多孔質炭素膜の製造方法、燃料電池用電極、塩水電解用電極 |
| WO2013133333A1 (ja) * | 2012-03-07 | 2013-09-12 | 古河電気工業株式会社 | 気泡層入り絶縁電線、電気機器及び気泡層入り絶縁電線の製造方法 |
| JP2013209499A (ja) | 2012-03-30 | 2013-10-10 | Toyobo Co Ltd | 半導体用コーティング剤 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4947989B1 (enExample) | 1970-09-22 | 1974-12-19 | ||
| DE3743780A1 (de) * | 1987-12-23 | 1989-07-06 | Bayer Ag | Verfahren zur verbesserung der haftfestigkeit von stromlos abgeschiedenen metallschichten auf polyimidoberflaechen |
| JPH08208984A (ja) * | 1995-02-06 | 1996-08-13 | Sumitomo Bakelite Co Ltd | ポリイミド樹脂組成物 |
| JP2001266949A (ja) * | 2000-03-17 | 2001-09-28 | Sumitomo Chem Co Ltd | リチウムイオン二次電池 |
| JP2004256750A (ja) * | 2003-02-27 | 2004-09-16 | Toppan Forms Co Ltd | 金属ナノ微粒子を含む導電性塗工液、導電性金属箔 |
| WO2005080487A1 (ja) * | 2004-02-23 | 2005-09-01 | Toyo Boseki Kabushiki Kaisha | 多孔質膜とその製造法及びこれを用いたリチウムイオン二次電池 |
| JP4591010B2 (ja) * | 2004-03-03 | 2010-12-01 | 東洋紡績株式会社 | 多孔質膜とその製造法及びこれを用いたリチウムイオン二次電池 |
| JP4812266B2 (ja) * | 2004-07-01 | 2011-11-09 | 株式会社巴川製紙所 | 電子部品用セパレータ及びその製造方法 |
| JP4947989B2 (ja) | 2006-02-09 | 2012-06-06 | ユニチカ株式会社 | ポリイミド前駆体溶液、ポリイミド多孔質フィルム、およびそれらの製造方法 |
| JP2008027766A (ja) * | 2006-07-21 | 2008-02-07 | Hitachi Maxell Ltd | リチウム電池 |
| JP5430249B2 (ja) * | 2009-06-23 | 2014-02-26 | キヤノン株式会社 | 多孔質高分子膜の製造方法及びその製造方法で製造した多孔質高分子膜 |
| JP2012111790A (ja) * | 2010-11-19 | 2012-06-14 | Daicel Corp | 乾式ポリイミド系多孔性フィルム及びその製造方法 |
| TWI529200B (zh) * | 2011-04-20 | 2016-04-11 | 鐘化股份有限公司 | 聚醯胺醯亞胺溶液及聚醯胺醯亞胺膜 |
| JP2013187029A (ja) | 2012-03-07 | 2013-09-19 | Furukawa Electric Co Ltd:The | 気泡入り絶縁電線の製造方法 |
| JP2013210493A (ja) | 2012-03-30 | 2013-10-10 | Furukawa Electric Co Ltd:The | 光反射部材及びその製造方法 |
| KR101905513B1 (ko) | 2012-05-29 | 2018-10-10 | 삼성전자주식회사 | 휴대단말기의 영상 재생 방법 및 장치 |
-
2015
- 2015-01-15 CN CN201811502729.3A patent/CN109971174A/zh active Pending
- 2015-01-15 KR KR1020167017884A patent/KR101874728B1/ko active Active
- 2015-01-15 WO PCT/JP2015/050962 patent/WO2015108114A1/ja not_active Ceased
- 2015-01-15 JP JP2015557872A patent/JP6175517B2/ja active Active
- 2015-01-15 KR KR1020187017652A patent/KR102127586B1/ko active Active
- 2015-01-15 CN CN201580004484.XA patent/CN105916941A/zh active Pending
-
2017
- 2017-02-20 JP JP2017028928A patent/JP6656192B2/ja active Active
- 2017-04-17 JP JP2017081323A patent/JP2017128741A/ja active Pending
- 2017-04-17 JP JP2017081326A patent/JP6425760B2/ja active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007154029A (ja) * | 2005-12-05 | 2007-06-21 | Toyobo Co Ltd | ポリアミドイミド樹脂 |
| JP2007269575A (ja) * | 2006-03-31 | 2007-10-18 | Tomoegawa Paper Co Ltd | 多孔質炭素膜の製造方法、燃料電池用電極、塩水電解用電極 |
| WO2013133333A1 (ja) * | 2012-03-07 | 2013-09-12 | 古河電気工業株式会社 | 気泡層入り絶縁電線、電気機器及び気泡層入り絶縁電線の製造方法 |
| JP2013209499A (ja) | 2012-03-30 | 2013-10-10 | Toyobo Co Ltd | 半導体用コーティング剤 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2015108114A1 (ja) | 2017-03-23 |
| KR20180075695A (ko) | 2018-07-04 |
| JP6175517B2 (ja) | 2017-08-02 |
| WO2015108114A1 (ja) | 2015-07-23 |
| KR102127586B1 (ko) | 2020-06-26 |
| JP6656192B2 (ja) | 2020-03-04 |
| JP2017128741A (ja) | 2017-07-27 |
| KR20160107167A (ko) | 2016-09-13 |
| CN105916941A (zh) | 2016-08-31 |
| JP6425760B2 (ja) | 2018-11-21 |
| CN109971174A (zh) | 2019-07-05 |
| JP2017122243A (ja) | 2017-07-13 |
| JP2017082250A (ja) | 2017-05-18 |
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