KR101736718B1 - 관통형 적층 세라믹 콘덴서 - Google Patents
관통형 적층 세라믹 콘덴서 Download PDFInfo
- Publication number
- KR101736718B1 KR101736718B1 KR1020150149306A KR20150149306A KR101736718B1 KR 101736718 B1 KR101736718 B1 KR 101736718B1 KR 1020150149306 A KR1020150149306 A KR 1020150149306A KR 20150149306 A KR20150149306 A KR 20150149306A KR 101736718 B1 KR101736718 B1 KR 101736718B1
- Authority
- KR
- South Korea
- Prior art keywords
- external electrode
- capacitor
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- interval
- thickness
- Prior art date
Links
- 239000003985 ceramic capacitor Substances 0.000 title claims abstract description 28
- 239000003990 capacitor Substances 0.000 claims abstract description 165
- 230000003746 surface roughness Effects 0.000 claims description 31
- 238000000034 method Methods 0.000 claims description 11
- 238000011156 evaluation Methods 0.000 description 38
- 239000004020 conductor Substances 0.000 description 18
- 238000004519 manufacturing process Methods 0.000 description 16
- 230000000694 effects Effects 0.000 description 15
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 13
- 238000013461 design Methods 0.000 description 13
- 239000000919 ceramic Substances 0.000 description 9
- 230000000149 penetrating effect Effects 0.000 description 9
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 8
- 230000001681 protective effect Effects 0.000 description 8
- 230000009467 reduction Effects 0.000 description 8
- 239000000203 mixture Substances 0.000 description 7
- 230000006872 improvement Effects 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 229910052759 nickel Inorganic materials 0.000 description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 6
- 230000002265 prevention Effects 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 238000007789 sealing Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 5
- 239000000956 alloy Substances 0.000 description 5
- 239000012298 atmosphere Substances 0.000 description 5
- 239000013256 coordination polymer Substances 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 239000005022 packaging material Substances 0.000 description 5
- 229910002113 barium titanate Inorganic materials 0.000 description 4
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 238000010304 firing Methods 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 229910052763 palladium Inorganic materials 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 238000011109 contamination Methods 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 230000005012 migration Effects 0.000 description 3
- 238000013508 migration Methods 0.000 description 3
- 230000035515 penetration Effects 0.000 description 3
- 229910052697 platinum Inorganic materials 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 229920003002 synthetic resin Polymers 0.000 description 3
- 239000000057 synthetic resin Substances 0.000 description 3
- DJOYTAUERRJRAT-UHFFFAOYSA-N 2-(n-methyl-4-nitroanilino)acetonitrile Chemical compound N#CCN(C)C1=CC=C([N+]([O-])=O)C=C1 DJOYTAUERRJRAT-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 239000002270 dispersing agent Substances 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 208000027418 Wounds and injury Diseases 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229910021523 barium zirconate Inorganic materials 0.000 description 1
- DQBAOWPVHRWLJC-UHFFFAOYSA-N barium(2+);dioxido(oxo)zirconium Chemical compound [Ba+2].[O-][Zr]([O-])=O DQBAOWPVHRWLJC-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- AOWKSNWVBZGMTJ-UHFFFAOYSA-N calcium titanate Chemical compound [Ca+2].[O-][Ti]([O-])=O AOWKSNWVBZGMTJ-UHFFFAOYSA-N 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 1
- 238000007607 die coating method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 235000019325 ethyl cellulose Nutrition 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
- 238000007756 gravure coating Methods 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 230000000116 mitigating effect Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 1
- 229940116411 terpineol Drugs 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/35—Feed-through capacitors or anti-noise capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014265701 | 2014-12-26 | ||
JPJP-P-2014-265701 | 2014-12-26 | ||
JPJP-P-2015-203774 | 2015-10-15 | ||
JP2015203774A JP2016127262A (ja) | 2014-12-26 | 2015-10-15 | 貫通型積層セラミックコンデンサ |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20160079636A KR20160079636A (ko) | 2016-07-06 |
KR101736718B1 true KR101736718B1 (ko) | 2017-05-17 |
Family
ID=56359804
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020150149306A KR101736718B1 (ko) | 2014-12-26 | 2015-10-27 | 관통형 적층 세라믹 콘덴서 |
Country Status (4)
Country | Link |
---|---|
JP (3) | JP2016127262A (zh) |
KR (1) | KR101736718B1 (zh) |
HK (1) | HK1222038A1 (zh) |
TW (1) | TWI581284B (zh) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6540069B2 (ja) * | 2015-02-12 | 2019-07-10 | Tdk株式会社 | 積層貫通コンデンサ |
JP6476954B2 (ja) * | 2015-02-12 | 2019-03-06 | Tdk株式会社 | 積層貫通コンデンサ |
US10734159B2 (en) | 2016-12-22 | 2020-08-04 | Murata Manufacturing Co., Ltd. | Multilayer ceramic capacitor and method for manufacturing multilayer ceramic capacitor |
JP6935707B2 (ja) * | 2016-12-22 | 2021-09-15 | 株式会社村田製作所 | 積層セラミックコンデンサ |
JP6930114B2 (ja) * | 2017-01-20 | 2021-09-01 | Tdk株式会社 | 電子部品装置 |
JP6841121B2 (ja) * | 2017-03-29 | 2021-03-10 | Tdk株式会社 | 貫通コンデンサ |
JP2019062023A (ja) | 2017-09-25 | 2019-04-18 | Tdk株式会社 | 電子部品装置 |
JP7231340B2 (ja) * | 2018-06-05 | 2023-03-01 | 太陽誘電株式会社 | セラミック電子部品およびその製造方法 |
JP7231703B2 (ja) * | 2018-09-13 | 2023-03-01 | 太陽誘電株式会社 | 積層セラミックコンデンサ |
JP7006879B2 (ja) | 2018-09-13 | 2022-02-10 | 太陽誘電株式会社 | 積層セラミックコンデンサ及び回路基板 |
JP7361465B2 (ja) | 2018-11-08 | 2023-10-16 | 株式会社村田製作所 | 積層セラミックコンデンサ |
JP7156914B2 (ja) | 2018-11-13 | 2022-10-19 | 株式会社村田製作所 | 積層セラミックコンデンサ、及び、積層セラミックコンデンサの製造方法 |
JP7289677B2 (ja) | 2019-03-13 | 2023-06-12 | 太陽誘電株式会社 | 多端子コンデンサ、多端子コンデンサの製造方法、ならびに、多端子コンデンサ実装回路基板 |
JP2021114584A (ja) * | 2020-01-21 | 2021-08-05 | 太陽誘電株式会社 | 積層セラミック電子部品及びその製造方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000058376A (ja) * | 1998-08-04 | 2000-02-25 | Tdk Corp | セラミックコンデンサ |
JP2008294298A (ja) * | 2007-05-25 | 2008-12-04 | Murata Mfg Co Ltd | 電子部品 |
KR101321836B1 (ko) * | 2011-01-21 | 2013-10-28 | 가부시키가이샤 무라타 세이사쿠쇼 | 적층 세라믹 전자부품 |
JP2014220527A (ja) * | 2014-08-13 | 2014-11-20 | 株式会社村田製作所 | 積層コンデンサ |
Family Cites Families (19)
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JPS6048230U (ja) * | 1983-09-11 | 1985-04-04 | 株式会社村田製作所 | 積層コンデンサ |
JPH0373422U (zh) * | 1989-11-22 | 1991-07-24 | ||
JP2982539B2 (ja) * | 1993-02-19 | 1999-11-22 | 株式会社村田製作所 | チップ型貫通コンデンサ |
JP3903757B2 (ja) * | 2001-09-05 | 2007-04-11 | 株式会社村田製作所 | チップ状電子部品の製造方法およびチップ状電子部品 |
JP2004235377A (ja) * | 2003-01-29 | 2004-08-19 | Kyocera Corp | セラミック電子部品 |
JP3850398B2 (ja) * | 2003-08-21 | 2006-11-29 | Tdk株式会社 | 積層コンデンサ |
JP2006100708A (ja) * | 2004-09-30 | 2006-04-13 | Taiyo Yuden Co Ltd | 3端子型積層コンデンサ実装回路基板および3端子型積層コンデンサ |
WO2006104613A2 (en) * | 2005-03-01 | 2006-10-05 | X2Y Attenuators, Llc | Conditioner with coplanar conductors |
JP2007035848A (ja) * | 2005-07-26 | 2007-02-08 | Taiyo Yuden Co Ltd | 積層セラミックコンデンサ及びその製造方法 |
JP4924490B2 (ja) * | 2008-03-10 | 2012-04-25 | Tdk株式会社 | 貫通型積層コンデンサ |
JP4725629B2 (ja) * | 2008-10-14 | 2011-07-13 | Tdk株式会社 | 積層貫通コンデンサの製造方法 |
JP5062237B2 (ja) * | 2009-11-05 | 2012-10-31 | Tdk株式会社 | 積層コンデンサ、その実装構造、及びその製造方法 |
JP5246215B2 (ja) * | 2010-07-21 | 2013-07-24 | 株式会社村田製作所 | セラミック電子部品及び配線基板 |
JP2012156315A (ja) * | 2011-01-26 | 2012-08-16 | Murata Mfg Co Ltd | 積層セラミック電子部品 |
JP5620938B2 (ja) * | 2012-03-30 | 2014-11-05 | 太陽誘電株式会社 | 積層セラミックコンデンサ |
JP5811152B2 (ja) * | 2012-11-05 | 2015-11-11 | 株式会社村田製作所 | 積層セラミック電子部品、その製造方法、テーピング電子部品連、その製造方法、および積層セラミック電子部品の方向識別方法 |
KR101452058B1 (ko) * | 2012-12-06 | 2014-10-22 | 삼성전기주식회사 | 적층 세라믹 전자부품 |
JP5689143B2 (ja) * | 2013-03-19 | 2015-03-25 | 太陽誘電株式会社 | 低背型積層セラミックコンデンサ |
JP6142650B2 (ja) * | 2013-05-08 | 2017-06-07 | Tdk株式会社 | 積層貫通コンデンサ |
-
2015
- 2015-10-15 JP JP2015203774A patent/JP2016127262A/ja not_active Withdrawn
- 2015-10-27 KR KR1020150149306A patent/KR101736718B1/ko active IP Right Grant
- 2015-11-06 TW TW104136719A patent/TWI581284B/zh active
-
2016
- 2016-08-26 HK HK16110184.7A patent/HK1222038A1/zh unknown
-
2018
- 2018-05-25 JP JP2018100457A patent/JP6901996B2/ja active Active
- 2018-05-25 JP JP2018100456A patent/JP6929245B2/ja active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000058376A (ja) * | 1998-08-04 | 2000-02-25 | Tdk Corp | セラミックコンデンサ |
JP2008294298A (ja) * | 2007-05-25 | 2008-12-04 | Murata Mfg Co Ltd | 電子部品 |
KR101321836B1 (ko) * | 2011-01-21 | 2013-10-28 | 가부시키가이샤 무라타 세이사쿠쇼 | 적층 세라믹 전자부품 |
JP2014220527A (ja) * | 2014-08-13 | 2014-11-20 | 株式会社村田製作所 | 積層コンデンサ |
Also Published As
Publication number | Publication date |
---|---|
TW201628033A (zh) | 2016-08-01 |
JP6929245B2 (ja) | 2021-09-01 |
KR20160079636A (ko) | 2016-07-06 |
JP2018152593A (ja) | 2018-09-27 |
JP2016127262A (ja) | 2016-07-11 |
JP6901996B2 (ja) | 2021-07-14 |
TWI581284B (zh) | 2017-05-01 |
HK1222038A1 (zh) | 2017-06-16 |
JP2018152594A (ja) | 2018-09-27 |
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